C1206F274K5RACAUTO [KEMET]
Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.27uF, Surface Mount, 1206, CHIP, ROHS COMPLIANT;型号: | C1206F274K5RACAUTO |
厂家: | KEMET CORPORATION |
描述: | Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.27uF, Surface Mount, 1206, CHIP, ROHS COMPLIANT 电容器 |
文件: | 总19页 (文件大小:773K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC
(Commercial & Automotive Grade)
Overview
KEMET’s Ceramic Open Mode capacitor in X7R dielectric
is designed to significantly minimize the probability of a low
IR or short circuit condition when forced to failure in a board
stress flex situation, thus reducing the potential for catastrophic
failure. The Open Mode capacitor may experience a drop in
capacitance; however, a short is unlikely because a crack
will not typically propagate across counter electrodes within
the device’s “active area.” Since there will not be any current
leakage associated with a typical Open Mode flex crack,
there is no localized heating and therefore little chance for a
catastrophic and potentially costly failure event.
Concerned with flex cracks resulting from excessive tensile and
shear stresses produced during board flexure and thermal cycling?
These devices are available with KEMET's Flexible termination
technology which inhibits the transfer of board stress to the rigid
ceramic body, therefore mitigating flex cracks which can result
in low IR or short circuit failures. Although flexible termination
technology does not eliminate the potential for mechanical
damage that may propagate during extreme environmental and
handling conditions, it does provide superior flex performance
over standard termination systems. When combined with flexible
termination technology these devices offer the ultimate level of
protection against a low IR or short circuit condition. Open Mode
devices compliment KEMET's Floating Electrode (FE-CAP) and
Floating Electrode with Flexible Termination (FF-CAP) product
lines by providing a fail-safe design optimized for mid to high range
capacitance values. These devices exhibit a predictable change in
capacitance with respect to time and voltage and boast a minimal
change in capacitance with reference to ambient temperature.
Capacitance change is limited to ±15% from -55°C to +125°C.
Driven by the demand for a more robust and reliable
component, the Open Mode capacitor was designed for
critical applications where higher operating temperatures and
mechanical stress are a concern. These capacitors are widely
used in automotive circuits as well as power supplies (input and
output filters) and general electronic applications.
Ordering Information
C
1210
J
685
K
3
R
A
C
TU
Case Size Specification/
Capacitance
Code (pF)
Capacitance
Tolerance
Failure Rate/
Design
Packaging/Grade
(C-Spec)2
Ceramic
Voltage Dielectric
Termination Finish1
(L" x W")
Series
0805
1206
1210
1812
F = Open Mode 2 Significant Digits K = ±10% 4 = 16 V R = X7R A = N/A
J = Open Mode + Number of Zeros M = ±20% 3 = 25 V
C = 100% Matte Sn Blank = Bulk
L = SnPb (5%
minimum)
TU = 7" Reel
Unmarked
withFlexible
5 = 50 V
1 = 100 V
2 = 200 V
Termination
TM = 7" Reel Marked
AUTO = Automotive
Grade
1 Additional termination finish options may be available. Contact KEMET for details.
1, 2 SnPb termination finish option is not available on automotive grade product.
