C1206X154MBRALTU_技术文档

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System (HV FT-CAP)

X7R Dielectric, 500 – 3,000 VDC (Commercial Grade)

Overview

KEMET’s High Voltage with Flexible Termination (HV FT-CAP)

surface mount MLCCs in X7R dielectric address the primary

failure mode of MLCCs– ﬂex cracks, which are typically the

result of excessive tensile and shear stresses produced

during board ﬂexure and thermal cycling. Featuring several

of the highest CV (capacitance/voltage) values available in

the industry, these devices utilize a pliable and conductive

silver epoxy between the base metal and nickel barrier layers

of the termination system. The addition of this epoxy layer

inhibits the transfer of board stress to the rigid ceramic

body, therefore mitigating ﬂex cracks which can result in

low IR or short circuit failures. Although ﬂexible termination

technology does not eliminate the potential for mechanical

damage that may propagate during extreme environmental

and handling conditions, it does provide superior ﬂex

performance over standard termination systems.

Combined with the stability of an X7R dielectric and designed

to accommodate all capacitance requirements, these ﬂex-

robust devices are RoHS-compliant, offer up to 5 mm of

ﬂex-bend capability and exhibits a predictable change in

capacitance with respect to time and voltage. Capacitance

change with reference to ambient temperature is limited to

±15% from −55°C to +125°C.

In addition to Commercial Grade, Automotive Grade devices are

available which meet the demanding Automotive Electronics

Council's AEC-Q200 qualiﬁcation requirements.

The HV FT-CAP offers low leakage current, exhibits low ESR

at high frequencies and ﬁnds conventional use as snubbers

or ﬁlters in applications such as switching power supplies

and lighting ballasts. Their exceptional performance at high

frequencies has made them a preferred choice of design

engineers worldwide. In addition to their use in power

supplies, these capacitors are widely used in industries

related to automotive(hybrid), telecommunications, medical,

military, aerospace, semiconductors and test/diagnostic

equipment.

Click image above for interactive 3D content

Open PDF in Adobe Reader for full functionality

Ordering Information

C

1210

X

154

K

C

R

A

C

TU

Case Size Speciﬁcation/ Capacitance Capacitance Rated Voltage

Failure Rate/

Design

Packaging/

Grade (C-Spec)

Ceramic

Dielectric

R = X7R

Termination Finish¹

(L" x W")

Series

Code (pF)

Tolerance

(VDC)

0603

0805

1206

1210

1808

1812

1825

2220

2225

X = Flexible

Termination

Two

J = ±5%

K = ±10%

M = ±20%

C = 500

B = 630

D = 1,000

F = 1,500

G = 2,000

Z = 2,500

H = 3,000

A = N/A

C = 100% Matte Sn

L = SnPb

(5% Pb minimum)

See

"Packaging

C-Spec

Ordering

Options Table"

below

signiﬁcant

digits +

number of

zeros.

¹Additional termination ﬁnish options may be available. Contact KEMET for details.

One world. One KEMET

C1025_X7R_HV_FT-CAP_SMD • 7/29/2016

1

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade)

Packaging C-Spec Ordering Options Table

Packaging/Grade

Packaging Type₁

Ordering Code (C-Spec)

Bulk Bag/Unmarked

7" Reel/Unmarked

Not required (Blank)

TU

7411 (EIA 0603 and smaller case sizes)

7210 (EIA 0805 and larger case sizes)

13" Reel/Unmarked

7" Reel/Marked

TM

7040 (EIA 0603 and smaller case sizes)

7215 (EIA 0805 and larger case sizes)

13" Reel/Marked

7" Reel/Unmarked/2mm pitch²

13" Reel/Unmarked/2mm pitch²

7081

7082

¹Default packaging is "Bulk Bag". An ordering code C-Spec is not required for "Bulk Bag" packaging.

¹The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors

that have not been laser marked. Please contact KEMET if you require a laser marked option. For more information see "Capacitor Marking".

²The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case

size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".

Beneﬁts

• −55°C to +125°C operating temperature range

• Industry-leading CV values

• Capacitance offerings ranging from 10 pF to 560 nF

• Available capacitance tolerances of ±5%, ±10% or ±20%

• Low ESR and ESL

• Non-polar device, minimizing installation concerns

• Automotive (AEC–Q200) Grade available

• 100% pure matte tin-plated termination ﬁnish allowing for

excellent solderability

• Superior ﬂex performance (up to 5 mm)

• Exceptional performance at high frequencies

• Lead (Pb)-free, RoHS and REACH compliant

• EIA 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2220,

and 2225 case sizes

• DC voltage ratings of 500 V, 630 V, 1 KV, 1.5 KV, 2 KV,

2.5 KV, and 3 KV

• SnPb plated termination ﬁnish option available upon

request (5% Pb minimum)

Applications

Typical applications include switch mode power supplies (input ﬁlters, resonators, tank circuits, snubber circuits, output

ﬁlters), high voltage coupling and DC blocking, lighting ballasts, voltage multiplier circuits, DC/DC converters and coupling

capacitors in Ćuk converters. Markets include power supply, LCD ﬂuorescent backlight ballasts, HID lighting, telecom

equipment, industrial and medical equipment/control, LAN/WAN interface, analog and digital modems, and automotive

(electric and hybrid vehicles, charging stations and lighting applications).

Application Note

X7R dielectric is not recommended for AC line ﬁltering or pulse applications. These capacitors and/or the assembled circuit

board containing these capacitors may require a protective surface coating to prevent external surface arcing.

