IAD110P [IXYS]
Integrated Telecom Circuits; 综合电信电路
| 型号： | IAD110P |
| 厂家： | 
IXYS CORPORATION |
| 描述： | Integrated Telecom Circuits |
| 文件： | 总7页 (文件大小：122K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IAD110P
Integrated Telecom Circuits
INTEGRATED
CIRCUITS
DIVISION
Description
Parameter
Blocking Voltage
Load Current
Rating
350
Units
The IAD110P Multifunction Telecom switch combines
a 350V normally open (1-Form-A) relay and two
optocouplers in a single package. The relay uses
optically coupled MOSFET technology to provide
3750Vrms of input to output isolation. The efficient
MOSFET switch and photovoltaic die use IXYS
Integrated Circuits Division’s patented OptoMOS®
architecture. The optically coupled output is controlled
by highly efficient GaAIAs infrared LEDs. The
IAD110P enables telecom circuit designers to
combine three discrete functions in a single
component that uses less space than traditional
discrete component solutions.
VP
mArms / mADC
100
On-Resistance (max)
35
Features
• 3750Vrms Input/Output Isolation
• Bidirectional Current Sensing
• Bidirectional Current Switching
• Replaces up to Three or Four Components
• Three Functions in One Package
• Small 16-Pin SOIC Package (PCMCIA Compatible)
• FCC Compatible
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
• Tape & Reel Versions Available
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1305490
• EN/IEC 60950-1 Certified Component:
TUV Certificate: B 09 07 49410 006
Applications
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket
Size)
Ordering Information
Part #
IAD110P
Description
16-Pin SOIC (50/Tube)
IAD110PTR
16-Pin SOIC (1000/Reel)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
Pin Configuration
1. (N/C)
16
1
2. + LED - Relay Input
(N/C)
3. – LED - Relay Input
• Multiplexers
• Data Acquisition
2
3
4
15
14
13
(Form A)
4. Emitter - Phototransistor #1
5. Collector - Phototransistor #1
6. Emitter - Phototransistor #2
7. Collector - Phototransistor #2
8. (N/C)
9. LED - Phototransistor +/– #2
10. LED - Phototransistor –/+ #2
11. LED - Phototransistor +/– #1
12. LED - Phototransistor –/+ #1
13. (N/C)
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment-Patient/Equipment Isolation
• Security
(N/C)
5
12
6
7
11
10
9
• Aerospace
• Industrial Controls
14. Output - Relay
15. Common - Relay
16. Output - Relay
8
(N/C)
Switching Characteristics of
Normally Open Devices
Form-A
IF
90%
10%
ILOAD
t
t
on
off
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IAD110P
INTEGRATED
CIRCUITS
DIVISION
Absolute Maximum Ratings @ 25ºC
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Parameter
Ratings
50
Units
mA
W
Input Control Current, Relay
Total Package Dissipation 1
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
3750
Vrms
°C
-40 to +85
-40 to +125
°C
1
Derate linearly 1.67 mW / ºC
Electrical Characteristics @25ºC: Relay Section
Parameter
Conditions
Symbol
Min
Typ
Max
Units
Output Characteristics
Blocking Voltage (Peak)
Load Current
IL=1A
VL
-
-
350
VP
Continuous
-
IL
-
-
-
-
-
-
-
-
100
350
35
mArms / mADC
Peak
t=10ms
ILPK
RON
ILEAK
mAP
On-Resistance
IL=100mA
Off-State Leakage Current
