LPM013M091A [JDI]
Display;
| 型号： | LPM013M091A |
| 厂家： | 
Japan Display Inc. |
| 描述： | Display |
| 文件： | 总47页 (文件大小：2280K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
JDG01-E-01E
1. BASIC SPECIFICATIONS
n
1.1 STRUCTURES
(*1-1) Excluding FPC and part of protruding. See attached drawing for details.
1.2 BLOCK DIAGRAM
The block diagram is shown below.
1.342inch(Round)
77,782 dots
(320 x RGB x 300 pixels)
Dot Pitch
35.5um x 106.5um(238.5ppi)
Selector
(NT35350)
LED
FPC
1.3 I/O PINS
1pin
23pin
2. ABSOLUTE MAXIMUM RATING
3. ELECTRICAL SPECIFICATIONS
3.1. Operating Conditions
3.1.1 Input and output power supply voltage conditions
(GND=0V)
3.1.2 Input signal voltage conditions (DC conditions)
3.1.3 DC characteristic power consumption characteristics, input threshold
VDDI=1.8V , VCI=3.1V
(Iled=20mA)
3.1.4 Backlight Operating Conditions
4. INTERFACE
4.1 MIPI INTERFACE
Follow the MIPI Standerd.
D-PHY: V1.0
DSI:1.01.00
DCS:1.01.00
MIPI I/F Supported 1 data lane (MIPI CLK speed up to 300Mbps).
MIPI I/F Supported only command mode.
4.2 MIPI DC CHARACTERISTICS
4.3 MIPI AC CHARACTERISTICS
4.4 SPI
Command Write for LoSSI
The host CPU drives the CSX pin low and starts by setting the D/CX-bit on SDI or by DCX
pin. The bit is read by the display on the first rising
edge of SCL. For 4-Wires Mode, first bit is data bit (D7) is set on SDI by the CPU. Then on
the next falling edge of SCL the MSB data bit (D6) is
set on SDI by the CPU and so on. For 3-Wires Mode, the next falling edge of SCL the MSB
data bit (D7) is set on SDI by the CPU. On the next
falling edge of SCL the next bit (D6) is set on SDI and so on. This continues until all 8 Data
bits have been transmitted as shown in below figures:
Command Write.
Command/GRAM Write for 3-Wires Mode 9-bit Type SPI
Command/GRAM Write for 4-Wires Mode 8-bit Type SPI
Note:
(*4-1)The GRAM write command should be 2Ch/3Ch.
(*4-2)When using SPI,differential input voltage for MIPI,such as HSSI_D0_N,HSSI_D0_P,HSSI_CLK_N,
HSSI_CLK_P,should be fixed 1.2V,which is the high level of the differential input voltage. The power on
sequence for these pins should follow LP11(See Page.27) even if not using MIPI.
2
Figure1. Serial Interface Operation for 3‐Wires/4‐Wires 9/8‐bit Type SPI
Register access(excluding 2C/3C command) SPI SPEC
Item
Symbol Min. Typ. Max. Unit
SCL clock cycle time Write (received)
SCL clock cycle time Read (transmitted)
SCL “High” pulse width Write (received)
SCL “High” pulse width Read (transmitted)
SCL “Low” pulse width Write (received)
SCL “Low” pulse width Read (transmitted)
SCL clock rise/fall time
t SCYCW
80
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
20,000 ns
20,000 ns
t SCYCR 280
t SHW
t SHR
t SLW
t SLR
t r , t f
t CSS
t CSH
t SDS
t SDH
tAST
40
140
40
140
-
-
-
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
-
-
10
-
Chip select setup time
20
50
20
20
20
2
Chip select hold time
-
Input data setup time
-
Input data hold time
-
DCX to SCL Write setup time
DCX to SCL Write hold time
Output data access time
-
tAHT
-
t ACC
t OH
-
120
-
Output data hold time
5