C1025_X7R_HV_FT-CAP_SMD • 7/29/2016

2

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade)

Dimensions – Millimeters (Inches)

L

ꢁ

T

ꢀ

S

EIA Size

Code

Metric Size

Code

L

W

Width

T

B

Mounting

Technique

Separation

Minimum

Length

Thickness

Bandwidth

1.60 (0.063)

±0.17 (0.007)

0.80 (0.032)

±0.15 (0.006)

0.45 (0.018)

±0.15 (0.006)

0603

0805

1206

1210

1808

1812

1825

2220

2225

1608

2012

3216

3225

4520

4532

4564

5650

5664

0.58 (0.023)

2.00 (0.079)

±0.30 (0.012)

1.25 (0.049)

±0.30 (0.012)

0.50 (0.02)

±0.25 (0.010)

Solder Wave or

Solder Reﬂow

0.75 (0.030)

3.30 (0.130)

±0.40 (0.016)

1.60 (0.063)

±0.35 (0.013)

0.60 (0.024)

±0.25 (0.010)

3.30 (0.130)

±0.40 (0.016)

2.60 (0.102)

±0.30 (0.012)

0.60 (0.024)

±0.25 (0.010)

4.70 (0.185)

±0.50 (0.020)

2.00 (0.079)

±0.20 (0.008)

See Table 2 for

Thickness

0.70 (0.028)

±0.35 (0.014)

4.50 (0.178)

±0.40 (0.016)

3.20 (0.126)

±0.30 (0.012)

0.70 (0.028)

±0.35 (0.014)

N/A

Solder Reﬂow

Only

4.60 (0.181)

±0.40 (0.016)

6.40 (0.252)

±0.40 (0.016)

0.70 (0.028)

±0.35 (0.014)

5.90 (0.232)

±0.75 (0.030)

5.00 (0.197)

±0.40 (0.016)

0.70 (0.028)

±0.35 (0.014)

5.90 (0.232)

±0.75 (0.030)

6.40 (0.248)

±0.40 (0.016)

0.70 (0.028)

±0.35 (0.014)

Qualiﬁcation/Certiﬁcation

Commercial Grade products are subject to internal qualiﬁcation. Details regarding test methods and conditions are

referenced in Table 4, Performance & Reliability.

Environmental Compliance

Lead (Pb)-free, RoHS, and REACH compliant without exemptions (excluding SnPb termination ﬁnish option).

C1025_X7R_HV_FT-CAP_SMD • 7/29/2016

3

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade)

Electrical Parameters/Characteristics

Item

Parameters/Characteristics

Operating Temperature Range

−55°C to +125°C

±15%

Capacitance Change with Reference to

+25°C and 0 Vdc Applied (TCC)

¹Aging Rate (Maximum % Capacitance Loss/Decade Hour)

3.0%

150% of rated voltage for voltage rating of < 1000V

120% of rated voltage for voltage rating of ≥ 1000V

(5±1 seconds and charge/discharge not exceeding 50mA)

²Dielectric Withstanding Voltage (DWV)

³Dissipation Factor (DF) Maximum Limit at 25°C

⁴Insulation Resistance (IR) Minimum Limit at 25°C

2.5%

See Insulation Resistance Limit Table

(500VDC applied for 120±5 seconds at 25°C)

¹Regarding Aging Rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.

²DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the

capacitor.

³Capacitance and dissipation factor (DF) measured under the following conditions:

1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance ≤10µF

120Hz ± 10Hz and 0.5 ± 0.1 Vrms if capacitance >10µF

⁴To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.

Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as

Automatic Level Control (ALC). The ALC feature should be switched to "ON".

Post Environmental Limits

High Temperature Life, Biased Humidity, Moisture Resistance

Rated DC

Voltage

Capacitance

Value

Dissipation

Factor (%)

Capacitance

Shift

Insulation

Resistance

Dielectric

X7R

> 25

16/25

< 16

3.0

5.0

7.5

10% of Initial

Limit

All

±20%

Insulation Resistance Limit Table (X7R Dielectric)

1,000 Megohm

EIA Case Size

100 Megohm

Microfarads or 10 GΩ

Microfarads or 100 GΩ

0603

0805

1206

1210

1808

1812

1825

2220

2225

N/A

All

< .0039 µF

< 0.012 µF

< 0.033 µF

< 0.018 µF

< 0.027 µF

< 0.120 uF

< 0.150 uF

< 0.180 uF

≥ .0039 µF

≥ 0.012 µF

≥ 0.033 µF

≥ 0.018 µF

≥ 0.027 µF

≥ 0.120 uF

≥ 0.150 uF

≥ 0.180 uF

C1025_X7R_HV_FT-CAP_SMD • 7/29/2016

4

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade)

Table 1A – Capacitance Range/Selection Waterfall (0603 – 1812 Case Sizes)

Case Size/

Series

Voltage Code

C0603X C0805X

C1206X

C1210X

C1808X

C1812X

Cap

Code

C

B

D

C

B

D

C

B

D

F

G

C

B

D

F

G

C

B

D

F

G

Z

H

C

B

D

F

G

Z

H

Cap

Rated Voltage

(VDC)

