LOC117 [IXYS]

Transistor Output Optocoupler, 1-Element, 3750V Isolation, ROHS COMPLIANT, DIP-8;
LOC117
型号: LOC117
厂家: IXYS CORPORATION    IXYS CORPORATION
描述:

Transistor Output Optocoupler, 1-Element, 3750V Isolation, ROHS COMPLIANT, DIP-8

输出元件 光电
文件: 总6页 (文件大小:126K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LOC117  
Linear Optocoupler  
INTEGRATED  
CIRCUITS  
DIVISION  
Parameter  
LED Operating Range  
Rating  
2-10  
Units  
mA  
Description  
The LOC117 Single Linear Optocoupler features an  
infrared LED optically coupled with two photodiodes.  
One feedback (input) photodiode is used to generate  
a control signal that provides a servomechanism  
to the LED drive current, thus compensating  
for the LED's nonlinear time and temperature  
characteristics. The other (output) photodiode  
provides an output signal that is linear with respect  
to the servo LED current. The product features  
wide bandwidth, high input to output isolation, and  
excellent servo linearity.  
K3, Transfer Gain  
0.887-1.072  
3750  
-
Isolation, Input to Output  
Vrms  
Features  
0.01% Servo Linearity  
THD -87dB Typical  
Wide Bandwidth (>200kHz)  
Couples Analog and Digital Signals  
High Gain Stability  
Low Input-to-Output Capacitance  
Low Power Consumption  
Approvals  
UL Recognized Component: File E76270  
CSA Certified Component: File 043639  
Certified to:  
VDE Compatible  
Small 8-Pin Package  
Flatpack Package (PCMCIA Compatible)  
Machine Insertable, Wave Solderable  
Surface Mount and Tape & Reel Versions Available  
EN 60950-1/A 12: 2011  
TUV Certificate B 12 11 82667 002  
Applications  
Modem Transformer Replacement With No  
Insertion Loss  
Digital Telephone Isolation  
Power Supply Feedback Voltage/Current  
Medical Sensor Isolation  
Ordering Information  
Part #  
LOC117  
Description  
8-Pin DIP (50/tube)  
LOC117P  
LOC117PTR  
LOC117S  
LOC117STR  
8-Pin Flatpack (50/tube)  
8-Pin Flatpack (1000/Reel)  
8-Pin Surface Mount (50/tube)  
8-Pin Surface Mount (1000/Reel)  
Audio Signal Interfacing  
Isolation of Process Control Transducers  
Pin Configuration  
1
8
- LED  
N/C  
N/C  
C2  
2
7
6
+ LED  
3
C1  
4
5
A1  
A2  
DS-LOC117-R03  
1
www.ixysic.com  
LOC117  
INTEGRATED  
CIRCUITS  
DIVISION  
Absolute Maximum Ratings @ 25ºC  
Absolute Maximum Ratings are stress ratings. Stresses in  
excess of these ratings can cause permanent damage to  
the device. Functional operation of the device at conditions  
beyond those indicated in the operational sections of this  
data sheet is not implied.  
