C1210H393BCGAGTU_技术文档

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

HV-HT Series, High Voltage, High Temperature 200°C,

C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)

Overview

KEMET’s High Voltage-High Temperature (HV-HT) series

surface mount C0G Multilayer Ceramic Capacitors (MLCCs) are

constructed of a robust and proprietary base metal electrode

reference to ambient temperature. Capacitance change is limited

to ±30ppm/ºC from −55°C to +200°C. In addition, these capacitors

exhibit high insulation resistance with low dissipation factor at

(BME) dielectric system that offers industry-leading performance elevated temperatures up to 200°C. They also exhibit low ESR

at extreme temperatures. These surface mountable devices

feature a 200ºC maximum operating temperature and are

speciﬁcally designed to withstand the demands of harsh

industrial environments such as oil exploration and automotive/

avionics engine compartment circuitry. They also offer

higher and more uniform breakdown voltage performance

than competitive products, resulting in increased yields in

customer ﬁeld applications. When dealing with expensive high

temperature circuitry and systems, higher yields can quickly

result in signiﬁcant cost savings.

at high frequencies and offer superior volumetric efﬁciency over

competitive high temperature precious metal electrode (PME) and

base metal electrode (BME) dielectric system devices.

These devices are Lead (Pb)-Free, RoHS and REACH compliant

without the need of any exemptions.

KEMET’s HV-HT series MLCCs are temperature compensating

and are suited for resonant circuit applications or those where

Q and stability of capacitance characteristics are required.

They exhibit no change in capacitance with respect to time

and voltage and boast a negligible change in capacitance with

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Ordering Information

C

2225

H

393

J

C

G

A

C

TU

Case Size Speciﬁcation/

Capacitance

Code (pF)

Capacitance Rated Voltage

Failure Rate/

Design

Packaging/Grade

(C-Spec)

Ceramic

Dielectric

G = C0G

Termination Finish²

(L" x W")

Series

Tolerance¹

(VDC)

0805

1206

1210

1808

1812

1825

2220

2225

2824

3040

3640

4540

H = High

Temperature

(200°C)

Two signiﬁcant B = ±0.10 pF

digits + C = ±0.25 pF

number of zeros. D = ±0.5 pF

F = ±1%

C = 500

B = 630

A = N/A

C = 100% Matte Sn

See “Packaging

C-Spec Ordering

Options Table”

below

L = SnPb (5% Pb min.)

E = Gold (Au) 1.97 – 11.8 µin

F = Gold (Au) 30 – 50 µin

G = Gold (Au) 100 µin min.

D = 1,000

F = 1,500

G = 2,000

G = ±2%

J = ±5%

K = ±10%

M = ±20%

¹Additional capacitance tolerance offerings may be available. Contact KEMET for details.

²Gold(Au) termination ﬁnish options are not available on 2824, 3040, 3640 and 4540 case sizes.

One world. One KEMET

C1069_C0G_HV_HT_200C • 3/24/2016 1

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)

Packaging C-Spec Ordering Options Table

Packaging

Ordering Code (C-Spec)

Termination Finish Options

Packaging Type/Options

Standard Packaging – Unmarked³

Bulk Bag

Wafﬂe Tray²

Blank¹

7292

TU

7" Tape & Reel

7411 (EIA 0603 and smaller case sizes)

7210 (EIA 0805 and larger case sizes)

13" Reel

C = 100% Matte Sn

7” Tape & Reel/2 mm pitch⁴

7" Tape & Reel – 50 pcs

7" Tape & Reel – 100 pcs

7" Tape & Reel – 250 pcs

7" Tape & Reel – 500 pcs

7" Tape & Reel – 1,000 pcs

7081

T050

T100

T250

T500

T1K0

L = SnPb (5% Pb min.)

F = Gold (Au) 30 – 50 µin

G = Gold (Au) 100 µin min.

Moisture Sensitive Packaging⁵– Unmarked³

Wafﬂe Tray²

7282

7130

7" Tape & Reel

7" Tape & Reel – 50 pcs

7" Tape & Reel – 100 pcs

7" Tape & Reel – 250 pcs

7" Tape & Reel – 500 pcs

7" Tape & Reel – 1,000 pcs

E = Gold (Au) 1.97 – 11.8 µin

F = Gold (Au) 30 – 50 µin

G = Gold (Au) 100 µin min.

Contact KEMET⁶

¹Default packaging is “Bulk Bag”. An ordering code C-Spec is not required for “Bulk Bag” packaging.

¹“Bulk Bag” packaging option is not available for Gold (Au) termination ﬁnish options and case sizes larger than 2225 (5664 Metric).