Chip deselect “High” pulse width
t CHW
40
-
2
2C/3C command(GRAM access) SPI SPEC
Item
Symbol Min. Typ. Max. Unit
SCL clock cycle time Write (received)
t SCYCW
16
-
20,000 ns
20,000 ns
SCL clock cycle time Read (transmitted)
SCL “High” pulse width Write (received)
SCL “High” pulse width Read (transmitted)
SCL “Low” pulse width Write (received)
SCL “Low” pulse width Read (transmitted)
SCL clock rise/fall time
t SCYCR 280
-
-
-
-
-
-
-
-
-
-
-
-
-
-
t SHW
t SHR
t SLW
t SLR
t r , t f
t CSS
t CSH
t SDS
t SDH
tAST
8
140
8
-
-
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
-
140
-
-
10
-
Chip select setup time
4
Chip select hold time
12
5
-
Input data setup time
-
Input data hold time
5
-
DCX to SCL Write setup time
DCX to SCL Write hold time
Output data access time
20
2
-
tAHT
-
t ACC
t OH
-
120
-
Output data hold time
5
Chip deselect “High” pulse width
From GRAM Write(2C/3C) to GRAM Write(2C/3C)
t CHW
t CHW
8
-
-
-
-
ns
ns
Chip deselect “High” pulse width
From GRAM Write(2C/3C) to command (not 2C/3C)
1000
5. POWER SEQUENCE
5.1 Power ON/OFF sequence
VDDI
t1
t8
t9
t12
VCI
t2
t7
t10
t11
RESET
t3
t6
Initial setting
HSSI_D0_P/N
LP-11
LP-11
LP-11
HSSI_CLK_P/N
1
t4
t5
※If you don't use MIPI , please fix the MIPI pin to LP11 (1.2 V) at the timing of the power
ON / OFF sequence.
SDI
SCL / CSX
DCX(*)
※During the period that the SPI is not active, If CSX = H, SCL and SDI and DCX should set H or L. (Hi‐z is prohibited.)
ꢀ However, recommendations are CSX = H, SCL = H, SDI = L and DCX = H.
1
Min
0
10
10
0
Typ Max unit
Min
0
10
0
0
1
Typ Max unit
Command Address
(HEX) (HEX)
Wait more than 10ms
t1
t2
t3
t4
t9
-
-
-
-
-
-
ms
ms
ms
ms
ms
ms
t5
t6
t7
t8
t11
t12
-
80
-
-
-
-
ms
ms
ms
ms
ms
ms
90%
50
5
FF
28
28
E0
40
0
-
-
-
1
-
-
-
-
10
10
2*
10
10%
Lowerline
t10
-
Wait more than 10ms
FF
10
Upper line
*If t9 over than 2ms, please add right command in front of "Initinal setting"
5.2 Reset Timing Characteristics
6. CHANGE STATUS
6.1 Status flow
Deep Standby
Mode
Power OFF
Sleep Mode
(D)PowerOFF
(A)PowerON
(N)EnterSTB
(F)ExitDSTB
(E)EnterDSTB
Standby
Mode
(O)ExitSTB
(N‐1)ON Sequence toMM by MIPI
(N‐2)ON Sequence toMM by SPI
(B‐1)ON Sequence toAMby MIPI
(B‐2)ON Sequence toAMby SPI
(C)OFFSequence
(G‐1)Enter MIP byMIPI
(G‐2)Enter MIP bySPI
MM
(Memory Mode)
AM
(Analog Mode)
(I‐1)Exit MIP byMIPI
(I‐2)Exit MIP bySPI
(H‐1)MM Write new image byMIPI
(H‐2)MM Write new image bySPI
(O‐1)AMWrite new image byMIPI
(O‐2)AMWrite new image bySPI
AM= Analog Mode
= Normal Mode
DSTB= Deep Standby
STB= Standby
BL= Back Light
MM= Memory Mode
= MIP Mode
BACKLIGHT OFF
(Z)BLOFF
(Y)BLON
BACKLIGHT ON
6.1.1 Sequence 1 (A,B-1,B-2,N-1,N-2)
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
(C)OFF Sequence
Command Parameter
Data
Type
(HEX)
Para.
Num.
(DEC)
Write/
Read
DCS/
Generic
address
(HEX)
value
(HEX)
Description
Analog Mode
-
Write
Write
-
-
FF
28
10
-
Select CMD1 (If already setted CMD1, skip this command)
Display Off
DCS
05
-
Wait more than 20ms
Write
DCS
05 10
-
-
Sleep In
Wait more than 100ms
Sleep Mode
(D)Power OFF
Command Parameter
Data
Type
(HEX)
Para.
Num.
