C1206X563B3GALTU_技术文档

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric,

10 – 250 VDC (Commercial & Automotive Grade)

Overview

KEMET’s Flexible Termination (FT-CAP) Multilayer Ceramic

Capacitor in C0G dielectric incorporates a unique, ﬂexible

termination system that is integrated with KEMET’s

standard termination materials. A conductive silver epoxy

is utilized between the base metal and nickel barrier

layers of KEMET’s standard termination system in order

to establish pliability while maintaining terminal strength,

solderability and electrical performance. This technology

was developed in order to address the primary failure

mode of MLCCs– ﬂex cracks, which are typically the result

of excessive tensile and shear stresses produced during

board ﬂexure and thermal cycling. Flexible termination

technology inhibits the transfer of board stress to the rigid

ceramic body, therefore mitigating ﬂex cracks which can

result in low IR or short circuit failures.

Combined with the stability of C0G dielectric and designed to

accommodate all capacitance requirements, these ﬂex-robust

devices are RoHS Compliant, offer up to 5 mm of ﬂex-bend

capability and exhibit no change in capacitance with respect

to time and voltage. Capacitance change with reference to

ambient temperature is limited to ±30 ppm/ºC from −55°C to

+125°C.

In addition to Commercial Grade, Automotive Grade devices

are available which meet the demanding Automotive

Electronics Council's AEC–Q200 qualiﬁcation requirements.

Although this technology does not eliminate the potential

for mechanical damage that may propagate during extreme

environmental and handling conditions, it does provide

superior ﬂex performance over standard termination

systems. FT-CAP complements KEMET’s Open Mode,

Floating Electrode (FE-CAP), Floating Electrode with

Flexible Termination (FF-CAP), and KEMET Power Solutions

(KPS) product lines by providing a complete portfolio of

ﬂex mitigation solutions.

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Ordering Information

C

1206

X

563

J

3

G

A

C

TU

Rated

Voltage Dielectric

(VDC)

Failure

Rate/

Design

Case Size Speciﬁcation/

Capacitance

Code (pF)

Capacitance

Tolerance¹

Packaging/

Grade (C-Spec)

Ceramic

Termination Finish²

(L" x W")

Series

0603

0805

1206

1210

1812

1825

2220

2225

X = Flexible

Termination

Two signiﬁcant digits

and number of zeros.

Use 9 for 1.0 – 9.9 pF

Use 8 for 0.5 – .99 pF

e.g., 2.2 pF = 229

B = ±0.10 pF

C = ±0.25 pF

D = ±0.5 pF

F = ±1%

G = ±2%

J = ±5%

8 = 10

4 = 16

3 = 25

5 = 50

1 = 100

2 = 200

A = 250

G = C0G

A = N/A C = 100% Matte Sn

L = SnPb (5% Pb minimum)

See

"Packaging

C-Spec

Ordering

Options

Table" below

e.g., 0.5 pF = 508

K = ±10%

M = ±20%

¹Additional capacitance tolerance offerings may be available. Contact KEMET for details.

²Additional termination ﬁnish options may be available. Contact KEMET for details.

One world. One KEMET

C1062_C0G_FT-CAP_SMD • 11/21/2016

1

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)

Packaging C-Spec Ordering Options Table

Packaging/Grade

Packaging Type¹

Ordering Code (C-Spec)

Commercial Grade¹

Bulk Bag

Not required (Blank)

7" Reel/Unmarked

TU

7411 (EIA 0603 and smaller case sizes)

7210 (EIA 0805 and larger case sizes)

7081

13" Reel/Unmarked

7" Reel/Unmarked/2mm pitch²

13" Reel/Unmarked/2mm pitch²

7082

Automotive Grade³

7" Reel

AUTO

AUTO7411 (EIA 0603 and smaller case sizes)

AUTO7210 (EIA 0805 and larger case sizes)

3190

13" Reel/Unmarked

7" Reel/Unmarked/2mm pitch²

13" Reel/Unmarked/2mm pitch²

3191

¹Default packaging is "Bulk Bag". An ordering code C-Spec is not required for "Bulk Bag" packaging.

¹The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain

capacitors that have not been laser marked. The option to laser mark is not available on these devices. For more information see "Capacitor Marking".

²The 2mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case

size devices. For more information regarding 2mm pitch option see "Tape & Reel Packaging Information".

³Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L" x W") and thickness dimension. See "Chip Thickness/Tape & Reel

Packaging Quantities" and "Tape & Reel Packaging Information".

³For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information".

³All Automotive packaging C-Specs listed exclude the option to laser mark components. The option to laser mark is not available on these devices. For

more information see "Capacitor Marking".

Beneﬁts

• −55°C to +125°C operating temperature range

• Superior ﬂex performance (up to 5 mm)

• Lead (Pb)-Free, RoHS and REACH compliant

• EIA 0603, 0805, 1206, 1210, 1812, 1825, 2220, and

2225 case sizes

• High ripple current capability

• Preferred capacitance solution at line frequencies and into

the MHz range

• No capacitance change with respect to applied rated DC

voltage

• DC voltage ratings of 10 V, 16 V, 25 V, 50 V, 100 V,

200 V, and 250 V

• Negligible capacitance change with respect to temperature

from −55°C to +125°C

• Capacitance offerings ranging from 0.5 pF up to 0.47 μF

• Available capacitance tolerances of ±0.10pF, ±0.25 pF,

±0.5 pF, ±1%, ±2%, ±5%, ±10%, and ±20%

• No piezoelectric noise

• Extremely low ESR and ESL

• High thermal stability

• Non-polar device, minimizing installation concerns

• 100% pure matte tin-plated termination ﬁnish allowing for

excellent solderability

• Commercial & Automotive (AEC–Q200) Grades available

• SnPb termination ﬁnish option available upon request

(5% Pb minimum)

Applications

Typical applications include critical timing, tuning, circuits requiring low loss, circuits with pulse, high current, decoupling,

bypass, ﬁltering, transient voltage suppression and blocking, as well as energy storage in critical and safety relevant circuits

without (integrated) current limitation, including those subject to high levels of board ﬂexure or temperature cycling.