²“Wafﬂe Tray” packaging option is not available for case sizes larger than 2225 (5664 Metric).

³The terms “Marked” and “Unmarked” pertain to laser marking option of components. All packaging options labeled as “Unmarked” will contain capacitors that

have not been laser marked. The option to laser mark is not available on these devices.

³Reeling quantities are dependent upon chip size and thickness dimension. When ordering using the “T1K0” packaging option, 1812 thru 2225 case size devices

with chip thickness of ≥ 1.9mm (nominal) may be shipped on multiple 7” reels or a single 13” reel. Additional reeling or packaging options may be available.

Contact KEMET for details.

⁴The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case size

devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”.

⁵Moisture sensitive packaging is required for Gold (Au) termination option “E” (1.97 – 11.8 µin)

⁶Additional reeling or packaging options may be available. Contact KEMET for details.

C1069_C0G_HV_HT_200C • 3/24/2016 2

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)

Beneﬁts

• Operating temperature range of −55°C to +200°C

• Lead (Pb)-Free, RoHS, and REACH compliant

• EIA 0805, 1206, 1210, 1808, 1812, 1825, 2220, 2225, 2824,

3040, 3640 and 4540 case sizes

• No capacitance change with respect to applied rated

DC voltage

• Negligible capacitance change with respect to temperature

from −55°C to +125°C

• DC voltage ratings of 500 V, 630 V, 1 KV, 1.5 KV, and 2 KV

• Capacitance offerings ranging from 1 pF to 0.150 μF

• Available capacitance tolerances of ±0.10 pF, ±0.25 pF,

±0.5 pF, ±1%, ±2%, ±5%, ±10%, and ±20%

• No piezoelectric noise

• No capacitance decay with time

• Non-polar device, minimizing installation concerns

• 100% pure matte tin-plated termination ﬁnish allowing for

excellent solderability

• SnPb plated termination ﬁnish option available upon request

(5% Pb minimum)

• Extremely low ESR & ESL

• High thermal stability

• High ripple current capability

• Gold (Au), Tin/Lead (Sn/Pb) and 100% pure matte Tin (Sn)

termination ﬁnishes available

Applications

Typical applications include critical timing, tuning, circuits requiring low loss, circuits with pulse, high current, switch mode power

supplies (input ﬁlters, resonators, tank circuits, snubbed circuits, output ﬁlters), high voltage coupling, DC blocking and voltage

multiplier circuits in extreme environments such as down-hole exploration, aerospace engine compartments and geophysical probes.

Markets include power supply, HID lighting, industrial equipment/control, automotive, aerospace, and munitions.

Qualiﬁcation/Certiﬁcation

High temperature (200ºC) Industrial grade products meet or exceed the requirements outlined in Table 4, Performance & Reliability.

Qualiﬁcation packages are available for review and download on our website at www.kemet.com/hightemp

Environmental Compliance

Lead (Pb)-Free, RoHS, and REACH compliant without exemptions (excluding SnPb termination ﬁnish option).

C1069_C0G_HV_HT_200C • 3/24/2016 3

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)

Dimensions – Millimeters (Inches)

L

W

T

B

S

EIA

Size

Code

Metric

Size

Code

S

L

W

Width

T

B

Mounting

Technique

Separation

Minimum

Length

Thickness

Bandwidth

0805

1206

1210

1808

1812

1825

2220

2225

2824

3040

3640

4540

2012

3216

3225

4520

4532

4564

5650

5664

7260

7610

9210

-

2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008)

3.20 (.126) ± 0.20 (.008) 1.60 (.063) ± 0.20 (.008)

3.20 (.126) ± 0.20 (.008) 2.50 (.098) ± 0.20 (.008)

4.70 (.185) ± 0.50 (.020) 2.00 (.079) ± 0.20 (.008)

4.50 (.177) ± 0.30 (.012) 3.20 (.126) ± 0.30 (.012)

4.50 (.177) ± 0.30 (.012) 6.40 (.252) ± 0.40 (.016)

5.70 (.224) ± 0.40 (.016) 5.00 (.197) ± 0.40 (.016)

5.60 (.220) ± 0.40 (.016) 6.40 (.248) ± 0.40 (.016)

7.10 (.280) ± 0.40 (.016) 6.10 (.240) ± 0.40 (.016)

7.60 (.300) ± 0.40 (.016) 10.20 (.402) ± 0.40 (.016)

9.10 (.358) ± 0.40 (.016) 10.20 (.402) ± 0.40 (.016)

11.40 (.449) ± 0.40 (.016) 10.20 (.402) ± 0.40 (.016)

0.50 (0.02) ± 0.25 (.010)