2 Additional reeling or packaging options may be available. Contact KEMET for details.
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 5/30/2013
1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Dimensions – Millimeters (Inches) – Standard Termination
100% Tin or SnPb Plate
L
W
B
T
Nickel Plate
S
Conductive Metalization
Electrodes
EIA
Size
Code
Metric
Size
Code
S
L
W
Width
T
B
Mounting
Technique
Separation
Minimum
Length
Thickness
Bandwidth
0805
1206
1210
1812
2012
3216
3225
4532
2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008)
3.20 (.126) ± 0.20 (.008) 1.60 (.063) ± 0.20 (.008)
3.20 (.126) ± 0.20 (.008) 2.50 (.098) ± 0.20 (.008)
4.50 (.177) ± 0.30 (.012) 3.20 (.126) ± 0.30 (.012)
0.50 (0.02) ± 0.25 (.010)
0.50 (0.02) ± 0.25 (.010)
0.50 (0.02) ± 0.25 (.010)
0.60 (.024) ± 0.35 (.014)
0.75 (.030)
Solder Wave or
Solder Reflow
See Table 2 for
Thickness
N/A
Solder Reflow Only
L
W
B
T
S
Dimensions – Millimeters (Inches) – Flexible Termination
EIA Metric
S
L
W
Width
T
B
Mounting
Technique
Size
Size
Separation
Minimum
Length
Thickness
Bandwidth
Code Code
0805
1206
1210
1812
2012
3216
3225
4532
2.00 (.079) ± 0.20 (.008)
3.30 (.130) ± 0.40 (.016)
3.30 (.130) ± 0.40 (.016)
4.50 (.178) ± 0.40 (.016)
1.25 (.049) ± 0.20 (.008)
1.60 (.063) ± 0.20 (.008)
2.50 (.098) ± 0.20 (.008)
3.20 (.126) ± 0.30 (.012)
0.50 (0.02) ± 0.25 (.010)
0.60 (.024) ± 0.25 (.010)
0.60 (.024) ± 0.25 (.010)
0.70 (.028) ± 0.35 (.014)
0.75 (.030)
Solder Wave or
Solder Reflow
See Table 2 for
Thickness
N/A
Solder Reflow
Only
Benefits
• -55°C to +125°C operating temperature range
• Open Mode/fail open design
• Mid to high capacitance flex mitigation
• Non-polar device, minimizing installation concerns
• 100% pure matte tin-plated termination finish allowing for
excellent solderability
• Pb-Free and RoHS Compliant
• Commercial and Automotive (AEC–Q200) grades available
• SnPb termination finish option available upon request (5%
minimum)
• EIA 0805, 1206, 1210, and 1812 case sizes
• DC voltage ratings of 16 V, 25 V, 50 V, 100 V, and 200 V
• Capacitance offerings ranging from 1,000 pF to 6.8 μF
• Available capacitance tolerances of ±5%, ±10%, and ±20%
• Flexible termination option available upon request
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 5/30/2013
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Applications
Typical applications include input side filtering (power plane/bus), high current (battery line) and circuits that cannot be fused to open
when short circuits occur due to flex cracks. Markets include automotive applications that are directly connected to the battery and/or
involve conversion to a 42 V system and raw power input side filtering in power conversion.
Qualification/Certification
Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in
Table 4, Performance and Reliability.
Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test
methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. For additional
information regarding the Automotive Electronics Council and AEC–Q200, please visit their website at www.aecouncil.com.
Environmental Compliance
Pb-Free and RoHS Compliant (excluding SnPb termination finish option).
Electrical Parameters/Characteristics
Item
Parameters/Characteristics
Operating Temperature Range
-55°C to +125°C
±15%
Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC)
Aging Rate (Maximum % Capacitance Loss/Decade Hour)
3.0%
250% of rated voltage
Dielectric Withstanding Voltage (DWV)
Dissipation Factor (DF) Maximum Limit @ 25ºC
Insulation Resistance (IR) Limit @ 25°C
(5 ±1 seconds and charge/discharge not exceeding 50 mA)
5% (6.3 and 10 V), 3.5% (16 and 25 V) and 2.5% (50 to 250 V)
See Insulation Resistance Limit Table
(Rated voltage applied for 120 ±5 seconds @ 25°C)
Regarding aging rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Capacitance and dissipation factor (DF) measured under the following conditions:
1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance ≤ 10 µF
120 Hz ±10Hz and 0.5 ±0.1 Vrms if capacitance > 10 µF
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as
Automatic Level Control (ALC). The ALC feature should be switched to "ON."
