C0805Y104MARALTU [KEMET]
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, 6.3 - 250 VDC (Commercial & Automotive Grade);型号: | C0805Y104MARALTU |
厂家: | KEMET CORPORATION |
描述: | Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, 6.3 - 250 VDC (Commercial & Automotive Grade) |
文件: | 总21页 (文件大小:1647K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination
System (FF-CAP), X7R Dielectric, 6.3 – 250 VDC
(Commercial & Automotive Grade)
Overview
KEMET’s Floating Electrode with Flexible Termination
capacitor (FF-CAP) combines two existing KEMET
technologies– Floating Electrode and Flexible Termination.
The floating electrode component utilizes a cascading
internal electrode design configured to form multiple
capacitors in series within a single monolithic structure.
This unique configuration results in enhanced voltage and
ESD performance over standard capacitor designs while
allowing for a fail-open condition if mechanically damaged
(cracked). The flexible termination component utilizes a
conductive silver epoxy between the base metal and nickel
barrier layers of KEMET’s standard termination system
in order to establish pliability while maintaining terminal
strength, solderability and electrical performance. Both
technologies address the primary failure mode of MLCCs–
flex cracks, which are typically the result of excessive
tensile and shear stresses produced during board flexure
and thermal cycling.
The FF-CAP complements KEMET’s Open Mode, Floating
Electrode (FE-CAP), Flexible Termination (FT-CAP) and KEMET
Power Solutions (KPS) product lines by providing an ultimate
fail-safe design optimized for low to mid range capacitance
values. These devices exhibit a predictable change in
capacitance with respect to time and voltage and boast a
minimal change in capacitance with reference to ambient
temperature. Capacitance change is limited to ±15% from
−55°C to +125°C.
In addition to Commercial Grade, Automotive Grade devices
are available which meet the demanding Automotive
Electronics Council's AEC–Q200 qualification requirements.
Although neither technology can eliminate the potential for
mechanical damage that may propagate during extreme
environmental and/or handling conditions, the combination
of these two technologies provide the ultimate level of
protection against a low IR or short circuit condition.
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Ordering Information
C
0805
Y
104
K
5
R
A
C
TU
Case Size Specification/ Capacitance
Capacitance Rated Voltage
Failure Rate/
Design
Packaging/
Grade (C-Spec)
Ceramic
Dielectric
R = X7R
Termination Finish1
(L" x W")
Series
Code (pF)
Tolerance
(VDC)
0603
0805
1206
1210
1812
Y = Floating Two significant
J = ±5%
K = ±10%
M = ±20%
9 = 6.3
8 = 10
4 = 16
A = N/A
C = 100% Matte Sn
L = SnPb (5% Pb
minimum)
See
"Packaging
C-Spec
Ordering
Options
Table" below
Electrode
with
digits + number
of zeros
Flexible
Termination
3 = 25
5 = 50
1 = 100
2 = 200
A = 250
1 Additional termination finish options may be available. Contact KEMET for details.
1 SnPb termination finish option is not available on automotive grade product.
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 10/14/2016
1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Packaging C-Spec Ordering Options Table
Packaging/Grade
Packaging Type
Ordering Code (C-Spec)
Commercial Grade1
Bulk Bag
Not Required (Blank)
TU
7" Reel/Unmarked
7411 (EIA 0603 and smaller case sizes)
7210 (EIA 0805 and larger case sizes)
13" Reel/Unmarked
7" Reel/Marked
TM
7040 (EIA 0603 and smaller case sizes)
7215 (EIA 0805 and larger case sizes)
13" Reel/Marked
7" Reel/Unmarked/2 mm pitch2
13" Reel/Unmarked/2 mm pitch2
7081
7082
Automotive Grade3
7" Reel
AUTO
AUTO7411 (EIA 0603 and smaller case sizes)
AUTO7210 (EIA 0805 and larger case sizes)
13" Reel/Unmarked
7" Reel/Unmarked/2 mm pitch2
13" Reel/Unmarked/2 mm pitch2
3190
3191
1 Default packaging is "Bulk Bag". An ordering code C-Spec is not required for "Bulk Bag" packaging.
1 The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors
that have not been laser marked.
2 The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".
3 Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L" x W") and thickness dimension. See "Chip Thickness/Tape & Reel
Packaging Quantities" and "Tape & Reel Packaging Information".
3 For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information".
3 All Automotive packaging C-Specs listed exclude the option to laser mark components. Please contact KEMET if you require a laser marked option. For
more information see "Capacitor Marking".
