C0603X563C5GACTU [KEMET]
Flexible Termination System (FT-CAP), C0G Dielectric, 10 - 250 VDC (Commercial & Automotive Grade);型号: | C0603X563C5GACTU |
厂家: | KEMET CORPORATION |
描述: | Flexible Termination System (FT-CAP), C0G Dielectric, 10 - 250 VDC (Commercial & Automotive Grade) |
文件: | 总20页 (文件大小:1402K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), C0G Dielectric,
10 – 250 VDC (Commercial & Automotive Grade)
Overview
KEMET’s Flexible Termination (FT-CAP) Multilayer Ceramic
Capacitor in C0G dielectric incorporates a unique, flexible
termination system that is integrated with KEMET’s
standard termination materials. A conductive silver epoxy
is utilized between the base metal and nickel barrier
layers of KEMET’s standard termination system in order
to establish pliability while maintaining terminal strength,
solderability and electrical performance. This technology
was developed in order to address the primary failure
mode of MLCCs– flex cracks, which are typically the result
of excessive tensile and shear stresses produced during
board flexure and thermal cycling. Flexible termination
technology inhibits the transfer of board stress to the rigid
ceramic body, therefore mitigating flex cracks which can
result in low IR or short circuit failures.
Combined with the stability of C0G dielectric and designed to
accommodate all capacitance requirements, these flex-robust
devices are RoHS Compliant, offer up to 5 mm of flex-bend
capability and exhibit no change in capacitance with respect
to time and voltage. Capacitance change with reference to
ambient temperature is limited to ±30 ppm/ºC from −55°C to
+125°C.
In addition to Commercial Grade, Automotive Grade devices
are available which meet the demanding Automotive
Electronics Council's AEC–Q200 qualification requirements.
Although this technology does not eliminate the potential
for mechanical damage that may propagate during extreme
environmental and handling conditions, it does provide
superior flex performance over standard termination
systems. FT-CAP complements KEMET’s Open Mode,
Floating Electrode (FE-CAP), Floating Electrode with
Flexible Termination (FF-CAP), and KEMET Power Solutions
(KPS) product lines by providing a complete portfolio of
flex mitigation solutions.
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Ordering Information
C
1206
X
563
J
3
G
A
C
TU
Rated
Voltage Dielectric
(VDC)
Failure
Rate/
Design
Case Size Specification/
Capacitance
Code (pF)
Capacitance
Tolerance1
Packaging/
Grade (C-Spec)
Ceramic
Termination Finish2
(L" x W")
Series
0603
0805
1206
1210
1812
1825
2220
2225
X = Flexible
Termination
Two significant digits
and number of zeros.
Use 9 for 1.0 – 9.9 pF
Use 8 for 0.5 – .99 pF
e.g., 2.2 pF = 229
B = ±0.10 pF
C = ±0.25 pF
D = ±0.5 pF
F = ±1%
G = ±2%
J = ±5%
8 = 10
4 = 16
3 = 25
5 = 50
1 = 100
2 = 200
A = 250
G = C0G
A = N/A C = 100% Matte Sn
L = SnPb (5% Pb minimum)
See
"Packaging
C-Spec
Ordering
Options
Table" below
e.g., 0.5 pF = 508
K = ±10%
M = ±20%
1 Additional capacitance tolerance offerings may be available. Contact KEMET for details.
2 Additional termination finish options may be available. Contact KEMET for details.
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1062_C0G_FT-CAP_SMD • 11/21/2016
1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)
Packaging C-Spec Ordering Options Table
Packaging/Grade
Packaging Type1
Ordering Code (C-Spec)
Commercial Grade1
Bulk Bag
Not required (Blank)
7" Reel/Unmarked
TU
7411 (EIA 0603 and smaller case sizes)
7210 (EIA 0805 and larger case sizes)
7081
13" Reel/Unmarked
7" Reel/Unmarked/2mm pitch2
13" Reel/Unmarked/2mm pitch2
7082
Automotive Grade3
7" Reel
AUTO
AUTO7411 (EIA 0603 and smaller case sizes)
AUTO7210 (EIA 0805 and larger case sizes)
3190
13" Reel/Unmarked
7" Reel/Unmarked/2mm pitch2
13" Reel/Unmarked/2mm pitch2
3191
1 Default packaging is "Bulk Bag". An ordering code C-Spec is not required for "Bulk Bag" packaging.
1 The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain
capacitors that have not been laser marked. The option to laser mark is not available on these devices. For more information see "Capacitor Marking".
2 The 2mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2mm pitch option see "Tape & Reel Packaging Information".
3 Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L" x W") and thickness dimension. See "Chip Thickness/Tape & Reel
Packaging Quantities" and "Tape & Reel Packaging Information".
3 For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information".
3 All Automotive packaging C-Specs listed exclude the option to laser mark components. The option to laser mark is not available on these devices. For
more information see "Capacitor Marking".
