C1206X390D8GAC_技术文档

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric,

10 – 200 VDC (Commercial & Automotive Grade)

Overview

KEMET’s Flexible Termination (FT-CAP) Multilayer Ceramic

Capacitor in C0G dielectric incorporates a unique, ﬂexible

termination system that is integrated with KEMET’s standard

termination materials. A conductive silver epoxy is utilized

between the base metal and nickel barrier layers of KEMET’s

standard termination system in order to establish pliability

while maintaining terminal strength, solderability and electrical

performance. This technology was developed in order to

address the primary failure mode of MLCCs– ﬂex cracks, which

are typically the result of excessive tensile and shear stresses

produced during board ﬂexure and thermal cycling. Flexible

environmental and handling conditions, it does provide superior

ﬂex performance over standard termination systems. FT-CAP

complements KEMET’s Open Mode, Floating Electrode (FE-

CAP), Floating Electrode with Flexible Termination (FF-CAP),

and KEMET Power Solutions (KPS) product lines by providing a

complete portfolio of ﬂex mitigation solutions.

Combined with the stability of C0G dielectric and designed to

accommodate all capacitance requirements, these ﬂex-robust

devices are RoHS Compliant, offer up to 5 mm of ﬂex-bend

capability and exhibit no change in capacitance with respect to

termination technology inhibits the transfer of board stress to the time and voltage. Capacitance change with reference to ambient

rigid ceramic body, therefore mitigating ﬂex cracks which can

result in low IR or short circuit failures.

temperature is limited to ±30 ppm/ºC from -55°C to +125°C.

In addition to Commercial Grade, Automotive Grade devices

are available which meet the demanding Automotive Electronics

Council's AEC–Q200 qualiﬁcation requirements.

Although this technology does not eliminate the potential

for mechanical damage that may propagate during extreme

Ordering Information

C

1206

X

563

J

3

G

A

C

TU

Case Size Speciﬁcation/

Capacitance

Code (pF)

Capacitance Rated Voltage

Failure Rate/ Termination

Design

Packaging/Grade

(C-Spec)³

Ceramic

Dielectric

(L" x W")

Series

Tolerance¹

(VDC)

Finish²

0603

0805

1206

1210

1812

2220

X = Flexible

Termination

2 signiﬁcant digits +

number of zeros.

Use 9 for 1.0 – 9.9 pF D = ±0.5 pF 3 = 25 V

Use 8 for 0.5 – .99 pF F = ±1%

e.g., 2.2 pF = 229

e.g., 0.5 pF = 508

B = ±0.10 pF 8 = 10 V

C = ±0.25 pF 4 = 16 V

G = C0G A = N/A

C = 100%

Matte Sn

Blank = Bulk

TU = 7" Reel Unmarked

AUTO = Automotive

Grade 7" Reel

5 = 50 V

1 = 100 V

2 = 200 V

G = ±2%

J = ±5%

Unmarked

K = ±10%

M = ±20%

¹Additional capacitance tolerance offerings may be available. Contact KEMET for details.

²Additional termination ﬁnish options may be available. Contact KEMET for details.

³Additional reeling or packaging options may be available. Contact KEMET for details.

One world. One KEMET

C1062_C0G_FT-CAP_SMD • 1/10/2013

1

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 200 VDC (Commercial & Automotive Grade)

Dimensions – Millimeters (Inches)

L

W

B

T

S

EIA

Size

Code

Metric

Size

Code

S

L

W

Width

T

B

Mounting

Technique

Separation

Minimum

Length

Thickness

Bandwidth

0603

0805

1206

1210

1812

2220

1608

2012

3216

3225

4532

5650

1.60 (.064) ±0.17 (.007) 0.80 (.032) ±0.15 (.006)

2.00 (.079) ±0.20 (.008) 1.25 (.049) ±0.20 (.008)

3.30 (.130) ±0.40 (.016) 1.60 (.063) ±0.20 (.008)

3.30 (.130) ±0.40 (.016) 2.50 (.098) ±0.20 (.008)

4.50 (.178) ±0.40 (.016) 3.20 (.126) ±0.30 (.012)

5.90 (.232) ±0.75 (.030) 5.00 (.197) ±0.40 (.016)

0.45 (.018) ±0.15 (.006)

0.50 (0.02) ±0.25 (.010)

0.60 (.024) ±0.25 (.010)

0.70 (.028) ±0.35 (.014)

0.58 (.023)

0.75 (.030)

