IS42LS32400AL-10BI [ISSI]

Synchronous DRAM, 4MX32, 7ns, CMOS, PBGA90, FBGA-90;
IS42LS32400AL-10BI
型号: IS42LS32400AL-10BI
厂家: INTEGRATED SILICON SOLUTION, INC    INTEGRATED SILICON SOLUTION, INC
描述:

Synchronous DRAM, 4MX32, 7ns, CMOS, PBGA90, FBGA-90

时钟 动态存储器 内存集成电路
文件: 总66页 (文件大小:577K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
IS42S81600AL, IS42LS81600AL  
IS42S16800AL, IS42LS16800AL  
IS42S32400AL, IS42LS32400AL  
16Meg x 8, 8Meg x16 & 4Meg x 32  
128-MBIT LOW-POWER  
SYNCHRONOUS DRAM  
®
ISSI  
PRELIMINARY INFORMATION  
SEPTEMBER 2003  
OVERVIEW  
FEATURES  
ISSI's 128Mb Low - Power Synchronous DRAM achieves  
high-speed data transfer using pipeline architecture. All  
inputs and outputs signals refer to the rising edge of the  
clock input. The 128Mb SDRAM is organized as follows.  
• Clock frequency: 133, 100, MHz  
• Fully synchronous; all signals referenced to a  
positive clock edge  
• Internal bank for hiding row access/precharge  
• Power supply  
VDD  
VDDQ  
IS42LS81600AL  
IS42S81600AL  
4Mx8x4Banks  
54-PinTSOPII  
IS42LS16800AL  
IS42S16800AL  
2Mx16x4Banks  
54-ball FBGA  
IS42LS32400AL  
IS42S32400AL  
1Mx32x4Banks  
90-ball FBGA  
IS42LS81600AL  
IS42LS16800AL  
2.5V 1.8V (2.5V tolerant)  
2.5V 1.8V (2.5V tolerant)  
IS42LS32400AL  
IS42S81600AL  
2.5V 1.8V (2.5V tolerant)  
3.3V 3.3V  
54-pinTSOPII  
86-pinTSOPII  
IS42S16800AL  
IS42S32400AL  
3.3V 3.3V  
3.3V 3.3V  
• LVTTL interface  
• Programmable burst length  
– (1, 2, 4, 8, full page)  
KEY TIMING PARAMETERS  
• Extended Mode Register  
Parameter  
-7  
-10 Unit  
• Programmable Power Reduction Feature by  
partial array activation during Self-Refresh  
Clk Cycle Time  
CAS Latency = 3  
CAS Latency = 2  
7
10  
10  
10  
ns  
ns  
• Auto Precharge and Auto refresh Modes  
• Temp. Compensated Self Refresh.  
Clk Frequency  
CAS Latency = 3  
CAS Latency = 2  
133  
100  
100  
100  
Mhz  
Mhz  
• Self Refresh Mode: Standard and Low-Power  
• 4096 refresh cycles every 64 ms  
Access Time from Clock  
CAS Latency = 3  
5.4  
6
7
9
ns  
ns  
• Random column address every clock cycle  
• Programmable CAS latency (2, 3 clocks)  
CAS Latency = 2  
• Burst read/write and burst read/single write  
operations capability  
• Burst termination by burst stop and Precharge  
command  
• Industrial Temperature Availability  
• Lead-freeAvailability  
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time  
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to  
obtain the latest version of this device specification before relying on any published information and before placing orders for products.  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
PRELIMINARY INFORMATION, Rev. 00A  
1
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
DEVICE OVERVIEW  
nal banks to hide precharge time and the capability to  
randomly change column addresses on each clock cycle  
during burst access.  
The 128Mb Low - Power SDRAM is a high speed CMOS,  
dynamic random-access memory designed to operate in  
2.5VVDD and1.8VVDDQ or3.3VVDD and3.3VVDDQ memory  
systemscontaining134,217,728bits. Internallyconfigured  
asaquad-bankDRAMwithasynchronousinterface. (Each  
33,554,432-bit bank is organized as 4,096 rows by 512  
columns by 16 bits.)  
A self-timed row precharge initiated at the end of the burst  
sequence is available with the AUTO PRECHARGE func-  
tionenabled. Prechargeonebankwhileaccessingoneofthe  
otherthreebankswillhidetheprechargecyclesandprovide  
seamless,high-speed,random-accessoperation.  
The 128Mb Low - Power SDRAM includes an AUTO RE-  
FRESH MODE, and a power-saving, power-down mode.  
All signals are registered on the positive edge of the clock  
signal, CLK. All inputs and outputs are LVTTL compatible.  
SDRAMreadandwriteaccessesareburstorientedstartingat  
aselectedlocationandcontinuingforaprogrammednum-  
ber of locations in a programmed sequence. The registra-  
tionofanACTIVEcommandbeginsaccesses, followedby  
a READ or WRITE command. The ACTIVE command in  
conjunction with address bits registered are used to select  
the bank and row to be accessed (BA0, BA1 select the  
bank; A0-A11 select the row). The READ or WRITE  
commands in conjunction with address bits registered are  
used to select the starting column location for the burst  
access.  
Only partials of the memory array can be selected for Self-  
Refresh and the refresh period during Self-Refresh is  
programmablein4stepswhichdrasticallyreducestheself  
refresh current, depending on the case temperature of the  
components in the system application.  
The128MbLow-PowerSDRAMhastheabilitytosynchro-  
nouslyburstdataatahighdataratewithautomaticcolumn-  
address generation, the ability to interleave between inter-  
ProgrammableREADorWRITEburstlengthsconsistof1,  
2, 4 and 8 locations or full page, with a burst terminate  
option.  
FUNCTIONAL BLOCK DIAGRAM (ONLY FOR 2MX16X4 BANKS)  
CLK  
CKE  
CS  
RAS  
CAS  
WE  
DQML  
DQMH  
DATA IN  
BUFFER  
COMMAND  
DECODER  
&
CLOCK  
GENERATOR  
16  
16  
2
REFRESH  
CONTROLLER  
MODE  
REGISTER  
I/O 0-15  
12  
V
DD/VDDQ  
ss/Vss  
SELF  
DATA OUT  
BUFFER  
REFRESH  
V
Q
A10  
A11  
A9  
CONTROLLER  
16  
16  
A8  
A7  
A6  
REFRESH  
COUNTER  
A5  
A4  
4096  
A3  
A2  
A1  
A0  
BA0  
BA1  
4096  
MEMORY CELL  
ARRAY  
4096  
4096  
12  
BANK 0  
ROW  
ADDRESS  
LATCH  
ROW  
ADDRESS  
BUFFER  
12  
12  
SENSE AMP I/O GATE  
512  
(x 16)  
COLUMN  
ADDRESS LATCH  
BANK CONTROL LOGIC  
9
BURST COUNTER  
COLUMN DECODER  
COLUMN  
ADDRESS BUFFER  
9
2
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
PIN CONFIGURATIONS  
54-Pin TSOP - Type II for x8  
V
DD  
1
54  
53  
52  
51  
50  
49  
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
VSS  
I/O0  
2
I/O7  
V
DD  
Q
3
VSSQ  
NC  
4
NC  
I/O6  
I/O1  
5
V
SS  
Q
6
VDDQ  
NC  
I/O2  
7
NC  
I/O5  
8
V
DD  
Q
9
VSSQ  
NC  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
NC  
I/O4  
I/O3  
V
SS  
Q
VDDQ  
NC  
NC  
V
DD  
NC  
WE  
V
SS  
NC  
DQM  
CLK  
CKE  
NC  
A11  
A9  
CAS  
RAS  
CS  
BA0  
BA1  
A10  
A0  
A8  
A7  
A1  
A6  
A2  
A5  
A3  
A4  
V
DD  
VSS  
PIN DESCRIPTIONS  
A0-A11  
A0-A9  
BA0,BA1  
I/O0toI/O15  
CLK  
Row Address Input  
WE  
WriteEnable  
Column Address Input  
Bank Select Address  
Data I/O  
DQM  
VDD  
x8LowerByte, Input/OutputMask  
Power  
Vss  
VDDQ  
VssQ  
NC  
Ground  
System Clock Input  
Clock Enable  
Power Supply for I/O Pin  
Ground for I/O Pin  
No Connection  
CKE  
CS  
Chip Select  
RAS  
Row Address Strobe Command  
Column Address Strobe Command  
CAS  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
3
PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
PIN CONFIGURATIONS  
54-Ball FBGA for x16  
1
2
3
4
5
6
7
8
9
A
B
C
D
E
F
Vss  
I/O14  
I/O12  
I/O10  
I/O8  
I/O15  
I/O13  
I/O11  
I/O9  
NC  
VssQ  
VDDQ  
VssQ  
VDDQ  
Vss  
VDDQ  
VssQ  
VDDQ  
VssQ  
VDD  
CAS  
BA0  
I/O0  
I/O2  
I/O4  
I/O6  
DQML  
RAS  
BA1  
A1  
VDD  
I/O1  
I/O3  
I/O5  
I/O7  
WE  
DQMH  
NC/A12  
A8  
CLK  
A11  
A7  
CKE  
A9  
G
H
J
CS  
A6  
A0  
A10  
VDD  
Vss  
A5  
A4  
A3  
A2  
PIN DESCRIPTIONS  
A0-A11  
A0-A8  
BA0,BA1  
I/O0toI/O15  
CLK  
Row Address Input  
Column Address Input  
Bank Select Address  
Data I/O  
WE  
WriteEnable  
DQML  
DQMH  
VDD  
x16 Lower Byte, Input/Output Mask  
x16 Upper Byte, Input/Output Mask  
Power  
System Clock Input  
Clock Enable  
Vss  
Ground  
CKE  
VDDQ  
VssQ  
NC  
Power Supply for I/O Pin  
Ground for I/O Pin  
CS  
Chip Select  
RAS  
Row Address Strobe Command  
Column Address Strobe Command  
NoConnection  
CAS  
4
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
PIN CONFIGURATIONS  
54-Pin TSOP - Type II for x16  
V
DD  
1
54  
53  
52  
51  
50  
49  
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
VSS  
I/O0  
2
I/O15  
V
DD  
Q
3
VSSQ  
I/O1  
I/O2  
4
I/O14  
I/O13  
5
V
SS  
Q
6
VDDQ  
I/O3  
I/O4  
7
I/O12  
I/O11  
8
V
DD  
Q
9
VSSQ  
I/O5  
I/O6  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
I/O10  
I/O9  
V
SS  
Q
VDDQ  
I/O7  
I/O8  
V
DD  
VSS  
DQML  
WE  
CAS  
RAS  
CS  
NC  
DQMH  
CLK  
CKE  
NC  
A11  
A9  
BA0  
BA1  
A10  
A0  
A8  
A7  
A1  
A6  
A2  
A5  
A3  
A4  
V
DD  
VSS  
PIN DESCRIPTIONS  
A0-A11  
A0-A8  
BA0,BA1  
I/O0toI/O15  
CLK  
Row Address Input  
WE  
WriteEnable  
Column Address Input  
Bank Select Address  
Data I/O  
DQML  
DQMH  
VDD  
x16 Lower Byte, Input/Output Mask  
x16 Upper Byte, Input/Output Mask  
Power  
System Clock Input  
Clock Enable  
Vss  
Ground  
CKE  
VDDQ  
VssQ  
NC  
Power Supply for I/O Pin  
Ground for I/O Pin  
CS  
Chip Select  
RAS  
Row Address Strobe Command  
Column Address Strobe Command  
NoConnection  
CAS  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
5
PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
PIN CONFIGURATIONS  
86-Pin TSOP - Type II for x32  
V
DD  
1
86  
85  
84  
83  
82  
81  
80  
79  
78  
77  
76  
75  
74  
73  
72  
71  
70  
69  
68  
67  
66  
65  
64  
63  
62  
61  
60  
59  
58  
57  
56  
55  
54  
53  
52  
51  
50  
49  
48  
47  
46  
45  
44  
VSS  
I/O0  
2
I/O15  
V
DD  
Q
3
VSSQ  
I/O1  
I/O2  
4
I/O14  
I/O13  
5
V
SS  
Q
6
VDDQ  
I/O3  
I/O4  
7
I/O12  
I/O11  
8
V
DD  
Q
9
VSSQ  
I/O5  
I/O6  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
I/O10  
I/O9  
V
SS  
Q
VDDQ  
I/O7  
NC  
I/O8  
NC  
V
DD  
VSS  
DQM0  
WE  
DQM1  
NC  
CAS  
RAS  
CS  
NC  
CLK  
CKE  
A9  
A11  
BA0  
BA1  
A10  
A0  
A8  
A7  
A6  
A5  
A1  
A4  
A2  
A3  
DQM2  
DQM3  
VDD  
VSS  
NC  
NC  
I/O16  
I/O31  
V
SS  
Q
VDDQ  
I/O17  
I/O18  
I/O30  
I/O29  
V
DD  
Q
VSSQ  
I/O19  
I/O20  
I/O28  
I/O27  
V
SS  
Q
VDDQ  
I/O21  
I/O22  
I/O26  
I/O25  
V
DD  
Q
VSSQ  
I/O23  
I/O24  
V
DD  
VSS  
PIN DESCRIPTIONS  
A10-A11  
A0-A7  
BA0,BA1  
I/O0toI/O31  
CLK  
Row Address Input  
WE  
WriteEnable  
Column Address Input  
Bank Select Address  
Data I/O  
DQM0-DQM3  
VDD  
x32 Input/Output Mask  
Power  
Vss  
Ground  
System Clock Input  
Clock Enable  
VDDQ  
Power Supply for I/O Pin  
Ground for I/O Pin  
NoConnection  
CKE  
VssQ  
NC  
CS  
Chip Select  
RAS  
Row Address Strobe Command  
Column Address Strobe Command  
CAS  
6
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
PIN CONFIGURATIONS  
90-Ball FBGA for x32  
1
2
3
4
5
6
7
8
9
A
B
C
D
E
F
I/O26  
I/O28  
VssQ  
VssQ  
VDDQ  
Vss  
I/O24  
VDDQ  
I/O27  
I/O29  
I/O31  
DQM3  
A5  
Vss  
VssQ  
I/O25  
I/O30  
NC  
VDD  
VDDQ  
I/O22  
I/O17  
NC  
I/O23  
VssQ  
I/O20  
I/O18  
I/O16  
DQM2  
A0  
I/O21  
I/O19  
VDDQ  
VDDQ  
VssQ  
VDD  
A3  
A2  
G
H
J
A4  
A6  
A10  
A1  
A7  
A8  
NC  
NC  
BA1  
A11  
CLK  
CKE  
NC  
A9  
BA0  
CAS  
VDD  
I/O6  
I/O1  
VDDQ  
VDD  
CS  
RAS  
K
L
DQM1  
VDDQ  
VssQ  
VssQ  
I/O11  
I/O13  
NC  
WE  
DQM0  
VssQ  
VDDQ  
VDDQ  
I/O4  
I/O8  
Vss  
I/O7  
M
N
P
R
I/O10  
I/O12  
VDDQ  
I/O15  
I/O9  
I/O14  
VssQ  
Vss  
I/O5  
I/O3  
VssQ  
I/O0  
I/O2  
PIN DESCRIPTIONS  
WE  
WriteEnable  
A10-A11  
A0-A7  
BA0,BA1  
I/O0toI/O31  
CLK  
Row Address Input  
Column Address Input  
Bank Select Address  
Data I/O  
DQM0-DQM3  
VDD  
x32 Input/Output Mask  
Power  
Vss  
Ground  
VDDQ  
Power Supply for I/O Pin  
Ground for I/O Pin  
NoConnection  
System Clock Input  
Clock Enable  
VssQ  
NC  
CKE  
CS  
Chip Select  
RAS  
Row Address Strobe Command  
Column Address Strobe Command  
CAS  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
7
PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
PIN FUNCTIONS  
Symbol  
Type  
Function (In Detail)  
A0-A11  
Input Pin  
AddressInputs:A0-A11aresampledduringtheACTIVE  
command(row-addressA0-A11)andREAD/WRITEcommand(A0-A9(x8);A0-A8  
(x16); A0-A7 (x32)with A10 defining auto precharge) to select one location out of the  
memoryarrayintherespectivebank. A10issampledduringaPRECHARGEcommand  
to determine if all banks are to be precharged (A10 HIGH) or bank selected by BA0,  
BA1 (A10 LOW). The address inputs also provide the op-code during a LOAD MODE  
REGISTERcommand.  