Benefits
• −55°C to +125°C operating temperature range
• Superior flex performance (up to 5 mm)
• Floating Electrode/fail open design
• Low to mid capacitance flex mitigation
• Lead (Pb)-free, RoHS and REACH compliant
• EIA 0603, 0805, 1206, 1210, and 1812 case sizes
• DC voltage ratings of 6.3 V, 10 V, 16 V, 25 V, 50 V, 100 V,
200 V, and 250 V
• Capacitance offerings ranging from 180 pF to 0.22 μF
• Available capacitance tolerances of ±5%, ±10%, and ±20%
• Commercial & Automotive (AEC–Q200) grades available
• Non-polar device, minimizing installation concerns
• 100% pure matte tin-plated termination finish allowing for
excellent solderability
• SnPb termination finish option available upon request
(5% Pb minimum)
Applications
Typical applications include circuits with a direct battery or power source connection, critical and safety relevant circuits
without (integrated) current limitation and any application that is subject to high levels of board flexure or temperature
cycling. Examples include raw power input side filtering (power plane/bus), high current applications (automobile battery
line) and circuits that cannot be fused to open. Markets include consumer, medical, industrial (power supply), automotive,
aerospace and telecom.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 10/14/2016
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Automotive C-Spec Information
KEMET Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council.
Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive
Components. These products are supported by a Product Change Notification (PCN) and Production Part Approval Process
warrant (PPAP).
Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec,
“AUTO”. This C-Spec was developed in order to better serve small and medium sized companies that prefer an automotive
grade component without the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review
by a KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET’s OEM Automotive customers
and are not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are
limited (see details below).
Product Change Notification (PCN)
The KEMET Product Change Notification system is used to communicate primarily the following types of changes:
• Product/process changes that affect product form, fit, function, and/or reliability
• Changes in manufacturing site
• Product obsolescence
Customer Notification due to:
KEMET Automotive
C-Spec
Days prior to
implementation
Process/Product change
Obsolescence*
KEMET assigned1
AUTO
Yes (with approval and sign off)
Yes (without approval)
Yes
Yes
180 days Minimum
90 days Minimum
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)
The purpose of the Production Part Approval Process is:
• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
• To provide the evidence that all customer engineering design record and specification requirements are properly
understood and
fulfilled by the manufacturing organization.
• To demonstrate that the established manufacturing process has the potential to produce the part
PPAP (Product Part Approval Process) Level
KEMET Automotive
C-Spec
1
●
○
2
3
●
○
4
5
KEMET assigned1
AUTO
●
●
●
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
● Part Number specific PPAP available
○ Product family PPAP only
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 10/14/2016
3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Dimensions – Millimeters (Inches)
L
ꢁ
T
ꢀ
S
S
EIA Size
Code
Metric Size
Code
L
W
Width
T
B
Mounting
Technique
Separation
Minimum
Length
Thickness
Bandwidth
1.60 (0.063)
±0.17 (0.007)
2.00 (0.079)
±0.30 (0.012)
3.30 (0.130)
±0.40 (0.016)
3.30 (0.130)
±0.40 (0.016)
4.50 (0.178)
±0.40 (0.016)
0.80 (0.032)
±0.15 (0.006)
1.25 (0.049)
±0.30 (0.012)
1.60 (0.063)
±0.35 (0.013)
2.60 (0.102)
±0.30 (0.012)
3.20 (0.126)
±0.30 (0.012)
0.45 (0.018)
±0.15 (0.006)
0.50 (0.02)
±0.25 (0.010)
0.60 (0.024)
±0.25 (0.010)
0.60 (0.024)
±0.25 (0.010)
0.70 (0.028)
±0.35 (0.014)
0603
0805
1206
1210
1812
1608
2012
3216
3225
4532
0.58 (0.023)
Solder Wave or
Solder Reflow
0.75 (0.030)
See Table 2 for
Thickness
N/A
Solder Reflow
Only
Qualification/Certification
Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are
referenced in Table 4, Performance & Reliability.
Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details
regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive
Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their
website at www.aecouncil.com.
Environmental Compliance
Lead (Pb)-free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 10/14/2016
4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Electrical Parameters/Characteristics
Item
Parameters/Characteristics
Operating Temperature Range
−55°C to +125°C
±15%
Capacitance Change with Reference to
+25°C and 0 Vdc Applied (TCC)
1Aging Rate (Maximum % Capacitance Loss/Decade Hour)
2Dielectric Withstanding Voltage (DWV)
3.0%
250% of rated voltage
(5±1 seconds and charge/discharge not exceeding 50mA)
3Dissipation Factor (DF) Maximum Limit at 25°C
5%(6.3V & 10V), 3.5%(16V & 25V) and 2.5%(50V to 250V)
See Insulation Resistance Limit Table
(Rated voltage applied for 120±5 seconds at 25°C)
4Insulation Resistance (IR) Minimum Limit at 25°C
1 Regarding Aging Rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.
2 DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the
capacitor.