Switching Speeds
Turn-On
VL=350V, TJ=25ºC
1
A
ton
toff
-
-
-
-
-
3
3
-
ms
ms
pF
IF=5mA, VL=10V
VL=50V, f=1MHz
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Voltage
Reverse Input Current
COUT
25
IL=100mA
IL=1mA
IF=5mA
-
IF
IF
-
0.4
0.9
-
-
5
-
mA
mA
V
-
1.2
-
VF
VR
IR
1.4
5
V
VR=5V
-
-
10
A
Electrical Characteristics @25ºC: Detector Section
Parameter
Conditions
Symbol
Min
Typ
Max
Units
Output Characteristics
Phototransistor Blocking Voltage
Phototransistor Dark Current
Saturation Voltage
IC=10A
BVCEO
ICEO
20
-
50
50
0.3
-
-
500
0.5
-
V
nA
V
VCE=5V, IF=0mA
IC=2mA, IF=16mA
IF=6mA, VCE=0.5V
VSAT
-
Current Transfer Ratio
CTR
33
%
Input Characteristics
Input Control Current
IC=2mA, VCE=0.5V
IF=5mA
IF
VF
-
-
0.9
5
2
1.2
25
3
6
1.4
-
mA
V
Input Voltage Drop
Input Current (Detector Must be Off)
Capacitance, Input to Output
Isolation, Input to Output
IC=1A, VCE=5V
VL=50V, f=1MHz
-
A
pF
CI/O
VI/O
-
-
3750
-
-
Vrms
R04
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IAD110P
INTEGRATED
CIRCUITS
DIVISION
RELAY PERFORMANCE DATA*
Typical Turn-On Time
(N=50, IF=5mA, IL=100mADC, TA=25ºC)
Typical LED Forward Voltage Drop
(N=50, IF=5mA, TA=25ºC)
Typical Turn-Off Time
(N=50, IF=5mA, IL=100mADC, TA=25ºC)
25
35
30
25
20
15
10
5
25
20
15
10
5
20
15
10
5
0
0
0
0.3
0.9
1.5
2.1
2.7
3.3
3.9
1.17
1.19
1.21
1.23
1.25
0.05 0.15 0.25 0.35 0.45 0.55 0.65
Turn-On Time (ms)
LED Forward Voltage Drop (V)
Turn-Off Time (ms)
Typical On-Resistance Distribution
(N=50, IF=5mA, IL=100mADC, TA=25ºC)
Typical IF for Switch Operation
(N=50, IL=100mADC, TA=25ºC)
Typical IF for Switch Dropout
(N=50, IL=100mADC, TA=25ºC)
25
20
15
10
5
35
30
25
20
15
10
5
25
20
15
10
5
0
0
0
0.39 0.65 0.91 1.17 1.43 1.69 1.95
18.75 19.85 20.95 22.05 23.15 24.25 25.35
0.39 0.65 0.91 1.17 1.43 1.69 1.95
LED Current (mA)
On-Resistance (:)
LED Current (mA)
Typical Blocking Voltage Distribution
(N=50, TA=25ºC)
35
30
25
20
15
10
5
0
377.5 388.5 399.5 410.5 421.5 432.5 443.5
Blocking Voltage (VP)
Typical Turn-On Time
Typical Turn-Off Time
vs. LED Forward Current
vs. LED Forward Current
Typical LED Forward Voltage Drop
vs. Temperature
(IL=100mADC
)
(IL=100mADC
)
1.8
1.6
1.4
1.2
1.0
0.8
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
IF=50mA
IF=30mA
IF=20mA
IF=10mA
IF=5mA
-40 -20
0
20
40
60
80 100 120
0
5
10 15 20 25 30 35 40 45 50
0
5
10 15 20 25 30 35 40 45 50
Temperature (ºC)
LED Forward Current (mA)
Forward Current (mA)
* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R04
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IAD110P
INTEGRATED
CIRCUITS
DIVISION
RELAY PERFORMANCE DATA (cont.)*
Typical Turn-On Time
vs. Temperature
Typical Turn-Off vs. Temperature
Maximum Load Current
vs. Temperature
(IL=100mADC
)
(IF=5mA, IL=100mADC)
180
160
140
120
100
80
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
IF=5mA
IF=10mA
IF=20mA
IF=20mA
IF=10mA
IF=5mA
60
40
20
0
-20
0
20
Temperature (ºC)
40
60
80
100
100
2.5
-40
-40
-40
-20
0
20
Temperature (ºC)
40
60
80
100
100
100
-40 -20
0
20
Temperature (ºC)
40
60
80 100 120
-40
Typical IF for Switch Dropout
vs. Temperature
Typical On-Resistance
vs. Temperature
(IF=5mA, IL=100mADC)
