C1206X103K1RACTU [KEMET]
Ceramic Capacitor, Multilayer, Ceramic, 100V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.01uF, Surface Mount, 1206, CHIP;型号: | C1206X103K1RACTU |
厂家: | KEMET CORPORATION |
描述: | Ceramic Capacitor, Multilayer, Ceramic, 100V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.01uF, Surface Mount, 1206, CHIP 电容器 |
文件: | 总24页 (文件大小:1484K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), X7R Dielectric,
6.3 – 250 VDC (Commercial Grade)
Overview
KEMET’s Flexible Termination (FT-CAP) multilayer ceramic
capacitor in X7R dielectric incorporates a unique, flexible
termination system that is integrated with KEMET’s
standard termination materials. A conductive silver epoxy
is utilized between the base metal and nickel barrier
layers of KEMET’s standard termination system in order
to establish pliability while maintaining terminal strength,
solderability and electrical performance. This technology
was developed in order to address the primary failure
mode of MLCCs– flex cracks, which are typically the result
of excessive tensile and shear stresses produced during
board flexure and thermal cycling. Flexible termination
technology inhibits the transfer of board stress to the rigid
ceramic body, therefore mitigating flex cracks which can
result in low IR or short circuit failures.
(KPS) product lines by providing a complete portfolio of flex
mitigation solutions.
Combined with the stability of an X7R dielectric and designed
to accommodate all capacitance requirements, these flex-
robust devices are RoHS-compliant, offer up to 5 mm of
flex-bend capability and exhibit a predictable change in
capacitance with respect to time and voltage. Capacitance
change with reference to ambient temperature is limited to
±15% from −55°C to +125°C.
In addition to commercial grade, automotive grade devices
are available which meet the demanding Automotive
Electronics Council's AEC–Q200 qualification requirements.
Although this technology does not eliminate the potential
for mechanical damage that may propagate during extreme
environmental and handling conditions, it does provide
superior flex performance over standard termination
systems. FT-CAP complements KEMET’s Open Mode,
Floating Electrode (FE-CAP), Floating Electrode with
Flexible Termination (FF-CAP) and KEMET Power Solutions
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Ordering Information
C
1206
X
106
K
4
R
A
C
TU
Rated
Failure
Case Size Specification/ Capacitance
Capacitance
Tolerance
Packaging/Grade
(C-Spec)2
Ceramic
Voltage Dielectric Rate/
(VDC)
Termination Finish1
(L" x W")
Series
Code (pF)
Design
R = X7R A = N/A C = 100% Matte Sn
L = SnPb (5% Pb minimum)
0603
0805
1206
1210
1808
1812
1825
2220
2225
X = Flexible
Termination
Two
significant
digits +
number of
zeros
J = ±5%
K = ±10%
M = ±20%
9 = 6.3
8 = 10
4 = 16
3 = 25
5 = 50
1 = 100
2 = 200
A = 250
See "Packaging
C-Spec
Ordering
Options Table"
below
1 Additional termination finish options may be available. Contact KEMET for details.
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1013_X7R_FT-CAP_SMD • 2/23/2018
1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Packaging C-Spec Ordering Options Table
Packaging/Grade
Packaging Type1
Ordering Code (C-Spec)
Bulk Bag/Unmarked
7" Reel/Unmarked
Not required (Blank)
TU
7411 (EIA 0603 and smaller case sizes)
7210 (EIA 0805 and larger case sizes)
13" Reel/Unmarked
7" Reel/Marked
TM
7040 (EIA 0603 and smaller case sizes)
7215 (EIA 0805 and larger case sizes)
13" Reel/Marked
7" Reel/Unmarked/2mm pitch2
13" Reel/Unmarked/2mm pitch2
7081
7082
1 Default packaging is "Bulk Bag". An ordering code C-Spec is not required for "Bulk Bag" packaging.
1 The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain
capacitors that have not been laser marked. Please contact KEMET if you require a laser marked option. For more information see "Capacitor Marking".
2 The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".
Benefits
• −55°C to +125°C operating temperature range
• Superior flex performance (up to 5 mm)
• High capacitance flex mitigation
• Lead (Pb)-free, RoHS and REACH compliant
• EIA 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2220, and
2225 case sizes
• Capacitance offerings ranging from 180 pF to 22 μF
• Available capacitance tolerances of ±5%, ±10%, and ±20%
• Automotive (AEC-Q200) grade available
• Non-polar device, minimizing installation concerns
• 100% pure matte tin-plated termination finish allowing for
excellent solderability
• DC voltage ratings of 6.3 V, 10 V, 16 V, 25 V, 50 V, 100 V,
200 V, and 250 V
• SnPb termination finish option available upon request
(5% Pb minimum)
Applications
Typical applications include circuits with a direct battery or power source connection, critical and safety relevant circuits
without (integrated) current limitation and any application that is subject to high levels of board flexure or temperature
cycling. Examples include raw power input side filtering (power plane/bus), high current applications (automobile battery
line) and circuits that cannot be fused to open. Markets include consumer, medical, industrial (power supply), automotive,
aerospace and telecom.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1013_X7R_FT-CAP_SMD • 2/23/2018
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Dimensions – Millimeters (Inches)
L
W
T
B
S
S
EIA Size
Code
Metric Size
Code
L
W
Width
T
B
Mounting
Technique
Separation
Minimum
Length
Thickness
Bandwidth
1.60 (0.063)
±0.17 (0.007)
2.00 (0.079)
±0.30 (0.012)
3.30 (0.130)
±0.40 (0.016)
3.30 (0.130)
±0.40 (0.016)
4.70 (0.185)
±0.50 (0.020)
4.50 (0.178)
±0.40 (0.016)
4.60 (0.181)
±0.40 (0.016)
5.90 (0.232)
±0.75 (0.030)
5.90 (0.232)
±0.75 (0.030)
0.80 (0.032)
±0.15 (0.006)
1.25 (0.049)
±0.30 (0.012)
1.60 (0.063)
±0.35 (0.013)
2.60 (0.102)
±0.30 (0.012)
2.00 (0.079)
±0.20 (0.008)
3.20 (0.126)
±0.30 (0.012)
6.40 (0.252)
±0.40 (0.016)
5.00 (0.197)
±0.40 (0.016)
6.40 (0.248)
±0.40 (0.016)
0.45 (0.018)
±0.15 (0.006)
0.50 (0.02)
06031
08052
1206
1210
1808
1812
1825
2220
2225
1608
2012
3216
3225
4520
4532
4564
5650
5664
0.58 (0.023)
Solder Wave
or
Solder Reflow
0.75 (0.030)
±0.25 (0.010)
0.60 (0.024)
±0.25 (0.010)
0.60 (0.024)
±0.25 (0.010)
0.70 (0.028)
±0.35 (0.014)
0.70 (0.028)
±0.35 (0.014)
0.70 (0.028)
±0.35 (0.014)
0.70 (0.028)
±0.35 (0.014)
0.70 (0.028)
±0.35 (0.014)
