IS31LT3172-GRLS4-TR [ISSI]
LED Driver;
| 型号： | IS31LT3172-GRLS4-TR |
| 厂家： | 
INTEGRATED SILICON SOLUTION, INC |
| 描述： | LED Driver 驱动 接口集成电路 |
| 文件： | 总19页 (文件大小：465K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IS31LT3172/73
10-TO-200MA CONSTANT-CURRENT LED DRIVER
July 2016
GENERAL DESCRIPTION
FEATURES
The IS31LT3172 and IS31LT3173 are adjustable
linear current devices with excellent temperature
stability. A single resistor is all that is required to set
the operating current from 10mA to 200mA. The
devices can operate from an input voltage from 2.5V
to 42V with a minimal voltage headroom of 1V
(typical). Designed with a low dropout voltage; the
device can drive LED strings close to the supply
voltage without switch capacitors or inductors.
Low-side current sink
- Current preset to 10mA
- Adjustable from 10mA to 200mA with external
resistor selection
Wide input voltage range from
- 2.5V to 42V (IS31LT3173)
- 5V to 42V (IS31LT3172)
with a low dropout of typical 1V
Up to 10kHz PWM input (IS31LT3173 only)
Protection features:
The IS31LT3172/73 simplifies designs by
providing a stable current without the additional
requirement of input or output capacitors,
inductors, FETs or diodes. The complete constant
current driver requires only a current set resistor
and a small PCB area making designs both
efficient and cost effective.
- 0.26%/K negative temperature coefficient at
high temp for thermal protection
Up to 1.8W power dissipation in a small SOP-8-
EP package
RoHS compliant (Pb-free) package
The EN pin (3) of the IS31LT3172 can be tied to
Vbat or BCM PWM signal for high side dimming.
The EN Pin (3) of the IS31LT3173 can function as
the PWM signal input used for low side dimming.
APPLICATIONS
Architectural LED lighting
As a current sink it is ideal for LED lighting
applications or current limiter for power supplies.
Channel letters for advertising, LED strips for
decorative lighting
Retail lighting in fridge, freezer case and
vending machines
The device is provided in a lead (Pb) free, SOP-8-EP
package.
Emergency lighting (e.g. steps lighting, exit way
sign etc.)
TYPICAL APPLICATION CIRCUIT
Figure 1 Typical Application Circuit
Integrated Silicon Solution, Inc. – www.issi.com
Rev. C, 07/01/2016
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IS31LT3172/73
PIN CONFIGURATION
Package
Pin Configuration (Top View)
SOP-8-EP
PIN DESCRIPTION
No.
Pin
Description
1, 2
3
OUT
Current sink.
EN
Enable pin (PWM input IS31LT3173 only).
Optional current adjust.
Ground.
4
REXT
GND
5
6 ~ 8
NC
Floating or connect to GND.
Connect to GND.
Thermal Pad
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IS31LT3172/73
ORDERING INFORMATION
Industrial Range: -40°C to +125°C
Order Part No.
Package
QTY/Reel
IS31LT3172-GRLS4-TR
IS31LT3173-GRLS4-TR
SOP-8-EP, Lead-free
2500
Copyright © 2016 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any
time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are
advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the
product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not
authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
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Rev. C, 07/01/2016
IS31LT3172/73
ABSOLUTE MAXIMUM RATINGS (Note 1)
Maximum enable voltage, VEN(MAX) only for IS31LT3172-GRLS4-TR
45V
V
EN(MAX) only for IS31LT3173-GRLS4-TR
6V
Maximum output current, IOUT(MAX)
Maximum output voltage, VOUT(MAX)
Reverse voltage between all terminals, VR
Power dissipation, PD(MAX) (Note 2)
Maximum junction temperature, TJMAX
Storage temperature range, TSTG
Operating temperature range, TA
ESD (HBM) IS31LT3172-GRLS4-TR
ESD (HBM) IS31LT3173-GRLS4-TR
ESD (CDM)
200mA
45V
0.5V
1.8W
150°C
-65°C ~ +150°C
-40°C ~ +125°C
±2kV
±1.5kV
±500V
Note 1:
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only
and functional operation of the device at these or any other condition beyond those indicated in the operational sections of the specifications is
not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Note 2:
Detail information please refer to package thermal de-rating curve on Page 14.