Capacitance

Tolerance

Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions

10 pF

11 pF

12 pF

13 pF

15 pF

16 pF

18 pF

20 pF

22 pF

24 pF

27 pF

30 pF

33 pF

36 pF

39 pF

43 pF

47 pF

51 pF

56 pF

62 pF

68 pF

75 pF

82 pF

91 pF

100 pF

110 pF

120 pF

130 pF

150 pF

180 pF

220 pF

270 pF

330 pF

390 pF

470 pF

560 pF

680 pF

820 pF

1,000 pF

1,200 pF

1,500 pF

1,800 pF

2,200 pF

2,700 pF

3,300 pF

3,900 pF

4,700 pF

5,600 pF

6,800 pF

8,200 pF

10,000 pF

12,000 pF

100

110

120

130

150

160

180

200

220

240

270

300

330

360

390

430

470

510

560

620

680

750

820

910

101

111

121

131

151

181

221

271

331

391

471

561

681

821

102

122

152

182

222

272

332

392

472

562

682

822

103

123

J

K

M

DG DG DG ES ES ES ES ES FM FM FM FM FM LB LB LB LB LB LB LB GK GK GK GK GK GK GK

DG DG DG ES ES ES ES EF FM FM FM FM FM LB LB LB LB LB LB LB GK GK GK GK GK GK GK

DG DG DG ES ES ES ES EF FM FM FM FM FM LB LB LB LB LB LC LB GK GK GK GK GK GK GK

DG DG DG ES ES ES ES EU FM FM FM FM FM LB LB LB LB LB LC LB GK GK GK GK GK GK GK

DG DG DG ES ES ES ES EU FM FM FM FM FM LA LA LA LA LB LC LB GG GG GG GG GG GG GK

DG DG DG ES ES ES ES EU FZ FZ FZ FM FM LB LB LB LB LB LB LB GK GK GK GK GK GK GK

DG DG DG ES ES ES EF EU FZ FZ FZ FM FM LB LB LB LB LB LB LB GK GK GK GK GK GK GK

DG DG DG ES ES ES EF EF FZ FZ FZ FM FM LB LB LB LB LB LB LB GK GK GK GK GK GK GK

DG DG DG ES ES ES EF EF FZ FZ FZ FK FK LC LC LC LC LC LC LC GK GK GK GK GK GK GK

DG DG DG ES ES EF EF EF FZ FZ FZ FK FK LC LC LC LC LC LC LC GK GK GK GK GK GK GK

DG DG DG ES ES EF EF EF FZ FZ FZ FK FS LB LB LB LB LB LB LC GK GK GK GK GK GK GK

DG DG DG ES ES EF EF EF FZ FM FM FS FS LB LB LB LB LB LB LC GK GK GK GK GK GK GK

DG DG DG ES ES EF EF EF FL FL FL FL FL LB LB LB LB LB LB LC GH GH GH GH GH GK GK

DG DG DG ES ES EF EF EF FL FL FL FL FL LA LA LA LA LB LC LC GH GH GH GH GH GK GK

DG DG DG ES ES ES EF EF FL FL FL FL FL LA LA LA LA LB LC LC GH GH GH GH GH GK GK

CG CG CG DG DG DG ES ES ES EF EF FL FL FL FL FL LA LA LA LA LB LC LC GH GH GH GH GH GK GK

CG CG

CG

DG DG DG ES ES ES EU EU FL FL FL FL FM LB LB LB LB LC LA

DG DG DG ES ES ES EU EU FL FL FL FL FM LB LB LB LB LC LB

DG DG DG ES ES ES EU EU FL FL FL FL FM LB LB LB LB LC LC

DG DG DG ES ES ES EU EU FL FL FL FL FM LA LA LA LB LC LC

GH GH GH GH GH GK GK

GH GH GH GH GH GK

GH GH GH GH GK GM

GH GH GH GH GK GO

GH GH GH GH GH GO

GH GH GH GK GK

GH GH GH GK GM

GH GH GH GK GO

GH GK GK GK

DG DG DG ES ES ES EU

DG DG DG ES EF EF EF

FL FL FL FL FM LA LA LA LB LC

FL FL FL FL FM LA LA LA LB LA

FL FL FL FL FK LA LA LA LB LB

FL FL FL FL FK LA LA LA LB LC

FL FL FL FM FK LA LB LB LC

FL FL FL FM FS LA LB LB LC

CG

DG DG

EF EF EF EF

EF EU EU EF

EF EU EU EU

EU EJ EJ

FL FL FL FK

LA LB LB LC

LA LC LC LB

Rated Voltage

(VDC)

Cap

Code

Voltage Code

C

B

D

C

B

D

C

B

D

F

G

C

B

D

F

G

C

B

D

F

G

Z

H

C

B

D

F

G

Z

H

Cap

Case Size/

Series

C0603X

C0805X

C1206X

C1210X

C1808X

C1812X

KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage

capability within the same form factor (conﬁguration and dimensions).

C1025_X7R_HV_FT-CAP_SMD • 7/29/2016

5

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade)

Table 1A – Capacitance Range/Selection Waterfall (0603 – 1812 Case Sizes) cont'd

Case Size/

Series

Voltage Code

C0603X C0805X

C1206X

C1210X

C1808X

C1812X

Cap

Code

C

B

D

C

B

D

C

B

D

F

G

C

B

D

F

G

C

B

D

F

G

Z

H

C

B

D

F

G

Z

H

Cap

Rated Voltage

(VDC)

Capacitance

Tolerance

Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions

15,000 pF

18,000 pF

22,000 pF

27,000 pF

33,000 pF

39,000 pF

47,000 pF

56,000 pF

62,000 pF

68,000 pF

82,000 pF

0.10 µF

0.12 µF

0.15 µF

0.18 µF

0.22 µF

0.27 µF

0.33 µF

153

183

223

273

333

393

473

563

623

683

823

104

124

154

184

224

274

334

J

K

M

DG

EU EJ EJ

EJ EJ EJ

EJ EJ

EJ

FL FL FL FL

FL FL FL FM

FL FM FM FM

FM FK FK FK

FM FZ FU FS

FK FZ FU FS

FK FU FK

FZ FU FK

FZ FK FS

FU FK

LA LC LC LC

LA LE LE

LA LA LA

LC LA LA

LC LA LB

LA LA LC

LA LC

GH GK GK GH

GH GK GK GM

GH GB GB GO

GH GB GB

GH GB GC

GH GB GE

GK GB GE

GE GE GE

GB GE GK

GB GH GJ

GE GK

EJ

FK FS

FK

LA LC

LA

LB

GE GN

GF

GJ

GL

GS

Rated Voltage

(VDC)

Cap

Code

Voltage Code

C

B

D

C

B

D

C

B

D

F

G

C

B

D

F

G

C

B

D

F

G

Z

H

C

B

D

F

G

Z

H

Cap

Case Size/

Series

C0603X

C0805X

C1206X

C1210X

C1808X

C1812X

KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage

capability within the same form factor (conﬁguration and dimensions).

C1025_X7R_HV_FT-CAP_SMD • 7/29/2016

6

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade)

Table 1B – Capacitance Range/Selection Waterfall (1825 – 2225 Case Sizes)

Case Size/

Series

Voltage Code

C1825X

C2220X

C2225X

Cap

Code

C

B

D

F

G

Z

H

C

B

D

F

G

Z

H

C

B

D

F

G

Z

H

Capacitance

Rated Voltage (VDC)