See Table 2 for
Thickness
N/A
Solder Reflow
Only
1 For capacitance values ≥ 0.56 µF add 0.03 (0.001) to length tolerance dimension.
2 For capacitance values 1.0 µF or ≥ 2.7 µF add 0.05 (0.002) to length tolerance dimension.
Qualification/Certification
Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are
referenced in Table 4, Performance & Reliability.
Environmental Compliance
Lead (Pb)-free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1013_X7R_FT-CAP_SMD • 2/23/2018
3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Electrical Parameters/Characteristics
Item
Parameters/Characteristics
Operating Temperature Range
−55°C to +125°C
Capacitance Change with Reference to
±15%
+25°C and 0 Vdc Applied (TCC)
1Aging Rate (Maximum % Capacitance Loss/Decade Hour)
2Dielectric Withstanding Voltage (DWV)
3.0%
250% of rated voltage
(5±1 seconds and charge/discharge not exceeding 50mA)
3Dissipation Factor (DF) Maximum Limit at 25°C
See Dissipation Factor Limit Table
See Insulation Resistance Limit Table
(Rated voltage applied for 120±5 seconds at 25°C)
4Insulation Resistance (IR) Minimum Limit at 25°C
1 1Regarding Aging Rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.
2 DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the
capacitor.
3 Capacitance and dissipation factor (DF) measured under the following conditions:
1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance ≤10µF
120Hz ± 10Hz and 0.5 ± 0.1 Vrms if capacitance >10µF
4 To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known
as Automatic Level Control (ALC). The ALC feature should be switched to "ON".
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1013_X7R_FT-CAP_SMD • 2/23/2018
4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Dissipation
Factor
(Maximum %)
Rated
DC Voltage
Capacitance
Shift
Insulation
Resistance
EIA Case Size
0603
Capacitance
< 1.0µF
< 16
16 / 25
> 25
7.5
5.0
3.0
20.0
7.5
All
≥ 1.0µF
< 4.7µF
≥ 4.7µF
< 4.7µF
≥ 4.7µF
All
< 16
16
20.0
5.0
20.0
5.0
3.0
7.5
0805
25
> 25
10% of Initial
Limit
All
±20%
< 16
All
12061
1210
16 / 25
> 25
All
5.0
3.0
7.5
All
< 16
All
16 / 25
> 25
All
5.0
3.0
7.5
All
< 16
All
1808 - 2225
16 / 25
> 25
All
5.0
3.0
All
1 For Capacitance values 4.7 µf and 10 µF DF Post Value is 20% (All Voltages).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1013_X7R_FT-CAP_SMD • 2/23/2018
5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Insulation Resistance Limit Table (X7R Dielectric)
1,000 Megohm
Microfarads or 100 GΩ
500 Megohm
Microfarads or 10 GΩ
100 Megohm
Microfarads or 10 GΩ
EIA Case Size
0402
0603
0805
1206
1210
1808
1812
1825
2220
2225
< 0.012 µF
< 0.047 µF
< 0.15 µF
< 0.47 µF
< 0.39 µF
ALL
≥ 0.012 µF
N/A
≥ 0.47 µf
≥ 2.2 µf
≥ 4.7 µf
≥ 10 µf
N/A
≥ 0.047 µf < 0.47 µf
≥ 0.15 µF < 2.2 µf
≥ 0.47 µF < 4.7 µf
≥ 0.39 µF < 10 µf
N/A
< 2.2 µF
ALL
≥ 2.2 µF
N/A
N/A
N/A
< 10 µF
ALL
≥ 10 µF
N/A
N/A
N/A
Dissipation Factor (DF) Limit Table
Dissipation
Factor
(Maximum %)
EIA
Case Size
Rated DC
Voltage
Capacitance
< 16
16/25
> 25
All
5.0
3.5
2.5
10.0
5.0
10.0
3.5
10.0
3.5
2.5
5.0
3.5
2.5
5.0
3.5
2.5
5.0
3.5
2.5
< 1.0µF
0603
0805
≥ 1.0µF
< 4.7µF
≥ 4.7µF
< 4.7µF
≥ 4.7µF
All
< 16
16
25
> 25
All
< 16
All
12061
1210
16/25
> 25
All
All
< 16
All
16 / 25
> 25
All
All
< 16
All
1808 – 2225
16/25
> 25
All
All
1 For Capacitance values 4.7 µf and 10 µF DF Value is 10% (All Voltages).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1013_X7R_FT-CAP_SMD • 2/23/2018
6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Table 1A – Capacitance Range/Selection Waterfall (0603 – 1210 Case Sizes)
Case Size/
Series
Voltage Code
C0603X
C0805X
C1206X
C1210X
Cap
Code
9
8
4
3
5
1
2
9
8
4
3
5
1
2
A
9
8
4
3
5
1
2
A
9
8
4
3
5
1
2
A
Cap
Rated Voltage
(VDC)
Cap Tolerance
Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions
180 pF
220 pF
270 pF
330 pF
390 pF
470 pF
560 pF
680 pF
820 pF
1,000 pF
1,200 pF
1,500 pF
1,800 pF
2,200 pF
2,700 pF
3,300 pF
3,900 pF
4,700 pF
5,600 pF
6,800 pF
8,200 pF
10,000 pF
12,000 pF
15,000 pF
18,000 pF
181
221
271
331
391
471
561
681
821
102
122
152
182
222
272
332
392
472
562
682
822
103
123
153
183
