C0603X393GBGACAUTO_技术文档

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System (HV FT-CAP),

C0G Dielectric, 500 – 3,000 VDC (Automotive Grade)

Overview

KEMET’s Automotive Grade High Voltage with Flexible

Termination (HV FT-CAP) surface mount MLCCs in C0G

dielectric address the primary failure mode of MLCCs– ﬂex

cracks, which are typically the result of excessive tensile and

shear stresses produced during board ﬂexure and thermal

cycling. Featuring several of the highest CV (capacitance/

voltage) values available in the industry, these devices utilize

a pliable and conductive silver epoxy between the base

metal and nickel barrier layers of the termination system.

The addition of this epoxy layer inhibits the transfer of board

stress to the rigid ceramic body, therefore mitigating ﬂex

cracks which can result in low IR or short circuit failures.

Although ﬂexible termination technology does not eliminate

the potential for mechanical damage that may propagate

during extreme environmental and handling conditions,

it does provide superior ﬂex performance over standard

termination systems.

These devices exhibit low ESR at high frequencies and ﬁnd

conventional use as snubbers or ﬁlters in applications such as

switching power supplies and lighting ballasts. Their exceptional

performance at high frequencies has made high voltage

MLCC’s the preferred dielectric choice of design engineers

worldwide. In addition to their use in power supplies, these

capacitors are widely used in industries related to automotive

(hybrid), telecommunications, medical, military, aerospace,

semiconductors and test/diagnostic equipment.

Whether under-hood or in-cabin, these capacitors are designed

to provide reliable performance in mission and safety

critical automotive circuits. Stricter testing protocol and

inspection criteria have been established for automotive grade

products in recognition of potentially harsh environmental

conditions. KEMET automotive grade series capacitors meet

the demanding Automotive Electronics Council’s AEC-Q200

qualiﬁcation requirements.

KEMET’s high voltage surface mount MLCCs in C0G dielectric

feature a 125°C maximum operating temperature and offers

the most stable voltage and temperature performance of all

ceramic dielectric materials. C0G (NP0) dielectric capacitors

exhibit no change in capacitance with respect to time and

voltage and boasts a negligible change in capacitance with

reference to ambient temperature. Capacitance change is

limited to ±30ppm/ºC from −55°C to +125°C.

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Ordering Information

C

2225

X

393

J

C

G

A

C

AUTO

Case Size Speciﬁcation/

Capacitance

Code (pF)

Capacitance Rated Voltage

Failure Rate/ Termination

Ceramic

Dielectric

G = C0G

Packaging/Grade (C-Spec)

(L" x W")

Series

Tolerance¹

(VDC)

Design

Finish²

0603

0805

1206

1210

1808

1812

1825

2220

2225

X= Flexible

Two signiﬁcant

B = ±0.10 pF C = 500

A = N/A

C = 100%

Matte Sn

See

Termination digits and number C = ±0.25 pF B = 630

“Packaging C-Spec

Ordering Options Table”

below

of zeros.

D = ±0.5 pF

F = ±1%

D = 1,000

F = 1,500

G = 2,000

Z = 2,500

H = 3,000

G = ±2%

J = ±5%

K = ±10%

M = ±20%

¹Additional capacitance tolerance offerings may be available. Contact KEMET for details.

²Additional termination ﬁnish options may be available. Contact KEMET for details.

One world. One KEMET

C1081_C0G_HV_FT_AUTO_SMD • 6/8/2017

1

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System (HV FT-CAP), C0G Dielectric, 500 – 3,000 VDC (Automotive Grade)

Packaging C-Spec Ordering Options Table

Packaging/Grade

Packaging Type¹

Ordering Code (C-Spec)

Commercial Grade¹

Bulk Bag

Not required (Blank)

TU

7" Reel/Unmarked

7411 (EIA 0603 and smaller case sizes)

7210 (EIA 0805 and larger case sizes)

13" Reel/Unmarked

7" Reel/Unmarked/2mm pitch²

13" Reel/Unmarked/2mm pitch²

7081

7082

Automotive Grade³

7" Reel

AUTO

AUTO7411 (EIA 0603 and smaller case sizes)

AUTO7210 (EIA 0805 and larger case sizes)

13" Reel/Unmarked

7" Reel/Unmarked/2mm pitch²

13" Reel/Unmarked/2mm pitch²

3190

3191

¹Default packaging is “Bulk Bag”. An ordering code C-Spec is not required for “Bulk Bag” packaging.

¹The terms “Marked” and “Unmarked” pertain to laser marking option of capacitors. All packaging options labeled as “Unmarked” will contain

capacitors that have not been laser marked. The option to laser mark is not available on these devices. For more information see “Capacitor Marking”.

²The 2mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case

size devices. For more information regarding 2mm pitch option see “Tape & Reel Packaging Information”.

³Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L” x W”) and thickness dimension. See “Chip Thickness/Tape & Reel

Packaging Quantities” and “Tape & Reel Packaging Information”.

³For additional Information regarding “AUTO” C-Spec options, see “Automotive C-Spec Information”.

³All Automotive packaging C-Specs listed exclude the option to laser mark components. The option to laser mark is not available on these devices. For

more information see “Capacitor Marking”.

Beneﬁts

• AEC–Q200 automotive qualiﬁed

• High thermal stability

• High ripple current capability

• Preferred capacitance solution at line frequencies

and into the MHz range

• No capacitance change with respect to applied

rated DC voltage

• −55°C to +125°C operating temperature range

• Superior ﬂex performance (up to 5mm)

• Lead (Pb)-Free, RoHS and REACH compliant

• EIA 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2220

and 2225 case sizes

• DC voltage ratings of 500 V, 630 V, 1 KV, 1.5 KV, 2 KV,

2.5 KV and 3 KV

• Capacitance offerings ranging from 1 pF to 39 nF

• Available capacitance tolerances of ±0.10 pF, ±0.25 pF,

±0.5 pF, ±1%, ±2%, ±5%, ±10% and ±20%

• No piezoelectric noise

• Negligible capacitance change with respect to

temperature from −55°C to +125°C

• No capacitance decay with time

• Non-polar device, minimizing installation concerns

• 100% pure matte tin-plated termination ﬁnish

allowing for excellent solderability

• Extremely low ESR and ESL

Applications

Typical applications include switch mode power supplies (input ﬁlters, resonators, tank circuits, snubbed circuits, output

ﬁlters), high voltage coupling and DC blocking, lighting ballasts, voltage multiplier circuits, DC/DC converters and coupling

capacitors in Ćuk converters. Markets include power supply, LCD ﬂuorescent backlight ballasts, HID lighting, telecom

equipment, industrial and medical equipment/control, LAN/WAN interface, analog and digital modems, and automotive.

