C0805X561M3RACTU_技术文档

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP) X7R Dielectric,

6.3 – 250 VDC (Commercial & Automotive Grade)

Overview

KEMET’s Flexible Termination (FT-CAP) multilayer ceramic

capacitor in X7R dielectric incorporates a unique, ﬂexible

termination system that is integrated with KEMET’s standard

termination materials. A conductive silver epoxy is utilized

between the base metal and nickel barrier layers of KEMET’s

standard termination system in order to establish pliability

while maintaining terminal strength, solderability and electrical

performance. This technology was developed in order to

address the primary failure mode of MLCCs– ﬂex cracks, which

are typically the result of excessive tensile and shear stresses

produced during board ﬂexure and thermal cycling. Flexible

environmental and handling conditions, it does provide superior

ﬂex performance over standard termination systems.FT-CAP

complements KEMET’s Open Mode, Floating Electrode (FE-CAP),

Floating Electrode with Flexible Termination (FF-CAP) and KEMET

Power Solutions (KPS) product lines by providing a complete

portfolio of ﬂex mitigation solutions.

Combined with the stability of an X7R dielectric and designed to

accommodate all capacitance requirements, these ﬂex-robust

devices are RoHS-compliant, offer up to 5mm of ﬂex-bend

capability and exhibit a predictable change in capacitance with

termination technology inhibits the transfer of board stress to the respect to time and voltage. Capacitance change with reference to

rigid ceramic body, therefore mitigating ﬂex cracks which can

result in low IR or short circuit failures.

ambient temperature is limited to ±15% from -55°C to +125°C.

In addition to commercial grade, automotive grade devices are

available which meet the demanding Automotive Electronics

Council's AEC–Q200 qualiﬁcation requirements.

Although this technology does not eliminate the potential

for mechanical damage that may propagate during extreme

Ordering Information

C

1206

X

106

K

4

R

A

C

AUTO

Case Size Speciﬁcation/ Capacitance Capacitance

Failure Rate/

Design

Packaging/Grade

(C-Spec)²

Ceramic

Voltage

Dielectric

Termination Finish¹

(L" x W")

Series

Code (pF)

Tolerance

0603

0805

1206

1210

1808

1812

1825

2220

2225

X = Flexible 2 signiﬁcant

J = ±5%

K = ±10%

M = ±20%

9 = 6.3 V

8 = 10 V

4 = 16 V

3 = 25 V

5 = 50 V

1 = 100 V

2 = 200 V

A = 250 V

R = X7R A = N/A

C = 100% Matte Sn Blank = Bulk

Termination

digits +

number of

zeros

L = SnPb (5%

minimum)

TU = 7" Reel Unmarked

TM = 7" Reel Marked

AUTO = Automotive

Grade 7" Reel Unmarked

¹Additional termination ﬁnish options may be available. Contact KEMET for details.

^1,2SnPb termination ﬁnish option is not available on Automotive Grade product.

²Additional reeling or packaging options may be available. Contact KEMET for details.

One world. One KEMET

C1013_X7R_FT-CAP_SMD • 10/3/2012

1

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade & Automotive Grade)

Dimensions – Millimeters (Inches)

L

W

B

T

S

EIA

Metric

Size

Code

1608

2012

S

L

W

Width

T

B

Mounting

Technique

Size

Code

0603

0805

1206

1210

1808

1812

Separation

Minimum

0.58 (.023)

0.75 (.030)

Length

Thickness

Bandwidth

1.60 (.064) ± 0.17 (.007) 0.80 (.032) ± 0.15 (.006)

2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008)

3.30 (.130) ± 0.40 (.016) 1.60 (.063) ± 0.20 (.008)

3.30 (.130) ± 0.40 (.016) 2.50 (.098) ± 0.20 (.008)

4.70 (.185) ± 0.50 (.020) 2.00 (.079) ± 0.20 (.008)

4.50 (.178) ± 0.40 (.016) 3.20 (.126) ± 0.30 (.012)

4.60 (.181) ± 0.40 (.016) 6.40 (.252) ± 0.40 (.016)

5.90 (.232) ± 0.75 (.030) 5.00 (.197) ± 0.40 (.016)

5.90 (.232) ± 0.75 (.030) 6.40 (.248) ± 0.40 (.016)

0.45 (.018) ± 0.15 (.006)

0.50 (0.02) ± 0.25 (.010)

0.60 (.024) ± 0.25 (.010)

0.70 (.028) ± 0.35 (.014)

Solder Wave

or

Solder Reﬂow

3216

3225

4520

4532

4564

5650

5664

See Table 2 for

Thickness

N/A

Solder Reﬂow

Only

1825

2220

2225

Beneﬁts

• -55°C to +125°C operating temperature range

• Superior ﬂex performance (up to 5 mm)

• High capacitance ﬂex mitigation

• Pb-Free and RoHS Compliant

• EIA 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2220, and

2225 case sizes

• Capacitance offerings ranging from 180 pF to 22 μF

• Available capacitance tolerances of ±5%, ±10%, and ±20%

• Non-polar device, minimizing installation concerns

• 100% pure matte tin-plated termination ﬁnish allowing for

excellent solderability

• SnPb termination ﬁnish option available upon request (5% min)

• Commercial and Automotive (AEC–Q200) grades available

• DC voltage ratings of 6.3 V, 10 V, 16 V, 25 V, 50 V, 100 V,

200 V, and 250 V

Applications

Typical applications include circuits with a direct battery or power source connection, critical and safety relevant circuits without

(integrated) current limitation and any application that is subject to high levels of board ﬂexure or temperature cycling. Examples

include raw power input side ﬁltering (power plane/bus), high current applications (automobile battery line) and circuits that cannot be

fused to open. Markets include consumer, medical, industrial (power supply), automotive, aerospace and telecom.