Capacitance

Tolerance

Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions

470 pF

560 pF

680 pF

471

561

681

821

102

122

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

623

683

823

104

124

154

184

224

274

334

394

474

564

J

K

M

HG HG HG HG HG HG HG JK JK JK JK JK JK JK

HG HG HG HG HG HG HG JK JK JK JK JK JK JK KF KF KF KF KF KF KF

HE HE HE HE HE HG HG JK JK JK JK JK JK JK KF KF KF KF KF KF KF

820 pF

1,000 pF

1,200 pF

1,500 pF

1,800 pF

2,200 pF

2,700 pF

3,300 pF

3,900 pF

4,700 pF

5,600 pF

6,800 pF

8,200 pF

10,000 pF

12,000 pF

15,000 pF

18,000 pF

22,000 pF

27,000 pF

33,000 pF

39,000 pF

47,000 pF

56,000 pF

62,000 pF

68,000 pF

82,000 pF

0.10 µF

HE HE HE HE HE HG HG JE

JE

JE JK JK KF KF KF KF KF KF KF

JE JK JK KE KE KE KE KE KF KE

JE JK JE KE KE KE KE KE KF KE

HE HE HE HE HE HG

HE HE HE HE HE HJ

HE HE HE HE HJ HK

HE HE HE HG HJ

HE HE HE HG HK

HE HE HE HG

HE HG HG HG

HE HG HG HE

HE HG HG HG

HE HG HG HJ

HG HG HG HK

HG HJ HJ HK

HG HJ HJ

JE

JE JK JE

JE KE KE KE KE KE KF KE

JE KE KE KE KE KF KE KE

JE JK JK JK KE KE KE KE KF KF KF

JE

JL

JL KE KE KE KE KF KH KH

JE JK JK JK

JE JK JK JK JN JN JN KE KE KE KE KF KJ KJ

JE JK JK JK JN

JE JK JK JK

JE JK JK JE

JE JK JK JK

JE

KE KE KE KE KH

KE KF KF KF KJ

KE KF KF KF

KF KF KF KH

KE KF KF KJ

KE KH KH KJ

KE KH KH

KF KJ KJ

KF KE

KF KF

KF KH

KH KJ

KJ

JE

JL

JE JK JK

JE JL

JL JN

HG HK HK

HG HE

JE JN JN

JK JE

0.12 µF

0.15 µF

0.18 µF

0.22 µF

0.27 µF

0.33 µF

0.39 µF

0.47 µF

HG HG

JK JE

HG HJ

JK JK

HJ HJ

JK

JL

HJ

HK

JL JN

JN

0.56 µF

Rated Voltage (VDC)

Voltage Code

C

B

D

F

G

Z

H

C

B

D

F

G

Z

H

C

B

D

F

G

Z

H

Capacitance

Cap Code

Case Size/ Series

C1825X

C2220X

C2225X

KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage

capability within the same form factor (conﬁguration and dimensions).

C1025_X7R_HV_FT-CAP_SMD • 7/29/2016

7

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade)

Table 2A – Chip Thickness/Tape & Reel Packaging Quantities

Paper Quantity¹

7" Reel 13" Reel

Plastic Quantity

7" Reel 13" Reel

Thickness Case Thickness ±

Code

Size¹Range (mm)

CG

DG

ES

EF

EU

EJ

FZ

FL

FU

FM

FK

FS

LE

LA

LB

LC

GB

GC

GE

GH

GF

GG

GK

GJ

GN

GL

GM

GS

GO

HE

HG

HJ

HK

JE

0603

0805

1206

1210

1808

1812

1825

2220

2225

0.80 ± 0.10

1.25 ± 0.15

1.00 ± 0.20

1.20 ± 0.15

1.60 ± 0.25

1.70 ± 0.20

1.25 ± 0.20

1.40 ± 0.15

1.55 ± 0.20

1.70 ± 0.20

2.10 ± 0.20

2.50 ± 0.30

1.00 ± 0.10

1.40 ± 0.15

1.60 ± 0.15

2.00 ± 0.15

1.00 ± 0.10

1.10 ± 0.10

1.30 ± 0.10

1.40 ± 0.15

1.50 ± 0.10

1.55 ± 0.10

1.60 ± 0.20

1.70 ± 0.15

1.70 ± 0.20

1.90 ± 0.20

2.00 ± 0.20

2.10 ± 0.20

2.50 ± 0.20

1.40 ± 0.15

1.60 ± 0.20

2.00 ± 0.20

2.50 ± 0.20

1.40 ± 0.15

1.60 ± 0.20

2.00 ± 0.20

2.50 ± 0.20

1.40 ± 0.15

1.60 ± 0.20

2.00 ± 0.20

2.50 ± 0.20

4,000

0

15,000

0

2,500

2,000

2,500

2,000

1,000

2,500

1,000

500

10,000

8,000

10,000

8,000

4,000

10,000

4,000

2,000

4,000

2,000

4,000

2,000

4,000

2,000

500

1,000

500

0

1,000

500

JK

JL

JN

KE

KF

KH

KJ

500

1,000

500

7" Reel

13" Reel

7" Reel

13" Reel

Thickness

Code

Case

Size¹

Thickness ±

Range (mm)

Paper Quantity¹

Plastic Quantity

Package quantity based on ﬁnished chip thickness speciﬁcations.

¹If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA 0603

(1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".

C1025_X7R_HV_FT-CAP_SMD • 7/29/2016

8

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade)

Table 2B – Bulk Packaging Quantities

Loose Packaging

Packaging Type

Bulk Bag (default)

Packaging C-Spec¹

N/A²

Case Size

Packaging Quantities (pieces/unit packaging)

EIA (in)

Metric (mm)

Minimum

Maximum

0402

0603

0805

1206

1210

1808

1812

1825

2220

2225

1005

1608

2012

3216

3225

4520

4532

4564

5650

5664

50,000

1

20,000

¹The "Packaging C-Spec" is a 4 to 8 digit code which identiﬁes the packaging type and/or product grade. When ordering, the proper code must be

included in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details.

Commercial Grade product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk

bag packaging option for Automotive Grade products.

²A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and Automotive Grade products). The

15th through 22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our

standard "Bulk Bag" packaging.