0.60 (.024) ± 0.35 (.014)

1.27 (.050) ± 0.40 (.016)

0.75 (.030)

"Solder Wave or

Solder Reﬂow"

See Table 2 for

Thickness

N/A

Solder Reﬂow Only

C1069_C0G_HV_HT_200C • 3/24/2016 4

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)

Electrical Parameters/Characteristics

Item

Parameters/Characteristics

Operating Temperature Range

−55°C to +200°C

±30 ppm/ºC (up to +200ºC)

0%

Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC)

Aging Rate (Maximum % Capacitance Loss/Decade Hour)

150% of rated voltage for voltage rating of < 1000 V

120% of rated voltage for voltage rating of ≥ 1000 V

(5 ±1 seconds and charge/discharge not exceeding 50 mA)

¹Dielectric Withstanding Voltage (DWV)

²Dissipation Factor (DF) Maximum Limit @ 25ºC

0.1%

1000 megohm microfarads or 100 GΩ

(500 VDC applied for 120 ±5 secs @ 25°C)

³Insulation Resistance (IR) Minimum Limit @ 25°C

¹DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the capacitor.

²Capacitance and dissipation factor (DF) measured under the following conditions:

1 MHz ±100 kHz and 1.0 Vrms ±0.2 V if capacitance ≤ 1,000 pF

1 kHz ± 50 Hz and 1.0 Vrms ±0.2 V if capacitance > 1,000 pF

³To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.

Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as

Automatic Level Control (ALC). The ALC feature should be switched to "ON."

Post Environmental Limits

High Temperature Life, Biased Humidity, Moisture Resistance

Rated DC

Voltage

Capacitance

Value

Dissipation Factor

(Maximum %)

Capacitance

Shift

Insulation

Resistance

Dielectric

C0G

All

0.5

0.3% or ±0.25 pF 10% of Initial Limit

C1069_C0G_HV_HT_200C • 3/24/2016 5

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)

Table 1A – Capacitance Range/Selection Waterfall (0805 – 1808 Case Sizes)

*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82 and 91)

KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within

the same form factor (conﬁguration and dimensions).

These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts..

Case Size/Series

C0805H

C1206H

C1210H

C1808H

Voltage Code

C

B

D

C

B

D

F

G

C

B

D

F

G

C

B

D

F

G

Cap

Code

Capacitance

Rated Voltage (VDC)

Capacitance

Tolerance

Product Availability and Chip Thickness Codes

See Table 2 for Chip Thickness Dimensions

1.0 - 9.1 pF*

10 pF - 47pF*

51 pF

109 - 919*

100 - 470*

510

B

C

D

DG DG DG

LB

LA

LB

LC

LA

LB

LC

LB

LA

LB

LC

LB

LC

LB

LA

LB

LC

LA

LB

LC

LB

LC

LA

LB

LC

F

G

J

K

M

DG DG DG ED ED ED ED ED FM FM FM FM FM LB

DG DG DG ED ED ED ED EF FM FM FM FM FM LB

DG DG DG ED ED ED ED EG FM FM FM FM FM LB

DG DG DG ED ED ED ED EG FG FG FG FM FM LA

DG DG DG ED ED ED EF EG FG FG FG FM FM LA

DG DG DG ED ED ED EG EG FG FG FG FM FM LA

56 pF

62 pF

68 pF

75 pF

82 pF

91 pF

100 pF

110 pF

120 pF

130 pF

150 pF

160 pF

560

620

680

750

820

910

101

111

121

131

151

161

181

201

221

241

271

301

331

361

391

431

471

180 pF

200 pF

220 pF

240 pF

270 pF

DG DG DG ED ED ED EG EG FG FG FG FK

FK

FS

LA

LB

LC

LA

300 pF

330 pF

360 pF

390 pF

430 pF

470 pF

510 pF

560 pF

620 pF

DG DG

DG

ED ED EF EG

ED ED EG EG

ED ED EG

ED EF EG

EF EG

EG

FG FG FG FK

FG FM FM FS

FG FM FM FM

FM FM FM FY

511

561

621

681

751

821

911

680 pF

750 pF

820 pF

DG

910 pF

1,000 pF

1,100 pF

1,200 pF

1,300 pF

1,500 pF

1,600 pF

1,800 pF

2,000 pF

2,200 pF

2,400 pF

2,700 pF

3,000 pF

3,300 pF

3,600 pF

3,900 pF

4,300 pF

4,700 pF

102

112

FM FK

FM FS

FK FS

122

132

152

162

182

202

222

242

272

302

332

362

392

432

472

FK

FS

FK

FS

FL

EG

FS FM

FL FM

FL

FY

FM FY

Rated Voltage (VDC)