C1081_C0G_HV_FT_AUTO_SMD • 6/8/2017

2

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System (HV FT-CAP), C0G Dielectric, 500 – 3,000 VDC (Automotive Grade)

Automotive C-Spec Information

KEMET Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council.

Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualiﬁcation for Passive

Components. These products are supported by a Product Change Notiﬁcation (PCN) and Production Part Approval Process

warrant (PPAP).

Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec,

“AUTO”. This C-Spec was developed in order to better serve small and medium sized companies that prefer an automotive

grade component without the requirement to submit a customer Source Controlled Drawing (SCD) or speciﬁcation for review

by a KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET’s OEM Automotive customers

and are not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are

limited (see details below).

Product Change Notiﬁcation (PCN)

The KEMET Product Change Notiﬁcation system is used to communicate primarily the following types of changes:

• Product/process changes that affect product form, ﬁt, function, and/or reliability

• Changes in manufacturing site

• Product obsolescence

Customer Notiﬁcation due to:

KEMET Automotive

C-Spec

Days prior to

implementation

Process/Product change

Obsolescence*

KEMET assigned¹

AUTO

Yes (with approval and sign off)

Yes (without approval)

Yes

180 days Minimum

90 days Minimum

¹KEMET assigned C-Specs require the submittal of a customer SCD or customer speciﬁcation for review. For additional information contact KEMET.

Production Part Approval Process (PPAP)

The purpose of the Production Part Approval Process is:

• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.

• To provide the evidence that all customer engineering design record and speciﬁcation requirements are properly

understood and fulﬁlled by the manufacturing organization.

• To demonstrate that the established manufacturing process has the potential to produce the part

PPAP (Product Part Approval Process) Level

KEMET Automotive

C-Spec

1

●

○

2

3

●

○

4

5

KEMET assigned¹

AUTO

●

¹KEMET assigned C-Specs require the submittal of a customer SCD or customer speciﬁcation for review. For additional information contact KEMET.

● Part Number speciﬁc PPAP available

○ Product family PPAP only

C1081_C0G_HV_FT_AUTO_SMD • 6/8/2017

3

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System (HV FT-CAP), C0G Dielectric, 500 – 3,000 VDC (Automotive Grade)

Dimensions – Millimeters (Inches)

L

ꢁ

T

ꢀ

S

EIA Size

Code

Metric Size

Code

L

W

Width

T

B

Mounting

Technique

Separation

Minimum

Length

Thickness

Bandwidth

1.60 (0.063)

±0.15 (0.006)

2.00 (0.079)

±0.30 (0.012)

3.30 (0.130)

±0.40 (0.016)

3.30 (0.130)

±0.40 (0.016)

4.70 (0.185)

±0.50 (0.020)

4.50 (0.178)

±0.40 (0.016)

4.60 (0.181)

±0.40 (0.016)

5.90 (0.232)

±0.75 (0.030)

5.90 (0.232)

±0.75 (0.030)

0.80 (0.032)

±0.15 (0.006)

1.25 (0.049)

±0.30 (0.012)

1.60 (0.063)

±0.35 (0.013)

2.60 (0.102)

±0.30 (0.012)

2.00 (0.079)

±0.20 (0.008)

3.20 (0.126)

±0.30 (0.012)

6.40 (0.252)

±0.40 (0.016)

5.00 (0.197)

±0.40 (0.016)

0.35 (0.014)

±0.15 (0.006)

0.50 (0.02)

±0.25 (0.010)

0.60 (0.024)

±0.25 (0.010)

0.60 (0.024)

±0.25 (0.010)

0.70 (0.028)

±0.35 (0.014)

0.70 (0.028)

±0.35 (0.014)

0.70 (0.028)

±0.35 (0.014)

0.70 (0.028)

±0.35 (0.014)

0.70 (0.028)

±0.35 (0.014)

0603

0805

1206

1210

1808

1812

1825

2220

2225

1608

2012

3216

3225

4520

4532

4564

5650

5664

0.70 (0.028)

Solder Wave or

Solder Reﬂow

0.75 (0.030)

See Table 2 for

Thickness

N/A

Solder Reﬂow

Only

6.40 (0.248)

±0.40 (0.016)

Qualiﬁcation/Certiﬁcation

Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details

regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualiﬁcation for Passive

Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their

website at www.aecouncil.com.

C1081_C0G_HV_FT_AUTO_SMD • 6/8/2017

4

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System (HV FT-CAP), C0G Dielectric, 500 – 3,000 VDC (Automotive Grade)

Environmental Compliance

Lead (Pb)-free, RoHS, and REACH compliant without exemptions.

Electrical Parameters/Characteristics

Item

Parameters/Characteristics

Operating Temperature Range

−55°C to +125°C

±30 ppm/ºC

0%

Capacitance Change with Reference to

+25°C and 0 VDC Applied (TCC)

Aging Rate (Maximum % Capacitance Loss/Decade Hour)

¹Dielectric Withstanding Voltage (DWV)

150% of rated voltage for voltage rating of < 1,000 V

120% of rated voltage for voltage rating of ≥ 1,000 V

(5±1 seconds and charge/discharge not exceeding 50 mA)

²Dissipation Factor (DF) Maximum Limit at 25ºC

³Insulation Resistance (IR) Limit at 25°C

0.1%

1,000 megohm microfarads or 100 GΩ

(500 VDC applied for 120±5 seconds at 25°C)

¹DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the

capacitor.