C1025_X7R_HV_FT-CAP_SMD • 7/29/2016

9

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade)

Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351

Density Level A:

Maximum (Most)

Land Protrusion (mm)

Density Level B:

Median (Nominal)

Land Protrusion (mm)

Density Level C:

Minimum (Least)

Land Protrusion (mm)

EIA

Size

Code

Metric

Size

Code

C

Y

X

V1

V2

C

Y

X

V1

V2

C

Y

X

V1

V2

0603

0805

1206

1210

1808

1812

1825

2220

2225

1608

2012

3216

3225

4520

4532

4564

5650

5664

0.85

1.25

1.10

4.00

2.10

0.75

1.05

1.00

3.10

1.50

0.65

0.85

0.90

2.40

1.20

0.99

1.59

2.30

2.10

2.15

2.85

1.44

1.62

1.75

1.80

2.10

1.66

2.06

3.01

2.30

3.60

6.90

5.50

6.90

4.47

5.85

5.90

7.40

7.00

7.10

8.80

2.71

3.06

4.01

3.30

4.60

7.90

6.50

7.90

0.89

1.49

2.20

2.00

2.05

2.75

1.24

1.42

1.55

1.60

1.90

1.56

1.96

2.91

2.20

3.50

6.80

5.40

6.80

3.57

4.95

6.50

6.10

6.20

7.90

2.11

2.46

3.41

2.70

4.00

7.30

5.90

7.30

0.79

1.39

2.10

1.90

1.95

2.65

1.04

1.22

1.35

1.40

1.70

1.46

1.86

2.81

2.10

3.40

6.70

5.30

6.70

2.42

4.25

5.80

5.40

5.50

7.20

1.81

2.16

3.11

2.40

3.70

7.00

5.60

7.00

Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reﬂow

solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reﬂow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform

qualiﬁcation testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).

Image below based on Density Level B for an EIA 1210 case size.

Vꢁ

ꢀ

Vꢂ

X

C

Grid ꢃlacement Courtyard

C1025_X7R_HV_FT-CAP_SMD • 7/29/2016 10

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade)

Soldering Process

Recommended Soldering Technique:

• Solder wave or solder reﬂow for EIA case sizes 0603, 0805 and 1206

• All other EIA case sizes are limited to solder reﬂow only

Recommended Reﬂow Soldering Proﬁle:

KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),

convection, IR or vapor phase reﬂow techniques. Preheating of these components is recommended to avoid extreme thermal

stress. KEMET’s recommended proﬁle conditions for convection and IR reﬂow reﬂect the proﬁle conditions of the IPC/J-

STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reﬂow passes at

these conditions.

Termination Finish

T_ꢁ

T_L

t_ꢁ

Proﬁle Feature

Maximum Ramp ꢂp Rate ꢃ 3ꢄCꢅsec

Maximum Ramp Down Rate ꢃ ꢆꢄCꢅsec

SnPb

100% Matte Sn

t_L

Preheat/Soak

Temperature Minimum (T_Smin

)

100°C

150°C

200°C

T_smax

T_smin

Temperature Maximum (T_Smax

Time (t_S) from T_Sminto T_Smax

)

60 – 120 seconds

t_s

3°C/second

maximum

3°C/second

maximum

Ramp-Up Rate (T_Lto T_P)

ꢀ5

ꢀ5ꢄC to ꢁeaꢇ

Liquidous Temperature (T_L)

Time Above Liquidous (t_L)

Peak Temperature (T_P)

183°C

60 – 150 seconds

235°C

217°C

60 – 150 seconds

260°C

Time

Time Within 5°C of Maximum

20 seconds

maximum

30 seconds

maximum

Peak Temperature (t_P)

6°C/second

maximum

6°C/second

maximum

Ramp-Down Rate (T_Pto T_L)

Time 25°C to Peak

6 minutes

maximum

8 minutes

maximum

Temperature

Note 1: All temperatures refer to the center of the package, measured on the

capacitor body surface that is facing up during assembly reﬂow.

C1025_X7R_HV_FT-CAP_SMD • 7/29/2016 11

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade)

Table 4 – Performance & Reliability: Test Methods and Conditions

Stress

Reference

Test or Inspection Method

Terminal Strength

JIS–C–6429

Appendix 1, Note: Force of 1.8 kg for 60 seconds.

Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm

for C0G. Flexible termination system – 3.0 mm (minimum).

Board Flex

JIS–C–6429

Magniﬁcation 50 X. Conditions:

a) Method B, 4 hours at 155°C, dry heat at 235°C

b) Method B at 215°C category 3

Solderability

J–STD–002

c) Method D, category 3 at 260°C

Temperature Cycling

Biased Humidity

JESD22 Method JA–104 1,000 cycles (−55°C to +125°C). Measurement at 24 hours +/−4 hours after test conclusion.

Load Humidity: 1,000 hours 85°C/85% RH and 200 VDC maximum. Add 100 K ohm resistor.

Measurement at 24 hours +/−4 hours after test conclusion.

MIL–STD–202 Method

103

Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.

Measurement at 24 hours +/−4 hours after test conclusion.

MIL–STD–202 Method

106

t = 24 hours/cycle. Steps 7a and 7b not required. Measurement at 24 hours +/−4 hours after

Moisture Resistance

Thermal Shock

test conclusion.

MIL–STD–202 Method

107

−55°C/+125°C. Note: Number of cycles required – 300. Maximum transfer time – 20

seconds. Dwell time – 15 minutes. Air – Air.

MIL–STD–202 Method

High Temperature Life

Storage Life

1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 1.2 X rated voltage applied.

108

MIL–STD–202 Method

108

150°C, 0 VDC for 1,000 hours.

5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7

secure points on one long side and 2 secure points at corners of opposite sides. Parts

mounted within 2" from any secure point. Test from 10 – 2,000 Hz

MIL–STD–202 Method

204

Vibration

MIL–STD–202 Method

213

Mechanical Shock

Figure 1 of Method 213, Condition F.

MIL–STD–202 Method

Resistance to Solvents

Add aqueous wash chemical, OKEM Clean or equivalent.

215

Storage and Handling

Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in

other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,

and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp

and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum

storage humidity not exceed 70% relative humidity. Temperature ﬂuctuations should be minimized to avoid condensation on

the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock

should be used promptly, preferably within 1.5 years of receipt.

