PDM4M3120S15M [IXYS]

SRAM Module, 1MX32, 15ns, CMOS, SIMM-72;
PDM4M3120S15M
型号: PDM4M3120S15M
厂家: IXYS CORPORATION    IXYS CORPORATION
描述:

SRAM Module, 1MX32, 15ns, CMOS, SIMM-72

静态存储器
文件: 总10页 (文件大小:108K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PRELIMINARY  
PDM4M3120  
3.3V, 1M x 32 CMOS  
Static RAM Module  
1
The PDM4M3120 is packaged in a 72-pin FR-4 ZIP  
(Zig-zag In-line vertical Package) or a 72-pin SIMM or  
Angled SIMM (Single In-line Memory Module). The  
Features  
High-density 3.3V, 4 megabyte Static RAM  
module  
Low profile 72-pin ZIP (Zig-zag In-line vertical  
Package) or 72-pin SIMM or Angled SIMM  
(Single In-line Memory Module)  
Fast access time: 12 ns (max.)  
Surface mounted plastic components on an  
epoxy laminate (FR-4) substrate.  
Single 3.3V (±10%) power supply  
Multiple V pins and decoupling capacitors for  
maximum noise immunity  
Inputs/ outputs directly TTL compatible  
ZIP configuration allows 72 pins to be placed on a 2  
package 3.950" long and 0.365" wide. At only 0.590"  
high, this low-profile package is ideal for systems  
with minimum board spacing. The SIMM configura-  
tion allows use of edge mounted sockets to secure the 3  
module.  
All inputs and outputs of the PDM4M3120 are TTL  
compatible and operate from a single 3.3V supply.  
Full asynchronous circuitry requires no clock or  
refresh for operation and provides equal access and  
cycle times for ease of use.  
SS  
4
Four identification pins (PD0, PD1, PD2, PD3) are pro-  
vided for applications in which different density  
versions of the module are used. In this way, the tar-  
5
Description  
The PDM4M3120 is a 3.3V, 1M x 32 static RAM  
module constructed on an epoxy laminate (FR-4)  
substrate using eight 1M x 4 static RAMs in plastic  
SOJ packages. Availability of four chip select lines  
(one for each of four RAMs) provides byte access.  
The PDM4M3120 is available with access times as  
fast as 12 ns with minimal power consumption.  
get system can read the respective levels of PD0, PD1, 6  
PD2, PD3 to determine a 1M depth.  
7
9
Functional Block Diagram  
CS1  
CS2  
CS3  
CS4  
20  
ADDRESS  
WE  
4
10  
11  
12  
PD3-PD0  
1M x 32  
RAM  
OE  
8
8
8
8
I/O31-I/O0  
Rev 1.1  
1
PRELIMINARY  
PDM4M3120  
Pin Configuration(1)  
Pin Assignment  
Pin  
Signal  
1
3
NC  
PD0 - Vss  
I/O31-I/O0  
A19-A0  
CS4-CS1  
WE  
Data Inputs/Outputs  
Addresses  
2
NC  
PD3  
PD0  
I/O0  
I/O1  
I/O2  
I/O3  
Vcc  
A7  
PD2  
Vss  
PD1 - NC  
PD2 - Vss  
PD3 - NC  
4
5
Chip Selects  
Write Enable  
Output Enable  
Depth Identification  
Power  
6
7
PD1  
I/O8  
I/O9  
I/O10  
I/O11  
A0  
8
9
OE  
10  
12  
14  
16  
18  
20  
22  
24  
26  
28  
30  
32  
34  
36  
11  
13  
15  
17  
19  
21  
23  
25  
27  
29  
31  
33  
35  
PD3-PD0  
V
V
CC  
SS  
Ground  
A1  
A8  
A2  
A9  
I/O12  
I/O13  
I/O14  
I/O15  
Vss  
I/O4  
I/O5  
I/O6  
I/O7  
WE  
A15  
CS2  
A14  
CS1  
ZIP, SIMM  
TOP VIEW  
37  
39  
41  
43  
45  
47  
49  
51  
53  
55  
57  
59  
61  
63  
65  
67  
69  
71  
CS4  
A17  
OE  
38  
40  
42  
44  
46  
48  
50  
52  
54  
56  
58  
60  
62  
64  
66  
68  
70  
72  
CS3  
A16  
Vss  
I/O24  
I/O25  
I/O26  
I/O27  
A3  
I/O16  
I/O17  
I/O18  
I/O19  
A10  
A4  
A11  
A5  
A12  
Vcc  
A13  
A6  
I/O20  
I/O21  
I/O22  
I/O23  
Vss  
I/O28  
I/O29  
I/O30  
I/O31  
A18  
NC  
A19  
NC  
NOTE: 1. Pins 3, 4, 6, and 7 (PD0, PD1, PD02, and PD3  
respectively) are read by the user to determine the  
density of the module. If PD0 reads V , PD1 reads  
SS  
NC, PD2 reads V , PD3 reads NC then the mod-  
SS  
ule has a 1M depth.  
