GWM70-01P2 [IXYS]

Three phase full bridge with Trench MOSFETs in DCB isolated high current package; 三相与DCB沟槽MOSFET的全桥隔离大电流包
GWM70-01P2
型号: GWM70-01P2
厂家: IXYS CORPORATION    IXYS CORPORATION
描述:

Three phase full bridge with Trench MOSFETs in DCB isolated high current package
三相与DCB沟槽MOSFET的全桥隔离大电流包

晶体 晶体管 开关 光电二极管
文件: 总2页 (文件大小:68K)
中文:  中文翻译
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Advanced Technical Information  
GWM 70-01P2  
VDSS  
ID25  
= 100 V  
= 70 A  
Three phase full bridge  
with Trench MOSFETs  
RDSon typ. = 11 m  
in DCB isolated high current package  
L +  
G3  
G5  
S5  
G1  
S3  
S1  
L1  
L2  
L3  
G4  
G6  
S6  
G2  
S4  
S2  
L -  
Applications  
MOSFETs  
AC drives  
• in automobiles  
Symbol  
VDSS  
Conditions  
Maximum Ratings  
-electric power steering  
-starter generator  
• in industrial vehicles  
-propulsion drives  
-fork lift drives  
TVJ = 25°C to 150°C  
100  
20  
V
V
VGS  
ID25  
ID90  
TC = 25°C  
TC = 90°C  
70  
50  
A
A
• in battery supplied equipment  
IF25  
IF90  
TC = 25°C (diode)  
TC = 90°C (diode)  
130  
85  
A
A
Features  
• MOSFETs in trench technology:  
-low RDSon  
-optimized intrinsic reverse diode  
• package:  
-high level of integration  
-high current capability  
-auxiliary terminals for MOSFET control  
-terminals for soldering or welding  
connections  
-isolated DCB ceramic base plate  
with optimized heat transfer  
Symbol  
RDSon  
Conditions  
Characteristic Values  
(TVJ = 25°C, unless otherwise specified)  
min.  
typ. max.  
on chip level at  
VGS = 10 V; ID = 35 A TVJ = 125°C  
TVJ = 25°C  
11  
24  
14 mΩ  
mΩ  
VGSth  
IDSS  
VDS = 20 V;ID = 1 mA  
2
4
1
V
VDS = VDSS;VGS = 0 V; TVJ = 25°C  
TVJ = 125°C  
µA  
0.1  
mA  
IGSS  
VGS = 20 V; VDS = 0 V  
0.2 µA  
Qg  
Qgs  
Qgd  
110  
18  
44  
nC  
nC  
nC  
VGS= 10 V; VDS = 80 V; ID = 25 A  
td(on)  
tr  
td(off)  
tf  
35  
85  
150  
70  
ns  
ns  
ns  
ns  
VGS= 10 V; VDS = 30 V;  
ID = 25 A; RG = 10 Ω  
VF  
trr  
(diode) IF = 35 A; VGS= 0 V  
0.8 1.25  
80  
V
(diode) IF = 75 A; -di/dt = 100 A/µs; VDS =30 V  
ns  
RthJC  
RthJH  
0.85 K/W  
K/W  
with heat transfer paste  
1.7  
IXYS reserves the right to change limits, test conditions and dimensions.  
© 2006 IXYS All rights reserved  
1 - 2  
Advanced Technical Information  
GWM 70-01P2  
Component  
EquivalentCircuitsforSimulation  
Thermal Response  
Symbol  
IRMS  
Conditions  
Maximum Ratings  
per pin in main current paths (L+, L-, L1, L2, L3)  
may be additionally limited by external connections  
300  
A
TVJ  
Tstg  
-40...+175  
-55...+125  
°C  
°C  
VISOL  
FC  
IISOL 1 mA; 50/60 Hz; t = 1 min  
1000  
V~  
N
junction - case (typ.)  
Mounting force with clip  
50 - 250  
Cth1 = 0.039 J/K; Rth1 = 0.28 K/W  
Cth2 = 0.069 J/K; Rth2 = 0.57 K/W  
Symbol  
Conditions  
Characteristic Values  
(TVJ = 25°C, unless otherwise specified)  
min.  
typ. max.  
Rpin to chip  
CP  
0.6  
mΩ  
coupling capacity between shorted  
pins and mounting tab in the case  
160  
pF  
Weight  
typ.  
25  
g
Dimensions in mm (1 mm = 0.0394")  
S6 G6 S5 G5 S4 G4 S3 G3 S2 G2 S1 G1  
L3  
L2  
L1  
L-  
L+  
© 2006 IXYS All rights reserved  
2 - 2  

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