THERMAL CHARACTERISTICS
Characteristic
Test Conditions
Value
Package Thermal Resistance On 4-layer PCB based on JEDEC standard
55.4°C/W
(Junction to Ambient), RθJA
at 1W, TA=25°C
Package Thermal Resistance
(Junction to Pad), RθJP
2.24°C/W
ELECTRICAL CHARACTERISTICS
“●”
This symbol in the table means these parameters are for IS31LT3172-GRLS4-TR.
“○” This symbol in the table means these parameters are for IS31LT3173-GRLS4-TR.
Test condition is TA = TJ = 25°C, unless otherwise specified. (Note 3)
Symbol
Parameter
Condition
Min.
Typ.
Max. Unit
VBD_OUT OUT pin breakdown voltage VEN= 0V
VEN= 24V
42
V
●
○
0.35
0.35
106
IEN
Enable current
Ma
VEN= 3.3V
RINT
Internal resistor
IRINT = 10Ma
Ω
VOUT = 1.4V, VEN = 24V, REXT
OPEN
●
○
●
○
●
○
9
9
10
10
11
Ma
11
VOUT = 1.4V, VEN = 3.3V, REXT
OPEN
Output current
VOUT > 2.0V, VEN = 24V, REXT
= 10Ω
105
105
10
10
118
118
130
Ma
130
IOUT
VOUT > 2.0V, VEN = 3.3V, REXT
= 10Ω
VOUT > 2.0V, VEN = 24V
VOUT > 2.0V, VEN = 3.3V
200
Ma
200
Output current Range
(Note 4, 5)
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IS31LT3172/73
DC CHARACTERISTICS WITH STABILIZED LED LOAD
“●”
This symbol in the table means these parameters are for IS31LT3172-GRLS4-TR.
“○” This symbol in the table means these parameters are for IS31LT3173-GRLS4-TR.
Test condition is TA = TJ = 25°C, unless otherwise specified. (Note 3)
Symbol
Parameter
Condition
Min.
Typ.
Max. Unit
●
○
5
42
V
Sufficient supply voltage on EN
pin
VS
2.5
5.5
Lowest sufficient headroom
voltage on OUT pin
VHR
IOUT = 100Ma
1
1.2
V
VOUT > 2.0V, VEN = 24V,
REXT = 10Ω
●
○
●
○
-0.26
-0.26
1.9
Output current change versus
ambient temp change
%/K
VOUT > 2.0V, VEN = 3.3V,
REXT = 10Ω
∆IOUT/IOUT
(Note 4)
VOUT > 2.0V, VEN = 24V,
R
EXT = 10Ω
VOUT > 2.0V, VEN = 3.3V,
EXT = 10Ω
Output current change versus
Vout
%/V
1.9
R
Note 3:
Production testing of the device is performed at 25°C. Functional operation of the device and parameters specified over -40°C to +125°C
temperature range, are guaranteed by design and characterization.
Note 4:
Guaranteed by design.
Note 5:
The maximum output current is dependent on the PCB board design, air flow, ambient temperature and power dissipation in the device.
Please refer to the package thermal de-rating curve on Page 14 for more detail information.