Solder Wave

or

Solder Reﬂow

See Table 2 for

Thickness

N/A

Solder Reﬂow Only

Beneﬁts

• -55°C to +125°C operating temperature range

• Superior ﬂex performance (up to 5 mm)

• Pb-Free and RoHS Compliant

• High ripple current capability

• Preferred capacitance solution at line frequencies and into the

MHz range

• EIA 0603, 0805, 1206, 1210, 1812, and 2220 case sizes

• DC voltage ratings of 10 V, 16 V, 25 V, 50 V, 100 V, and 200 V

• Capacitance offerings ranging from 0.5 pF up to 0.47 μF

• No capacitance change with respect to applied rated DC voltage

• Negligible capacitance change with respect to temperature from

-55°C to +125°C

• Available capacitance tolerances of ±0.10pF, ±0.25 pF, ±0.5 pF, • Non-polar device, minimizing installation concerns

±1%, ±2%, ±5%, ±10%, and ±20%

• No piezoelectric noise

• 100% pure matte tin-plated termination ﬁnish allowing for

excellent solderability

• Extremely low ESR and ESL

• High thermal stability

• Commercial & Automotive (AEC–Q200) Grades available

Applications

Typical applications include critical timing, tuning, circuits requiring low loss, circuits with pulse, high current, decoupling, bypass,

ﬁltering, transient voltage suppression and blocking, as well as energy storage in critical and safety relevant circuits without (integrated)

current limitation, including those subject to high levels of board ﬂexure or temperature cycling.

C1062_C0G_FT-CAP_SMD • 1/10/2013

2

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 200 VDC (Commercial & Automotive Grade)

Qualiﬁcation/Certiﬁcation

Commercial Grade products are subject to internal qualiﬁcation. Details regarding test methods and conditions are referenced in

Table 4, Performance & Reliability.

Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test

methods and conditions are referenced in document AEC–Q200, Stress Test Qualiﬁcation for Passive Components. For additional

information regarding the Automotive Electronics Council and AEC–Q200, please visit their website at www.aecouncil.com.

Environmental Compliance

Pb-Free and RoHS Compliant.

Electrical Parameters/Characteristics

Item

Parameters/Characteristics

Operating Temperature Range

-55°C to +125°C

±30 ppm/ºC

0%

Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC)

Aging Rate (Maximum % Capacitance Loss/Decade Hour)

250% of rated voltage

Dielectric Withstanding Voltage (DWV)

Dissipation Factor (DF) Maximum Limit @ 25ºC

Insulation Resistance (IR) Limit @ 25°C

(5 ±1 seconds and charge/discharge not exceeding 50 mA)

0.1%

1,000 megohm microfarads or 100 GΩ

(Rated voltage applied for 120 ±5 seconds @ 25°C)

To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.

Capacitance and dissipation factor (DF) measured under the following conditions:

1 MHz ±100 kHz and 1.0 ±0.2 Vrms if capacitance ≤ 1,000 pF

1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance > 1,000 pF

Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as

Automatic Level Control (ALC). The ALC feature should be switched to "ON."

Post Environmental Limits

High Temperature Life, Biased Humidity, Moisture Resistance

Rated DC

Voltage

Capacitance

Dissipation Factor

(Maximum %)

Capacitance

Insulation

Resistance

Dielectric

C0G

Value

Shift

All

0.5

0.3% or ±0.25 pF 10% of Initial Limit

C1062_C0G_FT-CAP_SMD • 1/10/2013

3

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 200 VDC (Commercial & Automotive Grade)

Table 1A – Capacitance Range/Selection Waterfall (0603 – 1206 Case Sizes)

