LBB120S [IXYS]

Dual Single-Pole, Normally Closed OptoMOS Relay; 双路单刀,常闭继电器OptoMOS
LBB120S
型号: LBB120S
厂家: IXYS CORPORATION    IXYS CORPORATION
描述:

Dual Single-Pole, Normally Closed OptoMOS Relay
双路单刀,常闭继电器OptoMOS

继电器
文件: 总7页 (文件大小:124K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LBB120  
Dual Single-Pole, Normally Closed  
OptoMOS® Relay  
INTEGRATED  
CIRCUITS  
DIVISION  
Parameter  
Blocking Voltage  
Ratings  
250  
Units  
Description  
VP  
mArms / mADC  
LBB120 is a dual 250V, 170mA, 20normally closed  
(1-Form-B) relay that features low on-resistance  
combined with enhanced peak load current handling  
capability. Provided in an 8-pin SOIC package, and  
employing optically coupled MOSFET technology, it  
provides 3750Vrms of input/output isolation.  
Load Current  
170  
On-Resistance (max)  
20  
Features  
3750Vrms Input/Output Isolation  
Low Drive Power Requirements (TTL/CMOS  
Compatible)  
Its optically coupled outputs, which use the patented  
OptoMOS architecture, are controlled by a highly  
efficient GaAIAs infrared LED.  
High Reliability  
Arc-Free With No Snubbing Circuits  
FCC Compatible  
VDE Compatible  
No EMI/RFI Generation  
Small 8-Pin Package  
Dual single-pole OptoMOS relays provide a more  
compact design solution than discrete single-pole  
relays in a variety of applications by incorporating  
both relays in a single 8-pin package.  
Machine Insertable, Wave Solderable  
Surface Mount, Tape & Reel Version Available  
Approvals  
UL Recognized Component: File E76270  
CSA Certified Component: Certificate 1175739  
EN/IEC 60950-1 Certified Component:  
TUV Certificate B 09 07 49410 004  
Applications  
Telecommunications  
Telecom Switching  
Tip/Ring Circuits  
Modem Switching (Laptop, Notebook, Pocket Size)  
Hook Switch  
Dial Pulsing  
Ground Start  
Ringing Injection  
Ordering Information  
Part #  
LBB120  
Description  
8-Pin DIP (50/Tube)  
LBB120S  
LBB120STR  
8-Pin Surface Mount (50/Tube)  
8-Pin Surface Mount (1000/Reel)  
Instrumentation  
Multiplexers  
Data Acquisition  
Electronic Switching  
I/O Subsystems  
Meters (Watt-Hour, Water, Gas)  
Medical Equipment-Patient/Equipment Isolation  
Security  
Pin Configuration  
1
8
+ Control - Switch #1  
Load - Switch #1  
2
7
6
– Control - Switch #1  
Load - Switch #1  
Load - Switch #2  
3
+ Control - Switch #2  
Aerospace  
Industrial Controls  
4
5
– Control - Switch #2  
Load - Switch #2  
Switching Characteristics of  
Normally Closed Devices  
Form-B  
IF  
ILOAD  
90%  
10%  
t
t
on  
off  
Pb  
e3  
DS-LBB120-R08  
1
www.ixysic.com  
LBB120  
INTEGRATED  
CIRCUITS  
DIVISION  
Absolute Maximum Ratings @ 25ºC  
Absolute Maximum Ratings are stress ratings. Stresses in  
excess of these ratings can cause permanent damage to  
the device. Functional operation of the device at conditions  
beyond those indicated in the operational sections of this  
data sheet is not implied.  
Parameter  
Blocking Voltage  
Ratings Units  
250  
VP  
Reverse Input Voltage  
Input Control Current  
Peak (10ms)  
5
50  
V
mA  
A
1
Input Power Dissipation 1  
Total Power Dissipation 2  
Isolation Voltage, Input to Output  
Operational Temperature  
Storage Temperature  
150  
mW  
mW  
Vrms  
°C  
800  
3750  
-±0 to +85  
-±0 to +125  
°C  
1
Derate linearly 1.33 mW / ºC  
Derate linearly 6.67 mW / ºC  
2
Electrical Characteristics @ 25ºC  
Parameter  
Conditions  
Symbol  
Min  
Typ  
Max  
Units  
Output Characteristics  
Load Current  
Continuous, AC/DC Configuration 1  
-
IL  
-
-
-
-
-
-
170  
±±00  
20  
mArms / mADC  
Peak  
t=10ms  
ILPK  
RON  
ILEAK  
mAP  
On-Resistance, AC/DC Configuration 2  
Off-State Leakage Current  
Switching Speeds  
IL=120mA  
VL=250VP  
16  
-
1
A  
Turn-On  
ton  
toff  
-
-
-
-
-
5
5
-
IF=5mA, VL=10V  
VL=50V, f=1MHz  
ms  
pF  
Turn-Off  
Output Capacitance  
COUT  
50  
Input Characteristics  
Input Control Current to Activate  
Input Control Current to Deactivate  
Input Voltage Drop  
IL=170mA  
-
IF  
IF  
-
-
5
-
mA  
mA  
V
0.±  
0.9  
-
0.7  
1.2  
-
IF=5mA  
VR=5V  
VF  
IR  
1.±  
10  
Reverse Input Current  
Common Characteristics  
A  
Input to Output Capacitance  
1
-
CI/O  
-
3
-
pF  
If both poles operate simultaneously, then the load current must be derated so as not to exceed the package power dissipation value.  