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 5/30/2013
3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Rated DC
Voltage
Capacitance
Dissipation Factor
(Maximum %)
Capacitance
Insulation
Dielectric
X7R
Value
Shift
Resistance
> 25
16/25
< 16
3.0
5.0
7.5
All
±20%
10% of Initial Limit
Insulation Resistance Limit Table (X7R Dielectric)
1,000 Megohm
EIA Case Size
500 Megohm
Microfarads or 10 GΩ
Microfarads or 100 GΩ
0201
0402
0603
0805
1206
1210
1808
1812
1825
2220
2225
N/A
< 0.012 µF
< 0.047 µF
< 0.047 µF
< 0.22 µF
< 0.39 µF
ALL
ALL
≥ 0.012 µF
≥ 0.047 µF
≥ 0.047 µF
≥ 0.22 µF
≥ 0.39 µF
N/A
< 2.2 µF
ALL
≥ 2.2 µF
N/A
< 10 µF
ALL
≥ 10 µF
N/A
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 5/30/2013
4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Table 1 – Capacitance Range/Selection Waterfall (0805 – 1812 Case Sizes)
Series
Voltage Code
Voltage DC
C0805F
C1206F
C1210F
C1812F
4
3
5
1
2
4
3
5
1
2
4
3
5
1
2
3
5
1
2
Cap
Code
Capacitance
16
25
50
100 200
16
25
50
100 200
16
25
50
100 200
25
50
100 200
Capacitance
Tolerance
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
1,000 pF
1,200 pF
1,500 pF
1,800 pF
2,200 pF
2,700 pF
3,300 pF
3,900 pF
4,700 pF
5,600 pF
6,800 pF
8,200 pF
10,000 pF
12,000 pF
15,000 pF
18,000 pF
22,000 pF
27,000 pF
33,000 pF
39,000 pF
47,000 pF
56,000 pF
68,000 pF
82,000 pF
0.10 µF
102
122
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
274
334
394
474
564
684
824
105
125
155
185
225
275
335
395
475
685
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DG
DG
DG
DG
DG
DD
DD
DD
DE
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DG
DG
DG
DG
DD
DD
DG
DG
DG
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DG
DG
DG
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DG
DG
DG
DG
DE
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DG
DG
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EG
EG
EG
EG
EG
EG
EG
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EG
EG
EG
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EG
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EC
EG
EG
ED
EC
EC
EC
EC
EC
EG
EG
EG
EG
EG
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GD
GN
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GD
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GC
GD
GF
GK
GB
GB
GB
GB
GB
GB
GB
GB
GC
GF
GK
GL
DG
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FG
FH
FH
FJ
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FD
FG
FG
FH
FD
FD
FD
FD
FD
FD
FD
FD
FD
FG
FG
FG
FH
FH
FJ
FD
FD
FD
FD
FD
FD
FG
FG
FH
FH
FJ
FD
FD
FG
FG
FH
FH
FJ
0.12 µF
0.15 µF
0.18 µF
0.22 µF
0.27 µF
0.33 µF
0.39 µF
0.47 µF
0.56 µF
0.68 µF
0.82 µF
1.0 µF
1.2 µF
1.5 µF
1.8 µF
2.2 µF
DG
EG
EC
FR
FR
FR
FS
DG
EC
EH
GN GM
EC
EH
FM
FM
2.7 µF
3.3 µF
3.9 µF
4.7 µF
FM
M
M
M
EH
FG
FS
FM
FS
GK
GK
6.8 µF
J
685
K
3
R
A
C
TU
C
1210
Case Size Specification/
Capacitance
Code (pF)
Capacitance
Tolerance
Failure Rate/
Design
Packaging/Grade
(C-Spec)2
Ceramic
Voltage Dielectric
Termination Finish1
(L" x W")
Series
0805
1206
1210
1812
F = Open Mode 2 Significant Digits K = ±10% 4 = 16 V R = X7R A = N/A
J = Open Mode + Number of Zeros M = ±20% 3 = 25 V
C = 100% Matte Sn Blank = Bulk
L = SnPb (5%
minimum)
TU = 7" Reel
Unmarked
withFlexible
5 = 50 V
1 = 100 V
2 = 200 V
Termination
TM = 7" Reel Marked
AUTO = Automotive
Grade
Roll Over for
Order Info.