Cap

Code

Capacitance

Voltage Code

C

B

D

C

B

D

F

G

C

B

D

F

G

C

B

D

F

G

Case Size/Series

C0805H

C1206H

C1210H

C1808H

C1069_C0G_HV_HT_200C • 3/24/2016 6

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)

Table 1A – Capacitance Range/Selection Waterfall (0805 – 1808 Case Sizes) cont’d

Case Size/Series

C0805H

C1206H

C1210H

C1808H

Voltage Code

C

B

D

C

B

D

F

G

C

B

D

F

G

C

B

D

F

G

Cap

Code

Capacitance

Rated Voltage (VDC)

Capacitance

Tolerance

Product Availability and Chip Thickness Codes

See Table 2 for Chip Thickness Dimensions

5,100 pF

5,600 pF

6,200pF

6,800pF

7,500pF

8,200 pF

512

562

622

682

752

822

F

G

J

K

M

FY

FS

LA

LB

LC

Rated Voltage (VDC)

Cap

Code

Capacitance

Voltage Code

C

B

D

C

B

D

F

G

C

B

D

F

G

C

B

D

F

G

Case Size/Series

C0805H

C1206H

C1210H

C1808H

*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82 and 91)

KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within

the same form factor (conﬁguration and dimensions).

These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts..

C1069_C0G_HV_HT_200C • 3/24/2016 7

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)

Table 1B – Capacitance Range/Selection Waterfall (1812 – 2225 Case Sizes)

Case Size/Series

C1812H

C1825H

C2220H

C2225H

Voltage Code

C

B

D

F

G

C

B

D

F

G

C

B

D

F

G

C

B

D

F

G

Cap

Code

Capacitance

Rated Voltage (VDC)