C1062_C0G_FT-CAP_SMD • 11/21/2016

2

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)

Automotive C-Spec Information

KEMET Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council.

Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualiﬁcation for Passive

Components. These products are supported by a Product Change Notiﬁcation (PCN) and Production Part Approval Process

warrant (PPAP).

Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec,

“AUTO”. This C-Spec was developed in order to better serve small and medium sized companies that prefer an automotive

grade component without the requirement to submit a customer Source Controlled Drawing (SCD) or speciﬁcation for review

by a KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET’s OEM Automotive customers

and are not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are

limited (see details below).

Product Change Notiﬁcation (PCN)

The KEMET Product Change Notiﬁcation system is used to communicate primarily the following types of changes:

• Product/process changes that affect product form, ﬁt, function, and/or reliability

• Changes in manufacturing site

• Product obsolescence

Customer Notiﬁcation due to:

KEMET Automotive

C-Spec

Days prior to

implementation

Process/Product change

Obsolescence*

KEMET assigned¹

AUTO

Yes (with approval and sign off)

Yes (without approval)

Yes

180 days Minimum

90 days Minimum

¹KEMET assigned C-Specs require the submittal of a customer SCD or customer speciﬁcation for review. For additional information contact KEMET.

Production Part Approval Process (PPAP)

The purpose of the Production Part Approval Process is:

• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.

• To provide the evidence that all customer engineering design record and speciﬁcation requirements are properly

understood and

fulﬁlled by the manufacturing organization.

• To demonstrate that the established manufacturing process has the potential to produce the part

PPAP (Product Part Approval Process) Level

KEMET Automotive

C-Spec

1

●

○

2

3

●

○

4

5

KEMET assigned¹

AUTO

●

¹KEMET assigned C-Specs require the submittal of a customer SCD or customer speciﬁcation for review. For additional information contact KEMET.

● Part Number speciﬁc PPAP available

○ Product family PPAP only

C1062_C0G_FT-CAP_SMD • 11/21/2016

3

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)

Dimensions – Millimeters (Inches)

L

ꢁ

T

ꢀ

S

EIA Size

Code

Metric Size

Code

L

W

Width

B

Mounting

Technique

T Thickness

Separation

Minimum

Length

Bandwidth

1.60 (0.064)

±0.17 (0.007)

2.00 (0.079)

±0.30 (0.012)

3.30 (0.130)

±0.40 (0.016)

3.30 (0.130)

±0.40 (0.016)

4.50 (0.178)

±0.40 (0.016)

4.60 (0.181)

±0.40 (0.016)

5.90 (0.232)

±0.75 (0.030)

5.90 (0.232)

±0.75 (0.030)

0.80 (0.032)

±0.15 (0.006)

1.25 (0.049)

±0.30 (0.012)

1.60 (0.063)

±0.35 (0.013)

2.60 (0.102)

±0.30 (0.012)

3.20 (0.126)

±0.30 (0.012)

6.40 (0.252)

±0.40 (0.016)

5.00 (0.197)

±0.40 (0.016)

6.40 (0.248)

±0.40 (0.016)

0.45 (0.018)

±0.15 (0.006)

0.50 (0.02)

0603

0805

1206

1210

1812

1825

2220

2225

1608

2012

3216

3225

4532

4564

5650

5664

0.58 (0.023)

Solder Wave

or

Solder Reﬂow

0.75 (0.030)

±0.25 (0.010)

0.60 (0.024)

±0.25 (0.010)

0.60 (0.024)

±0.25 (0.010)

0.70 (0.028)

±0.35 (0.014)

0.70 (0.028)

±0.35 (0.014)

0.70 (0.028)

±0.35 (0.014)

0.70 (0.028)

±0.35 (0.014)

See Table 2 for

Thickness

N/A

Solder Reﬂow

Only

Qualiﬁcation/Certiﬁcation

Commercial Grade products are subject to internal qualiﬁcation. Details regarding test methods and conditions are

referenced in Table 4, Performance & Reliability.

Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details

regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualiﬁcation for Passive

Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their

website at www.aecouncil.com.

C1062_C0G_FT-CAP_SMD • 11/21/2016

4

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)

Environmental Compliance

Lead (Pb)-free, RoHS, and REACH compliant without exemptions (excluding SnPb termination ﬁnish option).

Electrical Parameters/Characteristics

Item

Parameters/Characteristics

Operating Temperature Range

−55°C to +125°C

±30 ppm/ºC

0%

Capacitance Change with Reference to

+25°C and 0 VDC Applied (TCC)

Aging Rate (Maximum % Capacitance Loss/Decade Hour)

¹Dielectric Withstanding Voltage (DWV)

250% of rated voltage

(5±1 seconds and charge/discharge not exceeding 50 mA)

²Dissipation Factor (DF) Maximum Limit at 25ºC

0.1%

1,000 megohm microfarads or 100 GΩ

(Rated voltage applied for 120±5 seconds at 25°C)

³Insulation Resistance (IR) Limit at 25°C

¹DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the

capacitor.

