IX3120G [IXYS]
2.5A Maximum Peak Output Current;
| 型号： | IX3120G |
| 厂家： | 
IXYS CORPORATION |
| 描述： | 2.5A Maximum Peak Output Current |
| 文件： | 总12页 (文件大小：263K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IX3120
2.5A Output Current Gate Driver
Optocoupler
INTEGRATED
C
IRCUITS
D
IVISION
Features
Description
• 2.5A Maximum Peak Output Current
• 25kV/µs Minimum Common Mode Rejection (CMR)
The IX3120 gate driver includes an input infrared LED
that is optically coupled to a power output stage. The
power output stage is capable of sourcing or sinking
2A of peak current, which is ideal for driving IGBTs
and MOSFETs in the mid-power range.
at 1500V
CM
• Wide Operating Voltage Range: 15V to 30V
• Under Voltage Lockout with Hysteresis
• 3750V
Input to Output Isolation
rms
The gate driver optocoupler with its low input LED
current, high output peak current, and high noise
immunity (25kV/s) is ideally suited for use in motor
control and inverter applications.
• Wide Temperature Range: -40°C to +100°C
Applications
• Isolated IGBT/MOSFET Gate Drive
• Switch Mode Power Supplies
• Industrial Inverters
The IX3120 is provided in an 8-pin DIP package and
an 8-pin surface mount package.
• Motor Drivers
Approvals
• UL Recognized Component: File E76270
• IEC/EN/DIN EN 60747-5-5 (“GE” Versions)
Ordering Information
Part
Description
IX3120G
8-Pin DIP Package (50/Tube)
IX3120GS
8-Pin Surface Mount (50/Tube)
IX3120GSTR
IX3120GE
8-Pin Surface Mount Tape & Reel (1000/Reel)
8-Pin DIP Package (50/Tube), IEC 60747-5-5 Option
8-Pin Surface Mount (50/Tube), IEC 60747-5-5 Option
IX3120GES
IX3120GESTR
8-Pin Surface Mount Tape & Reel (1000/Reel), IEC 60747-5-5 Option
Figure 1. IX3120 Block Diagram
TRUTH TABLE
VCC
1
2
3
4
8
7
6
5
N/C
VCC-VEE
VCC-VEE
VO
LED Positive Going Negative Going
(i.e. Turn-On)
0V - 30V
(i.e. Turn-Off)
0V - 30V
VO
VO
ANODE
CATHODE
N/C
LOW
LOW
OFF
ON
ON
ON
0V - 11V
0V - 9.5V
9.5V - 12V
12V - 30V
11V - 13.5V
13.5V - 30V
TRANSITION
HIGH
VEE
Note: A 0.1μF bypass capacitor must
be connected between pins 5 and 8.
DS-IX3120-R04
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1
IX3120
INTEGRATED
C
IRCUITS
D
IVISION
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Package Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.5 Electrical Specifications (DC). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.6 Switching Characteristics (AC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.7 Safety and Insulation Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2. Performance Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3. Test Circuits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.3 Soldering Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.5 Package Mechanical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.5.1 IX3120G & IX3120GE 8-Pin DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.5.2 IX3120GS & IX3120GES 8-Pin Surface Mount . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.5.3 IX3120GSTR & IX3120GESTR Tape & Reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.6 Device Branding. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2
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R04
IX3120
INTEGRATED
C
IRCUITS
D
IVISION
1. Specifications
1.1 Package Pinout
1.2 Pin Description
VCC
N/C
8
1
Pin#
Name
Description
No connection
1
2
3
4
5
N/C
ANODE
CATHODE
N/C
Anode of input LED
Cathode of input LED
No connection
VO
VO
2
3
4
ANODE
CATHODE
N/C
7
6
5
V
Negative Supply Voltage
EE
V
6
7
8
Gate Drive Output
Gate Drive Output
Positive Supply Voltage
O
V
O
VEE
V
CC
1.3 Absolute Maximum Ratings
Absolute maximum ratings are at 25°C.