²Capacitance and dissipation factor (DF) measured under the following conditions:

1 MHz ±100 kHz and 1.0 Vrms ±0.2 V if capacitance ≤ 1,000 pF

1 kHz ±50 Hz and 1.0 Vrms ±0.2 V if capacitance > 1,000 pF

³To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.

Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known

as Automatic Level Control (ALC). The ALC feature should be switched to “ON.”

Post Environmental Limits

High Temperature Life, Biased Humidity, Moisture Resistance

Rated DC

Voltage

Capacitance Dissipation Factor Capacitance

Insulation

Dielectric

C0G

Value

(Maximum %)

Shift

Resistance

10% of Initial

Limit

All

0.5

0.3% or ±0.25 pF

C1081_C0G_HV_FT_AUTO_SMD • 6/8/2017

5

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System (HV FT-CAP), C0G Dielectric, 500 – 3,000 VDC (Automotive Grade)

Table 1A – Capacitance Range/Selection Waterfall (0603 – 1808 Case Sizes)

Case Size/Series

C0603X C0805X

C1206X

C1210X

C1808X

Voltage Code

C

B

D

C

B

D

C

B

D

F

G

C

B

D

F

G

C

B

D

F

G

Z

H

Cap

Capacitance

Rated Voltage (VDC)

Code

Product Availability and Chip Thickness Codes

See Table 2 for Chip Thickness Dimensions

Capacitance Tolerance

1.0 - 9.1 pF*

10 pF

11 pF

12 pF

13 pF

15 pF

16 pF

18 pF

20 pF

22 pF

24 pF

27 pF

30 pF

33 pF

36 pF

39 pF

43 pF

47 pF

51 pF

56 pF

62 pF

68 pF

75 pF

82 pF

91 pF

100 pF

110 pF

120 pF

130 pF

150 pF

160 pF

180 pF

200 pF

220 pF

240 pF

270 pF

300 pF

330 pF

360 pF

390 pF

430 pF

470 pF

510 pF

560 pF

620 pF

680 pF

750 pF

820 pF

910 pF

1,000 pF

109 - 169*

100

110

120

130

150

160

180

200

220

240

270

300

330

360

390

430

470

510

560

620

680

750

820

910

101

111

121

131

151

161

181

201

221

241

271

301

331

361

391

431

471

511

561

621

681

751

821

911

102

B

C

D

DG DG DG

LB LB LB LB LB LB LB

F

G

J

K

M

DG DG DG EU EU EU EU EU FM FM FM FM FM LB LB LB LB LB LB LB

DG DG DG EF EF EF EU EU FM FM FM FM FM LB LB LB LB LB LB LB

CJ CJ CJ DG DG DG EF EF EF EU EU FM FM FM FM FM LB LB LB LB LB LC LB

CJ CJ CJ DG DG DG EF EF EF EU EU FZ FZ FZ FM FM LA LA LA LA LB LC LB

CJ CJ CJ DG DG DG EF EF EF EU EU FZ FZ FZ FM FM LA LA LA LA LB LC LC

CJ CJ CJ DG DG DG EF EF EF EU EU FZ FZ FZ FM FM LA LA LA LA LC LC LC

CJ CJ CJ DG DG DG EF EU EU EU EU FZ FZ FZ FM FM LA LA LA LA LC LC

CJ CJ

DG DG DG EF EU EU EU EU FZ FZ FZ FM FM LA LA LA LB LC LC

DG DG DG EF EU EU EU EU FZ FZ FZ FK FK LA LA LA LB LC LC

DG DG DC EF EU EU EU

DG DG DC EU EU EU EU

DG DG DD EU EU EU EU

DG DG DG EU EU EU EU

DG DG DG EU EU EU

FZ FZ FZ FK FK LA LA LA LB LC LC

FZ FZ FZ FK FS LA LA LA LB LA LC

FZ FM FM FS FS LA LB LB LC LA

FZ FM FM FS FS LA LB LB LC LB

FZ FM FM FS FS LA LB LB LA LC

FZ FM FM FS FS LB LB LB LA LC

DG DG DG EU EU EU

DG DG DG EU EF EU

FZ FM FM FM

FM FM FM FY

LB LB LB LA

LB LB LB LB

DC DC

EU EF EU

Rated Voltage (VDC)

Cap

Code

Capacitance

Voltage Code

C

B

D

C

B

D

C

B

D

F

G

C

B

D

F

G

C

B

D

F

G

Z

H

Case Size/Series

C0603X

C0805X

C1206X

C1210X

C1808X

*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91)

KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage

capability within the same form factor (conﬁguration and dimensions).

These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts.

C1081_C0G_HV_FT_AUTO_SMD • 6/8/2017

6

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System (HV FT-CAP), C0G Dielectric, 500 – 3,000 VDC (Automotive Grade)

Table 1A – Capacitance Range/Selection Waterfall (0603 – 1808 Case Sizes) cont’d

Case Size/Series

C0603X C0805X

C1206X

C1210X

C1808X

Voltage Code

C

B

D

C

B

D

C

B

D

F

G

C

B

D

F

G

C

B

D

F

G

Z

H

Cap

Capacitance

Rated Voltage (VDC)

