C0805T104K5RAL7800_技术文档

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial Off-The-Shelf (COTS) for Higher Reliability

Applications, X7R Dielectric, 6.3 – 250 VDC

Overview

KEMET’s COTS program is an extension of KEMET knowledge

of high reliability test regimes and requirements. KEMET

regularly supplies “up-screened” products by working with

customer drawings and imposing speciﬁed design and test

requirements. The COTS program offers the same high quality

and high reliability components as up-screened products,

but at a lower cost to the customer. This is accomplished by

eliminating the need for customer-speciﬁc drawings to achieve

the reliability level required for customer applications. A series

of tests and inspections have been selected to provide the

accelerated conditioning and 100% screening necessary to

eliminate infant mortal failures from the population.

All COTS testing includes voltage conditioning and post-electrical

testing as per MIL–PRF–55681. For enhanced reliability, KEMET

also provides the following test level options and conformance

certiﬁcations:

Test Level A

Test Level B

Test Level C

Voltage Conditioning

DWV

IR@25°C

CAP

DWV

IR@25°C

CAP

DWV

IR@25°C

CAP

DF

PDA 8%

C of C

PDA 8%

DPA

PDA 8%

DPA

KEMET’s X7R dielectric features a 125°C maximum operating

temperature and is considered “temperature stable.” The

Electronics Components, Assemblies & Materials Association

(EIA) characterizes X7R dielectric as a Class II material.

Components of this classiﬁcation are ﬁxed, ceramic dielectric

capacitors suited for bypass and decoupling applications or

for frequency discriminating circuits where Q and stability of

capacitance characteristics are not critical. X7R exhibits a

predictable change in capacitance with respect to time and

voltage and boasts a minimal change in capacitance with

reference to ambient temperature. Capacitance change is

limited to ±15% from −55°C to +125°C.

C of C

85/85

C of C

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Ordering Information

C

1210

T

104

K

5

R

A

C

TU

Rated

Voltage Dielectric

(VDC)

Case Size Speciﬁcation/ Capacitance Capacitance

Termination

Finish¹

Packaging/

Grade (C-Spec)

Ceramic

Failure Rate/Design

(L" x W")

Series

Code (pF)

Tolerance

0402

0603

0805

1206

1210

1812

2220

T = COTS

Two

J = ±5%

K = ±10%

M = ±20%

9 = 6.3

8 = 10

4 = 16

3 = 25

5 = 50

1 = 100

2 = 200

A = 250

R = X7R A = Testing per MIL–PRF–

55681 PDA 8%

C = 100%

Matte Sn

L = SnPb (5%

Pb minimum)

See

"Packaging

C-Spec

Ordering

Options Table"

below

signiﬁcant

digits and

number of

zeros

B= Testing per MIL–PRF–

55681 PDA 8%, DPA per

EIA–469

C = Testing per MIL–

PRF–55681 PDA 8%, DPA

per EIA–469, Humidity per

MIL–STD–202, Method 103,

Condition A

¹Additional termination ﬁnish options may be available. Contact KEMET for details.

One world. One KEMET

C1027_X7R_COTS_SMD • 11/29/2017

1

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC

Packaging C-Spec Ordering Options Table

Packaging/Grade

Packaging Type¹

Ordering Code (C-Spec)

Bulk Bag/Unmarked

7" Reel/Unmarked

Not required (Blank)

TU

7411 (EIA 0603 and smaller case sizes)

7210 (EIA 0805 and larger case sizes)

TM

13" Reel/Unmarked

7" Reel/Marked

7040 (EIA 0603 and smaller case sizes)

7215 (EIA 0805 and larger case sizes)

7081

13" Reel/Marked

7" Reel/Unmarked/2mm pitch²

13" Reel/Unmarked/2mm pitch²

7082

¹Default packaging is "Bulk Bag". An ordering code C-Spec is not required for "Bulk Bag" packaging.

¹The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain

capacitors that have not been laser marked. Please contact KEMET if you require a laser marked option. For more information see "Capacitor Marking".

²The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case

size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".

Beneﬁts

• −55°C to +125°C operating temperature range

• Lead (Pb)-free, RoHS and REACH compliant

• Voltage conditioning and post-electrical testing per

MIL–PRF–55681

• Destructive Physical Analysis (DPA) per EIA–469

• Biased humidity testing (85/85) per MIL–STD–202

• Certiﬁcate of Compliance

• DC voltage ratings of 6.3 V, 10 V, 16 V, 25 V, 50 V, 100 V,

200 V, and 250 V

• Capacitance offerings ranging from 10 pF to 22 μF

• Available capacitance tolerances of ±5%, ±10%, and ±20%

• Non-polar device, minimizing installation concerns

• 100% pure matte tin-plated termination ﬁnish allowing for

excellent solderability

• Temperature stable dielectric

• EIA 0402, 0603, 0805, 1206, 1210, 1812, and

2220 case sizes

• SnPb termination ﬁnish option available upon request

(5% Pb minimum)

Applications

Typical applications include military, space quality and high reliability electronics.

C1027_X7R_COTS_SMD • 11/29/2017

2

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC

Dimensions – Millimeters (Inches)

L

W

T

B

S

EIA Size

Code

Metric Size

Code

L

W

Width

T

B

Mounting

Technique

Separation

Minimum

Length

Thickness

Bandwidth

1.00 (0.040)

±0.05 (0.002)

1.60 (0.063)

±0.15 (0.006)

2.00 (0.079)

±0.20 (0.008)

3.20 (0.126)

±0.20 (0.008)

3.20 (0.126)

+0.20 (0.008)

4.50 (0.177)

±0.30 (0.012)

5.70 (0.224)

±0.40 (0.016)

0.50 (0.020)

±0.05 (0.002)

0.80 (0.032)

±0.15 (0.006)

1.25 (0.049)

+0.20 (0.008)

1.60 (0.063)

±0.20 (0.008)

2.50 (0.098)

±0.20 (0.008)

3.20 (0.126)