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR EQ EQ EQ EQ EQ
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ EQ
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ EQ
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ EQ
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ EQ
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN
CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN
CJ CJ CJ CJ CJ CJ
CJ CJ CJ CJ CJ CJ
CJ CJ CJ CJ CJ CJ
CJ CJ CJ CJ CJ CJ
CJ CJ CJ CJ CJ CJ
CJ CJ CJ CJ CJ CJ
CJ CJ CJ CJ CJ CJ
CJ CJ CJ CJ CJ CJ
CJ CJ CJ CJ CJ
CJ CJ CJ CJ CJ
CJ CJ CJ CJ CJ
CJ CJ CJ CJ CJ
CJ CJ CJ CJ CJ
CJ CJ CJ CJ CJ
CJ CJ CJ CJ
DR DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN
DR DR DR DR DR DD DR DR EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN
DR DR DR DR DR DD DR DR EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN
DR DR DR DR DR DD DR DR EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN
22,000 pF 223
27,000 pF
33,000 pF
39,000 pF
47,000 pF
56,000 pF 563
68,000 pF 683
82,000 pF 823
0.10 µF
0.12 µF
0.15 µF
0.18 µF
0.22 µF
0.27 µF
0.33 µF
0.39 µF
0.47 µF
0.56 µF
0.68 µF
0.82 µF
1.0 µF
1.2 µF
1.5 µF
1.8 µF
2.2 µF
2.7 µF
3.3 µF
3.9 µF
4.7 µF
5.6 µF
273
333
393
473
DR DR DR DR DR DD DS
DR DR DR DR DR DD DS
DR DR DR DR DR DD DS
DR DR DR DR DR DS DG
DD DD DD DD DD DS DG
DD DD DD DD DD DS
DD DD DD DD DD DS
DR DR DR DR DR DS
DR DR DR DR DD DG
DR DR DR DR DD DG
DR DR DR DR DG DG
DR DR DR DR DG DG
DD DD DD DD DD
DG DG DG DG DD
DG DG DG DG DS
DG DG DG DG DS
DD DD DD DG DH
DD DD DD DG DH
DD DD DD DG
EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN
EQ EQ EQ EQ EQ EQ EQ EQ FN FN FN FN FN FN FN FN
EQ EQ EQ EQ EQ ER EQ EQ FN FN FN FN FN FN FN FN
EQ EQ EQ EQ EQ ER ES ES FN FN FN FN FN FN FQ FQ
EQ EQ EQ EQ EQ EQ ES ES FN FN FN FN FN FN FQ FQ
EQ EQ EQ EQ EQ EQ ES ES FN FN FN FN FN FN FQ FQ
EQ EQ EQ EQ EQ EQ ES ES FN FN FN FN FN FQ FA FA
EQ EQ EQ EQ EQ EQ EM EM FN FN FN FN FN FX FZ FZ
104
124
154
184
224
274
334
394
474
564
684
824
105
125
155
185
225
275
335
395
475
565
ER ER ER ER ER ER EU
ER ER ER ER ER ER EU
ER ER ER ER ER ER
ER ER ER ER ER ER
EQ EQ EQ EQ ER EM
EQ EQ EQ EQ ER EU
EQ EQ EQ EQ ER EU
ER ER ER ER ER EU
ES ES ES ES ER EM
ET ET ET ET ES EM
EF EF EF EF ES EU
EF EF EF EU ES EU
ES ES ES EU EH
EF EF EF EU EH
ES ES ES EF EH
ES ES ES EF EH
EN EN EN EH
FN FN FN FN FN FX FU FU
FQ FQ FQ FQ FQ FX FM FM
FQ FQ FQ FQ FQ FX FK FK
FQ FQ FQ FQ FQ FX FK FK
FQ FQ FQ FQ FQ FX
FX FX FX FX FX FX
FX FX FX FX FX FX
FX FX FX FX FX FX
FX FX FX FX FX FA
FX FX FX FX FX FZ
FA FA FA FA FA FL
FU FU FU FU FU FM
FU FU FU FU FZ FH
FU FU FU FU FZ FM
FU FU FU FU FZ FJ
FJ FJ FJ FJ FZ FK
FE FE FE FZ FU
CJ CJ CJ CJ
CJ CJ CJ
CJ CJ CJ
CJ CJ CJ
CJ CJ CJ
CJ CJ CJ
DD DD DD DG
DS DS DS
DG DG DG
DG DG DG
DG DG DG
ES ES ES EH
FA FA FA FM FM
EF EF EF EH
FZ FZ FZ FZ FK
DH DH DH
EF EA EA EA
FQ FQ FQ FZ FS
EH EH EH
FA FA FA FU
Rated Voltage
(VDC)
Cap
Code
Voltage Code
9
8
4
3
5
1
2
9
8
4
3
5
1
2
A
9
8
4
3
5
1
2
A
9
8
4
3
5
1
2
A
Cap
Case Size/
Series
C0603X
C0805X
C1206X
C1210X
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1013_X7R_FT-CAP_SMD • 2/23/2018
7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Table 1A – Capacitance Range/Selection Waterfall (0603 – 1210 Case Sizes) cont'd
Case Size/
Series
Voltage Code
C0603X
C0805X
C1206X
C1210X
Cap
Code
9
8
4
3
5
1
2
9
8
4
3
5
1
2
A
9
8
4
3
5
1
2
A
9
8
4
3
5
1
2
A
Cap
Rated Voltage
(VDC)
Cap Tolerance
Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions
6.8 µF
8.2 µF
10 µF
12 µF
15 µF
18 µF
22 µF
685
825
106
126
156
186
226
J
J
J
J
J
J
J
K
K
K
K
K
K
K
M
M
M
M
M
M
M
EH EH EH
EH EH EH
EA EA EA EA
FZ FZ FZ FM
FU FU FU FK
FU FU FU FS
DH DH
FS FS
Rated Voltage
(VDC)
Cap
Code
Voltage Code
9
8
4
3
5
1
2
9
8
4
3
5
1
2
A
9
8
4
3
5
1
2
A
9
8
4
3
5
1
2
A
Cap
Case Size/
Series
C0603X
C0805X
C1206X
C1210X
Table 1B – Capacitance Range/Selection Waterfall (1808 – 2225 Case Sizes)
Case Size/
Series
Voltage Code
C1808X
C1812X
C1825X
C2220X
C2225X
Cap
Code
5
1
2
A
3
5
1
2
A
5
1
2
A
3
5
1
2
A
5
1
2
A
Cap
Rated Voltage
(VDC)
Cap Tolerance
Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions
4,700 pF
5,600 pF
6,800 pF