Code

Product Availability and Chip Thickness Codes

See Table 2 for Chip Thickness Dimensions

Capacitance Tolerance

1,100 pF

1,200 pF

1,300 pF

1,500 pF

1,600 pF

1,800 pF

2,000 pF

2,200 pF

2,400 pF

2,700 pF

3,000 pF

3,300 pF

3,600 pF

3,900 pF

4,300 pF

4,700 pF

5,100 pF

5,200 pF

6,200pF

6,800pF

7,500pF

8,200pF

9,100 pF

10,000 pF

12,000 pF

15,000 pF

18,000 pF

22,000 pF

112

122

132

152

162

182

202

222

242

272

302

332

362

392

432

472

512

562

622

682

752

822

912

103

123

153

183

223

F

G

J

K

M

DC DC

DD DD

DG DG

EF EU ED

EF EU EF

EU EQ EF

EU EQ EU

EQ EQ

ER ER

ES ES

EE EE

EF EF

FM FK FK FS

FM FS FS

FK FS FS

FK FL FS

FS FL FS

FS FL FF

FS FM FG

FL FM FG

FL FY FL

FM FY FL

FM FY FM

FY FS FM

FY FE FY

FS FF

LC LC LC LB

LC LC LC LC

LC LC LC

LC LA LB

LC LA LC

LA LA LA

LA LB LA

LA LC LA

LA LC LB

LA LB LB

LB LC LC

LC LC LC

LA LA

EU EU

FS FF

FF FF

FG FG

FM FM

FY FY

LA LA

LB LB

LC LC

EU EU

Rated Voltage (VDC)

Cap

Code

Capacitance

Voltage Code

C

B

D

C

B

D

C

B

D

F

G

C

B

D

F

G

C

B

D

F

G

Z

H

Case Size/Series

C0603X

C0805X

C1206X

C1210X

C1808X

*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91)

KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage

capability within the same form factor (conﬁguration and dimensions).

These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts.

C1081_C0G_HV_FT_AUTO_SMD • 6/8/2017

7

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System (HV FT-CAP), C0G Dielectric, 500 – 3,000 VDC (Automotive Grade)

Table 1B – Capacitance Range/Selection Waterfall (1812 – 2225 Case Sizes)

Case Size/

C1812X

C1825X

C2220X

C2225X

Series

Voltage Code

C

B

D

F

G

Z

H

C

B

D

F

G

Z

H

C

B

D

F

G

Z

H

C

B

D

F

G

Z

H

Cap

Code

Cap

Rated Voltage (VDC)

Capacitance

Tolerance

Product Availability and Chip Thickness Codes

See Table 2 for Chip Thickness Dimensions

10 pF

11 pF

12 pF

13 pF

15 pF

16 pF

18 pF

20 pF

22 pF

24 pF

27 pF

30 pF

33 pF

36 pF

39 pF

43 pF

47 pF

51 pF

56 pF

62 pF

68 pF

75 pF

82 pF

91 pF

100 pF

110 pF

120 pF

130 pF

150 pF

160 pF

180 pF

200 pF

220 pF

240 pF

270 pF

300 pF

330 pF

360 pF

390 pF

430 pF

470 pF

510 pF

560 pF

620 pF

680 pF

750 pF

820 pF

910 pF

1,000 pF

1,100 pF

100

110

120

130

150

160

180

200

220

240

270

300

330

360

390

430

470

510

560

620

680

750

820

910

101

111

121

131

151

161

181

201

221

241

271

301

331

361

391

431

471

511

561

621

681

751

821

911

102

112

F

G

J

K

M

GK GK GK GK GK GK GK

GH GH GH GH GH GK GM

GH GH GH GH GH GK GO

GK GK GK GK GH GK GO

GK GK GK GK GK GK GO

GK GK GK GK GK GK

JK JK JK JK JK JK JK KF KF KF KF KF KF KF

JK JK JK JK JK JK JK KE KE KE KE KE KE KF

JE JE JE JE JE JK JK KE KE KE KE KE KE KF

HJ HJ HJ HJ HJ HJ HJ JE JE JE JE JE JK JE KE KE KE KE KE KE KF

HJ HJ HJ HJ HJ HJ HJ JE JE JE JE JE JK JK KF KF KF KF KE KE KF

HJ HJ HJ HJ HJ HJ HJ JK JK JK JK JK JK JK KF KF KF KF KE KE KF

HJ HJ HJ HJ HJ HJ HJ JK JK JK JK JK JK JL KF KF KF KF KE KE KF

HK HK HK HK HK HK HK JK JK JK JK JK JK JL KF KF KF KF KE KF KH

HK HK HK HK HK HK HK JE JE JE JK JK JK JL KF KF KF KF KE KF KH

JE JE JE JK JK JK JL KE KE KE KF KE KF KH

GK GK GK GK GK GK

GH GH GH GK GH GM

GH GH GH GK GH GO

GH GH GH GK GK

GH GH GH GH GM

JE JE JE JK JK JK JN KE KE KE KF KE KF KJ

JE JK JK JK JK JK JN KE KE KE KF KE KF KJ

GH GH GH GH GM

GH GK GK GH GO

HJ HJ HJ HJ HJ HJ

JE JK JK JK JK JK

KE KE KE KF KF KF

Rated Voltage (VDC)

Voltage Code

Cap

Code

C

B

D

F

G

Z

H

C

B

D

F

G

Z

H

C

B

D

F

G

Z

H

C

B

D

F

G

Z

H

Cap

Case Size/Series

C1812X

C1825X

C2220X

C2225X

*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91)

KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage

capability within the same form factor (conﬁguration and dimensions).

These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts.