±0.30 (0.012)

5.00 (0.197)

±0.40 (0.016)

0.30 (0.012)

±0.10 (0.004)

0.35 (0.014)

±0.15 (0.006)

0.50 (0.02)

±0.25 (0.010)

0.50 (0.02)

±0.25 (0.010)

0.50 (0.02)

±0.25 (0.010)

0.60 (0.024)

±0.35 (0.014)

0.60 (0.024)

±0.35 (0.014)

Solder Reﬂow

0402

0603

0805

1206

1210¹

1812

2220

1005

1608

2012

3216

3225

4532

5650

0.30 (0.012)

0.70 (0.028)

0.75 (0.030)

Only

Solder Wave or

Solder Reﬂow

See Table 2 for

Thickness

N/A

Solder Reﬂow

Only

¹For capacitance values ≥ 4.7 µF add 0.02 (0.001) to the width tolerance dimension and 0.10 (0.004) to the length tolerance dimension.

Qualiﬁcation/Certiﬁcation

Commercial Grade products are subject to internal qualiﬁcation. Details regarding test methods and conditions are refer-

enced in Table 4, Performance & Reliability.

Environmental Compliance

Lead (Pb)-free, RoHS, and REACH compliant without exemptions (excluding SnPb termination ﬁnish option).

C1027_X7R_COTS_SMD • 11/29/2017

3

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC

Electrical Parameters/Characteristics

Item

Parameters/Characteristics

Operating Temperature Range

−55°C to +125°C

±15%

Capacitance Change with Reference to

+25°C and 0 Vdc Applied (TCC)

¹Aging Rate (Maximum % Capacitance Loss/Decade Hour)

²Dielectric Withstanding Voltage (DWV)

3.0%

250% of rated voltage

(5±1 seconds and charge/discharge not exceeding 50mA)

³Dissipation Factor (DF) Maximum Limit at 25°C

5%(6.3V & 10V), 3.5%(16V & 25V) and 2.5%(50V to 250V)

See Insulation Resistance Limit Table

(Rated voltage applied for 120±5 seconds at 25°C)

⁴Insulation Resistance (IR) Minimum Limit at 25°C

¹Regarding Aging Rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.

²DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the

capacitor.

³Capacitance and dissipation factor (DF) measured under the following conditions:

1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance ≤10µF

120Hz ± 10Hz and 0.5 ± 0.1 Vrms if capacitance >10µF

⁴To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.

Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as

Automatic Level Control (ALC). The ALC feature should be switched to "ON".

Post Environmental Limits

High Temperature Life, Biased Humidity, Moisture Resistance

Rated DC

Voltage

Capacitance Dissipation Factor Capacitance

Insulation

Dielectric

X7R

Value

(Maximum %)

Shift

Resistance

> 25

16/25

< 16

3.0

5.0

7.5

10% of Initial

Limit

All

±20%

Insulation Resistance Limit Table

1,000 Megohm

Microfarads or 100 GΩ

500 Megohm

Microfarads or 10 GΩ

EIA Case Size

0201

0402

0603

0805

1206

1210

1808

1812

1825

2220

2225

N/A

< 0.012 µF

< 0.047 µF

< 0.15 µF

< 0.47 µF

< 0.39 µF

ALL

≥ 0.012 µF

≥ 0.047 µF

≥ 0.15 µF

≥ 0.47 µF

≥ 0.39 µF

N/A

< 2.2 µF

ALL

≥ 2.2 µF

N/A

< 10 µF

ALL

≥ 10 µF

N/A

C1027_X7R_COTS_SMD • 11/29/2017

4

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC

Table 1A – Capacitance Range/Selection Waterfall (0402 – 1206 Case Sizes)

Case Size/

Series

C0402T

C0603T

C0805T

C1206T

Cap

Code

Voltage Code

9

8

4

3

5

9

8

4

3

5

1

2

9

8

4

3

5

1

2

A

9

8

4

3

5

1

2

A

Capacitance

Rated Voltage

(VDC)

Capacitance

Tolerance

Product Availability and Chip Thickness Codes

See Table 2 for Chip Thickness Dimensions

BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN

10 – 91 pF*

100 – 150 pF**

100 – 910*

101 – 151**

J

K

M

EB EB EB EB EB EB EB

180 – 820 pF** 181 – 821**

BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB

1,000 pF

1,200 pF

1,500 pF

1,800 pF

2,200 pF

2,700 pF

3,300 pF

3,900 pF

4,700 pF

5,600 pF

6,800 pF

8,200 pF

10,000 pF

12,000 pF

15,000 pF

18,000 pF

22,000 pF

27,000 pF

33,000 pF

39,000 pF

47,000 pF

56,000 pF

68,000 pF

82,000 pF

0.10 µF

102

122

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

823

104

124

154

184

224

274

334

394

474

564

684

824

105

125

155

185

225

275

335

395

475

565

685

BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB

BB BB BB BB BB CF CF CF CF CF CF

DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB

DN DN DN DN DN DP DN DN EB EB EB EB EB EB EB EB

BB BB BB BB

BB BB BB

CF CF CF CF CF CF

CF CF CF CF CF

CF CF CF CF

DN DN DN DN DN DP DE

DN DN DN DN DN DE DG

DP DP DP DP DP DE DG

DP DP DP DP DP DE

DN DN DN DN DN DE

DN DN DN DN DP DG

DP DP DP DP DP

DG DG DG DG DE

DP DP DP DP DE

DP DP DP DG DH

DP DP DP DG

EB EB EB EB EB EB EB EB

EB EB EB EB EB EC EB EB

EB EB EB EB EB EC ED ED

EB EB EB EB EB EB ED ED

EB EB EB EB EB EB EM EM

EC EC EC EC EC EC EG

EC EC EC EC EC EC

EB EB EB EB EC EM

EB EB EB EB EC EG

EC EC EC EC EC EG

ED ED ED ED EC EM

EE EE EE EE ED EM

EF EF EF EF ED EH

EF EF EF EG ED EH

ED ED ED EG EH

0.12 µF

0.15 µF

0.18 µF

BE

0.22 µF

0.27 µF

0.33 µF

0.39 µF

0.47 µF

0.56 µF

0.68 µF

0.82 µF

1.0 µF

CF CF CF CF

CF CF CF

DP DP DP DG

DE DE DE

1.2 µF

1.5 µF

1.8 µF

2.2 µF

2.7 µF

3.3 µF

3.9 µF

4.7 µF

DG DG DG

EF EF EF EG EH

DG DG DG

ED ED ED EF EH

DG DG DG

ED ED ED EF EH

EN EN EN EH

ED ED ED EH

EF EF EF EH

EH EH EH

5.6 µF

6.8 µF

Rated Voltage

(VDC)