Capacitance

Tolerance

Product Availability and Chip Thickness Codes

See Table 2 for Chip Thickness Dimensions

10 pF - 47pF*

51 pF

100 - 470*

510

560

620

680

750

820

910

101

111

121

131

151

161

181

201

221

241

271

301

331

361

391

431

471

511

561

621

681

751

821

911

102

112

122

132

152

162

182

202

222

242

272

302

332

362

392

432

472

F

G

J

K

M

GK GK GK GK GK HG HG HG HG HG JK JK JK JK JK KF KF KF KF KF

GH GH GH GH GH HE HE HE HE HE JK JK JK JK JK KF KF KF KF KF

GH GH GH GH GH HE HE HE HE HE JK JK JK JK JK KE KE KE KE KE

GH GH GH GH GH HE HE HE HE HE JE JE JE JE JE KE KE KE KE KE

GK GK GK GK GH HE HE HE HE HE JE JE JE JE JE KE KE KE KE KE

GK GK GK GK GK HE HE HE HE HE JE JE JE JE JE KE KE KE KE KE

GK GK GK GK GK HE HE HE HE HE JE JE JE JE JE KF KF KF KF KE

GH GH GH GK GH HE HE HE HE HE JK JK JK JK JK KF KF KF KF KE

GH GH GH GK GH HE HE HE HE HG JK JK JK JK JK KF KF KF KF KE

GH GH GH GK GH HE HE HE HE HG JE JE JE JK JK KF KF KF KF KE

GH GH GH GK GK HE HE HE HG HG JE JE JE JK JK KE KE KE KF KE

GH GH GH GH GM HE HE HE HG HG JE JK JK JK JK KE KE KE KF KE

GH GK GK GH GO HE HE HE HG HG JE JK JK JK JK KE KE KE KF KF

GH GK GK GH GO HE HE HE HG HE JE JK JK JK JE KE KE KE KF KF

GK GK GK GK GO HE HE HE HG HE JE JK JK JK JE KE KE KE KF KF

56 pF

62 pF

68 pF

75 pF

82 pF

91 pF

100 pF

110 pF

120 pF

130 pF

150 pF

160 pF

180 pF

200 pF

220 pF

240 pF

270 pF

300 pF

330 pF

360 pF

390 pF

430 pF

470 pF

510 pF

560 pF

620 pF

680 pF

750 pF

820 pF

910 pF

1,000 pF

1,100 pF

1,200 pF

1,300 pF

1,500 pF

1,600 pF

1,800 pF

2,000 pF

2,200 pF

2,400 pF

2,700 pF

3,000 pF

3,300 pF

3,600 pF

3,900 pF

4,300 pF

4,700 pF

GK GK GK GK

GK GK GK GM

GK GK GK GO

GK GH GK GO

GK GH GK

HE HG HG HG HG JE JK JK JK JE KE KE KE KF KE

HE HG HG HE HJ JE JK JK JE JK KE KE KE KF KE

HE HG HG HE HJ JE JK JK JE JK KE KE KE KF KF

HE HG HG HE HJ JK JK JK JE JL KE KE KE KE KH

HE HG HG HE HK JK JK JK JE JL KE KE KE KE KH

HG HG HG HE HK JK JK JK JE JL KE KE KE KE KH

GK GH GK

GK GH GM

GH GH GO

HG HG HG HG

HG HG HG HJ

JK JK JK JK JN KE KE KE KE KJ

JK JK JK JK JN KE KF KF KF KJ

JK JK JK JK

JK JK JK JL

KE KF KF KF

KE KF KF KH

GH GH GO

Rated Voltage (VDC)

Voltage Code

Cap

Code

Capacitance

C

B

D

F

G

C

B

D

F

G

C

B

D

F

G

C

B

D

F

G

Case Size/Series

C1812H

C1825H

C2220H

C2225H

*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82 and 91)

KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within

the same form factor (conﬁguration and dimensions).

These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts..

C1069_C0G_HV_HT_200C • 3/24/2016 8

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)

Table 1B – Capacitance Range/Selection Waterfall (1812 – 2225 Case Sizes) cont’d

Case Size/Series

C1812H

C1825H

C2220H

C2225H

Voltage Code

C

B

D

F

G

C

B

D

F

G

C

B

D

F

G

C

B

D

F

G

Cap

Code

Capacitance

Rated Voltage (VDC)

Capacitance

Tolerance

Product Availability and Chip Thickness Codes

See Table 2 for Chip Thickness Dimensions

5,100 pF

5,600 pF

6,200pF

6,800pF

7,500pF

8,200 pF

9,100 pF

10,000 pF

12,000 pF

15,000 pF

18,000 pF

22,000 pF

27,000 pF

33,000 pF

39,000 pF

512

562

622

682

752

822

912

103

123

153

183

223

273

333

393

F

G

J

K

M

GH GK GO

GH GK

GH GM

GK GO

GM GO

GO

HG HE HG HK

HG HE HG

HG HE HJ

HE HG HK

HE HG

HE HJ

HG HK

HJ

JK JK JK JL

JK JK JK JN

JK JE JE JN

JK JE JK JN

JK JE JK

JK JE JL

JE JE JL

JE JK JN

JE JL

KE KF KF KH

KE KF KF KJ

KF KE KF

KF KE KH

KE KE KH

KE KF KJ

KE KH

GO

JE JL

JK JN

JL JN

JN

KF KJ

KH

KJ

HK

Rated Voltage (VDC)

Voltage Code

Cap

Code

Capacitance

C

B

D

F

G

C

B

D

F

G

C

B

D

F

G

C

B

D

F

G

Case Size/Series

C1812H

C1825H

C2220H

C2225H

*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82 and 91)

KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within

the same form factor (conﬁguration and dimensions).

These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts..

C1069_C0G_HV_HT_200C • 3/24/2016 9

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)

Table 1C – Capacitance Range/Selection Waterfall (2824 – 4540 Case Sizes)

Case Size/

Series

C2824H

C3040H

C3640H

C4540H

Cap

Code

Voltage Code

C

B

D

F

G

C

B

D

F

G

C

B

D

F

G

C

B

D

F

G

Capacitance

Rated

Voltage (VDC)

