C0603X106J5NACTU
更新时间:2024-09-18 21:42:41
品牌:KEMET
描述:Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
C0603X106J5NACTU 概述
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
C0603X106J5NACTU 数据手册
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PDF下载Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8L Dielectric, 10 – 50 VDC
(Commercial & Automotive Grade)
Overview
KEMET’s X8L dielectric features a 150°C maximum operating
temperature and is considered “general purpose high
temperature.” These components are fixed, ceramic dielectric
capacitors suited for high temperature bypass and decoupling
applications or frequency discriminating circuits where Q and
stability of capacitance characteristics are not critical. X8L
exhibits a predictable change in capacitance with respect to time
and voltage and boasts a minimal change in capacitance with
reference to ambient temperature up to 125°C. Beyond 125°C
X8L displays a wider variation in capacitance. Capacitance
change is limited to ±15% from −55°C to +125°C and +15, -40%
from 125°C to 150°C.
stress to the rigid ceramic body, therefore mitigating flex cracks
which can result in low IR or short circuit failures. Although
flexible termination technology does not eliminate the potential
for mechanical damage that may propagate during extreme
environmental and handling conditions, it does provide superior
flex performance over standard termination systems.
In addition to commercial grade, automotive grade devices
are available and meet the demanding Automotive Electronics
Council's AEC–Q200 qualification requirements.
Driven by the demand for a more robust and reliable
component, X8L dielectric capacitors were developed for critical
applications where reliability at higher operating temperatures
are a concern. These capacitors are widely used in automotive
circuits as well as general high temperature applications.
Concerned with flex cracks resulting from excessive tensile
and shear stresses produced during board flexure and thermal
cycling? These devices are available with KEMET's Flexible
termination technology which inhibits the transfer of board
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Ordering Information
C
1210
X
106
K
8
N
A
C
TU
Case Size Specification/ Capacitance
Capacitance Rated Voltage
Tolerance (VDC)
Failure Rate/
Design
Packaging/Grade
(C-Spec)
Ceramic
Dielectric
N = X8L
Termination Finish2
(L" x W")
Series1
Code (pF)
0402
0603
0805
1206
1210
C = Standard
X = Flexible
Termination
Two
significant
digits +
number of
zeros
J = ±5% 8 = 10
A = N/A
C = 100% Matte Sn
L = SnPb (5% Pb
minimum)
See "Packaging
C-Spec Ordering
Options Table"
below
K = ±10%
M = ±20%
3 = 25
5 = 50
1 The flexible termination option is not available on EIA 0402 case size product. "C" must be used in the 6th character position when ordering this case size.
2 Additional termination finish options may be available. Contact KEMET for details.
2 SnPb termination finish option is not available on Automotive Grade product.
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1008_X8L_150C_SMD • 2/29/2016
1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8L Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Packaging C-Spec Ordering Options Table
Packaging/Grade
Ordering Code (C-Spec)
Packaging Type
Commercial Grade1
Bulk Bag
Not Required (Blank)
TU
7411 (EIA 0603 and smaller case sizes)
7210 (EIA 0805 and larger case sizes)
TM
7" Reel / Unmarked
13" Reel / Unmarked
7" Reel / Marked
7040 (EIA 0603 and smaller case sizes)
7215 (EIA 0805 and larger case sizes)
7081
13" Reel / Marked
7" Reel / Unmarked / 2 mm pitch2
13" Reel / Unmarked / 2 mm pitch2
7082
Automotive Grade3
7" Reel
AUTO
AUTO7411 (EIA 0603 and smaller case sizes)
AUTO7210 (EIA 0805 and larger case sizes)
13" Reel / Unmarked
7" Reel / Unmarked / 2 mm pitch2
13" Reel / Unmarked / 2 mm pitch2
3190
3191
1 Default packaging is "Bulk Bag". An ordering code C-Spec is not required for "Bulk Bag" packaging.
1 The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors that have
not been laser marked.
2 The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case size
devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".
3 Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L" x W") and thickness dimension. See "Chip Thickness/Tape & Reel Packaging
Quantities" and "Tape & Reel Packaging Information".
3 For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information".
3 All Automotive packaging C-Specs listed exclude the option to laser mark components. Please contact KEMET if you require a laser marked option. For more
information see "Capacitor Marking".
Benefits
• −55°C to +150°C operating temperature range
• Lead (Pb)-Free, RoHS and REACH compliant
• EIA 0402, 0603, 0805, 1206, and 1210 case sizes
• DC voltage ratings of 10 V, 25 V, and 50 V
• Capacitance offerings ranging from 0.012 μF to 10 μF
• Available capacitance tolerances of ±5%, ±10%, and ±20%
• Commercial & Automotive (AEC–Q200) grades available
• Non-polar device, minimizing installation concerns
• 100% pure matte tin-plated termination finish allowing for
excellent solderability
• SnPb termination finish option available upon request (5% Pb
minimum)
• Flexible termination option available upon request
Applications
Typical applications include use in extreme environments such as down-hole oil exploration, under-hood automotive, military and
aerospace.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1008_X8L_150C_SMD • 2/29/2016
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8L Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Automotive C-Spec Information
KEMET Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding
test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. These
products are supported by a Product Change Notification (PCN) and Production Part Approval Process warrant (PPAP).
Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, "AUTO". This
C-Spec was developed in order to better serve small and medium sized companies that prefer an automotive grade component without
the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review by a KEMET engineering specialist.
This C-Spec is therefore not intended for use by KEMET’s OEM Automotive customers and are not granted the same “privileges” as
other automotive C-Specs. Customer PCN approval and PPAP request levels are limited (see details below).
Product Change Notification (PCN)
The KEMET Product Change Notification system is used to communicate primarily the following types of changes:
• Product/process changes that affect product form, fit , function, and /or reliability
• Changes in manufacturing site
• Product obsolescence
Customer Notification due to:
KEMET Automotive
C-Spec
Days prior to
implementation
Process/Product change
Obsolescence*
Yes
KEMET assigned1
Yes (with approval and
sign off)
180 days Minimum
AUTO
Yes (without approval)
Yes
90 days Minimum
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)
The purpose of the Production Part Approval Process is:
• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
• To provide the evidence that all customer engineering design record and specification requirements are properly understood and
fulfilled by the manufacturing organization.
• To demonstrate that the established manufacturing process has the potential to produce the part
KEMET
Automotive
C-Spec
PPAP (Product Part Approval Process) Level
1
●
○
2
3
●
○
4
5
KEMET
●
●
●
assigned1
AUTO
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
● Part Number specific PPAP available
○ Product family PPAP only
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1008_X8L_150C_SMD • 2/29/2016
3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8L Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Dimensions – Standard Termination – Millimeters (Inches)
L
W
T
B
S
EIA Metric
Size Size
Code Code
S
L
W
Width
T
B
Mounting
Technique
Separation
Minimum
Length
Thickness
Bandwidth
0402
0603
0805
1206
1210
1005 1.00 (0.040) ±0.05 (0.002) 0.50 (0.020) ±0.05 (0.002)
1608 1.60 (0.063) ±0.15 (0.006) 0.80 (0.032) ±0.15 (0.006)
2012 2.00 (0.079) ±0.20 (0.008) 1.25 (0.049) ±0.20 (0.008)
3216 3.20 (0.126) ±0.20 (0.008) 1.60 (0.063) ±0.20 (0.008)
3225 3.20 (0.126) ±0.20 (0.008) 2.50 (0.098) ±0.20 (0.008)
0.30 (0.012) ±0.10 (0.004) 0.30 (0.012)
Solder Reflow Only
0.35 (0.014) ±0.15 (0.006) 0.70 (0.028)
See Table 2 for
Thickness
Solder Wave or
Solder Reflow
0.50 (0.02) ±0.25 (0.010)
0.50 (0.02) ±0.25 (0.010)
0.50 (0.02) ±0.25 (0.010)
0.75 (0.030)
N/A
Solder Reflow Only
Dimensions – Flexible Termination – Millimeters (Inches)
EIA Metric
Size Size
Code Code
S
L
W
Width
T
B
Mounting
Technique
Separation
Minimum
Length
Thickness
Bandwidth
0603
0805
1206
1210
1608
2012
3216
3225
1.60 (0.063) ±0.17 (0.007) 0.80 (0.032) ±0.15 (0.006)
2.00 (0.079) ±0.30 (0.012) 1.25 (0.049) ±0.30 (0.012)
3.30 (0.130) ±0.40 (0.016) 1.60 (0.063) ±0.35 (0.013)
3.30 (0.130) ±0.40 (0.016) 2.60 (0.102) ±0.30(0.012)
0.45 (0.018) ±0.15 (0.006)
0.50 (0.020) ±0.25 (0.010)
0.60 (0.024) ±0.25 (0.010)
0.60 (0.024) ±0.25 (0.010)
0.58 (0.023)
Solder Wave
or
Solder Reflow
0.75 (0.030)
See Table 2
for Thickness
N/A
Solder Reflow Only
Qualification/Certification
Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in
Table 4, Performance & Reliability.
Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test
methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. For additional
information regarding the Automotive Electronics Council and AEC–Q200, please visit their website at www.aecouncil.com.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1008_X8L_150C_SMD • 2/29/2016
4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8L Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Environmental Compliance
Lead (Pb)-Free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option).