Cap

Code

Capacitance

Voltage Code

9

8

4

3

5

9

8

4

3

5

1

2

9

8

4

3

5

1

2

A

9

8

4

3

5

1

2

A

Case Size/

Series

C0402T

C0603T

C0805T

C1206T

*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91)

**Capacitance range Includes E12 decade values only. (i.e., 10, 12, 15, 18, 22, 27, 33, 39, 47, 56, 68, and 82)

C1027_X7R_COTS_SMD • 11/29/2017

5

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC

Table 1A – Capacitance Range/Selection Waterfall (0402 – 1206 Case Sizes) cont'd

Case Size/

Series

C0402T

C0603T

C0805T

C1206T

Cap

Code

Voltage Code

9

8

4

3

5

9

8

4

3

5

1

2

9

8

4

3

5

1

2

A

9

8

4

3

5

1

2

A

Capacitance

Rated Voltage

(VDC)

Capacitance

Tolerance

Product Availability and Chip Thickness Codes

See Table 2 for Chip Thickness Dimensions

8.2 µF

10 µF

825

106

J

K

M

EH EH EH

Rated Voltage

(VDC)

Cap

Code

Capacitance

Voltage Code

9

8

4

3

5

9

8

4

3

5

1

2

9

8

4

3

5

1

2

A

9

8

4

3

5

1

2

A

Case Size/

Series

C0402T

C0603T

C0805T

C1206T

*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91)

**Capacitance range Includes E12 decade values only. (i.e., 10, 12, 15, 18, 22, 27, 33, 39, 47, 56, 68, and 82)

Table 1B – Capacitance Range/Selection Waterfall (1210 – 2220 Case Sizes)

Case Size/

Series

C1210T

C1808T

C1812T

C1825T

C2220T

Cap

Code

Voltage Code

9

8

4

3

5

1

2

A

5

1

2

3

5

1

2

A

5

1

2

A

3

5

1

2

A

Capacitance

Rated Voltage

(VDC)

Capacitance

Tolerance

Product Availability and Chip Thickness Codes

See Table 2 for Chip Thickness Dimensions

10 - 91 pF*

100 - 270 pF**

330 pF

390 pF

470 - 820 pF**

1,000 pF

1,200 pF

1,500 pF

1,800 pF

2,200 pF

2,700 pF

100 - 910*

101 - 391**

331

391

471 - 821**

102

J

K

M

FB FB FB FB FB FB FB

FB FB FB FB FB FB FE

LF LF LF

LF LF LF GB GB GB GB

122

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

FB FB FB FB FB FB FB FB LF LF LF GB GB GB GB

3,300 pF

3,900 pF

4,700 pF

FB FB FB FB FB FB FB FB LF LF

FB FB FB FB FB FB FB FB LD LD

GB GB GB GB

GB GB GB GD

GB GB GB GH

GB GB GB GB GB

5,600 pF

6,800 pF

8,200 pF

10,000 pF

12,000 pF

15,000 pF

18,000 pF

22,000 pF

27,000 pF

JE JE JE

GB GB GB GB GB HB HB HB HB JE JE JE

273

Rated Voltage

(VDC)

Cap

Code

Capacitance

Voltage Code

9

8

4

3

5

1

2

A

5

1

2

3

5

1

2

A

5

1

2

A

3

5

1

2

A

Case Size/

Series

C1210T

C1808T

C1812T

C1825T

C2220T

*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91)

**Capacitance range Includes E12 decade values only. (i.e., 10, 12, 15, 18, 22, 27, 33, 39, 47, 56, 68, and 82)

C1027_X7R_COTS_SMD • 11/29/2017

6

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC

Table 1B – Capacitance Range/Selection Waterfall (1210 – 2220 Case Sizes) cont'd

Case Size/

Series

C1210T

C1808T

C1812T

C1825T

C2220T

Cap

Code

Voltage Code

9

8

4

3

5

1

2

A

5

1

2

3

5

1

2

A

5

1

2

A

3

5

1

2

A

Capacitance

Rated Voltage

(VDC)