3 Capacitance and dissipation factor (DF) measured under the following conditions:
1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance ≤10µF
120Hz ± 10Hz and 0.5 ± 0.1 Vrms if capacitance >10µF
4 To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as
Automatic Level Control (ALC). The ALC feature should be switched to "ON".
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Rated DC
Voltage
> 25
16/25
< 16
Capacitance Dissipation Factor Capacitance
Insulation
Dielectric
X7R
Value
(Maximum %)
Shift
Resistance
3.0
5.0
7.5
10% of Initial
Limit
All
±20%
Insulation Resistance Limit Table (X7R Dielectric)
1,000 Megohm
EIA Case Size
500 Megohm
Microfarads or 10 GΩ
Microfarads or 100 GΩ
0201
0402
0603
0805
1206
1210
1808
1812
1825
2220
2225
N/A
< 0.012 µF
< 0.047 µF
< 0.15 µF
< 0.47 µF
< 0.39 µF
ALL
ALL
≥ 0.012 µF
≥ 0.047 µF
≥ 0.15 µF
≥ 0.47 µF
≥ 0.39 µF
N/A
< 2.2 µF
ALL
≥ 2.2 µF
N/A
< 10 µF
ALL
≥ 10 µF
N/A
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 10/14/2016
5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Table 1A – Capacitance Range/Selection Waterfall (0603 – 0805 Case Sizes)
Case Size/
C0603Y
Series
C0805Y
Voltage Code
9
8
4
3
5
1
2
9
8
4
3
5
1
2
A
Capacitance
Code
Capacitance
Rated Voltage
(VDC)
Capacitance
Tolerance
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
180 pF
220 pF
270 pF
330 pF
390 pF
470 pF
560 pF
680 pF
820 pF
181
221
271
331
391
471
561
681
821
102
122
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
CJ
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DD
DD
DG
DG
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DD
DD
DG
DG
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DD
DD
DG
DG
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DD
DD
DG
DG
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DD
DD
DG
DG
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DD
DD
DD
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
DR
1,000 pF
1,200 pF
1,500 pF
1,800 pF
2,200 pF
2,700 pF
3,300 pF
3,900 pF
4,700 pF
5,600 pF
6,800 pF
8,200 pF
10,000 pF
12,000 pF
15,000 pF
18,000 pF
22,000 pF
27,000 pF
33,000 pF
39,000 pF
47,000 pF
56,000 pF
68,000 pF
82,000 pF
0.10 µF
Rated Voltage
(VDC)
Voltage Code
9
8
4
3
5
1
2
9
8
4
3
5
1
2
A
Capacitance
Capacitance Code
Case Size/Series
C0603Y
C0805Y
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 10/14/2016
6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Table 1B – Capacitance Range/Selection Waterfall (1206 – 1812 Case Sizes)
Case Size/
Series
Voltage Code
C1206Y
C1210Y
C1812Y
Cap
Code
9
8
4
3
5
1
2
A
9
8
4
3
5
1
2
A
3
5
1
2
A
Capacitance
Rated Voltage
(VDC)
Capacitance
Tolerance
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
1,000 pF
1,200 pF
1,500 pF
1,800 pF
2,200 pF
2,700 pF
3,300 pF
3,900 pF
4,700 pF
5,600 pF
6,800 pF
8,200 pF
10,000 pF
12,000 pF
15,000 pF
18,000 pF
22,000 pF
27,000 pF
33,000 pF
39,000 pF
47,000 pF
56,000 pF
68,000 pF
82,000 pF
0.10 µF
102
122
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
ER
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
ER
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
ER
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
ER
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
ER
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
ER
ER
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
EQ
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FQ
FQ
FQ
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FQ
FQ
FQ
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FQ
FQ
FQ
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FQ
FX
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FN
FQ
FQ
FN
FN
FN
FN
FN
FN
FN GB GB GB GB GB
FN GB GB GB GB GB
FN GB GB GB GB GB
FN GB GB GB GB GB
FN GB GB GB GB GB
FN GB GB GB GB GB
FN GB GB GB GB GB
FN GB GB GB GB GB
FN GB GB GB GB GB
FN GB GB GB GB GB
FN FN
FN
FN
FN
FN
FN
FN
FN
FQ
FQ
FQ
FN
FN
FN
FN
FN
FN
FN
FQ
FQ
FQ
FQ
FQ
GB GB GB GB GB
GB GB GB GB GB
GB GB GB GB GB
GB GB GB GB GB
GB GB GB GB GB
GB GB GB GB GB
GB GB GB GB GB
GB GB GB GB GB
GB GB GB GB GB
0.12 µF
0.15 µF
0.18 µF