Benefits
• −55°C to +125°C operating temperature range
• Superior flex performance (up to 5 mm)
• Lead (Pb)-Free, RoHS and REACH compliant
• EIA 0603, 0805, 1206, 1210, 1812, 1825, 2220, and
2225 case sizes
• High ripple current capability
• Preferred capacitance solution at line frequencies and into
the MHz range
• No capacitance change with respect to applied rated DC
voltage
• DC voltage ratings of 10 V, 16 V, 25 V, 50 V, 100 V,
200 V, and 250 V
• Negligible capacitance change with respect to temperature
from −55°C to +125°C
• Capacitance offerings ranging from 0.5 pF up to 0.47 μF
• Available capacitance tolerances of ±0.10pF, ±0.25 pF,
±0.5 pF, ±1%, ±2%, ±5%, ±10%, and ±20%
• No piezoelectric noise
• Extremely low ESR and ESL
• High thermal stability
• Non-polar device, minimizing installation concerns
• 100% pure matte tin-plated termination finish allowing for
excellent solderability
• Commercial & Automotive (AEC–Q200) Grades available
• SnPb termination finish option available upon request
(5% Pb minimum)
Applications
Typical applications include critical timing, tuning, circuits requiring low loss, circuits with pulse, high current, decoupling,
bypass, filtering, transient voltage suppression and blocking, as well as energy storage in critical and safety relevant circuits
without (integrated) current limitation, including those subject to high levels of board flexure or temperature cycling.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1062_C0G_FT-CAP_SMD • 11/21/2016
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)
Automotive C-Spec Information
KEMET Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council.
Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive
Components. These products are supported by a Product Change Notification (PCN) and Production Part Approval Process
warrant (PPAP).
Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec,
“AUTO”. This C-Spec was developed in order to better serve small and medium sized companies that prefer an automotive
grade component without the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review
by a KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET’s OEM Automotive customers
and are not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are
limited (see details below).
Product Change Notification (PCN)
The KEMET Product Change Notification system is used to communicate primarily the following types of changes:
• Product/process changes that affect product form, fit, function, and/or reliability
• Changes in manufacturing site
• Product obsolescence
Customer Notification due to:
KEMET Automotive
C-Spec
Days prior to
implementation
Process/Product change
Obsolescence*
KEMET assigned1
AUTO
Yes (with approval and sign off)
Yes (without approval)
Yes
Yes
180 days Minimum
90 days Minimum
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)
The purpose of the Production Part Approval Process is:
• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
• To provide the evidence that all customer engineering design record and specification requirements are properly
understood and
fulfilled by the manufacturing organization.
• To demonstrate that the established manufacturing process has the potential to produce the part
PPAP (Product Part Approval Process) Level
KEMET Automotive
C-Spec
1
●
○
2
3
●
○
4
5
KEMET assigned1
AUTO
●
●
●
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
● Part Number specific PPAP available
○ Product family PPAP only
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1062_C0G_FT-CAP_SMD • 11/21/2016
3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)
Dimensions – Millimeters (Inches)
L
ꢁ
T
ꢀ
S
S
EIA Size
Code
Metric Size
Code
L
W
Width
B
Mounting
Technique
T Thickness
Separation
Minimum
Length
Bandwidth
1.60 (0.064)
±0.17 (0.007)
2.00 (0.079)
±0.30 (0.012)
3.30 (0.130)
±0.40 (0.016)
3.30 (0.130)
±0.40 (0.016)
4.50 (0.178)
±0.40 (0.016)
4.60 (0.181)
±0.40 (0.016)
5.90 (0.232)
±0.75 (0.030)
5.90 (0.232)
±0.75 (0.030)
0.80 (0.032)
±0.15 (0.006)
1.25 (0.049)
±0.30 (0.012)
1.60 (0.063)
±0.35 (0.013)
2.60 (0.102)
±0.30 (0.012)
3.20 (0.126)
±0.30 (0.012)
6.40 (0.252)
±0.40 (0.016)
5.00 (0.197)
±0.40 (0.016)
6.40 (0.248)
±0.40 (0.016)
0.45 (0.018)
±0.15 (0.006)
0.50 (0.02)
0603
0805
1206
1210
1812
1825
2220
2225
1608
2012
3216
3225
4532
4564
5650
5664
0.58 (0.023)
Solder Wave
or
Solder Reflow
0.75 (0.030)
±0.25 (0.010)
0.60 (0.024)
±0.25 (0.010)
0.60 (0.024)
±0.25 (0.010)
0.70 (0.028)
±0.35 (0.014)
0.70 (0.028)
±0.35 (0.014)
0.70 (0.028)
±0.35 (0.014)
0.70 (0.028)
±0.35 (0.014)
See Table 2 for
Thickness
N/A
Solder Reflow
Only
Qualification/Certification
Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are
referenced in Table 4, Performance & Reliability.
Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details
regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive
Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their
website at www.aecouncil.com.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1062_C0G_FT-CAP_SMD • 11/21/2016
4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)
Environmental Compliance
Lead (Pb)-free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option).
Electrical Parameters/Characteristics
Item
Parameters/Characteristics
Operating Temperature Range
−55°C to +125°C
±30 ppm/ºC
0%
Capacitance Change with Reference to
+25°C and 0 VDC Applied (TCC)
Aging Rate (Maximum % Capacitance Loss/Decade Hour)
1Dielectric Withstanding Voltage (DWV)
250% of rated voltage
(5±1 seconds and charge/discharge not exceeding 50 mA)
2Dissipation Factor (DF) Maximum Limit at 25ºC
0.1%
1,000 megohm microfarads or 100 GΩ
(Rated voltage applied for 120±5 seconds at 25°C)
3Insulation Resistance (IR) Limit at 25°C
1 DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the
capacitor.
