LCB127S [IXYS]

Single-Pole, Normally Closed OptoMOS Relay; 单极,常闭继电器OptoMOS
LCB127S
型号: LCB127S
厂家: IXYS CORPORATION    IXYS CORPORATION
描述:

Single-Pole, Normally Closed OptoMOS Relay
单极,常闭继电器OptoMOS

光电 继电器 固态继电器 输出元件
文件: 总7页 (文件大小:159K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LCB127  
Single-Pole, Normally Closed  
OptoMOS® Relay  
INTEGRATED  
CIRCUITS  
DIVISION  
Description  
Parameter  
Blocking Voltage  
Load Current  
Ratings  
250  
Units  
The LCB127 is a 250V, 200mA, 10, single-pole,  
normally closed (1-Form-B) Solid State Relay that  
features enhanced peak load current capability. It  
employs optically coupled MOSFET technology to  
provide 3750Vrms of input to output isolation.  
VP  
mArms / mADC  
200  
On-Resistance (max)  
10  
Features  
3750Vrms Input/Output Isolation  
Low Drive Power Requirements  
TTL/CMOS Compatible  
Its optically coupled outputs, which use the patented  
OptoMOS architecture, are controlled by a highly  
efficient GaAIAs infrared LED.  
High Reliability  
Arc-Free With No Snubbing Circuits  
FCC Compatible  
VDE Compatible  
No EMI/RFI Generation  
Small 6-Pin Package  
This OptoMOS relay provides a more compact design  
solution than discrete single-pole relays in a variety of  
applications, and saves board space over conventional  
electromechanical relays.  
Approvals  
Machine Insertable, Wave Solderable  
Surface Mount Tape & Reel Versions Available  
UL Recognized Component: File E76270  
CSA Certified Component: Certificate 1175739  
EN/IEC 60950-1 Certified Component:  
TUV Certificate B 09 07 49410 006  
Applications  
Telecommunications  
Telecom Switching  
Tip/Ring Circuits  
Modem Switching (Laptop, Notebook, Pocket Size)  
Hook Switch  
Ordering Information  
Part #  
Description  
LCB127  
6-Pin DIP (50/Tube)  
LCB127S  
LCB127STR  
6-Pin Surface Mount (50/Tube)  
6-Pin Surface Mount (1,000/Reel)  
Dial Pulsing  
Ground Start  
Ringing Injection  
Instrumentation  
Multiplexers  
Data Acquisition  
Electronic Switching  
I/O Subsystems  
Meters (Watt-Hour, Water, Gas)  
Medical Equipment-Patient/Equipment Isolation  
Security  
Aerospace  
Industrial Controls  
Pin Configuration  
AC/DC Configuration  
1
2
3
6
5
4
+ Control  
– Control  
Load  
Do Not Use  
Load  
Do Not Use  
DC Only Configuration  
1
2
3
6
5
4
+ Control  
– Control  
+ Load  
– Load  
Do Not Use  
Switching Characteristics  
of Normally Closed Devices  
Form-B  
IF  
ILOAD  
90%  
10%  
t
t
on  
Pb  
off  
e3  
DS-LCB127-R05  
1
www.ixysic.com  
LCB127  
INTEGRATED  
CIRCUITS  
DIVISION  
Absolute Maximum Ratings @ 25ºC  
Absolute Maximum Ratings are stress ratings. Stresses in  
excess of these ratings can cause permanent damage to  
the device. Functional operation of the device at conditions  
beyond those indicated in the operational sections of this  
data sheet is not implied.  