0.22 µF
Rated Voltage
(VDC)
Voltage Code
9
8
4
3
5
1
2
A
9
8
4
3
5
1
2
A
3
5
1
2
A
Capacitance Cap Code
Case Size/
Series
C1206Y
C1210Y
C1812Y
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 10/14/2016
7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Table 2A – Chip Thickness/Tape & Reel Packaging Quantities
Paper Quantity1
7" Reel 13" Reel
Plastic Quantity
7" Reel 13" Reel
Thickness Case Thickness ±
Code
Size1 Range (mm)
CJ
DR
DD
DG
EQ
ER
FN
FQ
FX
GB
0603
0805
0805
0805
1206
1206
1210
1210
1210
1812
0.80 ± 0.15
0.78 ± 0.20
0.90 ± 0.10
1.25 ± 0.15
0.78 ± 0.20
0.90 ± 0.20
0.78 ± 0.20
0.90 ± 0.20
0.95 ± 0.20
1.00 ± 0.10
4,000
0
0
0
15,000
0
0
0
0
0
4,000
4,000
2,500
4,000
4,000
4,000
4,000
4,000
1,000
10,000
10,000
10,000
10,000
10,000
10,000
10,000
10,000
4,000
4,000
10,000
0
0
0
0
0
0
0
0
0
0
7" Reel
13" Reel
7" Reel
13" Reel
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
Paper Quantity1
Plastic Quantity
Package quantity based on finished chip thickness specifications.
1 If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA
0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".
Table 2B – Bulk Packaging Quantities
Loose Packaging
Packaging Type
Bulk Bag (default)
Packaging C-Spec1
N/A2
Case Size
Packaging Quantities (pieces/unit packaging)
EIA (in)
Metric (mm)
Minimum
Maximum
0402
0603
0805
1206
1210
1808
1812
1825
2220
2225
1005
1608
2012
3216
3225
4520
4532
4564
5650
5664
50,000
1
20,000
1 The "Packaging C-Spec" is a 4 to 8 digit code which identifies the packaging type and/or product grade. When ordering, the proper code must be
included in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details.
Commercial Grade product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk
bag packaging option for Automotive Grade products.
2 A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and Automotive Grade products). The
15th through 22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our
standard "Bulk Bag" packaging.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 10/14/2016
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
EIA
Size
Code
Metric
Size
Code
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
0603
0805
1206
1210
1812
1608
2012
3216
3225
4532
0.85
1.25
1.10
4.00
2.10
0.75
1.05
1.00
3.10
1.50
0.65
0.85
0.90
2.40
1.20
0.99
1.59
1.59
2.10
1.44
1.62
1.62
1.80
1.66
2.06
3.01
3.60
4.47
5.85
5.90
7.00
2.71
3.06
4.01
4.60
0.89
1.49
1.49
2.00
1.24
1.42
1.42
1.60
1.56
1.96
2.91
3.50
3.57
4.95
4.95
6.10
2.11
2.46
3.41
4.00
0.79
1.39
1.39
1.90
1.04
1.22
1.22
1.40
1.46
1.86
2.81
3.40
2.42
4.25
4.25
5.40
1.81
2.16
3.11
3.70
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
ꢁꢂ
ꢀ
ꢀ
ꢁꢃ
X
X
C
C
Grid Placement Courtyard
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 10/14/2016
9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Reflow Soldering Profile:
KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),
convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal
stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/
J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes
at these conditions.
Termination Finish
TP
TL
tP
Profile Feature
Maximum Ramp ꢂp Rate ꢃ ꢄꢅCꢆsec
Maximum Ramp Down Rate ꢃ ꢇꢅCꢆsec
SnPb
100% Matte Sn
tL
Preheat/Soak
Temperature Minimum (TSmin
)
100°C
150°C
150°C
200°C
Tsmax
Tsmin
Temperature Maximum (TSmax
Time (tS) from TSmin to TSmax
)
60 – 120 seconds
3°C/second
60 – 120 seconds
3°C/second
ts
Ramp-Up Rate (TL to TP)
maximum
maximum
ꢀꢁ
Liquidous Temperature (TL)
Time Above Liquidous (tL)
Peak Temperature (TP)
183°C
60 – 150 seconds
235°C
217°C
60 – 150 seconds
260°C
ꢀꢁꢅC to Peaꢈ
Time
Time Within 5°C of Maximum
20 seconds
maximum
30 seconds
maximum
Peak Temperature (tP)
6°C/second
maximum
6°C/second
maximum
Ramp-Down Rate (TP to TL)
Time 25°C to Peak
6 minutes
maximum
8 minutes
maximum
Temperature
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 10/14/2016 10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress
Reference
Test or Inspection Method
Terminal Strength
JIS–C–6429
Appendix 1, Note: Force of 1.8 kg for 60 seconds.
Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm
for C0G. Flexible termination system – 3.0 mm (minimum).
Board Flex
JIS–C–6429
Magnification 50 X. Conditions:
a) Method B, 4 hours at 155°C, dry heat at 235°C
b) Method B at 215°C category 3
Solderability
J–STD–002
c) Method D, category 3 at 260°C
1,000 Cycles (−55°C to +125°C). Measurement at 24 hours +/− 4 hours after test
Temperature Cycling
Biased Humidity
JESD22 Method JA–104
conclusion.
Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor.
Measurement at 24 hours +/− 4 hours after test conclusion.
Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.
Measurement at 24 hours +/− 4 hours after test conclusion.
MIL–STD–202 Method
103
MIL–STD–202 Method
t = 24 hours/cycle. Steps 7a and 7b not required.
Moisture Resistance
Thermal Shock
Measurement at 24 hours +/− 4 hours after test conclusion.
106
MIL–STD–202 Method
−55°C/+125°C. Note: Number of cycles required – 300, maximum transfer time – 20
seconds, dwell time – 15 minutes. Air – Air.
107
MIL–STD–202 Method
108
High Temperature Life
1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied.
/EIA–198
MIL–STD–202 Method
108
Storage Life
Vibration
150°C, 0 VDC for 1,000 hours.
5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7
secure points on one long side and 2 secure points at corners of opposite sides. Parts
mounted within 2" from any secure point. Test from 10 – 2,000 Hz
MIL–STD–202 Method
204
MIL–STD–202 Method
Mechanical Shock
Figure 1 of Method 213, Condition F.
213
MIL–STD–202 Method
215
Resistance to Solvents
Add aqueous wash chemical, OKEM Clean or equivalent.
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum
storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on
the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock
should be used promptly, preferably within 1.5 years of receipt.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 10/14/2016 11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Construction
Detailed Cross Section
Dielectric Material
(BaTiO3)
Barrier Layer
(Ni)
End Termination/
External Electrode
(Cu)
Termination Finish
(100% Matte Sn /
Epoxy Layer
(Ag)
SnPb - 5% Pb min)
Dielectric Material
(BaTiO3)
Inner Electrodes
(Ni)
End Termination/
External Electrode
(Cu)
Epoxy Layer
(Ag)
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn /
SnPb - 5% Pb min)
Inner Electrodes
(Ni)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 10/14/2016 12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Capacitor Marking (Optional):
These surface mount multilayer ceramic capacitors are
normally supplied unmarked. If required, they can be
marked as an extra cost option. Marking is available
on most KEMET devices but must be requested using
the correct ordering code identifier(s). If this option is
requested, two sides of the ceramic body will be laser
marked with a “K” to identify KEMET, followed by two
characters (per EIA–198 - see table below) to identify the
capacitance value. EIA 0603 case size devices are limited
to the “K” character only.
• X7R dielectric products in capacitance values outlined
below
Marking appears in legible contrast. Illustrated below is an
example of an MLCC with laser marking of “KA8”, which
designates a KEMET device with rated capacitance of 100 µF.
Orientation of marking is vendor optional.
ꢂ-Digit
ꢀEMET
Capacitance
ꢁD
Laser marking option is not available on:
• C0G, Ultra Stable X8R and Y5V dielectric devices
• EIA 0402 case size devices
Code
• EIA 0603 case size devices with Flexible Termination
option.
• KPS Commercial and Automotive Grade stacked devices.