Parameter  
Ratings  
Units  
Reverse Input Voltage  
Input Control Current  
Peak (10ms)  
5
V
100  
mA  
A
1
Input Power Dissipation 1  
Total Package Dissipation 2  
Isolation Voltage, Input to Output  
Operational Temperature  
Storage Temperature  
150  
mW  
mW  
Vrms  
ºC  
500  
3750  
-40 to +85  
-40 to +125  
ºC  
1 Derate linearly 1.33 mW / °C  
2 Derate linearly 6.67 mW / ºC  
Electrical Characteristics @ 25ºC  
Parameter  
Conditions  
Symbol  
Min  
Typ  
Max  
Units  
Input Characteristics  
LED Voltage Drop  
IF=2 - 10mA  
VR=5V  
VF  
IR  
0.9  
-
1.2  
-
1.4  
10  
V
Reverse LED Current  
µA  
Coupler/Detector Characteristics  
Dark Current  
IF=0mA, VC1-A1= VC2-A2 =15V  
ID  
K1  
-
1
-
25  
nA  
-
K1, Servo Gain (IC1/IF)  
0.008  
0.030  
K2, Forward Gain (IC2/IF)  
IF=2 - 10mA, VC1-A1=VC2-A2=15V  
K2  
0.006  
-
0.030  
-
K3, Transfer Gain (K2 / K1 = IC2 / IC1)  
K3, Transfer Gain Linearity (non-servoed)  
K3 Temperature Coefficient  
Common Mode Rejection Ratio  
Total Harmonic Distortion  
Frequency Response 1  
K3  
0.887  
1
1.072  
-
IF=2 - 10mA  
K3  
K3/T  
CMRR  
THD  
-
-
1
%
IF=2 - 10mA, VC1-A1=VC2-A2=5V  
V=20VP-P , RL=2K, f=100Hz  
f0=350Hz, 0dBm  
-
0.005  
130  
-87  
200  
40  
-
% / ºC  
dB  
dB  
kHz  
kHz  
-
-96  
-
-
-80  
-
Photoconductive Configuration  
Photovoltaic Configuration  
f-3dB  
-
-
Common Characteristics  
Input/Output Capacitance  
-
CI/O  
-
3
-
pF  
1 Refer to Application Note, AN-107, for LOC117 configurations.  
R03  
2
www.ixysic.com  
LOC117  
INTEGRATED  
CIRCUITS  
DIVISION  
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*  
LED Forward Current  
vs. LED Forward Voltage  
LED Forward Current  
vs. LED Forward Voltage  
Typical LED Forward Voltage Drop  
vs.Temperature  
1.6  
1.5  
1.4  
1.3  
1.2  
1.1  
1.0  
100  
10  
60  
50  
40  
30  
20  
10  
0
IF=50mA  
IF=20mA  
IF=10mA  
1
IF=5mA  
IF=2mA  
IF=1mA  
0.1  
0.01  
1.0  
1.1  
1.2  
1.3  
1.4  
1.5  
1.0  
1.1  
1.2  
1.3  
1.4  
1.5  
-40  
-20  
0
20  
40  
60  
80  
100  
LED Forward Voltage (V)  
Temperature (ºC)  
LED Forward Voltage (V)  
Normalized Servo-Photocurrent  
vs. LED Current & Temperature  
Servo Gain  
vs. LED Current & Temperature  
Servo-Photocurrent  
vs. LED Current & Temperature  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
0.016  
0.012  
0.008  
0.004  
0.000  
140  
120  
100  
80  
0ºC  
0ºC  
25ºC  
0ºC  
25ºC  
25ºC  
50ºC  
70ºC  
85ºC  
50ºC  
70ºC  
85ºC  
50ºC  
70ºC  
85ºC  
60  
40  
20  
0
0
2
4
6
8
10  
12  
0
2
4
6
8
10  
12  
0
2
4
6
8
10  
12  
LED Current (mA)  
LED Current (mA)  
LED Current (mA)  
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please  
contact our application department.  
R03  
www.ixysic.com  
3
LOC117  
INTEGRATED  
CIRCUITS  
DIVISION  
Manufacturing Information  
Moisture Sensitivity  
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated  
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to  
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product  
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper  
operation of our devices when handled according to the limitations and information in that standard as well as to any  
limitations set forth in the information or standards referenced below.  
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced  
product performance, reduction of operable life, and/or reduction of overall reliability.  
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according  
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.  
Device  
Moisture Sensitivity Level (MSL) Rating  
LOC117 / LOC117P / LOC117S  
MSL 1  
ESD Sensitivity  
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.  
Reflow Profile  
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020  
must be observed.  
Device  
MaximumTemperature xTime  
LOC117 / LOC117S  
LOC117P  
250ºC for 30 seconds  
260ºC for 30 seconds  
Board Wash  
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to  
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as  
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary  
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.  
Cleaning methods that employ ultrasonic energy should not be used.  
R03  
4
www.ixysic.com  
LOC117  
INTEGRATED  
CIRCUITS  
DIVISION  
Mechanical Dimensions  
LOC117  
9.652 0.381  
(0.380 0.015)  
PCB Hole Pattern  
7.620 0.254  
(0.300 0.010)  
2.540 0.127  
(0.100 0.005)  
8-0.800 DIA.  