BA0, BA1  
CAS  
Input Pin  
Input Pin  
Input Pin  
BankSelectAddress:BA0andBA1defineswhichbanktheACTIVE, READ, WRITEor  
PRECHARGEcommandisbeingapplied.  
CAS, inconjunctionwiththeRASand WE, formsthedevicecommand. Seethe  
"CommandTruthTable"fordetailsondevicecommands.  
CKE  
TheCKEinputdetermineswhethertheCLKinputisenabled. Thenextrisingedgeofthe  
CLKsignalwillbevalidwhenisCKEHIGHandinvalidwhenLOW. WhenCKEisLOW,  
the device will be in either power-down mode, clock suspend mode, or self refresh  
mode. CKE is an asynchronous input.  
CLK  
Input Pin  
Input Pin  
CLK is the master clock input for this device. Except for CKE, all inputs to this device  
areacquiredinsynchronizationwiththerisingedgeofthispin.  
CS  
TheCSinputdetermineswhethercommandinputisenabledwithinthedevice.  
Command input is enabled whenCSisLOW, anddisabledwithCSisHIGH. Thedevice  
remains in the previous state when CS is HIGH.  
DQML,  
DQMH  
Input Pin  
DQML and DQMH control the lower and upper bytes of the I/O buffers. In read  
mode,DQMLandDQMHcontroltheoutputbuffer. WhenDQMLorDQMHisLOW, the  
correspondingbufferbyteisenabled, andwhenHIGH, disabled. Theoutputsgotothe  
HIGH impedance state whenDQML/DQMH is HIGH. This function corresponds to OE  
inconventionalDRAMs.Inwritemode,DQMLandDQMHcontroltheinputbuffer.  
WhenDQML or DQMH is LOW, the corresponding buffer byte is enabled, and data can  
be written to the device. WhenDQML or DQMH is HIGH, input data is masked and  
cannot be written to the device.  
DQM0-DQM3  
DQM  
Input Pin  
Input Pin  
Input Pin  
For IS42S32400AL, IS42S32400AL only.  
For IS42S81600AL, IS42S81600AL only.  
RAS  
RAS, in conjunction with CAS and WE, forms the device command. See the "Com-  
mand Truth Table" item for details on device commands.  
WE  
Input Pin  
WE, in conjunction with RAS and CAS, forms the device command. See the "Com-  
mand Truth Table" item for details on device commands.  
VDDQ  
VDD  
Power Supply Pin  
Power Supply Pin  
Power Supply Pin  
Power Supply Pin  
VDDQ is the output buffer power supply.  
VDD is the device internal power supply.  
VSSQ is the output buffer ground.  
VSSQ  
VSS  
VSS is the device internal ground.  
8
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
GENERAL DESCRIPTION  
READ  
burst mode. Upon completion of the READ or WRITE burst,  
a precharge of the bank/row that is addressed is automati-  
cally performed.  
The READ command selects the bank from BA0, BA1  
inputsandstartsaburstreadaccesstoanactiverow. Inputs  
A0-A9(x8);A0-A8(x16);A0-A7(x32)providesthestarting  
column location. When A10 is HIGH, this command func-  
tionsasanAUTOPRECHARGEcommand. Whentheauto  
precharge is selected, the row being accessed will be  
precharged at the end of the READ burst. The row will  
remain open for subsequent accesses when AUTO  
PRECHARGE is not selected. DQ’s read data is subject  
tothelogiclevelontheDQMinputstwoclocksearlier.When  
agivenDQMsignalwasregisteredHIGH, thecorrespond-  
ing DQ’s will be High-Z two clocks later. DQ’s will provide  
valid data when the DQM signal was registered LOW.  
AUTO REFRESH COMMAND  
This command executes the AUTO REFRESH operation.  
The row address and bank to be refreshed are automatically  
generated during this operation. The stipulated period (tRC) is  
required for a single refresh operation, and no other com-  
mands can be executed during this period. This command is  
executedatleast4096timesfor every64ms. DuringanAUTO  
REFRESH command, address bits are “Don’t Care”. This  
command corresponds to CBR Auto-refresh.  
BURST TERMINATE  
WRITE  
The BURST TERMINATE command forcibly terminates the  
burst read and write operations by truncating either fixed-  
length or full-page bursts and the most recently registered  
READ or WRITE command prior to the BURST TERMI-  
NATE.  
A burst write access to an active row is initiated with the  
WRITE command. BA0, BA1 inputs selects the bank, and  
the starting column location is provided by inputs A0-A9  
(x8); A0-A8 (x16); A0-A7 (x32). Whether or not AUTO-  
PRECHARGE is used is determined by A10.  
The row being accessed will be precharged at the end of  
the WRITE burst, if AUTO PRECHARGE is selected. If  
AUTO PRECHARGE is not selected, the row will remain  
open for subsequent accesses.  
COMMAND INHIBIT  
COMMAND INHIBIT prevents new commands from being  
executed.Operationsinprogressarenotaffected,apartfrom  
whether the CLK signal is enabled  
Amemoryarrayiswrittenwithcorrespondinginputdataon  
DQ’sandDQMinputlogiclevelappearingatthesametime.  
Data will be written to memory when DQM signal is LOW.  
When DQM is HIGH, the corresponding data inputs will be  
ignored, and a WRITE will not be executed to that byte/  
column location.  
NO OPERATION  
When CS is low, the NOP command prevents unwanted  
commands from being registered during idle or wait states.  
LOAD MODE REGISTER  
During the LOAD MODE REGISTER command the mode  
register is loaded from A0-A11. This command can only be  
issued when all banks are idle.  
PRECHARGE  
ThePRECHARGEcommandisusedtodeactivatetheopen  
row in a particular bank or the open row in all banks. BA0,  
BA1canbeusedtoselectwhichbankisprechargedorthey  
aretreatedasDon’tCare”. A10determinedwhetheroneor  
all banks are precharged. After executing this command,  
the next command for the selected banks(s) is executed  
afterpassageoftheperiodtRP, whichistheperiodrequired  
for bank precharging. Once a bank has been precharged,  
itisintheidlestateandmustbeactivatedpriortoanyREAD  
or WRITE commands being issued to that bank.  
ACTIVE COMMAND  
When the ACTIVE COMMAND is activated, BA0, BA1 inputs  
selectsabanktobeaccessed, andtheaddressinputsonA0-  
A11 selects the row. Until a PRECHARGE command is  
issued to the bank, the row remains open for accesses.  
EXTENDED MODE REGISTER  
The extended mode register defines low power functions.  
DuringthiscommandA0-A11aredatainputpins. Afterpower  
on, the extended mode register set command must be ex-  
AUTO PRECHARGE  
ecuted to fix low power functions. During t  
command, they can not accept any other command. The  
extended mode register has four fields:  
following this  
CSR  
TheAUTOPRECHARGEfunctionensuresthattheprecharge  
is initiated at the earliest valid stage within a burst. This  
functionallowsforindividual-bankprechargewithoutrequir-  
ing an explicit command. A10 to enable the AUTO  
PRECHARGEfunctioninconjunctionwithaspecificREAD  
orWRITEcommand. ForeachindividualREADorWRITE  
command, auto precharge is either enabled or disabled.  
AUTO PRECHARGE does not apply except in full-page  
Options: A11-A7  
Drive Strength: A6-A5  
Temperature Compensated self Refresh: A4-A3  
Partial Array Self Refresh: A2-A0  
Following extended mode register programming, no com-  
mand can be issued before at least 2 CLK have elapsed.  
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9
PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
COMMAND TRUTH TABLE  
CKE  
A11  
Function Symbol  
Device deselect  
No operation  
Burst stop  
n–1  
H
n
×
×
H
×
×
×
×
×
×
×
×
×
CS  
H
L
RAS  
×
CAS  
×
WE  
×
BA1  
×
BA0  
×
A10  
A9 - A0  
×
×
×
L
×
×
×
V
V
V
V
V
×
×
V
V
H
H
H
H
H
H
H
L
H
H
L
H
L
×
×
H
L
×
×
Read  
H
L
H
H
L
V
V
V
V
V
V
×
V
V
V
V
V
V
×
Read with auto precharge H  
Write  
Write with auto precharge H  
L
L
H
L
H
L
L
L
L
L
H
V
L
Bank activate  
H
H
H
H
H
L
H
H
H
L
H
L
Precharge select bank  
Precharge all banks  
Mode register set  
L
L
L
L
L
H
L
L
L
L
L
L
Extended mode reg set  
L
L
L
L
H
L
L
Note: H=VIH, L=VIL x= VIH or VIL, V = Valid Data.  
DQM TRUTH TABLE  
CKE  
n-1  
H
DQM  
U
Function Symbol  
n
L
L
Data write / output enable  
×
×
×
×
×
×
L
Data mask / output disable  
H
H
H
×
L
Upper byte write enable / output enable  
Lower byte write enable / output enable  
Upper byte write inhibit / output disable  
Lower byte write inhibit / output disable  
H
L
H
×
H
H
×
H
H
×
Note: H=VIH, L=VIL x= VIH or VIL, V = Valid Data.  
10  
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PRELIMINARY  
INFORMATION Rev. 00A  
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®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
CKE TRUTH TABLE  
CKE  
CurrentState/Function  
n – 1 n  
CS  
×
RAS  
CAS WE  
Address  
Activating Clock suspend mode entry  
Any Clock suspend mode  
Clock suspend mode exit  
Auto refresh command Idle  
Self refresh entry Idle  
H
L
L
×
×
×
L
×
×
×
×
H
H
×
×
×
L
×
×
L
H
H
L
×
×
H
H
L
L
L
×
L
L
×
Power down entry Idle  
H
H
L
L
L
H
H
×
H
×
H
×
×
×
Deeppowerdownentry  
Self refresh exit  
H
L
L
H
H
L
×
L
L
H
H
L
H
H
×
H
×
H
×
×
×
Power down exit  
L
L
H
H
L
H
H
×
H
×
H
×
×
×
Deeppowerdownexit  
L
H
×
×
×
×
×
Note: H=VIH, L=VIL x= VIH or VIL, V = Valid Data.  