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Rev. C, 07/01/2016
IS31LT3172/73
FUNCTIONAL BLOCK DIAGRAM
IS31LT3172
IS31LT3173
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IS31LT3172/73
TYPICAL PERFORMANCE CHARACTERISTICS
IS31LT3172
15
80
60
V
EN = 42V
V
EN = 42V
T = 125°C
A
TA = 25°C
REXT = 20Ω
REXT Open
12.5
10
TA = 85°C
TA = 25°C
TA = 85°C
TA = -40°C
TA = 125°C
40
7.5
5
TA = -40°C
20
0
2.5
0
0.5
2
3.5
5
6.5
8
9.5
11
12.5
14
0.5
2
3.5
5
6.5
8
9.5
11
12.5
14
14
14
Output Voltage (V)
Output Voltage (V)
Figure 2 IOUT vs. VOUT
Figure 3 IOUT vs. VOUT
200
150
100
200
V
R
EN = 42V
EXT = 7.5Ω
V
R
EN = 42V
EXT = 10Ω
T = 85°C
A
T
A
= 25°C
180
160
T = 25°C
A
T = 85°C
A
140
120
100
80
T = 125°C
A
T
A
= -40°C
TA = 125°C
T
A
= -40°C
60
50
0
40
20
0
0.5
2
3.5
5
6.5
8
9.5
11
12.5
14
0.5
2
3.5
5
6.5
8
9.5
11
12.5
Output Voltage (V)
Output Voltage (V)
Figure 5 IOUT vs. VOUT
Figure 4 IOUT vs. VOUT
300
250
200
150
100
50
300
250
V
R
EN = 3.3V
EXT = 5.6Ω
V
EN = 42V
= 25°C
TA
T
A
= 85°C
T = 25°C
A
R
EXT = 5.6Ω
200
150
100
R
EXT = 7.5Ω
TA
= -40°C
TA = 125°C
R
EXT = 10Ω
R
EXT = 20Ω
50
0
R
EXT Open
2
0
0
4
6
8
10
12
14
0.5
2
3.5
5
6.5
8
9.5
11
12.5
Output Voltage (V)
Output Voltage (V)
Figure 7 IOUT vs. VOUT
Figure 6 IOUT vs. VOUT
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Rev. C, 07/01/2016
IS31LT3172/73
300
20
16
12
8
V
f
EN = 5V
PWM = 100Hz@1% Duty Cycle
= 25°C
VOUT = 2V
REXT Open
TA
250
200
150
100
50
R
EXT = 5.6Ω
R
EXT = 7.5Ω
TA = 85°C
TA = 25°C
R
EXT = 10Ω
TA = 125°C
TA = -40°C
R
EXT= 20Ω
4
0
R
EXT Open
2
0
0
5
5
4
6
8
10
12
14
42
42
5
15
25
35
42
Output Voltage (V)
V
EN (V)
Figure 8 IOUT vs. VOUT
Figure 9 IOUT vs. VEN
80
60
40
150
120
V
OUT = 2V
V
OUT = 2V
T = 85°C
A
TA = 85°C
T = 125°C
A
R
EXT = 20Ω
REXT = 10Ω
T = 25°C
A
T = 25°C
A
T = 125°C
A
T = -40°C
A
T = -40°C
A
90
60
20
0
30
0
15
25
35
5
15
25
EN (V)
35
42
V
EN (V)
V
Figure 10 IOUT vs. VEN
Figure 11 IOUT vs. VEN
200
175
150
125
100
75
300
250
200
150
100
V
OUT = 2V
VOUT = 2V
TA = 85°C
TA = 125°C
R
EXT = 7.5Ω
R
EXT = 5.6Ω
T = 85°C
A
T
A
= 125°C
T
A
= 25°C
T = 25°C
A
TA = -40°C
TA
= -40°C
50
50
0
25
0
15
25
EN (V)
35
2.5
3
3.5
4
4.5
5
V
V
EN (V)
Figure 12 IOUT vs. VEN
Figure 13 IOUT vs. VEN
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Rev. C, 07/01/2016
IS31LT3172/73
300
250
200
V
OUT = 2V
V
V
EN = 42V
OUT = 2V
TA
= 25°C
250
200
150
100
REXT = 5.6Ω
REXT = 7.5Ω
150
100
R
EXT = 10Ω
R
EXT = 20Ω
50
0
50
0
R
EXT Open
10
1
10
100
1000
5
15