C1013_X7R_FT-CAP_SMD • 10/3/2012

2

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade & Automotive Grade)

Qualiﬁcation/Certiﬁcation

Commercial Grade products are subject to internal qualiﬁcation. Details regarding test methods and conditions are referenced in

Table 4, Performance & Reliability.

Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test

methods and conditions are referenced in document AEC–Q200, Stress Test Qualiﬁcation for Passive Components. For additional

information regarding the Automotive Electronics Council and AEC–Q200, please visit their website at www.aecouncil.com.

Environmental Compliance

Pb-Free and RoHS Compliant (excluding SnPb termination ﬁnish option).

Electrical Parameters/Characteristics

Item

Parameters/Characteristics

Operating Temperature Range

-55°C to +125°C

±15%

Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC)

Aging Rate (Maximum % Capacitance Loss/Decade Hour)

3.0%

250% of rated voltage

Dielectric Withstanding Voltage (DWV)

Dissipation Factor (DF) Maximum Limit @ 25ºC

Insulation Resistance (IR) Limit @ 25°C

(5 ±1 seconds and charge/discharge not exceeding 50 mA)

5% (6.3 and 10 V), 3.5% (16 and 25 V) and 2.5% (50 to 250 V)

See Insulation Resistance Limit Table

(Rated voltage applied for 120 ±5 seconds @ 25°C)

Regarding aging rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.

To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.

Capacitance and dissipation factor (DF) measured under the following conditions:

1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance ≤ 10 µF

120 Hz ±10 Hz and 0.5 ±0.1 Vrms if capacitance > 10 µF

Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as

Automatic Level Control (ALC). The ALC feature should be switched to "ON."

C1013_X7R_FT-CAP_SMD • 10/3/2012

3

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade & Automotive Grade)

Post Environmental Limits

High Temperature Life, Biased Humidity, Moisture Resistance

Rated DC

Voltage

Capacitance

Dissipation Factor

(Maximum %)

Capacitance

Insulation

Resistance

Dielectric

X7R

Value

Shift

> 25

16/25

< 16

3.0

5.0

7.5

All

±20%

10% of Initial Limit

Insulation Resistance Limit Table (X7R Dielectric)

1,000 Megohm

EIA Case Size

500 Megohm

Microfarads or 10 GΩ

Microfarads or 100 GΩ

0201

0402

0603

0805

1206

1210

1808

1812

1825

2220

2225

N/A

< 0.012 µF

< 0.047 µF

< 0.22 µF

< 0.39 µF

ALL

≥ 0.012 µF

≥ 0.047 µF

≥ 0.22 µF

≥ 0.39 µF

N/A

< 2.2 µF

ALL

≥ 2.2 µF

N/A

< 10 µF

ALL

≥ 10 µF

N/A

C1013_X7R_FT-CAP_SMD • 10/3/2012

4

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade & Automotive Grade)

Table 1A – Capacitance Range/Selection Waterfall (0603 – 1210 Case Sizes)