EIA Case Size
Metric Size Code
Capacitance
0603
0805
1206
1210
1808
1812
1825
2220
2225
1608
2012
3216
3225
4520
4532
4564
5650
5664
≤ 170 pF
≤ 150 pF
≤ 910 pF
≤ 2,000 pF
≤ 3,900 pF
≤ 6,700 pF
≤ 0.018 µF
≤ 0.027 µF
≤ 0.033 µF
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 10/14/2016 13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Capacitor Marking (Optional) cont’d
Capacitance (pF) For Various Alpha/Numeral Identifiers
Numeral
Alpha
Character
9
0
1
2
3
4
5
6
7
8
Capacitance (pF)
A
B
C
D
E
F
0.1
0.11
0.12
0.13
0.15
0.16
0.18
0.2
1 0
1.1
1 2
1 3
1 5
1 6
1 8
2 0
2 2
2.4
2.7
3 0
3 3
3 6
3 9
4 3
4.7
5.1
5 6
6 2
6 8
7 5
8 2
9.1
2 5
3 5
4 0
4 5
5 0
6 0
7 0
8 0
9 0
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
51
56
62
68
75
82
91
25
35
40
45
50
60
70
80
90
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
250
350
400
450
500
600
700
800
900
1,000
1,100
1,200
1,300
1,500
1,600
1,800
2,000
2,200
2,400
2,700
3,000
3,300
3,600
3,900
4,300
4,700
5,100
5,600
6,200
6,800
7,500
8,200
9,100
2,500
3,500
4,000
4,500
5,000
6,000
7,000
8,000
9,000
10,000 100,000 1,000,000 10,000,000
11,000 110,000 1,100,000 11,000,000
100,000,000
110,000,000
120,000,000
130,000,000
150,000,000
160,000,000
180,000,000
200,000,000
220,000,000
240,000,000
270,000,000
300,000,000
330,000,000
360,000,000
390,000,000
430,000,000
470,000,000
510,000,000
560,000,000
620,000,000
680,000,000
750,000,000
820,000,000
910,000,000
250,000,000
350,000,000
400,000,000
450,000,000
500,000,000
600,000,000
700,000,000
800,000,000
900,000,000
12,000 120,000 1,200,000 12,000,000
13,000 130,000 1,300,000 13,000,000
15,000 150,000 1,500,000 15,000,000
16,000 160,000 1,600,000 16,000,000
18,000 180,000 1,800,000 18,000,000
20,000 200,000 2,000,000 20,000,000
22,000 220,000 2,200,000 22,000,000
24,000 240,000 2,400,000 24,000,000
27,000 270,000 2,700,000 27,000,000
30,000 300,000 3,000,000 30,000,000
33,000 330,000 3,300,000 33,000,000
36,000 360,000 3,600,000 36,000,000
39,000 390,000 3,900,000 39,000,000
43,000 430,000 4,300,000 43,000,000
47,000 470,000 4,700,000 47,000,000
51,000 510,000 5,100,000 51,000,000
56,000 560,000 5,600,000 56,000,000
62,000 620,000 6,200,000 62,000,000
68,000 680,000 6,800,000 68,000,000
75,000 750,000 7,500,000 75,000,000
82,000 820,000 8,200,000 82,000,000
91,000 910,000 9,100,000 91,000,000
25,000 250,000 2,500,000 25,000,000
35,000 350,000 3,500,000 35,000,000
40,000 400,000 4,000,000 40,000,000
45,000 450,000 4,500,000 45,000,000
50,000 500,000 5,000,000 50,000,000
60,000 600,000 6,000,000 60,000,000
70,000 700,000 7,000,000 70,000,000
80,000 800,000 8,000,000 80,000,000
90,000 900,000 9,000,000 90,000,000
G
H
J
0.22
0.24
0.27
0.3
K
L
M
N
P
Q
R
S
T
U
V
W
X
Y
Z
a
0.33
0.36
0.39
0.43
0.47
0.51
0.56
0.62
0.68
0.75
0.82
0.91
0.25
0.35
0.4
b
d
e
0.45
0.5
f
m
n
0.6
0.7
t
0.8
y
0.9
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 10/14/2016 14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with
EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for
details on reeling quantities for commercial chips.
ꢐar Code Label
Anti-Static Reel
®
Embossed Plasticꢈ or
Punched Paper Carrierꢄ
Chip and ꢋPS ꢌrientation in Pocꢊet
(except ꢁꢀꢂꢍ Commercial, and ꢁꢀꢂꢍ and ꢂꢂꢂꢍ Military)
KEMET
Sprocꢊet ꢑoles
Embossment or Punched Cavity
ꢀ mm, ꢁꢂ mm
or ꢁꢃ mm Carrier Tape
Anti-Static Cover Tape
(ꢄꢁꢅ mm (ꢄꢅꢅꢉꢆ) Maximum Thicꢊness)
ꢁ7ꢀ mm (7ꢄꢅꢅꢆ)
or
ꢇꢇꢅ mm (ꢁꢇꢄꢅꢅꢆ)
ꢈEꢎA ꢅꢁꢅꢅꢍ, ꢅꢂꢅꢁ, ꢅꢉꢅꢂ and ꢅꢃꢅꢇ case siꢏes available on punched paper carrier onlyꢄ
Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm)
New 2 mm Pitch Reel Options*
Embossed Plastic Punched Paper
Tape
Packaging
Ordering Code
(C-Spec)
C-3190
7" Reel 13" Reel 7" Reel 13" Reel
EIA Case Size Size
(W)*
Packaging Type/Options
Pitch (P1)* Pitch (P1)*
01005 – 0402
0603
8
8
2
2
2/4
4
Automotive grade 7" reel unmarked
Automotive grade 13" reel unmarked
Commercial grade 7" reel unmarked
Commercial grade 13" reel unmarked
C-3191
2/4
4
C-7081
0805
8
4
4
4
C-7082
1206 – 1210
1805 – 1808
≥ 1812
8
4
4
4
4
* 2 mm pitch reel only available for 0603 EIA case size.