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11  
PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
FUNCTIONAL TRUTH TABLE  
CS  
H
L
RAS CAS  
WE  
Address  
Command  
DESL  
Action  
Nop  
Idle  
X
X
H
H
L
X
X
H
H
H
H
L
H
L
X
NOP  
Nop  
L
X
BST  
Nop  
L
H
L
BA,CA,A10  
A,CA,A10  
BA,RA  
BA, A10  
X
READ/READA  
WRIT/WRITA  
ACT  
ILLEGAL (2)  
ILLEGAL(2)  
L
L
L
H
H
L
H
L
Row activating  
L
L
PRE/PALL  
REF  
Nop  
L
L
H
L
Auto refresh  
L
L
L
OC, BA1=L  
OC,BA1=H  
X
MRS  
Mode register set  
L
L
L
L
EMRS  
Extended mode register set  
Row Active  
H
L
X
H
H
H
H
L
X
H
H
L
X
H
L
DESL  
Nop  
Nop  
Nop  
X
NOP  
L
X
BST  
(3)  
L
H
L
BA,CA,A10  
BA,CA,A10  
BA,RA  
BA, A10  
X
READ/READA  
WRIT/WRITA  
ACT  
Begin read  
(3)  
L
L
Begin write  
ILLEGAL (2)  
Precharge/Precharge all banks(  
L
H
H
L
H
L
L
L
PRE/PALL  
REF  
L
L
H
L
ILLEGAL  
ILLEGAL  
L
L
L
OC,BA  
X
MRS/EMRS  
DESL  
Read  
H
X
X
X
Continue burst to end to  
Row active  
L
H
H
H
X
NOP  
Continue burst to end Row  
Row active  
L
L
H
H
H
L
L
X
BST  
Burst stop Row active  
Terminate burst,  
begin new read  
H
BA, CA, A10  
READ/READA  
(5)  
L
H
L
L
BA, CA, A10  
WRIT/WRITA  
Terminate burst,  
begin write  
(5, 6)  
L
L
L
L
H
H
H
L
BA, RA  
ACT  
ILLEGAL (2)  
BA, A10  
PRE/PALL  
Terminate burst  
Precharging  
L
L
H
L
L
X
L
L
X
H
L
X
REF  
ILLEGAL  
ILLEGAL  
OC, BA  
X
MRS/EMRS  
DESL  
Write  
X
Continue burst to end  
Write recovering  
L
H
H
H
X
NOP  
Continue burst to end  
Write recovering  
L
L
H
H
H
L
L
X
BST  
Burst stop Row active  
H
BA, CA, A10  
READ/READA  
Terminate burst, start read :  
Determine AP (5, 6)  
L
H
L
L
BA, CA, A10  
WRIT/WRITA  
Terminate burst, new write :  
Determine AP (5)  
L
L
L
L
L
L
L
L
H
H
L
H
L
BA,RA  
BA, A10  
X
ACT  
ILLEGAL (2)  
(7)  
PRE/PALL  
REF  
Terminate burst Precharging  
ILLEGAL  
H
L
L
OC,BA  
MRS/EMRS  
ILLEGAL  
Note: H=VIH, L=VIL x= VIH or VIL, V = Valid Data, BA= Bank Address, CA+Column Address, RA=Row Address, OC= Op-Code  
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INFORMATION Rev. 00A  
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®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
FUNCTIONAL TRUTH TABLE Continued:  
CS  
RAS CAS  
WE  
Address  
Command  
Action  
Read with auto  
Precharging  
H
×
×
×
×
DESL  
Continue burst to end -  
Precharge  
L
H
H
H
x
NOP  
Continue burst to end -  
Precharging  
L
L
L
L
L
L
L
H
H
H
H
L
H
L
L
×
BST  
ILLEGAL  
H
L
BA, CA, A10  
BA, CA, A10  
BA, RA  
BA, A10  
×
READ/READA  
WRIT/WRITA  
ACT  
ILLEGAL (2)  
ILLEGAL (2)  
ILLEGAL (2)  
ILLEGAL (2)  
ILLEGAL  
L
H
H
L
H
L
L
PRE/PALL  
REF  
L
H
L
L
L
OC, BA  
×
MRS/EMRS  
DESL  
ILLEGAL  
Write with Auto  
Precharge  
×
×
×
Continue burst to end -Write  
recovering with auto precharge  
L
H
H
H
×
NOP  
Continue burst to end -Write  
recoveringwith auto precharge  
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
H
H
H
L
H
L
L
×
BST  
ILLEGAL  
ILLEGAL(2)  
ILLEGAL (2)  
ILLEGAL(2)  
H
L
BA, CA, A10  
READ/READA  
WRIT/WRITA  
ACT  
L
BA, CA, A10  
H
H
L
H
L
BA,RA  
L
BA, A10  
PRE/PALL  
REF  
ILLEGAL (2)  
L
H
L
×
ILLEGAL  
L
L
OC,BA  
MRS/EMRS  
DESL  
ILLEGAL  
Precharging  
×
H
H
H
H
L
×
H
H
L
×
H
L
×
Nop Enter idle after tRP  
Nop Enter idle after tRP  
ILLEGAL  
ILLEGAL (2)  
ILLEGAL (2)  
×
NOP  
×
BST  
H
L
BA,CA,A10  
BA,CA,A10  
BA,RA  
BA, A10  
×
READ/READA  
WRIT/WRITA  
ACT  
L
H
H
L
H
L
ILLEGAL(2)  
L
PRE/PALL  
REF  
Nop Enter idle after tRP  
ILLEGAL  
L
H
L
L
L
OC,BA  
×
MRS/EMRS  
DESL  
ILLEGAL  
Row Activating  
×
H
H
H
H
L
×
H
H
L
×
H
L
Nop Enter bank active after tRCD  
Nop Enter bank active after tRCD  
ILLEGAL  
ILLEGAL (2)  
ILLEGAL (2)  
ILLEGAL (2,8)  
ILLEGAL (2)  
×
NOP  
×
BST  
H
L
BA,CA,A10  
BA,CA,A10  
BA,RA  
BA, A10  
×
READ/READA  
WRIT/WRITA  
ACT  
L
H
H
L
H
L
L
PRE/PALL  
REF  
L
H
L
ILLEGAL  
L
L
OC,BA  
MRS/EMRS  
ILLEGAL  
Note: H=VIH, L=VIL x= VIH or VIL, V = Valid Data, BA= Bank Address, CA+Column Address, RA=Row Address, OC= Op-Code  
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13  
PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
FUNCTIONAL TRUTH TABLE Continued:  
CS  
H
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
RAS CAS  
WE  
Address  
Command  
DESL  
Action  
Write Recovering  
×
H
H
H
H
L
×
H
H
L
×
×
Nop Enter row active after tDPL  
Nop Enter row active after tDPL  
Nop Enter row active after tDPL  
Begin read (6)  
H
L
×
NOP  
×
BST  
H
L
BA, CA, A10  
READ/READA  
WRIT/WRITA  
ACT  
L
BA, CA, A10  
Begin new write  
ILLEGAL (2)  
ILLEGAL (2)  
H
H
L
H
L
BA, RA  
L
BA, A10  
PRE/PALL  
REF  
L
H
L
×
ILLEGAL  
L
L
OC, BA  
MRS/EMRS  
DESL  
ILLEGAL  
Write Recovering  
with Auto  
×
H
H
H
H
L
×
H
H
L
×
H
L
×
Nop Enter precharge after tDPL  
Nop Enter precharge after tDPL  
Nop Enter row active after tDPL  
ILLEGAL  
ILLEGAL (2, 6)  
ILLEGAL (2)  
×
NOP  
Precharge  
×
BST  
H
L
BA, CA, A10  
READ/READA  
WRIT/WRITA  
ACT  
L
BA, CA, A10  
H
H
L
H
L
BA, RA  
L
BA, A10  
PRE/PALL  
REF  
ILLEGAL (2)  
L
H
L
×
ILLEGAL  
L
L
OC, BA  
MRS/EMRS  
DESL  
ILLEGAL  
Refresh  
×
H
H
H
H
L
×
H
H
L
×
H
L
×
Enter idle after tRC1  
Nop Enter idle after tRC1  
Nop Enter idle after tRC1  
ILLEGAL  
×
NOP  
×
BST  
H
L
BA, CA, A10  
BA, CA, A10  
BA, RA  
BA, A10  
×
EAD/READA  
WRIT/WRITA  
ACT  
L
ILLEGAL  
H
H
L
H
L
ILLEGAL  
L
PRE/PALL  
REF  
ILLEGAL  
L
H
L
ILLEGAL  
L
L
OC, BA  
×
MRS/EMRS  
DESL  
ILLEGAL  
Mode Register  
Accessing  
×
H
H
H
H
L
×
H
H
L
×
H
L
Nop Enter idle after tRSC  
Nop Enter idle after tRSC  
Nop Enter idle after tRSC  
ILLEGAL  
×
NOP  
×
BST  
H
L
BA, CA, A10  
BA, CA, A10  
BA, RA  
BA, A10  
×
READ/READA  
WRIT/WRITA  
ACT  
L
ILLEGAL  
H
H
L
H
L
ILLEGAL  
L
PRE/PALL  
REF  
ILLEGAL  
L
H
L
ILLEGAL  
L
L
OC, BA  
MRS/EMRS  
ILLEGAL  
Note: H=VIH, L=VIL x= VIH or VIL, V = Valid Data, BA= Bank Address, CA+Column Address, RA=Row Address, OC= Op-Code  
14  
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PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
FUNCTIONAL TRUTH TABLE Continued:  
Notes:  
1. All entries assume that CKE is active (CKEn-1=CKEn=H).  
2. Illegal to bank in specified states; Function may be legal in the bank indicated by Bank Address (BA), depending on the  
state of that bank.  
3. Illegal if tRCD is not satisfied.  
4. Illegal if tRAS is not satisfied.  
5. Must satisfy burst interrupt condition.  
6. Must satisfy bus contention, bus turn around, and/or write recovery requirements.  
7. Must mask preceding data which don’t satisfy tDPL.  
8. Illegal if tRRD is not satisfied.  
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PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
ABSOLUTE MAXIMUM RATINGS(1)  
Symbol  
Parameters  
Rating  
Rating  
Unit  
42LSxxxxxxL 42SxxxxxxL  
VDD MAX  
VDDQ MAX  
VIN  
Maximum Supply Voltage  
Maximum Supply Voltage for Output Buffer  
Input Voltage  
–0.5to+3.6  
–0.5to+3.6  
–0.5to+3.6  
–0.5to+3.6  
1
–0.5to+4.6  
–0.5to+4.6  
–0.5to+4.6  
–0.5to+4.6  
1
V
V
V
VOUT  
Output Voltage  
V
PD MAX  
ICS  
Allowable Power Dissipation  
OutputShortedCurrent  
W
mA  
°C  
50  
50  
TOPR  
Operating Temperature  
Com.  
Ind.  
0to+70  
–40to+85  
0to+70  
–40to+85  
TSTG  
Storage Temperature  
–55to+125  
–55to+125  
°C  
Notes:  
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to  
the device. This is a stress rating only and functional operation of the device at these or any other condi-  
tions above those indicated in the operational sections of this specification is not implied. Exposure to  
absolute maximum rating conditions for extended periods may affect reliability.  
2. All voltages are referenced to Vss.  
DC RECOMMENDED OPERATING CONDITIONS(2) (At TA = 0 to +70°C)  
42LSxxxxxxL  
Typ.  
42SxxxxxxL  
Typ.  
Symbol  
Parameter  
Min.  
Max.  
Min.  
Max.  
Unit  
VDD  
SupplyVoltage  
2.3  
1.65  
1.25  
-0.3  
2.5  
2.0  
2.7  
2.7  
3.0  
3.0  
2.0  
-0.3  
3.3  
3.3  
3.6  
3.6  
V
V
V
V
VDDQ  
I/O Supply Voltage  
Input High Voltage  
Input Low Voltage  
(1)  
VIH  
VDDQ +0.3  
+0.3  
VDDQ +0.3  
+0.8  
(2)  
VIL  
Note:  
1. VIH (max) = VDDQ +1.5V (PULSE WIDTH < 5NS).  
2. VIL (min) = -1.5V (PULSE WIDTH < 5NS).  
CAPACITANCE CHARACTERISTICS  
(AtTA =0to+25°C, VDD =3.3V± 0.3Vor2.5V± 0.2V, VDDQ=3.3V± 0.3Vor2.5V± 0.2Vor1.8V± 0.15V, f=1MHz)  
Symbol  
Parameter  
Typ.  
Max.  
Unit  
CIN1  
CIN2  
CI/O  
InputCapacitance:CLK  
3.5  
3.8  
6.5  
pF  
pF  
pF  
Input Capacitance: All other input pins  
Data Input/Output Capacitance: I/Os  
16  
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INFORMATION Rev. 00A  
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®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
DC ELECTRICAL CHARACTERISTICS (VDD = 3.3V ± 0.3V or 2.5V ± 0.2V , VDDQ = 3.3V ± 0.3V or 2.5V ± 0.2V or 1.8V± 0.15V)  
Symbol Parameter  
Test Condition  
S p e e d Min.  
Max.  
Unit  
I
IL  
InputLeakageCurrent  
0V VIN VDD, with pins other than  
–5  
5
µA  
thetestedpinat0V  
I
OL  
OutputLeakageCurrent  
OutputHighVoltageLevel  
OutputLowVoltageLevel  
OperatingCurrent(1,2)  
Output is disabled, 0V VOUT VDD  
–5  
2.4  
5
µA  
V
V
V
OH  
OL  
I
OUT =2mA  
OUT = +2 mA  
0.4  
I
V
I
DD1  
ActiveMode,  
BurstLength=2  
Com.  
Ind.  
Com.  
Ind.  
-7  
-7  
-10  
-10  
120  
130  
100  
110  
mA  
mA  
mA  
mA  
tRC tRC (min.)  
IOUT = 0mA  
I
I
DD2P  
PrechargeStandbyCurrent  
(InPower-DownMode)  
CKE VIL  
CKE VIH  
CKE VIL  
CKE VIH  
(
MAX  
)
t
CK = tCK  
(MIN  
(MIN  
(MIN  
(MIN  
)
)
)
)
1.5  
1.0  
mA  
mA  
DD2PS  
tCK = ∞  
I
I
DD2N  
PrechargeStandbyCurrent  
(InNonPower-DownMode)  
(
MIN)  
tCK = tCK  
25  
15  
mA  
mA  
DD2NS  
tCK = ∞  
I
I
DD3P  
ActiveStandbyCurrent  
(InPower-DownMode)  
(
MAX  
)
tCK = tCK  
10  
10  
mA  
mA  
DD3PS  
tCK = ∞  
I
DD3N  
ActiveStandbyCurrent  
(
MIN)  
tCK = tCK  
Com  
Ind.  
Com  
Ind.  
35  
45  
30  
35  
mA  
mA  
mA  
mA  
I
DD3NS  
(InNonPower-DownMode)  
tCK = ∞  
I
I
DD4  
OperatingCurrent  
(InBurstMode)(1)  
t
CK = tCK  
(
MIN  
)
Com.  
Ind.  
Com.  
Ind.  
-7  
-7  
-10  
-10  
90  
110  
80  
mA  
mA  
mA  
mA  
IOUT = 0mA  
100  
DD5  
Auto-RefreshCurrent  
tRC = tRC  
(
MIN  
)
Com.  
Ind.  
Com.  
Ind.  
-7  
-7  
-10  
-10  
210  
240  
190  
200  
mA  
mA  
mA  
mA  
Notes:  
1. These are the values at the minimum cycle time. Since the currents are transient, these values decrease as the cycle time  
increases. Also note that a bypass capacitor of at least 0.01 µF should be inserted between Vdd and Vss for each memory  
chip to suppress power supply voltage noise (voltage drops) due to these transient currents.  
2. IDD1 and IDD4 depend on the output load. The maximum values for Idd1 and Idd4 are obtained with the output open state.  
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17  
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INFORMATION Rev. 00A  
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®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
DC ELECTRICAL CHARACTERISTICS (Recommended Operation Conditions unless otherwise noted.)  
Symbol Parameter  
Self-RefreshCurrent  
Test Condition  
S p e e d Min. Max.  
Unit  
I
DD6  
CKE0.2V,tCSR =00  
PASR=000(full)  
ts < 70OC  
350  
300  
230  
170  
140  
µA  
µA  
µA  
µA  
µA  
PASR=001(2BK)  
PASR=010(1BK)  
PASR=101(1/2BK)  
PASR=110(1/4BK)  
I
DD6  
DD6  
DD6  
Self-RefreshCurrent  
PASR=000(full)  
PASR=001(2BK)  
PASR=010(1BK)  
PASR=101(1/2BK)  
PASR=110(1/4BK)  
CKE0.2V,tCSR =01  
ts < 45OC  
300  
250  
200  
150  
130  
µA  
µA  
µA  
µA  
µA  
I
I
Self-RefreshCurrent  
PASR=000(full)  
PASR=001(2BK)  
PASR=010(1BK)  
PASR=101(1/2BK)  
PASR=110(1/4BK)  
CKE0.2V,tCSR =10  
ts < 15OC  
250  
180  
140  
110  
90  
µA  
µA  
µA  
µA  
µA  
Self-RefreshCurrent  
PASR=000(full)  
CKE 0.2V, , tCSR = 11  
ts < 85OC  
600  
400  
350  
250  
200  
µA  
µA  
µA  
µA  
µA  
PASR=001(2BK)  
PASR=010(1BK)  
PASR=101(1/2BK)  
PASR=110(1/4BK)  
I
DD7  
StandbyCurrent in  
CKE0.2V  
10  
µA  
DeepPowerDownMode  
18  
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®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
(1,2,3)  
AC ELECTRICAL CHARACTERISTICS  
- 7  
- 1 0  
M i n .  
S y m b o l  
P a r a m e t e r  
M i n . M a x .  
M a x  
U n i t s  
tCK3  
tCK2  
Clock Cycle Time  
CAS Latency = 3  
CAS Latency = 2  
7
10  
10  
10  
ns  
ns  
tAC3  
tAC2  
Access Time From CLK(4)  
CAS Latency = 3  
CAS Latency = 2  
5.4  
6
7
9
ns  
ns  
tCHI  
tCL  
CLK HIGH Level Width  
CLK LOW Level Width  
Output Data Hold Time  
2.5  
2.5  
3.5  
3.5  
ns  
ns  
tOH3  
tOH2  
CAS Latency = 3  
CAS Latency = 2  
2.5  
2.5  
2.5  
2.5  
ns  
ns  
tLZ  
Output LOW Impedance Time  
0
0
ns  
tHZ3  
tHZ2  
Output HIGH Impedance Time(5)CAS Latency = 3  
CAS Latency = 2  
6
6
7
9
ns  
ns  
tDS  
Input Data Setup Time  
1.5  
0.8  
1.5  
0.8  
1.5  
0.8  
1CLK+3  
1.5  
0.8  
63  
2.0  
1
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tDH  
Input Data Hold Time  
tAS  
Address Setup Time  
2.0  
1
tAH  
Address Hold Time  
tCKS  
tCKH  
tCKA  
tCS  
CKE Setup Time  
2.0  
1
CKE Hold Time  
CKE to CLK Recovery Delay Time  
Command Setup Time (CS, RAS, CAS, WE, DQM)  
Command Hold Time (CS, RAS, CAS, WE, DQM)  
Command Period (REF to REF / ACT to ACT)  
Command Period (ACT to PRE)  
Command Period (PRE to ACT)  
Active Command To Read / Write Command Delay Time  
Command Period (ACT [0] to ACT[1])  
1CLK+3  
2.0  
1
tCH  
tRC  
70  
tRAS  
tRP  
37  
120,000  
44  
120,000  
18  
20  
tRCD  
tRRD  
tDPL3  
18  
20  
14  
15  
Input Data To Precharge  
Command Delay time  
CAS Latency = 3  
2CLK  
2CLK  
tDPL2  
tDAL3  
CAS Latency = 2  
2CLK  
2CLK  
ns  
ns  
Input Data To Active / Refresh CAS Latency = 3  
Command Delay time (During Auto-Precharge)  
CAS Latency = 2  
2CLK+tRP  
2CLK+tRP  
tDAL2  
tT  
2CLK+tRP  
0.5  
30  
64  
2CLK+tRP  
0.5  
30  
64  
ns  
ns  
Transition Time  
tREF  
Refresh Cycle Time (4096)  
ms  
Notes:  
1. When power is first applied, memory operation should be started 100 µs after VDD and VDDQ reach their stipulated voltages.  