Series

Voltage Code

Voltage DC

C0603X

C0805X

C1206X

C1210X

Cap

Code

9

8

4

3

5

1

2

9

8

4

3

5

1

2

A

9

8

4

3

5

1

2

A

9

8

4

3

5

1

2

A

Cap

Cap Tolerance

Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions

180 pF

220 pF

270 pF

330 pF

390 pF

470 pF

560 pF

680 pF

820 pF

181

221

271

331

391

471

561

681

821

102

122

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

823

104

124

154

184

224

274

334

394

474

564

684

824

105

125

J

K

M

CB CB CB CB CB CB CB DC DC DC DC DC DC DC DC

CB CB CB CB CB CB CB DC DC DC DC DC DC DC DC EB EB EB EB EB

CB CB CB CB CB CB CB DC DC DC DC DC DC DC DC

CB CB CB CB CB CB CB DC DC DC DC DC DC DC DC EB EB EB EB EB EB EB EB

CB CB CB CB CB CB CB DC DC DC DC DC DC DC DC EB EB EB EB EB EB EB EB FB FB FB FB FB FB FB FB

1,000 pF

1,200 pF

1,500 pF

1,800 pF

2,200 pF

2,700 pF

3,300 pF

3,900 pF

4,700 pF

5,600 pF

6,800 pF

8,200 pF

10,000 pF

12,000 pF

15,000 pF

18,000 pF

22,000 pF

27,000 pF

33,000 pF

39,000 pF

47,000 pF

56,000 pF

68,000 pF

82,000 pF

0.10 µF

0.12 µF

0.15 µF

0.18 µF

0.22 µF

0.27 µF

0.33 µF

0.39 µF

0.47 µF

0.56 µF

0.68 µF

0.82 µF

1.0 µF

CB CB CB CB CB CB

CB CB CB CB CB

CB CB CB CB CD

CB CB CB CB

DC DC DC DC DC DC DC DC EB EB EB EB EB EB EB EB FB FB FB FB FB FB FB FB

DC DC DC DC DC DD DC DC EB EB EB EB EB EB EB EB FB FB FB FB FB FB FB FB

DC DC DC DC DC DD DE

DC DC DC DC DC DE DG

DD DD DD DD DD DE DG

DD DD DD DD DD DE

DC DC DC DC DD DG

DC DC DC DC DG DG

DD DD DD DD DD

EB EB EB EB EB EB EB EB FB FB FB FB FB FB FB FB

EB EB EB EB EB EC EB EB FB FB FB FB FB FB FB FB

EB EB EB EB EB EC ED ED FB FB FB FB FB FB FC FC

EB EB EB EB EB EB ED ED FB FB FB FB FB FB FC FC

EB EB EB EB EB EB ED ED FB FB FB FB FB FC FF FF

EB EB EB EB EB EB EM EM FB FB FB FB FB FD FG FG

EC EC EC EC EC EC EG

EC EC EC EC EC EC

EB EB EB EB EC EM

EB EB EB EB EC EG

EC EC EC EC EC EG

ED ED ED ED EC

EE EE EE EE ED

EF EF EF EF ED

EF EF EF EG ED

ED ED ED EG EH

FB FB FB FB FB FD

FC FC FC FC FC FD

FD FD FD FD FD FD

FD FD FD FD FD FF

FD FD FD FD FD FG

FF FF FF FF FF FL

FH FH FH FH FH FM

FH FH FH FH FG

CB CB CB CD

CB CB CB

DG DG DG DG DD

CB CB CB

DG DG DG DG DE

CB CB CB

DD DD DD DD DE

DD DD DD DG DH

DD DD DD DG

1.2 µF

1.5 µF

1.8 µF

2.2 µF

2.7 µF

3.3 µF

3.9 µF

4.7 µF

DE DE DE

155

DG DG DG

EF EF EF EG EH

ED ED ED EF EH

FH FH FH FH FG

C

1206^K

X

106

K

4

R

A

C

AUTO

185

225

J

K

Case Size Speciﬁcation/ Capacitance Capacitance

Failure Rate/

Packaging/Grade

J

K

M

DG DG DG

ED ED ED EF EH

FJ FJ FJ FJ FG

Ceramic

Voltage

Dielectric

Termination Finish

275

EN EN EN EH

FE FE FE FG FH

(L" x W")

Series

Code (pF)

Tolerance

Design

(C-Spec)

335

395

475

565

685

825

J

K

ED ED ED EH

FF FF FF FM FM

0603

X = Flexible 2 signiﬁcant

J = ±5%

K = ±10%

M = ±20%

9 = 6.3 V

8 = 10 V

4 = 16 V

3 = 25 V

5 = 50 V

1 = 100 V

2 = 200 V

R = X7R A = N/A

C = 100% Matte Sn Blank = Bulk

J

M

EF EF EF EH FG FG FG FG FK

EF EF EF EH

EH EH EH

0805

Termination

digits +

number of

zeros

L = SnPb (5%

minimum)

TU = 7" Reel Unmarked

FC FC FC FG FS

J

M

1206

TM = 7" Reel Marked

5.6 µF

6.8 µF

8.2 µF

J

M

FF FF FF FH

1210

AUTO = Automotive

FG FG FG FM

Grade 7" Reel Unmarked

FH FH FH FK

J

1808

J

1812

Voltage DC

1825

Cap

Code

Voltage Code

9

8

4

3

5

1

2

9

8

4

3

5

1

2

A

9

8

4

3

5

1

2

A

9

8

4

3

5

1

2

A

Cap

2220

A = 250 V

2225

Series

C0603X

C0805X

C1206X

C1210X

C1013_X7R_FT-CAP_SMD • 10/3/2012

5

Roll Over for

Order Info.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade & Automotive Grade)

Table 1A – Capacitance Range/Selection Waterfall (0603 – 1210 Case Sizes) cont'd

Series

Voltage Code

Voltage DC

C0603X

C0805X

C1206X

C1210X

Cap

Code

9

8

4

3

5

1

2

9

8

4

3

5

1

2

A

9

8

4

3

5

1

2

A

9

8

4

3

5

1

2

A

Cap

Cap Tolerance

Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions

10 µF

12 µF

15 µF

18 µF

22 µF

106

126

156

186

226

J

K

M

EH EH EH

FH FH FH FS

FS FS

Voltage DC

Voltage Code

Series

Cap

Code

9

8

4

3

5

1

2

9

8

4

3

5

1

2

A

9

8

4

3

5

1

2

A

9

8

4

3

5

1

2

A

Cap

C0603X

C0805X

C1206X

C1210X

Table 1B – Capacitance Range/Selection Waterfall (1808 – 2225 Case Sizes)

Series

Voltage Code

Voltage DC

C1808X

C1812X

C1825X

C2220X

C2225X

Cap

Code

5

1

2

A

3

5

1

2

A

5

1

2

A

3

5

1

2

A

5

1

2

A

Cap

Cap Tolerance

Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions

4,700 pF

5,600 pF

6,800 pF

8,200 pF

10,000 pF

12,000 pF

15,000 pF

18,000 pF

22,000 pF

27,000 pF

33,000 pF

39,000 pF

47,000 pF

56,000 pF

68,000 pF

82,000 pF

0.10 µF

0.12 µF

0.15 µF

0.18 µF

0.22 µF

0.27 µF

0.33 µF

0.39 µF

0.47 µF

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

823

104

124

154

184

224

274

334

394

J

K

M

LD

GB

GC

GB

GE

GF

GB

GE

GG

HB

HD

HB

HD

HB

HD

KC

KB

KC

KD

KE

KC

KD

KE

JC

JD

JC

JD

JF

JC

JD

GB GG GG

GG GG GG

474

J

GG

GC GG

GC GC GG

GJ

HB

HD

JC

KB

C

1206

X

106

K

4

R

A

C

AUTO

0.56 µF

0.68 µF

0.82 µF

1.0 µF

564

684

J

HB

HD

JC

KB

J

K

M

HD

HF

JD

JF

KB

KC

Case Size Speciﬁcation/ Capacitance Capacitance

Failure Rate/

Packaging/Grade

Ceramic

Voltage

Dielectric

Termination Finish

824

J

M

GE

GG

HB

HF

JC

JF

KB

KC

KD

KE

(L" x W")

Series

Code (pF)

Tolerance

Design

(C-Spec)

105

125

155

185

225

J

M

GE

HB

HF

KB

0603

X = Flexible 2 signiﬁcant

J = ±5%

9 = 6.3 V

8 = 10 V

4 = 16 V

3 = 25 V

5 = 50 V

1 = 100 V

R = X7R A = N/A

C = 100% Matte Sn Blank = Bulk

1.2 µF

1.5 µF

1.8 µF

2.2 µF

J

M

HB

JC

JD

JF

0805

Termination

digits +

number of

zeros

K = ±10%

M = ±20%

L = SnPb (5%

TU = 7" Reel Unmarked

J

M

HC

HD

HF

JC

KC

1206

minimum)