C1081_C0G_HV_FT_AUTO_SMD • 6/8/2017

8

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System (HV FT-CAP), C0G Dielectric, 500 – 3,000 VDC (Automotive Grade)

Table 1B – Capacitance Range/Selection Waterfall (1812 – 2225 Case Sizes) cont’d

Case Size/

C1812X

C1825X

C2220X

C2225X

Series

Voltage Code

C

B

D

F

G

Z

H

C

B

D

F

G

Z

H

C

B

D

F

G

Z

H

C

B

D

F

G

Z

H

Cap

Code

Cap

Rated Voltage (VDC)

Capacitance

Tolerance

Product Availability and Chip Thickness Codes

See Table 2 for Chip Thickness Dimensions

1,200 pF

1,300 pF

1,500 pF

1,600 pF

1,800 pF

2,000 pF

2,200 pF

2,400 pF

2,700 pF

3,000 pF

3,300 pF

3,600 pF

3,900 pF

4,300 pF

4,700 pF

5,100 pF

5,600 pF

6,200 pF

6,800 pF

7,500 pF

8,200 pF

9,100 pF

10,000 pF

12,000 pF

15,000 pF

18,000 pF

22,000 pF

27,000 pF

33,000 pF

39,000 pF

122

132

152

162

182

202

222

242

272

302

332

362

392

432

472

512

562

622

682

752

822

912

103

123

153

183

223

273

333

393

F

G

J

K

M

GH GK GK GH GO

GK GK GK GK GO

GK GK GK GK

GK GK GK GM

GK GK GK GO

GK GH GK GO

GK GH GK

GK GH GM

GH GH GO

GH GK GO

GH GK GH

GH GM GH

GH GM GK

GK GO GK

GM GO GM

GO GH

HJ HJ HJ HJ HJ HJ

HE HE HE HE HE HJ

HE HE HE HE HE HK

HG HG HG HG HG HK

HG HG HG HG HG

HE HE HE HE HJ

HE HE HE HE HK

HG HG HG HG

HJ HJ HJ HJ

HE HE HG HK

HE HE HG

HE HE HJ

HE HG HK

HE HG

HE HJ

HG HK

JE JK JK JK JK JL

JE JK JK JK JE JL

JE JK JK JK JE JN

JE JK JK JE JK

JK JK JK JE JL

JK JK JK JK JN

JK JK JK JK

JK JK JK JL

JK JK JK JN

JK JE JE JN

JK JE JK JN

JK JE JK

KE KE KE KF KF KF

KE KE KE KF KF KH

KE KE KE KF KE KH

KE KE KE KF KE KJ

KE KE KE KF KF KJ

KE KE KE KE KH

KE KE KE KE KJ

KE KF KF KF KJ

KE KF KF KF

KE KF KF KH

KE KF KF KJ

KF KE KF

JK JE JL

JE JE JL

JE JK JN

JE JL

JK JN

JL JN

KF KE KF

KF KE KH

KE KE KH

KE KF KJ

KE KH

KF KJ

GO GH

GH GH

GK GK

HJ

HK

GM GM

JN

KH

KJ

Rated Voltage (VDC)

Voltage Code

Cap

Code

C

B

D

F

G

Z

H

C

B

D

F

G

Z

H

C

B

D

F

G

Z

H

C

B

D

F

G

Z

H

Cap

Case Size/Series

C1812X

C1825X

C2220X

C2225X

*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91)

KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage

capability within the same form factor (conﬁguration and dimensions).

These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts.

C1081_C0G_HV_FT_AUTO_SMD • 6/8/2017

9

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System (HV FT-CAP), C0G Dielectric, 500 – 3,000 VDC (Automotive Grade)

Table 2 – Chip Thickness/Tape & Reel Packaging Quantities

Paper Quantity

Plastic Quantity

7" Reel 13" Reel

Thickness Case Thickness ±

Code

Size

Range (mm)

7" Reel

13" Reel

CJ

DC

DD

DG

EQ

ER

ED

ES

EE

EF

EU

FE

FF

FG

FZ

FL

FM

FY

FK

FS

LA

LB

LC

GH

GK

GM

GO

HE

HG

HJ

HK

JE

JK

JL

JN

KE

KF

KH

KJ

0603

0805

1206

1210

1808

1812

1825

2220

2225

0.80 ± 0.15*

0.78 ± 0.10

0.90 ± 0.10

1.25 ± 0.15

0.78 ± 0.20

0.90 ± 0.20

1.00 ± 0.10

1.00 ± 0.20

1.10 ± 0.10

1.20 ± 0.15

1.60 ± 0.25

1.00 ± 0.10

1.10 ± 0.10

1.25 ± 0.15

1.25 ± 0.20

1.40 ± 0.15

1.70 ± 0.20

2.00 ± 0.20

2.10 ± 0.20

2.50 ± 0.30

1.40 ± 0.15

1.60 ± 0.15

2.00 ± 0.15

1.40 ± 0.15

1.60 ± 0.20

2.00 ± 0.20

2.50 ± 0.20

1.40 ± 0.15

1.60 ± 0.20

2.00 ± 0.20

2.50 ± 0.20

1.40 ± 0.15

1.60 ± 0.20

2.00 ± 0.20

2.50 ± 0.20

1.40 ± 0.15

1.60 ± 0.20

2.00 ± 0.20

2.50 ± 0.20

4,000

0

15,000

0

4,000

2,500

4,000

2,500

2,000

2,500

2,000

1,000

500

10,000

8,000

10,000

8,000

4,000

2,000

4,000

2,000

4,000

2,000

4,000

2,000

0

4,000

0

10,000

0

500

1,000

500

1,000

500

1,000

500

0

500

7" Reel

13" Reel

7" Reel

13" Reel

Thickness

Code

Case

Size

Thickness ±

Range (mm)

Paper Quantity

Plastic Quantity

Package quantity based on ﬁnished chip thickness speciﬁcations.

C1081_C0G_HV_FT_AUTO_SMD • 6/8/2017

10

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System (HV FT-CAP), C0G Dielectric, 500 – 3,000 VDC (Automotive Grade)

Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351

Density Level A:

Maximum (Most)

Land Protrusion (mm)

Density Level B:

Median (Nominal)

Land Protrusion (mm)

Density Level C:

Minimum (Least)

Land Protrusion (mm)

