LBB110S [IXYS]
Dual Single-Pole, Normally Closed OptoMOS Relay; 双路单刀，常闭继电器OptoMOS
| 型号： | LBB110S |
| 厂家： | 
IXYS CORPORATION |
| 描述： | Dual Single-Pole, Normally Closed OptoMOS Relay |
| 文件： | 总7页 (文件大小：136K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LBB110
Dual Single-Pole, Normally Closed
OptoMOS® Relay
INTEGRATED
CIRCUITS
DIVISION
Parameter
Blocking Voltage
Ratings
350
Units
Description
VP
mArms / mADC
LBB110 is a dual normally closed (1-Form-B) solid
state relay that has two independently controlled,
optically coupled MOSFET switches in an 8-pin SOIC
package that employs optically coupled MOSFET
technology to provide 3750Vrms of input to output
isolation.
Load Current
120
On-Resistance (max)
35
Features
• 3750Vrms Input/Output Isolation
• Low Drive Power Requirements
(TTL/CMOS Compatible)
• High Reliability
Its optically coupled outputs, which use patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED.
• Arc-Free With No Snubbing Circuits
• FCC Compatible
• VDE Compatible
• No EMI/RFI Generation
• Small 8-Pin Package
Dual single-pole OptoMOS relays provide a more
compact design solution than discrete single-pole
relays in a variety of applications by incorporating
both relays in a single 8-pin package.
• Machine Insertable, Wave Solderable
• Surface Mount, Tape & Reel Version Available
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 004
Applications
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket Size)
• Hook Switch
• Dial Pulsing
Ordering Information
Part #
LBB110
Description
8-Pin DIP (50/Tube)
LBB110P
LBB110PTR
LBB110S
LBB110STR
8-Pin Flatpack (50/Tube)
8-Pin Flatpack (1000/Reel)
8-Pin Surface Mount (50/Tube)
8-Pin Surface Mount (1000/Reel)
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment-Patient/Equipment Isolation
• Security
Pin Configuration
1
8
+ Control - Switch #1
Load - Switch #1
2
7
6
– Control - Switch #1
Load - Switch #1
Load - Switch #2
• Aerospace
3
+ Control - Switch #2
• Industrial Controls
4
5
– Control - Switch #2
Load - Switch #2
Switching Characteristics of
Normally Closed Devices
Form-B
IF
ILOAD
90%
10%
t
t
on
off
Pb
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LBB110
INTEGRATED
CIRCUITS
DIVISION
Absolute Maximum Ratings @ 25ºC
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Parameter
Blocking Voltage
Ratings Units
350
VP
Reverse Input Voltage
Input Control Current
Peak (10ms)
5
50
V
mA
A
1
Input Power Dissipation 1
Total Power Dissipation 2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
150
mW
mW
Vrms
°C
800
3750
-40 to +85
-40 to +125
°C
1
Derate linearly 1.33 mW / ºC
Derate linearly 6.67 mW / ºC
2
Electrical Characteristics @ 25ºC
Parameter
Conditions
Symbol
Min
Typ
Max
Units
Output Characteristics
Load Current
Continuous 1
-
IL
-
-
-
-
-
-
120
350
35
mArms / mADC
Peak
On-Resistance 2
t=10ms
ILPK
RON
ILEAK
AP
IL=120mA
VL=350VP
25
-
Off-State Leakage Current
Switching Speeds
1
A
Turn-On
ton
toff
-
-
-
-
-
3
3
-
IF=5mA, VL=10V
VL=50V, f=1MHz
ms
pF
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
COUT
25
IL=120mA
-
IF
IF
-
-
5
-
mA
mA
V
0.4
0.9
-
0.7
1.2
-
IF=5mA
VR=5V
VF
IR
1.4
10
A
Input to Output Capacitance
1
-
CI/O
-
3
-
pF
If both poles operate simultaneously, then the load current must be derated so as not to exceed the package power dissipation value.