Series

Voltage Code

Voltage DC

C0603

C0805

C1206

8

4

3

5

1

2

8

4

3

5

1

2

8

4

3

5

1

2

Capacitance Cap Code

Product Availability and Chip Thickness Codes

See Table 2 for Chip Thickness Dimensions

Capacitance Tolerance

0.50 – 0.75 pF

1.0 – 1.6 pF

1.8 – 4.3 pF

4.7 – 9.1 pF

10 – 12 pF

13 – 33 pF

36 – 62 pF

68 – 91 pF

100 – 180 pF

200 – 430 pF

470 pF

510 pF

560 pF

620 pF

680 pF

750 pF

820 pF

910 pF

1,000 pF

1,100 pF

1,200 pF

1,300 pF

1,500 pF

1,600 pF

1,800 pF

2,000 pF

2,200 pF

2,400 pF

2,700 pF

3,000 pF

3,300 pF

3,600 pF

3,900 pF

4,300 pF

4,700 pF

5,100 pF

5,600 pF

6,200 pF

6,800 pF

7,500 pF

8,200 pF

9,100 pF

10,000 pF

12,000 pF

15,000 pF

18,000 pF

22,000 pF

508 – 758

109 – 169

189 – 439

479 – 919

100 – 120

130 – 330

360 – 620

680 – 910

101 – 181

201 – 431

471

511

561

621

681

751

821

911

102

112

122

132

152

162

182

202

222

242

272

302

332

362

392

432

472

B

C

D

CB CB CB CB CB CB DC DC DC DC DC DC

K

M

CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB

D

J

G

F

CB CB CB CB CB

CB CB CB CB

DC DC DC DC DC DC EB EB EB EB EB EB

DC DC DC DC DD DD EB EB EB EB EB EB

DC DC DC DC DC

DD DD DD DD DD

DC DC DC DC DC

DD DD DD DD DC

DE DE DE DE DC

DC DC DC DC DC

DC DC DC DC DD

DC DC DC DC DE

DC DC DC DD DG

DC DC DC DD

EB EB EB EB EB EB

EB EB EB EB EC EC

EB EB EB EB ED EC

EB EB EB EB ED ED

EB EB EB EB EE EE

EB EB EB EB EC EC

EC EC EC EC EC

EC EC EC EC EE

EC EC EC EC EF

EC EC EC EC EC

ED ED ED ED ED

EB EB EB EB EB

EC EC EC EC EB

ED ED ED ED EB

EB EB EB EB EB

EB EB EB EB EC

512

562

622

682

752

822

912

103

123

153

183

223

CB CB CB CB

CB CB CB

DD DD DD DF

27,000 pF

273

333

DF DF DF

EB EB EB EB

C

1206

X

_F^F56_G^G3

J

3

G

_{DG DG}A_DG

C

TU

33,000 pF

EB EB EB EB

39,000 pF

393

F

G

J

M

DG DG DG

EC EC EC

Case Size Speciﬁcation/

473

Capacitance

Capacitance Rated Voltage

Failure Rate/ Termination

Packaging/Grade

Ceramic

Dielectric

47,000 pF

G

J

DG DG DG

EC EC EC

(L" x W")

Series

Code (pF)

Tolerance¹

(VDC)

Design

Finish²

(C-Spec)³

56,000 pF

563

G

ED ED ED

Blank = Bulk

0603

0805

1206

1210

1812

2220

X = Flexible

Termination

2 signiﬁcant digits +

number of zeros.

Use 9 for 1.0 – 9.9 pF D = ±0.5 pF 3 = 25 V

Use 8 for 0.5 – .99 pF F = ±1%

e.g., 2.2 pF = 229

e.g., 0.5 pF = 508

B = ±0.10 pF 8 = 10 V

C = ±0.25 pF 4 = 16 V

G = C0G A = N/A

C = 100%

Voltage DC

Matte Sn

TU = 7" Reel Unmarked

AUTO = Automotive

Voltage Code

8

4

3

5

1

2

8

4

3

5

1

2

8

4

3

5

1

2

Capacitance

Cap Code

5 = 50 V

1 = 100 V

2 = 200 V

Grade 7" Reel

Series

C0603

C0805

C1206

G = ±2%

J = ±5%

K = ±10%

Unmarked

These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts.

M = ±20%

C1062_C0G_FT-CAP_SMD • 1/10/2013

4

Roll Over for

Order Info.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 200 VDC (Commercial & Automotive Grade)

Table 1B – Capacitance Range/Selection Waterfall (1210 – 2220 Case Sizes)