Electrical Parameters/Characteristics
Item
Parameters/Characteristics
Operating Temperature Range
−55°C to +150°C
Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC)
±15% (−55ºC to 125ºC), +15, -40% (125ºC to 150ºC)
1Aging Rate (Maximum % Capacitance Loss/Decade Hour)
3.0%
250% of rated voltage
2Dielectric Withstanding Voltage (DWV)
3Dissipation Factor (DF) Maximum Limit @ 25°C
4Insulation Resistance (IR) Minimum Limit @ 25°C
(5 ±1 seconds and charge/discharge not exceeding 50 mA)
3.5% ( ≤ 16V) and 2.5% ( ≥ 25V)
500 megohm microfarads or 10 GΩ
(Rated voltage applied for 120 ±5 seconds @ 25°C)
1Regarding Aging Rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.
2DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the capacitor.
3Capacitance and dissipation factor (DF) measured under the following conditions:
1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance ≤10µF
120Hz ± 10Hz and 0.5 ± 0.1 Vrms if capacitance >10µF
4To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as
Automatic Level Control (ALC). The ALC feature should be switched to "ON".
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Rated DC
Voltage
Capacitance
Value
Dissipation Factor
(Maximum %)
Capacitance
Shift
Insulation
Resistance
Dielectric
X8L
≥ 25
≤ 16
3.0
5.0
All
±20%
10% of Initial Limit
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1008_X8L_150C_SMD • 2/29/2016
5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8L Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Insulation Resistance Limit Table (X8L Dielectric)
1,000 Megohm
EIA Case Size
500 Megohm
Microfarads or 10 GΩ
Microfarads or 100 GΩ
0201
0402
0603
0805
1206
1210
1808
1812
1825
2220
2225
N/A
ALL
< .012 µF
< .047 µF
< 0.15 µF
< 0.47 µF
< 0.39 µF
ALL
≥ .012 µF
≥ .047 µF
≥ 0.15 µF
≥ 0.47 µF
≥ 0.39 µF
N/A
< 2.2 µF
ALL
≥ 2.2 µF
N/A
< 10 µF
ALL
≥ 10 µF
N/A
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1008_X8L_150C_SMD • 2/29/2016
6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8L Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Table 1 – Capacitance Range/Selection Waterfall (0402 – 1210 Case Sizes)
Case Size/
Series
C0402C
C0603C
C0805C
C1206C
C1210C
Cap
Code
Cap
Voltage Code
9
8
4
3
9
8
4
3
5
9
8
4
3
5
9
8
4
3
5
9
8
4
3
5
Rated Voltage (VDC) 6.3 10 16 25 6.3 10 16 25 50 6.3 10 16 25 50 6.3 10 16 25 50 6.3 10 16 25 50
Product Availability and Chip Thickness Codes See Table 2 for Chip Thickness Dimensions
Capacitance Tolerance
12,000 pF
15,000 pF
18,000 pF
22,000 pF
27,000 pF
33,000 pF
39,000 pF
47,000 pF
56,000 pF
68,000 pF
82,000 pF
0.10 µF
0.12 µF
0.15 µF
0.18 µF
0.22 µF
0.27 µF
0.33 µF
0.39 µF
0.47 µF
0.56 µF
0.68 µF
0.82 µF
1.0 µF
1.2 µF
1.5 µF
1.8 µF
2.2 µF
2.7 µF
3.3 µF
3.9 µF
4.7 µF
5.6 µF
6.8 µF
8.2 µF
10 µF
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
274
334
394
474
564
684
824
105
125
155
185
225
275
335
395
475
565
685
825
106
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
BB BB BB BB
BB BB BB BB
BB BB BB BB
BB BB BB BB
BB BB
BB BB
BB BB
BB BB
CF CF CF CF CF
CF CF CF CF
CF CF CF CF
CF CF CF CF
CF CF
DG DG DG DG DG
DG DG DG DG DG
DP DP DP DP DG
DP DP DP DP
DP DP DP DP
DE DE DE DE
DE DE DE DE
DG DG DH DH
DG DG DH DH
DG DG DG
CF CF
FD FD FD FD FD
EG EG EG EG EG FD FD FD FD FD
FF FF FF FF FF
FG FG FG FG FG
FL FL FL FL FL
DG DG DG
ED ED ED ED
EH EH EH EH
EH EH EH EH
EF EF EH EH
EF EF EH EH
EH EH EH
EH EH EH
EH EH EH
EH EH EH
FM FM FM FM FM
FG FG FG FG
FG FG FG FG
FG FG FG FG
FG FG FG FG
FG FG FH FH
FM FM FM FM
FG FG FK FK
FG FG FS FS
FH FH FH
FM FM FM
FK FK FK
FS FS FS
Rated Voltage (VDC) 6.3 10 16 25 6.3 10 16 25 50 6.3 10 16 25 50 6.3 10 16 25 50 6.3 10 16 25 50
Cap
Code
Cap
Voltage Code
9
8
4
3
9
8
4
3
5
9
8
4
3
5
9
8
4
3
5
9
8
4
3
5
Case Size/Series
C0402C
C0603C
C0805C
C1206C
C1210C
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1008_X8L_150C_SMD • 2/29/2016
7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8L Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Table 2A – Chip Thickness/Tape & Reel Packaging Quantities
Paper Quantity1
Plastic Quantity
Thickness Case Thickness ±
Code
Size1
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
BB
CF
DP
DE
DG
DH
ED
EF
EG
EH
FD
FF
FG
FL
FH
FM
FK
FS
0402
0603
0805
0805
0805
0805
1206
1206
1206
1206
1210
1210
1210
1210
1210