Parameter
Supply Voltage
Symbol
Limit
Units
V
V - V
CC EE
0 to 35
0 to V
V
Output Voltage
V
O(PEAK)
CC
1
I
- 2.5
2.5
5
A
“High” Peak Output Current
OH(PEAK)
1
I
A
“Low” Peak Output Current
Reverse Input Voltage
Average Input Current
OL(PEAK)
V
V
R
I
20
mA
F(AVG)
Peak Transient Input Current
(<1s pulse width, 300pps)
I
1
A
F(TRAN)
2
P
50
mW
mW
Input Power Dissipation
IN
3
P
800
Total Power Dissipation
T
V
V
Isolation Voltage, Input to Output
Operating Temperature
3750
IO
rms
T
-40 to +100
-55 to +125
°C
°C
A
T
Storage Temperature
STG
Notes:
1 Maximum pulse width=10s, maximum duty cycle=0.2%.
2 Derate linearly 1.33mW/°C
3 Derate linearly 7.5mW/°C
Absolute maximum ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
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IX3120
INTEGRATED
C
IRCUITS
D
IVISION
1.4 Recommended Operating Conditions
Parameter
Power Supply Voltage
Input Current (ON)
Symbol
Min
15
Max
30
Units
V
- V
EE
V
mA
V
CC
I
7
16
F(on)
V
Input Voltage (OFF)
-3.6
-40
0.8
100
F(off)
T
Operating Temperature
°C
A
1.5 Electrical Specifications (DC)
Over recommended operating conditions unless otherwise specified. Typical values are at T =25°C,V =30V, and
A
CC
V
=Ground.
EE
Parameter
Conditions
Symbol Min
Typ
-1.5
-
Max
Units
1
High Level Output Current
- 0.5
-
-
-
V =(V -4V)
CC
O
I
A
OH
2
- 2
V =(V -15V)
CC
O
1
Low Level Output Current
0.5
1.4
-
V =(V +2.5V)
EE
O
I
A
OL
2
2
-
V =(V +15V)
EE
O
I =-100mA
O
V
V
- 4
V - 3
CC
High Level Output Voltage
Low Level Output Voltage
-
0.5
6
V
V
OH
CC
I =100mA
O
V
OL
-
0.1
Output Open, I =7 to 16mA
F
I
CCH
High Level Supply Current
Low Level Supply Current
-
-
-
4.5
2.6
0.7
-
mA
Output Open, V =- 3 to +0.8V
F
I
CCL
6
I =0mA, V >5V
O
I
FLH
Threshold Input Current, Low-to-High
Threshold Input Voltage, High-to-Low
Input Forward Voltage
5
mA
V
O
V
-
0.8
1
-
FHL
I =10mA
F
V
1.24
-1.6
-
1.5
-
V
F
I =10mA
F
V /T
Temperature Coefficient of Forward Voltage
Input Reverse Breakdown Voltage
Input Capacitance
-
mV/°C
V
F
A
I =10A
BV
5
-
R
R
f=1MHz, V =0V
F
C
-
60
-
pF
IN
V
UVLO Threshold
11
9.5
-
12.3
10.7
1.6
13.5
12
-
UVLO+
V >5V, I =10mA
F
V
V
O
V
UVLO-
V >5V, I =10mA
F
UVLO
HYS
UVLO Hysteresis
O
1
Maximum pulse width = 50s, maximum duty cycle = 0.5%.
Maximum pulse width = 10s, maximum duty cycle = 0.2%.
2
See “Test Circuits” on page 9 for more information.
4
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R04
IX3120
INTEGRATED
C
IRCUITS
D
IVISION
1.6 Switching Characteristics (AC)
Over recommended operating conditions, unless otherwise specified.