2 Capacitance and dissipation factor (DF) measured under the following conditions:
1 MHz ±100 kHz and 1.0 Vrms ±0.2 V if capacitance ≤ 1,000 pF
1 kHz ±50 Hz and 1.0 Vrms ±0.2 V if capacitance > 1,000 pF
3 To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Capacitance and Dissipation Factor (DF) measured under the following conditions:
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known
as Automatic Level Control (ALC). The ALC feature should be switched to "ON."
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Rated DC
Voltage
Capacitance Dissipation Factor Capacitance
Insulation
Dielectric
C0G
Value
(Maximum %)
Shift
Resistance
10% of Initial
Limit
All
All
0.5
0.3% or ±0.25 pF
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1062_C0G_FT-CAP_SMD • 11/21/2016
5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)
Table 1A – Capacitance Range/Selection Waterfall (0603 – 1206 Case Sizes)
Case Size/Series
Voltage Code
C0603X
C0805X
C1206X
8
4
3
5
1
2
A
8
4
3
5
1
2
A
8
4
3
5
1
2
A
Cap
Code
Capacitance
Rated Voltage (VDC)
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
Capacitance Tolerance
0.50 & 0.75 pF
1.0 - 9.1 pF*
10 - 91 pF*
100 pF
110 - 180 pF*
200 - 300 pF*
330 pF
508 & 758
109 - 919*
100 - 910*
101
111 - 181*
201 - 301*
331
361
391
431
471
511
561
621
681
751
821
911
102
112
122
132
152
162
182
202
222
242
272
302
332
362
392
432
472
512
562
622
682
752
822
912
103
123
153
183
223
273
333
393
473
B
B
C
C
D
D
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DD DD EQ EQ EQ EQ EQ EQ EQ
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DD DD DD EQ EQ EQ EQ EQ EQ EQ
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DD DD DD EQ EQ EQ EQ EQ EQ EQ
CJ CJ CJ CJ CJ CH CH DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ
CJ CJ CJ CJ CJ CH CH DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ
CJ CJ CJ CJ CJ CH CH DD DD DD DD DD DR DR EQ EQ EQ EQ ER ER ER
CJ CJ CJ CJ CJ CH CH DD DD DD DD DD DR DR EQ EQ EQ EQ ES ER ER
CJ CJ CJ CJ CJ CH CH DD DD DD DD DD DR DR EQ EQ EQ EQ ES ES ES
CJ CJ CJ CJ CJ CH CH DD DD DD DD DD DR DR EQ EQ EQ EQ ES ES ES
CJ CJ CJ CJ CJ CH CH DR DR DR DR DR DR DR EQ EQ EQ EQ ES ES ES
CJ CJ CJ CJ CJ CH CH DR DR DR DR DR DR DR EQ EQ EQ EQ ET ET ET
CJ CJ CJ CJ CJ
CJ CJ CJ CJ CJ
CJ CJ CJ CJ CJ
CJ CJ CJ CJ CJ
CJ CJ CJ CJ CJ
CJ CJ CJ CJ CJ
CJ CJ CJ CJ CJ
CJ CJ CJ CJ CJ
CJ CJ CJ CJ
CJ CJ CJ CJ
CJ CJ CJ CJ
CJ CJ CJ CJ
CJ CJ CJ
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
360 pF
390 pF
430 pF
470 pF
510 pF
560 pF
620 pF
680 pF
750 pF
820 pF
910 pF
1,000 pF
1,100 pF
1,200 pF
1,300 pF
1,500 pF
1,600 pF
1,800 pF
2,000 pF
2,200 pF
2,400 pF
2,700 pF
3,000 pF
3,300 pF
3,600 pF
3,900 pF
4,300 pF
4,700 pF
5,100 pF
5,600 pF
6,200 pF
6,800 pF
7,500 pF
8,200 pF
9,100 pF
10,000 pF
12,000 pF
15,000 pF
18,000 pF
22,000 pF
27,000 pF
33,000 pF
39,000 pF
47,000 pF
56,000 pF
68,000 pF
82,000 pF
0.10 µF
DR DR DR DR DR DR DR EQ EQ EQ EQ ER ER ER
DR DR DR DR DR DR DR EQ EQ EQ EQ ER ER ER
DD DD DD DD DR DR DR ER ER ER ER ER EQ EQ
DD DD DD DD DR DR DR ER ER ER ER ET EQ EQ
DD DD DD DD DR DD DD ER ER ER ER ET EQ EQ
DS DS DS DS DR DD DD ER ER ER ER EF EQ EQ
DS DS DS DS DR DD DD ER ER ER ER ER EQ EQ
DS DS DS DS DR DD DD ER ER ER ER ER EQ EQ
DS DS DS DS DR DD DD ES ES ES ES ES EQ EQ
DR DR DR DR DR DD DD ES ES ES ES ES EQ EQ
