XAA117 [IXYS]

Transistor Output SSR, 2-Channel, 3750V Isolation, ROHS COMPLIANT, DIP-8;
XAA117
型号: XAA117
厂家: IXYS CORPORATION    IXYS CORPORATION
描述:

Transistor Output SSR, 2-Channel, 3750V Isolation, ROHS COMPLIANT, DIP-8

输出元件 光电
文件: 总7页 (文件大小:146K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
XAA117  
Dual Single-Pole, Normally Open  
OptoMOS® Relay  
INTEGRATED  
CIRCUITS  
DIVISION  
Parameter  
Blocking Voltage  
Ratings  
Units  
Description  
60  
150  
16  
1
VP  
mArms / mADC  
The XAA117 is a dual, single-pole, normally open  
(1-Form-A) Solid State Relay with two independently  
controlled, optically coupled MOSFET switches that  
feature 3750Vrms of input to output isolation.  
Load Current  
On-Resistance (max)  
LED Current to Operate  
mA  
The optically coupled outputs, which use the  
patented OptoMOS architecture, are controlled by a  
highly efficient GaAIAs infrared LED.  
Features  
Low Input Control Current: 1mA  
3750Vrms Input/Output Isolation  
Low Drive Power Requirements (TTL/CMOS  
Compatible)  
Arc-Free With No Snubbing Circuits  
FCC Compatible  
This dual single-pole OptoMOS relay provides a more  
compact design solution than discrete single-pole  
relays in a variety of applications, and saves board  
space by incorporating both switches in a single 8-Pin  
package.  
VDE Compatible  
No EMI/RFI Generation  
Machine Insertable, Wave Solderable  
Surface Mount Tape & Reel Version Available  
Approvals  
UL Recognized Component: File E76270  
CSA Certified Component: Certificate 1175739  
EN/IEC 60950-1 Compliant  
Applications  
Security  
Passive Infrared Detectors (PIR)  
Data Signaling  
Sensor Circuitry  
Instrumentation  
Multiplexers  
Data Acquisition  
Electronic Switching  
I/O Subsystems  
Ordering Information  
Part #  
XAA117  
Description  
8-Pin DIP (50/Tube)  
XAA117S  
XAA117STR  
XAA117P  
XAA117PTR  
8-Pin Surface Mount (50/Tube)  
8-Pin Surface Mount (1,000/Reel)  
8-Pin Flat Pack (50/Tube)  
8-Pin Flat Pack (1,000/Reel)  
Meters (Watt-Hour, Water, Gas)  
Medical Equipment-Patient/Equipment Isolation  
Security  
Aerospace  
Industrial Controls  
Pin Configuration  
1
8
+ Control - Switch #1  
Load - Switch #1  
2
7
6
– Control - Switch #1  
Load - Switch #1  
Load - Switch #2  
3
+ Control - Switch #2  
4
5
– Control - Switch #2  
Load - Switch #2  
Switching Characteristics of  
Normally Open Devices  
Form-A  
IF  
90%  
10%  
ILOAD  
t
t
off  
on  
Pb  
e3  
DS-XAA117-R03  
1
www.ixysic.com  
XAA117  
INTEGRATED  
CIRCUITS  
DIVISION  
Absolute Maximum Ratings @ 25ºC  
Absolute Maximum Ratings are stress ratings. Stresses in  
excess of these ratings can cause permanent damage to  
the device. Functional operation of the device at conditions  
beyond those indicated in the operational sections of this  
data sheet is not implied.  
Parameter  
Blocking Voltage  
Ratings Units  
60  
VP  
Reverse Input Voltage  
Input Control Current  
Peak (10ms)  
5
50  
V
mA  
A
1
Input Power Dissipation 1  
Total Power Dissipation 2  
Isolation Voltage, Input to Output  
Operational Temperature  
Storage Temperature  
150  
mW  
mW  
Vrms  
°C  
800  
3750  
-±0 to +85  
-±0 to +125  
°C  
1
Derate linearly 1.33 mW / ºC  
Derate linearly 6.67 mW / ºC  
2
Electrical Characteristics @ 25ºC  
Parameter  
Conditions  
Symbol  
Min  
Typ  
Max  
Units  
Output Characteristics  
Load Current  
Continuous 1  
-
IL  
-
-
-
-
-
-
150  
±±00  
16  
mArms / mADC  
Peak  
t =10ms  
IL=150mA  
VL=60VP  
ILPK  
RON  
ILEAK  
mAP  
On-Resistance  
7
-
Off-State Leakage Current  
Switching Speeds  
1
µA  
Turn-On  
ton  
toff  
-
-
-
0.1  
0.5  
25  
5
5
-
IF=5mA, VL=10V  
VL=50V, f=1MHz  
ms  
pF  
Turn-Off  
Output Capacitance  
Input Characteristics  
Input Control Current to Activate  
Input Control Current to Deactivate  
Input Voltage Drop  
Reverse Input Current  
Common Characteristics  
COUT  
IL=150mA  
-
IF  
-
-
0.05  
0.9  
-
-
-
1
-
mA  
mA  
V
IF=5mA  
VR=5V  
VF  
IR  
1.2  
-
1.±  
10  
µA  
Input to Output Capacitance  
1
-
CI/O  
-
3
-
pF  
If both poles operate simultaneously, then the load current must be derated so as not to exceed the package power dissipation value.  