Parameter
Conditions
Symbol Min
Typ
Max
Units
Propagation Delay Time
to High Output Level
tPLH
0.1
0.1
-
0.3
0.5
Propagation Delay Time
to Low Output Level
tPHL
0.3
0.5
0.3
Pulse Width Distortion
PWD
|tPHL-tPLH
RG=10, CG=10nF
f=10kHz, Duty Cycle=50%
-
-
s
|
Propagation Delay Difference
Between any Two Parts1
Rise Time
PDD
(tPHL-tPLH
-0.35
0.35
)
tr
-
-
-
-
0.1
0.1
0.8
0.6
-
-
-
-
Fall Time
tf
UVLO Turn-On Delay
UVLO Turn-Off Delay
VO>5V, IF=10mA
VO<5V, IF=10mA
tUVLO(on)
tUVLO(off)
s
Output High Level
Common Mode Transient Immunity
IF=10 to 16mA, VCM=1500V,
VCC=30V, TA=25°C
|CMH|
|CML|
25
25
35
35
-
-
kV/s
Output Low Level
Common Mode Transient Immunity
VF=0V, VCM=1500V, VCC=30V,
TA=25°C
1 The difference between tPHL and tPLH of any two IX3120 devices operating under the same conditions and temperature.
Figure 2. Timing Waveforms
IF
tr
tf
90%
50%
10%
VOUT
tPLH
tPHL
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IX3120
INTEGRATED
C
IRCUITS
D
IVISION
1.7 Safety and Insulation Ratings
As per IEC 60747-5-5.
Parameter
Conditions
Symbol Rating
Units
Minimum External Air Gap (Clearance)
Measured from input terminals to output
terminals, shortest distance through air.
L(101)
7.62
mm
Minimum External Tracking (Creepage)
Measured from input terminals to output
terminals, shortest distance path along
body.
L(102)
7.50
mm
Distance Through Insulation
(Internal Clearance)
Insulation thickness between emitter and
detector
-
0.48
>175
IIIa
mm
Tracking Resistance
(Comparative Tracking Index)
DIN IEC 60112/VDE 0303 Part 1
CTI
V
-
Isolation Group
DIN VDE 0110, 1/89, Table 1
Material Group
-
-
Installation classification
DIN VDE 0110/1.89, Table 1
Rated mains voltage < 300Vrms
I-IV
-
DIN VDE 0110/1.89, Table 1
Rated mains voltage < 1000Vrms
-
-
I-III
-
-
Climatic Classification
-
55/100/21
Input to Output Test Voltage
IEC EN 60747-5-5 Method b,
VIORM x 1.875 = VPR, 100% Production Test
with tm = 1 sec., Partial Discharge < 5pC
3750
3200
VPR
VPEAK
IEC EN 60747-5-5 Method a,
VIORM x 1.6 = VPR, Type and Sample Test
with tm = 10 sec., Partial Discharge < 5pC
TS, VIO = 500VDC
109
2
Insulation Resistance
RS
-
Pollution Degree
DIN VDE 0109
Transient Over-Voltage
Recurring Voltage
DIN EN 60747-5-5 Method B
-
-
Highest Allowable Over-Voltage
VIOTM
VP
6000
Maximum Working Insulation Voltage
Partial Discharge Test Voltage
Isolation Test Voltage
VIORM
VPR
VP
VP
2000
3750
3750
VISO
Vrms
Input-Output Momentary Withstand
Voltage
RH < 50%, t = 1 min,
TA = 25°C
VISO
Vrms
3750
1012
0.6
Resistance (Input-Output), Typical
Capacitance (Input-Output), Typical
VI-O = 500VDC
f = 1 MHz
RI-O
CI-O
pF
6
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IX3120
INTEGRATED
C
IRCUITS
D
IVISION
2. Performance Data
VOL vs.Temperature
(IF=0mA, IOUT=100mA, VCC=15V, VEE=0V)
Output High Current vs.Temperature