1210
1210
1210
0.50 ± 0.05
0.80 ± 0.07
0.90 ± 0.10
1.00 ± 0.10
1.25 ± 0.15
1.25 ± 0.20
1.00 ± 0.10
1.20 ± 0.15
1.60 ± 0.15
1.60 ± 0.20
0.95 ± 0.10
1.10 ± 0.10
1.25 ± 0.15
1.40 ± 0.15
1.55 ± 0.15
1.70 ± 0.20
2.10 ± 0.20
2.50 ± 0.30
10,000
4,000
4,000
50,000
15,000
15,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
2,500
2,500
2,500
2,500
2,500
2,000
2,000
4,000
2,500
2,500
2,000
2,000
2,000
2,000
1,000
10,000
10,000
10,000
10,000
10,000
8,000
8,000
10,000
10,000
10,000
8,000
8,000
8,000
8,000
4,000
7" Reel
13" Reel
7" Reel
13" Reel
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
Paper Quantity1
Plastic Quantity
Package quantity based on finished chip thickness specifications.
1 If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA 0603 (1608 metric)
case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".
Table 2B – Bulk Packaging Quantities
Loose Packaging
Packaging Type
Bulk Bag (default)
Packaging C-Spec1
N/A2
Case Size
Packaging Quantities (pieces/unit packaging)
EIA (in)
Metric (mm)
Minimum
Maximum
0402
0603
0805
1206
1210
1808
1812
1825
2220
2225
1005
1608
2012
3216
3225
4520
4532
4564
5650
5664
50,000
1
20,000
1 The "Packaging C-Spec" is a 4 to 8 digit code which identifies the packaging type and/or product grade. When ordering, the proper code must be included in the 15th
through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details. Commercial Grade product ordered without
a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk bag packaging option for Automotive Grade products.
2 A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and Automotive Grade products). The 15th through
22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to out standard "Bulk Bag" packaging.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1008_X8L_150C_SMD • 2/29/2016
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8L Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Table 3A – Land Pattern Design Recommendations per IPC–7351 – Standard Termination
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
EIA
Size
Code
Metric
Size
Code
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
0402
0603
0805
1206
1210
1005
1608
2012
3216
3225
0.50
0.72
0.72
2.20
1.20
0.45
0.62
0.62
1.90
1.00
0.40
0.52
0.52
1.60
0.80
0.90
0.99
1.59
1.59
1.15
1.44
1.62
1.62
1.10
1.66
2.06
3.01
4.00
4.47
5.85
5.90
2.10
2.71
3.06
4.01
0.80
0.89
1.49
1.49
0.95
1.24
1.42
1.42
1.00
1.56
1.96
2.91
3.10
3.57
4.95
4.95
1.50
2.11
2.46
3.41
0.60
0.79
1.39
1.39
0.75
1.04
1.22
1.22
0.90
1.46
1.86
2.81
2.40
2.42
4.25
4.25
1.20
1.81
2.16
3.11
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder
processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification
testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
V1
Y
Y
V2
X
X
C
C
Grid Placement Courtyard
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1008_X8L_150C_SMD • 2/29/2016
9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8L Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Table 3B – Land Pattern Design Recommendations per IPC–7351 – Flexible Termination
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
EIA
Size
Code
Metric
Size
Code
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
0603
0805
1206
1210
1608
2012
3216
3225
0.85
1.25
1.10
4.00
2.10
0.75
1.05
1.00
3.10
1.50
0.65
0.85
0.90
2.40
1.20
1.00
1.60
1.60
1.35
1.65
1.65
1.55
1.90
2.80
4.40
5.90
5.90
2.60
2.90
3.80
0.90
1.50
1.50
1.15
1.45
1.45
1.45
1.80
2.70
3.50
5.00
5.00
2.00
2.30
3.20
0.75
1.40
1.40
0.95
1.25
1.25
1.35
1.70
2.60
2.80
4.30
4.30
1.70
2.00
2.90
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder
processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification
testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
V1
Y
Y
V2
X
X
C
C
Grid Placement Courtyard
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1008_X8L_150C_SMD • 2/29/2016 10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8L Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Reflow Soldering Profile:
KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection,
IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s
recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-STD-020 standard for moisture
sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions.