2
Rev 1.1  
PRELIMINARY  
PDM4M3120  
Truth Table  
CS  
OE  
WE  
Mode  
Output  
Power  
1
2
Deselect/  
Power-down  
H
X
X
High-Z  
Standby  
Read  
L
L
L
L
X
H
H
L
DATA  
Active  
Active  
Active  
OUT  
Write  
DATA  
IN  
Deselect  
H
High-Z  
3
Absolute Maximum Ratings(1)  
4
Symbol  
Rating  
Terminal Voltage with Respect to V  
Com’l.  
Ind.  
Unit  
V
–0.5 to +4.6  
–10 to +85  
–55 to +125  
0 to +70  
1.0  
–0.5 to +4.6  
–10 to +85  
–65 to +150  
–40 to +85  
1.0  
V
TERM  
SS  
T
Temperature Under Bias  
Storage Temperature  
Operating Temperature  
Power Dissipation  
°C  
°C  
°C  
W
BIAS  
5
T
STG  
T
A
P
T
6
I
DC Output Current  
50  
50  
mA  
OUT  
NOTE: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent  
damage to the device.This is a stress rating only and functional operation of the device at these or  
any other conditions above those indicated in the operational sections of this specification is not  
implied. Exposure to absolute maximum rating conditions for extended periods may affect  
reliability.  
7
Recommended DC Operating Conditions  
Symbol  
Parameter  
Min.  
Typ.  
Max.  
Unit  
9
V
V
Supply Voltage  
3.0  
0
3.3  
0
3.6  
0
V
CC  
Supply Voltage  
V
SS  
Commercial  
Industrial  
Ambient Temperature  
Ambient Temperature  
0
25  
25  
70  
85  
°C  
°C  
10  
11  
12  
–40  
Rev 1.1  
3
PRELIMINARY  
PDM4M3120  
DC Electrical Characteristics (V = 3.3V ± 10%, T = 0°C to 70°C)  
CC  
A
Symbol  
Parameter  
Test Conditions  
Min.  
Max.  
Unit  
I
I
I
Input Leakage Current  
(Address)  
V
V
V
= Max.,V = V to V  
CC  
80  
µA  
LI  
CC  
IN  
SS  
Input Leakage Current  
(Data)  
= Max., V = V to V  
CC  
10  
10  
µA  
µA  
LI  
CC  
IN  
SS  
Output Leakage Current  
= V to V , V = Max.,  
SS CC CC  
LO  
OUT  
CS = V  
IH  
V
V
V
V
Output Low Voltage  
Output High Voltage  
Input High Voltage  
Input Low Voltage  
I
I
= 8 mA, V = Min.  
2.4  
2.2  
0.4  
V
V
V
V
OL  
OH  
IH  
OL  
OL  
CC  
= –4 mA, V = Min.  
CC  
6.0  
0.8  
(1)  
–0.5  
IL  
NOTE 1.  
V = –1.5V for pulse widths less than 10 ns, once per cycle.  
IL  
Power Supply Characteristics  
(1)  
Symbol  
Parameter  
Max  
Unit  
I
I
I
Operating Current  
900  
200  
85  
mA  
CC  
SB  
CS = V , V = Max., f = f , Outputs Open  
IL  
CC  
MAX  
Standby Current  
CS V , V = Max., f = f , Outputs Open  
MAX  
mA  
mA  
IH  
CC  
Full Standby CurrentCS V – 0.2V,  
SB1  
CC  
f = 0, V > V – 0.2V or < 0.2V, Outputs Open  
IN  
CC  
NOTE 1. Preliminary specification only.  