Series

Voltage Code

Voltage DC

C1210

C1808

C1812

C2220

8

4

3

5

1

2

5

1

2

5

1

2

5

1

2

Capacitance

Cap Code

Product Availability and Chip Thickness Codes

See Table 2 for Chip Thickness Dimensions

Capacitance Tolerance

0.5–0.75 pF

1.0–9.1 pF

10–91 pF

100–430 pF

470–910 pF

1,000 pF

1,100 pF

1,200 pF

1,300 pF

1,500 pF

1,600 pF

1,800 pF

2,000 pF

2,200 pF

2,400 pF

2,700 pF

3,000 pF

3,300 pF

3,600 pF

3,900 pF

4,300 pF

4,700 pF

5,100 pF

5,600 pF

6,200 pF

6,800 pF

7,500 pF

8,200 pF

9,100 pF

10,000 pF

12,000 pF

15,000 pF

18,000 pF

22,000 pF

27,000 pF

33,000 pF

39,000 pF

47,000 pF

56,000 pF

68,000 pF

82,000 pF

0.10 µF

508–758

109–919

100–910

101–431

471–911

102

112

122

132

152

162

182

202

222

242

272

302

332

362

392

432

472

512

562

622

682

752

822

912

103

123

153

183

223

B

C

D

FB

FC

FB

FC

FE

F

G

J

K

M

GB

FC

GB

GH

GB

GD

GH

GJ

FB

FC

FE

FB

FC

FE

FB

FC

FE

FB

FC

FE

JE

FC

FE

GB

GH

GG

JE

273

333

393

473

563

683

823

104

124

154

184

224

GD

GH

GD

GH

GK

GD

GH

GN

0.12 µF

0.15 µF

0.18 µF

0.22 µF

JD

JF

JD

JG

JD

JF

JG

0.27 µF

274

0.33 µF

334

C

1206

X

563 ^G_G

J

3

G

A

C

TU

0.39 µF

394

F

0.47 µF

Ceramic

474

G

Case Size Speciﬁcation/

(L" x W")

Capacitance

Capacitance Rated Voltage

Failure Rate/ Termination

Design

Packaging/Grade

(C-Spec)³

Dielectric

Series

Code (pF)

Tolerance¹

(VDC)

Finish²

Voltage DC

Voltage Code

8

4

3

5

1

2

5

1

2

5

1

2

5

1

2

0603

X = Flexible

Termination

2 signiﬁcant digits +

B = ±0.10 pF 8 = 10 V

C = ±0.25 pF 4 = 16 V

G = C0G A = N/A

C = 100%

Blank = Bulk

Capacitance

0805

Cap Code

number of zeros.

Matte Sn

TU = 7" Reel Unmarked

Series

C1210

C1808

C1812

C2220

1206

1210

1812

2220

Use 9 for 1.0 – 9.9 pF D = ±0.5 pF 3 = 25 V

AUTO = Automotive

Use 8 for 0.5 – .99 pF F = ±1%

5 = 50 V

1 = 100 V

2 = 200 V

Grade 7" Reel

Unmarked

These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts.

e.g., 2.2 pF = 229

e.g., 0.5 pF = 508

G = ±2%

J = ±5%

K = ±10%

M = ±20%

C1062_C0G_FT-CAP_SMD • 1/10/2013

5

Roll Over for

Order Info.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 200 VDC (Commercial & Automotive Grade)

Table 2 – Chip Thickness/Packaging Quantities

Paper Quantity

Plastic Quantity

7" Reel 13" Reel

Thickness Case Thickness ±

Code

Size

Range (mm)

7" Reel

13" Reel

CB

DC

DD

DE

DF

DG

EB

EC

ED

EE

EF

FB

FC

FE

GB

GD

GH

GG

GK

GJ

GN

HB

HG

JD

0603

0805

1206

1210

1812

1825

2220

2225

0.80 ± 0.07

0.78 ± 0.10

0.90 ± 0.10

1.00 ± 0.10

1.10 ± 0.10

1.25 ± 0.15

0.78 ± 0.10

0.90 ± 0.10

1.00 ± 0.10

1.10 ± 0.10

1.20 ± 0.15

0.78 ± 0.10

0.90 ± 0.10

1.00 ± 0.10

1.25 ± 0.15

1.40 ± 0.15

1.55 ± 0.10

1.60 ± 0.20

1.70 ± 0.15

1.70 ± 0.20

1.10 ± 0.15

1.60 ± 0.20

1.30 ± 0.15

1.40 ± 0.15

1.50 ± 0.15

1.70 ± 0.15

1.40 ± 0.15

4,000

0

10,000

0

4,000

2,500

4,000

2,500

4,000

2,500

1,000

10,000

4,000

0

4,000

0

10,000

0

4,000

JE

JF

JG

KE

0

4,000

7" Reel

13" Reel

7" Reel

13" Reel

Thickness

Code

Case

Size

Thickness ±

Range (mm)

Paper Quantity

Plastic Quantity

Package quantity based on ﬁnished chip thickness speciﬁcations.