DR DR DR DR DR DG DG EQ EQ EQ EQ EQ EQ EQ
DR DR DR DR DR DG DG EQ EQ EQ EQ EQ EQ EQ
DR DR DR DR DR DG DG EQ EQ EQ EQ EQ EQ EQ
DR DR DR DR DR DG DG ER ER ER ER EQ ER ER
DR DR DR DR DR
DR DR DR DR DD
DR DR DR DR DS
DR DR DR DD DG
DR DR DR DD
DD DD DD DF
DF DF DF
CJ CJ CJ
CJ CJ CJ
CJ CJ CJ
CJ CJ CJ
ER ER ER ER EQ ER ER
ES ES ES ES EQ ER ER
EQ EQ EQ EQ EQ ES ES
EQ EQ EQ EQ EQ EF EF
EQ EQ EQ EQ EQ EH EH
EQ EQ EQ EQ ER EH EH
EQ EQ EQ EQ ET
EQ EQ EQ EQ ET
ER ER ER ET EH
ER ER ER ET EH
ES ES ES EF
CJ CJ CJ
DG DG DG
DG DG DG
DG DG DG
563
683
823
104
EF EF EF EH
EH EH EH EH
EH EH EH
Rated Voltage (VDC)
Voltage Code
Cap
Code
8
4
3
5
1
2
A
8
4
3
5
1
2
A
8
4
3
5
1
2
A
Capacitance
Case Size/Series
C0603X
C0805X
C1206X
*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91)
These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1062_C0G_FT-CAP_SMD • 11/21/2016
6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)
Table 1B – Capacitance Range/Selection Waterfall (1210 – 2225 Case Sizes)
Case Size/Series
Voltage Code
C1210X
C1812X
C1825X
C2220X
C2225X
8
4
3
5
1
2
A
5
1
2
A
5
1
2
A
5
1
2
A
5
1
2
A
Cap
Code
Capacitance
Rated Voltage (VDC)
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
Capacitance Tolerance
1.0 - 9.1 pF*
10 - 91 pF*
100 - 430 pF*
470 - 910 pF*
1,000 pF
1,100 pF
1,200 pF
1,300 pF
1,500 pF
1,600 pF
1,800 pF
2,000 pF
2,200 pF
2,400 pF
2,700 pF
3,000 pF
3,300 pF
3,600 pF
3,900 pF
4,300 pF
4,700 pF
5,100 pF
5,600 pF
6,200 pF
6,800 pF
7,500 pF
8,200 pF
9,100 pF
10,000 pF
12,000 pF
15,000 pF
18,000 pF
22,000 pF
27,000 pF
33,000 pF
39,000 pF
47,000 pF
56,000 pF
68,000 pF
82,000 pF
0.10 µF
109 - 919*
100 - 910*
101 - 431*
471 - 911*
102
112
122
132
152
162
182
202
222
242
272
302
332
362
392
432
472
512
562
622
682
752
822
912
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
274
334
394
474
B
C
D
FN FN FN FN FN FN FN
FN FN FN FN FN FN FN
FN FN FN FN FN FN FN
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
FN FN FN FN FN FN FN GB GB GB GB
FN FN FN FN FN FN FN GB GB GB GB
FN FN FN FN FN FN FN GB GB GB GB
FN FN FN FN FN FN FN GB GB GB GB
FN FN FN FN FN FQ FQ GB GB GB GB
FN FN FN FN FN FE FE GB GB GB GB
FN FN FN FN FN FE FE GB GB GB GB
FN FN FN FN FN FE FE GB GB GB GB
FN FN FN FN FQ FE FE GB GB GB GB
FN FN FN FN FQ FZ FZ GB GB GB GB
FN FN FN FN FQ FQ FQ
FN FN FN FN FQ FQ FQ GB GB GB GB
FN FN FN FN FQ FA FA
FN FN FN FN FA FA FA GB GB GB GB
FN FN FN FN FA FA FA
FN FN FN FN FA FA FA GB GB GB GB HB HB HB HB
FN FN FN FN FA FA FA
FA FA FA FA FZ FZ FZ GB GB GD GD HB HB HB HB
FN FN FN FN FZ FZ FZ
FN FN FN FN FZ FZ FZ GB GB GH GH HB HB HB HB
FN FN FN FN FZ FN FN
FN FN FN FN FZ FN FN GB GB GJ GJ HB HB HB HB JE JE JB
FQ FQ FQ FQ FQ FN FN
FQ FQ FQ FQ FQ FN FN GB GH GB GB HB HB HB HB JE JE JB
FE FE FE FE FE FN FN
FA FA FA FA FA FN FN GB GH GB GB HB HB HE HE JE JE JB
FZ FZ FZ FZ FN FN FN GB GG GB GB HB HB HE HE JE JE JB
FZ FZ FZ FZ FN FQ FQ GB GB GB GB HB HB
FN FN FN FN FN FQ FQ GB GB GB GB HB HE
FN FN FN FN FN FA FA GB GB GB GB HB HE
FN FN FN FN FN FZ FZ GB GB GB GB HB HG
FN FN FN FN FN FU FU GB GB GB GB
KE KE KE KE
KE KE KE KE
KE KE KE KE
KE KE KE KE
KE KE KE KE
KE KE KE KE
KE KE KE KE
KE KE KE KE
KE KE KE KE
KE KE KE KE
KE KE KE KE
KE KE
JE JE JB
JE JE JB
JE JB JB
JE JB JB
JB JB JB
JB JB JB
JB JB JB
JB JB JB
JB JB JB
JB JB JB
JB JB JD
JB JB JD
JB JB JG
JB JD JG
JB JD
KE KE