8,200 pF
10,000 pF
12,000 pF
15,000 pF
18,000 pF
22,000 pF
27,000 pF
33,000 pF
39,000 pF
47,000 pF
56,000 pF
68,000 pF
82,000 pF
0.10 µF
0.12 µF
0.15 µF
0.18 µF
0.22 µF
0.27 µF
0.33 µF
0.39 µF
0.47 µF
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
274
334
394
474
564
684
824
105
125
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
LD
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GC
GC
GE
GE
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GC
GC
GE
GE
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GG
GG
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GE
GF
GG
GG
GG
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GE
GG
GG
GG
GG
GG
GJ
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HD
HD
HF
HF
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HD
HD
HD
HD
HF
HF
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HB
HD
HD
HD
HD
HF
HF
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JD
JF
JF
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JD
JD
JF
JF
JC
JC
JC
JC
JC
JC
JC
JC
JC
JC
JD
JD
JF
JF
KC
KC
KC
KC
KC
KB
KB
KB
KB
KB
KB
KB
KB
KB
KC
KC
KC
KC
KC
KC
KC
KC
KC
KC
KC
KC
KD
KE
KC
KC
KC
KC
KC
KC
KC
KC
KD
KD
KD
KE
KE
KE
KC
KC
KC
KC
KC
KC
KC
KC
KD
KD
KD
KE
KE
KE
GG GG
GG
GG
GG
GG
GG
GB
GJ
0.56 µF
0.68 µF
0.82 µF
1.0 µF
1.2 µF
Rated Voltage
(VDC)
Cap
Code
Voltage Code
5
1
2
A
3
5
1
2
A
5
1
2
A
3
5
1
2
A
5
1
2
A
Cap
Case Size/
Series
C1808X
C1812X
C1825X
C2220X
C2225X
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1013_X7R_FT-CAP_SMD • 2/23/2018
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Table 1B – Capacitance Range/Selection Waterfall (1808 – 2225 Case Sizes) cont'd
Case Size/
Series
Voltage Code
C1808X
C1812X
C1825X
C2220X
C2225X
Cap
Code
5
1
2
A
3
5
1
2
A
5
1
2
A
3
5
1
2
A
5
1
2
A
Cap
Rated Voltage
(VDC)
Cap Tolerance
Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions
1.5 µF
1.8 µF
2.2 µF
2.7 µF
3.3 µF
3.9 µF
4.7 µF
5.6 µF
6.8 µF
8.2 µF
10 µF
12 µF
15 µF
18 µF
22 µF
155
185
225
275
335
395
475
565
685
825
106
126
156
186
226
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
GC
GE
GG
GJ
GL
GC
GE
GG
GJ
GL
GC
GE
GG
GJ
GL
HC
HD
HF
JC
JD
JF
JC
JD
JF
KC
KD
KD
GK
GK
GK
JF
JO
JO
JO
JO
Rated Voltage
(VDC)
Cap
Code
Voltage Code
5
1
2
A
3
5
1
2
A
5
1
2
A
3
5
1
2
A
5
1
2
A
Cap
Case Size/
Series
C1808X
C1812X
C1825X
C2220X
C2225X
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1013_X7R_FT-CAP_SMD • 2/23/2018
9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Table 2A – Chip Thickness/Tape & Reel Packaging Quantities
Paper Quantity1
7" Reel 13" Reel
Plastic Quantity
Thickness Case Thickness ±
Code
Size1 Range (mm)
7" Reel
13" Reel
CJ
DR
DD
DS
DG
DH
EQ
ER
EN
ES
ET
EF
EM
EH
EU
EA
FN
FQ
FX
FE
0603
0805
0805
0805
0805
0805
1206
1206
1206
1206
1206
1206
1206
1206
1206
1206
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1210
1808
1812
1812
1812
1812
1812
1812
1812
1812
1825
1825
1825
1825
2220
2220
2220
2220
2225
2225
2225
2225
0.80 ±0.15*
0.78 ±0.20
0.90 ±0.10
1.00 ±0.20
1.25 ±0.15
1.25 ±0.20
0.78 ±0.20
0.90 ±0.20
0.95 ±0.10
1.00 ±0.20
1.10 ±0.20
1.20 ±0.15
1.25 ±0.15
1.60 ±0.20
1.60 ±0.25
1.60 ±0.35
0.78 ±0.20
0.90 ±0.20
0.95 ±0.20
1.00 ±0.10
1.10 ±0.15
1.25 ±0.20
1.40 ±0.15
1.55 ±0.15
1.55 ±0.20
1.70 ±0.20
1.85 ±0.20
2.10 ±0.20
2.50 ±0.30
0.90 ±0.10
1.00 ±0.10
1.10 ±0.10
1.30 ±0.10
1.50 ±0.10
1.55 ±0.10
1.60 ±0.20
1.70 ±0.15
1.90 ±0.20
1.10 ±0.15
1.15 ±0.15
1.30 ±0.15
1.50 ±0.15
1.10 ±0.15
1.30 ±0.15
1.50 ±0.15
2.40 ±0.15
1.00 ±0.15
1.10 ±0.15
1.30 ±0.15
1.40 ±0.15
4,000
0
0
0
0
15,000
0
0
0
0
0
0
4,000
4,000
2,500
2,500
2,500
4,000
4,000
4,000
2,500
2,500
2,500
2,500
2,000
2,000
2,000
4,000
4,000
4,000
2,500
2,500
2,500
2,000
2,000
2,000
2,000
2,000
2,000
1,000
2,500
1,000
1,000
1,000
1,000
1,000
1,000
1,000
500
10,000
10,000
10,000
10,000
10,000
10,000
10,000
10,000
10,000
10,000
10,000
10,000
8,000
8,000
8,000
10,000
10,000
10,000
10,000
10,000
10,000
8,000
8,000
8,000
8,000
8,000
8,000
4,000
10,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
2,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
2,000
4,000
4,000
4,000
4,000
0
0
4,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