²Capacitance and dissipation factor (DF) measured under the following conditions:

1 MHz ±100 kHz and 1.0 Vrms ±0.2 V if capacitance ≤ 1,000 pF

1 kHz ±50 Hz and 1.0 Vrms ±0.2 V if capacitance > 1,000 pF

³To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.

Capacitance and Dissipation Factor (DF) measured under the following conditions:

Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known

as Automatic Level Control (ALC). The ALC feature should be switched to "ON."

Post Environmental Limits

High Temperature Life, Biased Humidity, Moisture Resistance

Rated DC

Voltage

Capacitance Dissipation Factor Capacitance

Insulation

Dielectric

C0G

Value

(Maximum %)

Shift

Resistance

10% of Initial

Limit

All

0.5

0.3% or ±0.25 pF

C1062_C0G_FT-CAP_SMD • 11/21/2016

5

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)

Table 1A – Capacitance Range/Selection Waterfall (0603 – 1206 Case Sizes)

Case Size/Series

Voltage Code

C0603X

C0805X

C1206X

8

4

3

5

1

2

A

8

4

3

5

1

2

A

8

4

3

5

1

2

A

Cap

Code

Capacitance

Rated Voltage (VDC)

Product Availability and Chip Thickness Codes

See Table 2 for Chip Thickness Dimensions

Capacitance Tolerance

0.50 & 0.75 pF

1.0 - 9.1 pF*

10 - 91 pF*

100 pF

110 - 180 pF*

200 - 300 pF*

330 pF

508 & 758

109 - 919*

100 - 910*

101

111 - 181*

201 - 301*

331

361

391

431

471

511

561

621

681

751

821

911

102

112

122

132

152

162

182

202

222

242

272

302

332

362

392

432

472

512

562

622

682

752

822

912

103

123

153

183

223

273

333

393

473

B

C

D

CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR

CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ

CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DD DD EQ EQ EQ EQ EQ EQ EQ

CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ

CJ CJ CJ CJ CJ CJ CJ DR DR DR DR DD DD DD EQ EQ EQ EQ EQ EQ EQ

CJ CJ CJ CJ CJ CH CH DR DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ EQ

CJ CJ CJ CJ CJ CH CH DD DD DD DD DD DR DR EQ EQ EQ EQ ER ER ER

CJ CJ CJ CJ CJ CH CH DD DD DD DD DD DR DR EQ EQ EQ EQ ES ER ER

CJ CJ CJ CJ CJ CH CH DD DD DD DD DD DR DR EQ EQ EQ EQ ES ES ES

CJ CJ CJ CJ CJ CH CH DR DR DR DR DR DR DR EQ EQ EQ EQ ES ES ES

CJ CJ CJ CJ CJ CH CH DR DR DR DR DR DR DR EQ EQ EQ EQ ET ET ET

CJ CJ CJ CJ CJ

CJ CJ CJ CJ

CJ CJ CJ

F

G

J

K

M

360 pF

390 pF

430 pF

470 pF

510 pF

560 pF

620 pF

680 pF

750 pF

820 pF

910 pF

1,000 pF

1,100 pF

1,200 pF

1,300 pF

1,500 pF

1,600 pF

1,800 pF

2,000 pF

2,200 pF

2,400 pF

2,700 pF

3,000 pF

3,300 pF

3,600 pF

3,900 pF

4,300 pF

4,700 pF

5,100 pF

5,600 pF

6,200 pF

6,800 pF

7,500 pF

8,200 pF

9,100 pF

10,000 pF

12,000 pF

15,000 pF

18,000 pF

22,000 pF

27,000 pF

33,000 pF

39,000 pF

47,000 pF

56,000 pF

68,000 pF

82,000 pF

0.10 µF

DR DR DR DR DR DR DR EQ EQ EQ EQ ER ER ER

DD DD DD DD DR DR DR ER ER ER ER ER EQ EQ

DD DD DD DD DR DR DR ER ER ER ER ET EQ EQ

DD DD DD DD DR DD DD ER ER ER ER ET EQ EQ

DS DS DS DS DR DD DD ER ER ER ER EF EQ EQ

DS DS DS DS DR DD DD ER ER ER ER ER EQ EQ

DS DS DS DS DR DD DD ES ES ES ES ES EQ EQ

DR DR DR DR DR DD DD ES ES ES ES ES EQ EQ

DR DR DR DR DR DG DG EQ EQ EQ EQ EQ EQ EQ

DR DR DR DR DR DG DG ER ER ER ER EQ ER ER

DR DR DR DR DR

DR DR DR DR DD

DR DR DR DR DS

DR DR DR DD DG

DR DR DR DD

DD DD DD DF

DF DF DF

CJ CJ CJ

ER ER ER ER EQ ER ER

ES ES ES ES EQ ER ER

EQ EQ EQ EQ EQ ES ES

EQ EQ EQ EQ EQ EF EF

EQ EQ EQ EQ EQ EH EH

EQ EQ EQ EQ ER EH EH

EQ EQ EQ EQ ET

ER ER ER ET EH

ES ES ES EF

CJ CJ CJ

DG DG DG

563

683

823

104

EF EF EF EH

EH EH EH EH

EH EH EH

Rated Voltage (VDC)

Voltage Code

Cap

Code

8

4

3

5

1

2

A

8

4

3

5

1

2

A

8

4

3

5

1

2

A

Capacitance

Case Size/Series

C0603X

C0805X

C1206X

*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91)

These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts.