C1062_C0G_FT-CAP_SMD • 1/10/2013

6

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 200 VDC (Commercial & Automotive Grade)

Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 (mm)

Density Level A:

Maximum (Most)

Land Protrusion (mm)

Density Level B:

Median (Nominal)

Land Protrusion (mm)

Density Level C:

Minimum (Least)

Land Protrusion (mm)

EIA

Size

Code

Metric

Size

Code

C

Y

X

V1

V2

C

Y

X

V1

V2

C

Y

X

V1

V2

0603

0805

1206

1210

1812

2220

1608

2012

3216

3225

4532

5650

0.85

1.25

1.10

4.00

2.10

0.75

1.05

1.00

3.10

1.50

0.65

0.85

0.90

2.40

1.20

1.00

1.60

2.10

2.85

1.35

1.65

1.80

2.10

1.55

1.90

2.80

3.60

5.50

4.40

5.90

7.00

8.80

2.60

2.90

3.80

4.60

6.50

0.90

1.50

2.00

2.75

1.15

1.45

1.60

1.90

1.45

1.80

2.70

3.50

5.40

3.50

5.00

6.10

7.90

2.00

2.30

3.20

4.00

5.90

0.80

1.40

1.90

2.65

0.95

1.25

1.40

1.70

1.35

1.70

2.60

3.40

5.30

2.80

4.30

5.40

7.20

1.70

2.00

2.90

3.70

5.60

Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reﬂow solder

processes. KEMET only recommends wave soldering of EIA 0603, 0805, and 1206 case sizes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reﬂow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualiﬁcation

testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).

Soldering Process

Recommended Soldering Technique:

• Solder wave or solder reﬂow for EIA case sizes 0603, 0805, and 1206

• All other EIA case sizes are limited to solder reﬂow only

Recommended Soldering Proﬁle:

• KEMET recommends following the guidelines outlined in IPC/JEDEC J–STD–020

C1062_C0G_FT-CAP_SMD • 1/10/2013

7

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 200 VDC (Commercial & Automotive Grade)

Table 4 – Performance & Reliability: Test Methods and Conditions

Stress

Reference

Test or Inspection Method

Terminal Strength

JIS–C–6429

Appendix 1, Note: Force of 1.8 kg for 60 seconds.

Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G.

Flexible termination system – 3.0 mm (minimum).

Board Flex

JIS–C–6429

Magniﬁcation 50 X. Conditions:

a) Method B, 4 hours @ 155°C, dry heat @ 235°C

b) Method B @ 215°C category 3

Solderability

J–STD–002

c) Method D, category 3 @ 260°C

Temperature Cycling

Biased Humidity

JESD22 Method JA–104

MIL–STD–202 Method 103

1,000 Cycles (-55°C to +125°C). Measurement at 24 hours +/- 2 hours after test conclusion.

Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor. Measurement

at 24 hours +/- 2 hours after test conclusion.

Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.

Measurement at 24 hours +/- 2 hours after test conclusion.

t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered.

Measurement at 24 hours +/- 2 hours after test conclusion.

-55°C/+125°C. Note: Number of cycles required – 300, maximum transfer time – 20 seconds, dwell

time – 15 minutes. Air – Air.

Moisture Resistance

Thermal Shock

MIL–STD–202 Method 106

MIL–STD–202 Method 107

MIL–STD–202 Method 108

/EIA–198

High Temperature Life

Storage Life

1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied.

MIL–STD–202 Method 108 150°C, 0 VDC for 1,000 hours.

5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 secure

MIL–STD–202 Method 204 points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2"

from any secure point. Test from 10 – 2,000 Hz

Vibration

Mechanical Shock

MIL–STD–202 Method 213 Figure 1 of Method 213, Condition F.

Resistance to Solvents MIL–STD–202 Method 215 Add aqueous wash chemical, OKEM Clean or equivalent.

Storage and Handling

Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other

environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term

storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may

increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70%

relative humidity. Temperature ﬂuctuations should be minimized to avoid condensation on the parts and atmospheres should be free of

chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of

receipt.

C1062_C0G_FT-CAP_SMD • 1/10/2013

8

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 200 VDC (Commercial & Automotive Grade)

Construction

Reference

Item

Material

A

B

C

D

E

F

Finish

100% Matte Sn

Barrier Layer

Epoxy Layer

Base Metal

Ni

Ag

Termination

System

Cu

Inner Electrode

Dielectric Material

Ni

CaZrO₃

Note: Image is exaggerated in order to clearly identify all components of construction.

Capacitor Marking (Optional):

Laser marking option is not available on:

• C0G, Ultra Stable X8R and Y5V dielectric devices

• EIA 0402 case size devices

• EIA 0603 case size devices with Flexible Termination option.

• KPS Commercial and Automotive grade stacked devices.

These capacitors are supplied unmarked only.