KE KE
KE
FN FN FN FN FE FU FU GB GB GB GB
FN FN FN FN FE FJ FJ GB GB GD GD
FN FN FN FN FA
FN FN FN FQ FZ
FQ FQ FQ FA FU
FE FE FE FZ FM
FZ FZ FZ FU
FU FU FU FM
FJ FJ FJ
GB GB GD GD
GB GB GK GK
GB GB GM GM
GB GD GM GM
GB GH
0.12 µF
0.15 µF
0.18 µF
0.22 µF
0.27 µF
0.33 µF
0.39 µF
0.47 µF
GD GN
GH
GK
FK FK FK
JB JF
JD JG
JG
JG
Rated Voltage (VDC)
Voltage Code
Cap
Code
8
4
3
5
1
2
A
5
1
2
A
5
1
2
A
5
1
2
5
1
2
A
Capacitance
Case Size/Series
C1210X
C1812X
C1825X
C2220X
C2225X
*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82 and 91)
These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1062_C0G_FT-CAP_SMD • 11/21/2016
7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)
Table 2A – Chip Thickness/Tape & Reel Packaging Quantities
Paper Quantity1
7" Reel 13" Reel
Plastic Quantity
7" Reel 13" Reel
Thickness Case Thickness ±
Code
Size1 Range (mm)
CJ
CH
DR
DD
DS
DF
DG
EQ
ER
ES
ET
EF
EH
FN
FQ
FE
FA
FZ
FU
FM
FJ
FK
GB
GD
GH
GG
GK
GJ
GN
GM
HB
HE
HG
JB
JD
JE
0603
0603
0805
0805
0805
0805
0805
1206
1206
1206
1206
1206
1206
1210
1210
1210
1210
1210
1210
1210
1210
1210
1812
1812
1812
1812
1812
1812
1812
1812
1825
1825
1825
2220
2220
2220
2220
2220
2225
0.80 ± 0.15
0.85 ± 0.07
0.78 ± 0.20
0.90 ± 0.10
1.00 ± 0.20
1.10 ± 0.10
1.25 ± 0.15
0.78 ± 0.20
0.90 ± 0.20
1.00 ± 0.20
1.10 ± 0.20
1.20 ± 0.15
1.60 ± 0.20
0.78 ± 0.20
0.90 ± 0.20
1.00 ± 0.10
1.10 ± 0.15
1.25 ± 0.20
1.55 ± 0.20
1.70 ± 0.20
1.85 ± 0.20
2.10 ± 0.20
1.00 ± 0.10
1.25 ± 0.15
1.40 ± 0.15
1.55 ± 0.10
1.60 ± 0.20
1.70 ± 0.15
1.70 ± 0.20
2.00 ± 0.20
1.10 ± 0.15
1.40 ± 0.15
1.60 ± 0.20
1.00 ± 0.15
1.30 ± 0.15
1.40 ± 0.15
1.50 ± 0.15
1.70 ± 0.15
1.40 ± 0.15
4,000
4,000
0
0
0
0
0
4,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
15,000
10,000
0
0
0
0
0
0
0
0
4,000
4,000
2,500
2,500
2,500
4,000
4,000
2,500
2,500
2,500
2,000
4,000
4,000
2,500
2,500
2,500
2,000
2,000
2,000
2,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
500
10,000
10,000
10,000
10,000
10,000
10,000
10,000
10,000
10,000
10,000
8,000
10,000
10,000
10,000
10,000
10,000
8,000
8,000
8,000
8,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
2,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
0
10,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
0
0
0
0
0
0
0
JF
JG
KE
7" Reel
13" Reel
7" Reel
13" Reel
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
Paper Quantity1
Plastic Quantity
Package quantity based on finished chip thickness specifications.
1 If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA 0603
(1608 metric) case size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1062_C0G_FT-CAP_SMD • 11/21/2016
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)
Table 2B – Bulk Packaging Quantities
Loose Packaging
Packaging Type
Bulk Bag (default)
Packaging C-Spec1
N/A2
Case Size
Packaging Quantities (pieces/unit packaging)
EIA (in)
Metric (mm)
Minimum
Maximum
0402
0603
0805
1206
1210
1808
1812
1825
2220
2225
1005
1608
2012
3216
3225
4520
4532
4564
5650
5664
50,000
1
20,000
1 The "Packaging C-Spec" is a 4 to 8 digit code which identifies the packaging type and/or product grade. When ordering, the proper code must be
included in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details.
Commercial Grade product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk
bag packaging option for Automotive Grade products.