Also note that the power-on sequence must be executed before starting memory operation.  
2. Measured with tT = 1 ns.  
3. The reference level is 0.9V when measuring input signal timing. Rise and fall times are measured between VIH (min.) and VIL  
(max.).  
4. Access time is measured at 0.9V with the load shown in the figure below.  
5. The time tHZ (max.) is defined as the time required for the output voltage to transition by ± 200 mV from VOH (min.) or VOL (max.)  
when the output is in the high impedance state.  
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PRELIMINARY  
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®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
OPERATING FREQUENCY / LATENCY RELATIONSHIPS  
SYMBOL PARAMETER  
-7  
7
-10.  
UNITS  
ns  
Clock Cycle Time  
10  
100  
1
OperatingFrequency  
133  
1
MHz  
tCCD  
tCKED  
tPED  
tDQD  
tDQM  
tDQZ  
tDWD  
tDAL  
tDPL  
tBDL  
tCDL  
tRDL  
tMRD  
READ/WRITE command to READ/WRITE command  
CKE to clock disable or power-down entry mode  
CKE to clock enable or power-down exit setup mode  
DQM to input data delay  
cycle  
cycle  
cycle  
cycle  
cycle  
cycle  
cycle  
cycle  
cycle  
cycle  
cycle  
cycle  
cycle  
1
1
1
1
0
0
DQM to data mask during WRITEs  
DQM to data high-impedance during READs  
WRITE command to input data delay  
Data-in to ACTIVE command  
0
0
2
2
0
0
5
4
Data-intoPRECHARGEcommand  
Last data-in to burst STOP command  
Last data-in to new READ/WRITE command  
Last data-in to PRECHARGE command  
2
2
1
1
1
1
2
2
LOAD MODE REGISTER command  
to ACTIVE or REFRESH command  
2
2
tROH  
Data-outtohigh-impedancefrom  
PRECHARGEcommand  
CL = 3  
CL = 2  
3
2
3
2
cycle  
20  
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®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
AC TEST CONDITIONS (VCCQ = 1.8V)  
Input Load  
Output Load  
t
CK  
t
CHI  
t
CL  
1.4V  
0.9V  
0.9V  
0.4V  
CLK  
50Ω  
Z = 50Ω  
t
CS  
t
CH  
Output  
1.4V  
0.9V  
30 pF  
INPUT  
0.4V  
t
AC  
t
OH  
OUTPUT  
0.9V  
0.9V  
AC TEST CONDITIONS  
Parameter  
Unit  
AC High Level Input Voltage/Low Level Input Voltage  
Input Rise and Fall Times  
1.4Vto0.4V  
1 ns  
Input Timing Reference Level  
0.9V  
Output Timing Measurement Reference Level  
0.9V  
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PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
AC TEST CONDITIONS (VCCQ = 3.3V)  
Output Load  
Input Load  
t
CK  
t
CHI  
t
CL  
3.0V  
1.5V  
1.5V  
0V  
CLK  
50Ω  
Z = 50Ω  
t
CS  
t
CH  
Output  
3.0V  
1.5V  
30 pF  
INPUT  
0V  
t
AC  
t
OH  
OUTPUT  
1.5V  
1.5V  
AC TEST CONDITIONS  
Parameter  
Unit  
AC High Level Input Voltage/Low Level Input Voltage  
Input Rise and Fall Times  
3.0Vto0V  
1 ns  
Input Timing Reference Level  
1.5V  
Output Timing Measurement Reference Level  
1.5V  
22  
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®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
descriptions and device operation.  
FUNCTIONAL DESCRIPTION  
The 128Mb Low - Power SDRAMs are quad-bank DRAMs  
which operate at 2.5V or 3.3V and include a synchronous  
interface (all signals are registered on the positive edge of  
the clock signal, CLK). Each of the 33,554,432-bit banks is  
organized as 4,096 rows by 512 columns by 16 bits.  
Initialization  
SDRAMs must be powered up and initialized in a  
predefinedmanner.  
The128MSDRAMisinitializedafterthepowerisappliedto  
VDD and VDDQ (simultaneously) and the clock is stable.  
Read and write accesses to the SDRAM are burst oriented;  
accesses start at a selected location and continue for a  
programmed number of locations in a programmed  
sequence. Accesses begin with the registration of an AC-  
TIVEcommandwhichisthenfollowedbyaREADorWRITE  
command. The address bits registered coincident with the  
ACTIVE command are used to select the bank and row to  
A 200µs delay is required prior to issuing any command  
other than a COMMAND INHIBIT or aNOP. The COMMAND  
INHIBITorNOPmaybeappliedduringthe100usperiodand  
should continue at least through the end of the period.  
With at least one COMMAND INHIBIT or NOP command  
havingbeenapplied,aPRECHARGEcommandshouldbe  
appliedoncethe100µsdelayhasbeensatisfied. Allbanks  
mustbeprecharged. Thiswillleaveallbanksinanidlestate  
wheretwoAUTOREFRESHcyclesmustbeperformed. After  
theAUTOREFRESHcyclesarecomplete,theSDRAMisthen  
readyformoderegisterprogramming.  
beaccessed(BA0andBA1selectthebank,A0-A11selecttherow)  
.
TheaddressbitsA0-A9(x8);A0-A8(x16);A0-A7(x32)regis-  
tered coincident with the READ or WRITE command are  
used to select the starting column location for the burst  
access.  
Themoderegisterandextendedmoderegistersshouldbe  
loadedpriortoapplyinganyoperationalcommandbecause  
it will power up in an unknown state.  
Prior to normal operation, the SDRAM must be initialized.  
The following sections provide detailed information covering  
device initialization, register definition, command  
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®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
REGISTER DEFINITION  
Mode Register  
Mode register bits M0-M2 specify the burst length, M3  
specifiesthetypeofburst (sequentialorinterleaved), M4-M6  
specify the CAS latency, M7 and M8 specify the operating  
mode, M9 specifies the WRITE burst mode, and M10 and  
M11 are reserved for future use.  
The mode register is used to define the specific mode of  
operation of the SDRAM. This definition includes the  
selection of a burst length, a burst type, a CAS latency, an  
operatingmodeandawriteburstmode,asshowninMODE  
REGISTERDEFINITION.  
The mode register must be loaded when all banks are idle,  
and the controller must wait the specified time before  
initiatingthesubsequentoperation.Violatingeitherofthese  
requirements will result in unspecified operation.  
The mode register is programmed via the LOAD MODE  
REGISTER command and will retain the stored information  
until it is programmed again or the device loses power.  
MODE REGISTER DEFINITION  
Address Bus  
BA1 BA0 A11 A10 A9  
A8  
A7  
A6  
A5  
A4  
A3  
A2  
A1  
A0  
Mode Register (Mx)  
Reserved(1)  
Burst Length  
M2 M1 M0  
M3=0  
M3=1  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
1
2
4
8
1
2
4
8
Reserved Reserved  
Reserved Reserved  
Reserved Reserved  
Full Page Reserved  
Burst Type  
M3  
Type  
0
1
Sequential  
Interleaved  
Latency Mode  
M6 M5 M4  
CAS Latency  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
Reserved  
Reserved  
2
3
Reserved  
Reserved  
Reserved  
Reserved  
Operating Mode  
M8 M7 M6-M0 Mode  
0
0
Defined Standard Operation  
All Other States Reserved  
Write Burst Mode  
M9  
0
Mode  
Programmed Burst Length  
Single Location Access  
1. To ensure compatibility with future devices,  
should program BA1, BA0, A11, A10 = "0, 0"  
1
24  
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®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
REGISTER DEFINITION  
Extended Mode Register  
ExtendedModeregisterbitsM0-M2controlsPASRandM3-  
M4 controls (TCSR). M5 - M11 must be programmed to 0.  
The mode register is used to define the specific SDRAM  
low-power features. This includes the Temperature Com-  
pensated Self Refresh (TCSR) and Partial Array Self  
Refresh (PASR) as shown in EXTENDED MODE REGIS-  
TER DEFINITION.  
The Extended Mode Register must be loaded when all  
banksareidleandnoburstsareinprogress.Thecontroller  
mustinitializetheoperationafterwaitingthespecifiedtime.  
.Violatingeitheroftheserequirementswillresultinunspeci-  
fied operation.  
The extended mode register is programmed via the EX-  
TENDED LOAD MODE REGISTER command (M13=1,  
M12=0) and will retain the stored information until it is pro-  
grammed again or the device loses power.  
MODE REGISTER DEFINITION  
Address Bus  
BA1 BA0 A11 A10 A9 A8 A7 A6 A5  
A4 A3  
A2 A1 A0  
Extended Mode  
Register (Mx)  
M11-M5  
PASR  
0
M12  
0
M2 M1 M0 Self Refresh Coverage  
M13  
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
4 banks  
2 banks (Bank 0,1)  
1 bank (Bank 0)  
Reserved  
Reserved  
1/2 bank (Bank 0)  
1/4 bank (Bank 0)  
Reserved  
TCSR  
M4 M3 Max. Case Temp.  
1
0
0
1
0
1
0
1
15ο C  
45ο C  
70ο C  
85ο C  
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PRELIMINARY  
INFORMATION Rev. 00A  
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®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
INITIALIZE / LOAD MODE REGISTER AND EXTEND MODE REGISTER  
Tp+5  
Tp+6  
Tp+4  
T0  
T1  
Tn+1  
To+1  
t
CL  
Tp+1  
t
CK  
t
CH  
CLK  
CKE  
t
CKS tCKH  
t
CMS  
t
CMH  
t
CMS  
t
CMH  
tCMS tCMH  
AUTO  
REFRESH  
AUTO  
Load MODE  
REGISTER  
Load MODE  
REGISTER  
COMMAND  
ACTIVE  
NOP  
NOP  
PRECHARGE  
NOP  
NOP  
REFRESH  
DQM/DQML  
DQMH/DQM0-3  
t
AS  
tAH  
A0-A9, A11  
A10  
ROW  
ROW  
BANK  
CODE  
CODE  
CODE  
ALL BANKS  
CODE  
t
AS  
tAH  
BA0=L  
BA1=L  
BA0=L  
BA1=H  
BA0, BA1  
DQ  
HighZ  
T
t
RP  
t
RFC  
tRFC  
MODE REGISTER  
Power-up: VCC  
Precharge AUTO REFRESH  
AUTO REFRESH  
Extended MODE REGISTER  
and CLK stable all banks  
DON'T CARE  
T = 100µs Min.  
Note: The Load Mode Register for both Mode Register / Extended Mode Register and two Auto Refresh Commands  
can be in any order. However, all must occur prior to an Active Command.  
26  
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PRELIMINARY  
INFORMATION Rev. 00A  
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®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
AUTO-REFRESH CYCLE  
T0  
T1  
T2  
Tn+1  
To+1  
t
CK  
t
CL  
t
CH  
CLK  
CKE  
t
CKS CKH  
t
t
CMS  
t
CMH  
Auto  
Refresh  
Auto  
COMMAND  
PRECHARGE  
NOP  
NOP  
NOP  
ACTIVE  
Refresh  
DQM/DQML  
DQMH/DQM0-3  
A0-A9, A11  
A10  
ROW  
ROW  
BANK  
ALL BANKS  
SINGLE BANK  
BANK(s)  
BA0, BA1  
DQ  
t
AS  
t
AH  
High-Z  
t
RFC  
t
RP  
t
RFC  
DON'T CARE  
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PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
SELF-REFRESH CYCLE  
T0  
T1  
T2  
Tn+1  
To+1  
To+2  
t
CK  
t
CH  
t
CL  
CLK  
CKE  
t
CKS  
t
CKH  
t
CKS  
tRAS  
t
CKS  
t
CMS  
t
CMH  
Auto  
Auto  
COMMAND  
PRECHARGE  
NOP  
NOP  
NOP  
Refresh  
Refresh  
DQM/DQML  
DQMH/DQM0-3  
A0-A9, A11  
A10  
ALL BANKS  
SINGLE BANK  
t
AS  
t
AH  
BA0, BA1  
DQ  
BANK  
High-Z  
t
XSR  
t
RP  
Precharge all  
active banks  
Enter self  
refresh mode  
CLK stable prior to exiting  
self refresh mode  
Exit self refresh mode  
(Restart refresh time base)  
DON'T CARE  
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PRELIMINARY  
INFORMATION Rev. 00A  
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®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
BURST LENGTH  
ReadandwriteaccessestotheSDRAMareburstoriented,  
with the burst length being programmable, as shown in  
MODE REGISTER DEFINITION. The burst length deter-  
mines the maximum number of column locations that can  
be accessed for a given READ or WRITE command. Burst  
lengths of 1, 2, 4 or 8 locations are available for both the  
sequential and the interleaved burst types, and a full-page  
burstisavailableforthesequentialtype.Thefull-pageburst  
is used in conjunction with the BURST TERMINATE com-  
mand to generate arbitrary burst lengths.  
ing that the burst will wrap within the block if a boundary is  
reached. The block is uniquely selected by A1-A7 (x32)  
whentheburstlengthissettotwo;byA2-A7(x32)whenthe  
burstlengthissettofour;andbyA3-A7(x32)whentheburst  
length is set to eight. The remaining (least significant)  
address bit(s) is (are) used to select the starting location  
withintheblock.Full-pageburstswrapwithinthepageifthe  
boundary is reached.  
Burst Type  
Accesses within a given burst may be programmed to be  
either sequential or interleaved; this is referred to as the  
burst type and is selected via bit M3.  
Reservedstatesshouldnotbeused,asunknownoperation  
or incompatibility with future versions may result.  
When a READ or WRITE command is issued, a block of  
columnsequaltotheburstlengthiseffectivelyselected.All  
accesses for that burst take place within this block, mean-  
Theorderingofaccesseswithinaburstisdeterminedbythe  
burstlength,thebursttypeandthestartingcolumnaddress,  
as shown in BURST DEFINITION table.  