Capacitance

Tolerance

Product Availability and Chip Thickness Codes

See Table 2 for Chip Thickness Dimensions

33,000 pF

39,000 pF

47,000 pF

56,000 pF

68,000 pF

82,000 pF

0.10 µF

0.12 µF

0.15 µF

0.18 µF

0.22 µF

0.27 µF

0.33 µF

0.39 µF

0.47 µF

0.56 µF

0.68 µF

0.82 µF

1.0 µF

1.2 µF

1.5 µF

1.8 µF

2.2 µF

2.7 µF

3.3 µF

3.9 µF

4.7 µF

333

393

473

563

683

823

104

124

154

184

224

274

334

394

474

564

684

824

105

125

155

185

225

275

335

395

475

565

685

825

106

126

156

186

226

J

K

M

FB FB FB FB FB FB FB FB LD LD

FB FB FB FB FB FB FC FC LD LD

FB FB FB FB FB FB FC FC LD

FB FB FB FB FB FC FF FF LD

FB FB FB FB FB FD FG FG LD

FB FB FB FB FB FD FH FH LD

FC FC FC FC FC FD FM FM LD

FC FC FC FC FC FD FK FK LD

FC FC FC FC FC FD FK FK

FC FC FC FC FC FD

FD FD FD FD FD FD

FD FD FD FD FD FF

FD FD FD FD FD FG

FF FF FF FF FF FL

FH FH FH FH FH FM

FH FH FH FH FG FH

GB GB GB GB GB HB HB HB HB JB JB JB

GB GB GB GB GB HB HB HB HB JB JB JC JC JC

GB GB GB GE GE HB HB HB HB JB JB JC JC JC

GB GB GB GG GG HB HB HB HB JB JB JC JC JC

GB GB GG GG GG HB HB HB HB JC JC JC JC JC

GB GB GG GG GG HD HD HD HD JC JC JC JC JC

GB GB GG GJ GJ HD HD HD HD JC JC JC JC JC

GC GC GG

GE GE GG

GB GB GB

GC GC GC

GE GE GE

GO GO GG

GJ GJ GJ

GL GL GL

HD HD HD HD JC JD JD JD JD

HF HF HF HF JC JF JF JF JF

JC JC

JD JD

JF JF

FH FH FH FH FG FM

FH FH FH FH FG FJ

FJ FJ FJ FJ FG FK

FE FE FE FG FH

FF FF FF FM FM

FG FG FG FG FK

FC FC FC FG FS

FF FF FF FH

GK GK

JF JF

5.6 µF

6.8 µF

8.2 µF

10 µF

12 µF

15 µF

18 µF

22 µF

FG FG FG FM

FH FH FH FK

FH FH FH FS

GK

JF JO

JO

FS FS

JO

Rated Voltage

(VDC)

Cap

Code

Capacitance

Voltage Code

9

8

4

3

5

1

2

A

5

1

2

3

5

1

2

A

5

1

2

A

3

5

1

2

A

Case Size/

Series

C1210T

C1808T

C1812T

C1825T

C2220T

*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91)

**Capacitance range Includes E12 decade values only. (i.e., 10, 12, 15, 18, 22, 27, 33, 39, 47, 56, 68, and 82)

C1027_X7R_COTS_SMD • 11/29/2017

7

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC

Table 2A – Chip Thickness/Tape & Reel Packaging Quantities

Paper Quantity¹

Plastic Quantity

7" Reel 13" Reel

Thickness Case Thickness ±

Code

Size¹Range (mm)

7" Reel

13" Reel

BB

CF

DN

DP

DE

DG

DH

EB

EC

EN

ED

EE

EF

EM

EG

EH

FB

FC

FD

FE

FF

FG

FL

FH

FM

FJ

FK

FS

LD

LF

GB

GC

GD

GE

GH

GG

GK

GJ

GO

HB

HD

HF

JB

JC

JD

JE

0402

0603

0805

1206

1210

1808

1812

1825

2220

0.50 ± 0.05

0.80 ± 0.07

0.78 ± 0.10

0.90 ± 0.10

1.00 ± 0.10

1.25 ± 0.15

1.25 ± 0.20

0.78 ± 0.10

0.90 ± 0.10

0.95 ± 0.10

1.00 ± 0.10

1.10 ± 0.10

1.20 ± 0.15

1.25 ± 0.15

1.60 ± 0.15

1.60 ± 0.20

0.78 ± 0.10

0.90 ± 0.10

0.95 ± 0.10

1.00 ± 0.10

1.10 ± 0.10

1.25 ± 0.15

1.40 ± 0.15

1.55 ± 0.15

1.70 ± 0.20

1.85 ± 0.20

2.10 ± 0.20

2.50 ± 0.30

0.90 ± 0.10

1.00 ± 0.15

1.00 ± 0.10

1.10 ± 0.10

1.25 ± 0.15

1.30 ± 0.10

1.40 ± 0.15

1.55 ± 0.10

1.60 ± 0.20

1.70 ± 0.15

2.50 ± 0.20

1.10 ± 0.15

1.30 ± 0.15

1.50 ± 0.15

1.00 ± 0.15

1.10 ± 0.15

1.30 ± 0.15

1.40 ± 0.15

1.50 ± 0.15

2.40 ± 0.15

10,000

4,000

0

50,000

15,000

0

2,500

4,000

2,500

2,000

4,000

2,500

2,000

1,000

2,500

1,000

500

10,000

8,000

10,000

8,000

4,000

10,000

4,000

2,000

4,000

2,000

0

4,000

0

10,000

0

1,000

500

0

JF

JO

7" Reel

13" Reel

7" Reel

13" Reel

Thickness

Code

Case

Size¹

Thickness ±

Range (mm)

Paper Quantity¹

Plastic Quantity

Package quantity based on ﬁnished chip thickness speciﬁcations.

¹If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA

0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”.

C1027_X7R_COTS_SMD • 11/29/2017

8

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC

Table 2B – Bulk Packaging Quantities

Loose Packaging

Packaging Type

Bulk Bag (default)

Packaging C-Spec¹

N/A²

Case Size

Packaging Quantities (pieces/unit packaging)

EIA (in)

Metric (mm)

Minimum

Maximum

0402

0603

0805

1206

1210

1808

1812

1825

2220

2225

1005

1608

2012

3216

3225

4520

4532

4564

5650

5664

50,000

1

20,000

¹The "Packaging C-Spec" is a 4 to 8 digit code which identiﬁes the packaging type and/or product grade. When ordering, the proper code must be

included in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details.

Commercial Grade product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk

bag packaging option for Automotive Grade products.

²A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and Automotive Grade products). The

15th through 22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our

standard "Bulk Bag" packaging.