EIA

Size

Code

Metric

Size

Code

C

Y

X

V1

V2

C

Y

X

V1

V2

C

Y

X

V1

V2

0603

0805

1206

1210

1808

1812

1825

2220

2225

1608

2012

3216

3225

4520

4532

4564

5650

5664

0.90

1.15

1.10

4.00

2.10

0.80

0.95

1.00

3.10

1.50

0.60

0.75

0.90

2.40

1.20

0.99

1.59

2.30

2.10

2.15

2.85

1.44

1.62

1.75

1.80

2.10

1.66

2.06

3.01

2.30

3.60

6.90

5.50

6.90

4.47

5.85

5.90

7.40

7.00

7.10

8.80

2.71

3.06

4.01

3.30

4.60

7.90

6.50

7.90

0.89

1.49

2.20

2.00

2.05

2.75

1.24

1.42

1.55

1.60

1.90

1.56

1.96

2.91

2.20

3.50

6.80

5.40

6.80

3.57

4.95

6.50

6.10

6.20

7.90

2.11

2.46

3.41

2.70

4.00

7.30

5.90

7.30

0.79

1.39

2.10

1.90

1.95

2.65

1.04

1.22

1.35

1.40

1.70

1.46

1.86

2.81

2.10

3.40

6.70

5.30

6.70

2.42

4.25

5.80

5.40

5.50

7.20

1.81

2.16

3.11

2.40

3.70

7.00

5.60

7.00

Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reﬂow

solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reﬂow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform

qualiﬁcation testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).

Image below based on Density Level B for an EIA 1210 case size.

Vꢂ

ꢀ

Vꢃ

ꢁ

C

Grid Placement Courtyard

C1081_C0G_HV_FT_AUTO_SMD • 6/8/2017

11

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System (HV FT-CAP), C0G Dielectric, 500 – 3,000 VDC (Automotive Grade)

Soldering Process

Recommended Soldering Technique:

• Solder wave or solder reﬂow for EIA case sizes 0603, 0805 and 1206

• All other EIA case sizes are limited to solder reﬂow only

Recommended Reﬂow Soldering Proﬁle:

KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),

convection, IR or vapor phase reﬂow techniques. Preheating of these components is recommended to avoid extreme thermal

stress. KEMET’s recommended proﬁle conditions for convection and IR reﬂow reﬂect the proﬁle conditions of the IPC/J-

STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reﬂow passes at

these conditions.

Termination Finish

T_P

T_L

t_P

Proﬁle Feature

Maximum ꢁamp ꢂp ꢁate ꢃ 3ꢄCꢅsec

Maximum ꢁamp Down ꢁate ꢃ ꢆꢄCꢅsec

SnPb

100% Matte Sn

t_L

Preheat/Soak

Temperature Minimum (T_Smin

)

100°C

150°C

200°C

T_smax

T_smin

Temperature Maximum (T_Smax

Time (t_S) from T_Sminto T_Smax

)

60 – 120 seconds

t_s

3°C/second

maximum

3°C/second

maximum

Ramp-Up Rate (T_Lto T_P)

ꢀ5

ꢀ5ꢄC to Peaꢇ

Liquidous Temperature (T_L)

Time Above Liquidous (t_L)

Peak Temperature (T_P)

183°C

60 – 150 seconds

235°C

217°C

60 – 150 seconds

260°C

Time

Time Within 5°C of Maximum

Peak Temperature (t_P)

20 seconds

maximum

30 seconds

maximum

6°C/second

maximum

6°C/second

maximum

Ramp-Down Rate (T_Pto T_L)

Time 25°C to Peak

Temperature

6 minutes

maximum

8 minutes

maximum

Note 1: All temperatures refer to the center of the package, measured on the

capacitor body surface that is facing up during assembly reﬂow.

Storage and Handling

Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in

other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,

and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp

and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum

storage humidity not exceed 70% relative humidity. Temperature ﬂuctuations should be minimized to avoid condensation on

the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock

should be used promptly, preferably within 1.5 years of receipt.

C1081_C0G_HV_FT_AUTO_SMD • 6/8/2017

12

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System (HV FT-CAP), C0G Dielectric, 500 – 3,000 VDC (Automotive Grade)

Construction

Detailed Cross Section

Dielectric Material

(Caꢀrꢁ₃)

ꢃnd Terminationꢈ

ꢅarrier Layer

ꢃxternal ꢃlectrode

(ꢄi)

(Cu)

Termination Finish

(ꢆ00ꢇ Matte Sn)

ꢃpoxy Layer

(Ag)

Dielectric

Material (Caꢀrꢁ₃)

ꢂnner ꢃlectrodes

(ꢄi)

ꢃnd Terminationꢈ

ꢃxternal ꢃlectrode

(Cu)

ꢃpoxy Layer

(Ag)

ꢅarrier Layer

(ꢄi)

Termination

ꢂnner ꢃlectrodes

(ꢄi)

Finish

(ꢆ00ꢇ Matte Sn)

Capacitor Marking (Optional):

Laser marking option is not available on:

• C0G, Ultra Stable X8R and Y5V dielectric devices

• EIA 0402 case size devices

• EIA 0603 case size devices with Flexible Termination option.

• KPS Commercial and Automotive grade stacked devices.

These capacitors are supplied unmarked only.

C1081_C0G_HV_FT_AUTO_SMD • 6/8/2017

13

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System (HV FT-CAP), C0G Dielectric, 500 – 3,000 VDC (Automotive Grade)

Tape & Reel Packaging Information

KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with

EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for

details on reeling quantities for commercial chips.

ꢐar Code Label

Anti-Static ꢇeel

®

ꢈmbossed Plasticꢉ or

Punched Paper Carrierꢅ

Chip and ꢌPS ꢍrientation in Pocꢋet

(except ꢁꢀꢂ5 Commercial, and ꢁꢀꢂ5 and ꢂꢂꢂ5 Military)

KEMET

Sprocꢋet Holes

ꢈmbossment or Punched Cavity

ꢀ mm, ꢁꢂ mm

or ꢁꢃ mm Carrier Tape

Anti-Static Cover Tape

(ꢅꢁ0 mm (ꢅ00ꢊꢆ) Maximum Thicꢋness)

ꢁꢄꢀ mm (ꢄꢅ00ꢆ)

or

330 mm (ꢁ3ꢅ00ꢆ)

ꢉꢈꢎA 0ꢁ005, 0ꢂ0ꢁ, 0ꢊ0ꢂ and 0ꢃ03 case siꢏes available on punched paper carrier onlyꢅ