BURST DEFINITION  
Burst  
StartingColumn  
Address  
OrderofAccessesWithinaBurst  
Length  
Type=Sequential  
Type=Interleaved  
A0  
2
4
0
1
0-1  
1-0  
0-1  
1-0  
A1  
0
A0  
0
0-1-2-3  
1-2-3-0  
2-3-0-1  
3-0-1-2  
0-1-2-3  
1-0-3-2  
2-3-0-1  
3-2-1-0  
0
1
1
0
1
1
A2  
A1  
0
A0  
0
0
0-1-2-3-4-5-6-7  
1-2-3-4-5-6-7-0  
2-3-4-5-6-7-0-1  
3-4-5-6-7-0-1-2  
4-5-6-7-0-1-2-3  
5-6-7-0-1-2-3-4  
6-7-0-1-2-3-4-5  
7-0-1-2-3-4-5-6  
0-1-2-3-4-5-6-7  
1-0-3-2-5-4-7-6  
2-3-0-1-6-7-4-5  
3-2-1-0-7-6-5-4  
4-5-6-7-0-1-2-3  
5-4-7-6-1-0-3-2  
6-7-4-5-2-3-0-1  
7-6-5-4-3-2-1-0  
NotSupported  
0
0
1
0
1
0
8
0
1
1
1
0
0
1
0
1
1
1
1
0
1
1
Full  
Page  
(y)  
n=A0-A7  
Cn, Cn + 1, Cn + 2  
Cn + 3, Cn + 4...  
…Cn-1,  
(location0-y)  
Cn…  
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®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
CAS Latency  
The CAS latency is the delay, in clock cycles, between the  
registration of a READ command and the availability of the  
first piece of output data. The latency can be set to two or  
three clocks.  
reserved for future use and/or test modes. The programmed  
burst length applies to both READ and WRITE bursts.  
Test modes and reserved states should not be used  
because unknown operation or incompatibility with future  
versions may result.  
If a READ command is registered at clock edge n, and the  
latencyismclocks, thedatawillbeavailablebyclockedge  
n+m.TheDQswillstartdrivingasaresultoftheclockedge  
one cycle earlier (n + m - 1), and provided that the relevant  
access times are met, the data will be valid by clock edge  
n + m. For example, assuming that the clock cycle time is  
such that all relevant access times are met, if a READ  
commandisregisteredatT0andthelatencyisprogrammed  
totwoclocks,theDQswillstartdrivingafterT1andthedata  
willbevalidbyT2,asshowninCASLatencydiagrams.The  
AllowableOperatingFrequencytableindicatestheoperat-  
ing frequencies at which each CAS latency setting can be  
used.  
Write Burst Mode  
When M9 = 0, the burst length programmed via M0-M2  
appliestobothREADandWRITEbursts;whenM9=1, the  
programmedburstlengthappliestoREADbursts,butwrite  
accesses are single-location (nonburst) accesses.  
CAS Latency  
Allowable Operating Frequency (MHz)  
S p e e d  
CAS Latency  
100  
=
2
CAS Latency  
133  
= 3  
Reservedstatesshouldnotbeusedasunknownoperationor  
incompatibility with future versions may result.  
7
10  
100  
100  
Operating Mode  
ThenormaloperatingmodeisselectedbysettingM7andM8  
to zero; the other combinations of values for M7 and M8 are  
CAS LATENCY  
T0  
T1  
T2  
T3  
CLK  
READ  
NOP  
NOP  
COMMAND  
DQ  
t
AC  
DOUT  
t
LZ  
t
OH  
CAS Latency - 2  
T0  
T1  
T2  
T3  
T4  
CLK  
READ  
NOP  
NOP  
NOP  
COMMAND  
DQ  
t
AC  
DOUT  
t
LZ  
t
OH  
CAS Latency - 3  
DON'T CARE  
UNDEFINED  
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IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
ACTIVATING  
WITHIN SPECIFIC BANK  
SPECIFIC  
ROW  
CHIP OPERATION  
BANK/ROW ACTIVATION  
BeforeanyREADorWRITEcommandscanbeissuedtoa  
bankwithintheSDRAM,arowinthatbankmustbe“opened.”  
This is accomplished via the ACTIVE command, which  
selects both the bank and the row to be activated (see  
Activating Specific Row Within Specific Bank).  
CLK  
HIGH  
CKE  
CS  
After opening a row (issuing an ACTIVE command), a  
READ or WRITE command may be issued to that row,  
subject to the tRCD specification. Minimum tRCD should be  
dividedbytheclockperiodandroundeduptothenextwhole  
number to determine the earliest clock edge after the  
ACTIVE command on which a READ or WRITE command  
can be entered. For example, a tRCD specification of 20ns  
with a 125 MHz clock (8ns period) results in 2.5 clocks,  
rounded to 3. This is reflected in the following example,  
which covers any case where 2 < [tRCD (MIN)/tCK] 3. (The  
sameprocedureisusedtoconvertotherspecificationlimits  
from time units to clock cycles).  
RAS  
CAS  
WE  
A0-A11  
BA0, BA1  
ROW ADDRESS  
A subsequent ACTIVE command to a different row in the  
samebankcanonlybeissuedafterthepreviousactiverow  
hasbeenclosed(precharged).Theminimumtimeinterval  
betweensuccessiveACTIVEcommandstothesamebank  
is defined by tRC.  
BANK ADDRESS  
A subsequent ACTIVE command to another bank can be  
issuedwhilethefirstbankisbeingaccessed, whichresults  
in a reduction of total row-access overhead. The minimum  
time interval between successive ACTIVE commands to  
different banks is defined by tRRD.  
EXAMPLE: MEETING TRCD (MIN) WHEN 2 < [TRCD (MIN)/TCK] 3  
T0  
T1  
T2  
T3  
T4  
CLK  
READ or  
WRITE  
ACTIVE  
NOP  
NOP  
COMMAND  
tRCD  
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®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
READS  
READ COMMAND  
READ bursts are initiated with a READ command, as  
shown in the READ COMMAND diagram.  
CLK  
CKE  
The starting column and bank addresses are provided with  
the READ command, and auto precharge is either enabled  
ordisabledforthatburstaccess.Ifautoprechargeisenabled,  
therowbeingaccessedisprechargedatthecompletionofthe  
burst.ForthegenericREADcommandsusedinthefollowing  
illustrations, auto precharge is disabled.  
HIGH  
CS  
During READ bursts, the valid data-out element from the  
startingcolumnaddresswillbeavailablefollowingtheCAS  
latencyaftertheREADcommand. Eachsubsequent data-  
outelementwillbevalidbythenextpositiveclockedge.The  
CAS Latency diagram shows general timing  
for each possible CAS latency setting.  
RAS  
CAS  
WE  
Upon completion of a burst, assuming no other commands  
havebeeninitiated,theDQswillgoHigh-Z.Afull-pageburst  
will continue until terminated. (At the end of the page, it will  
wrap to column 0 and continue.)  
COLUMN ADDRESS  
A0-A7  
A8, A9, A11  
A10  
Data from any READ burst may be truncated with a subse-  
quentREADcommand, anddatafromafixed-lengthREAD  
burst may be immediately followed by data from a READ  
command. In either case, a continuous flow of data can be  
maintained.Thefirstdataelementfromthenewburstfollows  
eitherthelastelementofacompletedburstorthelastdesired  
data element of a longer burst which is being truncated.  
AUTO PRECHARGE  
NO PRECHARGE  
BANK ADDRESS  
BA0, BA1  
ThenewREADcommandshouldbeissuedxcyclesbefore  
the clock edge at which the last desired data element is  
valid, where x equals the CAS latency minus one. This is  
shown in Consecutive READ Bursts for CAS latencies of  
twoandthree;dataelementn+3iseitherthelastofaburst  
of four or the last desired of a longer burst. The 128Mb  
SDRAM uses a pipelined architecture and therefore does  
not require the 2n rule associated with a prefetch architec-  
ture. AREADcommandcanbeinitiatedonanyclockcycle  
following a previous READ command. Full-speed random  
readaccessescanbeperformedtothesamebank,asshown  
in Random READ Accesses, or each subsequent READ  
may be performed to a different bank.  
TheDQMinputisusedtoavoidI/Ocontention,asshownin  
FiguresRW1andRW2. TheDQMsignalmustbeasserted  
(HIGH) at least two clocks prior to the WRITE command  
(DQM latency is two clocks for output buffers) to suppress  
data-out from the READ. Once the WRITE command is  
registered, the DQs will go High-Z (or remain High-Z),  
regardless of the state of the DQM signal, provided the  
DQM was active on the clock just prior to the WRITE  
command that truncated the READ command. If not, the  
second WRITE will be an invalid WRITE. For example, if  
DQMwasLOWduringT4inFigureRW2,thentheWRITEs  
at T5 and T7 would be valid, while the WRITE at T6 would  
be invalid.  
Data from any READ burst may be truncated with a  
subsequent WRITE command, and data from a fixed-length  
READ burst may be immediately followed by data from a  
WRITE command (subject to bus turnaround limitations).  
The WRITE burst may be initiated on the clock edge  
immediatelyfollowingthelast(orlastdesired)dataelement  
from the READ burst, provided that I/O contention can be  
avoided. In a given system design, there may be a possi-  
bility that the device driving the input data will go Low-Z  
before the SDRAM DQs go High-Z. In this case, at least a  
single-cycledelayshouldoccurbetweenthelastreaddata  
and the WRITE command.  
The DQM signal must be de-asserted prior to the WRITE  
command (DQM latency is zero clocks for input buffers) to  
ensure that the written data is not masked. Figure RW1  
shows the case where the clock frequency allows for bus  
contention to be avoided without adding a NOP cycle, and  
Figure RW2 shows the case where the additional NOP is  
needed.  
Afixed-lengthREADburstmaybefollowedby, ortruncated  
with, aPRECHARGEcommandtothesamebank(provided  
that auto precharge was not activated), and a full-page burst  
may be truncated with a PRECHARGE command to the  
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IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
same bank. The PRECHARGE command should be is-  
suedxcyclesbeforetheclockedgeatwhichthelastdesired  
dataelementisvalid,wherexequalstheCASlatencyminus  
one.ThisisshownintheREADtoPRECHARGEdiagramfor  
each possible CAS latency; data element n + 3 is either the  
last of a burst of four or the last desired of a longer burst.  
FollowingthePRECHARGEcommand,asubsequentcom-  
mandtothesamebankcannotbeissueduntiltRP ismet.Note  
that part of the row precharge time is hidden during the  
access of the last data element(s).  
Inthecaseofafixed-lengthburstbeingexecutedtocomple-  
tion,aPRECHARGEcommandissuedattheoptimumtime  
(as described above) provides the same operation that  
would result from the same fixed-length burst with auto  
precharge. The disadvantage of the PRECHARGE com-  
mand is that it requires that the command and address  
buses be available at the appropriate time to issue the  
command;theadvantageofthePRECHARGEcommandis  
that it can be used to truncate fixed-length or full-page  
bursts.  
Full-page READ bursts can be truncated with the BURST  
TERMINATE command, and fixed-length READ bursts  
may be truncated with a BURST TERMINATE command,  
providedthatautoprechargewasnotactivated.TheBURST  
TERMINATE command should be issued x cycles before  
the clock edge at which the last desired data element is  
valid, where x equals the CAS latency minus one. This is  
shown in the READ Burst Termination diagram for each  
possibleCASlatency;dataelementn+3isthelastdesired  
data element of a longer burst.  
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®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
RW1 - READ TO WRITE  
T0  
T1  
T2  
T3  
T4  
CLK  
DQM  
COMMAND  
ADDRESS  
DQ  
READ  
NOP  
NOP  
NOP  
WRITE  
BANK,  
COL n  
BANK,  
COL b  
t
HZ  
DOUT  
n
DIN  
b
t
DS  
DON'T CARE  
RW2 - READ TO WRITE WITH EXTRA CLOCK CYCLE  
T0  
T1  
T2  
T3  
T4  
T5  
CLK  
DQM  
COMMAND  
ADDRESS  
DQ  
READ  
NOP  
NOP  
NOP  
NOP  
WRITE  
BANK,  
COL b  
BANK,  
COL n  
t
HZ  
DOUT  
n
DIN  
b
t
DS  
DON'T CARE  
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IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
CONSECUTIVE READ BURSTS  
T0  
T1  
T2  
T3  
T4  
T5  
T6  
CLK  
COMMAND  
ADDRESS  
DQ  
READ  
NOP  
NOP  
NOP  
READ  
NOP  
NOP  
x=1 cycle  
BANK,  
COL n  
BANK,  
COL b  
DOUT  
n
DOUT n+1  
DOUT n+2  
DOUT n+3  
DOUT  
b
CAS Latency - 2  
DON'T CARE  
T0  
T1  
T2  
T3  
T4  
T5  
T6  
T7  
CLK  
COMMAND  
READ  
NOP  
NOP  
NOP  
READ  
NOP  
NOP  
NOP  
x = 2 cycles  
BANK,  
COL n  
BANK,  
COL b  
ADDRESS  
DQ  
DOUT n  
DOUT n+1  
DOUT n+2  
DOUT n+3  
DOUT b  
CAS Latency - 3  
DON'T CARE  
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IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
RANDOM READ ACCESSES  
T0  
T1  
T2  
T3  
T4  
T5  
CLK  
COMMAND  
ADDRESS  
DQ  
READ  
READ  
READ  
READ  
NOP  
NOP  
BANK,  
COL n  
BANK,  
COL b  
BANK,  
COL m  
BANK,  
COL x  
DOUT  
n
DOUT  
b
DOUT  
m
DOUT  
x
CAS Latency - 2  
DON'T CARE  
T0  
T1  
T2  
T3  
T4  
T5  
T6  
CLK  
COMMAND  
ADDRESS  
DQ  
READ  
READ  
READ  
READ  
NOP  
NOP  
NOP  
BANK,  
COL n  
BANK,  
COL b  
BANK,  
COL m  
BANK,  
COL x  
DOUT  
n
DOUT  
b
DOUT  
m
DOUT  
x
CAS Latency - 3  
DON'T CARE  
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ISSI  
READ BURST TERMINATION  
T0  
T1  
T2  
T3  
T4  
T5  
T6  
CLK  
COMMAND  
ADDRESS  
DQ  
BURST  
TERMINATE  
READ  
NOP  
NOP  
NOP  
NOP  
NOP  
x = 1 cycle  
BANK a,  
COL n  
DOUT  
n
DOUT n+1  
DOUT n+2  
DOUT n+3  
CAS Latency - 2  
DON'T CARE  
T0  
T1  
T2  
T3  
T4  
T5  
T6  
T7  
CLK  
COMMAND  
ADDRESS  
DQ  
BURST  
TERMINATE  
READ  
NOP  
NOP  
NOP  
NOP  
x = 2 cycles  
NOP  
NOP  
BANK,  
COL n  
DOUT  
n
DOUT n+1  
DOUT n+2  
DOUT n+3  
CAS Latency - 3  
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IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
ALTERNATING BANK READ ACCESSES  
T0  
T1  
T2  
T3  
T4  
T5  
T6  
T7  
T8  
t
CK  
t
CL  
tCH  
CLK  
CKE  
t
CKS tCKH  
t
CMS  
tCMH  
COMMAND  
ACTIVE  
NOP  
READ  
NOP  
ACTIVE  
NOP  
READ  
NOP  
ACTIVE  
t
CMS tCMH  
DQM/DQML  
DQMH/DQM0-3  
t
t
t
AS  
tAH  
COLUMN m(2)  
ROW  
ROW  
COLUMN b(2)  
ROW  
ROW  
A0-A9, A11  
A10  
ROW  
AS  
t
AH  
ENABLE AUTO PRECHARGE  
ENABLE AUTO PRECHARGE  
ROW  
AS  
tAH  
BANK 0  
BANK 3  
BANK 3  
BANK 0  
BA0, BA1  
BANK 0  
t
LZ  
t
OH  
t
OH  
t
OH  
t
OH  
t
OH  
DQ  
DOUT  
m
D
OUT m+  
1
DOUT m+  
2
DOUT m+  
3
DOUT  
b
t
AC  
t
AC  
t
AC  
t
AC  
t
AC  
t
AC  
t
t
t
t
RCD - BANK 0  
RRD  
CAS Latency - BANK 0  
t
RP - BANK 0  
tRCD - BANK 0  
t
RCD - BANK 3  
CAS Latency - BANK 3  
RAS - BANK 0  
RC - BANK 0  
DON'T CARE  
Notes:  
1) CAS latency = 2, Burst Length = 4  
2) X16: A9 and A11 = "Don't Care"  
X32: A8, A9, and A11 = "Don't Care"  
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ISSI  
READ - FULL-PAGE BURST  
T0  
T1  
T2  
T3  
T4  
T5  
T6  
Tn+1  
Tn+2  
Tn+3  
Tn+4  
t
CK  
t
CL  
tCH  
CLK  
CKE  
t
CKS tCKH  
t
CMS  
t
CMH  
COMMAND  
ACTIVE  
NOP  
READ  
CMS CMH  
NOP  
NOP  
NOP  
NOP  
NOP  
BURST TERM  
NOP  
NOP  
t
t
DQM/DQML  
DQMH/DQM0-3  
t
t
t
AS  
tAH  
COLUMN m(2)  
A0-A9, A11  
A10  
ROW  
AS  
t
AH  
ROW  
AS  
t
AH  
BA0, BA1  
BANK  
BANK  
t
AC  
t
AC  
t
AC  
t
AC  
t
AC  
t
AC  
tHZ  
D
OUT  
m
D
OUT m+  
1
D
OUT m+  
2
D
OUT m-  
1
D
OUT  
m
D
OUT m+  
1
DQ  
t
LZ  
t
OH  
t
OH  
t
OH  
t
OH  
t
OH  
tOH  
t
RCD  
CAS Latency  
1024 (x8) location  
DON'T CARE  
UNDEFINED  
within same row.  