TP
TL
Termination Finish
tP
Maximum Ramp Up Rate = 3°C/sec
Maximum Ramp Down Rate = 6°C/sec
Profile Feature
SnPb
100% Matte Sn
tL
Preheat/Soak
Tsmax
Tsmin
Temperature Minimum (TSmin
Temperature Maximum (TSmax
Time (tS) from TSmin to TSmax
)
100°C
150°C
150°C
200°C
)
tS
60 – 120 seconds
60 – 120 seconds
Ramp-Up Rate (TL to TP)
Liquidous Temperature (TL)
Time Above Liquidous (tL)
Peak Temperature (TP)
3°C/second maximum 3°C/second maximum
25
183°C
60 – 150 seconds
235°C
217°C
60 – 150 seconds
260°C
25° C to Peak
Time
Time Within 5°C of Maximum
Peak Temperature (tP)
20 seconds maximum 30 seconds maximum
Ramp-Down Rate (TP to TL) 6°C/second maximum 6°C/second maximum
Time 25°C to Peak
6 minutes maximum
8 minutes maximum
Temperature
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1008_X8L_150C_SMD • 2/29/2016 11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8L Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress
Reference
Test or Inspection Method
Terminal Strength
JIS–C–6429
Appendix 1, Note: Force of 1.8 kg for 60 seconds.
Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G.
Flexible termination system – 3.0 mm (minimum).
Board Flex
JIS–C–6429
Magnification 50 X. Conditions:
a) Method B, 4 hours @ 155°C, dry heat @ 235°C
b) Method B @ 215°C category 3
Solderability
J–STD–002
c) Method D, category 3 @ 260°C
Temperature Cycling
Biased Humidity
JESD22 Method JA–104
MIL–STD–202 Method 103
1,000 cycles (−55°C to +150°C). Measurement at 24 hours +/- 4 hours after test conclusion.
Load Humidity: 1,000 hours 85°C/85%RH and rated voltage. Add 100K ohm resistor. Measurement
at 24 hours +/- 4 hours after test conclusion.
Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor. Measurement at
24 hours +/- 4 hours after test conclusion.
t = 24 hours/cycle. Steps 7a and 7b not required. Measurement at 24 hours. +/- 4 hours after test
conclusion.
−55°C/+150. Note: Number of cycles required – 300. Maximum transfer time – 20 seconds. Dwell
Moisture Resistance
Thermal Shock
MIL–STD–202 Method 106
MIL–STD–202 Method 107
time – 15 minutes. Air – Air.
MIL–STD–202 Method 108
/EIA–198
High Temperature Life
Storage Life
1,000 hours at 150°C with 2 X rated voltage applied.
MIL–STD–202 Method 108 150°C, 0 VDC for 1,000 hours.
5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 secure
MIL–STD–202 Method 204 points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2"
from any secure point. Test from 10 – 2,000 Hz
Vibration
Mechanical Shock
MIL–STD–202 Method 213 Figure 1 of Method 213, Condition F.
Resistance to Solvents MIL–STD–202 Method 215 Add aqueous wash chemical, OKEM Clean or equivalent.
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other
environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term
storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may
increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70%
relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of
chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of
receipt.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1008_X8L_150C_SMD • 2/29/2016 12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8L Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Construction – Standard Termination
Detailed Cross Section
Dielectric Material
(BaTiO3)
Dielectric Material
(BaTiO3)
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn /
SnPb - 5% Pb min)
End Termination/
External Electrode
(Cu)
Inner Electrodes
(Ni)
End Termination/
External Electrode
(Cu)
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn /
SnPb - 5% Pb min)
Inner Electrodes
(Ni)
Construction – Flexible Termination
Detailed Cross Section
Dielectric Material
(BaTiO3)
Barrier Layer
(Ni)
End Termination/
External Electrode
(Cu)
Termination Finish
(100% Matte Sn /
Epoxy Layer
(Ag)
SnPb - 5% Pb min)
Dielectric Material
(BaTiO3)
Inner Electrodes
(Ni)
End Termination/
External Electrode
(Cu)
Epoxy Layer
(Ag)
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn /
SnPb - 5% Pb min)
Inner Electrodes
(Ni)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1008_X8L_150C_SMD • 2/29/2016 13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8L Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Capacitor Marking (Optional):
These surface mount multilayer ceramic capacitors are
normally supplied unmarked. If required, they can be marked
as an extra cost option. Marking is available on most KEMET
devices but must be requested using the correct ordering
code identifier(s). If this option is requested, two sides of the
ceramic body will be laser marked with a “K” to identify KEMET,
followed by two characters (per EIA–198 - see table below) to
identify the capacitance value. EIA 0603 case size devices are
limited to the “K” character only.
Marking appears in legible contrast. Illustrated below is an
example of an MLCC with laser marking of “KA8”, which
designates a KEMET device with rated capacitance of 100 µF.