C1062_C0G_FT-CAP_SMD • 1/10/2013

9

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 200 VDC (Commercial & Automotive Grade)

Tape & Reel Packaging Information

KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA

Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on

reeling quantities for commercial chips.

Bar Code Label

Anti-Static Reel

®

Embossed Plastic* or

Punched Paper Carrier.

Chip and KPS Orientation in Pocket

(except 1825 Commercial, and 1825 and 2225 Military)

KEMET

Sprocket Holes

Embossment or Punched Cavity

8 mm, 12 mm

or 16 mm Carrier Tape

Anti-Static Cover Tape

(.10 mm (.004") Maximum Thickness)

178 mm (7.00")

or

330 mm (13.00")

*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.

Table 5 – Carrier Tape Conﬁguration – Embossed Plastic & Punched Paper (mm)

EIA Case Size

01005 – 0402

0603 – 1210

Tape Size (W)*

Pitch (P₁)*

8

2

4

1805 – 1808

12

16

8

4

≥ 1812

8

KPS 1210

8

KPS 1812 & 2220

Array 0508 & 0612

12

4

*Refer to Figures 1 & 2 for W and P₁carrier tape reference locations.

*Refer to Tables 6 & 7 for tolerance speciﬁcations.

C1062_C0G_FT-CAP_SMD • 1/10/2013 10

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 200 VDC (Commercial & Automotive Grade)

Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

T

P2

[10 pitches cumulative

tolerance on tape ± 0.2 mm]

2

E

1

Po

ØDo

Ao

F

Ko

W

E

2

B

1

Bo

S

1

P

1

T

1

Embossment

For cavity size,

see Note 1 Table 4

Center Lines of Cavity

ØD

1

Cover Tape

is for tape feeder reference only,

including draft concentric about B

B

1

o

.

User Direction of Unreeling

Table 6 – Embossed (Plastic) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

D₁Minimum

Note 1

1.0

(0.039)

R Reference S₁Minimum

T

T₁

Tape Size

8 mm

D₀

E₁

P₀

P₂

Note 2

Note 3

Maximum

25.0

(0.984)

1.5 +0.10/-0.0

(0.059 +0.004/-0.0)

1.75 ±0.10

4.0 ±0.10

2.0 ±0.05

0.600

(0.024)

0.600

(0.024)

0.100

(0.004)

12 mm

16 mm

(0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002)

1.5

(0.059)

30

(1.181)

Variable Dimensions — Millimeters (Inches)

B₁Maximum

Note 4

4.35

(0.171)

E₂

T₂

W

Tape Size

8 mm

Pitch

F

P₁

A₀,B₀& K₀

Minimum

6.25

(0.246)

Maximum

2.5

(0.098)

Maximum

8.3

(0.327)

3.5 ±0.05

(0.138 ±0.002) (0.157 ±0.004)

4.0 ±0.10

Single (4 mm)

Single (4 mm) &

Double (8 mm)

8.2

10.25

5.5 ±0.05

8.0 ±0.10

4.6

12.3

12 mm

16 mm

Note 5

(0.323)

(0.404)

(0.217 ±0.002) (0.315 ±0.004)

(0.181)

(0.484)

12.1

(0.476)

14.25

(0.561)

7.5 ±0.05 12.0 ±0.10

(0.138 ±0.002) (0.157 ±0.004)

4.6

(0.181)

16.3

(0.642)

Triple (12 mm)

1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and

hole location shall be applied independent of each other.

2. The tape with or without components shall pass around R without damage (see Figure 6).

3. If S₁< 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).

4. B₁dimension is a reference dimension for tape feeder clearance only.

5. The cavity deﬁned by A₀, B₀and K₀shall surround the component with sufﬁcient clearance that:

(a) the component does not protrude above the top surface of the carrier tape.

(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).

(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4).

(e) for KPS Series product, A₀and B₀are measured on a plane 0.3 mm above the bottom of the pocket.

(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.