Capacitance(1) (T = +25°C, f = 1.0 MHz)  
A
Symbol  
Parameter  
Data I/O Capacitance, V = 0V  
Max.  
Unit  
C
15  
60  
75  
20  
pF  
pF  
pF  
pF  
I/O  
IN  
C
Input Capacitance, (Address) V = 0V  
IN  
IN(1)  
C
Input Capacitance, (WE, OE) V = 0V  
IN  
IN(2)  
C
Input Capacitance, (CS), V = 0V  
IN  
IN(3)  
NOTE 1. This parameter is determined by device characteristics but is not production tested.  
4
Rev 1.1  
PRELIMINARY  
PDM4M3120  
AC Test Conditions  
Input Pulse Levels  
V
to 3.0V  
SS  
Input Rise/Fall Times  
Input Timing Reference Levels  
Output Reference Levels  
Output Load  
2.5 ns  
1
2
1.5V  
1.5V  
See Figures 1 and 2  
3
+3.3V  
+3.3V  
317Ω  
317Ω  
4
DATAOUT  
351Ω  
DATAOUT  
351Ω  
5 pF*  
30 pF*  
5
* Including scope and jig capacitances  
* Including scope and jig capacitances  
6
Figure 2. Output Load  
(for tOHZ, tCHZ, tOLZ, and tCLZ  
Figure 1. Output Load  
)
7
9
10  
11  
12  
Rev 1.1  
5
PRELIMINARY  
PDM4M3120  
AC Electrical Characteristics (Vcc = 3.3V ± 10%, T = 0°C to +70°C)  
A
PDM4M3120SXXZ, PDM4M3120SXXM  
-20 ns -15 ns -12 ns  
Min. Max. Min. Max. Min. Max.  
Symbol  
Parameter  
Unit  
Read Cycle  
t
t
t
t
t
t
t
t
t
t
t
Read Cycle Time  
20  
15  
12  
ns  
ns  
RC  
Address Access Time  
20  
15  
12  
AA  
Chip Select Access Time  
3
20  
10  
7
3
15  
8
3
12  
7
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ACS  
(1)  
Chip Select to Output inLow-Z  
Output Enable to Output Valid  
Output Enable to Output in Low-Z  
Chip Deselect to Output in High-Z  
Output Disable to Output in High-Z  
Output Hold from Address Change  
Chip Select to Power-Up Time  
Chip Deselect to Power-Down Time  
CLZ  
OE  
0
0
0
(1)  
(1)  
7
7
OLZ  
3
3
3
CHZ  
OHZ  
OH  
(1)  
7
7
7
20  
15  
12  
(1)  
0
0
0
PU  
(1)  
PD  
Write Cycle  
t
t
t
t
t
t
t
t
t
t
Write Cycle Time  
20  
12  
12  
0
15  
10  
10  
0
7
12  
10  
10  
0
7
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
WC  
CW  
AW  
AS  
Chip Select to End of Write  
Address Valid to End of Write  
Address Setup Time  
Write Pulse Width  
15  
3
7
13  
3
12  
3
WP  
WR  
WHZ  
DW  
DH  
Write Recovery Time  
(1)  
Write Enable to Output in High-Z  
Data to Write Time Overlap  
Data Hold from Write Time  
Output Active from End of Write  
12  
0
10  
0
10  
0
(1)  
OW  
0
0
0
NOTE 1. This parameter is determined by device characteristics but is not production tested.  
6
Rev 1.1  
PRELIMINARY  
PDM4M3120  
Timing Waveforms of Read Cycle No.1(1)  
t
RC  
1
2
ADDRESS  
t
AA  
OE  
t
t
OH  
(5)  
OE  
(5)  
t
OLZ  
CS  
3
t
t
OHZ  
ACS  
(5)  
(5)  
t
t
CHZ  
CLZ  
D
OUT  
4
5
Timing Waveforms of Read Cycle No.2(1,2,4)  
t
RC  
6
ADDRESS  
t
AA  
t
t
OH  
OH  
7
D
OUT  
Previous Data Valid  
Data Valid  
Timing Waveforms of Read Cycle No.3(1,3,4)  
9
CS  
t
ACS  
10  
11  
12  
(5)  
(5)  
t
t
CLZ  
CLZ  
D
OUT  
NOTES  
1
WE is HIGH for Read Cycle.  