Product Availability and Chip Thickness Codes

See Table 2 for Chip Thickness Dimensions

Capacitance

Tolerance

10 - 2,000 pF

2,200 pF

2,400 pF

2,700 pF

3,000 pF

3,300 pF

3,600 pF

3,900 pF

4,300 pF

4,700 pF

5,100 pF

5,600 pF

6,200 pF

6,800 pF

7,500 pF

8,200 pF

9,100 pF

10,000 pF

12,000 pF

15,000 pF

18,000 pF

22,000 pF

27,000 pF

33,000 pF

39,000 pF

47,000 pF

56,000 pF

68,000 pF

82,000 pF

0.1 µF

100 - 202

222

242

272

302

332

362

392

432

472

512

562

622

682

752

822

912

103

123

153

183

223

273

333

393

473

563

683

823

104

124

154

J

K

M

TA

TA QB QB QB QB QB

TB QB QB QB QB QB MA MA MA MA MA

TB TB QB QB QB QB QB MA MA MA MA MA SA SA SA SA SA

TB TC QB QB QB QB QB MA MA MA MA MA SA SA SA SA SA

TB

TC

QB QB QB QB QC MA MA MA MA MA SA SA SA SA SA

QB QB QB QC QC MA MA MA MA MB SA SA SA SA SA

QB QB QB QC QD MA MA MA MA MB SA SA SA SA SB

TA

TB TB

TB TC

TB

TA

TB TC

TB

TA

TB

QB QB QB QD

QB QB QB

QB QB QC

QB QC QC

QB QC QD

QB QC

MA MA MA MB MB SA SA SA SA SB

MA MA MA MB MC SA SA SA SB SB

MA MA MA MC

MA MA MA

MA MA MB

MA MB MC

MA MB

SA SA SA SB SC

SA SA SA SB

SA SA SA SC

SA SA SA

SA SA SB

SA SB SC

SA SB

TC

QC QD

MB MC

QC

MB

QD

MC

SB SC

SB

SC

0.12 µF

0.15 µF

MC

Rated Voltage (VDC)

Voltage Code

Cap

Code

C

B

D

F

G

C

B

D

F

G

C

B

D

F

G

C

B

D

F

G

Capacitance

Case Size/Series

C2824H

C3040H

C3640H

C4540H

*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82 and 91)

KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within

the same form factor (conﬁguration and dimensions).

These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts.

C1069_C0G_HV_HT_200C • 3/24/2016 10

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)

Table 2A – Chip Thickness/Tape & Reel Packaging Quantities

Paper Quantity

7" Reel 13" Reel

Plastic Quantity

7" Reel 13" Reel

Thickness Case Thickness ±

Code

Size

Range (mm)

DG

ED

EF

EG

FG

FL

FM

FY

FK

FS

LA

LB

LC

GH

GK

GM

GO

HE

HG

HJ

0805

1206

1210

1808

1812

1825

2220

2225

2824

3040

3640

4540

1.25 ± 0.15

1.00 ± 0.10

1.20 ± 0.15

1.60 ± 0.15

1.25 ± 0.15

1.40 ± 0.15

1.70 ± 0.20

2.00 ± 0.20

2.10 ± 0.20

2.50 ± 0.30

1.40 ± 0.15

1.60 ± 0.15

2.00 ± 0.15

1.40 ± 0.15

1.60 ± 0.20

2.00 ± 0.20

2.50 ± 0.20

1.40 ± 0.15

1.60 ± 0.20

2.00 ± 0.20

2.50 ± 0.20

1.40 ± 0.15

1.60 ± 0.20

2.00 ± 0.20

2.50 ± 0.20

1.40 ± 0.15

1.60 ± 0.20

2.00 ± 0.20

2.50 ± 0.20

1.40 ± 0.15

2.00 ± 0.20

2.50 ± 0.20

1.40 ± 0.15

2.00 ± 0.20

2.50 ± 0.20

1.40 ± 0.15

2.00 ± 0.20

2.50 ± 0.20

1.40 ± 0.15

2.00 ± 0.20

2.50 ± 0.20

0

2,500

2,000

2,500

2,000

1,000

500

10,000

8,000

10,000

8,000

4,000

2,000

4,000

2,000

4,000

2,000

4,000

2,000

2,500

2,000

1,650

1,400

1,550

1,500

0

500

1,000

500

HK

JE

JK

500

1,000

500

JL

JN

KE

KF

KH

KJ

500

1,000

500

750

300

500

350

250

200

TA

TB

TC

QB

QC

QD

MA

MB

MC

SA

SB

SC

7" Reel

13" Reel

7" Reel

13" Reel

Thickness

Code

Case

Size

Thickness ±

Range (mm)

Paper Quantity

Plastic Quantity

Package quantity based on ﬁnished chip thickness speciﬁcations.

C1069_C0G_HV_HT_200C • 3/24/2016 11

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)

Table 2B – Bulk Packaging Quantities

Loose Packaging

Bulk Bag (default)

N/A²

Secure Packaging

2” x 2” Wafﬂe Pack/Tray³

Packaging Type

Packaging C-Spec¹

7282 / 7292

Case Size

Packaging Quantities (pieces/unit packaging)

Chip Thickness

(mm)

EIA (in)

Metric (mm)

Minimum

Maximum

Minimum

Maximum

0402

0603

0805

1206

1210

1808

1812

1825

2220

2225

1005

1608

2012

3216

3225

4520

4532

4564

5650

5664

368

100

126

50

All

50,000

≤ 1.25 (nominal)

> 1.25 (nominal)

1

80

50

42

All

20,000

20

¹The "Packaging C-Spec" is a 4-digit code which identiﬁes the packaging type. When ordering, the proper code must be included in the 15th through 18th

character positions of the ordering code. See "Ordering Information" section of this document for further details. Product ordered without a packaging C-Spec will

default to our standard " bulk bag" packaging.