C1062_C0G_FT-CAP_SMD • 11/21/2016

6

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)

Table 1B – Capacitance Range/Selection Waterfall (1210 – 2225 Case Sizes)

Case Size/Series

Voltage Code

C1210X

C1812X

C1825X

C2220X

C2225X

8

4

3

5

1

2

A

5

1

2

A

5

1

2

A

5

1

2

A

5

1

2

A

Cap

Code

Capacitance

Rated Voltage (VDC)

Product Availability and Chip Thickness Codes

See Table 2 for Chip Thickness Dimensions

Capacitance Tolerance

1.0 - 9.1 pF*

10 - 91 pF*

100 - 430 pF*

470 - 910 pF*

1,000 pF

1,100 pF

1,200 pF

1,300 pF

1,500 pF

1,600 pF

1,800 pF

2,000 pF

2,200 pF

2,400 pF

2,700 pF

3,000 pF

3,300 pF

3,600 pF

3,900 pF

4,300 pF

4,700 pF

5,100 pF

5,600 pF

6,200 pF

6,800 pF

7,500 pF

8,200 pF

9,100 pF

10,000 pF

12,000 pF

15,000 pF

18,000 pF

22,000 pF

27,000 pF

33,000 pF

39,000 pF

47,000 pF

56,000 pF

68,000 pF

82,000 pF

0.10 µF

109 - 919*

100 - 910*

101 - 431*

471 - 911*

102

112

122

132

152

162

182

202

222

242

272

302

332

362

392

432

472

512

562

622

682

752

822

912

103

123

153

183

223

273

333

393

473

563

683

823

104

124

154

184

224

274

334

394

474

B

C

D

FN FN FN FN FN FN FN

F

G

J

K

M

FN FN FN FN FN FN FN GB GB GB GB

FN FN FN FN FN FQ FQ GB GB GB GB

FN FN FN FN FN FE FE GB GB GB GB

FN FN FN FN FQ FE FE GB GB GB GB

FN FN FN FN FQ FZ FZ GB GB GB GB

FN FN FN FN FQ FQ FQ

FN FN FN FN FQ FQ FQ GB GB GB GB

FN FN FN FN FQ FA FA

FN FN FN FN FA FA FA GB GB GB GB

FN FN FN FN FA FA FA

FN FN FN FN FA FA FA GB GB GB GB HB HB HB HB

FN FN FN FN FA FA FA

FA FA FA FA FZ FZ FZ GB GB GD GD HB HB HB HB

FN FN FN FN FZ FZ FZ

FN FN FN FN FZ FZ FZ GB GB GH GH HB HB HB HB

FN FN FN FN FZ FN FN

FN FN FN FN FZ FN FN GB GB GJ GJ HB HB HB HB JE JE JB

FQ FQ FQ FQ FQ FN FN

FQ FQ FQ FQ FQ FN FN GB GH GB GB HB HB HB HB JE JE JB

FE FE FE FE FE FN FN

FA FA FA FA FA FN FN GB GH GB GB HB HB HE HE JE JE JB

FZ FZ FZ FZ FN FN FN GB GG GB GB HB HB HE HE JE JE JB

FZ FZ FZ FZ FN FQ FQ GB GB GB GB HB HB

FN FN FN FN FN FQ FQ GB GB GB GB HB HE

FN FN FN FN FN FA FA GB GB GB GB HB HE

FN FN FN FN FN FZ FZ GB GB GB GB HB HG

FN FN FN FN FN FU FU GB GB GB GB

KE KE KE KE

KE KE

JE JE JB

JE JB JB

JB JB JB

JB JB JD

JB JB JG

JB JD JG

JB JD

KE KE

KE

FN FN FN FN FE FU FU GB GB GB GB

FN FN FN FN FE FJ FJ GB GB GD GD

FN FN FN FN FA

FN FN FN FQ FZ

FQ FQ FQ FA FU

FE FE FE FZ FM

FZ FZ FZ FU

FU FU FU FM

FJ FJ FJ

GB GB GD GD

GB GB GK GK

GB GB GM GM

GB GD GM GM

GB GH

0.12 µF

0.15 µF

0.18 µF

0.22 µF

0.27 µF

0.33 µF

0.39 µF

0.47 µF

GD GN

GH

GK

FK FK FK

JB JF

JD JG

JG

Rated Voltage (VDC)

Voltage Code

Cap

Code

8

4

3

5

1

2

A

5

1

2

A

5

1

2

A

5

1

2

5

1

2

A

Capacitance

Case Size/Series

C1210X

C1812X

C1825X

C2220X

C2225X

*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82 and 91)

These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts.