(VCC=15V, VEE=0V, IF=7mA, VOUT=VCC-4V)
VOH vs.Temperature
(IF=7mA, IOUT=-100mA, VCC=15V, VEE=0V)
0.22
0.20
0.18
0.16
0.14
0.12
0.10
3.0
2.5
2.0
1.5
1.0
-0.10
-0.12
-0.14
-0.16
-0.18
-0.20
-40
-20
0
20
40
60
80
100
-40
0.0
-40
-20
0
20
40
60
80
100
-40
-20
0
20
Temperature (ºC)
40
60
80
100
Temperature (ºC)
Temperature (ºC)
Output Low Current vs.Temperature
(VCC=15V, VEE=0V, VOUT=2.5V)
(VF(off)=-3.0 to 0.8V)
VOH vs. IOH
VOL vs. IOL
(IF=7mA, VCC=15V, VEE=0V)
(VCC=15V, VEE=0V, VF(off)=-3.0 to 0.8V)
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0
-2
12
10
8
-40ºC
25ºC
100ºC
100ºC
25ºC
-40ºC
-4
6
-6
4
-8
2
-10
0
-40
-20
0
20
40
60
80
100
0.5
1.0
IOH (A)
1.5
2.0
2.5
0.0
0.5
1.0
IOL (A)
1.5
2.0
2.5
Temperature (ºC)
ICC vs. VCC
ICC vs.Temperature
IFLH vs.Temperature
(VCC=30V, VEE=0V, Output=OPEN)
(IF=10mA, VEE=0V,TA=25ºC)
(VCC=30V, VEE=0V, Output=Open)
5.0
4.5
4.0
3.5
3.0
2.5
2.0
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.74
0.72
0.70
0.68
0.66
0.64
0.62
0.60
ICCH
ICCH: IF=10mA
ICCL
ICCL: IF=0mA
-40
-20
0
20
40
60
80
100
15
20
25
30
-20
0
20
40
60
80
100
Temperature (ºC)
Supply Voltage (V)
Temperature (ºC)
Propagation Delay vs. VCC
(IF=10mA, RG=10Ω, CG=10nF)
(Duty Cycle=50%, f=10kHz,TA=25ºC)
LED Forward Current
vs. Forward Voltage
(TA=25ºC)
Propagation Delay vs. RG
(IF=10mA, VCC=30V, VEE=0V, CG=10nF)
(Duty Cycle=50%, f=10kHz,TA=25ºC)
160
140
120
100
80
100
80
60
40
20
0
160
140
120
100
80
tPHL
tPHL
tPLH
tPLH
60
60
10
15
20
25
30
35
40
45
50
15
20
25
30
1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50
RG (Ω)
VCC - Supply Voltage (V)
LED Forward Voltage (V)
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IX3120
INTEGRATED
C
IRCUITS
D
IVISION
Performance Data (Cont.)
Propagation Delay vs.Temperature
(IF=10mA, VCC=30V, VEE=0V, RG=10Ω)
(CG=10nF, Duty Cycle=50%, f=10kHz)
Propagation Delay vs. CG
(IF=10mA, VCC=30V, VEE=0V, RG=10Ω)
(Duty Cycle=50%, f=10kHz,TA=25ºC)
Propagation Delay vs. IF
(VCC=30V, VEE=0V, RG=10Ω, CG=10nF)
(Duty Cycle=50%, f=10kHz,TA=25ºC)
160
140
120
100
80
160
160
140
120
100
80
tPHL
tPHL
tPHL
140
120
100
tPLH
tPLH
tPLH
80
60
60
60
0
20
40
CG (nF)
60
80
100
-40
-20
0
20
40
60
80
100
6
8
10
12
14
16
Temperature (ºC)
IF (mA)
Transfer Characteristics
35
30
25
20
15
10
5
0
0
1
2
3
4
5
IF - Forward LED Current (mA)
8
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R04
IX3120
INTEGRATED
C
IRCUITS
D
IVISION
3. Test Circuits
1
8
1
2
3
4
8
0.1μF
0.1μF
4V
IOL
IF=7 to 16mA
2
+
-
7
6
5
7
VCC=15 to 30V
VCC=15 to 30V
+
-
+
-
2.5V
+
-
3
4
6
5
IOH
IOH Test Circuit
IOL Test Circuit
1
2
3
4
8
1
2
3
4
8
100mA
0.1μF
0.1μF
IF=7 to 16mA
VOH
7
7
V
CC=15 to 30V
VCC=15 to 30V
+
-
+
-
6
5
6
5
VOL
100mA
VOH Test Circuit
VOL Test Circuit
1
2
3
4
8
1
2
3
4
8
IF
0.1μF
0.1μF
IF=10mA
7
7
VCC
+
-
+
-
6
5
6
5
VCC=15 to 30V
VO>5V
VO>5V
I
FLH Test Circuit