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Table 2 – Chip Thickness/Packaging Quantities
Paper Quantity
Plastic Quantity
7" Reel 13" Reel
Thickness Case Thickness ±
Code
Size
Range (mm)
7" Reel
13" Reel
DD
DE
DG
EC
ED
EG
EH
FD
FG
FH
FM
FJ
0805
0805
0805
1206
1206
1206
1206
1210
1210
1210
1210
1210
1210
1210
1812
1812
1812
1812
1812
1812
1812
1812
0.90 ± 0.10
1.00 ± 0.10
1.25 ± 0.15
0.90 ± 0.10
1.00 ± 0.10
1.60 ± 0.15
1.60 ± 0.20
0.95 ± 0.10
1.25 ± 0.15
1.55 ± 0.15
1.70 ± 0.20
1.85 ± 0.20
2.25 ± 0.20
2.50 ± 0.20
1.00 ± 0.10
1.10 ± 0.10
1.25 ± 0.15
1.50 ± 0.10
1.60 ± 0.20
1.70 ± 0.20
1.90 ± 0.20
2.00 ± 0.20
4,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
10,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
2,500
2,500
4,000
2,500
2,000
2,000
4,000
2,500
2,000
2,000
2,000
2,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
500
10,000
10,000
10,000
10,000
8,000
8,000
10,000
10,000
8,000
8,000
8,000
8,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
2,000
2,000
FR
FS
GB
GC
GD
GF
GK
GN
GL
GM
0
0
0
0
0
500
7" Reel
13" Reel
7" Reel
13" Reel
Thickness
Code
Case
Size
Thickness ±
Range (mm)
Paper Quantity
Plastic Quantity
Package quantity based on finished chip thickness specifications.
Table 3A – Land Pattern Design Recommendations per IPC–7351 – Standard Termination
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
EIA
Size
Code
Metric
Size
Code
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
0805
1206
1210
12101
1812
2012
3216
3225
3225
4532
1.00
1.35
1.55
4.40
2.60
0.90
1.15
1.45
3.50
2.00
0.75
0.95
1.35
2.80
1.70
1.60
1.60
1.50
2.15
1.35
1.35
1.60
1.60
1.90
2.80
2.90
3.60
5.60
5.65
5.60
6.90
2.90
3.80
3.90
4.60
1.50
1.50
1.40
2.05
1.15
1.15
1.40
1.40
1.80
2.70
2.80
3.50
4.70
4.70
4.70
6.00
2.30
3.20
3.30
4.00
1.40
1.40
1.30
1.95
0.95
0.95
1.20
1.20
1.70
2.60
2.70
3.40
4.00
4.00
4.00
5.30
2.00
2.90
3.00
3.70
1 Only for capacitance values ≥ 22 µF
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder
processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification
testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 5/30/2013
6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Table 3B – Land Pattern Design Recommendations per IPC–7351 – Flexible Termination
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
EIA
Size
Code
Metric
Size
Code
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
0805
1206
1210
1812
2012
3216
3225
4532
1.00
1.35
1.55
4.40
2.60
0.90
1.15
1.45
3.50
2.00
0.80
0.95
1.35
2.80
1.70
1.60
1.60
2.10
1.65
1.65
1.80
1.90
2.80
3.60
5.90
5.90
7.00
2.90
3.80
4.60
1.50
1.50
2.00
1.45
1.45
1.60
1.80
2.70
3.50
5.00
5.00
6.10
2.30
3.20
4.00
1.40
1.40
1.90
1.25
1.25
1.40
1.70
2.60
3.40
4.30
4.30
5.40
2.00
2.90
3.70
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder
processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification
testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Soldering Profile:
• KEMET recommends following the guidelines outlined in IPC/JEDEC J–STD–020
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 5/30/2013
7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress
Reference
Test or Inspection Method
Terminal Strength
JIS–C–6429
Appendix 1, Note: Force of 1.8 kg for 60 seconds.
Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G.
Flexible termination system – 3.0 mm (minimum).
Board Flex
JIS–C–6429
Magnification 50 X. Conditions:
a) Method B, 4 hours @ 155°C, dry heat @ 235°C
b) Method B @ 215°C category 3
Solderability
J–STD–002
c) Method D, category 3 @ 260°C
Temperature Cycling
Biased Humidity
JESD22 Method JA–104
MIL–STD–202 Method 103
1,000 Cycles (-55°C to +125°C). Measurement at 24 hours +/- 2 hours after test conclusion.
Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor. Measurement
at 24 hours +/- 2 hours after test conclusion.
Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.
Measurement at 24 hours +/- 2 hours after test conclusion.
t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered.
Measurement at 24 hours +/- 2 hours after test conclusion.
-55°C/+125°C. Note: Number of cycles required – 300, maximum transfer time – 20 seconds, dwell
time – 15 minutes. Air – Air.
Moisture Resistance
Thermal Shock
MIL–STD–202 Method 106
MIL–STD–202 Method 107
MIL–STD–202 Method 108
/EIA–198
High Temperature Life
Storage Life
1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied.
MIL–STD–202 Method 108 150°C, 0 VDC for 1,000 hours.
5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 secure
MIL–STD–202 Method 204 points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2"
from any secure point. Test from 10 – 2,000 Hz
Vibration
Mechanical Shock
MIL–STD–202 Method 213 Figure 1 of Method 213, Condition F.
Resistance to Solvents MIL–STD–202 Method 215 Add aqueous wash chemical, OKEM Clean or equivalent.
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other
environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term
storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may
increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70%
relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of
chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of
receipt.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 5/30/2013
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Construction – Standard Termination
Reference
Item
Material
A
B
C
D
E
Finish
100% Matte Sn SnPb (5% min)
Termination
System
Barrier Layer
Ni
Cu
Base Metal
Inner Electrode
Dielectric Material
Ni
BaTiO3
Note: Image is exaggerated in order to clearly identify all components of construction.
Construction – Flexible Termination
Reference
Item
Material
A
B
C
D
E
F
Finish
100% Matte Sn SnPb (5% min)
Barrier Layer
Epoxy Layer
Base Metal
Ni
Ag
Termination
System
Cu
Inner Electrode
Dielectric Material
Ni
BaTiO3
Note: Image is exaggerated in order to clearly identify all components of construction.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 5/30/2013
9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Capacitor Marking (Optional):
These surface mount multilayer ceramic capacitors are
normally supplied unmarked. If required, they can be marked
as an extra cost option. Marking is available on most KEMET
devices but must be requested using the correct ordering
code identifier(s). If this option is requested, two sides of the
ceramic body will be laser marked with a “K” to identify KEMET,
followed by two characters (per EIA–198 - see table below) to
identify the capacitance value. EIA 0603 case size devices are
limited to the “K” character only.
Marking appears in legible contrast. Illustrated below is an
example of an MLCC with laser marking of “KA8”, which
designates a KEMET device with rated capacitance of 100 µF.
Orientation of marking is vendor optional.
_
KA8
Laser marking option is not available on:
• C0G, Ultra Stable X8R and Y5V dielectric devices
• EIA 0402 case size devices
• EIA 0603 case size devices with Flexible Termination option.
• KPS Commercial and Automotive Grade stacked devices.
