XAA117 [IXYS]
Transistor Output SSR, 2-Channel, 3750V Isolation, ROHS COMPLIANT, DIP-8;型号: | XAA117 |
厂家: | IXYS CORPORATION |
描述: | Transistor Output SSR, 2-Channel, 3750V Isolation, ROHS COMPLIANT, DIP-8 输出元件 光电 |
文件: | 总7页 (文件大小:146K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
XAA117
Dual Single-Pole, Normally Open
OptoMOS® Relay
INTEGRATED
CIRCUITS
DIVISION
Parameter
Blocking Voltage
Ratings
Units
Description
60
150
16
1
VP
mArms / mADC
The XAA117 is a dual, single-pole, normally open
(1-Form-A) Solid State Relay with two independently
controlled, optically coupled MOSFET switches that
feature 3750Vrms of input to output isolation.
Load Current
On-Resistance (max)
LED Current to Operate
mA
The optically coupled outputs, which use the
patented OptoMOS architecture, are controlled by a
highly efficient GaAIAs infrared LED.
Features
• Low Input Control Current: 1mA
• 3750Vrms Input/Output Isolation
• Low Drive Power Requirements (TTL/CMOS
Compatible)
• Arc-Free With No Snubbing Circuits
• FCC Compatible
This dual single-pole OptoMOS relay provides a more
compact design solution than discrete single-pole
relays in a variety of applications, and saves board
space by incorporating both switches in a single 8-Pin
package.
• VDE Compatible
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
• Surface Mount Tape & Reel Version Available
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Compliant
Applications
• Security
• Passive Infrared Detectors (PIR)
• Data Signaling
• Sensor Circuitry
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
Ordering Information
Part #
XAA117
Description
8-Pin DIP (50/Tube)
XAA117S
XAA117STR
XAA117P
XAA117PTR
8-Pin Surface Mount (50/Tube)
8-Pin Surface Mount (1,000/Reel)
8-Pin Flat Pack (50/Tube)
8-Pin Flat Pack (1,000/Reel)
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment-Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
Pin Configuration
1
8
+ Control - Switch #1
Load - Switch #1
2
7
6
– Control - Switch #1
Load - Switch #1
Load - Switch #2
3
+ Control - Switch #2
4
5
– Control - Switch #2
Load - Switch #2
Switching Characteristics of
Normally Open Devices
Form-A
IF
90%
10%
ILOAD
t
t
off
on
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www.ixysic.com
XAA117
INTEGRATED
CIRCUITS
DIVISION
Absolute Maximum Ratings @ 25ºC
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Parameter
Blocking Voltage
Ratings Units
60
VP
Reverse Input Voltage
Input Control Current
Peak (10ms)
5
50
V
mA
A
1
Input Power Dissipation 1
Total Power Dissipation 2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
150
mW
mW
Vrms
°C
800
3750
-±0 to +85
-±0 to +125
°C
1
Derate linearly 1.33 mW / ºC
Derate linearly 6.67 mW / ºC
2
Electrical Characteristics @ 25ºC
Parameter
Conditions
Symbol
Min
Typ
Max
Units
Output Characteristics
Load Current
Continuous 1
-
IL
-
-
-
-
-
-
150
±±00
16
mArms / mADC
Peak
t =10ms
IL=150mA
VL=60VP
ILPK
RON
ILEAK
mAP
On-Resistance
7
-
Off-State Leakage Current
Switching Speeds
1
µA
Turn-On
ton
toff
-
-
-
0.1
0.5
25
5
5
-
IF=5mA, VL=10V
VL=50V, f=1MHz
ms
pF
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
COUT
IL=150mA
-
IF
-
-
0.05
0.9
-
-
-
1
-
mA
mA
V
IF=5mA
VR=5V
VF
IR
1.2
-
1.±
10
µA
Input to Output Capacitance
1
-
CI/O
-
3
-
pF
If both poles operate simultaneously, then the load current must be derated so as not to exceed the package power dissipation value.