20
25
30
35
40 42
REXT (Ω)
VEN (V)
Figure 15 IOUT vs. REXT
Figure 14 IOUT vs. VEN
500
400
300
200
I
R
OUT = 0A
EXT Open
TA = -40°C
TA = 25°C
TA = 85°C
TA = 125°C
100
0
0
5
10
15
20
25
30
35
40 42
V
EN (V)
Figure 16 IEN vs. VEN
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Rev. C, 07/01/2016
IS31LT3172/73
IS31LT3173
30
80
60
V
EN = 3.3V
TA = 25°C
V
EN = 3.3V
T = 85°C
A
REXT = 20Ω
REXT Open
25
20
15
10
TA
= 125°C
T
A
= -40°C
40
T
A
= 85°C
TA = 25°C
20
0
T = 125°C
A
T = -40°C
A
5
0
0.5
2
3.5
5
6.5
8
9.5
11
12.5
14
14
14
0.5
2
3.5
5
6.5
8
9.5
11
12.5
14
14
14
Output Voltage (V)
Output Voltage (V)
Figure 18 IOUT vs. VOUT
Figure 17 IOUT vs. VOUT
150
100
50
180
160
V
R
EN = 3.3V
EXT = 7.5Ω
VEN = 3.3V
T
A
= 25°C
T
A
= 25°C
T
A
= 85°C
T = 85°C
A
REXT = 10Ω
140
120
100
80
T
A
= 125°C
T
A
= 125°C
T
A
= -40°C
TA
= -40°C
60
40
20
0
0
0.5
2
3.5
5
6.5
8
9.5
11
12.5
0.5
2
3.5
5
6.5
8
9.5
11
12.5
Output Voltage (V)
Output Voltage (V)
Figure 19 IOUT vs. VOUT
Figure 20 IOUT vs. VOUT
350
300
300
250
200
150
100
VEN = 3.3V
V
EN = 3.3V
= 25°C
REXT = 5.6Ω
REXT = 5.6Ω
TA
TA = 85°C
250
200
150
100
R
EXT = 7.5Ω
TA = 25°C
R
EXT = 10Ω
T = 125°C
A
TA = -40°C
R
EXT = 20Ω
50
0
50
0
R
EXT Open
0.5
2
3.5
5
6.5
8
9.5
11
12.5
0
2
4
6
8
10
12
Output Voltage (V)
Output Voltage (V)
Figure 21 IOUT vs. VOUT
Figure 22 IOUT vs. VOUT
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Rev. C, 07/01/2016
IS31LT3172/73
300
20
16
12
8
V
f
EN = 5V
PWM = 100Hz@1% Duty Cycle
= 25°C
VOUT = 2V
REXT Open
TA
250
200
150
100
R
EXT = 5.6Ω
R
EXT = 7.5Ω
T
A
= 85°C
TA = 25°C
R
EXT = 10Ω
TA = 125°C
TA = -40°C
R
EXT= 20Ω
4
0
50
0
R
EXT Open
0
2
4
6
8
10
12
14
2.5
2.5
2.5
3
3.5
4
4.5
5
5
5
Output Voltage (V)
V
EN (V)
Figure 24 IOUT vs. VEN
Figure 23 IOUT vs. VOUT
80
60
40
150
120
V
R
OUT = 2V
EXT = 20Ω
V
OUT = 2V
TA
= 85°C
T
A
= 125°C
T = 85°C
A
TA = 25°C
REXT = 10Ω
T = 25°C
A
T = 125°C
A
T = -40°C
A
T = -40°C
A
90
60
20
0
30
0
2.5
3
3.5
4
4.5
5
3
3.5
4
4.5
V
EN (V)
V
EN (V)
Figure 26 IOUT vs. VEN
Figure 25 IOUT vs. VEN
300
250
200
150
100
200
175
150
125
100
75
VOUT = 2V
V
R
OUT = 2V
EXT = 7.5Ω
TA = 85°C
TA = 125°C
T = 85°C
A
R
EXT = 5.6Ω
T
A
= 125°C
T = 25°C
A
TA = 25°C
TA = -40°C
T = -40°C
A
50
50
0
25
0
3
3.5
4
4.5
2.5
3
3.5
4
4.5
5
V
EN (V)
V
EN (V)
Figure 28 IOUT vs. VEN
Figure 27 IOUT vs. VEN
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Rev. C, 07/01/2016
IS31LT3172/73
250
200
300
VOUT = 2V
V
V
EN = 3.3V
OUT = 2V
TA
= 25°C
250
200
150
100
R