Capacitance (pF) For Various Alpha/Numeral Identifiers
Numeral
Alpha
Character
9
0
1
2
3
4
5
6
7
8
Capacitance (pF)
A
B
C
D
E
F
G
H
J
0.1
0.11
0.12
0.13
0.15
0.16
0.18
0.2
1 0
1.1
1 2
1 3
1 5
1 6
1 8
2 0
2 2
2.4
2.7
3 0
3 3
3 6
3 9
4 3
4.7
5.1
5 6
6 2
6 8
7 5
8 2
9.1
2 5
3 5
4 0
4 5
5 0
6 0
7 0
8 0
9 0
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
51
56
62
68
75
82
91
25
35
40
45
50
60
70
80
90
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
250
350
400
450
500
600
700
800
900
1,000
1,100
1,200
1,300
1,500
1,600
1,800
2,000
2,200
2,400
2,700
3,000
3,300
3,600
3,900
4,300
4,700
5,100
5,600
6,200
6,800
7,500
8,200
9,100
2,500
3,500
4,000
4,500
5,000
6,000
7,000
8,000
9,000
10,000
11,000
12,000
13,000
15,000
16,000
18,000
20,000
22,000
24,000
27,000
30,000
33,000
36,000
39,000
43,000
47,000
51,000
56,000
62,000
68,000
75,000
82,000
91,000
25,000
35,000
40,000
45,000
50,000
60,000
70,000
80,000
90,000
100,000 1,000,000
110,000 1,100,000
120,000 1,200,000
130,000 1,300,000
150,000 1,500,000
160,000 1,600,000
180,000 1,800,000
200,000 2,000,000
220,000 2,200,000
240,000 2,400,000
270,000 2,700,000
300,000 3,000,000
330,000 3,300,000
360,000 3,600,000
390,000 3,900,000
430,000 4,300,000
470,000 4,700,000
510,000 5,100,000
560,000 5,600,000
620,000 6,200,000
680,000 6,800,000
750,000 7,500,000
820,000 8,200,000
910,000 9,100,000
250,000 2,500,000
350,000 3,500,000
400,000 4,000,000
450,000 4,500,000
500,000 5,000,000
600,000 6,000,000
700,000 7,000,000
800,000 8,000,000
900,000 9,000,000
10,000,000
11,000,000
12,000,000
13,000,000
15,000,000
16,000,000
18,000,000
20,000,000
22,000,000
24,000,000
27,000,000
30,000,000
33,000,000
36,000,000
39,000,000
43,000,000
47,000,000
51,000,000
56,000,000
62,000,000
68,000,000
75,000,000
82,000,000
91,000,000
25,000,000
35,000,000
40,000,000
45,000,000
50,000,000
60,000,000
70,000,000
80,000,000
90,000,000
100,000,000
110,000,000
120,000,000
130,000,000
150,000,000
160,000,000
180,000,000
200,000,000
220,000,000
240,000,000
270,000,000
300,000,000
330,000,000
360,000,000
390,000,000
430,000,000
470,000,000
510,000,000
560,000,000
620,000,000
680,000,000
750,000,000
820,000,000
910,000,000
250,000,000
350,000,000
400,000,000
450,000,000
500,000,000
600,000,000
700,000,000
800,000,000
900,000,000
0.22
0.24
0.27
0.3
K
L
M
N
P
Q
R
S
T
U
V
W
X
Y
Z
a
0.33
0.36
0.39
0.43
0.47
0.51
0.56
0.62
0.68
0.75
0.82
0.91
0.25
0.35
0.4
b
d
e
0.45
0.5
f
m
n
0.6
0.7
t
0.8
y
0.9
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 5/30/2013 10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA
Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on
reeling quantities for commercial chips.
Bar Code Label
Anti-Static Reel
®
Embossed Plastic* or
Punched Paper Carrier.
Chip and KPS Orientation in Pocket
(except 1825 Commercial, and 1825 and 2225 Military)
KEMET
Sprocket Holes
Embossment or Punched Cavity
8 mm, 12 mm
or 16 mm Carrier Tape
Anti-Static Cover Tape
(.10 mm (.004") Maximum Thickness)
178 mm (7.00")
or
330 mm (13.00")
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
Table 5 – Carrier Tape Configuration – Embossed Plastic & Punched Paper (mm)
EIA Case Size
01005 – 0402
0603 – 1210
Tape Size (W)*
Pitch (P1)*
8
8
2
4
1805 – 1808
12
12
12
16
8
4
≥ 1812
8
KPS 1210
8
KPS 1812 & 2220
Array 0508 & 0612
12
4
*Refer to Figures 1 & 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 & 7 for tolerance specifications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 5/30/2013 11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
T
T
P2
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
2
E
1
Po
ØDo
Ao
F
Ko
W
E
2
B
1
Bo
S
1
P
1
T
1
Embossment
For cavity size,
see Note 1 Table 4
Center Lines of Cavity
ØD
1
Cover Tape
is for tape feeder reference only,
including draft concentric about B
B
1
o
.