C1027_X7R_COTS_SMD • 11/29/2017

9

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC

Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351

Density Level A:

Maximum (Most)

Land Protrusion (mm)

Density Level B:

Median (Nominal)

Land Protrusion (mm)

Density Level C:

Minimum (Least)

Land Protrusion (mm)

EIA

Size

Code

Metric

Size

Code

C

Y

X

V1

V2

C

Y

X

V1

V2

C

Y

X

V1

V2

0402

0603

0805

1206

1210

1210¹

1812

2220

1005

1608

2012

3216

3225

4532

5650

0.50

0.72

2.20

1.20

0.45

0.62

1.90

1.00

0.40

0.52

1.60

0.80

0.90

1.00

1.60

1.50

2.15

2.75

1.15

1.35

1.60

1.70

1.10

1.55

1.90

2.80

2.90

3.60

5.50

4.00

4.40

5.60

5.65

5.60

6.90

8.20

2.10

2.60

2.90

3.80

3.90

4.60

6.50

0.80

0.90

1.50

1.40

2.05

2.65

0.95

1.15

1.40

1.50

1.00

1.45

1.80

2.70

2.80

3.50

5.40

3.10

3.50

4.70

6.00

7.30

1.50

2.00

2.30

3.20

3.30

4.00

5.90

0.60

0.75

1.40

1.30

1.95

2.55

0.75

0.95

1.20

1.30

0.90

1.35

1.70

2.60

2.70

3.40

5.30

2.40

2.80

4.00

5.30

6.60

1.20

1.70

2.00

2.90

3.00

3.70

5.60

¹Only for capacitance values ≥ 22 µF

Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reﬂow

solder processes. KEMET only recommends wave soldering of EIA 0603, 0805, and 1206 case sizes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reﬂow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform

qualiﬁcation testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).

Image below based on Density Level B for an EIA 1210 case size.

V1

Y

V2

X

C

Grid Placement Courtyard

C1027_X7R_COTS_SMD • 11/29/2017 10

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC

Soldering Process

Recommended Soldering Technique:

• Solder wave or solder reﬂow for EIA case sizes 0603, 0805 and 1206

• All other EIA case sizes are limited to solder reﬂow only

Recommended Reﬂow Soldering Proﬁle:

KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),

convection, IR or vapor phase reﬂow techniques. Preheating of these components is recommended to avoid extreme thermal

stress. KEMET’s recommended proﬁle conditions for convection and IR reﬂow reﬂect the proﬁle conditions of the IPC/J-

STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reﬂow passes at

these conditions.

Termination Finish

T_ꢁ

T_L

t_ꢁ

Proﬁle Feature

Maꢀimum Ramp ꢂp Rate ꢃ 3ꢄCꢅseconꢆ

Maꢀimum Ramp Doꢇn Rate ꢃ 6ꢄCꢅseconꢆ

SnPb

100% Matte Sn

t_L

Preheat/Soak

Temperature Minimum (T_Smin

)

100°C

150°C

200°C

T_smaꢀ

T_smin

Temperature Maximum (T_Smax

Time (t_S) from T_Sminto T_Smax

)

60 – 120 seconds

t_s

3°C/second

maximum

3°C/second

maximum

Ramp-Up Rate (T_Lto T_P)

25

25ꢄC to ꢁeaꢈ

Liquidous Temperature (T_L)

Time Above Liquidous (t_L)

Peak Temperature (T_P)

183°C

60 – 150 seconds

235°C

217°C

60 – 150 seconds

260°C

Time

Time Within 5°C of Maximum

Peak Temperature (t_P)

20 seconds

maximum

30 seconds

maximum

6°C/second

maximum

6°C/second

maximum

Ramp-Down Rate (T_Pto T_L)

Time 25°C to Peak

Temperature

6 minutes

maximum

8 minutes

maximum

Note 1: All temperatures refer to the center of the package, measured on the

capacitor body surface that is facing up during assembly reﬂow.

C1027_X7R_COTS_SMD • 11/29/2017 11

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC

Table 4 – Performance & Reliability: Test Methods and Conditions

Stress

Reference

Test or Inspection Method

Terminal Strength

JIS–C–6429

Appendix 1, Note: Force of 1.8 kg for 60 seconds.

Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm

for C0G. Flexible termination system – 3.0 mm (minimum).

Board Flex

JIS–C–6429

Magniﬁcation 50 X. Conditions:

a) Method B, 4 hours at 155°C, dry heat at 235°C

b) Method B at 215°C category 3

Solderability

J–STD–002

c) Method D, category 3 at 260°C

Temperature Cycling

Biased Humidity

JESD22 Method JA–104 1,000 Cycles (−55°C to +125°C). Measurement at 24 hours +/−4 hours after test conclusion.

Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor.

MIL–STD–202 Method

103

Measurement at 24 hours +/−4 hours after test conclusion.

Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.

Measurement at 24 hours +/−4 hours after test conclusion.

t = 24 hours/cycle. Steps 7a and 7b not required.

MIL–STD–202 Method

Moisture Resistance

Thermal Shock

106

Measurement at 24 hours +/−4 hours after test conclusion.

−55°C/+125°C. Note: Number of cycles required – 300, maximum transfer time – 20

seconds, dwell time – 15 minutes. Air – Air.

MIL–STD–202 Method

107

MIL–STD–202 Method

108

High Temperature Life

Storage Life

1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied.

/EIA–198

MIL–STD–202 Method

108

150°C, 0 VDC for 1,000 hours.

5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7

secure points on one long side and 2 secure points at corners of opposite sides. Parts

mounted within 2" from any secure point. Test from 10 – 2,000 Hz

MIL–STD–202 Method

204

Vibration

MIL–STD–202 Method

Mechanical Shock

Figure 1 of Method 213, Condition F.

213

MIL–STD–202 Method

215

Resistance to Solvents

Add aqueous wash chemical, OKEM Clean or equivalent.

Storage & Handling

Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in

other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,

and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp

and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum

storage humidity not exceed 70% relative humidity. Temperature ﬂuctuations should be minimized to avoid condensation on

the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock

should be used promptly, preferably within 1.5 years of receipt.