C1025_X7R_HV_FT-CAP_SMD • 7/29/2016 12

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade)

Construction

Detailed Cross Section

Dielectric Material

(ꢀaTiꢁ₃)

ꢀarrier Layer

(ꢂi)

ꢄnd Terminationꢇ

ꢄxternal ꢄlectrode

(Cu)

Termination Finish

(ꢅ00ꢆ Matte Sn ꢇ

Snꢈb ꢉ 5ꢆ ꢈb min)

ꢄpoxy Layer

(ꢊg)

Dielectric

Material (ꢀaTiꢁ₃)

ꢃnner ꢄlectrodes

(ꢂi)

ꢄnd Terminationꢇ

ꢄxternal ꢄlectrode

(Cu)

ꢄpoxy Layer

(ꢊg)

ꢀarrier Layer

(ꢂi)

Termination Finish

(ꢅ00ꢆ Matte Sn ꢇ

Snꢈb ꢉ 5ꢆ ꢈb min)

ꢃnner ꢄlectrodes

(ꢂi)

C1025_X7R_HV_FT-CAP_SMD • 7/29/2016 13

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade)

Capacitor Marking (Optional):

These surface mount multilayer ceramic capacitors are

normally supplied unmarked. If required, they can be

marked as an extra cost option. Marking is available

on most KEMET devices but must be requested using

the correct ordering code identiﬁer(s). If this option is

requested, two sides of the ceramic body will be laser

marked with a “K” to identify KEMET, followed by two

characters (per EIA–198 - see table below) to identify the

capacitance value. EIA 0603 case size devices are limited

to the “K” character only.

• X7R dielectric products in capacitance values outlined

below

Marking appears in legible contrast. Illustrated below is an

example of an MLCC with laser marking of “KA8”, which

designates a KEMET device with rated capacitance of 100 µF.

Orientation of marking is vendor optional.

ꢃꢄDigit

ꢀꢁMꢁT

Capacitance

ꢂD

Code

Laser marking option is not available on:

• C0G, Ultra Stable X8R and Y5V dielectric devices

• EIA 0402 case size devices

• EIA 0603 case size devices with Flexible Termination

option.

• KPS Commercial and Automotive Grade stacked devices.

EIA Case Size

Metric Size Code

Capacitance

0603

0805

1206

1210

1808

1812

1825

2220

2225

1608

2012

3216

3225

4520

4532

4564

5650

5664

≤ 170 pF

≤ 150 pF

≤ 910 pF

≤ 2,000 pF

≤ 3,900 pF

≤ 6,700 pF

≤ 0.018 µF

≤ 0.027 µF

≤ 0.033 µF

C1025_X7R_HV_FT-CAP_SMD • 7/29/2016 14

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade)

Capacitor Marking (Optional) cont’d

Capacitance (pF) For Various Alpha/Numeral Identiﬁers

Numeral

Alpha

Character

9

0

1

2

3

4

5

6

7

8

Capacitance (pF)

A

B

C

D

E

F

0.1

0.11

0.12

0.13

0.15

0.16

0.18

0.2

1 0

1.1

1 2

1 3

1 5

1 6

1 8

2 0

2 2

2.4

2.7

3 0

3 3

3 6

3 9

4 3

4.7

5.1

5 6

6 2

6 8

7 5

8 2

9.1

2 5

3 5

4 0

4 5

5 0

6 0

7 0

8 0

9 0

10

11

12

13

15

16

18

20

22

24

27

30

33

36

39

43

47

51

56

62

68

75

82

91

25

35

40

45

50

60

70

80

90

100

110

120

130

150

160

180

200

220

240

270

300

330

360

390

430

470

510

560

620

680

750

820

910

250

350

400

450

500

600

700

800

900

1,000

1,100

1,200

1,300

1,500

1,600

1,800

2,000

2,200

2,400

2,700

3,000

3,300

3,600

3,900

4,300

4,700

5,100

5,600

6,200

6,800

7,500

8,200

9,100

2,500

3,500

4,000

4,500

5,000

6,000

7,000

8,000

9,000

10,000 100,000 1,000,000 10,000,000

11,000 110,000 1,100,000 11,000,000

100,000,000

110,000,000

120,000,000

130,000,000

150,000,000

160,000,000

180,000,000

200,000,000

220,000,000

240,000,000

270,000,000

300,000,000

330,000,000

360,000,000

390,000,000

430,000,000

470,000,000

510,000,000

560,000,000

620,000,000

680,000,000

750,000,000

820,000,000

910,000,000

250,000,000

350,000,000

400,000,000

450,000,000

500,000,000

600,000,000

700,000,000

800,000,000

900,000,000

12,000 120,000 1,200,000 12,000,000

13,000 130,000 1,300,000 13,000,000

15,000 150,000 1,500,000 15,000,000

16,000 160,000 1,600,000 16,000,000

18,000 180,000 1,800,000 18,000,000

20,000 200,000 2,000,000 20,000,000

22,000 220,000 2,200,000 22,000,000

24,000 240,000 2,400,000 24,000,000

27,000 270,000 2,700,000 27,000,000

30,000 300,000 3,000,000 30,000,000

33,000 330,000 3,300,000 33,000,000

36,000 360,000 3,600,000 36,000,000

39,000 390,000 3,900,000 39,000,000

43,000 430,000 4,300,000 43,000,000

47,000 470,000 4,700,000 47,000,000

51,000 510,000 5,100,000 51,000,000

56,000 560,000 5,600,000 56,000,000

62,000 620,000 6,200,000 62,000,000

68,000 680,000 6,800,000 68,000,000

75,000 750,000 7,500,000 75,000,000

82,000 820,000 8,200,000 82,000,000

91,000 910,000 9,100,000 91,000,000

25,000 250,000 2,500,000 25,000,000

35,000 350,000 3,500,000 35,000,000

40,000 400,000 4,000,000 40,000,000

45,000 450,000 4,500,000 45,000,000

50,000 500,000 5,000,000 50,000,000

60,000 600,000 6,000,000 60,000,000

70,000 700,000 7,000,000 70,000,000

80,000 800,000 8,000,000 80,000,000

90,000 900,000 9,000,000 90,000,000

G

H

J

0.22

0.24

0.27

0.3

K

L

M

N

P

Q

R

S

T

U

V

W

X

Y

Z

a

0.33

0.36

0.39

0.43

0.47

0.51

0.56

0.62

0.68

0.75

0.82

0.91

0.25

0.35

0.4

b

d

e

0.45

0.5

f

m

n

0.6

0.7

t

0.8

y

0.9

C1025_X7R_HV_FT-CAP_SMD • 7/29/2016 15

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade)

Tape & Reel Packaging Information

KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with

EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for

details on reeling quantities for commercial chips.