JD

JF

TM = 7" Reel Marked

KD

J

M

12

J

10

AUTO = Automotive

KD

1808

Grade 7" Reel Unmarked

Voltage DC

1812

Cap

Code

Voltage Code

5

1

2

A

3

5

1

2

A

5

1

2

A

3

5

1

2

A

5

1

2

A

Cap

1825

2 = 200 V

A = 250 V

2220

2225

Series

C1808X

C1812X

C1825X

C2220X

C2225X

C1013_X7R_FT-CAP_SMD • 10/3/2012

6

Roll Over for

Order Info.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade & Automotive Grade)

Table 1B – Capacitance Range/Selection Waterfall (1808 – 2225 Case Sizes) cont'd

Series

Voltage Code

Voltage DC

C1808X

C1812X

C1825X

C2220X

C2225X

Cap

Code

5

1

2

A

3

5

1

2

A

5

1

2

A

3

5

1

2

A

5

1

2

A

Cap

Cap Tolerance

Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions

2.7 µF

3.3 µF

3.9 µF

4.7 µF

5.6 µF

6.8 µF

8.2 µF

10 µF

12 µF

15 µF

18 µF

22 µF

275

335

395

475

565

685

825

106

126

156

186

226

J

K

M

GK

JF

JO

Voltage DC

Cap

Code

Voltage Code

5

1

2

A

3

5

1

2

A

5

1

2

A

3

5

1

2

A

5

1

2

A

Cap

Series

C1808X

C1812X

C1825X

C2220X

C2225X

Table 2 – Chip Thickness/Packaging Quantities

Paper Quantity

Plastic Quantity

Thickness Case Thickness ±

Code

Size

Range (mm)

7" Reel

13" Reel

7" Reel

13" Reel

CB

CD

DC

DD

DE

DG

DH

EB

EC

EN

ED

EE

EF

0603

0805

1206

0.80 ± 0.07

0.80 ± 0.15

0.78 ± 0.10

0.90 ± 0.10

1.00 ± 0.10

1.25 ± 0.15

1.25 ± 0.20

0.78 ± 0.10

0.90 ± 0.10

0.95 ± 0.10

1.00 ± 0.10

1.10 ± 0.10

1.20 ± 0.15

1.25 ± 0.15

1.60 ± 0.15

1.60 ± 0.20

4,000

0

10,000

0

4,000

2,500

4,000

2,500

2,000

10,000

8,000

10,000

4,000

10,000

0

EM

EG

EH

C

1206

X

106

K

4

R

A

C

AUTO

FB

FC

1210

0.78 ± 0.10

0

4,000

1210

0.90 ± 0.10

0.95 ± 0.10

0

4,000

10,000

Case Size Speciﬁcation/ Capacitance Capacitance

Failure Rate/

Packaging/Grade

(C-Spec)

Ceramic

Voltage

Dielectric

Termination Finish

10,000

Design

FD

FE

FF

FG

FL

1210

0

4,000

2,500

(L" x W")

Series

Code (pF)

Tolerance

1210

0603

1210

0805

1.00 ± 0.10

0

10,000

X = Flexible 2 signiﬁcant

1.10 ± 0.10

J = ±5%

9 = 6.3 V

0

R = X7R A = N/A

2,500

C = 100% Matte Sn Blank = Bulk

0

10,000

L = SnPb (5%

10,000

minimum)

8,000

Termination

digits +

number of

zeros

K = ±10%

8 = 10 V

TU = 7" Reel Unmarked

TM = 7" Reel Marked

AUTO = Automotive

1210

1206

1.25 ± 0.15

1.40 ± 0.15

0

2,500

2,000

M = ±20%

4 = 16 V

1210

0

1210

3 = 25 V

1808

Case

1812

5 = 50 V

1 = 100 V

Grade 7" Reel Unmarked

7" Reel

13" Reel

7" Reel

13" Reel

Thickness

Code

Thickness ±

Range (mm)

Size

1825

Paper Quantity

Plastic Quantity

2 = 200 V

A = 250 V

2220

2225

Package quantity based on ﬁnished chip thickness speciﬁcations.

C1013_X7R_FT-CAP_SMD • 10/3/2012

7

Roll Over for

Order Info.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade & Automotive Grade)

Table 2 – Chip Thickness/Packaging Quantities cont'd

Paper Quantity

7" Reel 13" Reel

Plastic Quantity

7" Reel 13" Reel

Thickness Case Thickness ±

Code

Size

Range (mm)

FH

FM

FJ

1210

1808

1812

1825

2220

2225

1.55 ± 0.15

1.70 ± 0.20

1.85 ± 0.20

2.10 ± 0.20

2.50 ± 0.20

0.90 ± 0.10

1.00 ± 0.10

1.10 ± 0.10

1.30 ± 0.10

1.50 ± 0.10

1.55 ± 0.10

1.60 ± 0.20

1.70 ± 0.15

1.10 ± 0.15

1.15 ± 0.15

1.30 ± 0.15

1.50 ± 0.15

1.10 ± 0.15

1.30 ± 0.15

1.50 ± 0.15

2.40 ± 0.15

1.00 ± 0.15

1.10 ± 0.15

1.30 ± 0.15

1.40 ± 0.15

0

2,000

8,000

0

2,000

1,000

2,500

1,000

500

8,000

4,000

10,000

4,000

2,000

4,000

FK

FS

LD

GB

GC

GE

GF

GG

GK

GJ

HB

HC

HD

HF

JC

JD

JF

JO

KB

KC

KD

KE

1,000

7" Reel

13" Reel

7" Reel

13" Reel

Thickness

Code

Case

Size

Thickness ±

Range (mm)

Paper Quantity

Plastic Quantity

Package quantity based on ﬁnished chip thickness speciﬁcations.