C1027_X7R_COTS_SMD • 11/29/2017 12

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC

Construction

Detailed Cross Section

Dielectric Material

(BaTiO₃)

Dielectric

Material (BaTiO₃)

Barrier Layer

(Ni)

Termination Finish

(100% Matte Sn /

SnPb - 5% Pb min)

End Termination/

External Electrode

(Cu)

Inner Electrodes

(Ni)

End Termination/

External Electrode

(Cu)

Barrier Layer

(Ni)

Termination Finish

(100% Matte Sn /

SnPb - 5% Pb min)

Inner Electrodes

(Ni)

C1027_X7R_COTS_SMD • 11/29/2017 13

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC

Capacitor Marking (Optional):

These surface mount multilayer ceramic capacitors are

normally supplied unmarked. If required, they can be

marked as an extra cost option. Marking is available

on most KEMET devices but must be requested using

the correct ordering code identiﬁer(s). If this option is

requested, two sides of the ceramic body will be laser

marked with a “K” to identify KEMET, followed by two

characters (per EIA–198 - see table below) to identify the

capacitance value. EIA 0603 case size devices are limited

to the “K” character only.

Marking appears in legible contrast. Illustrated below

is an example of an MLCC with laser marking of “KA8”,

which designates a KEMET device with rated capacitance

of 100 µF. Orientation of marking is vendor optional.

2-Digit

KEMET

Capacitance

ID

Code

Laser marking option is not available on:

• C0G, Ultra Stable X8R and Y5V dielectric devices.

• EIA 0402 case size devices.

• EIA 0603 case size devices with Flexible Termination

option.

• KPS Commercial and Automotive Grade stacked

devices.

• X7R dielectric products in capacitance values outlined

below.

EIA Case Size

Metric Size Code

Capacitance

0603

0805

1206

1210

1808

1812

1825

2220

2225

1608

2012

3216

3225

4520

4532

4564

5650

5664

≤ 170 pF

≤ 150 pF

≤ 910 pF

≤ 2,000 pF

≤ 3,900 pF

≤ 6,700 pF

≤ 0.018 µF

≤ 0.027 µF

≤ 0.033 µF

C1027_X7R_COTS_SMD • 11/29/2017 14

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC

Capacitor Marking (Optional) cont’d

Capacitance (pF) For Various Alpha/Numeral Identiﬁers

Numeral

Alpha

Character

9

0

1

2

3

4

5

6

7

8

Capacitance (pF)

A

B

C

D

E

F

0.10

0.11

0.12

0.13

0.15

0.16

0.18

0.20

0.22

0.24

0.27

0.30

0.33

0.36

0.39

0.43

0.47

0.51

0.56

0.62

0.68

0.75

0.82

0.91

0.25

0.35

0.40

0.45

0.50

0.60

0.70

0.80

0.90

1.0

1.1

1.2

1.3

1.5

1.6

1.8

2.0

2.2

2.4

2.7

3.0

3.3

3.6

3.9

4.3

4.7

5.1

5.6

6.2

6.8

7.5

8.2

9.1

2.5

3.5

4.0

4.5

5.0

6.0

7.0

8.0

9.0

10

11

12

13

15

16

18

20

22

24

27

30

33

36

39

43

47

51

56

62

68

75

82

91

25

35

40

45

50

60

70

80

90

100

110

120

130

150

160

180

200

220

240

270

300

330

360

390

430

470

510

560

620

680

750

820

910

250

350

400

450

500

600

700

800

900

1,000

1,100

1,200

1,300

1,500

1,600

1,800

2,000

2,200

2,400

2,700

3,000

3,300

3,600

3,900

4,300

4,700

5,100

5,600

6,200

6,800

7,500

8,200

9,100

2,500

3,500

4,000

4,500

5,000

6,000

7,000

8,000

9,000

10,000 100,000 1,000,000 10,000,000

11,000 110,000 1,100,000 11,000,000

100,000,000

110,000,000

120,000,000

130,000,000

150,000,000

160,000,000

180,000,000

200,000,000

220,000,000

240,000,000

270,000,000

300,000,000

330,000,000

360,000,000

390,000,000

430,000,000

470,000,000

510,000,000

560,000,000

620,000,000

680,000,000

750,000,000

820,000,000

910,000,000

250,000,000

350,000,000

400,000,000

450,000,000

500,000,000

600,000,000

700,000,000

800,000,000

900,000,000

12,000 120,000 1,200,000 12,000,000

13,000 130,000 1,300,000 13,000,000

15,000 150,000 1,500,000 15,000,000

16,000 160,000 1,600,000 16,000,000

18,000 180,000 1,800,000 18,000,000

20,000 200,000 2,000,000 20,000,000

22,000 220,000 2,200,000 22,000,000

24,000 240,000 2,400,000 24,000,000

27,000 270,000 2,700,000 27,000,000

30,000 300,000 3,000,000 30,000,000

33,000 330,000 3,300,000 33,000,000

36,000 360,000 3,600,000 36,000,000

39,000 390,000 3,900,000 39,000,000

43,000 430,000 4,300,000 43,000,000

47,000 470,000 4,700,000 47,000,000

51,000 510,000 5,100,000 51,000,000

56,000 560,000 5,600,000 56,000,000

62,000 620,000 6,200,000 62,000,000

68,000 680,000 6,800,000 68,000,000

75,000 750,000 7,500,000 75,000,000

82,000 820,000 8,200,000 82,000,000

91,000 910,000 9,100,000 91,000,000

25,000 250,000 2,500,000 25,000,000

35,000 350,000 3,500,000 35,000,000

40,000 400,000 4,000,000 40,000,000

45,000 450,000 4,500,000 45,000,000

50,000 500,000 5,000,000 50,000,000

60,000 600,000 6,000,000 60,000,000

70,000 700,000 7,000,000 70,000,000

80,000 800,000 8,000,000 80,000,000

90,000 900,000 9,000,000 90,000,000

G

H

J

K

L

M

N

P

Q

R

S

T

U

V

W

X

Y

Z

a

b

d

e

f

m

n

t

y

C1027_X7R_COTS_SMD • 11/29/2017 15

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC

Tape & Reel Packaging Information

KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with

EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for

details on reeling quantities for commercial chips.