10,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
FA
FZ
FL
FH
FU
FM
FJ
FK
FS
LD
GB
GC
GE
GF
GG
GK
GJ
GL
HB
HC
HD
HF
JC
JD
JF
1,000
1,000
1,000
1,000
1,000
1,000
1,000
500
1,000
1,000
1,000
1,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
JO
KB
KC
KD
KE
0
0
0
0
0
7" Reel
13" Reel
7" Reel
13" Reel
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
Paper Quantity1
Plastic Quantity
Package quantity based on finished chip thickness specifications.
1 If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA 0603
(1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1013_X7R_FT-CAP_SMD • 2/23/2018 10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Table 2B – Bulk Packaging Quantities
Loose Packaging
Packaging Type
Bulk Bag (default)
Packaging C-Spec1
N/A2
Case Size
Packaging Quantities (pieces/unit packaging)
EIA (in)
Metric (mm)
Minimum
Maximum
0402
0603
0805
1206
1210
1808
1812
1825
2220
2225
1005
1608
2012
3216
3225
4520
4532
4564
5650
5664
50,000
1
20,000
1 The "Packaging C-Spec" is a 4 to 8 digit code which identifies the packaging type and/or product grade. When ordering, the proper code must be
included in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details.
Commercial Grade product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk
bag packaging option for Automotive Grade products.
2 A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and Automotive Grade products). The
15th through 22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our
standard "Bulk Bag" packaging.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1013_X7R_FT-CAP_SMD • 2/23/2018 11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
EIA
Size
Code
Metric
Size
Code
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
0603
0805
1206
1210
1808
1812
1825
2220
2225
1608
2012
3216
3225
4520
4532
4564
5650
5664
0.85
1.25
1.10
4.00
2.10
0.75
1.05
1.00
3.10
1.50
0.65
0.85
0.90
2.40
1.20
0.99
1.59
1.59
2.30
2.10
2.15
2.85
2.85
1.44
1.62
1.62
1.75
1.80
1.80
2.10
2.10
1.66
2.06
3.01
2.30
3.60
6.90
5.50
6.90
4.47
5.85
5.90
7.40
7.00
7.10
8.80
8.80
2.71
3.06
4.01
3.30
4.60
7.90
6.50
7.90
0.89
1.49
1.49
2.20
2.00
2.05
2.75
2.75
1.24
1.42
1.42
1.55
1.60
1.60
1.90
1.90
1.56
1.96
2.91
2.20
3.50
6.80
5.40
6.80
3.57
4.95
4.95
6.50
6.10
6.20
7.90
7.90
2.11
2.46
3.41
2.70
4.00
7.30
5.90
7.30
0.79
1.39
1.39
2.10
1.90
1.95
2.65
2.65
1.04
1.22
1.22
1.35
1.40
1.40
1.70
1.70
1.46
1.86
2.81
2.10
3.40
6.70
5.30
6.70
2.42
4.25
4.25
5.80
5.40
5.50
7.20
7.20
1.81
2.16
3.11
2.40
3.70
7.00
5.60
7.00
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805, and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
V1
Y
Y
V2
X
X
C
C
Grid Placement Courtyard
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1013_X7R_FT-CAP_SMD • 2/23/2018 12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Reflow Soldering Profile:
KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),
convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal
stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/
J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes
at these conditions.
Termination Finish
TP
TL
tP
Profile Feature
Maximum Ramp ꢀp Rate ꢁ 3ꢂCꢃsecond
Maximum Ramp Doꢄn Rate ꢁ 6ꢂCꢃsecond
SnPb
100% Matte Sn
tL
Preheat/Soak
Temperature Minimum (TSmin
)
100°C
150°C
150°C
200°C
Tsmax
Tsmin
Temperature Maximum (TSmax
Time (tS) from TSmin to TSmax
)
60 – 120 seconds
3°C/second
60 – 120 seconds
3°C/second
ts
Ramp-Up Rate (TL to TP)
maximum
maximum
25
Liquidous Temperature (TL)
Time Above Liquidous (tL)
Peak Temperature (TP)
183°C
60 – 150 seconds
235°C
217°C
60 – 150 seconds
260°C
25ꢂC to Peaꢅ
Time
Time Within 5°C of Maximum
20 seconds
maximum
30 seconds
maximum
Peak Temperature (tP)
6°C/second
maximum
6°C/second
maximum
Ramp-Down Rate (TP to TL)
Time 25°C to Peak
6 minutes
maximum
8 minutes
maximum
Temperature
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1013_X7R_FT-CAP_SMD • 2/23/2018 13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress
Reference
Test or Inspection Method
Terminal Strength
JIS–C–6429
Appendix 1, Note: Force of 1.8 kg for 60 seconds.
Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm
for C0G. Flexible termination system – 3.0 mm (minimum).
Board Flex
JIS–C–6429
Magnification 50 X. Conditions:
a) Method B, 4 hours at 155°C, dry heat at 235°C
b) Method B at 215°C category 3
Solderability
J–STD–002
c) Method D, category 3 at 260°C
1,000 Cycles (−55°C to +125°C). Measurement at 24 hours +/− 4 hours after test
Temperature Cycling
Biased Humidity
JESD22 Method JA–104
conclusion.
Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor.
Measurement at 24 hours +/− 4 hours after test conclusion.
Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.
Measurement at 24 hours +/− 4 hours after test conclusion.
MIL–STD–202 Method
103
MIL–STD–202 Method
t = 24 hours/cycle. Steps 7a and 7b not required.
Moisture Resistance
Thermal Shock
Measurement at 24 hours +/− 4 hours after test conclusion.
106
MIL–STD–202 Method
−55°C/+125°C. Note: Number of cycles required – 300, maximum transfer time – 20
seconds, dwell time – 15 minutes. Air – Air.
107
MIL–STD–202 Method
108
High Temperature Life
1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied.
/EIA–198
MIL–STD–202 Method
108
Storage Life
Vibration
150°C, 0 VDC for 1,000 hours.
5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7
secure points on one long side and 2 secure points at corners of opposite sides. Parts
mounted within 2" from any secure point. Test from 10 – 2,000 Hz
MIL–STD–202 Method
204
MIL–STD–202 Method
Mechanical Shock
Figure 1 of Method 213, Condition F.
213
MIL–STD–202 Method
215
Resistance to Solvents
Add aqueous wash chemical, OKEM Clean or equivalent.
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum
storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on
the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock
should be used promptly, preferably within 1.5 years of receipt.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1013_X7R_FT-CAP_SMD • 2/23/2018 14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Construction
Detailed Cross Section
Dielectric Material
(BaTiO3)
Barrier Layer
(Ni)
End Termination/
External Electrode
(Cu)
Termination Finish
(100% Matte Sn /
SnPb - 5% Pb min)
Epoxy Layer
(Ag)
Dielectric
Material (BaTiO3)
Inner Electrodes
(Ni)
End Termination/
External Electrode
(Cu)
Epoxy Layer
(Ag)
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn /
SnPb - 5% Pb min)
Inner Electrodes
(Ni)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1013_X7R_FT-CAP_SMD • 2/23/2018 15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Capacitor Marking (Optional):
These surface mount multilayer ceramic capacitors are
normally supplied unmarked. If required, they can be
marked as an extra cost option. Marking is available
on most KEMET devices but must be requested using
the correct ordering code identifier(s). If this option is
requested, two sides of the ceramic body will be laser
marked with a “K” to identify KEMET, followed by two
characters (per EIA–198 - see table below) to identify the
capacitance value. EIA 0603 case size devices are limited
to the “K” character only.
Marking appears in legible contrast. Illustrated below
is an example of an MLCC with laser marking of “KA8”,
which designates a KEMET device with rated capacitance
of 100 µF. Orientation of marking is vendor optional.
2-Digit
KEMET
Capacitance
ID
Code
Laser marking option is not available on:
• C0G, ultra stable X8R and Y5V dielectric devices.
• EIA 0402 case size devices.
• EIA 0603 case size devices with flexible termination
option.
• KPS commercial and automotive grade stacked
devices.
• X7R dielectric products in capacitance values outlined
below.
EIA Case Size
Metric Size Code
Capacitance
0603
0805
1206
1210
1808
1812
1825
2220
2225
1608
2012
3216
3225
4520
4532
4564
5650
5664
≤ 170 pF
≤ 150 pF
≤ 910 pF
≤ 2,000 pF
≤ 3,900 pF
≤ 6,700 pF
≤ 0.018 µF
≤ 0.027 µF
≤ 0.033 µF
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1013_X7R_FT-CAP_SMD • 2/23/2018 16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Capacitor Marking (Optional) cont’d
Capacitance (pF) For Various Alpha/Numeral Identifiers
Numeral
Alpha
Character
9
0
1
2
3
4
5
6
7
8
Capacitance (pF)
A
B
C
D
E
F
0.10
0.11
0.12
0.13
0.15
0.16
0.18
0.20
0.22
0.24
0.27
0.30
0.33
0.36
0.39
0.43
0.47
0.51
0.56
0.62
0.68
0.75
0.82
0.91
0.25
0.35
0.40
0.45
0.50
0.60
0.70
0.80
0.90
1.0
1.1
1.2
1.3
1.5
1.6
1.8
2.0
2.2
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
2.5
3.5
4.0
4.5
5.0
6.0
7.0
8.0
9.0
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
51
56
62
68
75
82
91
25
35
40
45
50
60
70
80
90
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
250
350
400
450
500
600
700
800
900
1,000
1,100
1,200
1,300
1,500
1,600
1,800
2,000
2,200
2,400
2,700
3,000
3,300
3,600
3,900
4,300
4,700
5,100
5,600
6,200
6,800
7,500
8,200
9,100
2,500
3,500
4,000
4,500
5,000
6,000
7,000
8,000
9,000
10,000 100,000 1,000,000 10,000,000