2 A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and Automotive Grade products). The
15th through 22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our
standard "Bulk Bag" packaging.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1062_C0G_FT-CAP_SMD • 11/21/2016
9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 (mm)
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
EIA
Size
Code
Metric
Size
Code
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
0603
0805
1206
1210
1812
1825
2220
2225
1608
2012
3216
3225
4532
4564
5650
5664
0.85
1.25
1.10
4.00
2.10
0.75
1.05
1.00
3.10
1.50
0.65
0.85
0.90
2.40
1.20
0.99
1.59
1.59
2.30
2.15
2.85
2.85
1.44
1.62
1.62
1.75
1.80
2.10
2.10
1.66
2.06
3.01
2.30
6.90
5.50
6.90
4.47
5.85
5.90
7.40
7.10
8.80
8.80
2.71
3.06
4.01
3.30
7.90
6.50
7.90
0.89
1.49
1.49
2.20
2.05
2.75
2.75
1.24
1.42
1.42
1.55
1.60
1.90
1.90
1.56
1.96
2.91
2.20
6.80
5.40
6.80
3.57
4.95
4.95
6.50
6.20
7.90
7.90
2.11
2.46
3.41
2.70
7.30
5.90
7.30
0.79
1.39
1.39
2.10
1.95
2.65
2.65
1.04
1.22
1.22
1.35
1.40
1.70
1.70
1.46
1.86
2.81
2.10
6.70
5.30
6.70
2.42
4.25
4.25
5.80
5.50
7.20
7.20
1.81
2.16
3.11
2.40
7.00
5.60
7.00
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805, and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
V1
ꢀ
ꢀ
V2
ꢁ
ꢁ
C
C
Grid Placement Courtyard
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1062_C0G_FT-CAP_SMD • 11/21/2016 10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Reflow Soldering Profile:
KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),
convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal
stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-
STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at
these conditions.
Termination Finish
TP
TL
tP
Profile Feature
Maximum ꢀamp ꢁp ꢀate ꢂ ꢃꢄCꢅsec
Maximum ꢀamp Doꢆn ꢀate ꢂ ꢇꢄCꢅsec
SnPb
100% Matte Sn
tL
Preheat/Soak
Temperature Minimum (TSmin
)
100°C
150°C
150°C
200°C
Tsmax
Tsmin
Temperature Maximum (TSmax
Time (tS) from TSmin to TSmax
)
60 – 120 seconds
60 – 120 seconds
ts
3°C/second
maximum
3°C/second
maximum
Ramp-Up Rate (TL to TP)
25
25ꢄC to Peaꢈ
Liquidous Temperature (TL)
Time Above Liquidous (tL)
Peak Temperature (TP)
183°C
60 – 150 seconds
235°C
217°C
60 – 150 seconds
260°C
Time
Time Within 5°C of Maximum
20 seconds
maximum
30 seconds
maximum
Peak Temperature (tP)
6°C/second
maximum
6°C/second
maximum
Ramp-Down Rate (TP to TL)
Time 25°C to Peak
6 minutes
maximum
8 minutes
maximum
Temperature
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1062_C0G_FT-CAP_SMD • 11/21/2016 11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress
Reference
Test or Inspection Method
Terminal Strength
JIS–C–6429
Appendix 1, Note: Force of 1.8 kg for 60 seconds.
Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm
for C0G. Flexible termination system – 3.0 mm (minimum).
Board Flex
JIS–C–6429
Magnification 50 X. Conditions:
a) Method B, 4 hours at 155°C, dry heat at 235°C
b) Method B at 215°C category 3
Solderability
J–STD–002
c) Method D, category 3 at 260°C
Temperature Cycling
Biased Humidity
JESD22 Method JA–104 1,000 Cycles (−55°C to +125°C). Measurement at 24 hours +/−4 hours after test conclusion.
Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor.
MIL–STD–202 Method
103
Measurement at 24 hours +/−4 hours after test conclusion.
Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.
Measurement at 24 hours +/−4 hours after test conclusion.
MIL–STD–202 Method
t = 24 hours/cycle. Steps 7a and 7b not required.
Moisture Resistance
Thermal Shock
Measurement at 24 hours +/−4 hours after test conclusion.
106
MIL–STD–202 Method
−55°C/+125°C. Note: Number of cycles required – 300, maximum transfer time – 20
seconds, dwell time – 15 minutes. Air – Air.
107
MIL–STD–202 Method
108
High Temperature Life
1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied.
/EIA–198
MIL–STD–202 Method
108
Storage Life
Vibration
150°C, 0 VDC for 1,000 hours.
5 g's for 20 minutes, 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick
7 secure points on one long side and 2 secure points at corners of opposite sides. Parts
mounted within 2" from any secure point. Test from 10 – 2,000 Hz
MIL–STD–202 Method
204
MIL–STD–202 Method
Mechanical Shock
Figure 1 of Method 213, Condition F.
213
MIL–STD–202 Method
215
Resistance to Solvents
Add aqueous wash chemical, OKEM Clean or equivalent.
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum
storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on
the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock
should be used promptly, preferably within 1.5 years of receipt.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1062_C0G_FT-CAP_SMD • 11/21/2016 12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)
Construction
Detailed Cross Section
Dielectric Material
(Caꢇrꢈꢉ)
ꢀnd Terminationꢂ
ꢀxternal ꢀlectrode
(Cu)
Barrier Layer
(Ni)
Termination Finish
ꢀpoxy Layer
(Aꢁ)
(100ꢆ Matte
SnꢂSnPb–5ꢆ Pb min)
Dielectric Material
(Caꢇrꢈꢉ)
ꢅnner ꢀlectrodes
(ꢄi)
ꢀnd Terminationꢂ
ꢀxternal ꢀlectrode
(Cu)
Epoxy Layer
(Ag)
ꢃarrier Layer
(ꢄi)
Termination Finish
Inner Electrodes
(Ni)
(100ꢆ Matte
SnꢂSnPb–5ꢆ Pb min)
Capacitor Marking (Optional):
Laser marking option is not available on:
• C0G, Ultra Stable X8R and Y5V dielectric devices
• EIA 0402 case size devices
• EIA 0603 case size devices with Flexible Termination option.