Measurement taken within 1 second of on-time.
2
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LBB110
INTEGRATED
CIRCUITS
DIVISION
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
Typical Turn-On Time
(N=50, IF=5mA, IL=120mADC
Typical Turn-Off Time
(N=50, IF=5mA, IL=120mADC)
)
35
30
25
20
15
10
5
25
20
15
10
5
25
20
15
10
5
0
0
0
1.17
1.19
1.21
1.23
1.25
0.09
0.27
0.45
0.63
0.81
0.99
0.27 0.45 0.63 0.81 0.99 1.17 1.35
LED Forward Voltage Drop (V)
Turn-On Time (ms)
Turn-Off Time (ms)
Typical IF for Switch Operation
(N=50, IL=120mADC
Typical IF for Switch Dropout
(N=50, IL=120mADC
Typical On-Resistance Distribution
)
)
(N=50, IL=120mADC)
25
20
15
10
5
25
20
15
10
5
25
20
15
10
5
0
0
0
0.33 0.55 0.77 0.99 1.21 1.43 1.65
0.11 0.33 0.55 0.77 0.99 1.21 1.43
25.5 26.5 27.5 28.5 29.5 30.5 31.5
LED Current (mA)
LED Current (mA)
On-Resistance (:)
Typical Blocking Voltage Distribution
(N=50, IF=5mA)
25
20
15
10
5
0
357.5 372.5 387.5 402.5 417.5 432.5
Blocking Voltage (VP)
Typical Turn-Off Time
Typical Turn-On Time
vs. LED Forward Current
vs. LED Forward Current
Typical LED Forward Voltage Drop
vs.Temperature
(IL=120mADC
)
(IL=120mADC
)
0.30
0.25
0.20
0.15
0.10
0.05
0
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1.8
1.6
1.4
1.2
1.0
0.8
IF=50mA
I =10mA
IFF=5mA
0
5
10 15 20 25 30 35 40 45 50
0
-40 -20
0
20
40
60
80 100 120
5
10 15 20 25 30 35 40 45 50
LED Forward Current (mA)
LED Forward Current (mA)
Temperature (ºC)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
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LBB110
INTEGRATED
CIRCUITS
DIVISION
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Typical IF for Switch Operation
vs.Temperature
Typical Turn-On Time
vs.Temperature
Typical On-Resistance vs.Temperature
(IL=120mADC
)
(IL=120mADC)
(IF=5mA, IL=120mADC
)
3.0
2.5
2.0
1.5
1.0
0.5
0
50
45
40
35
30
25
20
15
10
5
0.6
0.5
0.4
0.3
0.2
0.1
0
Dual Pole
Single Pole
Instantaneous
0
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
-40
-40
-40
-20
0
20
40
60
80
80
80
100
100
100
Temperature (ºC)
Temperature (ºC)
Temperature (ºC)
Typical IF for Switch Dropout
vs.Temperature
Typical Turn-Off Time
vs.Temperature
Typical Load Current vs. Load Voltage
(IL=120mADC
)
(IL=120mADC)
3.0
2.5
2.0
1.5
1.0
0.5
0
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0
150
100
50
IF=5mA
IF=10mA
0
-50
-100
-150
-40
-20
0
20
40
60
80
100
-20
0
20
40
60
0
-4
-3
-2
-1
1
2
3
4
Temperature (ºC)
Temperature (ºC)
Load Voltage (V)
Typical Blocking Voltage
vs.Temperature
(IF=5mA)
Maximum Load Current
vs.Temperature
Typical Leakage vs.Temperature
(Measured across Pins 5&6 or 7&8)
180
160
140
120
100
80
410
405
400
395
390
385
380
0.045
0.040
0.035
0.030
0.025
0.020
0.015
0.010
0.005
0
60
40
20
0
-40 -20
0
20
40
60
80 100 120
-20
0
20
40
60
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
Temperature (ºC)
Energy Rating Curve
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10Ps 100Ps 1ms 10ms 100ms 1s
10s 100s
Time
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
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LBB110
INTEGRATED
CIRCUITS
DIVISION
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
LBB110 / LBB110S / LBB110P
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
MaximumTemperature xTime
LBB110 / LBB110S
LBB110P
250ºC for 30 seconds
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb
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LBB110
INTEGRATED
CIRCUITS
DIVISION
MECHANICAL DIMENSIONS
LBB110
9.652 0.381
(0.380 0.015)
PCB Hole Pattern
7.620 0.254
(0.300 0.010)
2.540 0.127
(0.100 0.005)
8-0.800 DIA.