(DEC)
Write/
Read
DCS/
Generic
address
(HEX)
value
(HEX)
Description
Sleep Mode
Hard Reset H=>L
Power supply off VCI
Power supply off VDDI
Pwer OFF
DSI input should be at GND level while VDDI off.
(E)Enter DSTB
Command Parameter
Data
Type
(HEX)
Para.
Num.
(DEC)
Write/
Read
DCS/
Generic
address
(HEX)
value
(HEX)
Description
Enter DSTB
Sleep Mode
15
Write
DCS
1
4F
01
Set MIPI-DSI to ULPM, SPI to halt state
Deep Standby Mode
(F)Exit DSTB
Command Parameter
Data
Type
(HEX)
Para.
Num.
(DEC)
Write/
Read
DCS/
Generic
address
(HEX)
value
(HEX)
Description
Deep Standby Mode
Wait more than 10ms
Hard Reset H=>L
Wait more than 3ms
Hard Reset L=>H
Wait more than 50ms
Set MIPI-DSI to LP-11, SPI to halt state
Sleep Mode
(N)Enter STB
Command Parameter
Data
Type
(HEX)
Para.
Num.
(DEC)
Write/
Read
DCS/
Generic
address
(HEX)
value
(HEX)
Description
Description
Description
Sleep Mode
Power supply off VCI
Standby Mode
(O)Exit STB
Command Parameter
Data
Type
(HEX)
Para.
Num.
(DEC)
Write/
Read
DCS/
Generic
address
(HEX)
value
(HEX)
Standby Mode
Power supply on VCI
Sleep Mode
(Y)BL ON
Command Parameter
Data
Type
(HEX)
Para.
Num.
(DEC)
Write/
Read
DCS/
Generic
address
(HEX)
value
(HEX)
1
Analog Mode
Write
Write
Write
DCS
DCS
DCS
15
15
15
1
1
1
FF
53
51
10
24
xx
Select CMD1 (If already setted CMD1, skip this command)
BACKLIGHT ON
LEDPWMdutyꢀsetting(00h:0% 〜 FFh:100%）
(Z)BL OFF
Write/
Command Parameter
Data
Type
(HEX)
Para.
Num.
(DEC)
DCS/
address
(HEX)
value
(HEX)
Description
Read
Generic
1
Analog Mode
Write
Write
DCS
DCS
15
15
1
1
FF
53
10
00
Select CMD1 (If already setted CMD1, skip this command)
BACKLIGHT OFF
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
note1：If the communication is interrupted during transmission of the 2Ch/3Ch command, please re-send 2Ch/3Ch command from the beginning of the frame
【example】
・18bit/16bit mode
2Ch(ADD), xxh(data),…,xxh(data) ⇒ Data is transmitted for 320 pixels.（1st line）
3Ch(ADD), xxh(data),…,xxh(data) ⇒ Data is transmitted for 320 pixels.（2nd line）
ꢀꢀꢀ（repeat 3Ch command）
3Ch(ADD), xxh(data),…,xxh(data) ⇒ Data is transmitted for 320 pixels.（300th line）
・RGB1-1-1 mode（RGB 1-1-1-bits is only supported on 3-Wire mode 9-bit SPI interface.）
2Ch(ADD), xxh(data),…,xxh(data) ⇒ Data is transmitted for 320 x 300 pixels.（1frame data）
2
note2： After Display on, TE signal is output. Timing is as belows.
TE：Frequency 15.84ms(1V=63.1Hz)、H width 0.56ms
15.84ms(1V=63.1Hz)
0.56ms
note4 When switching from (AM to MM) or (MM to AM), please update the display image data with RGB format suitable for each mode.
The display image to be updated at AM is sent with RGB 666 or RGB 656 format. Be careful if you are using RGB 111 at MM.
2
note5 When using MIPI I/F, For the 2C / 3C command, it must be used the High speed mode,
and for the other commands, it must be used the Low Power mode.
2
2
ant.
no e6 When using SPI F, about CS=H period, specifications of 2C / 3C commandandothercomm ds aredifferen
I/
Please refer to 25,26page.
The register access can be sent by separating CS by address and data, but when sending 2C / 3C command,
it must be sent all of {2C + data} or {3C + data} with CS = L state.