Measurement taken within 1 second of on-time.  
2
R08  
2
www.ixysic.com  
LBB120  
INTEGRATED  
CIRCUITS  
DIVISION  
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*  
Typical Turn-On Time  
(N=50, IF=5mA, IL=120mADC  
Typical Turn-Off Time  
(N=50, IF=5mA, IL=120mADC)  
Typical LED Forward Voltage Drop  
(N=50, IF=5mA)  
)
35  
30  
25  
20  
15  
10  
5
35  
30  
25  
20  
15  
10  
5
35  
30  
25  
20  
15  
10  
5
0
0
0
1.17  
1.19  
1.21  
1.23  
1.25  
0.30  
0.42  
0.54  
0.66  
0.78  
0.90  
0.625 0.875 1.125 1.375 1.625 1.875  
Turn-On Time (ms)  
Turn-Off Time (ms)  
LED Forward Voltage Drop (V)  
Typical IF for Switch Operation  
(N=50, IL=120mADC  
Typical IF for Switch Dropout  
(N=50, IL=120mADC  
Typical On-Resistance Distribution  
)
)
(N=50, IL=120mADC  
)
30  
25  
20  
15  
10  
5
35  
25  
20  
15  
10  
5
35  
30  
25  
20  
15  
10  
5
0
0
0
0.63  
0.81  
0.99  
1.17  
1.35  
1.53  
0.45  
0.63  
0.81  
0.99  
1.17  
1.35  
10.4  
10.8  
11.2  
11.6  
12.0  
12.4  
On-Resistance (:)  
LED Current (mA)  
LED Current (mA)  
Typical Blocking Voltage Distribution  
(N=50)  
35  
30  
25  
20  
15  
10  
5
0
291.25 293.75 296.25 298.75 301.25 303.75  
Blocking Voltage (VP)  
Typical Turn-On Time  
Typical Turn-Off Time  
Typical LED Forward Voltage Drop  
vs.Temperature  
vs. LED Forward Current  
vs. LED Forward Current  
(IL=170mADC  
)
(IL=170mADC)  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.634  
0.632  
0.630  
0.628  
0.626  
0.624  
0.622  
IF=50mA  
IF=30mA  
IF=20mA  
IF=10mA  
IF=5mA  
0
5
10 15 20 25 30 35 40 45 50  
-40 -20  
0
20  
40  
60  
80 100 120  
0
5
10 15 20 25 30 35 40 45 50  
LED Forward Current (mA)  
Temperature (ºC)  
LED Forward Current (mA)  
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application  
department.  
R08  
www.ixysic.com  
3
LBB120  
INTEGRATED  
CIRCUITS  
DIVISION  
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*  
Typical Turn-On Time  
vs.Temperature  
Typical IF for Switch Operation  
vs.Temperature  
Typical On-Resistance vs.Temperature  
(IF=5mA, IL=170mADC  
(IF=5mA, IL=170mADC  
)
)
(IF=5mA, IL=170mADC  
)
0.12  
0.10  
0.08  
0.06  
0.04  
0.02  
0
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
60  
50  
40  
30  
20  
10  
0
-40  
-20  
0
20  
40  
60  
80  
100  
-40  
-40  
-40  
-20  
0
20  
40  
60  
80  
100  
100  
100  
-40  
-20  
0
20  
40  
60  
80  
100  
Temperature (ºC)  
Temperature (ºC)  
Temperature (ºC)  
Typical Turn-Off Time  
vs.Temperature  
Typical IF for Switch Dropout  
vs.Temperature  
Typical Load Current vs. Load Voltage  
(IF=5mA)  
(IL=170mADC  
)
(IL=170mADC)  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
200  
150  
100  
50  
2.5  
2.0  
1.5  
1.0  
0.5  
0
IF=5mA  
IF=10mA  
IF=20mA  
0
-50  
-100  
-150  
-200  
0
-40  
-20  
0
20  
40  
60  
80  
100  
-20  
0
20  
40  
60  
80  
-2.0 -1.5 -1.0 -0.5  
0.5 1.0 1.5 2.0  
Load Voltage (V)  
Temperature (ºC)  
Temperature (ºC)  
Maximum Load Current vs.Temperature  
(IF=5mA)  
Typical Blocking Voltage  
vs.Temperature  
Typical Leakage vs.Temperature  
Measured across Pins 5&6 or 7&8  
250  
310  
305  
300  
295  
290  
285  
0.030  
0.025  
0.020  
0.015  
0.010  
0.005  
0
200  
150  
100  
50  
0
-40 -20  
0
20  
40  
60  
80 100 120  
-20  
0
20  
40  
60  
80  
-40  
-20  
0
20  
40  
60  
80  
100  
Temperature (ºC)  
Temperature (ºC)  
Temperature (ºC)  
Energy Rating Curve  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
10Ps 100Ps 1ms 10ms 100ms 1s  
10s 100s  
Time  
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application  
department.  