2.540 0.127
(8-0.031 DIA.)
(0.100 0.005)
9.144 0.508
(0.360 0.020)
6.350 0.127
(0.250 0.005)
6.350 0.127
(0.250 0.005)
3.302 0.051
Pin 1
0.457 0.076
(0.018 0.003)
(0.130 0.002)
7.620 0.127
(0.300 0.005)
7.239 TYP.
(0.285)
7.620 0.127
(0.300 0.005)
4.064 TYP
(0.160)
0.254 0.0127
(0.010 0.0005)
Dimensions
0.813 0.102
mm
(0.032 0.004)
(inches)
LBB110P
2.286 MAX.
(0.090 MAX.)
PCB Land Pattern
0 MIN / 0.102 MAX
(0 MIN / 0.004 MAX)
2.540 0.127
(0.100 0.005)
2.54
(0.10)
0.635 0.127
(0.025 0.005)
7.620 0.254
(0.300 0.010)
6.350 0.127
(0.250 0.005)
9.398 0.127
(0.370 0.005)
8.70
(0.3425)
1.55
(0.0610)
Pin 1
0.203 0.013
(0.008 0.0005)
9.652 0.381
(0.380 0.015)
0.65
(0.0255)
2.159 0.025
(0.085 0.001)
0.457 0.076
(0.018 0.003)
Dimensions
mm
0.864 0.120
(0.034 0.004)
(inches)
LBB110S
9.652 0.381
(0.380 0.015)
PCB Land Pattern
0.635 0.127
(0.025 0.005)
2.540 0.127
(0.100 0.005)
3.302 0.051
(0.130 0.002)
2.54
(0.10)
9.525 0.254
(0.375 0.010)
6.350 0.127
(0.250 0.005)
8.90
(0.3503)
1.65
(0.0649)
7.620 0.254
(0.300 0.010)
Pin 1
0.457 0.076
(0.018 0.003)
0.254 0.0127
(0.010 0.0005)
0.65
(0.0255)
4.445 0.127
(0.175 0.005)
Dimensions
mm
(inches)
0.813 0.102
(0.032 0.004)
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LBB110
INTEGRATED
CIRCUITS
DIVISION
LBB110PTR Tape & Reel
2.00
(0.079)
4.00
(0.157)
330.2 DIA.
(13.00 DIA.)
W = 16.00
(0.63)
7.50
(0.295)
Top Cover
Tape Thickness
Bo = 10.30
(0.406)
0.102 MAX.
(0.004 MAX.)
P = 12.00
(0.472)
Ao = 10.30
(0.406)
K0 = 2.70
(0.106)
Dimensions
mm
(inches)
K1 = 2.00
(0.079)
User Direction of Feed
Embossed Carrier
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment
LBB110STR Tape & Reel
330.2 DIA.
(13.00 DIA.)
W=16.00
(0.63)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
Bo=10.30
(0.406)
Ao=10.30
(0.406)
P=12.00
(0.472)
K0=4.90
(0.193)
K1=4.20
(0.165)
User Direction of Feed
Dimensions
mm
Embossed Carrier
(inches)
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
Embossment
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-LBB110-R08
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
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