CPC5001G [IXYS]
Dual, One Channel Each Direction Digital Optical Isolator; 双通道，一个通道的每个方向的数字隔离器
| 型号： | CPC5001G |
| 厂家： | 
IXYS CORPORATION |
| 描述： | Dual, One Channel Each Direction Digital Optical Isolator |
| 文件： | 总9页 (文件大小：203K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CPC5001
Dual, One Channel Each Direction
Digital Optical Isolator
INTEGRATED
C
IRCUITS
D
IVISION
Features
Description
• Isolates One Signal in Each Direction
• Operates From 2.7V to 5.5V
• Buffered Inputs - No External LED Drive Required
• Voltage Level Translation
The CPC5001 is a dual, non-inverting digital optical
isolator with buffered-logic inputs and open-drain
outputs. Channel 1 propagates a signal from Side A to
Side B, while Channel 2 sends a signal from Side B to
• Hysteresis at Inputs for Noise Rejection
• Slew-Limited Drivers Reduce EMI
• Power-Down to Hi-Z Does Not Load Outputs
• 5Mbaud Data Rate
Side A. It provides galvanic isolation up to 3750V
When the two sides are powered by supplies with
different voltages, it also functions as a logic level
translator for supply voltages as low as 2.7V or as high
as 5.5V. Available in 8-pin DIP and surface mount
packages, it functionally replaces two logic buffers and
two single-channel optoisolators. Internal bandgap
references regulate the LED drive currents to 3mA to
reduce peak power requirements.
.
rms
• 8-Pin DIP or Surface Mount Packages
Applications
• Isolated Signal Monitoring and Control
• Power-Over-Ethernet
• Power Supply High-Side Interface
• Logic-Level Translation
Unlike transformer or capacitive isolators, optical
isolation passes DC signals, and does not need to be
clocked periodically to refresh state. Buffered signals
will always return to their proper value after a transient
interruption at either side.
• Microprocessor System Interface
2
• Inter-Integrated Circuit (I C) Interface
• Serial Peripheral Interface (SPI)
• Full Duplex Communication
• Isolated Line Receiver
• Isolated Data Acquisition Systems
Ordering Information
Approvals
• UL Recognized Component: File E76270
• CSA: Pending
Part
Description
CPC5001G
8-Pin DIP in Tubes (50 / Tube)
8-Pin Surface Mount (50 / Tube)
CPC5001GS
• EN/IEC 60950: Pending
CPC5001GSTR 8-Pin Surface Mount (1000 / Reel)
Pb
e3
Figure 1. CPC5001 Functional Block Diagram
VDDB
CHANNEL 1
VDDA
VDDB
1
8
IN1
VDDB
GNDB
LED
2
3
4
7
OUT1
GNDA
OUT2
B
VDDA
A
CHANNEL 2
VDDB
6
5
GNDB
IN2
B
VDDA
LED
VDDA
A
GNDA
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1
CPC5001
INTEGRATED
C
IRCUITS
D
IVISION
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Package Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.4 ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.5 Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.6 General Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.7 Electrical Parametric Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.8 Timing Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.9 Common Mode Rejection Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2. Switching Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3. Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5.3 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5.5 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2
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CPC5001
INTEGRATED
C
IRCUITS
D
IVISION
1.2 Pin Description
1 Specifications
Pin#
Name
Description
Input, Channel 1
1.1 Package Pinout
1
2
3
4
5
6
7
8
IN1
GNDA
OUT2
VDDA
Supply Return - Side A
Output, Channel 2
1
2
3
4
8
7
6
5
Supply Voltage - Side A
Input, Channel 2
IN2
GNDB
OUT1
VDDB
Supply Return - Side B
Output, Channel 1
Supply Voltage - Side B
1.3 Absolute Maximum Ratings
Electrical Absolute Maximum Ratings are at 25°C. Voltages with respect to local ground: GNDA or GNDB.
Parameter
Symbol
VDDA
VDDB
VIOx
Min
Max
Units
Supply Voltage, Side A
Supply Voltage, Side B
Input Voltage
-0.5
-0.5
+6.5
+6.5
V
V
VDDx + 0.3
-0.3
-
V
Total Package Power Dissipation 1
Isolation Voltage, Input to Output
60 Seconds
800
mW
PTOT
-
3750
4500
-40
-
-
Vrms
2 Seconds
TA
Operating Temperature
+85
°C
Operating Relative Humidity
(Non-condensing)
RH
%
5
85
TSTG
Storage Temperature
-50
+125
°C
1
Derate total power by 7.5mW/°C above 25°C.
Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device.
Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not
implied.
1.4 ESD Rating
ESD Rating (Human Body Model)
4000V
1.5 Thermal Characteristics
Parameter
Conditions
Symbol
Min
Typ
Max
Units
RJA
Thermal Resistance, Junction to Ambient
Free Air
-
114
-
°C/W
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CPC5001
INTEGRATED
C
IRCUITS
D
IVISION
1.6 General Conditions
Unless otherwise specified, minimum and maximum values are guaranteed by production testing requirements.
Typical values are characteristic of the device at 25°C, and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of the manufacturing testing requirements. Specifications
cover the operating temperature range T = -40°C to +85°C, unless otherwise specified.
A
Side A is the same as Side B, and Channel 1 is the same as Channel 2; therefore, the electrical and timing
specifications apply to both Sides/Channels.
1.7 Electrical Parametric Specifications
Parameter
Conditions
Symbol
VDD
Min
Typ
Max
Units
V
Electrical
Supply Voltage
ISINK=6mA
2.7
-
5.5
-
Supply Current
VDD=3.3V, ISINK=0mA
ISINK=6mA
-
-
-
4.3
4.4
5
IDD
-
mA
VDD=5.5V, ISINK=0mA, TA=25°C
IN1=OUT2=VDDA, IN2=OUT1=VDDB
7.5
Leakage Current
ILEAK
VIL
A
V
-
0.01
10
Falling Input Low Threshold
Rising Input High Threshold
Hysteresis
2.7V < VDD < 5.5V
2.7V < VDD < 5.5V
0.3VDD
0.42VDD
-
VIH
0.57VDD
0.15VDD
0.7VDD
-
2.7V < VDD < 5.5V
VDD=2.7V, ISINK=3mA
VHYST
V
-
-
-
-
-
-
0.35
0.7
-
Output Drive
0.21
0.42
0.38
+1.2
VDD=2.7V, ISINK=6mA
VOL
TC
V
VDD=3.3V, ISINK=6mA
2.7V < VDD < 5.5V, ISINK=6mA
Output Temperature Coefficient
-
mV/°C
1.8 Timing Specifications
Parameter
Conditions
Symbol
Min
Typ
Max
Units
MHz
ns
Timing
Clock Frequency
ISINK=6mA, CLOAD=20pF
VDDA=VDDB=3.3V,
fMAX
-
5
-
Propagation Delay (see Note 1)
High to Low
R
PUA=475, RPUB=475
IN_A=CIN_B=20pF
VIN=0.5VDD_IN to VOUT=0.5VDD_OUT
tPHL
tPLH
40
40
60
135
75
100
250
170
C
Low to High
tPLH - tPHL
Pulse Width Distortion
PWD
-25
ns
Note 1: See “Switching Waveforms” on page 5.
1.9 Common Mode Rejection Specifications
Parameter
Common Mode Rejection
Common Mode Transient Immunity
VOUT = High
Conditions
Symbol
Min
Typ
Max
Units
VCM=20VP-P , VDD=3.3V, TA=25°C
VOUT>2V
CMH
CML
5
7
-
-
-
-
kV/s
VOUT = Low
VOUT<0.8V
4
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CPC5001
INTEGRATED
C
IRCUITS
D
IVISION
2 Switching Waveforms
VOUT
4.0
3.0
2.0
1.0
tPLH
0.5 • VDD = 1.65V
0
0
0.275
0.55
0.825
1.1
VIN
TIME (μs)
4.0
tPHL
3.0
2.0
1.0
0
0.5 • VDD = 1.65V
0
0.275
0.55
0.825
1.1
TIME (μs)
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CPC5001
INTEGRATED
C
IRCUITS
D
IVISION
3 Performance Characteristics
Typical Output Voltage, VOLA , VOLB
Supply Current IDDA, IDDB
vs.Temperature
VIL Falling, VIH Rising
vs. Supply Voltage
vs. Supply Voltage
(ISINKA=6mA)
0.70
0.65
0.60
0.55
0.50
0.45
0.40
0.35
0.30
0.55
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
0.50
VIH
VDD=2.7V
VDD=3.3V
0.45
VDD=5.5V
0.40
0.35
0.30
0.25
VIL
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
-40
-20
0
20
40
60
80
100
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Supply Voltage (V)
Temperature (ºC)
Supply Voltage (V)
Logic-Low Output Level VOL
vs. Supply Voltage
(ISINK=6mA)
Supply Current IDDA, IDDB
vs.Temperature
(VDD=5.5V, RPU=820Ω)
Propagation Delay A to B and B to A
(VDD=3.3V, CL=20pF, RPU=475Ω)
0.60
0.55
0.50
0.45
0.40
0.35
0.30
0.25
0.20
160
140
120
100
80
5.5
5.4
5.3
5.2
5.1
5.0
4.9
4.8
4.7
4.6
4.5
tPLH
tPHL
60
40
-40
-20
0
20
40
60
80
100
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Supply Voltage (V)
Temperature (ºC)
4 Functional Description
4.1 Introduction
The CPC5001 combines the functions of two input
buffer/LED driver gates and two unidirectional logic
optoisolators in a single 8-pin package. The isolators
are arranged for one input and one output at each side
of the isolation barrier, which enables Channel 1 to
send signals from side A to Side B, and Channel 2 to
send signals from the Side B to the Side A. If different
supply voltage levels are used at each side, then the
part, in conjunction with its external pullup resistors,
drive current levels over the allowed range of V
DD
voltages. The supply currents at I
and I
are
DDA
DDB
much smaller than those required by bipolar solutions,
and are stable over temperature. The circuits also
ensure that the I current into each V package pin
DD
DD
remains constant for both high and low input signals.