Full page Full-page burst not self-terminating.  
completion Use BURST TERMINATE command.  
Notes:  
1) CAS latency = 2, Burst Length = Full Page  
2) X16: A9 and A11 = "Don't Care"  
X32: A8, A9, and A11 = "Don't Care"  
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39  
PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
READ - DQM OPERATION  
T0  
T1  
T2  
T3  
T4  
T5  
T6  
T7  
T8  
t
CK  
t
CL  
tCH  
CLK  
CKE  
t
CKS tCKH  
t
CMS tCMH  
COMMAND  
ACTIVE  
NOP  
READ  
NOP  
NOP  
NOP  
NOP  
NOP  
NOP  
t
CMS  
t
CMH  
DQM/DQML  
DQMH/DQM0-3  
t
t
t
AS  
tAH  
COLUMN m(2)  
A0-A9, A11  
A10  
ROW  
AS  
t
AH  
ENABLE AUTO PRECHARGE  
ROW  
DISABLE AUTO PRECHARGE  
AS  
t
AH  
BA0, BA1  
BANK  
BANK  
t
OH  
t
OH  
tOH  
t
AC  
tAC  
D
OUT  
m
D
OUT m+  
2
D
OUT m+  
3
DQ  
t
LZ  
tLZ  
t
HZ  
t
AC  
t
HZ  
DON'T CARE  
UNDEFINED  
t
RCD  
CAS Latency  
Notes:  
1) CAS latency = 2, Burst Length = 4  
2) X16: A9 and A11 = "Don't Care"  
X32: A8, A9, and A11 = "Don't Care"  
40  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
READ to PRECHARGE  
T0  
T1  
T2  
T3  
T4  
T5  
T6  
T7  
CLK  
COMMAND  
ADDRESS  
DQ  
t
RP  
PRECHARGE  
READ  
NOP  
NOP  
NOP  
NOP  
NOP  
ACTIVE  
x = 1 cycle  
BANK a,  
COL n  
BANK  
(a or all)  
BANK a,  
ROW  
DOUT  
n
DOUT n+1  
DOUT n+2  
DOUT n+3  
CAS Latency - 2  
DON'T CARE  
T0  
T1  
T2  
T3  
T4  
T5  
T6  
T7  
CLK  
COMMAND  
ADDRESS  
DQ  
t
RP  
PRECHARGE  
READ  
NOP  
NOP  
NOP  
NOP  
x = 2 cycles  
NOP  
ACTIVE  
BANK,  
COL n  
BANK,  
COL b  
BANK a,  
ROW  
DOUT  
n
DOUT n+1  
D
OUT n+2  
DOUT n+3  
CAS Latency - 3  
DON'T CARE  
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41  
PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
WRITES  
An example is shown in WRITE to WRITE diagram. Data n  
+ 1 is either the last of a burst of two or the last desired of  
a longer burst. The 128Mb Low - Power SDRAM uses a  
pipelinedarchitectureandthereforedoesnotrequirethe2n  
rule associated with a prefetch architecture. A WRITE com-  
mand can be initiated on any clock cycle following a  
previous WRITE command. Full-speed random write ac-  
cesses within a page can be performed to the same bank,  
as shown in Random WRITE Cycles, or each subsequent  
WRITE may be performed to a different bank.  
WRITE bursts are initiated with a WRITE command, as  
showninWRITECommanddiagram.  
WRITE COMMAND  
CLK  
HIGH  
CKE  
Data for any WRITE burst may be truncated with a subse-  
quentREADcommand, anddataforafixed-length WRITE  
burst may be immediately followed by a subsequent READ  
command. Once the READ command is registered, the  
data inputs will be ignored, and WRITEs will not be ex-  
ecuted. An example is shown in WRITE to READ. Data n +  
1 is either the last of a burst of two or the last desired of a  
longerburst.  
CS  
RAS  
CAS  
Dataforafixed-lengthWRITEburstmaybefollowed by,or  
truncatedwith,aPRECHARGEcommandtothesamebank  
(providedthatautoprechargewasnotactivated),andafull-  
page WRITE burst may be truncated with a PRECHARGE  
commandtothesamebank.ThePRECHARGEcommand  
should be issued tWR after the clock edge at which the last  
desiredinputdataelementisregistered.Theautoprecharge  
mode requires a tWR of at least one clock plus time,  
regardless of frequency. In addition, when truncating a  
WRITE burst, the DQM signal must be used to mask input  
datafortheclockedgepriorto,andtheclockedgecoincident  
with,thePRECHARGEcommand.Anexampleisshowninthe  
WRITEtoPRECHARGEdiagram.Datan+1iseitherthelast  
ofaburstoftwoorthelastdesiredofalongerburst.Following  
thePRECHARGEcommand,asubsequentcommandtothe  
same bank cannot be issued until tRP is met.  
WE  
(X16)A0-A8  
(X32)A0-A7  
(X8)A0-A9  
COLUMN ADDRESS  
AUTO PRECHARGE  
A10  
NO PRECHARGE  
BANK ADDRESS  
BA0, BA1  
The starting column and bank addresses are provided with  
theWRITEcommand,andautoprechargeiseitherenabled  
ordisabledforthataccess. Ifautoprechargeisenabled, the  
row being accessed is precharged at the completion of the  
burst. For the generic WRITE commands used in the  
following illustrations, auto precharge is disabled.  
In the case of a fixed-length burst being executed to comple-  
tion,aPRECHARGEcommandissuedattheoptimumtime(as  
describedabove)providesthesameoperationthatwouldresult  
from the same fixed-length burst with auto precharge. The  
disadvantageofthePRECHARGEcommandisthatitrequires  
that the command and address buses be available at the  
appropriatetimetoissuethecommand;theadvantageofthe  
PRECHARGE command is that it can be used to truncate  
fixed-length or full-page bursts.  
During WRITE bursts, the first valid data-in element will be  
registeredcoincidentwiththeWRITEcommand. Subsequent  
dataelementswillberegisteredoneachsuccessivepositive  
clockedge.Uponcompletionofafixed-lengthburst,assum-  
ing no other commands have been initiated, the DQs will  
remain High-Z and any additional input data will be ignored  
(see WRITE Burst). A full-page burst will continue until  
terminated. (At the end of the page, it will wrap to column 0  
andcontinue.)  
Fixed-length or full-page WRITE bursts can be truncated  
withtheBURSTTERMINATEcommand.Whentruncating  
a WRITE burst, the input data applied coincident with the  
BURST TERMINATE command will be ignored. The last  
datawritten(providedthatDQMisLOWatthattime)willbe  
the input data applied one clock previous to the BURST  
TERMINATE command. This is shown in WRITE Burst  
Termination, where data n is the last desired data element  
of a longer burst.  
Data for any WRITE burst may be truncated with a subse-  
quent WRITE command, and data for a fixed-length WRITE  
burst may be immediately followed by data for a WRITE  
command. The new WRITE command can be issued on any  
clock following the previous WRITE command, and the data  
providedcoincidentwiththenewcommandappliestothenew  
command.  
42  
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PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
WRITE BURST  
T0  
T1  
T2  
T3  
CLK  
COMMAND  
ADDRESS  
DQ  
WRITE  
NOP  
NOP  
NOP  
BANK,  
COL n  
DIN  
n
DIN n+1  
DON'T CARE  
WRITE TO WRITE  
T0  
T1  
T2  
CLK  
COMMAND  
ADDRESS  
DQ  
WRITE  
NOP  
WRITE  
BANK,  
COL n  
BANK,  
COL b  
DIN  
n
DIN n+1  
DIN b  
DON'T CARE  
RANDOM WRITE CYCLES  
T0  
T1  
T2  
T3  
CLK  
COMMAND  
ADDRESS  
DQ  
WRITE  
WRITE  
WRITE  
WRITE  
BANK,  
COL n  
BANK,  
COL b  
BANK,  
COL m  
BANK,  
COL x  
DIN  
n
DIN  
b
DIN  
m
DIN x  
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PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
WRITE TO READ  
T0  
T1  
T2  
T3  
T4  
T5  
CLK  
COMMAND  
ADDRESS  
DQ  
WRITE  
NOP  
READ  
NOP  
NOP  
NOP  
BANK,  
COL n  
BANK,  
COL b  
DIN  
n
DIN n+1  
D
OUT  
b
DOUT b+1  
Latency = 2  
DON'T CARE  
WRITE TO PRECHARGE (TWR @ TCK 15NS)  
T0  
T1  
T2  
T3  
T4  
T5  
T6  
CLK  
DQM  
tRP  
PRECHARGE  
COMMAND  
ADDRESS  
DQ  
WRITE  
NOP  
NOP  
NOP  
ACTIVE  
NOP  
BANK a,  
COL n  
BANK  
(a or all)  
BANK a,  
ROW  
tWR  
DIN n+1  
DIN n  
DON'T CARE  
44  
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PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
WRITE to PRECHARGE (tWR @ tCK < 15ns)  
T0  
T1  
T2  
T3  
T4  
T5  
T6  
CLK  
DQM  
tRP  
COMMAND  
ADDRESS  
DQ  
WRITE  
NOP  
NOP  
PRECHARGE  
NOP  
NOP  
ACTIVE  
BANK a,  
COL n  
BANK  
(a or all)  
BANK a,  
ROW  
tWR  
DIN  
n
DIN n+1  
DON'T CARE  
WRITE Burst Termination  
T0  
T1  
T2  
CLK  
BURST  
TERMINATE  
NEXT  
COMMAND  
ADDRESS  
DQ  
WRITE  
COMMAND  
BANK,  
COL n  
(ADDRESS)  
DIN  
n
(DATA)  
DON'T CARE  
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45  
PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
WRITE - FULL PAGE BURST  
T0  
T1  
T2  
T3  
T4  
T5  
Tn+1  
Tn+2  
t
CK  
t
CL  
t
CH  
CLK  
CKE  
t
CKS CKH  
t
t
CMS  
t
CMH  
COMMAND  
ACTIVE  
NOP  
WRITE  
NOP  
NOP  
NOP  
NOP  
BURST TERM  
NOP  
t
CMS  
t
CMH  
DQM/DQML  
DQMH/DQM0-3  
t
t
t
AS  
t
AH  
COLUMN m(2)  
A0-A9, A11  
A10  
ROW  
AS  
t
AH  
ROW  
AS  
t
AH  
BA0, BA1  
BANK  
BANK  
t
DS  
t
DH  
t
DS  
t
DH  
t
DS  
t
DH  
t
DS  
t
DH  
t
DS  
t
DH  
t
DS  
t
DH  
DIN  
m
D
IN m+  
1
DIN m+  
2
DIN m+  
3
DIN m-1  
DQ  
t
RCD  
Full page completed  
DON'T CARE  
Notes:  
1) Burst Length = Full Page  
2) X16: A9 and A11 = "Don't Care"  
X32: A8, A9, and A11 = "Don't Care"  
46  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
WRITE - DQM OPERATION  
T0  
T1  
T2  
T3  
T4  
T5  
T6  
T7  
t
CK  
t
CL  
t
CH  
CLK  
CKE  
t
CKS CKH  
t
t
CMS  
t
CMH  
COMMAND  
ACTIVE  
NOP  
WRITE  
NOP  
NOP  
NOP  
NOP  
NOP  
t
CMS  
t
CMH  
DQM/DQML  
DQMH/DQM0-3  
t
t
t
AS  
t
AH  
COLUMN m(2)  
A0-A9, A11  
A10  
ROW  
AS  
t
AH  
ENABLE AUTO PRECHARGE  
ROW  
DISABLE AUTO PRECHARGE  
AS  
t
AH  
BA0, BA1  
BANK  
BANK  
t
DS  
t
DH  
t
DS  
t
DH  
t
DS  
t
DH  
DIN  
m
D
IN m+  
2
DIN m+3  
DQ  
t
RCD  
DON'T CARE  
Notes:  
1) Burst Length = 4  
2) X16: A9 and A11 = "Don't Care"  
X32: A8, A9, and A11 = "Don't Care"  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
47  
PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
ALTERNATING BANK WRITE ACCESS  
T0  
T1  
T2  
T3  
T4  
T5  
T6  
T7  
T8  
T9  
t
CK  
t
CL  
tCH  
CLK  
CKE  
t
CKS tCKH  
t
CMS  
tCMH  
COMMAND  
ACTIVE  
NOP  
WRITE  
NOP  
ACTIVE  
NOP  
WRITE  
NOP  
NOP  
ACTIVE  
t
CMS tCMH  
DQM/DQML  
DQMH/DQM0-3  
t
t
t
AS  
tAH  
COLUMN m(2)  
ROW  
ROW  
COLUMN b(2)  
ROW  
ROW  
A0-A9, A11  
A10  
ROW  
AS  
t
AH  
ENABLE AUTO PRECHARGE  
ENABLE AUTO PRECHARGE  
ROW  
AS  
tAH  
BANK 0  
BANK 1  
BANK 1  
BANK 0  
BA0, BA1  
BANK 0  
t
DS  
t
DH  
t
DS  
t
DH  
t
DS  
t
DH  
t
DS  
t
DH  
t
DS  
t
DH  
t
DS  
t
DH  
t
DS  
tDH  
t
DS  
tDH  
DQ  
DIN  
m
D
IN m+  
1
DIN m+  
2
DIN m+  
3
DIN  
b
D
IN b+  
1
DIN b+  
2
DIN b+3  
t
t
t
t
RCD - BANK 0  
RRD  
t
WR - BANK 0  
t
RP - BANK 0  
t
RCD - BANK 0  
t
RCD - BANK 1  
tWR - BANK 1  
RAS - BANK 0  
RC - BANK 0  
DON'T CARE  
Notes:  
1) Burst Length = 4  
2) X16: A9 and A11 = "Don't Care"  
X32: A8, A9, and A11 = "Don't Care"  
48  
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INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
CLOCK SUSPEND  
Any command or data present on the input pins at the time  
of a suspended internal clock edge is ignored; any data  
presentontheDQpinsremainsdriven;andburstcounters  
are not incremented, as long as the clock is suspended.  