²A packaging C-Spec (see note 1 above) is not required For "bulk bag" packaging (excluding Anti-Static Bulk Bag). The 15th through 18th character positions of

the ordering code should be left blank. All product ordered without a packaging C-Spec will default to out standard "bulk bag" packaging.

³Also commonly referred to as “Chip Carrier” or “Molded Tray”. All tray packaging options offer static protection.

C1069_C0G_HV_HT_200C • 3/24/2016 12

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)

Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351

Density Level A:

Maximum (Most)

Land Protrusion (mm)

Density Level B:

Median (Nominal)

Land Protrusion (mm)

Density Level C:

Minimum (Least)

Land Protrusion (mm)

EIA

Size

Code

Metric

Size

Code

C

Y

X

V1

V2

C

Y

X

V1

V2

C

Y

X

V1

V2

0805

1206

1210

1808

1812

1825

2220

2225

2824

3040

3640

4540

2012

3216

3225

4520

4532

4564

5650

5664

7260

7610

9210

-

1.00

1.35

1.55

4.40

2.60

0.90

1.15

1.45

3.50

2.00

0.75

0.95

1.35

2.80

1.70

1.60

2.30

2.15

2.75

2.70

3.45

3.70

4.45

5.60

1.35

1.75

1.60

1.70

1.90

2.80

2.30

3.60

6.90

5.50

6.90

6.60

5.60

5.65

7.40

6.90

8.20

8.10

9.60

2.90

3.80

3.30

4.60

7.90

6.50

7.90

7.60

1.50

2.20

2.05

2.65

2.60

3.35

3.60

4.35

5.50

1.15

1.55

1.40

1.50

1.80

2.70

2.20

3.50

6.80

5.40

6.80

6.50

10.60

4.70

6.50

6.00

7.30

7.20

8.70

9.20

2.30

3.20

2.70

4.00

7.30

5.90

7.30

7.00

11.10

1.40

2.10

1.95

2.55

2.50

3.25

3.50

4.25

5.40

0.95

1.35

1.20

1.30

1.70

2.60

2.10

4.00

5.80

5.30

6.60

6.50

8.00

8.50

2.00

2.90

2.40

3.70

7.00

5.60

7.00

6.70

10.80

3.40

6.70

5.30

6.70

6.40

10.50

10.70 10.10 11.70

10.70 11.60 11.70

10.70 13.90 11.70

10.60 10.70 11.10

10.60 13.00 11.10

10.50 10.00 10.80

10.50 12.30 10.80

Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reﬂow solder

processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reﬂow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualiﬁcation

testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).

Image below based on Density Level B for an EIA 1210 case size.

V1

Y

V2

X

C

Grid Placement Courtyard

C1069_C0G_HV_HT_200C • 3/24/2016 13

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)

Soldering Process

Recommended Soldering Technique:

• Solder wave or solder reﬂow for EIA case sizes 0603, 0805 and 1206

• All other EIA case sizes are limited to solder reﬂow only

Recommended Reﬂow Soldering Proﬁle:

KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection,

IR or vapor phase reﬂow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s

recommended proﬁle conditions for convection and IR reﬂow reﬂect the proﬁle conditions of the IPC/J-STD-020 standard for moisture

sensitivity testing. These devices can safely withstand a maximum of three reﬂow passes at these conditions.

T_P

T_L

Termination Finish

t_P

Maximum Ramp Up Rate = 3°C/sec

Maximum Ramp Down Rate = 6°C/sec

Proﬁle Feature

SnPb

100% Matte Sn

t_L

Preheat/Soak

T_smax

T_smin

Temperature Minimum (T_Smin

Temperature Maximum (T_Smax

Time (t_S) from T_Sminto T_Smax

)

100°C

150°C

200°C

)

t_S

60 – 120 seconds

Ramp-Up Rate (T_Lto T_P)

Liquidous Temperature (T_L)

Time Above Liquidous (t_L)

Peak Temperature (T_P)

3°C/second maximum 3°C/second maximum

25

183°C

60 – 150 seconds

235°C

217°C

60 – 150 seconds

260°C

25° C to Peak

Time

Time Within 5°C of Maximum

Peak Temperature (t_P)

20 seconds maximum 30 seconds maximum

Ramp-Down Rate (T_Pto T_L) 6°C/second maximum 6°C/second maximum

Time 25°C to Peak

6 minutes maximum

8 minutes maximum

Temperature

Note 1: All temperatures refer to the center of the package, measured on the

capacitor body surface that is facing up during assembly reﬂow.