ꢒar Code Label

ꢆntiꢇStatic Reel

®

ꢈmbossed ꢉlasticꢊ or

ꢉunched ꢉaper Carrierꢄ

Chip and ꢎꢉS ꢏrientation in ꢉocꢍet

(except ꢁꢀꢂ5 Commercial, and ꢁꢀꢂ5 and ꢂꢂꢂ5 Military)

KEMET

Sprocꢍet Holes

ꢈmbossment or ꢉunched Caꢋity

ꢀ mm, ꢁꢂ mm

or ꢁꢃ mm Carrier Tape

ꢆntiꢇStatic Coꢋer Tape

(ꢄꢁ0 mm (ꢄ00ꢌꢅ) Maximum Thicꢍness)

ꢁ7ꢀ mm (7ꢄ00ꢅ)

or

330 mm (ꢁ3ꢄ00ꢅ)

ꢊꢈꢐꢆ 0ꢁ005, 0ꢂ0ꢁ, 0ꢌ0ꢂ and 0ꢃ03 case siꢑes aꢋailable on punched paper carrier onlyꢄ

Table 5 – Carrier Tape Conﬁguration, Embossed Plastic & Punched Paper (mm)

New 2 mm Pitch Reel Options*

Embossed Plastic Punched Paper

Tape

Packaging

Ordering Code

(C-Spec)

C-3190

7" Reel 13" Reel 7" Reel 13" Reel

EIA Case Size Size

(W)*

Packaging Type/Options

Pitch (P₁)* Pitch (P₁)*

01005 – 0402

0603

8

2

2/4

4

Automotive grade 7" reel unmarked

Automotive grade 13" reel unmarked

Commercial grade 7" reel unmarked

Commercial grade 13" reel unmarked

C-3191

2/4

4

C-7081

0805

8

4

C-7082

1206 – 1210

1805 – 1808

≥ 1812

8

4

* 2 mm pitch reel only available for 0603 EIA case size.

2 mm pitch reel for 0805 EIA case size under development.

12

16

8

4

8

Beneﬁts of Changing from 4 mm to 2 mm Pitching Spacing

• Lower placement costs

• Double the parts on each reel results in fewer reel

changes and increased efﬁciency

• Fewer reels result in lower packaging, shipping and

storage costs, reducing waste

KPS 1210

8

KPS 1812 & 2220

Array 0508 & 0612

12

4

12

4

*Refer to Figures 1 & 2 for W and P₁carrier tape reference locations.

*Refer to Tables 6 & 7 for tolerance speciﬁcations.

C1025_X7R_HV_FT-CAP_SMD • 7/29/2016 16

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade)

Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

T

ꢀ ꢇ

ꢍꢆ0 pitches cumulatiꢂe

tolerance on tape ꢎ 0ꢏꢇ mmꢐ

ꢇ

ꢉ

ꢆ

ꢀo

ꢈDo

ꢃo

F

ꢅo

ꢁ

ꢉ

ꢇ

ꢄ

ꢆ

ꢄo

S

ꢆ

ꢀ

ꢆ

T

ꢆ

ꢉmbossment

For caꢂity siꢊe,

see ꢋote ꢆ Table ꢌ

Center Lines of Caꢂity

ꢈD

ꢆ

Coꢂer Tape

is for tape feeder reference only,

including draft concentric about ꢄ

ꢄ

ꢆ

o

.

User Direction of Unreeling

Table 6 – Embossed (Plastic) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

D₁Minimum

Note 1

1.0

(0.039)

R Reference S₁Minimum

T

T₁

Tape Size

8 mm

D₀

E₁

P₀

P₂

Note 2

Note 3

Maximum Maximum

25.0

(0.984)

1.5 +0.10/-0.0

(0.059 +0.004/-

0.0)

1.75 ±0.10

4.0 ±0.10

2.0 ±0.05

0.600

(0.024)

0.100

(0.004)

12 mm

16 mm

(0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002)

(0.024)

1.5

(0.059)

30

(1.181)

Variable Dimensions — Millimeters (Inches)

B₁Maximum

Note 4

E₂

T₂

W

Tape Size

8 mm

Pitch

F

P₁

A₀,B₀& K₀

Minimum

6.25

(0.246)

Maximum Maximum

2.5

(0.098)

4.35

(0.171)

3.5 ±0.05

(0.138 ±0.002) (0.157 ±0.004)

4.0 ±0.10

8.3

(0.327)

Single (4 mm)

Single (4 mm) &

Double (8 mm)

8.2

10.25

5.5 ±0.05

8.0 ±0.10

4.6

12.3

12 mm

16 mm

Note 5

(0.323)

(0.404)

(0.217 ±0.002) (0.315 ±0.004)

(0.181)

(0.484)

12.1

(0.476)

14.25

(0.561)

7.5 ±0.05 12.0 ±0.10

(0.138 ±0.002) (0.157 ±0.004)

4.6

(0.181)

16.3

(0.642)

Triple (12 mm)

1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment

location and hole location shall be applied independent of each other.

2. The tape with or without components shall pass around R without damage (see Figure 6).

3. If S₁< 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).

4. B₁dimension is a reference dimension for tape feeder clearance only.

5. The cavity deﬁned by A₀, B₀and K₀shall surround the component with sufﬁcient clearance that:

(a) the component does not protrude above the top surface of the carrier tape.

(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).

(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see

Figure 4).

(e) for KPS Series product, A₀and B₀are measured on a plane 0.3 mm above the bottom of the pocket.

(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.

C1025_X7R_HV_FT-CAP_SMD • 7/29/2016 17

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade)

Figure 2 – Punched (Paper) Carrier Tape Dimensions

T

ꢋꢂ0 pitches cumulatiꢀe

ꢄ^ꢂ

ꢁo

ꢃDo

tolerance on tape ꢌ 0ꢍꢅ mmꢎ

ꢇ⁰

F

ꢆ

ꢄ^ꢅ

ꢈ⁰

ꢈottom Coꢀer Tape

ꢁ^ꢂ

G

Caꢀity Siꢉe,

See

T^ꢂ

Center Lines of Caꢀity

Top Coꢀer Tape

ꢊote ꢂ, Table 7

ꢈottom Coꢀer Tape

User Direction of Unreeling

Table 7 – Punched (Paper) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

R Reference

Note 2

Tape Size

8 mm

D₀

E₁

P₀

P₂

T₁Maximum

G Minimum

0.10

1.5 +0.10 -0.0

(0.059 +0.004 -0.0)

1.75 ±0.10

(0.069 ±0.004)

4.0 ±0.10

(0.157 ±0.004)

2.0 ±0.05

(0.079 ±0.002)

0.75

(0.030)

25

(0.984)

(0.004)

Maximum

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

Pitch

E2 Minimum

F

P₁

T Maximum

W Maximum

A₀B₀

2.0 ±0.05

(0.079 ±0.002)

4.0 ±0.10

(0.157 ±0.004)

8.3

(0.327)

8.3

(0.327)

Half (2 mm)

Single (4 mm)

6.25

(0.246)

3.5 ±0.05

(0.138 ±0.002)

1.1

(0.098)

Note 1

8 mm

1. The cavity deﬁned by A₀, B₀and T shall surround the component with sufﬁcient clearance that:

a) the component does not protrude beyond either surface of the carrier tape.

b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

c) rotation of the component is limited to 20° maximum (see Figure 3).

d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).

e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.