User Direction of Unreeling
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
D1 Minimum
Note 1
1.0
(0.039)
R Reference S1 Minimum
T
T1
Tape Size
8 mm
D0
E1
P0
P2
Note 2
Note 3
Maximum
Maximum
25.0
(0.984)
1.5 +0.10/-0.0
(0.059 +0.004/-0.0)
1.75 ±0.10
4.0 ±0.10
2.0 ±0.05
0.600
(0.024)
0.600
(0.024)
0.100
(0.004)
12 mm
16 mm
(0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002)
1.5
(0.059)
30
(1.181)
Variable Dimensions — Millimeters (Inches)
B1 Maximum
Note 4
4.35
(0.171)
E2
T2
W
Tape Size
8 mm
Pitch
F
P1
A0,B0 & K0
Minimum
6.25
(0.246)
Maximum
2.5
(0.098)
Maximum
8.3
(0.327)
3.5 ±0.05
(0.138 ±0.002) (0.157 ±0.004)
4.0 ±0.10
Single (4 mm)
Single (4 mm) &
8.2
10.25
5.5 ±0.05
8.0 ±0.10
4.6
12.3
12 mm
16 mm
Note 5
Double (8 mm)
(0.323)
(0.404)
(0.217 ±0.002) (0.315 ±0.004)
(0.181)
(0.484)
12.1
(0.476)
14.25
(0.561)
7.5 ±0.05 12.0 ±0.10
(0.138 ±0.002) (0.157 ±0.004)
4.6
(0.181)
16.3
(0.642)
Triple (12 mm)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and
hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4).
(e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 5/30/2013 12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
T
P2
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
E
1
Po
ØDo
0
A
F
W
2
E
0
B
Bottom Cover Tape
P
1
G
Cavity Size,
See
1
T
1
T
Top Cover Tape
Center Lines of Cavity
Note 1, Table 7
Bottom Cover Tape
User Direction of Unreeling
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
R Reference
Note 2
Tape Size
D0
E1
P0
P2
T1 Maximum
G Minimum
1.5 +0.10 -0.0
(0.059 +0.004 -0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
0.10
0.75
(0.030)
25
(0.984)
8 mm
(0.079 ±0.002) (0.004) Maximum
Variable Dimensions — Millimeters (Inches)
Tape Size
8 mm
Pitch
E2 Minimum
F
P1
T Maximum
W Maximum
A0 B0
2.0 ±0.05
(0.079 ±0.002)
4.0 ±0.10
8.3
(0.327)
8.3
Half (2 mm)
Single (4 mm)
6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
1.1
(0.098)
Note 1
8 mm
(0.157 ±0.004)
(0.327)
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
c) rotation of the component is limited to 20° maximum (see Figure 3).
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).