UVLO Test Circuit
1
8
0.1μF
IF=7 to 16mA
+
-
2
3
4
7
VCC=15 to 30V
VO
+
-
500Ω
10kHz
50%
RG
10Ω
Duty Cycle
6
5
CG
10nF
tPLH, tPHL, tr, tf Test Circuit
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IX3120
INTEGRATED
C
IRCUITS
D
IVISION
4. Manufacturing Information
4.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
IX3120G / IX3120GS / IX3120GE / IX3120GES
MSL 1
4.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
4.3 Soldering Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
Device
Maximum Temperature x Time
Maximum Reflow Cycles
IX3120G / IX3120GS / IX3120GE / IX3120GES
250°C for 30 seconds
3
4.4 Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an
optical waveguide in many of its optically isolated products, the use of a short drying bake may be necessary if a wash
is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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IX3120
INTEGRATED
C
IRCUITS
D
IVISION
4.5 Package Mechanical Dimensions
4.5.1 IX3120G & IX3120GE 8-Pin DIP
9.652 0.381
PCB Hole Pattern
7.620 0.254
(0.300 0.010)
(0.380 0.015)
2.540 0.127
(0.100 0.005)
8-0.800 DIA.
2.540 0.127
(0.100 0.005)
(8-0.031 DIA.)
9.144 0.508
(0.360 0.020)
6.350 0.127
(0.250 0.005)
6.350 0.127
(0.250 0.005)
3.302 0.051
(0.130 0.002)
Pin 1
0.457 0.076
(0.018 0.003)
7.620 0.127
(0.300 0.005)
7.239 TYP.
(0.285)
7.620 0.127
(0.300 0.005)
4.064 TYP
(0.160)
0.254 0.0127
(0.010 0.0005)
Dimensions
0.813 0.102
mm
(0.032 0.004)
(inches)
4.5.2 IX3120GS & IX3120GES 8-Pin Surface Mount
9.652 0.381
(0.380 0.015)
PCB Land Pattern
0.635 0.127
(0.025 0.005)
2.540 0.127
(0.100 0.005)
3.302 0.051
(0.130 0.002)
2.54
(0.10)
9.525 0.254
(0.375 0.010)
6.350 0.127
(0.250 0.005)
8.90
(0.3503)
1.65
(0.0649)
7.620 0.254
(0.300 0.010)
Pin 1
0.457 0.076
(0.018 0.003)
0.254 0.0127
(0.010 0.0005)
0.65
(0.0255)
4.445 0.127
(0.175 0.005)
Dimensions
mm
(inches)
0.813 0.102
(0.032 0.004)
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IX3120
INTEGRATED
C
IRCUITS
D
IVISION
4.5.3 IX3120GSTR & IX3120GESTR Tape & Reel
330.2 DIA.
(13.00 DIA.)
W=16.00
(0.63)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
Bo=10.30
(0.406)
Ao=10.30
(0.406)
P=12.00
(0.472)
K0=4.90
(0.193)
K1=4.20
(0.165)
User Direction of Feed
Dimensions
mm
Embossed Carrier
(inches)
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
Embossment
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
4.6 Device Branding
IX3120G
YYWW@KKKKK
IX3120GE
YYWW@KKKKK
*
*
IX3120G
IX3120GE
IX3120GS
IX3120GES
*
YYWW@KKKKK
YYWW = date code (year/year/week/week)
@KKKKK = sequentially assigned kit code with assembly location identifier
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-IX3120-R04
©Copyright 2014, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
9/26/2014
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