C1062_C0G_FT-CAP_SMD • 11/21/2016

7

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)

Table 2A – Chip Thickness/Tape & Reel Packaging Quantities

Paper Quantity¹

7" Reel 13" Reel

Plastic Quantity

7" Reel 13" Reel

Thickness Case Thickness ±

Code

Size¹Range (mm)

CJ

CH

DR

DD

DS

DF

DG

EQ

ER

ES

ET

EF

EH

FN

FQ

FE

FA

FZ

FU

FM

FJ

FK

GB

GD

GH

GG

GK

GJ

GN

GM

HB

HE

HG

JB

JD

JE

0603

0805

1206

1210

1812

1825

2220

2225

0.80 ± 0.15

0.85 ± 0.07

0.78 ± 0.20

0.90 ± 0.10

1.00 ± 0.20

1.10 ± 0.10

1.25 ± 0.15

0.78 ± 0.20

0.90 ± 0.20

1.00 ± 0.20

1.10 ± 0.20

1.20 ± 0.15

1.60 ± 0.20

0.78 ± 0.20

0.90 ± 0.20

1.00 ± 0.10

1.10 ± 0.15

1.25 ± 0.20

1.55 ± 0.20

1.70 ± 0.20

1.85 ± 0.20

2.10 ± 0.20

1.00 ± 0.10

1.25 ± 0.15

1.40 ± 0.15

1.55 ± 0.10

1.60 ± 0.20

1.70 ± 0.15

1.70 ± 0.20

2.00 ± 0.20

1.10 ± 0.15

1.40 ± 0.15

1.60 ± 0.20

1.00 ± 0.15

1.30 ± 0.15

1.40 ± 0.15

1.50 ± 0.15

1.70 ± 0.15

1.40 ± 0.15

4,000

0

4,000

0

15,000

10,000

0

4,000

2,500

4,000

2,500

2,000

4,000

2,500

2,000

1,000

500

10,000

8,000

10,000

8,000

4,000

2,000

4,000

0

10,000

0

1,000

0

JF

JG

KE

7" Reel

13" Reel

7" Reel

13" Reel

Thickness

Code

Case

Size¹

Thickness ±

Range (mm)

Paper Quantity¹

Plastic Quantity

Package quantity based on ﬁnished chip thickness speciﬁcations.

¹If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA 0603

(1608 metric) case size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”.

C1062_C0G_FT-CAP_SMD • 11/21/2016

8

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)

Table 2B – Bulk Packaging Quantities

Loose Packaging

Packaging Type

Bulk Bag (default)

Packaging C-Spec¹

N/A²

Case Size

Packaging Quantities (pieces/unit packaging)

EIA (in)

Metric (mm)

Minimum

Maximum

0402

0603

0805

1206

1210

1808

1812

1825

2220

2225

1005

1608

2012

3216

3225

4520

4532

4564

5650

5664

50,000

1

20,000

¹The "Packaging C-Spec" is a 4 to 8 digit code which identiﬁes the packaging type and/or product grade. When ordering, the proper code must be

included in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details.

Commercial Grade product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk

bag packaging option for Automotive Grade products.

²A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and Automotive Grade products). The

15th through 22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our

standard "Bulk Bag" packaging.

C1062_C0G_FT-CAP_SMD • 11/21/2016

9

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)

Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 (mm)

Density Level A:

Maximum (Most)

Land Protrusion (mm)

Density Level B:

Median (Nominal)

Land Protrusion (mm)

Density Level C:

Minimum (Least)

Land Protrusion (mm)

EIA

Size

Code

Metric

Size

Code

C

Y

X

V1

V2

C

Y

X

V1

V2

C

Y

X

V1

V2

0603

0805

1206

1210

1812

1825

2220

2225

1608

2012

3216

3225

4532

4564

5650

5664

0.85

1.25

1.10

4.00

2.10

0.75

1.05

1.00

3.10

1.50

0.65

0.85

0.90

2.40

1.20

0.99

1.59

2.30

2.15

2.85

1.44

1.62

1.75

1.80

2.10

1.66

2.06

3.01

2.30

6.90

5.50

6.90

4.47

5.85

5.90

7.40

7.10

8.80

2.71

3.06

4.01

3.30

7.90

6.50

7.90

0.89

1.49

2.20

2.05

2.75

1.24

1.42

1.55

1.60

1.90

1.56

1.96

2.91

2.20

6.80

5.40

6.80

3.57

4.95

6.50

6.20

7.90

2.11

2.46

3.41

2.70

7.30

5.90

7.30

0.79

1.39

2.10

1.95

2.65

1.04

1.22

1.35

1.40

1.70

1.46

1.86

2.81

2.10

6.70

5.30

6.70

2.42

4.25

5.80

5.50

7.20

1.81

2.16

3.11

2.40

7.00

5.60

7.00

Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reﬂow

solder processes. KEMET only recommends wave soldering of EIA 0603, 0805, and 1206 case sizes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reﬂow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform

qualiﬁcation testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).

Image below based on Density Level B for an EIA 1210 case size.

V1

ꢀ

V2

ꢁ

C

Grid Placement Courtyard

C1062_C0G_FT-CAP_SMD • 11/21/2016 10

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)

Soldering Process

Recommended Soldering Technique:

• Solder wave or solder reﬂow for EIA case sizes 0603, 0805 and 1206

• All other EIA case sizes are limited to solder reﬂow only

Recommended Reﬂow Soldering Proﬁle:

KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),

convection, IR or vapor phase reﬂow techniques. Preheating of these components is recommended to avoid extreme thermal

stress. KEMET’s recommended proﬁle conditions for convection and IR reﬂow reﬂect the proﬁle conditions of the IPC/J-

STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reﬂow passes at

these conditions.