C1013_X7R_FT-CAP_SMD • 10/3/2012

8

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade & Automotive Grade)

Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351

Density Level A:

Maximum (Most)

Land Protrusion (mm)

Density Level B:

Median (Nominal)

Land Protrusion (mm)

Density Level C:

Minimum (Least)

Land Protrusion (mm)

EIA

Size

Code

Metric

Size

Code

C

Y

X

V1

V2

C

Y

X

V1

V2

C

Y

X

V1

V2

0603

0805

1206

1210

1808

1812

1825

2220

2225

1608

2012

3216

3225

4520

4532

4564

5650

5664

0.85

1.00

1.60

2.25

2.10

2.15

2.85

1.25

1.35

1.65

1.85

1.80

2.10

1.10

1.55

1.90

2.80

2.30

3.60

6.90

5.50

6.90

4.00

4.40

5.90

7.40

7.00

7.10

8.80

2.10

2.60

2.90

3.80

3.30

4.60

7.90

6.50

7.90

0.75

0.90

1.50

2.15

2.00

2.05

2.75

1.05

1.15

1.45

1.65

1.60

1.90

1.00

1.45

1.80

2.70

2.20

3.50

6.80

5.40

6.80

3.10

3.50

5.00

6.50

6.10

6.20

7.90

1.50

2.00

2.30

3.20

2.70

4.00

7.30

5.90

7.30

0.65

0.80

1.40

2.05

1.90

1.95

2.65

0.85

0.95

1.25

1.45

1.40

1.70

0.90

1.35

1.70

2.60

2.10

3.40

6.70

5.30

6.70

2.40

2.80

4.30

5.80

5.40

5.50

7.20

1.20

1.70

2.00

2.90

2.40

3.70

7.00

5.60

7.00

Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reﬂow solder

processes. KEMET only recommends wave soldering of EIA 0603, 0805, and 1206 case sizes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reﬂow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualiﬁcation

testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).

Soldering Process

Recommended Soldering Technique:

• Solder wave or solder reﬂow for EIA case sizes 0603, 0805, and 1206

• All other EIA case sizes are limited to solder reﬂow only

Recommended Soldering Proﬁle:

• KEMET recommends following the guidelines outlined in IPC/JEDEC J–STD–020

C1013_X7R_FT-CAP_SMD • 10/3/2012

9

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade & Automotive Grade)

Table 4 – Performance & Reliability: Test Methods and Conditions

Stress

Reference

Test or Inspection Method

Terminal Strength

JIS–C–6429

Appendix 1, Note: Force of 1.8 kg for 60 seconds.

Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G.

Flexible termination system – 3.0 mm (minimum).

Board Flex

JIS–C–6429

Magniﬁcation 50 X. Conditions:

a) Method B, 4 hours @ 155°C, dry heat @ 235°C

b) Method B @ 215°C category 3

Solderability

J–STD–002

c) Method D, category 3 @ 260°C

Temperature Cycling

Biased Humidity

JESD22 Method JA–104

MIL–STD–202 Method 103

1,000 Cycles (-55°C to +125°C). Measurement at 24 hours +/- 2 hours after test conclusion.

Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor. Measurement

at 24 hours +/- 2 hours after test conclusion.

Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.

Measurement at 24 hours +/- 2 hours after test conclusion.

t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered.

Measurement at 24 hours +/- 2 hours after test conclusion.

-55°C/+125°C. Note: Number of cycles required – 300, maximum transfer time – 20 seconds, dwell

time – 15 minutes. Air – Air.

Moisture Resistance

Thermal Shock

MIL–STD–202 Method 106

MIL–STD–202 Method 107

MIL–STD–202 Method 108

/EIA–198

High Temperature Life

1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied.

Storage Life

MIL–STD–202 Method 108 150°C, 0 VDC for 1,000 hours.

Mechanical Shock

MIL–STD–202 Method 213 Figure 1 of Method 213, Condition F.

Resistance to Solvents MIL–STD–202 Method 215 Add aqueous wash chemical, OKEM Clean or equivalent.

Storage and Handling

Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other

environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term

storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may

increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70%

relative humidity. Temperature ﬂuctuations should be minimized to avoid condensation on the parts and atmospheres should be free of

chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of

receipt.

Construction

Reference

Item

Material

A

B

C

D

Finish

100% Matte Sn SnPb (5% min)

Barrier Layer

Epoxy Layer

Base Metal

Ni

Ag

Cu

Termination

System

E

Inner Electrode

Dielectric Material

Ni

F

BaTiO₃

Note: Image is exaggerated in order to clearly identify all components of construction.

C1013_X7R_FT-CAP_SMD • 10/3/2012 10

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade & Automotive Grade)

Capacitor Marking (Optional):

These surface mount multilayer ceramic capacitors are

normally supplied unmarked. If required, they can be marked

as an extra cost option. Marking is available on most KEMET

devices but must be requested using the correct ordering

code identiﬁer(s). If this option is requested, two sides of the

ceramic body will be laser marked with a “K” to identify KEMET,

followed by two characters (per EIA–198 - see table below) to

identify the capacitance value. EIA 0603 case size devices are

limited to the “K” character only.

Marking appears in legible contrast. Illustrated below is an

example of an MLCC with laser marking of “KA8”, which

designates a KEMET device with rated capacitance of 100 µF.

Orientation of marking is vendor optional.

_

KA8

Laser marking option is not available on:

• C0G and Y5V dielectric devices

• EIA 0402 case size devices

• EIA 0603 case size devices with Flexible Termination option.