R08  
4
www.ixysic.com  
LBB120  
INTEGRATED  
CIRCUITS  
DIVISION  
Manufacturing Information  
Moisture Sensitivity  
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated  
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to  
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product  
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper  
operation of our devices when handled according to the limitations and information in that standard as well as to any  
limitations set forth in the information or standards referenced below.  
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced  
product performance, reduction of operable life, and/or reduction of overall reliability.  
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according  
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.  
Device  
Moisture Sensitivity Level (MSL) Rating  
LBB120 / LBB120S  
MSL 1  
ESD Sensitivity  
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.  
Reflow Profile  
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020  
must be observed.  
Device  
MaximumTemperature xTime  
LBB120 / LBB120S  
250ºC for 30 seconds  
Board Wash  
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to  
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as  
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary  
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.  
Cleaning methods that employ ultrasonic energy should not be used.  
Pb  
e3  
R08  
www.ixysic.com  
5
LBB120  
INTEGRATED  
CIRCUITS  
DIVISION  
MECHANICAL DIMENSIONS  
LBB120  
9.652 0.381  
(0.380 0.015)  
PCB Hole Pattern  
7.620 0.254  
(0.300 0.010)  
2.540 0.127  
(0.100 0.005)  
8-0.800 DIA.  
2.540 0.127  
(0.100 0.005)  
(8-0.031 DIA.)  
9.144 0.508  
(0.360 0.020)  
6.350 0.127  
(0.250 0.005)  
6.350 0.127  
(0.250 0.005)  
3.302 0.051  
(0.130 0.002)  
Pin 1  
0.457 0.076  
(0.018 0.003)  
7.620 0.127  
(0.300 0.005)  
7.239 TYP.  
(0.285)  
7.620 0.127  
(0.300 0.005)  
4.064 TYP  
(0.160)  
0.254 0.0127  
(0.010 0.0005)  
Dimensions  
0.813 0.102  
mm  
(0.032 0.004)  
(inches)  
LBB120S  
9.652 0.381  
(0.380 0.015)  
PCB Land Pattern  
0.635 0.127  
(0.025 0.005)  
2.540 0.127  
(0.100 0.005)  
3.302 0.051  
(0.130 0.002)  
2.54  
(0.10)  
9.525 0.254  
(0.375 0.010)  
6.350 0.127  
(0.250 0.005)  
8.90  
(0.3503)  
1.65  
(0.0649)  
7.620 0.254  
(0.300 0.010)  
Pin 1  
0.457 0.076  
(0.018 0.003)  
0.254 0.0127  
(0.010 0.0005)  
0.65  
(0.0255)  
4.445 0.127  
(0.175 0.005)  
Dimensions  
mm  
(inches)  
0.813 0.102  
(0.032 0.004)  
R08  
6
www.ixysic.com  
LBB120  
INTEGRATED  
CIRCUITS  
DIVISION  
LBB120STR Tape & Reel  
330.2 DIA.  
(13.00 DIA.)  
W=16.00  
(0.63)  
Top Cover  
Tape Thickness  
0.102 MAX.  
(0.004 MAX.)  
Bo=10.30  
(0.406)  
Ao=10.30  
(0.406)  
P=12.00  
(0.472)  
K0=4.90  
(0.193)  
K1=4.20  
(0.165)  
User Direction of Feed  
Dimensions  
mm  
Embossed Carrier  
(inches)  
NOTES:  
1. Dimensions carry tolerances of EIA Standard 481-2  
Embossment  
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2  
For additional information please visit our website at: www.ixysic.com  
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make  
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated  
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to  
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.  
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other  
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe  
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.  
Specification: DS-LBB120-R08  
©Copyright 2012, IXYS Integrated Circuits Division  
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division  
All rights reserved. Printed in USA.  
12/22/2012  
7

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