This can greatly reduce the size of external decoupling
capacitors when compared with optoisolators
fabricated in a bipolar process wherein the supply
current can double when the LED is on.
will perform logic level translation for V between
DD
2.7V and 5.5V at either side.
The rotationally symmetric pinout ensures that the
part operates normally even if installed with 180°
rotation.
The part provides galvanic isolation for voltages up to
3750V . Its CMOS circuitry includes a bandgap
rms
reference to ensure that the LEDs receive consistent
6
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CPC5001
INTEGRATED
C
IRCUITS
D
IVISION
5 Manufacturing Information
5.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC5001G / CPC5001GS
MSL 1
5.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
5.3 Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
Device
Maximum Temperature x Time
CPC5001G / CPC5001GS
250°C for 30 seconds
5.4 Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an
optical waveguide in many of its optically isolated products, the use of a short drying bake may be necessary if a wash
is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb
e3
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CPC5001
INTEGRATED
C
IRCUITS
D
IVISION
5.5 Mechanical Dimensions
5.5.1 CPC5001G Package
9.652 0.381
(0.380 0.015)
PCB Hole Pattern
7.620 0.254
(0.300 0.010)
2.540 0.127
(0.100 0.005)
8-0.800 DIA.
2.540 0.127
(8-0.031 DIA.)
(0.100 0.005)
9.144 0.508
(0.360 0.020)
6.350 0.127
(0.250 0.005)
6.350 0.127
(0.250 0.005)
3.302 0.051
(0.130 0.002)
Pin 1
0.457 0.076
(0.018 0.003)
7.620 0.127
(0.300 0.005)
7.239 TYP.
(0.285)
7.620 0.127
(0.300 0.005)
4.064 TYP
(0.160)
0.254 0.0127
(0.010 0.0005)
Dimensions
0.813 0.102
mm
(0.032 0.004)
(inches)
5.5.2 CPC5001GS Package
9.652 0.381
(0.380 0.015)
PCB Land Pattern
0.635 0.127
(0.025 0.005)
2.540 0.127
3.302 0.051
2.54
(0.100 0.005)
(0.10)
(0.130 0.002)
9.525 0.254
(0.375 0.010)
6.350 0.127
(0.250 0.005)
8.90
(0.3503)
1.65
(0.0649)
7.620 0.254
(0.300 0.010)
Pin 1
0.457 0.076
(0.018 0.003)
0.254 0.0127
(0.010 0.0005)
0.65
(0.0255)
4.445 0.127
(0.175 0.005)
Dimensions
mm
(inches)
0.813 0.102
(0.032 0.004)
8
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CPC5001
INTEGRATED
C
IRCUITS
D
IVISION
5.5.3 CPC5001GS Tape & Reel Information
330.2 DIA.
(13.00 DIA.)
W=16.00
(0.63)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
Bo=10.30
(0.406)
Ao=10.30
(0.406)
P=12.00
(0.472)
K0=4.90
(0.193)
K1=4.20
(0.165)
User Direction of Feed
Dimensions
mm
Embossed Carrier
(inches)
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
Embossment
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC5001-R01
©Copyright 2013, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
7/30/2013
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