2. Device is continuously selected. CS = V .  
3. Address valid prior to or coincident with CS transition LOW.  
4. OE = V .  
IL  
IL  
5. Transition is measured ±200 mV for steady state. This parameter is  
determined by device characteristics but is not production tested.  
Rev 1.1  
7
PRELIMINARY  
PDM4M3120  
(1,2,3,7)  
WE  
Timing Waveforms of Write Cycle No.1 (  
Controlled)  
t
WC  
ADDRESS  
OE  
t
AW  
CS  
(7)  
t
t
t
WR  
AS  
WP  
WE  
(6)  
t
WHZ  
(6)  
(6)  
(6)  
t
t
t
OHZ  
OHZ  
OW  
D
OUT  
(4)  
(4)  
t
t
DH  
DW  
D
IN  
Data Valid  
(1,2,3,5)  
CS  
Timing Waveforms of Write Cycle No.2 (  
Controlled)  
t
WC  
ADDRESS  
t
AW  
CS  
t
t
t
WR  
AS  
CW  
WE  
t
t
DH  
DW  
D
IN  
Data Valid  
NOTES  
1
WE orCS must be HIGH during all address transitions.  
2. A write occurs during the overlap (t ) of a LOWCS and a LOWWE.  
WP  
3.  
t
is measured from the earlier ofCS orWE going HIGH to end the write cycle.  
WR  
4. During this period, I/O pins are in the output state, and input signals must be applied.  
5. If the CS LOW transition occurs simultaneously with or after the WE LOW transition, the outputs  
remain in a high-impedance state.  
6. Transition is measured ±200 mV for steady state with a 5 pF load (including scope and jig). This  
parameter is determined by device characteristics but is not production tested.  
7. If OE is LOW during aWE controlled write cycle, the write pulse width must be the larger of t or  
WP  
(t  
+ t ) to allow the I/O drivers to turn off and data to be placed on the bus for the required t  
.
WHZ  
DW  
DW  
If OE is HIGH during aWE controlled write cycle, this requirement does not apply and the write  
pulse width can be as short as the specified t  
.
WP  
8
Rev 1.1  
PRELIMINARY  
PDM4M3120  
Package Dimensions  
ZIP Version  
1
2
SIDE VIEW  
FRONT VIEW  
3.950  
0.365  
0.590  
3
0.125  
0.020  
0.250  
0.100  
0.050  
0.100  
4
PIN 1  
BACK VIEW  
5
6
PIN 1  
7
SIMM Version  
SIDE VIEW  
0.350  
FRONT VIEW  
4.250  
3.984  
9
0.650  
0.400  
0.250  
0.250  
0.050  
PIN 1  
0.050  
10  
11  
12  
0.080  
BACK VIEW  
PIN 1  
Rev 1.1  
9
PRELIMINARY  
PDM4M3120  
Angled SIMM Version  
SIDE VIEW  
4.255  
Max.  
3.988  
3.980  
0.350  
Max.  
COMPONENTS BOTH SIDES  
(NOT SHOWN)  
0.680  
Max.  
0.403  
0.397  
.220 ref  
.130 ref  
0.251  
0.249  
0.255  
0.245  
0.085  
0.075  
PIN 1  
0.050  
Typical  
0.630 R  
0.610 R  
0.255  
0.245  
3.752  
3.748  
Ordering Information  
PDM4M XXXXX  
S
XX  
X
X
Device Power Speed Package Temp  
Blank Commercial (0 to 70°C)  
AM  
M
72-pin Angled SIMM  
72-pin SIMM  
Z
72-pin ZIP  
12  
15  
20  
Commercial  
S
Standard Power  
3120  
1M x 32  
3.3V  
10  
Rev 1.1  

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