[note6]
CS
data
2C/3C + display data
(CMD１_DAh) : Read ID1
DAh
1st parameter
D7
0
D6
0
D5
D4
D3
D2
D1
D0
Prototype Level
Prototype No.
◆Prototype Level (2bit)
◆Prototype Number (2bit)
Prototype No.
Prototype Level
Bit
00
01
10
11
Bit
WS
ES
ꢀ
1
2
0000
0001
0010
・・・
CS
MP
3
・・・
14
15
16
1101
1110
1111
7. OPTICAL SPECIFICATION
7.1 OPTICAL CHARACTERISTICS
7.1.1 Reflective mode
*Vcom frequency :60Hz±10%
*VCI=3.1V / VDDI=1.8V
*Analog(Normal) driving mode
7.1.2 Transmissive mode
*Vcom frequency :60Hz±10%
*VCI=3.1V / VDDI=1.8V / ILED=20mA
*Analog(Normal) driving mode, White raster
7.2 DEFINITION AND CONDITION OF OPTICAL CHARACTERISTICS
Definition 1
This is a ratio between the screen surface reflectance of the white raster and the black raster
Reflection intensity on all pixels White
Contrast ratio (CR) =
Reflection intensity on all pixels Black
Definition 2
The response time is defined as the following figure and shall be measured by matching the input signal for
“Black” and “White”.
・Normally Black mode
Black
10%
tr：Response time from Black to White
tf：Response time from White to Black
90%
W hite
tr
tf
Time
Definition 3
This is the x-y coordinate of Red, Green, Blue and White colors specified on the CIE1931 chromaticity
Diagram. (* It is not a guaranteed value)
Definition 4
This is an area of a triangle shaped by R, G, B coordinates on the CIE1931 chromaticity diagram.
Definition 5
This is a maximum angle θ from the normal direction that keeps having the contrast more than 2.
θ=0
θT
Top
θR
θL
Left
Right
θB
Bottom
*FPCside
- Measurement method of optical characteristics -
< Basic measurement conditions >
a) Driving voltage
VCI = 3.1V
VDDI= 1.8V
b) Measurement temperature
25°C unless otherwise specified
c) Measurement point
Center of the Active area (one point) unless otherwise specified
< Measurement system-I for reflective mode>
Light source:
Parallel light source
・D65 / 2 degree viewing angle
・Light source input direction
: from opposite side of FPC (30°)
: at LCD center (0°)
・Light source receive direction
LCD-5200 or equivalent
Light source
30°
LCD center
LCD Module
Driving Circuit
FPC side
< Measurement system-II for transparent mode>
Receiver lens
Optical fiber
Measurement equipment
CS-2000A or equivalent
LCD Module
Stage
A side
8. INSPECTION
Please refer to the shipment inspection standard for LPM013M091A ver.02.
9. RELIABILITY TEST
9.1 CONDITIONS OF RELIABILITY AND MECHANICAL TEST
9.2 CRITERIA FOR JUDGEMENT
After the above tests, return samples to the normal temperature and moisture environment in the
thermostat chamber room over 30 minutes not to condense. Inspect samples kept for more than 1 hour
after pulling them out of the thermostat chamber room.
(1) There shall be no abnormality in the functions (Ex. No display, abnormal display, line defects).
(2) There shall be no serious degradation (Ex. Brightness uniformity, reversible changes, optical changes.
The degradation due to backlight or polarizer is ignored).
10. PACKING SPECIFICATIONS
10.1 INNER CARTON
Empty
Module
Tray
20pcs LCD modules per tray
10 trays with products + empty tray as cover
= 11 trays
Tray is inverted 180 degrees and piled up.
Bag
Inner Carton
d.
10.2 MASTER CARTON
Inner Carton
Insert four (4) inner cartons within a master carton.
Maximum quantity per a master carton : 20 × 10 × 4 = 800pcs
Master Carton
[C]
[D
]
(Notes)
[B]
[A
]
Master carton size : W395 × L596 ×H223 (mm).
Gap is filled if necessary.
Tape is applied if necessary.
Tied if necessary.
Indication onto [A] [B] [C] [D] on master carton are shown as below.
≪Outer label≫
Printing Area
12. LCD MODULE USAGE AND PRECAUTIONS
12.1 HANDLING
(1) The display panel is made of glass. Do not subject it to mechanical shock such as dropping it from a high position, etc.