(Seefollowingexamples.)  
Clock suspend mode occurs when a column access/burst  
is in progress and CKE is registered LOW. In the clock  
suspend mode, the internal clock is deactivated, “freezing”  
the synchronous logic.  
For each positive clock edge on which CKE is sampled  
LOW, the next internal positive clock edge is suspended.  
ClocksuspendmodeisexitedbyregisteringCKEHIGH;the  
internal clock and related operation will resume on the  
subsequent positive clock edge.  
Clock Suspend During WRITE Burst  
T0  
T1  
T2  
T3  
T4  
T5  
CLK  
CKE  
INTERNAL  
CLOCK  
COMMAND  
ADDRESS  
DQ  
NOP  
WRITE  
NOP  
NOP  
BANK a,  
COL n  
DIN  
n
DIN n+1  
DIN n+2  
DON'T CARE  
Clock Suspend During READ Burst  
T0  
T1  
T2  
T3  
T4  
T5  
T6  
CLK  
CKE  
INTERNAL  
CLOCK  
COMMAND  
ADDRESS  
DQ  
READ  
NOP  
NOP  
NOP  
NOP  
NOP  
BANK a,  
COL n  
Qn  
Qn+1  
Qn+2  
Qn+3  
DON'T CARE  
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49  
PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
CLOCK SUSPEND MODE  
T0  
T1  
T2  
T3  
T4  
T5  
T6  
T7  
T8  
T9  
t
CK  
t
CL  
t
CH  
CLK  
CKE  
t
CKS  
t
CKH  
t
CKS CKH  
t
t
CMS  
t
CMH  
COMMAND  
READ  
NOP  
NOP  
NOP  
NOP  
NOP  
WRITE  
NOP  
t
CMS  
t
CMH  
DQM/DQML  
DQMH/DQM0-3  
t
AS  
t
AH  
COLUMN n(2)  
A0-A9, A11  
A10  
COLUMN m(2)  
t
AS  
t
AH  
t
AS  
t
AH  
BA0, BA1  
BANK  
BANK  
t
DS  
t
DH  
t
AC  
t
AC  
t
HZ  
DQ  
DOUT  
m
DOUT m+1  
DOUT  
e
DOUT e+1  
t
LZ  
t
OH  
DON'T CARE  
UNDEFINED  
Notes:  
1) CAS latency = 3, Burst Length = 2  
2) X16: A9 and A11 = "Don't Care"  
X32: A8, A9, and A11 = "Don't Care"  
50  
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PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
PRECHARGE  
PRECHARGE Command  
The PRECHARGE command (see figure) is used to deac-  
tivatetheopenrowinaparticularbankortheopenrowinall  
banks. The bank(s) will be available for a subsequent row  
access some specified time (tRP) after the PRECHARGE  
command is issued. Input A10 determines whether one or  
all banks are to be precharged, and in the case where only  
one bank is to be precharged, inputs BA0, BA1 select the  
bank. When all banks are to be precharged, inputs BA0,  
BA1 are treated as “Don’t Care.” Once a bank has been  
precharged,itisintheidlestateandmustbeactivatedprior  
to any READ or WRITE commands being issued to that  
bank.  
CLK  
HIGH  
CKE  
CS  
RAS  
CAS  
WE  
POWER-DOWN  
Power-down occurs if CKE is registered LOW coincident  
with a NOP or COMMAND INHIBIT when no accesses are  
in progress. If power-down occurs when all banks are idle,  
thismodeisreferredtoasprechargepower-down;ifpower-  
down occurs when there is a row active in either bank, this  
modeisreferredtoasactivepower-down.Enteringpower-  
down deactivates the input and output buffers, excluding  
CKE, for maximum power savings while in standby. The  
devicemaynotremaininthepower-downstatelongerthan  
the refresh period (64ms) since no refresh operations are  
performed in this mode.  
A0-A9, A11  
ALL BANKS  
A10  
BANK SELECT  
BANK ADDRESS  
BA0, BA1  
The power-down state is exited by registering a NOP or  
COMMAND INHIBIT and CKE HIGH at the desired clock  
edge (meeting tCKS). See figure below.  
POWER-DOWN  
CLK  
t
CKS  
tCKS  
CKE  
COMMAND  
NOP  
NOP  
ACTIVE  
t
t
t
RCD  
RAS  
RC  
All banks idle  
Input buffers gated off  
Enter power-down mode  
Exit power-down mode  
less than 64ms  
DON'T CARE  
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PRELIMINARY  
INFORMATION Rev. 00A  
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®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
POWER-DOWN MODE CYCLE  
T0  
T1  
T2  
Tn+1  
Tn+2  
t
CK  
t
CL  
t
CH  
CLK  
CKE  
t
CKS  
t
CKH  
t
CKS  
t
CKS  
t
CMS  
t
CMH  
COMMAND  
PRECHARGE  
NOP  
NOP  
NOP  
ACTIVE  
DQM/DQML  
DQMH/DQM0-3  
A0-A9, A11  
A10  
ROW  
ROW  
ALL BANKS  
SINGLE BANK  
t
AS  
t
AH  
BA0, BA1  
DQ  
BANK  
BANK  
High-Z  
Two clock cycles  
Input buffers gated  
All banks idle  
off while in  
Precharge all  
active banks  
All banks idle, enter  
power-down mode  
power-down mode  
DON'T CARE  
Exit power-down mode  
52  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
BURST READ/SINGLE WRITE  
Four cases where CONCURRENT AUTO PRECHARGE  
occurs are defined below.  
The burst read/single write mode is entered by programming  
the write burst mode bit (M9) in the mode register to a logic 1.  
In this mode, all WRITE commands result in the access of a  
single column location (burst of one), regardless of the  
programmed burst length. READ commands access  
columns according to the programmed burst length and  
sequence, just as in the normal mode of operation (M9 = 0).  
READ with Auto Precharge  
1. Interrupted by a READ (with or without auto precharge):  
AREADtobankmwillinterruptaREADonbankn, CAS  
latency later. The PRECHARGE to bank n will begin  
when the READ to bank m is registered.  
CONCURRENT AUTO PRECHARGE  
2.InterruptedbyaWRITE(withorwithoutautoprecharge):  
AWRITEtobankmwillinterruptaREADonbanknwhen  
registered. DQM should be used two clocks prior to the  
WRITE command to prevent bus contention. The  
PRECHARGE to bank n will begin when the WRITE to  
bank m is registered.  
An access command (READ or WRITE) to another bank  
while an access command with auto precharge enabled is  
executing is not allowed by SDRAMs, unless the SDRAM  
supports CONCURRENT AUTO PRECHARGE. ISSI  
SDRAMs support CONCURRENT AUTO PRECHARGE.  
READ With Auto Precharge interrupted by a READ  
T0  
T1  
T2  
T3  
T4  
T5  
T6  
T7  
CLK  
READ - AP  
BANK n  
READ - AP  
BANK m  
NOP  
NOP  
NOP  
NOP  
NOP  
NOP  
Idle  
COMMAND  
BANK n  
Page Active  
READ with Burst of 4  
Page Active  
Interrupt Burst, Precharge  
tRP - BANK n  
tRP - BANK m  
Internal States  
BANK m  
READ with Burst of 4  
Precharge  
BANK n,  
COL a  
BANK n,  
COL b  
ADDRESS  
DQ  
DOUT  
a
DOUT a+1  
DOUT  
b
DOUT b+1  
CAS Latency - 3 (BANK n)  
DON'T CARE  
CAS Latency - 3 (BANK m)  
READ With Auto Precharge interrupted by a WRITE  
T0  
T1  
T2  
T3  
T4  
T5  
T6  
T7  
CLK  
READ - AP  
BANK n  
WRITE - AP  
BANK m  
COMMAND  
NOP  
NOP  
NOP  
NOP  
NOP  
NOP  
Idle  
BANK n  
READ with Burst of 4  
Page Active  
Interrupt Burst, Precharge  
Page Active  
t
RP - BANK n  
tWR - BANK m  
Internal States  
BANK m  
WRITE with Burst of 4  
Write-Back  
BANK n,  
COL a  
BANK m,  
COL b  
ADDRESS  
DQM  
DQ  
DOUT  
a
DIN  
b
DIN b+1  
DIN b+2  
DIN b+3  
CAS Latency - 3 (BANK n)  
DON'T CARE  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
53  
PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
WRITE with Auto Precharge  
4.InterruptedbyaWRITE(withorwithoutautoprecharge):  
WRITE to bank m will interrupt aWRITE on banknwhen  
3. Interrupted by a READ (with or without auto precharge):  
AREADtobankmwillinterruptaWRITEonbanknwhen  
registered,withthedata-outappearing(CASlatency) later.  
The PRECHARGE to bank n will begin after tWR is met,  
wheretWR beginswhentheREADtobankmisregistered.  
ThelastvalidWRITEtobanknwillbedata-inregisteredone  
clock prior to the READ to bank m.  
A
registered.ThePRECHARGEtobanknwillbeginaftertWR  
is met, where tWR begins when the WRITE to bank m is  
registered.ThelastvaliddataWRITEtobanknwillbedata  
registered one clock prior to a WRITE to bank m.  
WRITE With Auto Precharge interrupted by a READ  
T0  
T1  
T2  
T3  
T4  
T5  
T6  
T7  
CLK  
COMMAND  
BANK n  
WRITE - AP  
BANK n  
READ - AP  
BANK m  
NOP  
NOP  
NOP  
NOP  
NOP  
NOP  
Page Active  
WRITE with Burst of 4 Interrupt Burst, Write-Back  
WR - BANK n  
Precharge  
t
tRP - BANK n  
Internal States  
t
RP - BANK m  
BANK m  
Page Active  
READ with Burst of 4  
Precharge  
BANK n,  
COL a  
BANK m,  
COL b  
ADDRESS  
DQ  
DIN  
a
DIN a+1  
DOUT  
b
DOUT b+1  
CAS Latency - 3 (BANK m)  
DON'T CARE  
WRITE With Auto Precharge interrupted by a WRITE  
T0  
T1  
T2  
T3  
T4  
T5  
T6  
T7  
CLK  
COMMAND  
BANK n  
WRITE - AP  
BANK n  
WRITE - AP  
BANK m  
NOP  
NOP  
NOP  
NOP  
NOP  
NOP  
Page Active  
WRITE with Burst of 4  
Interrupt Burst, Write-Back  
WR - BANK n  
Precharge  
t
t
RP- BANKtWn R - BANK m  
Write - Back  
Internal States  
BANK m  
Page Active  
WRITE with Burst of 4  
BANK n,  
COL a  
BANK m,  
COL b  
ADDRESS  
DQ  
DIN  
a
DIN a+1  
DIN a+2  
D
IN  
b
DIN b+1  
DIN b+2  
DIN b+3  
DON'T CARE  
54  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
SINGLE READ WITH AUTO PRECHARGE  
T0  
T1  
T2  
T3  
T4  
T5  
T6  
T7  
T8  
t
CK  
t
CL  
tCH  
CLK  
CKE  
t
CKS tCKH  
t
CMS  
tCMH  
COMMAND  
ACTIVE  
NOP  
NOP  
NOP  
READ  
NOP  
NOP  
ACTIVE  
NOP  
t
CMS  
t
CMH  
DQM/DQML  
DQMH/DQM0-3  
t
t
t
AS  
tAH  
COLUMN m(2)  
A0-A9, A11  
A10  
ROW  
ROW  
ROW  
BANK  
AS  
t
AH  
ENABLE AUTO PRECHARGE  
ROW  
AS  
t
AH  
BA0, BA1  
BANK  
BANK  
t
OH  
t
AC  
DOUT m  
DQ  
t
HZ  
DON'T CARE  
UNDEFINED  
t
t
t
RCD  
RAS  
RC  
CAS Latency  
t
RP  
Notes:  
1) CAS latency = 2, Burst Length = 1  
2) X16: A9 and A11 = "Don't Care"  
X32: A8, A9, and A11 = "Don't Care"  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
55  
PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
READ WITH AUTO PRECHARGE  
T0  
T1  
T2  
T3  
T4  
T5  
T6  
T7  
T8  
t
CK  
t
CL  
tCH  
CLK  
CKE  
t
CKS tCKH  
t
CMS tCMH  
COMMAND  
ACTIVE  
NOP  
READ  
NOP  
NOP  
NOP  
NOP  
NOP  
ACTIVE  
t
CMS  
t
CMH  
DQM/DQML  
DQMH/DQM0-3  
t
t
t
AS  
tAH  
COLUMN m(2)  
A0-A9, A11  
A10  
ROW  
ROW  
ROW  
BANK  
AS  
t
AH  
ENABLE AUTO PRECHARGE  
ROW  
AS  
t
AH  
BA0, BA1  
DQ  
BANK  
BANK  
t
AC  
t
AC  
t
AC  
t
AC  
tHZ  
DOUT  
m
D
OUT m+1  
D
OUT m+2  
D
OUT m+3  
t
LZ  
t
OH  
t
OH  
t
OH  
tOH  
t
t
t
RCD  
RAS  
RC  
CAS Latency  
DON'T CARE  
UNDEFINED  
t
RP  
Notes:  
1) CAS latency = 2, Burst Length = 4  
2) X16: A9 and A11 = "Don't Care"  
X32: A8, A9, and A11 = "Don't Care"  
56  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
SINGLE READ WITHOUT AUTO PRECHARGE  
T0  
T1  
T2  
T3  
T4  
T5  
T6  
T7  
T8  
t
CK  
t
CL  
t
CH  
CLK  
CKE  
t
CKS CKH  
t
t
CMS  
t
CMH  
COMMAND  
ACTIVE  
NOP  
READ  
NOP  
NOP  
PRECHARGE  
NOP  
ACTIVE  
NOP  
t
CMS  
t
CMH  
DQM/DQML  
DQMH/DQM0-3  