ꢎar coꢄe label

Anti-static reel

®

ꢃmbosseꢄ plasticꢅ or

puncheꢄ paper carrier.

Chip anꢄ ꢊꢋS orientation in pocꢉet

(eꢈcept ꢁꢀ25 commercial, anꢄ ꢁꢀ25 anꢄ 2225 Military)

KEMET

Sprocꢉet holes

ꢃmbossment or puncheꢄ caꢆity

ꢀ mm, ꢁ2 mm

or ꢁ6 mm carrier tape

Anti-static coꢆer tape

(0.ꢁ0 mm (0.00ꢇꢂ) maꢈimum thicꢉness)

ꢁ7ꢀ mm (7.00ꢂ)

or

330 mm (ꢁ3.00ꢂ)

ꢅꢃꢌA 0ꢁ005, 020ꢁ, 0ꢇ02 anꢄ 0603 case siꢍes aꢆailable on puncheꢄ paper carrier only.

Table 5 – Carrier Tape Conﬁguration, Embossed Plastic & Punched Paper (mm)

New 2 mm Pitch Reel Options*

Embossed Plastic Punched Paper

Tape

Packaging

Ordering Code

(C-Spec)

C-3190

7" Reel 13" Reel 7" Reel 13" Reel

EIA Case Size Size

(W)*

Packaging Type/Options

Pitch (P₁)* Pitch (P₁)*

01005 – 0402

0603

8

2

2/4

4

Automotive grade 7" reel unmarked

Automotive grade 13" reel unmarked

Commercial grade 7" reel unmarked

Commercial grade 13" reel unmarked

C-3191

2/4

4

C-7081

0805

8

4

C-7082

1206 – 1210

1805 – 1808

≥ 1812

8

4

* 2 mm pitch reel only available for 0603 EIA case size.

2 mm pitch reel for 0805 EIA case size under development.

12

16

8

4

8

Beneﬁts of Changing from 4 mm to 2 mm Pitching Spacing

• Lower placement costs.

• Double the parts on each reel results in fewer reel

changes and increased eﬃciency.

• Fewer reels result in lower packaging, shipping and

storage costs, reducing waste.

KPS 1210

8

KPS 1812

and 2220

12

4

12

4

Array 0612

*Refer to Figures 1 and 2 for W and P₁carrier tape reference locations.

*Refer to Tables 6 and 7 for tolerance speciﬁcations.

C1027_X7R_COTS_SMD • 11/29/2017 16

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC

Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

T

ꢀ 2

ꢍꢆ0 pitches cumulatiꢃe

tolerance on tape ꢎ0.2 mmꢏ

2

ꢉ

ꢆ

ꢀo

ꢈDo

Ao

ꢁ

ꢅo

ꢂ

ꢉ

2

ꢄ

ꢆ

ꢄo

S

ꢆ

ꢀ

ꢆ

T

ꢆ

ꢉmbossment

ꢁor caꢃity siꢊe,

see ꢋote ꢆ Table ꢌ

Center Lines of Caꢃity

ꢈD

ꢆ

Coꢃer Tape

is for tape feeꢇer reference only,

incluꢇing ꢇraft concentric about ꢄo.

ꢄ

ꢆ

User Direction of Unreeling

Table 6 – Embossed (Plastic) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

D₁Minimum

Note 1

1.0

(0.039)

R Reference S₁Minimum

T

T₁

Tape Size

8 mm

D₀

E₁

P₀

P₂

Note 2

Note 3

Maximum Maximum

25.0

(0.984)

1.5 +0.10/−0.0

(0.059 +0.004/−0.0)

1.75 ±0.10

4.0 ±0.10

2.0 ±0.05

0.600

(0.024)

0.600

(0.024)

0.100

(0.004)

12 mm

16 mm

(0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002)

1.5

(0.059)

30

(1.181)

Variable Dimensions — Millimeters (Inches)

B₁Maximum

Note 4

E₂

T₂

W

Tape Size

8 mm

Pitch

F

P₁

A₀,B₀& K₀

Minimum

6.25

(0.246)

Maximum Maximum

2.5

(0.098)

4.35

(0.171)

3.5 ±0.05

(0.138 ±0.002) (0.157 ±0.004)

4.0 ±0.10

8.3

(0.327)

Single (4 mm)

8.2

10.25

5.5 ±0.05

8.0 ±0.10

4.6

12.3

12 mm

16 mm

Note 5

and Double (8 mm)

(0.323)

(0.404)

(0.217 ±0.002) (0.315 ±0.004)

(0.181)

(0.484)

12.1

(0.476)

14.25

(0.561)

7.5 ±0.05 12.0 ±0.10

(0.138 ±0.002) (0.157 ±0.004)

4.6

(0.181)

16.3

(0.642)

Triple (12 mm)

1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment

location and hole location shall be applied independent of each other.

2. The tape with or without components shall pass around R without damage (see Figure 6).

3. If S₁< 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).

4. B₁dimension is a reference dimension for tape feeder clearance only.

5. The cavity deﬁned by A₀, B₀and K₀shall surround the component with suﬃcient clearance that:

(a) the component does not protrude above the top surface of the carrier tape.

(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).

(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see

Figure 4).

(e) for KPS product, A₀and B₀are measured on a plane 0.3 mm above the bottom of the pocket.

(f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.