Parameter  
Ratings  
Units  
VP  
Blocking Voltage  
250  
Reverse Input Voltage  
Input Control Current  
Peak (10ms)  
5
50  
V
mA  
A
1
Input Power Dissipation 1  
Total Power Dissipation 2  
Isolation Voltage, Input to Output  
Operational Temperature  
Storage Temperature  
150  
mW  
mW  
Vrms  
°C  
800  
3750  
-40 to +85  
-40 to +125 °C  
1
Derate linearly 1.33 mW / ºC  
Derate linearly 6.67 mW / ºC  
2
Electrical Characteristics @ 25ºC  
Parameter  
Conditions  
Symbol  
Min  
Typ  
Max  
Units  
Output Characteristics  
Load Current  
Continuous, AC/DC Configuration 1  
Continuous, DC Configuration  
Peak  
-
IL  
IL  
-
-
-
-
-
-
200  
300  
mArms / mADC  
mADC  
t =10ms  
ILPK  
±±00  
mAP  
On-Resistance  
AC/DC Configuration  
DC Configuration  
IL=200mA  
IL=300mA  
VL=250VP  
-
-
-
8
2
-
10  
3
RON  
Off-State Leakage Current  
Switching Speeds  
ILEAK  
1
A  
Turn-On  
ton  
toff  
-
-
-
-
-
5
5
-
IF=5mA, VL=10V  
VL=50V, f=1MHz  
ms  
pF  
Turn-Off  
Output Capacitance  
Input Characteristics  
Input Control Current to Activate  
Input Control Current to Deactivate  
Input Voltage Drop  
COUT  
50  
IL=200mA  
-
IF  
IF  
-
-
5
-
mA  
mA  
V
0.±  
0.9  
-
0.7  
1.2  
-
IF=5mA  
VR=5V  
VF  
IR  
1.±  
10  
Reverse Input Current  
Common Characteristics  
Input to Output Capacitance  
A  
-
CI/O  
-
3
-
pF  
R05  
2
www.ixysic.com  
LCB127  
INTEGRATED  
CIRCUITS  
DIVISION  
PERFORMANCE DATA* (@25ºC Unless Otherwise Noted)  
Typical LED Forward Voltage Drop  
(N=50)  
Typical Turn-Off Time  
(N=50, IF=5mA, IL=170mADC)  
Typical Turn-On Time  
(N=50, IF=5mA, IL=200mADC  
)
25  
20  
15  
10  
5
35  
30  
25  
20  
15  
10  
5
25  
20  
15  
10  
5
0
0
0
0.03 0.05  
0.07  
0.09  
0.11  
0.13  
1.17  
1.19  
1.21  
1.23  
1.25  
0.75  
1.05  
1.35  
1.65  
1.95  
2.25  
Turn-On Time (ms)  
LED Forward Voltage Drop (V)  
Turn-Off Time (ms)  
Typical IF for Switch Dropout  
(N=50, IL=170mADC  
Typical On-Resistance Distribution  
(N=50, IF=5mA, IL=200mADC  
Typical IF for Switch Operation  
(N=50, IL=200mADC  
)
)
)
25  
20  
15  
10  
5
25  
20  
15  
10  
5
25  
20  
15  
10  
5
0
0
0
5.325 5.495 5.665 5.835 6.005 6.175  
1.0  
1.4  
1.8  
2.2  
2.6  
3.0  
1.4  
1.8  
2.2  
2.6  
3.0  
3.4  
On-Resistance (:)  
LED Current (mA)  
LED Current (mA)  
Typical Blocking Voltage Distribution  
(N=50)  
25  
20  
15  
10  
5
0
310  
314  
318  
322  
326  
330  
Blocking Voltage (VP)  
Typical Turn-On Time  
vs. LED Forward Current  
Typical Turn-Off Time  
vs. LED Forward Current  
Typical LED Forward Voltage Drop  
vs.Temperature  
(IL=200mADC  
)
(IL=200mADC  
)
0.06  
0.05  
0.04  
0.03  
0.02  
0.01  
0
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
I =50mA  
IF=30mA  
IF=20mA  
IF=10mA  
IFF=5mA  
0
5
10 15 20 25 30 35 40 45 50  
-40 -20  
0
20  
40  
60  
80 100 120  
0
5
10 15 20 25 30 35 40 45 50  
LED Forward Current (mA)  
Temperature (ºC)  
LED Forward Current (mA)  
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application  
department.  
R05  
www.ixysic.com  
3
LCB127  
INTEGRATED  
CIRCUITS  
DIVISION  
PERFORMANCE DATA* (@25ºC Unless Otherwise Noted)  
Typical Turn-On Time  
vs.Temperature  
Typical Turn-Off Time  
vs.Temperature  
Typical On-Resistance  
vs.Temperature  
(IF=5mA, IL=200mADC  
)
(IL=200mADC  
)
(IF=5mA, IL=200mADC)  
0.12  
0.10  
0.08  
0.06  
0.04  
0.02  
0
2.5  
2.0  
1.5  
1.0  
0.5  
0
8
7
6
5
4
3
2
1
0
IF=5mA  
IF=10mA  
IF=20mA  
-40  
-40  
-1.0  
-20  
0
20  
40  
60  
80  
100  
100  
1.0  
-40  
-40  
-40  
-20  
0
20  
40  
60  
80  
100  
-40  
-20  
0
20  
40  
60  
80  
100  
Temperature (ºC)  
Temperature (ºC)  
Temperature (ºC)  
Typical IF for Switch Operation  
vs.Temperature  
Typical IF for Switch Dropout  
vs.Temperature  
Maximum Load Current  
vs.Temperature  
(IF=5mA)  
(IL=200mADC  
)
(IL=200mADC)  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
250  
200  
150  
100  
50  
0
-20  
0
20  
40  
60  
80  
100  
-20  
0
20  
40  
60  
80  
-40 -20  
0
20  
40  
60  
80 100 120  
Temperature (ºC)  
Temperature (ºC)  
Temperature (ºC)  
Typical Load Current  
vs. Load Voltage  
(IF=5mA)  
Typical Blocking Voltage  
vs.Temperature  
Typical Leakage vs.Temperature  
Measured across Pins 4&6  
400  
350  
300  
250  
200  
150  
100  
50  
0.045  
0.040  
0.035  
0.030  
0.025  
0.020  
0.015  
0.010  
0.005  
0
200  
150  
100  
50  
0
-50  
-100  
-150  
-200  
0
-20  
0
20  
40  
60  
80  
100  
-40  
-20  
0
20  
40  
60  
80  
100  
-0.8 -0.6 -0.4 -0.2  
0
0.2 0.4 0.6 0.8  
Temperature (ºC)  
Temperature (ºC)  
Load Voltage (V)  
Energy Rating Curve  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
10Ps 100Ps 1ms 10ms 100ms 1s  
10s 100s  
Time  
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application  
department.  