t
t
t
AS  
t
AH  
COLUMN m(2)  
A0-A9, A11  
A10  
ROW  
ROW  
ROW  
BANK  
AS  
t
AH  
ALL BANKS  
ROW  
SINGLE BANK  
BANK  
AS  
t
AH  
DISABLE AUTO PRECHARGE  
BA0, BA1  
DQ  
BANK  
BANK  
t
OH  
t
AC  
D
OUT  
m
t
LZ  
t
HZ  
DON'T CARE  
UNDEFINED  
t
t
t
RCD  
RAS  
RC  
CAS Latency  
t
RP  
Notes:  
1) CAS latency = 2, Burst Length = 1  
2) X16: A9 and A11 = "Don't Care"  
X32: A8, A9, and A11 = "Don't Care"  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
57  
PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
READ WITHOUT AUTO PRECHARGE  
T0  
T1  
T2  
T3  
T4  
T5  
T6  
T7  
T8  
t
CK  
t
CL  
tCH  
CLK  
CKE  
t
CKS tCKH  
t
CMS tCMH  
COMMAND  
ACTIVE  
NOP  
READ  
NOP  
NOP  
NOP  
PRECHARGE  
NOP  
ACTIVE  
t
CMS  
t
CMH  
DQM/DQML  
DQMH/DQM0-3  
t
t
t
AS  
tAH  
COLUMN m(2)  
A0-A9, A11  
A10  
ROW  
ROW  
ROW  
BANK  
AS  
t
AH  
ALL BANKS  
ROW  
AS  
t
AH  
DISABLE AUTO PRECHARGE  
SINGLE BANK  
BANK  
BA0, BA1  
DQ  
BANK  
BANK  
t
AC  
t
AC  
t
AC  
t
AC  
tHZ  
DOUT  
m
D
OUT m+1  
DOUT m+2  
D
OUT m+3  
t
LZ  
t
OH  
t
OH  
t
OH  
tOH  
tRCD  
tRAS  
t
RC  
CAS Latency  
DON'T CARE  
UNDEFINED  
t
RP  
Notes:  
1) CAS latency = 2, Burst Length = 4  
2) X16: A9 and A11 = "Don't Care"  
X32: A8, A9, and A11 = "Don't Care"  
58  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
SINGLE WRITE - WITHOUT AUTO PRECHARGE  
T0  
T1  
T2  
T3  
T4  
T5  
T6  
T7  
T8  
t
CK  
t
CL  
tCH  
CLK  
CKE  
t
CKS tCKH  
t
CMS  
tCMH  
COMMAND  
ACTIVE  
NOP  
WRITE  
NOP  
NOP  
PRECHARGE  
NOP  
ACTIVE  
NOP  
t
CMS tCMH  
DQM/DQML  
DQMH/DQM0-3  
t
t
t
AS  
tAH  
COLUMN m(2)  
A0-A9, A11  
A10  
ROW  
ROW  
ROW  
BANK  
AS  
t
AH  
ALL BANKS  
ROW  
SINGLE BANK  
AS  
t
AH  
DISABLE AUTO PRECHARGE  
BANK  
BA0, BA1  
BANK  
BANK  
t
DS  
t
DH  
DQ  
DIN  
m
t
t
t
RCD  
RAS  
RC  
tRP  
DON'T CARE  
t
WR  
Notes:  
1) Burst Length = 1  
2) X16: A9 and A11 = "Don't Care"  
X32: A8, A9, and A11 = "Don't Care"  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
59  
PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
WRITE - WITHOUT AUTO PRECHARGE  
T9  
T0  
T1  
T2  
T3  
T4  
T5  
T6  
T7  
T8  
t
CK  
t
CL  
tCH  
CLK  
CKE  
t
CKS tCKH  
t
CMS tCMH  
COMMAND  
ACTIVE  
ACTIVE  
NOP  
WRITE  
NOP  
NOP  
NOP  
NOP  
PRECHARGE  
NOP  
t
CMS tCMH  
DQM/DQML  
DQMH/DQM0-3  
t
t
t
AS  
tAH  
COLUMN m(2)  
A0-A9, A11  
A10  
ROW  
ROW  
ROW  
BANK  
AS  
t
AH  
ALL BANKS  
ROW  
AS  
t
AH  
SINGLE BANK  
BANK  
DISABLE AUTO PRECHARGE  
BANK  
BA0, BA1  
BANK  
t
DS  
t
DH  
t
DS  
t
DH  
t
DS  
tDH  
t
DS  
tDH  
DQ  
DIN  
m
DIN m+  
1
DIN m+  
2
DIN m+3  
t
t
t
RCD  
RAS  
RC  
t
WR  
tRP  
DON'T CARE  
Notes:  
1) Burst Length = 4  
2) X16: A9 and A11 = "Don't Care"  
X32: A8, A9, and A11 = "Don't Care"  
60  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
SINGLE WRITE - WITH AUTO PRECHARGE  
T0  
T1  
T2  
T3  
T4  
T5  
T6  
T7  
T8  
t
CK  
t
CL  
tCH  
CLK  
CKE  
t
CKS tCKH  
t
CMS  
tCMH  
COMMAND  
ACTIVE  
NOP  
WRITE  
NOP  
NOP  
PRECHARGE  
NOP  
ACTIVE  
NOP  
t
CMS tCMH  
DQM/DQML  
DQMH/DQM0-3  
t
t
t
AS  
tAH  
COLUMN m(2)  
A0-A9, A11  
A10  
ROW  
ROW  
ROW  
BANK  
AS  
t
AH  
ALL BANKS  
ROW  
SINGLE BANK  
AS  
t
AH  
DISABLE AUTO PRECHARGE  
BANK  
BA0, BA1  
BANK  
BANK  
t
DS  
t
DH  
DQ  
DIN  
m
t
t
t
RCD  
RAS  
RC  
tRP  
DON'T CARE  
t
WR  
Notes:  
1) Burst Length = 1  
2) X16: A9 and A11 = "Don't Care"  
X32: A8, A9, and A11 = "Don't Care"  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
61  
PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
WRITE - WITH AUTO PRECHARGE  
T0  
T1  
T2  
T3  
T4  
T5  
T6  
T7  
T8  
T9  
t
CK  
t
CL  
tCH  
CLK  
CKE  
t
CKS tCKH  
t
CMS  
tCMH  
COMMAND  
ACTIVE  
NOP  
WRITE  
NOP  
NOP  
NOP  
NOP  
NOP  
NOP  
ACTIVE  
t
CMS tCMH  
DQM/  
DQML, DQMH  
t
t
t
AS  
tAH  
COLUMN m(2)  
ROW  
ROW  
BANK  
A0-A9, A11  
A10  
ROW  
AS  
t
AH  
ENABLE AUTO PRECHARGE  
ROW  
AS  
t
AH  
BA0, BA1  
BANK  
BANK  
t
DS  
t
DH  
t
DS  
t
DH  
t
DS  
tDH  
t
DS  
tDH  
DQ  
DIN  
m
DIN m+1  
DIN m+2  
DIN m+3  
t
t
t
RCD  
RAS  
RC  
t
WR  
tRP  
DON'T CARE  
Notes:  
1) Burst Length = 4  
2) X16: A9 and A11 = "Don't Care"  
X32: A8, A9, and A11 = "Don't Care"  
62  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
ORDERING INFORMATION - VDD = 2.5V  
Commercial Range: 0°C to 70°C  
Frequency Speed (ns) Order Part No.  
Package  
133MHz  
100MHz  
7
IS42LS81600AL-7T  
IS42LS81600AL-10T  
54-PinTSOPII  
54-PinTSOPII  
10  
Frequency Speed (ns) Order Part No.Package  
133MHz  
7
IS42LS16800AL-7B  
IS42LS16800AL-7T  
54-PinBGA  
54-PinTSOPII  
100MHz  
10  
IS42LS16800AL-10B  
IS42LS16800AL-10T  
54-PinBGA  
54-PinTSOPII  
Frequency Speed (ns) Order Part No.Package  
133MHz  
7
IS42LS32400AL-7B  
IS42LS32400AL-7T  
90-Pin BGA  
86-PinTSOPII  
100MHz  
10  
IS42LS32400AL-10B 90-Pin BGA  
IS42LS32400AL-10T 86-Pin TSOPII  
ORDERING INFORMATION - VDD = 2.5V  
Industrial Range: -40°C to 85°C  
Frequency Speed (ns) Order Part No.  
Package  
54-Pin TSOPII  
IS42LS81600AL-10TI 54-Pin TSOPII  
133MHz  
100MHz  
7
IS42LS81600AL-7TI  
10  
Frequency  
Speed(ns) Order Part No.  
Package  
133MHz  
7
IS42LS16800AL-7BI  
IS42LS16800AL-7TI  
54-Pin BGA  
54-Pin TSOPII  
100MHz  
10  
IS42LS16800AL-10BI 54-Pin BGA  
IS42LS16800AL-10TI 54-Pin TSOPII  
Frequency  
Speed(ns) Order Part No.  
Package  
133MHz  
7
IS42LS32400AL-7BI  
IS42LS32400AL-7TI  
90-Pin BGA  
86-Pin TSOPII  
100MHz  
10  
IS42LS32400AL-10BI 90-Pin BGA  
IS42LS32400AL-10TI 86-Pin TSOPII  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
63  
PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
ORDERING INFORMATION - VDD = 2.5V  
Commercial Range: 0°C to 70°C  
Frequency Speed (ns) Order Part No.  
Package  
133MHz  
100MHz  
7
IS42LS81600AL-7TL  
54-Pin TSOPII, Lead-free  
10  
IS42LS81600AL-10TL 54-Pin TSOPII, Lead-free  
Frequency Speed (ns) Order Part No.  
Package  
133MHz  
7
IS42LS16800AL-7BL  
IS42LS16800AL-7TL  
54-Pin BGA, Lead-free  
54-Pin TSOPII, Lead-free  
100MHz  
10  
IS42LS16800AL-10BL  
IS42LS16800AL-10TL  
54-Pin BGA, Lead-free  
54-Pin TSOPII, Lead-free  
Frequency Speed (ns) Order Part No.  
Package  
133MHz  
7
IS42LS32400AL-7BL  
IS42LS32400AL-7TL  
90-Pin BGA, Lead-free  
86-Pin TSOPII, Lead-free  
100MHz  
10  
IS42LS32400AL-10BL  
IS42LS32400AL-10TL  
90-Pin BGA, Lead-free  
86-Pin TSOPII, Lead-free  
ORDERING INFORMATION - VDD = 2.5V  
Industrial Range: -40°C to 85°C  
Frequency Speed (ns) Order Part No.  
Package  
54-Pin TSOPII, Lead-free  
IS42LS81600AL-10TLI 54-Pin TSOPII, Lead-free  
133MHz  
100MHz  
7
IS42LS81600AL-7TLI  
10  
Frequency Speed (ns) Order Part No.  
Package  
133MHz  
7
IS42LS16800AL-7BLI  
IS42LS16800AL-7TLI  
54-Pin BGA, Lead-free  
54-Pin TSOPII, Lead-free  
100MHz  
10  
IS42LS16800AL-10BLI 54-PinBGA,Lead-free  
IS42LS16800AL-10TLI 54-Pin TSOPII, Lead-free  
Frequency Speed (ns) Order Part No.  
Package  
133MHz  
7
IS42LS32400AL-7BLI  
IS42LS32400AL-7TLI  
90-Pin BGA, Lead-free  
86-Pin TSOPII, Lead-free  
100MHz  
10  
IS42LS32400AL-10BLI 90-PinBGA,Lead-free  
IS42LS32400AL-10TLI 86-PinTSOPII, Lead-free  
64  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
ORDERING INFORMATION - VDD = 3.3V  
Commercial Range: 0°C to 70°C  
Frequency Speed (ns) Order Part No.  
Package  
133MHz  
100MHz  
7
IS42S81600AL-7T  
IS42S81600AL-10T  
54-Pin TSOPII  
54-Pin TSOPII  
10  
Frequency  
Speed(ns) Order Part No.  
Package  
133MHz  
7
IS42S16800AL-7B  
IS42S16800AL-7T  
54-Pin BGA  
54-Pin TSOPII  
100MHz  
10  
IS42S16800AL-10B  
IS42S16800AL-10T  
54-Pin BGA  
54-Pin TSOPII  
Frequency  
Speed(ns) Order Part No.  
Package  
133MHz  
7
IS42S32400AL-7B  
IS42S32400AL-7T  
90-Pin BGA  
86-Pin TSOPII  
100MHz  
10  
IS42S32400AL-10B  
IS42S32400AL-10T  
90-Pin BGA  
86-Pin TSOPII  
ORDERING INFORMATION - VDD = 3.3V  
Industrial Range: -40°C to 85°C  
Frequency Speed (ns) Order Part No.  
Package  
54-Pin TSOPII  
IS42S81600AL-10TI 54-Pin TSOPII  
133MHz  
100MHz  
7
IS42S81600AL-7TI  
10  
Frequency  
Speed(ns) Order Part No.  
Package  
133MHz  
7
IS42S16800AL-7BI  
IS42S16800AL-7TI  
54-Pin BGA  
54-Pin TSOPII  
100MHz  
10  
IS42S16800AL-10BI 54-Pin BGA  
IS42S16800AL-10TI 54-Pin TSOPII  
Frequency  
Speed(ns) Order Part No.  
Package  
133MHz  
7
IS42S32400AL-7BI  
IS42S32400AL-7TI  
90-PinBGA  
86-Pin TSOPII  
100MHz  
10  
IS42S32400AL-10BI 90-PinBGA  
IS42S32400AL-10TI 86-Pin TSOPII  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
65  
PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  
®
IS42S81600AL, IS42S16800AL, IS42S32400AL  
IS42LS81600AL, IS42LS16800AL, IS42LS32400AL  
ISSI  
ORDERING INFORMATION - VDD = 3.3V  
Commercial Range: 0°C to 70°C  
Frequency Speed (ns) Order Part No.  
Package  
133MHz  
100MHz  
7
IS42S81600AL-7TL  
54-Pin TSOPII, Lead-free  
10  
IS42S81600AL-10TL 54-Pin TSOPII, Lead-free  
Frequency Speed (ns) Order Part No.  
Package  
133MHz  
7
IS42S16800AL-7BL  
IS42S16800AL-7TL  
54-Pin BGA, Lead-free  
54-Pin TSOPII, Lead-free  
100MHz  
10  
IS42S16800AL-10BL 54-Pin BGA, Lead-free  
IS42S16800AL-10TL 54-Pin TSOPII  
Frequency Speed (ns) Order Part No.  
Package  
133MHz  
7
IS42S32400AL-7BL  
IS42S32400AL-7TL  
90-Pin BGA, Lead-free  
86-Pin TSOPII, Lead-free  
100MHz  
10  
IS42S32400AL-10BL 90-Pin BGA, Lead-free  
IS42S32400AL-10TL 86-Pin TSOPII, Lead-free  
ORDERING INFORMATION - VDD = 3.3V  
Industrial Range: -40°C to 85°C  
Frequency Speed (ns) Order Part No.  
Package  
133MHz  
100MHz  
7
IS42S81600AL-7TLI 54-Pin TSOPII, Lead-free  
IS42S81600AL-10TLI 54-Pin TSOPII, Lead-free  
10  
Frequency Speed (ns) Order Part No.  
Package  
133MHz  
7
IS42S16800AL-7BLI 54-PinBGA, Lead-free  
IS42S16800AL-7TLI 54-Pin TSOPII , Lead-free  
100MHz  
10  
IS42S16800AL-10BLI 54-Pin BGA, Lead-free  
IS42S16800AL-10TLI 54-Pin TSOPII, Lead-free  
Frequency Speed (ns) Order Part No.  
Package  
133MHz  
7
IS42S32400AL-7BLI 90-PinBGA, Lead-free  
IS42S32400AL-7TLI 86-Pin TSOPII, Lead-free  
100MHz  
10  
IS42S32400AL-10BLI 90-Pin BGA, Lead-free  
IS42S32400AL-10TLI 86-Pin TSOPII, Lead-free  
66  
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774  
PRELIMINARY  
INFORMATION Rev. 00A  
09/18/03  

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