C1062_C0G_FT-CAP_SMD • 1/10/2013 11

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 200 VDC (Commercial & Automotive Grade)

Figure 2 – Punched (Paper) Carrier Tape Dimensions

T

P2

[10 pitches cumulative

tolerance on tape ± 0.2 mm]

E

1

Po

ØDo

0

A

F

W

2

E

0

B

Bottom Cover Tape

P

1

G

Cavity Size,

See

1

T

1

T

Top Cover Tape

Center Lines of Cavity

Note 1, Table 7

Bottom Cover Tape

User Direction of Unreeling

Table 7 – Punched (Paper) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

R Reference

Note 2

Tape Size

8 mm

D₀

E₁

P₀

P₂

T₁Maximum

G Minimum

1.5 +0.10 -0.0

(0.059 +0.004 -0.0)

1.75 ±0.10

(0.069 ±0.004)

4.0 ±0.10

(0.157 ±0.004)

2.0 ±0.05

(0.079 ±0.002) (0.004) Maximum

0.10

0.75

(0.030)

25

(0.984)

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

Pitch

E2 Minimum

F

P₁

T Maximum

W Maximum

A₀B₀

2.0 ±0.05

(0.079 ±0.002)

4.0 ±0.10

8.3

(0.327)

8.3

Half (2 mm)

Single (4 mm)

6.25

(0.246)

3.5 ±0.05

(0.138 ±0.002)

1.1

(0.098)

Note 1

8 mm

(0.157 ±0.004)

(0.327)

1. The cavity deﬁned by A₀, B₀and T shall surround the component with sufﬁcient clearance that:

a) the component does not protrude beyond either surface of the carrier tape.

b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

c) rotation of the component is limited to 20° maximum (see Figure 3).

d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).

e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.

2. The tape with or without components shall pass around R without damage (see Figure 6).

C1062_C0G_FT-CAP_SMD • 1/10/2013 12

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 200 VDC (Commercial & Automotive Grade)

Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 Kg minimum.

2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

Tape Width

8 mm

Peel Strength

0.1 to 1.0 Newton (10 to 100 gf)

0.1 to 1.3 Newton (10 to 130 gf)

12 and 16 mm

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180°

from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.

3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA

Standards 556 and 624.

Figure 3 – Maximum Component Rotation

°

T

Maximum Component Rotation

Top View

Maximum Component Rotation

Side View

Typical Pocket Centerline

Tape

Maximum

°

T

s

Width (mm) Rotation (

)

8,12

16 – 200

20

10

Bo

Tape

Maximum

°

S

Width (mm) Rotation (

)

8,12

16 – 56

72 – 200

20

10

5

Typical Component Centerline

Ao

Figure 4 – Maximum Lateral Movement

Figure 5 – Bending Radius

Embossed

Carrier

Punched

Carrier

8 mm & 12 mm Tape

16 mm Tape

0.5 mm maximum

1.0 mm maximum

R

Bending

Radius

R

C1062_C0G_FT-CAP_SMD • 1/10/2013 13

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 200 VDC (Commercial & Automotive Grade)

Figure 6 – Reel Dimensions

Full Radius,

W3 (Includes

flange distortion

at outer edge)

Access Hole at

Slot Location

(Ø 40 mm minimum)

See Note

W

2 (Measured at hub)

D

(See Note)

A

N

C

(Arbor hole

W

1 (Measured at hub)

diameter)

If present,

tape slot in core

for tape start:

2.5 mm minimum width x

10.0 mm minimum depth

B

(see Note)

Note: Drive spokes optional; if used, dimensions B and D shall apply.

Table 8 – Reel Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size

8 mm

A

B Minimum

C

D Minimum

178 ±0.20

(7.008 ±0.008)

or

330 ±0.20

(13.000 ±0.008)

1.5

(0.059)

13.0 +0.5/-0.2

(0.521 +0.02/-0.008)

20.2

(0.795)

12 mm

16 mm

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

N Minimum

W₁

W₂Maximum

W₃

8.4 +1.5/-0.0

(0.331 +0.059/-0.0)

14.4

(0.567)

50

(1.969)

12.4 +2.0/-0.0

18.4

Shall accommodate tape width

without interference

12 mm

16 mm

(0.488 +0.078/-0.0)

(0.724)

16.4 +2.0/-0.0

(0.646 +0.078/-0.0)

22.4

(0.882)

C1062_C0G_FT-CAP_SMD • 1/10/2013 14

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 200 VDC (Commercial & Automotive Grade)

Figure 7 – Tape Leader & Trailer Dimensions

Embossed Carrier

Carrier Tape

Round Sprocket Holes

Punched Carrier

8 mm & 12 mm only

START

END

Top Cover Tape

Elongated Sprocket Holes

(32 mm tape and wider)

100 mm

Minimum Leader

400 mm Minimum

Trailer

160 mm Minimum

Components

Top Cover Tape

Figure 8 – Maximum Camber

Elongated sprocket holes

(32 mm & wider tapes)