• KPS Commercial and Automotive grade stacked devices.
These capacitors are supplied unmarked only.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1062_C0G_FT-CAP_SMD • 11/21/2016 13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with
EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for
details on reeling quantities for commercial chips.
ꢏar Code Label
Anti-Static ꢆeel
®
ꢇmbossed Plasticꢈ or
Punched Paper Carrierꢃ
Chip and ꢋPS ꢌrientation in Pocꢊet
(except 1ꢀ25 Commercial, and 1ꢀ25 and 2225 Military)
KEMET
Sprocꢊet ꢐoles
ꢇmbossment or Punched Cavity
ꢀ mm, 12 mm
or 1ꢁ mm Carrier Tape
Anti-Static Cover Tape
(ꢃ10 mm (ꢃ00ꢉꢄ) Maximum Thicꢊness)
1ꢂꢀ mm (ꢂꢃ00ꢄ)
or
ꢅꢅ0 mm (1ꢅꢃ00ꢄ)
ꢈꢇꢍA 01005, 0201, 0ꢉ02 and 0ꢁ0ꢅ case siꢎes available on punched paper carrier onlyꢃ
Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm)
New 2 mm Pitch Reel Options*
Embossed Plastic Punched Paper
Tape
Packaging
Ordering Code
(C-Spec)
C-3190
7" Reel 13" Reel 7" Reel 13" Reel
EIA Case Size Size
(W)*
Packaging Type/Options
Pitch (P1)* Pitch (P1)*
01005 – 0402
0603
8
8
2
2
2/4
4
Automotive grade 7" reel unmarked
Automotive grade 13" reel unmarked
Commercial grade 7" reel unmarked
Commercial grade 13" reel unmarked
C-3191
2/4
4
C-7081
0805
8
4
4
4
C-7082
1206 – 1210
1805 – 1808
≥ 1812
8
4
4
4
4
* 2 mm pitch reel only available for 0603 EIA case size.
2 mm pitch reel for 0805 EIA case size under development.
12
12
12
16
8
4
8
8
Benefits of Changing from 4 mm to 2 mm Pitching Spacing
• Lower placement costs
• Double the parts on each reel results in fewer reel
changes and increased efficiency
• Fewer reels result in lower packaging, shipping and
storage costs, reducing waste
KPS 1210
8
8
KPS 1812 & 2220
Array 0508 & 0612
12
4
12
4
*Refer to Figures 1 & 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 & 7 for tolerance specifications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1062_C0G_FT-CAP_SMD • 11/21/2016 14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
T
T
P 2
ꢉ10 pitches cumulative
tolerance on tape ꢊ 0ꢋ2 mmꢌ
2
ꢅ
1
Po
ꢄDo
Ao
F
ꢂo
ꢀ
ꢅ
2
ꢁ
1
ꢁo
S
1
P
1
T
1
ꢅmbossment
For cavity siꢆe,
see ꢇote 1 Table ꢈ
Center Lines of Cavity
ꢄD
1
Cover Tape
is for tape feeder reference only,
includinꢃ draft concentric about ꢁ
ꢁ
1
o
.
User Direction of Unreeling
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
D1 Minimum
Note 1
1.0
(0.039)
R Reference S1 Minimum
T
T1
Tape Size
8 mm
D0
E1
P0
P2
Note 2
Note 3
Maximum Maximum
25.0
(0.984)
1.5 +0.10/-0.0
(0.059 +0.004/-
0.0)
1.75 ±0.10
4.0 ±0.10
2.0 ±0.05
0.600
0.600
(0.024)
0.100
(0.004)
12 mm
16 mm
(0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002)
(0.024)
1.5
(0.059)
30
(1.181)
Variable Dimensions — Millimeters (Inches)
B1 Maximum
Note 4
E2
T2
W
Tape Size
8 mm
Pitch
F
P1
A0,B0 & K0
Minimum
6.25
(0.246)
Maximum Maximum
2.5
(0.098)
4.35
(0.171)
3.5 ±0.05
(0.138 ±0.002) (0.157 ±0.004)
4.0 ±0.10
8.3
(0.327)
Single (4 mm)
Single (4 mm) &
Double (8 mm)
8.2
10.25
5.5 ±0.05
8.0 ±0.10
4.6
12.3
12 mm
16 mm
Note 5
(0.323)
(0.404)
(0.217 ±0.002) (0.315 ±0.004)
(0.181)
(0.484)
12.1
(0.476)
14.25
(0.561)
7.5 ±0.05 12.0 ±0.10
(0.138 ±0.002) (0.157 ±0.004)
4.6
(0.181)
16.3
(0.642)
Triple (12 mm)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment
location and hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see
Figure 4).