Table 5 – Carrier Tape Conﬁguration, Embossed Plastic & Punched Paper (mm)

New 2 mm Pitch Reel Options*

Embossed Plastic Punched Paper

Tape

Packaging

Ordering Code

(C-Spec)

C-3190

7" Reel 13" Reel 7" Reel 13" Reel

EIA Case Size Size

(W)*

Packaging Type/Options

Pitch (P₁)* Pitch (P₁)*

01005 – 0402

0603

8

2

2/4

4

Automotive grade 7" reel unmarked

Automotive grade 13" reel unmarked

Commercial grade 7" reel unmarked

Commercial grade 13" reel unmarked

C-3191

2/4

4

C-7081

0805

8

4

C-7082

1206 – 1210

1805 – 1808

≥ 1812

8

4

* 2 mm pitch reel only available for 0603 EIA case size.

2 mm pitch reel for 0805 EIA case size under development.

12

16

8

4

8

Beneﬁts of Changing from 4 mm to 2 mm Pitching Spacing

• Lower placement costs

• Double the parts on each reel results in fewer reel

changes and increased efﬁciency

• Fewer reels result in lower packaging, shipping and

storage costs, reducing waste

KPS 1210

8

KPS 1812 & 2220

Array 0508 & 0612

12

4

12

4

*Refer to Figures 1 & 2 for W and P₁carrier tape reference locations.

*Refer to Tables 6 & 7 for tolerance speciﬁcations.

C1081_C0G_HV_FT_AUTO_SMD • 6/8/2017

14

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System (HV FT-CAP), C0G Dielectric, 500 – 3,000 VDC (Automotive Grade)

Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

T

P ꢅ

ꢋꢃ0 pitches cumulative

tolerance on tape ꢌ 0ꢄꢅ mmꢍ

ꢅ

ꢇ

ꢃ

Po

ꢆDo

Ao

F

ꢂo

ꢀ

ꢇ

ꢅ

ꢁ

ꢃ

ꢁo

S

ꢃ

P

ꢃ

T

ꢃ

ꢇmbossment

For cavity siꢈe,

see ꢉote ꢃ Table ꢊ

Center Lines of Cavity

ꢆD

ꢃ

Cover Tape

is for tape feeder reference only,

including draft concentric about ꢁoꢄ

ꢁ

ꢃ

User Direction of Unreeling

Table 6 – Embossed (Plastic) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

D₁Minimum

Note 1

1.0

(0.039)

R Reference S₁Minimum

T

T₁

Tape Size

8 mm

D₀

E₁

P₀

P₂

Note 2

Note 3

Maximum Maximum

25.0

(0.984)

1.5 +0.10/-0.0

(0.059 +0.004/-

0.0)

1.75 ±0.10

4.0 ±0.10

2.0 ±0.05

0.600

(0.024)

0.100

(0.004)

12 mm

16 mm

(0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002)

(0.024)

1.5

(0.059)

30

(1.181)

Variable Dimensions — Millimeters (Inches)

B₁Maximum

Note 4

E₂

T₂

W

Tape Size

8 mm

Pitch

F

P₁

A₀,B₀& K₀

Minimum

6.25

(0.246)

Maximum Maximum

2.5

(0.098)

4.35

(0.171)

3.5 ±0.05

(0.138 ±0.002) (0.157 ±0.004)

4.0 ±0.10

8.3

(0.327)

Single (4 mm)

Single (4 mm) &

Double (8 mm)

8.2

10.25

5.5 ±0.05

8.0 ±0.10

4.6

12.3

12 mm

16 mm

Note 5

(0.323)

(0.404)

(0.217 ±0.002) (0.315 ±0.004)

(0.181)

(0.484)

12.1

(0.476)

14.25

(0.561)

7.5 ±0.05 12.0 ±0.10

(0.138 ±0.002) (0.157 ±0.004)

4.6

(0.181)

16.3

(0.642)

Triple (12 mm)

1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment

location and hole location shall be applied independent of each other.

2. The tape with or without components shall pass around R without damage (see Figure 6).

3. If S₁< 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).

4. B₁dimension is a reference dimension for tape feeder clearance only.

5. The cavity deﬁned by A₀, B₀and K₀shall surround the component with sufﬁcient clearance that:

(a) the component does not protrude above the top surface of the carrier tape.

(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).

(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see

Figure 4).

(e) for KPS Series product, A₀and B₀are measured on a plane 0.3 mm above the bottom of the pocket.

(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.

C1081_C0G_HV_FT_AUTO_SMD • 6/8/2017

15

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System (HV FT-CAP), C0G Dielectric, 500 – 3,000 VDC (Automotive Grade)

Figure 2 – Punched (Paper) Carrier Tape Dimensions

T

ꢉꢀ0 pitches cumulative

ꢂ^ꢀ

Po

ꢁDo

tolerance on tape ꢊ 0ꢋꢃ mmꢌ

A⁰

F

ꢄ

ꢂ^ꢃ

ꢅ⁰

ꢅottom Cover Tape

P^ꢀ

G

Cavity Siꢆe,

See

T^ꢀ

Center Lines of Cavity

Top Cover Tape

ꢇote ꢀ, Table ꢈ

ꢅottom Cover Tape

User Direction of Unreeling

Table 7 – Punched (Paper) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

R Reference

Note 2

Tape Size

8 mm

D₀

E₁

P₀

P₂

T₁Maximum

G Minimum

0.10

1.5 +0.10 -0.0

(0.059 +0.004 -0.0)

1.75 ±0.10

(0.069 ±0.004)

4.0 ±0.10

(0.157 ±0.004)

2.0 ±0.05

(0.079 ±0.002)

0.75

(0.030)

25

(0.984)

(0.004)

Maximum

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

Pitch

E2 Minimum

F

P₁

T Maximum

W Maximum

A₀B₀

2.0 ±0.05

(0.079 ±0.002)

4.0 ±0.10

(0.157 ±0.004)

8.3

(0.327)

8.3

(0.327)

Half (2 mm)

Single (4 mm)

6.25

(0.246)

3.5 ±0.05

(0.138 ±0.002)

1.1

(0.098)

Note 1

8 mm

1. The cavity deﬁned by A₀, B₀and T shall surround the component with sufﬁcient clearance that:

a) the component does not protrude beyond either surface of the carrier tape.

b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

c) rotation of the component is limited to 20° maximum (see Figure 3).

d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).

e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.