2 mm pitch reel for 0805 EIA case size under development.
12
12
12
16
8
4
8
8
Benefits of Changing from 4 mm to 2 mm Pitching Spacing
• Lower placement costs
• Double the parts on each reel results in fewer reel
changes and increased efficiency
• Fewer reels result in lower packaging, shipping and
storage costs, reducing waste
KPS 1210
8
8
KPS 1812 & 2220
Array 0508 & 0612
12
4
12
4
*Refer to Figures 1 & 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 & 7 for tolerance specifications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 10/14/2016 15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
T
T
P ꢄ
ꢉꢃꢊ pitches cumulative
tolerance on tape ꢋ ꢊꢌꢄ mmꢍ
ꢄ
E
ꢃ
Po
ꢅDo
Ao
F
ꢂo
ꢀ
E
ꢄ
ꢁ
ꢃ
ꢁo
S
ꢃ
P
ꢃ
T
ꢃ
Embossment
For cavity siꢆe,
see ꢇote ꢃ Table ꢈ
Center Lines of Cavity
ꢅD
ꢃ
Cover Tape
is for tape feeder reference only,
including draft concentric about ꢁ
ꢁ
ꢃ
o
.
User Direction of Unreeling
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
D1 Minimum
Note 1
1.0
(0.039)
R Reference S1 Minimum
T
T1
Tape Size
8 mm
D0
E1
P0
P2
Note 2
Note 3
Maximum Maximum
25.0
(0.984)
1.5 +0.10/-0.0
(0.059 +0.004/-
0.0)
1.75 ±0.10
4.0 ±0.10
2.0 ±0.05
0.600
0.600
(0.024)
0.100
(0.004)
12 mm
16 mm
(0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002)
(0.024)
1.5
(0.059)
30
(1.181)
Variable Dimensions — Millimeters (Inches)
B1 Maximum
Note 4
E2
T2
W
Tape Size
8 mm
Pitch
F
P1
A0,B0 & K0
Minimum
6.25
(0.246)
Maximum Maximum
2.5
(0.098)
4.35
(0.171)
3.5 ±0.05
(0.138 ±0.002) (0.157 ±0.004)
4.0 ±0.10
8.3
(0.327)
Single (4 mm)
Single (4 mm) &
Double (8 mm)
8.2
10.25
5.5 ±0.05
8.0 ±0.10
4.6
12.3
12 mm
16 mm
Note 5
(0.323)
(0.404)
(0.217 ±0.002) (0.315 ±0.004)
(0.181)
(0.484)
12.1
(0.476)
14.25
(0.561)
7.5 ±0.05 12.0 ±0.10
(0.138 ±0.002) (0.157 ±0.004)
4.6
(0.181)
16.3
(0.642)
Triple (12 mm)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment
location and hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see
Figure 4).
(e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 10/14/2016 16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
T
ꢈꢀꢄ pitches cumulative
Eꢀ
Po
ꢁDo
tolerance on tape ꢉ ꢄꢊꢂ mmꢋ
Aꢄ
F
ꢃ
Eꢂ
ꢅꢄ
ꢅottom Cover Tape
Pꢀ
G
Cavity Siꢆe,
See
Tꢀ
Tꢀ
Center Lines of Cavity
Top Cover Tape
ꢇote ꢀ, Table 7
ꢅottom Cover Tape
User Direction of Unreeling
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
R Reference
Note 2
Tape Size
D0
E1
P0
P2
T1 Maximum
G Minimum
0.10
1.5 +0.10 -0.0
(0.059 +0.004 -0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
0.75
(0.030)
25
(0.984)
8 mm
(0.004)
Maximum
Variable Dimensions — Millimeters (Inches)
Tape Size
8 mm
Pitch
E2 Minimum
F
P1
T Maximum
W Maximum
A0 B0
2.0 ±0.05
(0.079 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
8.3
(0.327)
8.3
(0.327)
Half (2 mm)
Single (4 mm)
6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
1.1
(0.098)
Note 1
8 mm
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
c) rotation of the component is limited to 20° maximum (see Figure 3).