Termination Finish

T_P

T_L

t_P

Proﬁle Feature

Maximum ꢀamp ꢁp ꢀate ꢂ ꢃꢄCꢅsec

Maximum ꢀamp Doꢆn ꢀate ꢂ ꢇꢄCꢅsec

SnPb

100% Matte Sn

t_L

Preheat/Soak

Temperature Minimum (T_Smin

)

100°C

150°C

200°C

T_smax

T_smin

Temperature Maximum (T_Smax

Time (t_S) from T_Sminto T_Smax

)

60 – 120 seconds

t_s

3°C/second

maximum

3°C/second

maximum

Ramp-Up Rate (T_Lto T_P)

25

25ꢄC to Peaꢈ

Liquidous Temperature (T_L)

Time Above Liquidous (t_L)

Peak Temperature (T_P)

183°C

60 – 150 seconds

235°C

217°C

60 – 150 seconds

260°C

Time

Time Within 5°C of Maximum

20 seconds

maximum

30 seconds

maximum

Peak Temperature (t_P)

6°C/second

maximum

6°C/second

maximum

Ramp-Down Rate (T_Pto T_L)

Time 25°C to Peak

6 minutes

maximum

8 minutes

maximum

Temperature

Note 1: All temperatures refer to the center of the package, measured on the

capacitor body surface that is facing up during assembly reﬂow.

C1062_C0G_FT-CAP_SMD • 11/21/2016 11

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)

Table 4 – Performance & Reliability: Test Methods and Conditions

Stress

Reference

Test or Inspection Method

Terminal Strength

JIS–C–6429

Appendix 1, Note: Force of 1.8 kg for 60 seconds.

Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm

for C0G. Flexible termination system – 3.0 mm (minimum).

Board Flex

JIS–C–6429

Magniﬁcation 50 X. Conditions:

a) Method B, 4 hours at 155°C, dry heat at 235°C

b) Method B at 215°C category 3

Solderability

J–STD–002

c) Method D, category 3 at 260°C

Temperature Cycling

Biased Humidity

JESD22 Method JA–104 1,000 Cycles (−55°C to +125°C). Measurement at 24 hours +/−4 hours after test conclusion.

Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor.

MIL–STD–202 Method

103

Measurement at 24 hours +/−4 hours after test conclusion.

Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.

Measurement at 24 hours +/−4 hours after test conclusion.

MIL–STD–202 Method

t = 24 hours/cycle. Steps 7a and 7b not required.

Moisture Resistance

Thermal Shock

Measurement at 24 hours +/−4 hours after test conclusion.

106

MIL–STD–202 Method

−55°C/+125°C. Note: Number of cycles required – 300, maximum transfer time – 20

seconds, dwell time – 15 minutes. Air – Air.

107

MIL–STD–202 Method

108

High Temperature Life

1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied.

/EIA–198

MIL–STD–202 Method

108

Storage Life

Vibration

150°C, 0 VDC for 1,000 hours.

5 g's for 20 minutes, 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick

7 secure points on one long side and 2 secure points at corners of opposite sides. Parts

mounted within 2" from any secure point. Test from 10 – 2,000 Hz

MIL–STD–202 Method

204

MIL–STD–202 Method

Mechanical Shock

Figure 1 of Method 213, Condition F.

213

MIL–STD–202 Method

215

Resistance to Solvents

Add aqueous wash chemical, OKEM Clean or equivalent.

Storage and Handling

Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in

other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,

and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp

and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum

storage humidity not exceed 70% relative humidity. Temperature ﬂuctuations should be minimized to avoid condensation on

the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock

should be used promptly, preferably within 1.5 years of receipt.

C1062_C0G_FT-CAP_SMD • 11/21/2016 12

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)

Construction

Detailed Cross Section

Dielectric Material

(Caꢇrꢈ_ꢉ)

ꢀnd Terminationꢂ

ꢀxternal ꢀlectrode

(Cu)

Barrier Layer

(Ni)

Termination Finish

ꢀpoxy Layer

(Aꢁ)

(100ꢆ Matte

SnꢂSnPb–5ꢆ Pb min)

Dielectric Material

(Caꢇrꢈ_ꢉ)

ꢅnner ꢀlectrodes

(ꢄi)

ꢀnd Terminationꢂ

ꢀxternal ꢀlectrode

(Cu)

Epoxy Layer

(Ag)

ꢃarrier Layer

(ꢄi)

Termination Finish

Inner Electrodes

(Ni)

(100ꢆ Matte

SnꢂSnPb–5ꢆ Pb min)

Capacitor Marking (Optional):

Laser marking option is not available on:

• C0G, Ultra Stable X8R and Y5V dielectric devices

• EIA 0402 case size devices

• EIA 0603 case size devices with Flexible Termination option.

• KPS Commercial and Automotive grade stacked devices.

These capacitors are supplied unmarked only.

C1062_C0G_FT-CAP_SMD • 11/21/2016 13

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)

Tape & Reel Packaging Information

KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with

EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for

details on reeling quantities for commercial chips.

ꢏar Code Label

Anti-Static ꢆeel

®

ꢇmbossed Plasticꢈ or

Punched Paper Carrierꢃ

Chip and ꢋPS ꢌrientation in Pocꢊet

(except 1ꢀ25 Commercial, and 1ꢀ25 and 2225 Military)

KEMET

Sprocꢊet ꢐoles

ꢇmbossment or Punched Cavity

ꢀ mm, 12 mm

or 1ꢁ mm Carrier Tape

Anti-Static Cover Tape

(ꢃ10 mm (ꢃ00ꢉꢄ) Maximum Thicꢊness)

1ꢂꢀ mm (ꢂꢃ00ꢄ)

or

ꢅꢅ0 mm (1ꢅꢃ00ꢄ)

ꢈꢇꢍA 01005, 0201, 0ꢉ02 and 0ꢁ0ꢅ case siꢎes available on punched paper carrier onlyꢃ