EXT = 5.6Ω
R
EXT = 7.5Ω
150
100
REXT = 10Ω
REXT = 20Ω
50
0
50
0
REXT Open
2.5
3
3.5
4
4.5
5
1
10
100
REXT (Ω)
V
EN (V)
Figure 29 IOUT vs. VEN
Figure 30 IOUT vs. REXT
500
400
300
200
V
V
OUT = 3V, 3 LEDs
EN = 5V, 100Hz, 50% Duty Cycle
I
R
OUT = 0A
EXT Open
REXT = 10Ω
T
J
= -40°C
TA = -40°C
T
A
= 25°C
V
EN
2V/Div
TA = 85°C
TA = 125°C
100
0
I
OUT
50mA/Div
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
Time (400ns/Div)
VEN (V)
Figure 31 IEN vs. VEN
Figure 32 VEN vs. IOUT Delay and Rising Edge
V
OUT = 3V, 3 LEDs
V
V
OUT = 3V, 3 LEDs
EN = 5V, 100Hz, 50% Duty Cycle
VEN = 5V, 100Hz, 50% Duty Cycle
R
EXT = 10Ω
REXT = 10Ω
TJ
= 25°C
T
J
= 125°C
V
EN
V
EN
2V/Div
2V/Div
I
OUT
I
OUT
50mA/Div
50mA/Div
Time (200ns/Div)
Figure 33 VEN vs. IOUT Delay and Rising Edge
Time (400ns/Div)
Figure 34 VEN vs. IOUT Delay and Rising Edge
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IS31LT3172/73
VOUT = 3V, 3 LEDs
VOUT = 3V, 3 LEDs
VEN = 5V, 100Hz, 50% Duty Cycle
VEN = 5V, 100Hz, 50% Duty Cycle
REXT = 10Ω
R
EXT = 10Ω
TJ
= -40°C
TJ
= 25°C
V
EN
V
EN
2V/Div
2V/Div
I
OUT
I
OUT
50mA/Div
50mA/Div
Time (100ns/Div)
Time (100ns/Div)
Figure 35 VEN vs. IOUT Delay and Falling Edge
Figure 36 VEN vs. IOUT Delay and Falling Edge
VOUT = 3V, 3 LEDs
VEN = 5V, 100Hz, 50% Duty Cycle
REXT = 10Ω
TJ
= 125°C
V
EN
2V/Div
I
OUT
50mA/Div
Time (100ns/Div)
Figure 37 VEN vs. IOUT Delay and Falling Edge
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IS31LT3172/73
APPLICATIONS INFORMATION
IS31LT3172/73 provides an easy constant current
source solution for LED lighting applications. It uses
an external resistor to adjust the LED current from
10Ma to 200Ma. The LED current can be determined
by the external resistor REXT as Equation (1):
When operating the chip at high ambient
temperatures, or when driving maximum load
current, care must be taken to avoid exceeding the
package power dissipation limits. Exceeding the
package dissipation will cause the device to enter
thermal protection mode. The maximum package
power dissipation can be calculated using the
following Equation (2):
10mA106
(1)
REXT
ISET 10mA
TJ (MAX ) TA
Where ISET is in Ma.
(2)
PD(MAX )
JA
Paralleling a low tolerance resistor REXT with the
internal resistor RINT will improve the overall
accuracy of the current sense resistance. The
resulting output current will vary slightly lower due to
the negative temperature coefficient (NTC) resulting
from the self heating of the IS31LT3172/73.