(2) If the display panel is damaged and internal liquid crystal substance leaks out, be sure not to inhale or consume it. If
the internal liquid crystal substance comes into contact with skin or clothing, promptly wash it off using soap and running
water.
(3) Do not apply excessive force on the surface, perimeter or adjoining areas of LCD module since this may cause display
panel color tone to vary.
(4) The polarizer covering the display panel surface of the LCD module is soft and can be easily scratched. Handle the LCD
module carefully.
(5) If the surface polarizer becomes contaminated, use the following recommended or equivalent adhesive tape for
contaminants removal.
• Scotch‐brand mending tape (No. 810)
(6) Do not breathe on the display surface or use solvents such as Ethyl Alcohol to remove contaminants. Those may cause
polarizer discoloration. Additionally, the following liquids can damage the polarizer.
• Water
• Ketones
• Aromatic solvents
(7) When mounting the LCD Module, be sure that it is free from twisting, warping, or distortion. Any stress can bring great
influence on the display quality. Be sure to secure sufficient stiffness on the outer case and the frame for a robust design.
(8) Do not apply pressure at or around the FPC bonding area and the surrounding area.
(9) Do not attempt to disassemble or rework the LCD module.
(10) To prevent destruction of the elements by static electricity, be careful to maintain an optimum working environment.
• Be sure to ground your body before handling the LCD module.
• Make sure that solder guns and all other tools required for assembly have been grounded.
• To reduce occurrence of static electricity, avoid using this product in dry environments.
• A protective film has been attached to the surface of the LCD panel. When peeling off the protective film, be careful to
prevent electrostatic discharges.
(11) To minimize performance degradation of the LCD module caused by destructive forces such as static electricity, etc.,
avoid direct contact to the following sections when handling the LCD module.
• Terminal electrodes of connector
• Wiring pattern on FPC
(12) The protective film attached on the LCD panel must be removed before final product installation. After removal of
protective film, some adhesive residues may be left on the LCD panel, especially after a long storage period. Please refer
to section (5) listed above for proper contaminant removal procedure.
(13) Take precaution to minimize corrosion of electrodes. Corrosion of electrodes is accelerated by moisture,
condensation or a current flow in a high‐humidity environment.
(14) Do not apply excessive pressure to the FPC part. Force type such as twist, warp, etc., may cause FPC patterning
damage and/or peeling FPC.
(15) Keep the LCD module away from rigid objects such as a tool. Don't put any heavy object on the display surface. Don't
stack or pile up the LCD modules. As the polarizer material tends to be easily scratched, the LCD module must be handled
with due care to avoid being touched, pressed or rubbed with any rigid object.
(16) Do not touch or handle the LCD module directly with bare hands. Residue of dirt, oil or water may have the
possibility to cause corrosion. Be sure to wear finger sacks or gloves when handling LCD modules. When holding an
LCD panel module, carefully hold the panel by the edges of the glass plate.
(17) Avoid using LCD module under condensation or high humidity environment because polarizer etc. maybe
damaged in these conditions.
(18) Trays are used to package LCD modules for shipment. If LCD modules scratch the tray during shipment, material
of the scratched tray may be left on LCD modules. In such case, clean up LCD modules after removal from trays.
(19) When installing LCD module, don't apply excess stress of bending or stretching to the input cable (FPC).
(20) Keep NC terminals open electrically unless otherwise specified.
(21) After storage under high humidity or condensation environment, keep LCD module under room temperature
more than 30 minutes before operation.
(22) Take precautions to handle LCD module because the glass plate has very keen edges.
12.2 DESIGN OF APPLICATION
(1) The absolute maximum ratings represent the rated values which LCD module cannot exceed. When LCD modules
are used beyond these rated values, the operating characteristics may be adversely affected.
(2) To prevent the occurrence of erroneous operation caused by noise, special attention on satisfying VIL, VIH
specified values is required. This includes taking the precautionary measures of using short cables for signal
transferring.
(3) An inherent characteristic of liquid crystal display is its temperature dependency. Be sure to use the LCD modules
within the specified operating temperature range. Recognition of the display becomes difficult when the LCD
module is used outside its range. Also, keep in mind that the voltage levels necessary for clear display images will
vary according to temperature.