11,000 110,000 1,100,000 11,000,000
100,000,000
110,000,000
120,000,000
130,000,000
150,000,000
160,000,000
180,000,000
200,000,000
220,000,000
240,000,000
270,000,000
300,000,000
330,000,000
360,000,000
390,000,000
430,000,000
470,000,000
510,000,000
560,000,000
620,000,000
680,000,000
750,000,000
820,000,000
910,000,000
250,000,000
350,000,000
400,000,000
450,000,000
500,000,000
600,000,000
700,000,000
800,000,000
900,000,000
12,000 120,000 1,200,000 12,000,000
13,000 130,000 1,300,000 13,000,000
15,000 150,000 1,500,000 15,000,000
16,000 160,000 1,600,000 16,000,000
18,000 180,000 1,800,000 18,000,000
20,000 200,000 2,000,000 20,000,000
22,000 220,000 2,200,000 22,000,000
24,000 240,000 2,400,000 24,000,000
27,000 270,000 2,700,000 27,000,000
30,000 300,000 3,000,000 30,000,000
33,000 330,000 3,300,000 33,000,000
36,000 360,000 3,600,000 36,000,000
39,000 390,000 3,900,000 39,000,000
43,000 430,000 4,300,000 43,000,000
47,000 470,000 4,700,000 47,000,000
51,000 510,000 5,100,000 51,000,000
56,000 560,000 5,600,000 56,000,000
62,000 620,000 6,200,000 62,000,000
68,000 680,000 6,800,000 68,000,000
75,000 750,000 7,500,000 75,000,000
82,000 820,000 8,200,000 82,000,000
91,000 910,000 9,100,000 91,000,000
25,000 250,000 2,500,000 25,000,000
35,000 350,000 3,500,000 35,000,000
40,000 400,000 4,000,000 40,000,000
45,000 450,000 4,500,000 45,000,000
50,000 500,000 5,000,000 50,000,000
60,000 600,000 6,000,000 60,000,000
70,000 700,000 7,000,000 70,000,000
80,000 800,000 8,000,000 80,000,000
90,000 900,000 9,000,000 90,000,000
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
W
X
Y
Z
a
b
d
e
f
m
n
t
y
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1013_X7R_FT-CAP_SMD • 2/23/2018 17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with
EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for
details on reeling quantities for commercial chips.
ꢋar code label
Anti-static reel
®
ꢃmbossed plasticꢄ or
punched paper carrier.
Chip and ꢈPS orientation in pocꢇet
(except ꢁꢀ25 commercial, and ꢁꢀ25 and 2225 Military)
KEMET
Sprocꢇet holes
ꢃmbossment or punched caꢅity
ꢀ mm, ꢁ2 mm
or ꢁ6 mm carrier tape
Anti-static coꢅer tape
(0.ꢁ0 mm (0.00ꢆꢂ) maximum thicꢇness)
ꢁ7ꢀ mm (7.00ꢂ)
or
330 mm (ꢁ3.00ꢂ)
ꢄꢃꢉA 0ꢁ005, 020ꢁ, 0ꢆ02 and 0603 case siꢊes aꢅailable on punched paper carrier only.
Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm)
New 2 mm Pitch Reel Options*
Embossed Plastic Punched Paper
Tape
Packaging
Ordering Code
(C-Spec)
C-3190
7" Reel 13" Reel 7" Reel 13" Reel
EIA Case Size Size
(W)*
Packaging Type/Options
Pitch (P1)* Pitch (P1)*
01005 – 0402
0603
8
8
2
2
2/4
4
Automotive grade 7" reel unmarked
Automotive grade 13" reel unmarked
Commercial grade 7" reel unmarked
Commercial grade 13" reel unmarked
C-3191
2/4
4
C-7081
0805
8
4
4
4
C-7082
1206 – 1210
1805 – 1808
≥ 1812
8
4
4
4
4
* 2 mm pitch reel only available for 0603 EIA case size.
2 mm pitch reel for 0805 EIA case size under development.
12
12
12
16
8
4
8
8
Benefits of Changing from 4 mm to 2 mm Pitching Spacing
• Lower placement costs.
• Double the parts on each reel results in fewer reel
changes and increased efficiency.
• Fewer reels result in lower packaging, shipping and
storage costs, reducing waste.
KPS 1210
8
8
KPS 1812
and 2220
12
4
12
4
Array 0612
*Refer to Figures 1 and 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 and 7 for tolerance specifications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1013_X7R_FT-CAP_SMD • 2/23/2018 18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
T
T2
P2
ꢋꢄ0 pitches cumulatiꢁe
tolerance on tape ꢌ0.2 mmꢍ
ꢇꢄ
P0
ꢆD0
A0
F
ꢃ0
ꢀ
ꢇ2
ꢂꢄ
ꢂ0
Sꢄ
Pꢄ
Tꢄ
Coꢁer Tape
ꢇmbossment
For caꢁity siꢈe,
see ꢉote ꢄ Table ꢊ
Center Lines of Caꢁity
ꢆDꢄ
ꢂꢄ is for tape feeder reference only,
includinꢅ draft concentric about ꢂ0.
User Direction of Unreeling
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
D1 Minimum
Note 1
1.0
(0.039)
R Reference S1 Minimum
T
T1
Tape Size
8 mm
D0
E1
P0
P2
Note 2
Note 3
Maximum Maximum
25.0
(0.984)
1.5 +0.10/−0.0
(0.059 +0.004/−0.0)
1.75 ±0.10
4.0 ±0.10
2.0 ±0.05
0.600
(0.024)
0.600
(0.024)
0.100
(0.004)
12 mm
16 mm
(0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002)
1.5
(0.059)
30
(1.181)
Variable Dimensions — Millimeters (Inches)
B1 Maximum
Note 4
E2
T2
W
Tape Size
8 mm
Pitch
F
P1
A0,B0 & K0
Minimum
6.25
(0.246)
Maximum Maximum
2.5
(0.098)
4.35
(0.171)
3.5 ±0.05
(0.138 ±0.002) (0.157 ±0.004)
4.0 ±0.10
8.3
(0.327)
Single (4 mm)
Single (4 mm)
8.2
10.25
5.5 ±0.05
8.0 ±0.10
4.6
12.3
12 mm
16 mm
Note 5
and Double (8 mm)
(0.323)
(0.404)
(0.217 ±0.002) (0.315 ±0.004)
(0.181)
(0.484)
12.1
(0.476)
14.25
(0.561)
7.5 ±0.05 12.0 ±0.10
(0.138 ±0.002) (0.157 ±0.004)
4.6
(0.181)
16.3
(0.642)
Triple (12 mm)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment
location and hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481, paragraph 4.3, section b.)