Orientation of marking is vendor optional.
2-Digit
KEMET
Capacitance
ID
Code
Laser marking option is not available on:
• C0G, Ultra Stable X8R and Y5V dielectric devices
• EIA 0402 case size devices
• EIA 0603 case size devices with Flexible Termination option.
• KPS Commercial and Automotive Grade stacked devices.
• X7R dielectric products in capacitance values outlined below
EIA Case Size
0603
Metric Size Code
Capacitance
≤ 170 pF
1608
2012
3216
3225
4520
4532
4564
5650
5664
0805
≤ 150 pF
1206
≤ 910 pF
1210
≤ 2,000 pF
≤ 3,900 pF
≤ 6,700 pF
≤ 0.018 µF
≤ 0.027 µF
≤ 0.033 µF
1808
1812
1825
2220
2225
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1008_X8L_150C_SMD • 2/29/2016 14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8L Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Capacitor Marking (Optional) cont’d
Capacitance (pF) For Various Alpha/Numeral Identifiers
Numeral
Alpha
Character
9
0
1
2
3
4
5
6
7
8
Capacitance (pF)
A
B
C
D
E
F
G
H
J
0.1
0.11
0.12
0.13
0.15
0.16
0.18
0.2
1 0
1.1
1 2
1 3
1 5
1 6
1 8
2 0
2 2
2.4
2.7
3 0
3 3
3 6
3 9
4 3
4.7
5.1
5 6
6 2
6 8
7 5
8 2
9.1
2 5
3 5
4 0
4 5
5 0
6 0
7 0
8 0
9 0
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
51
56
62
68
75
82
91
25
35
40
45
50
60
70
80
90
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
250
350
400
450
500
600
700
800
900
1,000
1,100
1,200
1,300
1,500
1,600
1,800
2,000
2,200
2,400
2,700
3,000
3,300
3,600
3,900
4,300
4,700
5,100
5,600
6,200
6,800
7,500
8,200
9,100
2,500
3,500
4,000
4,500
5,000
6,000
7,000
8,000
9,000
10,000
11,000
12,000
13,000
15,000
16,000
18,000
20,000
22,000
24,000
27,000
30,000
33,000
36,000
39,000
43,000
47,000
51,000
56,000
62,000
68,000
75,000
82,000
91,000
25,000
35,000
40,000
45,000
50,000
60,000
70,000
80,000
90,000
100,000 1,000,000
110,000 1,100,000
120,000 1,200,000
130,000 1,300,000
150,000 1,500,000
160,000 1,600,000
180,000 1,800,000
200,000 2,000,000
220,000 2,200,000
240,000 2,400,000
270,000 2,700,000
300,000 3,000,000
330,000 3,300,000
360,000 3,600,000
390,000 3,900,000
430,000 4,300,000
470,000 4,700,000
510,000 5,100,000
560,000 5,600,000
620,000 6,200,000
680,000 6,800,000
750,000 7,500,000
820,000 8,200,000
910,000 9,100,000
250,000 2,500,000
350,000 3,500,000
400,000 4,000,000
450,000 4,500,000
500,000 5,000,000
600,000 6,000,000
700,000 7,000,000
800,000 8,000,000
900,000 9,000,000
10,000,000
11,000,000
12,000,000
13,000,000
15,000,000
16,000,000
18,000,000
20,000,000
22,000,000
24,000,000
27,000,000
30,000,000
33,000,000
36,000,000
39,000,000
43,000,000
47,000,000
51,000,000
56,000,000
62,000,000
68,000,000
75,000,000
82,000,000
91,000,000
25,000,000
35,000,000
40,000,000
45,000,000
50,000,000
60,000,000
70,000,000
80,000,000
90,000,000
100,000,000
110,000,000
120,000,000
130,000,000
150,000,000
160,000,000
180,000,000
200,000,000
220,000,000
240,000,000
270,000,000
300,000,000
330,000,000
360,000,000
390,000,000
430,000,000
470,000,000
510,000,000
560,000,000
620,000,000
680,000,000
750,000,000
820,000,000
910,000,000
250,000,000
350,000,000
400,000,000
450,000,000
500,000,000
600,000,000
700,000,000
800,000,000
900,000,000
0.22
0.24
0.27
0.3
K
L
M
N
P
Q
R
S
T
U
V
W
X
Y
Z
a
0.33
0.36
0.39
0.43
0.47
0.51
0.56
0.62
0.68
0.75
0.82
0.91
0.25
0.35
0.4
b
d
e
0.45
0.5
f
m
n
0.6
0.7
t
0.8
y
0.9
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1008_X8L_150C_SMD • 2/29/2016 15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8L Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA
Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on
reeling quantities for commercial chips.
Bar Code Label
Anti-Static Reel
®
Embossed Plastic* or
Punched Paper Carrier.