2.540 0.127  
(8-0.031 DIA.)  
(0.100 0.005)  
9.144 0.508  
(0.360 0.020)  
6.350 0.127  
(0.250 0.005)  
6.350 0.127  
(0.250 0.005)  
3.302 0.051  
Pin 1  
0.457 0.076  
(0.018 0.003)  
(0.130 0.002)  
7.620 0.127  
(0.300 0.005)  
7.239 TYP.  
(0.285)  
7.620 0.127  
(0.300 0.005)  
4.064 TYP  
(0.160)  
0.254 0.0127  
(0.010 0.0005)  
Dimensions  
0.813 0.102  
mm  
(0.032 0.004)  
(inches)  
LOC117P  
2.286 MAX.  
(0.090 MAX.)  
PCB Land Pattern  
0 MIN / 0.102 MAX  
(0 MIN / 0.004 MAX)  
2.540 0.127  
(0.100 0.005)  
2.54  
(0.10)  
0.635 0.127  
(0.025 0.005)  
7.620 0.254  
(0.300 0.010)  
6.350 0.127  
(0.250 0.005)  
9.398 0.127  
(0.370 0.005)  
8.70  
(0.3425)  
1.55  
(0.0610)  
Pin 1  
0.203 0.013  
(0.008 0.0005)  
9.652 0.381  
(0.380 0.015)  
0.65  
(0.0255)  
2.159 0.025  
(0.085 0.001)  
0.457 0.076  
(0.018 0.003)  
Dimensions  
mm  
0.864 0.120  
(0.034 0.004)  
(inches)  
LOC117S  
9.652 0.381  
(0.380 0.015)  
PCB Land Pattern  
0.635 0.127  
(0.025 0.005)  
2.540 0.127  
(0.100 0.005)  
3.302 0.051  
(0.130 0.002)  
2.54  
(0.10)  
9.525 0.254  
(0.375 0.010)  
6.350 0.127  
(0.250 0.005)  
8.90  
(0.3503)  
1.65  
(0.0649)  
7.620 0.254  
(0.300 0.010)  
Pin 1  
0.457 0.076  
(0.018 0.003)  
0.254 0.0127  
(0.010 0.0005)  
0.65  
(0.0255)  
4.445 0.127  
(0.175 0.005)  
Dimensions  
mm  
(inches)  
0.813 0.102  
(0.032 0.004)  
R03  
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5
LOC117  
INTEGRATED  
CIRCUITS  
DIVISION  
LOC117PTR Tape & Reel  
2.00  
(0.079)  
4.00  
(0.157)  
330.2 DIA.  
(13.00 DIA.)  
W = 16.00  
(0.63)  
7.50  
(0.295)  
Top Cover  
Tape Thickness  
0.102 MAX.  
(0.004 MAX.)  
Bo = 10.30  
(0.406)  
P = 12.00  
(0.472)  
Ao = 10.30  
(0.406)  
K0 = 2.70  
(0.106)  
Dimensions  
mm  
(inches)  
K1 = 2.00  
(0.079)  
User Direction of Feed  
Embossed Carrier  
NOTES:  
1. All dimensions carry tolerances of EIA Standard 481-2  
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2  
Embossment  
LOC117STR Tape & Reel  
330.2 DIA.  
(13.00 DIA.)  
W=16.00  
(0.63)  
Top Cover  
Tape Thickness  
0.102 MAX.  
(0.004 MAX.)  
Bo=10.30  
(0.406)  
Ao=10.30  
(0.406)  
P=12.00  
(0.472)  
K0=4.90  
(0.193)  
K1=4.20  
(0.165)  
User Direction of Feed  
Dimensions  
mm  
Embossed Carrier  
(inches)  
NOTES:  
1. Dimensions carry tolerances of EIA Standard 481-2  
Embossment  
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2  
For additional information please visit our website at: www.ixysic.com  
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make  
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated  
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to  
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.  
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other  
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe  
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.  
Specification: DS-LOC117-R03  
©Copyright 2013, IXYS Integrated Circuits Division  
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division  
All rights reserved. Printed in USA.  
12/20/2013  
6

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