R05  
4
www.ixysic.com  
LCB127  
INTEGRATED  
CIRCUITS  
DIVISION  
Manufacturing Information  
Moisture Sensitivity  
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated  
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to  
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product  
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper  
operation of our devices when handled according to the limitations and information in that standard as well as to any  
limitations set forth in the information or standards referenced below.  
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced  
product performance, reduction of operable life, and/or reduction of overall reliability.  
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according  
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.  
Device  
Moisture Sensitivity Level (MSL) Rating  
LCB127 / LCB127S  
MSL 1  
ESD Sensitivity  
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.  
Reflow Profile  
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020  
must be observed.  
Device  
MaximumTemperature xTime  
LCB127 / LCB127S  
250ºC for 30 seconds  
Board Wash  
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to  
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as  
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary  
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.  
Cleaning methods that employ ultrasonic energy should not be used.  
Pb  
e3  
R05  
www.ixysic.com  
5
LCB127  
INTEGRATED  
CIRCUITS  
DIVISION  
MECHANICAL DIMENSIONS  
LCB127  
8.382 0.381  
(0.330 0.015)  
PCB Hole Pattern  
7.239 TYP  
2.54 0.127  
(0.285 TYP)  
(0.100 0.005)  
6 - 0.800 DIA.  
(6 - 0.031 DIA.)  
2.540 0.127  
(0.100 0.005)  
9.144 0.508  
(0.360 0.020)  
6.350 0.127  
(0.250 0.005)  
7.620 0.127  
(0.300 0.005)  
7.620 0.254  
(0.300 0.010)  
Pin 1  
0.254 0.0127  
(0.010 0.0005)  
1.651 0.254  
(0.065 0.010)  
6.350 0.127  
(0.250 0.005)  
5.080 0.127  
(0.200 0.005)  
3.302 0.051  
(0.130 0.002)  
4.064 TYP  
(0.160 TYP)  
Dimensions  
mm  
(inches)  
0.457 0.076  
(0.018 0.003)  
LCB127S  
0.635 0.127  
(0.025 0.005)  
PCB Land Pattern  
8.382 0.381  
(0.330 0.015)  
2.54 0.127  
(0.100 0.005)  
2.54  
(0.10)  
9.524 0.508  
(0.375 0.020)  
6.350 0.127  
(0.250 0.005)  
8.90  
(0.3503)  
1.65  
7.620 0.254  
(0.300 0.010)  
0.254 0.0127  
(0.010 0.0005)  
(0.0649)  
0.457 0.076  
(0.018 0.003)  
Pin 1  
1.651 0.254  
(0.065 0.010)  
0.65  
3.302 0.051  
(0.130 0.002)  
(0.0255)  
4.445 0.254  
(0.175 0.010)  
Dimensions  
mm  
(inches)  
1.651 0.254  
(0.065 0.010)  
R05  
6
www.ixysic.com  
LCB127  
INTEGRATED  
CIRCUITS  
DIVISION  
LCB127STR Tape & Reel  
330.2 Dia  
(13.00 Dia)  
Top Cover  
Tape Thickness  
0.102 Max  
W=16.00  
(0.63)  
B0 = 10.10  
(0.398)  
(0.004 Max)  
A0 = 10.10  
(0.398)  
P = 12.00  
(0.472)  
K0 = 4.90  
(0.19)  
K1 = 3.80  
(0.15)  
Dimensions  
mm  
(inches)  
User Direction of Feed  
Embossed  
Carrier  
NOTES:  
1. All dimensions carry tolerances of EIA Standard 481-2  
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2  
Embossment  
For additional information please visit our website at: www.ixysic.com  
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make  
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated  
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to  
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.  
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other  
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe  
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.  
Specification: DS-LCB127-R05  
©Copyright 2012, IXYS Integrated Circuits Division  
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division  
All rights reserved. Printed in USA.  
7
12/22/2012  

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