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).
e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 10/14/2016 17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
8 mm
Peel Strength
0.1 to 1.0 Newton (10 to 100 gf)
0.1 to 1.3 Newton (10 to 130 gf)
12 and 16 mm
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be
165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of
300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
°
T
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Typical Pocꢈet Centerline
Tape
Maximum
°
°
T
s
Width (mm) Rotation (
)
ꢁ,ꢂꢃ
ꢂꢅ ꢆ ꢃꢄꢄ
ꢃꢄ
ꢂꢄ
ꢀo
Tape
Maximum
°
S
Width (mm) Rotation (
)
ꢁ,ꢂꢃ
ꢂꢅ ꢆ ꢇꢅ
7ꢃ ꢆ ꢃꢄꢄ
ꢃꢄ
ꢂꢄ
ꢇ
Typical Component Centerline
Ao
Figure 4 – Maximum Lateral Movement
Figure 5 – Bending Radius
Embossed
Carrier
Punched
Carrier
ꢃ mm & ꢄꢅ mm Tape
ꢄꢆ mm Tape
ꢀꢁꢂ mm maximum
ꢀꢁꢂ mm maximum
ꢄꢁꢀ mm maximum
ꢄꢁꢀ mm maximum
R
ꢀending
Radius
R
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 10/14/2016 18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Figure 6 – Reel Dimensions
Full Radius,
See ꢀote
ꢌꢍ (ꢆncludes
Access ꢂole at
Slot Location
(ꢃ ꢄꢅ mm minimum)
flange distortion
at outer edge)
ꢌꢈ (Measured at hub)
D
(See ꢀote)
A
ꢀ
C
(Arbor hole
ꢌꢋ (Measured at hub)
diameter)
ꢆf present,
tape slot in core
for tape startꢇ
ꢈꢉꢊ mm minimum width x
ꢋꢅꢉꢅ mm minimum depth
ꢁ
(see ꢀote)
ꢀoteꢇ Drive spoꢎes optionalꢏ if used, dimensions ꢁ and D shall applyꢉ
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
8 mm
A
B Minimum
C
D Minimum
178 ±0.20
(7.008 ±0.008)
or
1.5
(0.059)
13.0 +0.5/-0.2
(0.521 +0.02/-0.008)
20.2
(0.795)
12 mm
16 mm
330 ±0.20
(13.000 ±0.008)
Variable Dimensions — Millimeters (Inches)
Tape Size
N Minimum
W1
W2 Maximum
W3
8.4 +1.5/-0.0
(0.331 +0.059/-0.0)
14.4
(0.567)
8 mm
50
(1.969)
12.4 +2.0/-0.0
18.4
Shall accommodate tape
width without interference
12 mm
16 mm
(0.488 +0.078/-0.0)
(0.724)
16.4 +2.0/-0.0
(0.646 +0.078/-0.0)
22.4
(0.882)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 10/14/2016 19
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Embossed Carrier
Carrier Tape
Punched Carrier
ꢇ mm & ꢀꢆ mm only
Round Sprocꢃet ꢄoles
START
END
Top Cover Tape
Elongated Sprocꢃet ꢄoles
(ꢅꢆ mm tape and wider)
ꢀꢂꢂ mm
Minimum Leader
ꢈꢂꢂ mm Minimum
Trailer
Components
ꢀꢁꢂ mm Minimum
Top Cover Tape
Figure 8 – Maximum Camber
Elongated sprocꢀet holes
(ꢆꢃ mm & wider tapes)
Carrier Tape
Round Sprocꢀet ꢁoles
ꢂ mm Maximum, either direction
Straight Edge
ꢃꢄꢅ mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 10/14/2016 20
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Floating Electrode Design with Flexible Termination System (FF-CAP), X7R Dielectric, (Commercial & Automotive Grade)
KEMET Electronic Corporation Sales Offices
For a complete list of our global sales offices, please visit www.kemet.com/sales.
Disclaimer
All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for
checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.
All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such
applications, but are not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use.
The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any
technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no
obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component
failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards
(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or
property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other
measures may not be required.
KEMET is a registered trademark of KEMET Electronics Corporation.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1015_X7R_FF-CAP_SMD • 10/14/2016 21
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