Capacitance (pF) For Various Alpha / Numeral Identiﬁers

Numeral

Alpha

Character

9

0

1

2

3

4

5

6

7

8

Capacitance (pF)

A

B

C

D

E

F

G

H

J

0.1

0.11

0.12

0.13

0.15

0.16

0.18

0.2

1 0

1.1

1 2

1 3

1 5

1 6

1 8

2 0

2 2

2.4

2.7

3 0

3 3

3 6

3 9

4 3

4.7

5.1

5 6

6 2

6 8

7 5

8 2

9.1

2 5

3 5

4 0

4 5

5 0

6 0

7 0

8 0

9 0

10

11

12

13

15

16

18

20

22

24

27

30

33

36

39

43

47

51

56

62

68

75

82

91

25

35

40

45

50

60

70

80

90

100

110

120

130

150

160

180

200

220

240

270

300

330

360

390

430

470

510

560

620

680

750

820

910

250

350

400

450

500

600

700

800

900

1,000

1,100

1,200

1,300

1,500

1,600

1,800

2,000

2,200

2,400

2,700

3,000

3,300

3,600

3,900

4,300

4,700

5,100

5,600

6,200

6,800

7,500

8,200

9,100

2,500

3,500

4,000

4,500

5,000

6,000

7,000

8,000

9,000

10,000

11,000

12,000

13,000

15,000

16,000

18,000

20,000

22,000

24,000

27,000

30,000

33,000

36,000

39,000

43,000

47,000

51,000

56,000

62,000

68,000

75,000

82,000

91,000

25,000

35,000

40,000

45,000

50,000

60,000

70,000

80,000

90,000

100,000 1,000,000

110,000 1,100,000

120,000 1,200,000

130,000 1,300,000

150,000 1,500,000

160,000 1,600,000

180,000 1,800,000

200,000 2,000,000

220,000 2,200,000

240,000 2,400,000

270,000 2,700,000

300,000 3,000,000

330,000 3,300,000

360,000 3,600,000

390,000 3,900,000

430,000 4,300,000

470,000 4,700,000

510,000 5,100,000

560,000 5,600,000

620,000 6,200,000

680,000 6,800,000

750,000 7,500,000

820,000 8,200,000

910,000 9,100,000

250,000 2,500,000

350,000 3,500,000

400,000 4,000,000

450,000 4,500,000

500,000 5,000,000

600,000 6,000,000

700,000 7,000,000

800,000 8,000,000

900,000 9,000,000

10,000,000

11,000,000

12,000,000

13,000,000

15,000,000

16,000,000

18,000,000

20,000,000

22,000,000

24,000,000

27,000,000

30,000,000

33,000,000

36,000,000

39,000,000

43,000,000

47,000,000

51,000,000

56,000,000

62,000,000

68,000,000

75,000,000

82,000,000

91,000,000

25,000,000

35,000,000

40,000,000

45,000,000

50,000,000

60,000,000

70,000,000

80,000,000

90,000,000

100,000,000

110,000,000

120,000,000

130,000,000

150,000,000

160,000,000

180,000,000

200,000,000

220,000,000

240,000,000

270,000,000

300,000,000

330,000,000

360,000,000

390,000,000

430,000,000

470,000,000

510,000,000

560,000,000

620,000,000

680,000,000

750,000,000

820,000,000

910,000,000

250,000,000

350,000,000

400,000,000

450,000,000

500,000,000

600,000,000

700,000,000

800,000,000

900,000,000

0.22

0.24

0.27

0.3

K

L

M

N

P

Q

R

S

T

U

V

W

X

Y

Z

a

0.33

0.36

0.39

0.43

0.47

0.51

0.56

0.62

0.68

0.75

0.82

0.91

0.25

0.35

0.4

b

d

e

0.45

0.5

f

m

n

0.6

0.7

t

0.8

y

0.9

C1013_X7R_FT-CAP_SMD • 10/3/2012 11

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade & Automotive Grade)

Tape & Reel Packaging Information

KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA

Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on

reeling quantities for commercial chips.

Bar Code Label

Anti-Static Reel

®

Embossed Plastic* or

Punched Paper Carrier.

Chip and KPS Orientation in Pocket

(except 1825 Commercial, and 1825 and 2225 Military)

KEMET

Sprocket Holes

Embossment or Punched Cavity

8 mm, 12 mm

or 16 mm Carrier Tape

Anti-Static Cover Tape

(.10 mm (.004") Maximum Thickness)

178 mm (7.00")

or

330 mm (13.00")

*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.

Table 5 – Carrier Tape Conﬁguration – Embossed Plastic & Punched Paper (mm)

EIA Case Size

01005 – 0402

0603 – 1210

Tape Size (W)*

Lead Space (P₁)*

8

2

4

1805 – 1808

12

16

8

4

≥ 1812

8

KPS 1210

8

KPS 1812 & 2220

Array 0508 & 0612

12

4

*Refer to Figures 1 & 2 for W and P₁carrier tape reference locations.

*Refer to Tables 6 & 7 for tolerance speciﬁcations.

C1013_X7R_FT-CAP_SMD • 10/3/2012 12

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade & Automotive Grade)

Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

T

P2

[10 pitches cumulative

tolerance on tape ± 0.2 mm]

2

E

1

Po

ØDo

Ao

F

Ko

W

E

2

B

1

Bo

S

1

P

1

T

1

Embossment

For cavity size,

see Note 1 Table 4

Center Lines of Cavity

ØD

1

Cover Tape

is for tape feeder reference only,

including draft concentric about B

B

1

o

.

User Direction of Unreeling

Table 6 – Embossed (Plastic) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

D₁Minimum

Note 1

1.0

(0.039)

R Reference S₁Minimum

T

T₁

Tape Size

8 mm

D₀

E₁

P₀

P₂

Note 2

Note 3

Maximum

25.0

(0.984)

1.5 +0.10/-0.0 (0.059

+0.004/-0.0)

1.75 ±0.10

4.0 ±0.10

2.0 ±0.05 (0.079

±0.002)

0.600

(0.024)

0.600

(0.024)

0.100

(0.004)

12 mm

16 mm

(0.069 ±0.004) (0.157 ±0.004)

1.5

(0.059)

30

(1.181)

Variable Dimensions — Millimeters (Inches)

B₁Maximum

Note 4

4.35

(0.171)

E₂

T₂

W

Tape Size

8 mm

Pitch

F

P₁

A₀,B₀& K₀

Minimum

6.25

(0.246)

Maximum

2.5

(0.098)

Maximum

8.3

(0.327)

3.5 ±0.05

(0.138 ±0.002) (0.157 ±0.004)

4.0 ±0.10

Single (4 mm)

Single (4 mm) &

Double (8 mm)

8.2

10.25

5.5 ±0.05

8.0 ±0.10 (0.315

±0.004)

4.6

12.3

12 mm

16 mm

Note 5

(0.323)

(0.404)

(0.217 ±0.002)

(0.181)

(0.484)

12.1

(0.476)

14.25

(0.561)

5.5 ±0.05

(0.217 ±0.002)

8.0 ±0.10 (0.315

±0.004)

4.6

(0.181)

16.3

(0.642)

Triple (12 mm)

1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and

hole location shall be applied independent of each other.