R03
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XAA117
INTEGRATED
CIRCUITS
DIVISION
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
Typical Turn-On Time
(N=50, IF=5mA, IL=100mA)
Typical Turn-Off Time
(N=50, IF=5mA, IL=100mA)
35
30
25
20
15
10
5
25
20
15
10
5
25
20
15
10
5
0
0
0
1.21
1.22
1.23
1.24
1.25
75
80
85
90
95
100 105
0.35 0.40 0.45 0.50 0.55 0.60 0.65
LED Forward Voltage Drop (V)
Turn-On Time (Ps)
Turn-Off Time (ms)
Typical IF for Switch Operation
(N=50, IL=100mA)
Typical On-Resistance Distribution
(N=50, IL=100mA)
Typical Blocking Voltage Distribution
(N=50)
35
30
25
20
15
10
5
20
15
10
5
25
20
15
10
5
0
0
0
0.05 0.06 0.07 0.08 0.09 0.10 0.11
84
85
86
87
88
89
90
6.8
6.9
7.0
7.1
7.2
7.4
7.3
On-Resistance (:)
Blocking Voltage (VP)
LED Current (mA)
Typical Turn-On Time
vs. LED Forward Current
(IL=100mA)
Typical Turn-Off Time
vs. LED Forward Current
(IL=100mA)
Typical LED Forward Voltage Drop
vs.Temperature
1.6
1.5
1.4
1.3
1.2
1.1
1.0
1200
1000
800
600
400
200
0
485
480
475
470
465
460
IF=50mA
IF=20mA
IF=10mA
IF=5mA
IF=2mA
IF=1mA
-40
-20
0
20
40
60
80
100
0
5
10
15
20
0
5
10
15
20
Temperature (ºC)
LED Forward Current (mA)
LED Forward Current (mA)
Typical Turn-On Time
vs.Temperature
(IL=50mA)
Typical Turn-Off Time
vs.Temperature
(IL=50mA)
Typical IF to Operate vs.Temperature
(IL=100mA)
600
500
400
300
200
100
0
800
700
600
500
400
300
200
0.18
0.16
0.14
0.12
0.10
0.08
IF=1mA
IF=1mA & IF=5mA
IF=5mA
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
Temperature (ºC)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
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XAA117
INTEGRATED
CIRCUITS
DIVISION
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Typical Load Current
vs. Load Voltage
(IF=1mA)
Typical On-Resistance
vs.Temperature
Maximum Load Current
vs.Temperature
(IF=2mA)
(IF=5mA, IL=50mA)
160
150
140
130
120
110
100
90
12
11
10
9
0.3
0.2
Single Pole
0.1
0.0
8
Both Poles
-0.1
-0.2
-0.3
7
6
80
70
5
-40
-1.5
-1.0
-0.5
0.0
0.5
1.0
1.5
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Voltage (V)
Temperature (ºC)
Temperature (ºC)
Typical Leakage vs.Temperature
Measured Across Pins 5&6 or 7&8
Typical Blocking Voltage
vs.Temperature
Energy Rating Curve
12
10
8
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
94
92
90
88
86
84
6
4
2
0
80
100
-40
-20
0
20
40
60
80
100
-40
-20
0
20
Temperature (ºC)
40
60
10Ps 100Ps 1ms 10ms 100ms 1s
10s 100s
Temperature (ºC)
Time
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
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XAA117
INTEGRATED
CIRCUITS
DIVISION
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
XAA117 / XAA117S / XAA117P
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
MaximumTemperature xTime
XAA117 / XAA117S
XAA117P
250ºC for 30 seconds
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb
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R03
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5
XAA117
INTEGRATED
CIRCUITS
DIVISION
Mechanical Dimensions
XAA117
9.652 0.381
(0.380 0.015)
PCB Hole Pattern
7.620 0.254
(0.300 0.010)
2.540 0.127
(0.100 0.005)
8-0.800 DIA.
2.540 0.127
(8-0.031 DIA.)
(0.100 0.005)
9.144 0.508
(0.360 0.020)
6.350 0.127
(0.250 0.005)
6.350 0.127
(0.250 0.005)
3.302 0.051
(0.130 0.002)
Pin 1
0.457 0.076
(0.018 0.003)
7.620 0.127
(0.300 0.005)
7.239 TYP.
(0.285)
7.620 0.127
(0.300 0.005)
4.064 TYP
(0.160)
0.254 0.0127
(0.010 0.0005)
Dimensions
0.813 0.102
mm
(0.032 0.004)
(inches)
XAA117S
9.652 0.381
(0.380 0.015)
PCB Land Pattern
0.635 0.127
(0.025 0.005)
2.540 0.127
(0.100 0.005)
3.302 0.051
(0.130 0.002)
2.54
(0.10)
9.525 0.254
(0.375 0.010)
6.350 0.127
(0.250 0.005)
8.90
(0.3503)
1.65
(0.0649)
7.620 0.254
(0.300 0.010)
Pin 1
0.457 0.076
(0.018 0.003)
0.254 0.0127
(0.010 0.0005)
0.65
(0.0255)
4.445 0.127
(0.175 0.005)
Dimensions
mm
(inches)
0.813 0.102
(0.032 0.004)
XAA117P
2.286 MAX.
(0.090 MAX.)
PCB Land Pattern
0 MIN / 0.102 MAX
(0 MIN / 0.004 MAX)
2.540 0.127
(0.100 0.005)
2.54
(0.10)
0.635 0.127
(0.025 0.005)
7.620 0.254
(0.300 0.010)
6.350 0.127
(0.250 0.005)
9.398 0.127
(0.370 0.005)
8.70
(0.3425)
1.55
(0.0610)
Pin 1
0.203 0.013
(0.008 0.0005)
9.652 0.381
(0.380 0.015)
0.65
(0.0255)
2.159 0.025
(0.085 0.001)
0.457 0.076
(0.018 0.003)
Dimensions
mm
0.864 0.120
(0.034 0.004)
(inches)
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XAA117
INTEGRATED
CIRCUITS
DIVISION
XAA117STR Tape & Reel
330.2 DIA.
(13.00 DIA.)
W=16.00
(0.63)
Top Cover
Tape Thickness
Bo=10.30
(0.406)
0.102 MAX.
(0.004 MAX.)
Ao=10.30
(0.406)
P=12.00
(0.472)
K0=4.90
(0.193)
K1=4.20
(0.165)
User Direction of Feed
Dimensions
mm
Embossed Carrier
(inches)
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
Embossment
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
XAA117PTR Tape & Reel
2.00
(0.079)
4.00
(0.157)
330.2 DIA.
(13.00 DIA.)
W = 16.00
(0.63)
7.50
(0.295)
Top Cover
Tape Thickness
Bo = 10.30
(0.406)
0.102 MAX.
(0.004 MAX.)
P = 12.00
(0.472)
Ao = 10.30
(0.406)
K0 = 2.70
(0.106)
Dimensions
mm
(inches)
K1 = 2.00
(0.079)
User Direction of Feed
Embossed Carrier
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-XAA117-R03
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/22/2012
7
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