e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 5/30/2013 13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
8 mm
Peel Strength
0.1 to 1.0 Newton (10 to 100 gf)
0.1 to 1.3 Newton (10 to 130 gf)
12 and 16 mm
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180°
from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
°
T
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Typical Pocket Centerline
Tape
Maximum
°
°
T
s
Width (mm) Rotation (
)
8,12
16 – 200
20
10
Bo
Tape
Maximum
°
S
Width (mm) Rotation (
)
8,12
16 – 56
72 – 200
20
10
5
Typical Component Centerline
Ao
Figure 4 – Maximum Lateral Movement
Figure 5 – Bending Radius
Embossed
Carrier
Punched
Carrier
8 mm & 12 mm Tape
16 mm Tape
0.5 mm maximum
0.5 mm maximum
1.0 mm maximum
1.0 mm maximum
R
Bending
Radius
R
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 5/30/2013 14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Figure 6 – Reel Dimensions
Full Radius,
W3 (Includes
flange distortion
at outer edge)
Access Hole at
Slot Location
(Ø 40 mm minimum)
See Note
W
2 (Measured at hub)
D
(See Note)
A
N
C
(Arbor hole
W
1 (Measured at hub)
diameter)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
B
(see Note)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
8 mm
A
B Minimum
C
D Minimum
178 ±0.20
(7.008 ±0.008)
or
330 ±0.20
(13.000 ±0.008)
1.5
(0.059)
13.0 +0.5/-0.2
(0.521 +0.02/-0.008)
20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size
N Minimum
W1
W2 Maximum
W3
8.4 +1.5/-0.0
(0.331 +0.059/-0.0)
14.4
(0.567)
8 mm
50
(1.969)
12.4 +2.0/-0.0
18.4
Shall accommodate tape width
without interference
12 mm
16 mm
(0.488 +0.078/-0.0)
(0.724)
16.4 +2.0/-0.0
(0.646 +0.078/-0.0)
22.4
(0.882)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 5/30/2013 15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Embossed Carrier
Carrier Tape
Round Sprocket Holes
Punched Carrier
8 mm & 12 mm only
START
END
Top Cover Tape
Elongated Sprocket Holes
(32 mm tape and wider)
100 mm
Minimum Leader
400 mm Minimum
Trailer
160 mm Minimum
Components
Top Cover Tape
Figure 8 – Maximum Camber
Elongated sprocket holes
(32 mm & wider tapes)
Carrier Tape
Round Sprocket Holes
1 mm Maximum, either direction
Straight Edge
250 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 5/30/2013 16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
KEMET Corporation
World Headquarters
Europe
Asia
Southern Europe
Paris, France
Tel: 33-1-4646-1006
Northeast Asia
Hong Kong
Tel: 852-2305-1168
2835 KEMET Way
Simpsonville, SC 29681
Sasso Marconi, Italy
Tel: 39-051-939111
Shenzhen, China
Tel: 86-755-2518-1306
Mailing Address:
P.O. Box 5928
Greenville, SC 29606
Beijing, China
Central Europe
Landsberg, Germany
Tel: 49-8191-3350800
Tel: 86-10-5829-1711
www.kemet.com
Tel: 864-963-6300
Fax: 864-963-6521
Shanghai, China
Tel: 86-21-6447-0707
Kamen, Germany
Tel: 49-2307-438110
Corporate Offices
Fort Lauderdale, FL
Tel: 954-766-2800
Taipei, Taiwan
Tel: 886-2-27528585
Northern Europe
Bishop’s Stortford, United Kingdom
Tel: 44-1279-460122
North America
Southeast Asia
Singapore
Southeast
Tel: 65-6586-1900
Lake Mary, FL
Tel: 407-855-8886
Espoo, Finland
Tel: 358-9-5406-5000
Penang, Malaysia
Tel: 60-4-6430200
Northeast
Wilmington, MA
Tel: 978-658-1663
Bangalore, India
Tel: 91-806-53-76817
Central
Novi, MI
Tel: 248-994-1030
West
Milpitas, CA
Tel: 408-433-9950
Mexico
Guadalajara, Jalisco
Tel: 52-33-3123-2141
Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not
assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of
KEMET Electronics Corporation.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 5/30/2013 17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
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Disclaimer
All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and
verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.
All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are
not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use. The Information is intended for use only
by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise
provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still
occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective
circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not
be required.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 5/30/2013 18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Digitally signed by Jeannette Calvo
DN: c=US, st=FL, l=Fort Lauderdale, o=KEMET Corp., ou=Marketing Communications,
cn=Jeannette Calvo, email=jeannettecalvo@kemet.com
Date: 2013.06.07 15:35:37 -04'00'
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 5/30/2013 19
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