R03  
2
www.ixysic.com  
XAA117  
INTEGRATED  
CIRCUITS  
DIVISION  
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*  
Typical LED Forward Voltage Drop  
(N=50, IF=5mA)  
Typical Turn-On Time  
(N=50, IF=5mA, IL=100mA)  
Typical Turn-Off Time  
(N=50, IF=5mA, IL=100mA)  
35  
30  
25  
20  
15  
10  
5
25  
20  
15  
10  
5
25  
20  
15  
10  
5
0
0
0
1.21  
1.22  
1.23  
1.24  
1.25  
75  
80  
85  
90  
95  
100 105  
0.35 0.40 0.45 0.50 0.55 0.60 0.65  
LED Forward Voltage Drop (V)  
Turn-On Time (Ps)  
Turn-Off Time (ms)  
Typical IF for Switch Operation  
(N=50, IL=100mA)  
Typical On-Resistance Distribution  
(N=50, IL=100mA)  
Typical Blocking Voltage Distribution  
(N=50)  
35  
30  
25  
20  
15  
10  
5
20  
15  
10  
5
25  
20  
15  
10  
5
0
0
0
0.05 0.06 0.07 0.08 0.09 0.10 0.11  
84  
85  
86  
87  
88  
89  
90  
6.8  
6.9  
7.0  
7.1  
7.2  
7.4  
7.3  
On-Resistance (:)  
Blocking Voltage (VP)  
LED Current (mA)  
Typical Turn-On Time  
vs. LED Forward Current  
(IL=100mA)  
Typical Turn-Off Time  
vs. LED Forward Current  
(IL=100mA)  
Typical LED Forward Voltage Drop  
vs.Temperature  
1.6  
1.5  
1.4  
1.3  
1.2  
1.1  
1.0  
1200  
1000  
800  
600  
400  
200  
0
485  
480  
475  
470  
465  
460  
IF=50mA  
IF=20mA  
IF=10mA  
IF=5mA  
IF=2mA  
IF=1mA  
-40  
-20  
0
20  
40  
60  
80  
100  
0
5
10  
15  
20  
0
5
10  
15  
20  
Temperature (ºC)  
LED Forward Current (mA)  
LED Forward Current (mA)  
Typical Turn-On Time  
vs.Temperature  
(IL=50mA)  
Typical Turn-Off Time  
vs.Temperature  
(IL=50mA)  
Typical IF to Operate vs.Temperature  
(IL=100mA)  
600  
500  
400  
300  
200  
100  
0
800  
700  
600  
500  
400  
300  
200  
0.18  
0.16  
0.14  
0.12  
0.10  
0.08  
IF=1mA  
IF=1mA & IF=5mA  
IF=5mA  
-40  
-20  
0
20  
40  
60  
80  
100  
-40  
-20  
0
20  
40  
60  
80  
100  
-40  
-20  
0
20  
40  
60  
80  
100  
Temperature (ºC)  
Temperature (ºC)  
Temperature (ºC)  
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application  
department.  
R03  
www.ixysic.com  
3
XAA117  
INTEGRATED  
CIRCUITS  
DIVISION  
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*  
Typical Load Current  
vs. Load Voltage  
(IF=1mA)  
Typical On-Resistance  
vs.Temperature  
Maximum Load Current  
vs.Temperature  
(IF=2mA)  
(IF=5mA, IL=50mA)  
160  
150  
140  
130  
120  
110  
100  
90  
12  
11  
10  
9
0.3  
0.2  
Single Pole  
0.1  
0.0  
8
Both Poles  
-0.1  
-0.2  
-0.3  
7
6
80  
70  
5
-40  
-1.5  
-1.0  
-0.5  
0.0  
0.5  
1.0  
1.5  
-20  
0
20  
40  
60  
80  
100  
-40  
-20  
0
20  
40  
60  
80  
100  
Voltage (V)  
Temperature (ºC)  
Temperature (ºC)  
Typical Leakage vs.Temperature  
Measured Across Pins 5&6 or 7&8  
Typical Blocking Voltage  
vs.Temperature  
Energy Rating Curve  
12  
10  
8
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
94  
92  
90  
88  
86  
84  
6
4
2
0
80  
100  
-40  
-20  
0
20  
40  
60  
80  
100  
-40  
-20  
0
20  
Temperature (ºC)  
40  
60  
10Ps 100Ps 1ms 10ms 100ms 1s  
10s 100s  
Temperature (ºC)  
Time  
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application  
department.  
R03  
4
www.ixysic.com  
XAA117  
INTEGRATED  
CIRCUITS  
DIVISION  
Manufacturing Information  
Moisture Sensitivity  
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated  
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to  
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product  
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper  
operation of our devices when handled according to the limitations and information in that standard as well as to any  
limitations set forth in the information or standards referenced below.  