Typical IF for Switch Operation
vs. Temperature
(IL=100mADC
)
(IL=100mADC
)
3.0
2.5
2.0
1.5
1.0
0.5
0
3.0
2.5
2.0
1.5
1.0
0.5
0
60
50
40
30
20
10
0
-20
0
20
40
60
80
-40
-20
0
20
40
60
80
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
Temperature (ºC)
Typical Load Current
vs. Load Voltage
(IF=5mA, TA=25ºC)
Typical Blocking Voltage
vs. Temperature
Typical Leakage vs. Temperature
Measured across Pins 14&16
100
80
430
425
420
415
410
405
400
395
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
60
40
20
0
-20
-40
-60
-80
-100
-2.5 -2 -1.5 -1 -0.5
0
0.5
1
1.5
2
-20
0
20
40
60
80
-40
-20
0
20
40
60
80
100
Load Voltage (V)
Temperature (ºC)
Temperature (ºC)
Energy Rating Curve
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10Ps 100Ps 1ms 10ms 100ms 1s
10s 100s
Time
* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R04
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IAD110P
INTEGRATED
CIRCUITS
DIVISION
DETECTOR PERFORMANCE DATA*
Typical Normalized CTR
vs. Temperature
(VCE=0.8V)
Typical Collector Current
vs. Forward Current
(VCE=0.8V)
Typical Normalized CTR
vs. Forward Current
(VCE=0.8V)
16
14
12
10
8
2.5
2.0
1.5
1.0
0.5
0
3.0
IF=1mA
IF=2mA
2.5
IF=5mA
IF=10mA
2.0
IF=15mA
IF=20mA
1.5
6
1.0
0.5
0
4
2
0
0
2
4
6
8
10 12 14 16 18 20
0
2
4
6
8
10 12 14 16 18 20
-40
-20
0
20
40
60
80
100
Forward Current (mA)
Forward Current (mA)
Temperature (ºC)
* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R04
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5
IAD110P
INTEGRATED
CIRCUITS
DIVISION
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
IAD110P
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
MaximumTemperature xTime
IAD110P
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an
optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a
wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb
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IAD110P
INTEGRATED
CIRCUITS
DIVISION
MECHANICAL DIMENSIONS
IAD110P
10.160 0.381
(0.400 0.015)
PCB Land Pattern
0.254 0.0127
(0.010 0.0005)
PIN 16
10.363 0.127
(0.408 0.005)
9.30
(0.366)
0.635 X 45°
(0.025 X 45°)
7.493 0.127
(0.295 0.005)
1.016 TYP
(0.040 TYP)
1.90
(0.075)
PIN 1
1.27
(0.050)
1.270 TYP
(0.050 TYP)
2.108 MAX
(0.083 MAX)
See Note 3
0.60
(0.024)
DIMENSIONS
mm
(inches)
0.406 TYP
NOTES:
(0.016 TYP)
8.890 TYP
(0.350 TYP)
0.508 0.1016
(0.020 0.004)
1. Coplanarity = 0.1016 (0.004) max.
2. Leadframe thickness does not include solder plating
(1000 microinch maximum).
3. Sum of package height, standoff, and coplanarity
does not exceed 2.108 (0.083).
Lead to Package Standoff:
MIN: 0.0254 (0.001)
MAX: 0.102 (0.004)
IAD110PTR Tape & Reel
330.2 DIA.
(13.00 DIA.)
W=16
(0.630)
B0=10.70
(0.421)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
A0=10.90
(0.429)
P=12.00
(0.472)
K0=3.20
(0.126)
K1=2.70
(0.106)
Embossed Carrier
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions
listed on page 5 of EIA-481-2
Dimensions
mm
Embossment
(inches)
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-IAD110P-R04
©Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/19/2012
7
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