2. The tape with or without components shall pass around R without damage (see Figure 6).

C1025_X7R_HV_FT-CAP_SMD • 7/29/2016 18

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade)

Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 Kg minimum.

2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

Tape Width

8 mm

Peel Strength

0.1 to 1.0 Newton (10 to 100 gf)

0.1 to 1.3 Newton (10 to 130 gf)

12 and 16 mm

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be

165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of

300 ±10 mm/minute.

3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA

Standards 556 and 624.

Figure 3 – Maximum Component Rotation

°

T

Maximum Component Rotation

Top View

Maximum Component Rotation

Side View

Typical ꢆocꢇet Centerline

Tape

Maximum

°

T

s

Width (mm) Rotation (

)

ꢂ,ꢃꢄ

ꢃꢅ – ꢄ00

ꢄ0

ꢃ0

ꢁo

Tape

Maximum

°

S

Width (mm) Rotation (

)

ꢂ,ꢃꢄ

ꢃꢅ – 5ꢅ

7ꢄ – ꢄ00

ꢄ0

ꢃ0

5

Typical Component Centerline

ꢀo

Figure 4 – Maximum Lateral Movement

Figure 5 – Bending Radius

ꢁmbossed

Carrier

ꢂunched

Carrier

ꢁ mm ꢂ ꢃꢄ mm Tape

ꢃꢅ mm Tape

0ꢀ5 mm maximum

ꢃꢀ0 mm maximum

R

ꢀending

Radius

R

C1025_X7R_HV_FT-CAP_SMD • 7/29/2016 19

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade)

Figure 6 – Reel Dimensions

Full Radius,

ꢊ3 (ꢅncludes

flange distortion

at outer edge)

ꢀccess Hole at

Slot Location

(ꢃ ꢄ0 mm minimum)

See ꢁote

ꢊꢇ (Measured at hub)

D

(See ꢁote)

ꢀ

ꢁ

C

(ꢀrbor hole

ꢊꢉ (Measured at hub)

diameter)

ꢅf present,

tape slot in core

for tape startꢆ

ꢇꢈ5 mm minimum width x

ꢉ0ꢈ0 mm minimum depth

ꢂ

(see ꢁote)

ꢁoteꢆ Driꢋe spoꢌes optionalꢍ if used, dimensions ꢂ and D shall applyꢈ

Table 8 – Reel Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size

8 mm

A

B Minimum

C

D Minimum

178 ±0.20

(7.008 ±0.008)

or

1.5

(0.059)

13.0 +0.5/-0.2

(0.521 +0.02/-0.008)

20.2

(0.795)

12 mm

16 mm

330 ±0.20

(13.000 ±0.008)

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

N Minimum

W₁

W₂Maximum

W₃

8.4 +1.5/-0.0

(0.331 +0.059/-0.0)

14.4

(0.567)

50

(1.969)

12.4 +2.0/-0.0

18.4

Shall accommodate tape

width without interference

12 mm

16 mm

(0.488 +0.078/-0.0)

(0.724)

16.4 +2.0/-0.0

(0.646 +0.078/-0.0)

22.4

(0.882)

C1025_X7R_HV_FT-CAP_SMD • 7/29/2016 20

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade)

Figure 7 – Tape Leader & Trailer Dimensions

ꢃmbossed Carrier

Carrier Tape

ꢆunched Carrier

ꢇ mm ꢈ ꢀꢄ mm only

Round Sprocꢂet Holes

START

END

Top Coꢅer Tape

ꢃlongated Sprocꢂet Holes

(3ꢄ mm tape and wider)

ꢀ00 mm

Minimum Leader

ꢉ00 mm Minimum

Trailer

Components

ꢀꢁ0 mm Minimum

Top Coꢅer Tape

Figure 8 – Maximum Camber

ꢂlongated sprocꢀet holes

(3ꢃ mm ꢄ wider tapes)

Carrier Tape

Round Sprocꢀet Holes

ꢁ mm Maximum, either direction

Straight ꢂdge

ꢃ50 mm

C1025_X7R_HV_FT-CAP_SMD • 7/29/2016 21

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade)

KEMET Electronic Corporation Sales Ofﬁces

For a complete list of our global sales ofﬁces, please visit www.kemet.com/sales.

Disclaimer

All product speciﬁcations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for

checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.

All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.

Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such

applications, but are not intended to constitute – and KEMET speciﬁcally disclaims – any warranty concerning suitability for a speciﬁc customer application or use.

The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any

technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no

obligation or liability for the advice given or results obtained.

Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component

failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards

(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or

property damage.

Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other

measures may not be required.

KEMET is a registered trademark of KEMET Electronics Corporation.

C1025_X7R_HV_FT-CAP_SMD • 7/29/2016 22


型号：	C1206X154MBRALTU
厂家：	KEMET CORPORATION
描述：	High Voltage with Flexible Termination System (HV FT-CAP) X7R Dielectric, 500 - 3,000 VDC (Commercial Grade)
文件：	总22页 (文件大小：1426K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

C1206X154MBRALTU [KEMET]

相关型号：

C1206X154MCRACTU

C1206X154MCRALTU

C1206X154MDRACTU

C1206X154MDRALTU

C1206X154MFRACTU

C1206X154MFRALTU

C1206X154MGRACTU

C1206X154MGRALTU

C1206X154MHRACTU

C1206X154MHRALTU

C1206X154MZRACTU

C1206X154MZRALTU