2. The tape with or without components shall pass around R without damage (see Figure 6).

C1081_C0G_HV_FT_AUTO_SMD • 6/8/2017

16

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System (HV FT-CAP), C0G Dielectric, 500 – 3,000 VDC (Automotive Grade)

Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 Kg minimum.

2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

Tape Width

8 mm

Peel Strength

0.1 to 1.0 Newton (10 to 100 gf)

0.1 to 1.3 Newton (10 to 130 gf)

12 and 16 mm

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be

165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of

300 ±10 mm/minute.

3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA

Standards 556 and 624.

Figure 3 – Maximum Component Rotation

°

T

Maximum Component Rotation

Top View

Maximum Component Rotation

Side View

Typical Pocꢆet Centerline

Tape

Maximum

°

T

s

Width (mm) Rotation (

)

ꢁ,ꢂꢃ

ꢂꢄ – ꢃ00

ꢃ0

ꢂ0

ꢀo

Tape

Maximum

°

S

Width (mm) Rotation (

)

ꢁ,ꢂꢃ

ꢂꢄ – 5ꢄ

ꢅꢃ – ꢃ00

ꢃ0

ꢂ0

5

Typical Component Centerline

Ao

Figure 4 – Maximum Lateral Movement

Figure 5 – Bending Radius

ꢂmbossed

Carrier

Punched

Carrier

ꢁ mm ꢂ ꢃꢄ mm Tape

ꢃꢅ mm Tape

0ꢀ5 mm maximum

ꢃꢀ0 mm maximum

ꢀ

ꢁending

ꢀadius

ꢀ

C1081_C0G_HV_FT_AUTO_SMD • 6/8/2017

17

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System (HV FT-CAP), C0G Dielectric, 500 – 3,000 VDC (Automotive Grade)

Figure 6 – Reel Dimensions

Full ꢁadius,

See ꢀote

ꢊ3 (ꢅncludes

Access Hole at

Slot Location

(ꢃ ꢄ0 mm minimum)

flange distortion

at outer edge)

ꢊꢇ (Measured at hub)

D

(See ꢀote)

A

ꢀ

C

(Arbor hole

ꢊꢉ (Measured at hub)

diameter)

ꢅf present,

tape slot in core

for tape startꢆ

ꢇꢈ5 mm minimum width x

ꢉ0ꢈ0 mm minimum depth

ꢂ

(see ꢀote)

ꢀoteꢆ Drive spoꢋes optionalꢌ if used, dimensions ꢂ and D shall applyꢈ

Table 8 – Reel Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size

8 mm

A

B Minimum

C

D Minimum

178 ±0.20

(7.008 ±0.008)

or

1.5

(0.059)

13.0 +0.5/-0.2

(0.521 +0.02/-0.008)

20.2

(0.795)

12 mm

16 mm

330 ±0.20

(13.000 ±0.008)

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

N Minimum

W₁

W₂Maximum

W₃

8.4 +1.5/-0.0

(0.331 +0.059/-0.0)

14.4

(0.567)

50

(1.969)

12.4 +2.0/-0.0

18.4

Shall accommodate tape

width without interference

12 mm

16 mm

(0.488 +0.078/-0.0)

(0.724)

16.4 +2.0/-0.0

(0.646 +0.078/-0.0)

22.4

(0.882)

C1081_C0G_HV_FT_AUTO_SMD • 6/8/2017

18

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System (HV FT-CAP), C0G Dielectric, 500 – 3,000 VDC (Automotive Grade)

Figure 7 – Tape Leader & Trailer Dimensions

ꢄmbossed Carrier

Carrier Tape

Punched Carrier

ꢆ mm ꢇ ꢀꢅ mm only

ꢂound Sprocꢃet Holes

START

END

Top Cover Tape

ꢄlongated Sprocꢃet Holes

(3ꢅ mm tape and wider)

ꢀ00 mm

Minimum Leader

ꢈ00 mm Minimum

Trailer

Components

ꢀꢁ0 mm Minimum

Top Cover Tape

Figure 8 – Maximum Camber

ꢃlongated Sprocꢁet Holes

(3ꢄ mm ꢅ wider tapes)

Carrier Tape

ꢀound Sprocꢁet Holes

ꢂ mm Maximum, either direction

Straight ꢃdge

ꢄ50 mm

C1081_C0G_HV_FT_AUTO_SMD • 6/8/2017

19

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System (HV FT-CAP), C0G Dielectric, 500 – 3,000 VDC (Automotive Grade)

KEMET Electronics Corporation Sales Ofﬁces

For a complete list of our global sales ofﬁces, please visit www.kemet.com/sales.

Disclaimer

All product speciﬁcations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for

checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.

All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.

Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such

applications, but are not intended to constitute – and KEMET speciﬁcally disclaims – any warranty concerning suitability for a speciﬁc customer application or use.

The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any

technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no

obligation or liability for the advice given or results obtained.

Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component

failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards

(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or

property damage.

Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other

measures may not be required.

KEMET is a registered trademark of KEMET Electronics Corporation.

C1081_C0G_HV_FT_AUTO_SMD • 6/8/2017

20


型号：	C0603X393GBGACAUTO
厂家：	KEMET CORPORATION
描述：	High Voltage with Flexible Termination System (HV FT-CAP), C0G Dielectric, 500 - 3,000 VDC (Automotive Grade)
文件：	总20页 (文件大小：1418K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

C0603X393GBGACAUTO [KEMET]

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