Carrier Tape

Round Sprocket Holes

1 mm Maximum, either direction

Straight Edge

250 mm

C1062_C0G_FT-CAP_SMD • 1/10/2013 15

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 200 VDC (Commercial & Automotive Grade)

KEMET Corporation

World Headquarters

Europe

Asia

Southern Europe

Paris, France

Tel: 33-1-4646-1006

Northeast Asia

Hong Kong

Tel: 852-2305-1168

2835 KEMET Way

Simpsonville, SC 29681

Sasso Marconi, Italy

Tel: 39-051-939111

Shenzhen, China

Tel: 86-755-2518-1306

Mailing Address:

P.O. Box 5928

Greenville, SC 29606

Beijing, China

Central Europe

Landsberg, Germany

Tel: 49-8191-3350800

Tel: 86-10-5829-1711

www.kemet.com

Tel: 864-963-6300

Fax: 864-963-6521

Shanghai, China

Tel: 86-21-6447-0707

Kamen, Germany

Tel: 49-2307-438110

Corporate Ofﬁces

Fort Lauderdale, FL

Tel: 954-766-2800

Taipei, Taiwan

Tel: 886-2-27528585

Northern Europe

Bishop’s Stortford, United Kingdom

Tel: 44-1279-460122

North America

Southeast Asia

Singapore

Southeast

Tel: 65-6586-1900

Lake Mary, FL

Tel: 407-855-8886

Espoo, Finland

Tel: 358-9-5406-5000

Penang, Malaysia

Tel: 60-4-6430200

Northeast

Wilmington, MA

Tel: 978-658-1663

Bangalore, India

Tel: 91-806-53-76817

Central

Novi, MI

Tel: 248-994-1030

West

Milpitas, CA

Tel: 408-433-9950

Mexico

Guadalajara, Jalisco

Tel: 52-33-3123-2141

Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not

assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of

KEMET Electronics Corporation.

C1062_C0G_FT-CAP_SMD • 1/10/2013 16

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 200 VDC (Commercial & Automotive Grade)

Other KEMET Resources

Tools

Resource

Location

Conﬁgure A Part: CapEdge

SPICE & FIT Software

http://capacitoredge.kemet.com

http://www.kemet.com/spice

http://www.kemet.com/keask

http://www.kemet.com:8080/elc

Search Our FAQs: KnowledgeEdge

Electrolytic LifeCalculator

Product Information

Resource

Location

Products

Technical Resources (Including Soldering Techniques)

RoHS Statement

http://www.kemet.com/products

http://www.kemet.com/technicalpapers

http://www.kemet.com/rohs

Quality Documents

http://www.kemet.com/qualitydocuments

Product Request

Resource

Location

http://www.kemet.com/sample

http://www.kemet.com/kits

Sample Request

Engineering Kit Request

Contact

Resource

Location

Website

Contact Us

Investor Relations

Call Us

www.kemet.com

http://www.kemet.com/contact

http://www.kemet.com/ir

1-877-MyKEMET

Twitter

http://twitter.com/kemetcapacitors

Disclaimer

All product speciﬁcations, statements, information and data (collectively, the “Information”) are subject to change without notice.

All Information given herein is believed to be accurate and reliable, but is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.

Statements of suitability for certain applications are based on our knowledge of typical operating conditions for such applications, but are not intended to constitute – and we

speciﬁcally disclaim – any warranty concerning suitability for a speciﬁc customer application or use. This Information is intended for use only by customers who have the requisite

experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by us with reference to the

use of our products is given gratis, and we assume no obligation or liability for the advice given or results obtained.

Although we design and manufacture our products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur.

Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or

redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.

Although all product-related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other measures may not

be required.

C1062_C0G_FT-CAP_SMD • 1/10/2013 17

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 200 VDC (Commercial & Automotive Grade)

Digitally signed by Jeannette Calvo

DN: c=US, st=FL, l=Fort Lauderdale, o=KEMET Corp., ou=Marketing Communications,

cn=Jeannette Calvo, email=jeannettecalvo@kemet.com

Date: 2013.01.15 11:06:27 -05'00'

C1062_C0G_FT-CAP_SMD • 1/10/2013 18


型号：	C1206X390D8GAC
厂家：	KEMET CORPORATION
描述：	Ceramic Capacitor, Multilayer, Ceramic, 10V, 1.28% +Tol, 1.28% -Tol, C0G, 30ppm/Cel TC, 0.000039uF, Surface Mount, 1206, CHIP, ROHS COMPLIANT
文件：	总18页 (文件大小：1016K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

C1206X390D8GAC [KEMET]

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