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3.)
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see
Figure 4.)
(e) for KPS product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1013_X7R_FT-CAP_SMD • 2/23/2018 19
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
T
ꢈꢁ0 pitches cumulatiꢀe
tolerance on tape ꢉ0.2 mmꢊ
ꢃꢁ
Po
ꢂDo
A0
F
ꢄ
ꢃ2
ꢅ0
Pꢁ
ꢅottom Coꢀer Tape
G
Caꢀity Siꢆe,
See
Tꢁ
Tꢁ
Center Lines of Caꢀity
Top Coꢀer Tape
ꢇote ꢁ, Table 7
ꢅottom Coꢀer Tape
User Direction of Unreeling
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
R Reference
Note 2
Tape Size
8 mm
D0
E1
P0
P2
T1 Maximum
G Minimum
0.10
1.5 +0.10 -0.0
(0.059 +0.004 -0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
0.75
(0.030)
25
(0.984)
(0.004)
maximum
Variable Dimensions — Millimeters (Inches)
Tape Size
8 mm
Pitch
E2 Minimum
F
P1
T Maximum
W Maximum
A0 B0
2.0 ±0.05
(0.079 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
8.3
(0.327)
8.3
(0.327)
Half (2 mm)
Single (4 mm)
6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
1.1
(0.098)
Note 1
8 mm
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
c) rotation of the component is limited to 20° maximum (see Figure 3.)
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4.)
e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1013_X7R_FT-CAP_SMD • 2/23/2018 20
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
8 mm
Peel Strength
0.1 to 1.0 Newton (10 to 100 gf)
0.1 to 1.3 Newton (10 to 130 gf)
12 and 16 mm
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be
165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of
300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
°
T
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Typical Pocket Centerline
Tape
Maximum
°
°
T
s
Width (mm) Rotation (
)
8,12
16 – 200
20
10
Bo
Tape
Maximum
°
S
Width (mm) Rotation (
)
8,12
16 – 56
72 – 200
20
10
5
Typical Component Centerline
Ao
Figure 4 – Maximum Lateral Movement
Figure 5 – Bending Radius
Embossed
Carrier
Punched
Carrier
8 mm & 12 mm Tape
16 mm Tape
0.5 mm maximum
0.5 mm maximum
1.0 mm maximum
1.0 mm maximum
R
Bending
Radius
R
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1013_X7R_FT-CAP_SMD • 2/23/2018 21
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Figure 6 – Reel Dimensions
Full Radius,
ꢉ3 (ꢅncludes
flanꢊe distortion
at outer edꢊe)
Access ꢂole at
Slot Location
(ꢃ ꢄ0 mm minimum)
See ꢀote
ꢉ2 (Measured at hub)
D
(See ꢀote)
A
ꢀ
C
(Arbor hole
ꢉꢈ (Measured at hub)
diameter)
ꢅf present,
tape slot in core
for tape startꢆ
2.5 mm minimum ꢇidth x
ꢈ0.0 mm minimum depth
ꢁ
(see ꢀote)
ꢀoteꢆ Driꢋe spoꢌes optionalꢍ if used, dimensions ꢁ and D shall apply.
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
8 mm
A
B Minimum
C
D Minimum
178 ±0.20
(7.008 ±0.008)
or
1.5
(0.059)
13.0 +0.5/−0.2
(0.521 +0.02/−0.008)
20.2
(0.795)
12 mm
16 mm
330 ±0.20
(13.000 ±0.008)
Variable Dimensions — Millimeters (Inches)
Tape Size
8 mm
N Minimum
W1
W2 Maximum
W3
8.4 +1.5/−0.0
(0.331 +0.059/−0.0)
14.4
(0.567)
50
(1.969)
12.4 +2.0/−0.0
18.4
Shall accommodate tape
width without interference
12 mm
16 mm
(0.488 +0.078/−0.0)
(0.724)
16.4 +2.0/−0.0
(0.646 +0.078/−0.0)
22.4
(0.882)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1013_X7R_FT-CAP_SMD • 2/23/2018 22
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Figure 7 – Tape Leader & Trailer Dimensions
ꢃmbossed Carrier
Carrier Tape
Punched Carrier
ꢇ mm ꢈ ꢀ2 mm only
Round Sprocꢁet ꢂoles
START
END
Top Coꢆer Tape
ꢃlonꢄated Sprocꢁet ꢂoles
(32 mm tape and ꢅider)
ꢀ00 mm
minimum Leader
ꢉ00 mm minimum
Trailer
Components
ꢀ60 mm minimum
Top Coꢆer Tape
Figure 8 – Maximum Camber
ꢄlonꢃated Sprocꢀet ꢁoles
(32 mm ꢅ ꢆider tapes)
Carrier Tape
Round Sprocꢀet ꢁoles
ꢂ mm maximum, either direction
Straiꢃht ꢄdꢃe
250 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1013_X7R_FT-CAP_SMD • 2/23/2018 23
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
KEMET Electronics Corporation Sales Offices
For a complete list of our global sales offices, please visit www.kemet.com/sales.
Disclaimer
All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for
checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.
All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such
applications, but are not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use.
The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any
technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no
obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component
failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards
(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or
property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other
measures may not be required.
KEMET is a registered trademark of KEMET Electronics Corporation.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1013_X7R_FT-CAP_SMD • 2/23/2018 24
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