2. The tape with or without components shall pass around R without damage (see Figure 6).

3. If S₁< 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).

4. B₁dimension is a reference dimension for tape feeder clearance only.

5. The cavity deﬁned by A₀, B₀and K₀shall surround the component with sufﬁcient clearance that:

(a) the component does not protrude above the top surface of the carrier tape.

(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).

(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4).

(e) for KPS Series product, A₀and B₀are measured on a plane 0.3 mm above the bottom of the pocket.

(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.

C1013_X7R_FT-CAP_SMD • 10/3/2012 13

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade & Automotive Grade)

Figure 2 – Punched (Paper) Carrier Tape Dimensions

T

P2

[10 pitches cumulative

tolerance on tape ± 0.2 mm]

E

1

Po

ØDo

0

A

F

W

2

E

0

B

Bottom Cover Tape

P

1

G

Cavity Size,

See

1

T

1

T

Top Cover Tape

Center Lines of Cavity

Note 1, Table 7

Bottom Cover Tape

User Direction of Unreeling

Table 7 – Punched (Paper) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

R Reference

Note 2

Tape Size

8 mm

D₀

E₁

P₀

P₂

T₁Maximum

G Minimum

1.5 +0.10 -0.0

(0.059 +0.004 -0.0)

1.75 ±0.10

(0.069 ±0.004)

4.0 ±0.10

(0.157 ±0.004)

2.0 ±0.05

(0.079 ±0.002) (0.004) Maximum

0.10

0.75

(0.030)

25

(0.984)

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

Pitch

E2 Minimum

F

P₁

T Maximum

W Maximum

A₀B₀

2.0 ±0.05

(0.079 ±0.002)

4.0 ±0.10

8.3

(0.327)

8.3

Half (2 mm)

Single (4 mm)

6.25

(0.246)

3.5 ±0.05

(0.138 ±0.002)

1.1

(0.098)

Note 1

8 mm

(0.157 ±0.004)

(0.327)

1. The cavity deﬁned by A₀, B₀and T shall surround the component with sufﬁcient clearance that:

a) the component does not protrude beyond either surface of the carrier tape.

b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

c) rotation of the component is limited to 20° maximum (see Figure 3).

d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).

e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.

2. The tape with or without components shall pass around R without damage (see Figure 6).

C1013_X7R_FT-CAP_SMD • 10/3/2012 14

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade & Automotive Grade)

Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 Kg minimum.

2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

Tape Width

8 mm

Peel Strength

0.1 to 1.0 Newton (10 to 100 gf)

0.1 to 1.3 Newton (10 to 130 gf)

12 and 16 mm

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180°

from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.

3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA

Standards 556 and 624.

Figure 3 – Maximum Component Rotation

°

T

Maximum Component Rotation

Top View

Maximum Component Rotation

Side View

Typical Pocket Centerline

Tape

Maximum

°

T

s

Width (mm) Rotation (

)

8,12

16 – 200

20

10

Bo

Tape

Maximum

°

S

Width (mm) Rotation (

)

8,12

16 – 56

72 – 200

20

10

5

Typical Component Centerline

Ao

Figure 4 – Maximum Lateral Movement

Figure 5 – Bending Radius

Embossed

Carrier

Punched

Carrier

8 mm & 12 mm Tape

16 mm Tape

0.5 mm maximum

1.0 mm maximum

R

Bending

Radius

R

C1013_X7R_FT-CAP_SMD • 10/3/2012 15

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade & Automotive Grade)

Figure 6 – Reel Dimensions

Full Radius,

W3 (Includes

flange distortion

at outer edge)

Access Hole at

Slot Location

(Ø 40 mm minimum)

See Note

W

2 (Measured at hub)

D

(See Note)

A

N

C

(Arbor hole

W

1 (Measured at hub)

diameter)

If present,

tape slot in core

for tape start:

2.5 mm minimum width x

10.0 mm minimum depth

B

(see Note)

Note: Drive spokes optional; if used, dimensions B and D shall apply.

Table 8 – Reel Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size

8 mm

A

B Minimum

C

D Minimum

178 ±0.20

(7.008 ±0.008)

or

330 ±0.20

(13.000 ±0.008)

1.5

(0.059)

13.0 +0.5/-0.2

(0.521 +0.02/-0.008)

20.2

(0.795)

12 mm

16 mm

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

N Minimum

W₁

W₂Maximum

W₃

8.4 +1.5/-0.0

(0.331 +0.059/-0.0)

14.4

(0.567)

50

(1.969)

12.4 +2.0/-0.0

18.4

Shall accommodate tape width

without interference

12 mm

16 mm

(0.488 +0.078/-0.0)

(0.724)

16.4 +2.0/-0.0

(0.646 +0.078/-0.0)

22.4

(0.882)

C1013_X7R_FT-CAP_SMD • 10/3/2012 16

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade & Automotive Grade)

Figure 7 – Tape Leader & Trailer Dimensions

Embossed Carrier

Carrier Tape

Round Sprocket Holes

Punched Carrier

8 mm & 12 mm only

START

END

Top Cover Tape

Elongated Sprocket Holes

(32 mm tape and wider)