(4) It is recommended that power supply lines (V_SYS, V_INTERFACE, LED+) include current surge protection. (Fuse
etc. recommend value: 0.5A)
(5) Note the peripheral devices can cause mutual noise interference with LCD modules. Especially, input devices
such as Touch Panel, etc., may output operational level by radiation noise even when these devices are not in
operation. Actual performance confirmation and verification under actual usage environment by actual final product
are highly recommended.
(6) To avoid EMI, preventive measures should be implemented for the final product.
(7) Display abnormality may occur with sudden removal of the battery pack. Electric design should be well studied so
that sudden electric power interruption will not occur. LCD module quality cannot be guaranteed under the
condition that unexpected power shutdown can possibly occur.
(8) Ensure sufficient light shading measures during design phase and then mount the LCD module.
(9) Ensure sufficient light shading measures in the inspection process.
(10) As well as general electronic components, ESD may cause the LCD IC to malfunction. Provide ESD prevention
measures entirely around the LCD module.
(11) While display data may be kept, the data can be easily changed by external noise. Noise can be minimized at
device or system level.
(12) Unexpected external noise may cause abnormal display and/or IC malfunction. Periodic refresh operation such
as resending commands and display data is highly recommended as a part of the software routine.
(13) When logic circuit power is off, do not apply any signals to the input terminals.
(14) As the pressure bonding of the FPC tends to be easily peeled by mechanical stress, never hold the LCD module
by the FPC when handling. Additionally, when mounting the LCD Module and/or fixing the FPC, keep them free from
twisting or bending. Those may cause wiring pattern breaks and/or bonding separation. Remember not to bend/pull
them toward the direction in which the bonding goes separate because there is a high possibility of wiring pattern
breaks.
12.3 DISPLAY CHARACTERISTECS
(1) Because the optimum LCD driving voltage depends on the ambient temperature, display may slightly flicker at
the environment of high temperature.
(2) One of the special characteristics of liquid crystal is that it freezes when stored at the temperature below the
storage temperature range. Such freezing may cause orientation defects or bubbles (black or white) to appear in
the LCD panel. Bubbles may also occur if the panel receives an impact in a low‐temperature environment.
(3) If the LCD module is left operating for a long time with the same display showing, the displayed pattern may
leave traces on the screen or the contrast may become inconsistent. These issues will usually recover in time, but
the phenomenon may persist in significant cases.
It is unavoidable with the current technology. The final product must be designed with this property in mind and
need to avoid displaying a fixed pattern for a long period. Any afterimage issue is excluded from the LCD Module
appearance specifications that we warrant.
12.4 KEEPING
(1) When keeping LCD modules, avoid the following condition or environment.
• Exposure to direct sunlight or fluorescent lamp lighting.
• High‐temperature/high‐humidity or very low‐temperature (below 0°C) environments.
• Exposure to water droplets, condensation, etc.
Furthermore, keep LCD modules in anti‐static bags to prevent static electricity charge ups. Whenever possible, LCD
modules should be stored in the same conditions in which they were shipped from Japan Display Inc.
(2) Take precaution to minimize corrosion of electrodes. Corrosion of electrodes is accelerated by moisture,
condensation or a current flow in a high‐humidity environment.
(3) Recommended keeping conditions.
• Keeping environment : +15°C to 35°C, less than 65%RH
• Duration: up to 2 months after shipping date
(4) Excessive load can damage or destroy the carton boxes. Please follow the printed instruction on the carton for
maximum number of stacks of cartons for both storage and transportation.
12.5 DISPOSAL
(1) Abide by national laws, legislation and local regulations when disposing of this LCD module.
(2) Consult a company specialized in industrial waste treatment which is permitted by the government or local
authority. When incineration is the method of LCD module disposal, law of environmental hygienic must be
obeyed.
12.6 OTHERS
(1) This product is designed to be used in ordinary electronic devices. Do not use this product in other applications,
especially in devices that may directly affect end users (such as weapons, military purposes, aerospace equipment,
life‐support system equipment, or safety equipment).
(2) Japan Display Inc. shall not be responsible for defects that occur in this product if the product is used in an
environment that exceeds the ranges specified in this document, or in an environment not described in this
document.
13. OUTLINE DRAWING
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