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced  
product performance, reduction of operable life, and/or reduction of overall reliability.  
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according  
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.  
Device  
Moisture Sensitivity Level (MSL) Rating  
XAA117 / XAA117S / XAA117P  
MSL 1  
ESD Sensitivity  
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.  
Reflow Profile  
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020  
must be observed.  
Device  
MaximumTemperature xTime  
XAA117 / XAA117S  
XAA117P  
250ºC for 30 seconds  
260ºC for 30 seconds  
Board Wash  
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to  
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as  
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary  
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.  
Cleaning methods that employ ultrasonic energy should not be used.  
Pb  
e3  
R03  
www.ixysic.com  
5
XAA117  
INTEGRATED  
CIRCUITS  
DIVISION  
Mechanical Dimensions  
XAA117  
9.652 0.381  
(0.380 0.015)  
PCB Hole Pattern  
7.620 0.254  
(0.300 0.010)  
2.540 0.127  
(0.100 0.005)  
8-0.800 DIA.  
2.540 0.127  
(8-0.031 DIA.)  
(0.100 0.005)  
9.144 0.508  
(0.360 0.020)  
6.350 0.127  
(0.250 0.005)  
6.350 0.127  
(0.250 0.005)  
3.302 0.051  
(0.130 0.002)  
Pin 1  
0.457 0.076  
(0.018 0.003)  
7.620 0.127  
(0.300 0.005)  
7.239 TYP.  
(0.285)  
7.620 0.127  
(0.300 0.005)  
4.064 TYP  
(0.160)  
0.254 0.0127  
(0.010 0.0005)  
Dimensions  
0.813 0.102  
mm  
(0.032 0.004)  
(inches)  
XAA117S  
9.652 0.381  
(0.380 0.015)  
PCB Land Pattern  
0.635 0.127  
(0.025 0.005)  
2.540 0.127  
(0.100 0.005)  
3.302 0.051  
(0.130 0.002)  
2.54  
(0.10)  
9.525 0.254  
(0.375 0.010)  
6.350 0.127  
(0.250 0.005)  
8.90  
(0.3503)  
1.65  
(0.0649)  
7.620 0.254  
(0.300 0.010)  
Pin 1  
0.457 0.076  
(0.018 0.003)  
0.254 0.0127  
(0.010 0.0005)  
0.65  
(0.0255)  
4.445 0.127  
(0.175 0.005)  
Dimensions  
mm  
(inches)  
0.813 0.102  
(0.032 0.004)  
XAA117P  
2.286 MAX.  
(0.090 MAX.)  
PCB Land Pattern  
0 MIN / 0.102 MAX  
(0 MIN / 0.004 MAX)  
2.540 0.127  
(0.100 0.005)  
2.54  
(0.10)  
0.635 0.127  
(0.025 0.005)  
7.620 0.254  
(0.300 0.010)  
6.350 0.127  
(0.250 0.005)  
9.398 0.127  
(0.370 0.005)  
8.70  
(0.3425)  
1.55  
(0.0610)  
Pin 1  
0.203 0.013  
(0.008 0.0005)  
9.652 0.381  
(0.380 0.015)  
0.65  
(0.0255)  
2.159 0.025  
(0.085 0.001)  
0.457 0.076  
(0.018 0.003)  
Dimensions  
mm  
0.864 0.120  
(0.034 0.004)  
(inches)  
R03  
6
www.ixysic.com  
XAA117  
INTEGRATED  
CIRCUITS  
DIVISION  
XAA117STR Tape & Reel  
330.2 DIA.  
(13.00 DIA.)  
W=16.00  
(0.63)  
Top Cover  
Tape Thickness  
Bo=10.30  
(0.406)  
0.102 MAX.  
(0.004 MAX.)  
Ao=10.30  
(0.406)  
P=12.00  
(0.472)  
K0=4.90  
(0.193)  
K1=4.20  
(0.165)  
User Direction of Feed  
Dimensions  
mm  
Embossed Carrier  
(inches)  
NOTES:  
1. Dimensions carry tolerances of EIA Standard 481-2  
Embossment  
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2  
XAA117PTR Tape & Reel  
2.00  
(0.079)  
4.00  
(0.157)  
330.2 DIA.  
(13.00 DIA.)  
W = 16.00  
(0.63)  
7.50  
(0.295)  
Top Cover  
Tape Thickness  
Bo = 10.30  
(0.406)  
0.102 MAX.  
(0.004 MAX.)  
P = 12.00  
(0.472)  
Ao = 10.30  
(0.406)  
K0 = 2.70  
(0.106)  
Dimensions  
mm  
(inches)  
K1 = 2.00  
(0.079)  
User Direction of Feed  
Embossed Carrier  
NOTES:  
1. All dimensions carry tolerances of EIA Standard 481-2  
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2  
Embossment  
For additional information please visit our website at: www.ixysic.com  
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make  
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated  
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to  
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.  
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other  
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe  
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.  
Specification: DS-XAA117-R03  
©Copyright 2012, IXYS Integrated Circuits Division  
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division  
All rights reserved. Printed in USA.  
12/22/2012  
7

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