Where TJ(MAX) is the maximum junction temperature,
TA is the ambient temperature, and θJA is the junction
to ambient thermal resistance; a metric for the
relative thermal performance of a package.
The recommended maximum operating junction
temperature, TJ(MAX), is 125°C and so the maximum
ambient temperature is determined by the package
parameter; θJA. The θJA for the IS31LT3172/73 SOP-
8-EP package is 55.4°C/W.
HIGH INPUT VOLTAGE APPLICATION
When driving a long string of LEDs whose total
forward voltage drop exceeds the IS31LT3172
V
BD_OUT limit of 42V, it is possible to stack several
LEDs (such as 2 LEDs) between the EN pin and the
OUT pins, and so the voltage on the EN pin is higher
than 5V. The remaining string of LEDs can then be
placed between power supply +VS and EN pin,
(Figure 38). The number of LEDs required to stack
at EN pin will depend on the LED’s forward voltage
drop (VF) and the +VS value.
Therefore the maximum power dissipation at TA =
25°C is:
125C 25C
55.4C /W
PD(MAX )
1.8W
The actual power dissipation PD is:
(3)
PD VOUT IOUT VEN IEN
To ensure the performance, the die temperature (TJ)
of the IS31LT3172/73 should not exceed 125°C. The
graph below gives details for the package power
derating.
2.5
SOP-8-EP
2
1.5
1
Figure 38 High Input Voltage Application Circuit
Note: when operating the IS31LT3172 at voltages
exceeding the device operating limits, care needs to
be taken to keep the EN pin and OUT pin voltage
below 42V.
0.5
0
-40 -25 -10
5
20
35
50
65
80
95 110 125
THERMAL PROTECTION AND DISSIPATION
Temperature (°C)
The IS31LT3172/73 implements thermal foldback
protection to reduce the LED current when the
package’s thermal dissipation is exceeded and
prevent “thermal runaway”. The thermal foldback
implements a negative temperature coefficient
(NTC) of -0.26%/K.
Figure 39 PD vs. TA (SOP-8-EP)
The thermal resistance is achieved by mounting the
IS31LT3172/73 on a standard FR4 double-sided
printed circuit board (PCB) with a copper area of a
few square inches on each side of the board under
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the IS31LT3172/73. Multiple thermal vias, as shown
in Figure 40, help to conduct the heat from the
exposed pad of the IS31LT3172/73 to the copper on
each side of the board. The thermal resistance can
be reduced by using a metal substrate or by adding
a heatsink.
Figure 40 Board Via Layout For Thermal Dissipation
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CLASSIFICATION REFLOW PROFILES
Profile Feature
Pb-Free Assembly
Preheat & Soak
150°C
Temperature min (Tsmin)
200°C
Temperature max (Tsmax)
60-120 seconds
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate (Tsmax to Tp)
Liquidous temperature (TL)
Time at liquidous (Tl)
3°C/second max.
217°C
60-150 seconds
Max 260°C
Peak package body temperature (Tp)*
Time (tp)** within 5°C of the specified
classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to peak temperature
Max 30 seconds
6°C/second max.
8 minutes max.
Figure 41 Classification Profile
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PACKAGE INFORMATION
SOP-8-EP
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RECOMMENDED LAND PATTERN
Note:
1. Land pattern complies to IPC-7351.
2. All dimensions in MM.
3. This document (including dimensions, notes & specs) is a recommendation based on typical circuit board manufacturing parameters. Since
land pattern design depends on many factors unknown (eg. User’s board manufacturing specs), user must determine suitability for use.
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REVISION HISTORY
Revision
Detail Information
Date
A
B
Initial release
2016.03.01
2016.05.04
Update EC table
Add Package Thermal Resistance (Junction to Pad), RθJP in THERMAL
CHARACTERISTICS
C
2016.07.01
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