Chip and KPS Orientation in Pocket
(except 1825 Commercial, and 1825 and 2225 Military)
KEMET
Sprocket Holes
Embossment or Punched Cavity
8 mm, 12 mm
or 16 mm Carrier Tape
Anti-Static Cover Tape
(.10 mm (.004") Maximum Thickness)
178 mm (7.00")
or
330 mm (13.00")
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm)
New 2 mm Pitch Reel Options*
Embossed Plastic Punched Paper
Tape
Packaging
Ordering Code
(C-Spec)
C-3190
7" Reel
13" Reel
7" Reel
13" Reel
EIA Case Size Size
(W)*
Packaging Type/Options
Pitch (P1)*
Pitch (P1)*
01005 – 0402
0603
8
8
2
2/4
4
2
2/4
4
Automotive grade 7" reel unmarked
Automotive grade 13" reel unmarked
Commercial grade 7" reel unmarked
Commercial grade 13" reel unmarked
C-3191
C-7081
0805
8
4
4
4
4
C-7082
1206 – 1210
1805 – 1808
≥ 1812
8
4
4
* 2 mm pitch reel only available for 0603 EIA case size.
2 mm pitch reel for 0805 EIA case size under development.
12
12
12
16
8
4
4
8
8
Benefits of Changing from 4 mm to 2 mm Pitching Spacing
• Lower placement costs
• Double the parts on each reel results in fewer reel
changes and increased efficiency
• Fewer reels result in lower packaging, shipping and
storage costs, reducing waste
KPS 1210
8
8
KPS 1812 & 2220
Array 0508 & 0612
12
4
12
4
*Refer to Figures 1 & 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 & 7 for tolerance specifications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1008_X8L_150C_SMD • 2/29/2016 16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8L Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
T
T
P2
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
2
E
1
Po
ØDo
Ao
F
Ko
W
E
2
B
1
Bo
S
1
P
1
T
1
Embossment
For cavity size,
see Note 1 Table 4
Center Lines of Cavity
ØD
1
Cover Tape
is for tape feeder reference only,
including draft concentric about B
B
1
o
.
User Direction of Unreeling
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
D1 Minimum
Note 1
1.0
(0.039)
R Reference S1 Minimum
T
T1
Tape Size
8 mm
D0
E1
P0
P2
Note 2
Note 3
Maximum
Maximum
25.0
(0.984)
1.5 +0.10/-0.0
(0.059 +0.004/-0.0)
1.75 ±0.10
4.0 ±0.10
2.0 ±0.05
0.600
(0.024)
0.600
(0.024)
0.100
(0.004)
12 mm
16 mm
(0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002)
1.5
(0.059)
30
(1.181)
Variable Dimensions — Millimeters (Inches)
B1 Maximum
Note 4
4.35
(0.171)
E2
T2
W
Tape Size
8 mm
Pitch
F
P1
A0,B0 & K0
Minimum
6.25
(0.246)
Maximum
2.5
(0.098)
Maximum
8.3
(0.327)
3.5 ±0.05
(0.138 ±0.002) (0.157 ±0.004)
4.0 ±0.10
Single (4 mm)
Single (4 mm) &
Double (8 mm)
8.2
10.25
5.5 ±0.05
8.0 ±0.10
4.6
12.3
12 mm
16 mm
Note 5
(0.323)
(0.404)
(0.217 ±0.002) (0.315 ±0.004)
(0.181)
(0.484)
12.1
(0.476)
14.25
(0.561)
7.5 ±0.05 12.0 ±0.10
(0.138 ±0.002) (0.157 ±0.004)
4.6
(0.181)
16.3
(0.642)
Triple (12 mm)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and
hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4).
(e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1008_X8L_150C_SMD • 2/29/2016 17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8L Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
T
P2
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
E
1
Po
ØDo
0
A
F
W
2
E
0
B
Bottom Cover Tape
P
1
G
Cavity Size,
See
1
T
1
T
Top Cover Tape
Center Lines of Cavity
Note 1, Table 7
Bottom Cover Tape
User Direction of Unreeling
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
R Reference
Note 2
Tape Size
8 mm
D0
E1
P0
P2
T1 Maximum
G Minimum
0.10
1.5 +0.10 -0.0
(0.059 +0.004 -0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
0.75
(0.030)
25
(0.984)
(0.004)
Maximum
Variable Dimensions — Millimeters (Inches)
Tape Size
8 mm
Pitch
E2 Minimum
F
P1
T Maximum
W Maximum
A0 B0
2.0 ±0.05
(0.079 ±0.002)
4.0 ±0.10
8.3
(0.327)
8.3
Half (2 mm)
Single (4 mm)
6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
1.1
(0.098)
Note 1
8 mm
(0.157 ±0.004)
(0.327)
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
c) rotation of the component is limited to 20° maximum (see Figure 3).