C1027_X7R_COTS_SMD • 11/29/2017 17

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC

Figure 2 – Punched (Paper) Carrier Tape Dimensions

T

ꢋꢂ0 pitches cumulatiꢀe

tolerance on tape ꢌ0.2 mmꢍ

ꢄ_ꢂ

ꢁo

ꢃDo

A₀

ꢅ

ꢆ

ꢄ₂

ꢈ₀

ꢁ^ꢂ

ꢈottom Coꢀer Tape

ꢇ

Caꢀity Siꢉe,

See

T^ꢂ

Center Lines of Caꢀity

Top Coꢀer Tape

ꢊote ꢂ, Table 7

ꢈottom Coꢀer Tape

User Direction of Unreeling

Table 7 – Punched (Paper) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

R Reference

Note 2

Tape Size

8 mm

D₀

E₁

P₀

P₂

T₁Maximum

G Minimum

0.10

1.5 +0.10 -0.0

(0.059 +0.004 -0.0)

1.75 ±0.10

(0.069 ±0.004)

4.0 ±0.10

(0.157 ±0.004)

2.0 ±0.05

(0.079 ±0.002)

0.75

(0.030)

25

(0.984)

(0.004)

Maximum

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

Pitch

E2 Minimum

F

P₁

T Maximum

W Maximum

A₀B₀

2.0 ±0.05

(0.079 ±0.002)

4.0 ±0.10

(0.157 ±0.004)

8.3

(0.327)

8.3

(0.327)

Half (2 mm)

Single (4 mm)

6.25

(0.246)

3.5 ±0.05

(0.138 ±0.002)

1.1

(0.098)

Note 1

8 mm

1. The cavity deﬁned by A₀, B₀and T shall surround the component with suﬃcient clearance that:

a) the component does not protrude beyond either surface of the carrier tape.

b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

c) rotation of the component is limited to 20° maximum (see Figure 3).

d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).

e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.

2. The tape with or without components shall pass around R without damage (see Figure 6).

C1027_X7R_COTS_SMD • 11/29/2017 18

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC

Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 kg minimum.

2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

Tape Width

8 mm

Peel Strength

0.1 to 1.0 Newton (10 to 100 gf)

0.1 to 1.3 Newton (10 to 130 gf)

12 and 16 mm

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be

165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of

300 ±10 mm/minute.

3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA

Standards 556 and 624.

Figure 3 – Maximum Component Rotation

°

T

Maximum Component Rotation

Top View

Maximum Component Rotation

Side View

Typical Pocket Centerline

Tape

Maximum

°

T

s

Width (mm) Rotation (

)

8,12

16 – 200

20

10

Bo

Tape

Maximum

°

S

Width (mm) Rotation (

)

8,12

16 – 56

72 – 200

20

10

5

Typical Component Centerline

Ao

Figure 4 – Maximum Lateral Movement

Figure 5 – Bending Radius

Embossed

Carrier

Punched

Carrier

8 mm & 12 mm Tape

16 mm Tape

0.5 mm maximum

1.0 mm maximum

R

Bending

Radius

R

C1027_X7R_COTS_SMD • 11/29/2017 19

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC

Figure 6 – Reel Dimensions

ꢁull Raꢂius,

ꢋ3 (ꢆncluꢂes

flange ꢂistortion

at outer eꢂge)

Access Hole at

Slot Location

(ꢄ ꢅ0 mm minimum)

See ꢀote

ꢋ2 (Measureꢂ at hub)

D

(See ꢀote)

A

ꢀ

C

(Arbor hole

ꢋꢊ (Measureꢂ at hub)

ꢂiameter)

ꢆf present,

tape slot in core

for tape startꢇ

2.5 mm minimum ꢈiꢂth ꢉ

ꢊ0.0 mm minimum ꢂepth

ꢃ

(see ꢀote)

ꢀoteꢇ Driꢌe spoꢍes optionalꢎ if useꢂ, ꢂimensions ꢃ anꢂ D shall apply.

Table 8 – Reel Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size

8 mm

A

B Minimum

C

D Minimum

178 ±0.20

(7.008 ±0.008)

or

1.5

(0.059)

13.0 +0.5/−0.2

(0.521 +0.02/−0.008)

20.2

(0.795)

12 mm

16 mm

330 ±0.20

(13.000 ±0.008)

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

N Minimum

W₁

W₂Maximum

W₃

8.4 +1.5/−0.0

(0.331 +0.059/−0.0)

14.4

(0.567)

50

(1.969)

12.4 +2.0/−0.0

18.4

Shall accommodate tape

width without interference

12 mm

16 mm

(0.488 +0.078/−0.0)

(0.724)

16.4 +2.0/−0.0

(0.646 +0.078/−0.0)

22.4

(0.882)

C1027_X7R_COTS_SMD • 11/29/2017 20

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC

Figure 7 – Tape Leader & Trailer Dimensions

ꢃmbosseꢁ Carrier

Carrier Tape

ꢆuncheꢁ Carrier

ꢇ mm ꢈ ꢀ2 mm only

Rounꢁ Sprocꢂet Holes

START

END

Top Coꢅer Tape

ꢃlongateꢁ Sprocꢂet Holes

(32 mm tape anꢁ ꢄiꢁer)

ꢀ00 mm

minimum Leaꢁer

ꢉ00 mm minimum

Trailer

Components

ꢀ60 mm minimum

Top Coꢅer Tape

Figure 8 – Maximum Camber

ꢄlongateꢀ Sprocꢁet Holes

(32 mm ꢅ ꢆiꢀer tapes)

Carrier Tape

Rounꢀ Sprocꢁet Holes

ꢂ mm maꢃimum, either ꢀirection

Straight ꢄꢀge

250 mm

C1027_X7R_COTS_SMD • 11/29/2017 21

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC

KEMET Electronics Corporation Sales Oﬃces

For a complete list of our global sales oﬃces, please visit www.kemet.com/sales.

Disclaimer

All product speciﬁcations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for

checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.

All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.

Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such

applications, but are not intended to constitute – and KEMET speciﬁcally disclaims – any warranty concerning suitability for a speciﬁc customer application or use.

The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any

technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no

obligation or liability for the advice given or results obtained.

Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component

failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards

(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or

property damage.

Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other

measures may not be required.

KEMET is a registered trademark of KEMET Electronics Corporation.

C1027_X7R_COTS_SMD • 11/29/2017 22


型号：	C0805T104K5RAL7800
厂家：	KEMET CORPORATION
描述：	Cap,Ceramic,100nF,50VDC,10% -Tol,10% +Tol,X7R TC Code,-15,15% TC,0805 Case
文件：	总22页 (文件大小：1418K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

C0805T104K5RAL7800 [KEMET]

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