100 mm

Minimum Leader

400 mm Minimum

Trailer

160 mm Minimum

Components

Top Cover Tape

Figure 8 – Maximum Camber

Elongated sprocket holes

(32 mm & wider tapes)

Carrier Tape

Round Sprocket Holes

1 mm Maximum, either direction

Straight Edge

250 mm

Bulk Cassette Packaging (Ceramic Chips Only)

Meets Dimensional Requirements IEC–286 and EIAJ 7201

Unit mm *Reference

53 3*

10*

1.5 ± ⁰₀^.1

2.0 ± ₀⁰_.1

3.0 ± ⁰₀^.2

5 0*

110 ± 0.7

Capacitor Dimensions for Bulk Cassette

Cassette Packaging – Millimeters

EIA Size Metric Size

S Separation

Minimum

Number of

Pieces/Cassette

L Length

W Width

B Bandwidth

T Thickness

Code

0402

1005

1.0 ±0.05

1.6 ±0.07

0.5 ±0.05

0.8 ±0.07

0.2 to 0.4

0.2 to 0.5

0.3

0.5 ±0.05

0.8 ±0.07

50,000

0603

1608

0.7

15,000

C1013_X7R_FT-CAP_SMD • 10/3/2012 17

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade & Automotive Grade)

KEMET Corporation

World Headquarters

Europe

Asia

Southern Europe

Geneva, Switzerland

Tel: 41-22-715-0100

Northeast Asia

Hong Kong

Tel: 852-2305-1168

2835 KEMET Way

Simpsonville, SC 29681

Paris, France

Tel: 33-1-4646-1009

Shenzhen, China

Tel: 86-755-2518-1306

Mailing Address:

P.O. Box 5928

Greenville, SC 29606

Sasso Marconi, Italy

Tel: 39-051-939111

Beijing, China

Tel: 86-10-5829-1711

www.kemet.com

Tel: 864-963-6300

Fax: 864-963-6521

Milan, Italy

Tel: 39-02-57518176

Shanghai, China

Tel: 86-21-6447-0707

Corporate Ofﬁces

Fort Lauderdale, FL

Tel: 954-766-2800

Rome, Italy

Tel: 39-06-23231718

Taipei, Taiwan

Tel: 886-2-27528585

Madrid, Spain

Tel: 34-91-804-4303

North America

Southeast Asia

Singapore

Tel: 65-6586-1900

Southeast

Lake Mary, FL

Tel: 407-855-8886

Central Europe

Landsberg, Germany

Tel: 49-8191-3350800

Penang, Malaysia

Tel: 60-4-6430200

Northeast

Wilmington, MA

Tel: 978-658-1663

Bangalore, India

Tel: 91-806-53-76817

Dortmund, Germany

Tel: 49-2307-3619672

West Chester, PA

Tel: 610-692-4642

Kwidzyn, Poland

Tel: 48-55-279-7025

Central

Novi, MI

Tel: 248-994-1030

Northern Europe

Bishop’s Stortford, United Kingdom

Tel: 44-1279-757201

Carmel, IN

Tel: 317-706-6742

Weymouth, United Kingdom

Tel: 44-1305-830747

West

Milpitas, CA

Tel: 408-433-9950

Coatbridge, Scotland

Tel: 44-1236-434455

Mexico

Zapopan, Jalisco

Tel: 52-33-3123-2141

Färjestaden, Sweden

Tel: 46-485-563934

Espoo, Finland

Tel: 358-9-5406-5000

Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not

assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of

KEMET Electronics Corporation.

C1013_X7R_FT-CAP_SMD • 10/3/2012 18

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade & Automotive Grade)

Other KEMET Resources

Tools

Resource

Location

Conﬁgure A Part: CapEdge

SPICE & FIT Software

http://capacitoredge.kemet.com

http://www.kemet.com/spice

http://www.kemet.com/keask

Search Our FAQs: KnowledgeEdge

Product Information

Resource

Location

Products

Technical Resources (Including Soldering Techniques)

RoHS Statement

http://www.kemet.com/products

http://www.kemet.com/technicalpapers

http://www.kemet.com/rohs

Quality Documents

http://www.kemet.com/qualitydocuments

Product Request

Resource

Location

http://www.kemet.com/sample

http://www.kemet.com/kits

Sample Request

Engineering Kit Request

Contact

Resource

Location

Website

Contact Us

Investor Relations

Call Us

www.kemet.com

http://www.kemet.com/contact

http://www.kemet.com/ir

1-877-MyKEMET

Twitter

http://twitter.com/kemetcapacitors

Disclaimer

All product speciﬁcations, statements, information and data (collectively, the “Information”) are subject to change without notice.

All Information given herein is believed to be accurate and reliable, but is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.

Statements of suitability for certain applications are based on our knowledge of typical operating conditions for such applications, but are not intended to constitute – and we

speciﬁcally disclaim – any warranty concerning suitability for a speciﬁc customer application or use. This Information is intended for use only by customers who have the requisite

experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by us with reference to the

use of our products is given gratis, and we assume no obligation or liability for the advice given or results obtained.

Although we design and manufacture our products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur.

Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or

redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.

Although all product-related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other measures may not

be required.

C1013_X7R_FT-CAP_SMD • 10/3/2012 19

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade & Automotive Grade)

Digitally signed by Jeannette Calvo

DN: c=US, st=FL, l=Fort Lauderdale, o=KEMET Corp., ou=Marketing

Communications, cn=Jeannette Calvo,

email=jeannettecalvo@kemet.com

Date: 2012.10.09 16:49:10 -04'00'

C1013_X7R_FT-CAP_SMD • 10/3/2012 20


型号：	C0805X561M3RACTU
厂家：	KEMET CORPORATION
描述：	Ceramic Capacitor, Multilayer, Ceramic, 25V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.00056uF, Surface Mount, 0805, CHIP 电容器
文件：	总20页 (文件大小：1391K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

C0805X561M3RACTU [KEMET]

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