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).
e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1008_X8L_150C_SMD • 2/29/2016 18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8L Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
8 mm
Peel Strength
0.1 to 1.0 Newton (10 to 100 gf)
0.1 to 1.3 Newton (10 to 130 gf)
12 and 16 mm
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180°
from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
°
T
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Typical Pocket Centerline
Tape
Maximum
°
°
T
s
Width (mm) Rotation (
)
8,12
16 – 200
20
10
Bo
Tape
Maximum
°
S
Width (mm) Rotation (
)
8,12
16 – 56
72 – 200
20
10
5
Typical Component Centerline
Ao
Figure 5 – Bending Radius
Figure 4 – Maximum Lateral Movement
Embossed
Carrier
Punched
Carrier
8 mm & 12 mm Tape
16 mm Tape
0.5 mm maximum
0.5 mm maximum
1.0 mm maximum
1.0 mm maximum
R
Bending
Radius
R
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1008_X8L_150C_SMD • 2/29/2016 19
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8L Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Figure 6 – Reel Dimensions
Full Radius,
W3 (Includes
flange distortion
at outer edge)
Access Hole at
Slot Location
(Ø 40 mm minimum)
See Note
W
2 (Measured at hub)
D
(See Note)
A
N
C
(Arbor hole
W
1 (Measured at hub)
diameter)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
B
(see Note)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
8 mm
A
B Minimum
C
D Minimum
178 ±0.20
(7.008 ±0.008)
or
330 ±0.20
(13.000 ±0.008)
1.5
(0.059)
13.0 +0.5/-0.2
(0.521 +0.02/-0.008)
20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size
8 mm
N Minimum
W1
W2 Maximum
W3
8.4 +1.5/-0.0
(0.331 +0.059/-0.0)
14.4
(0.567)
50
(1.969)
12.4 +2.0/-0.0
18.4
Shall accommodate tape width
without interference
12 mm
16 mm
(0.488 +0.078/-0.0)
(0.724)
16.4 +2.0/-0.0
(0.646 +0.078/-0.0)
22.4
(0.882)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1008_X8L_150C_SMD • 2/29/2016 20
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8L Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Embossed Carrier
Carrier Tape
Round Sprocket Holes
Punched Carrier
8 mm & 12 mm only
START
END
Top Cover Tape
Elongated Sprocket Holes
(32 mm tape and wider)
100 mm
Minimum Leader
400 mm Minimum
Trailer
160 mm Minimum
Components
Top Cover Tape
Figure 8 – Maximum Camber
Elongated sprocket holes
(32 mm & wider tapes)
Carrier Tape
Round Sprocket Holes
1 mm Maximum, either direction
Straight Edge
250 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1008_X8L_150C_SMD • 2/29/2016 21
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8L Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
KEMET Corporation
World Headquarters
Europe
Asia
Southern Europe
Sasso Marconi, Italy
Tel: 39-051-939111
Northeast Asia
Hong Kong
Tel: 852-2305-1168
2835 KEMET Way
Simpsonville, SC 29681
Skopje, Macedonia
Tel: 389-2-55-14-623
Shenzhen, China
Tel: 86-755-2518-1306
Mailing Address:
P.O. Box 5928
Greenville, SC 29606
Beijing, China
Central Europe
Landsberg, Germany
Tel: 49-8191-3350800
Tel: 86-10-5877-1075
www.kemet.com
Tel: 864-963-6300
Fax: 864-963-6521
Shanghai, China
Tel: 86-21-6447-0707
Kamen, Germany
Tel: 49-2307-438110
Corporate Offices
Fort Lauderdale, FL
Tel: 954-766-2800
Seoul, South Korea
Tel: 82-2-6294-0550
Northern Europe
Wyboston, United Kingdom
Tel: 44-1480-273082
Taipei, Taiwan
Tel: 886-2-27528585
North America
Northeast
Wilmington, MA
Tel: 978-658-1663
Espoo, Finland
Tel: 358-9-5406-5000
Southeast Asia
Singapore
Tel: 65-6701-8033
Southeast
Lake Mary, FL
Tel: 407-855-8886
Penang, Malaysia
Tel: 60-4-6430200
Central
Novi, MI
Tel: 248-994-1030
Bangalore, India
Tel: 91-806-53-76817
Irving, TX
Tel: 972-915-6041
West
Milpitas, CA
Tel: 408-433-9950
Mexico
Guadalajara, Jalisco
Tel: 52-33-3123-2141
Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not
assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of
KEMET Electronics Corporation.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1008_X8L_150C_SMD • 2/29/2016 22
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8L Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Disclaimer
All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and
verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.
All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are
not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use. The Information is intended for use only
by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise
provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still
occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective
circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not
be required.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1008_X8L_150C_SMD • 2/29/2016 23
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