(e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1062_C0G_FT-CAP_SMD • 11/21/2016 15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
T
ꢇ10 pitches cumulative
ꢁ1
Po
ꢀDo
tolerance on tape ꢈ 0ꢉ2 mmꢊ
A0
F
ꢂ
ꢁ2
ꢃ0
ꢃottom Cover Tape
P1
G
Cavity Siꢄe,
See
T1
T1
Center Lines of Cavity
Top Cover Tape
ꢅote 1, Table ꢆ
ꢃottom Cover Tape
User Direction of Unreeling
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
R Reference
Note 2
Tape Size
8 mm
D0
E1
P0
P2
T1 Maximum
G Minimum
0.10
1.5 +0.10 -0.0
(0.059 +0.004 -0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
0.75
(0.030)
25
(0.984)
(0.004)
Maximum
Variable Dimensions — Millimeters (Inches)
Tape Size
8 mm
Pitch
E2 Minimum
F
P1
T Maximum
W Maximum
A0 B0
2.0 ±0.05
(0.079 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
8.3
(0.327)
8.3
(0.327)
Half (2 mm)
Single (4 mm)
6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
1.1
(0.098)
Note 1
8 mm
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
c) rotation of the component is limited to 20° maximum (see Figure 3).
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).
e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1062_C0G_FT-CAP_SMD • 11/21/2016 16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
8 mm
Peel Strength
0.1 to 1.0 Newton (10 to 100 gf)
0.1 to 1.3 Newton (10 to 130 gf)
12 and 16 mm
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be
165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of
300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
°
T
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Typical Pocꢄet Centerline
Tape
Maximum
°
°
T
s
Width (mm) Rotation (
)
ꢁ,12
1ꢂ – 200
20
10
ꢀo
Tape
Maximum
°
S
Width (mm) Rotation (
)
ꢁ,12
1ꢂ – 5ꢂ
ꢃ2 – 200
20
10
5
Typical Component Centerline
Ao
Figure 4 – Maximum Lateral Movement
Figure 5 – Bending Radius
ꢃmbossed
Carrier
Punched
Carrier
ꢁ mm & 12 mm Tape
1ꢂ mm Tape
0ꢀ5 mm maximum
0ꢀ5 mm maximum
1ꢀ0 mm maximum
1ꢀ0 mm maximum
ꢀ
ꢁendinꢂ
ꢀadius
ꢀ
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1062_C0G_FT-CAP_SMD • 11/21/2016 17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)
Figure 6 – Reel Dimensions
Full ꢁadius,
ꢊꢋ (ꢆncludes
flanꢌe distortion
at outer edꢌe)
Access ꢃole at
Slot Location
(ꢄ ꢅ0 mm minimum)
See ꢀote
ꢊ2 (Measured at hub)
D
(See ꢀote)
A
ꢀ
C
(Arbor hole
ꢊ1 (Measured at hub)
diameter)
ꢆf present,
tape slot in core
for tape startꢇ
2ꢈ5 mm minimum ꢉidth x
10ꢈ0 mm minimum depth
ꢂ
(see ꢀote)
ꢀoteꢇ Drive spoꢍes optionalꢎ if used, dimensions ꢂ and D shall applyꢈ
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
8 mm
A
B Minimum
C
D Minimum
178 ±0.20
(7.008 ±0.008)
or
1.5
(0.059)
13.0 +0.5/-0.2
(0.521 +0.02/-0.008)
20.2
(0.795)
12 mm
16 mm
330 ±0.20
(13.000 ±0.008)
Variable Dimensions — Millimeters (Inches)
Tape Size
8 mm
N Minimum
W1
W2 Maximum
W3
8.4 +1.5/-0.0
(0.331 +0.059/-0.0)
14.4
(0.567)
50
(1.969)
12.4 +2.0/-0.0
18.4
Shall accommodate tape
width without interference
12 mm
16 mm
(0.488 +0.078/-0.0)
(0.724)
16.4 +2.0/-0.0
(0.646 +0.078/-0.0)
22.4
(0.882)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1062_C0G_FT-CAP_SMD • 11/21/2016 18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)
Figure 7 – Tape Leader & Trailer Dimensions
ꢄmbossed Carrier
Carrier Tape
Punched Carrier
ꢈ mm & 12 mm only
ꢁound Sprocꢂet ꢃoles
START
END
Top Cover Tape
ꢄlonꢅated Sprocꢂet ꢃoles
(ꢆ2 mm tape and ꢇider)
100 mm
Minimum Leader
ꢉ00 mm Minimum
Trailer
Components
1ꢀ0 mm Minimum
Top Cover Tape
Figure 8 – Maximum Camber
ꢄlonꢃated sprocꢁet holes
(ꢅ2 mm & ꢆider tapes)
Carrier Tape
ꢀound Sprocꢁet ꢂoles
1 mm Maximum, either direction
Straiꢃht ꢄdꢃe
250 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1062_C0G_FT-CAP_SMD • 11/21/2016 19
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)
KEMET Electronic Corporation Sales Offices
For a complete list of our global sales offices, please visit www.kemet.com/sales.
Disclaimer
All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for
checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.
All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such
applications, but are not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use.
The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any
technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no
obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component
failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards
(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or
property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other
measures may not be required.
KEMET is a registered trademark of KEMET Electronics Corporation.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1062_C0G_FT-CAP_SMD • 11/21/2016 20
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