Table 5 – Carrier Tape Conﬁguration, Embossed Plastic & Punched Paper (mm)

New 2 mm Pitch Reel Options*

Embossed Plastic Punched Paper

Tape

Packaging

Ordering Code

(C-Spec)

C-3190

7" Reel 13" Reel 7" Reel 13" Reel

EIA Case Size Size

(W)*

Packaging Type/Options

Pitch (P₁)* Pitch (P₁)*

01005 – 0402

0603

8

2

2/4

4

Automotive grade 7" reel unmarked

Automotive grade 13" reel unmarked

Commercial grade 7" reel unmarked

Commercial grade 13" reel unmarked

C-3191

2/4

4

C-7081

0805

8

4

C-7082

1206 – 1210

1805 – 1808

≥ 1812

8

4

* 2 mm pitch reel only available for 0603 EIA case size.

2 mm pitch reel for 0805 EIA case size under development.

12

16

8

4

8

Beneﬁts of Changing from 4 mm to 2 mm Pitching Spacing

• Lower placement costs

• Double the parts on each reel results in fewer reel

changes and increased efﬁciency

• Fewer reels result in lower packaging, shipping and

storage costs, reducing waste

KPS 1210

8

KPS 1812 & 2220

Array 0508 & 0612

12

4

12

4

*Refer to Figures 1 & 2 for W and P₁carrier tape reference locations.

*Refer to Tables 6 & 7 for tolerance speciﬁcations.

C1062_C0G_FT-CAP_SMD • 11/21/2016 14

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)

Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

T

P 2

ꢉ10 pitches cumulative

tolerance on tape ꢊ 0ꢋ2 mmꢌ

2

ꢅ

1

Po

ꢄDo

Ao

F

ꢂo

ꢀ

ꢅ

2

ꢁ

1

ꢁo

S

1

P

1

T

1

ꢅmbossment

For cavity siꢆe,

see ꢇote 1 Table ꢈ

Center Lines of Cavity

ꢄD

1

Cover Tape

is for tape feeder reference only,

includinꢃ draft concentric about ꢁ

ꢁ

1

o

.

User Direction of Unreeling

Table 6 – Embossed (Plastic) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

D₁Minimum

Note 1

1.0

(0.039)

R Reference S₁Minimum

T

T₁

Tape Size

8 mm

D₀

E₁

P₀

P₂

Note 2

Note 3

Maximum Maximum

25.0

(0.984)

1.5 +0.10/-0.0

(0.059 +0.004/-

0.0)

1.75 ±0.10

4.0 ±0.10

2.0 ±0.05

0.600

(0.024)

0.100

(0.004)

12 mm

16 mm

(0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002)

(0.024)

1.5

(0.059)

30

(1.181)

Variable Dimensions — Millimeters (Inches)

B₁Maximum

Note 4

E₂

T₂

W

Tape Size

8 mm

Pitch

F

P₁

A₀,B₀& K₀

Minimum

6.25

(0.246)

Maximum Maximum

2.5

(0.098)

4.35

(0.171)

3.5 ±0.05

(0.138 ±0.002) (0.157 ±0.004)

4.0 ±0.10

8.3

(0.327)

Single (4 mm)

Single (4 mm) &

Double (8 mm)

8.2

10.25

5.5 ±0.05

8.0 ±0.10

4.6

12.3

12 mm

16 mm

Note 5

(0.323)

(0.404)

(0.217 ±0.002) (0.315 ±0.004)

(0.181)

(0.484)

12.1

(0.476)

14.25

(0.561)

7.5 ±0.05 12.0 ±0.10

(0.138 ±0.002) (0.157 ±0.004)

4.6

(0.181)

16.3

(0.642)

Triple (12 mm)

1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment

location and hole location shall be applied independent of each other.

2. The tape with or without components shall pass around R without damage (see Figure 6).

3. If S₁< 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).

4. B₁dimension is a reference dimension for tape feeder clearance only.

5. The cavity deﬁned by A₀, B₀and K₀shall surround the component with sufﬁcient clearance that:

(a) the component does not protrude above the top surface of the carrier tape.

(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).

(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see

Figure 4).

(e) for KPS Series product, A₀and B₀are measured on a plane 0.3 mm above the bottom of the pocket.

(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.

C1062_C0G_FT-CAP_SMD • 11/21/2016 15

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)

Figure 2 – Punched (Paper) Carrier Tape Dimensions

T

ꢇ10 pitches cumulative

ꢁ¹

Po

ꢀDo

tolerance on tape ꢈ 0ꢉ2 mmꢊ

A⁰

F

ꢂ

ꢁ²

ꢃ⁰

ꢃottom Cover Tape

P¹

G

Cavity Siꢄe,

See

T¹

Center Lines of Cavity

Top Cover Tape

ꢅote 1, Table ꢆ

ꢃottom Cover Tape

User Direction of Unreeling

Table 7 – Punched (Paper) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

R Reference

Note 2

Tape Size

8 mm

D₀

E₁

P₀

P₂

T₁Maximum

G Minimum

0.10

1.5 +0.10 -0.0

(0.059 +0.004 -0.0)

1.75 ±0.10

(0.069 ±0.004)

4.0 ±0.10

(0.157 ±0.004)

2.0 ±0.05

(0.079 ±0.002)

0.75

(0.030)

25

(0.984)

(0.004)

Maximum

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

Pitch

E2 Minimum

F

P₁

T Maximum

W Maximum

A₀B₀

2.0 ±0.05

(0.079 ±0.002)

4.0 ±0.10

(0.157 ±0.004)

8.3

(0.327)

8.3

(0.327)

Half (2 mm)

Single (4 mm)

6.25

(0.246)

3.5 ±0.05

(0.138 ±0.002)

1.1

(0.098)

Note 1

8 mm

1. The cavity deﬁned by A₀, B₀and T shall surround the component with sufﬁcient clearance that:

a) the component does not protrude beyond either surface of the carrier tape.

b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

c) rotation of the component is limited to 20° maximum (see Figure 3).

d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).

e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.

2. The tape with or without components shall pass around R without damage (see Figure 6).

C1062_C0G_FT-CAP_SMD • 11/21/2016 16

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)

Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 Kg minimum.

2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

Tape Width

8 mm

Peel Strength

0.1 to 1.0 Newton (10 to 100 gf)

0.1 to 1.3 Newton (10 to 130 gf)

12 and 16 mm

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be

165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of

300 ±10 mm/minute.

3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA

Standards 556 and 624.

Figure 3 – Maximum Component Rotation

°

T

Maximum Component Rotation

Top View

Maximum Component Rotation

Side View

Typical Pocꢄet Centerline

Tape

Maximum

°

T

s

Width (mm) Rotation (

)

ꢁ,12

1ꢂ – 200

20

10

ꢀo

Tape

Maximum

°

S

Width (mm) Rotation (

)

ꢁ,12

1ꢂ – 5ꢂ

ꢃ2 – 200

20

10

5

Typical Component Centerline

Ao

Figure 4 – Maximum Lateral Movement

Figure 5 – Bending Radius

ꢃmbossed

Carrier

Punched

Carrier

ꢁ mm & 12 mm Tape

1ꢂ mm Tape

0ꢀ5 mm maximum

1ꢀ0 mm maximum

ꢀ

ꢁendinꢂ

ꢀadius

ꢀ

C1062_C0G_FT-CAP_SMD • 11/21/2016 17

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)

Figure 6 – Reel Dimensions

Full ꢁadius,

ꢊꢋ (ꢆncludes

flanꢌe distortion

at outer edꢌe)

Access ꢃole at

Slot Location

(ꢄ ꢅ0 mm minimum)

See ꢀote

ꢊ2 (Measured at hub)

D

(See ꢀote)

A

ꢀ

C

(Arbor hole

ꢊ1 (Measured at hub)

diameter)

ꢆf present,

tape slot in core

for tape startꢇ

2ꢈ5 mm minimum ꢉidth x

10ꢈ0 mm minimum depth

ꢂ

(see ꢀote)

ꢀoteꢇ Drive spoꢍes optionalꢎ if used, dimensions ꢂ and D shall applyꢈ

Table 8 – Reel Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size

8 mm

A

B Minimum

C

D Minimum

178 ±0.20

(7.008 ±0.008)

or

1.5

(0.059)

13.0 +0.5/-0.2

(0.521 +0.02/-0.008)

20.2

(0.795)

12 mm

16 mm

330 ±0.20

(13.000 ±0.008)

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

N Minimum

W₁

W₂Maximum

W₃

8.4 +1.5/-0.0

(0.331 +0.059/-0.0)

14.4

(0.567)

50

(1.969)

12.4 +2.0/-0.0

18.4

Shall accommodate tape

width without interference

12 mm

16 mm

(0.488 +0.078/-0.0)

(0.724)

16.4 +2.0/-0.0

(0.646 +0.078/-0.0)

22.4

(0.882)

C1062_C0G_FT-CAP_SMD • 11/21/2016 18

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)

Figure 7 – Tape Leader & Trailer Dimensions

ꢄmbossed Carrier

Carrier Tape

Punched Carrier

ꢈ mm & 12 mm only

ꢁound Sprocꢂet ꢃoles

START

END

Top Cover Tape

ꢄlonꢅated Sprocꢂet ꢃoles

(ꢆ2 mm tape and ꢇider)

100 mm

Minimum Leader

ꢉ00 mm Minimum

Trailer

Components

1ꢀ0 mm Minimum

Top Cover Tape

Figure 8 – Maximum Camber

ꢄlonꢃated sprocꢁet holes

(ꢅ2 mm & ꢆider tapes)

Carrier Tape

ꢀound Sprocꢁet ꢂoles

1 mm Maximum, either direction

Straiꢃht ꢄdꢃe

250 mm

C1062_C0G_FT-CAP_SMD • 11/21/2016 19

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), C0G Dielectric, 10 – 250 VDC (Commercial & Automotive Grade)

KEMET Electronic Corporation Sales Ofﬁces

For a complete list of our global sales ofﬁces, please visit www.kemet.com/sales.

Disclaimer

All product speciﬁcations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for

checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.

All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.

Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such

applications, but are not intended to constitute – and KEMET speciﬁcally disclaims – any warranty concerning suitability for a speciﬁc customer application or use.

The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any

technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no

obligation or liability for the advice given or results obtained.

Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component

failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards

(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or

property damage.

Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other

measures may not be required.

KEMET is a registered trademark of KEMET Electronics Corporation.

C1062_C0G_FT-CAP_SMD • 11/21/2016 20


型号：	C1206X563B3GALTU
厂家：	KEMET CORPORATION
描述：	Flexible Termination System (FT-CAP), C0G Dielectric, 10 - 250 VDC (Commercial & Automotive Grade)
文件：	总20页 (文件大小：1402K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

C1206X563B3GALTU [KEMET]

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