C1069_C0G_HV_HT_200C • 3/24/2016 14

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)

Table 4 – Performance & Reliability: Test Methods and Conditions

Product Qualiﬁcation Test Plan

Reliability/Environmental Tests per MIL–STD–202//JESD22

Load Humidity

Low Voltage Humidity

Temperature Cycling

Thermal Shock

85°C/85%RH and 200 VDC maximum, 1,000 Hours

85°C/85%RH, 1.5V, 1,000 Hours

−55°C to +200°C, 50 Cycles

−55°C to +150°C, 20 seconds transfer, 15 minute dwell, 300 Cycles

Cycled Temp/RH 0 V, 10 cycles @ 24 hours each

Moisture Resistance

Physical, Mechanical & Process Tests per MIL–STD 202/JIS–C–6429

Resistance to Solvents

Include Aqueous wash chemical – OKEM Clean or equivalent

Method 213: Figure 1, Condition F Method 204: 5 gs for 20 minutes, 12 cycles

Condition B, no per-heat of samples, Single Wave Solder

Force of 1.8 kg for 60 seconds

Mechanical Shock and Vibration

Resistance to Soldering Heat

Terminal Strength

Board Flex

Appendix 2, Note: 3.0 mm (minimum)

Storage and Handling

Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other

environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term

storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may

increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum storage humidity not exceed 70%

relative humidity. In addition, temperature ﬂuctuations should be minimized to avoid condensation on the parts and atmospheres should

be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within the

time frame outlined in the table below:

Termination Finish

100% Matte Tin (Sn)

SnPb (5% Pb min.)

Termination Finish Ordering Code¹

Storage Life

C

L

1.5 years upon receipt

6 months upon receipt²

1.5 years upon receipt

Gold (Au) 1.97 – 11.8 µin²

Gold (Au) 30 – 50 µin

Gold (Au) 100 µin min.

E

F

G

¹The fourteenth (14th) character position of the KEMET part number is assigned to identify and/or deﬁne the termination

ﬁnish. For more information, see “Ordering Information” section of this document.

²Gold plating option “E” devices should remain in its factory sealed moisture sensitive packaging during storage. If the factory sealed packaging is disturbed please

store any remaining packaged components in a dry box container to prevent oxidation of the termination ﬁnish.

C1069_C0G_HV_HT_200C • 3/24/2016 15

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)

Construction (Typical)

Detailed Cross Section

Termination Finish:

C = 100% Matte Sn

L = SnPb - 5% Pb min

Dielectric Material

(CaZrO₃)

E = Gold (Au) 1.97 - 11.8 µin

Dielectric Material

F = Gold (Au) 30 - 50 µin

(CaZrO₃)

G = Gold (Au) 100 µin min

Barrier Layer

(Ni)

End Termination/

External Electrode

(Cu)

Inner Electrodes

(Ni)

End Termination/

External Electrode

(Cu)

Barrier Layer

(Ni)

Termination Finish

(See options at left)

Inner Electrodes

(Ni)

Capacitor Marking (Optional):

Laser marking option is not available on:

• C0G, Ultra Stable X8R and Y5V dielectric devices

• EIA 0402 case size devices

• EIA 0603 case size devices with Flexible Termination option.

• KPS Commercial and Automotive grade stacked devices.

These capacitors are supplied unmarked only.

C1069_C0G_HV_HT_200C • 3/24/2016 16

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)

Tape & Reel Packaging Information

KEMET offers multilayer ceramic chip capacitors packaged in 8, 12, 16 and 24 mm tape on 7" and 13" reels in accordance with EIA

Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on

reeling quantities for commercial chips.

Bar Code Label

Anti-Static Reel

®

Embossed Plastic* or

Punched Paper Carrier.

Chip and KPS Orientation in Pocket

(except 1825 Commercial, and 1825 and 2225 Military)

KEMET

Sprocket Holes

Embossment or Punched Cavity

8 mm, 12 mm

or 16 mm Carrier Tape

Anti-Static Cover Tape

(.10 mm (.004") Maximum Thickness)

178 mm (7.00")

or

330 mm (13.00")

*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.

Table 5 – Carrier Tape Conﬁguration, Embossed Plastic & Punched Paper (mm)

Embossed Plastic Punched Paper

Tape

7" Reel

13" Reel

7" Reel

13" Reel

EIA Case Size Size

(W)*

New 2 mm Pitch Reel Options*

Packaging

Pitch (P₁)*

01005 – 0402

0603

8

2

2/4

4

2

2/4

4

Ordering Code

(C-Spec)

C-3190

Packaging Type/Options

Automotive grade 7" reel unmarked

Automotive grade 13" reel unmarked

Commercial grade 7" reel unmarked

Commercial grade 13" reel unmarked

0805

8

4

C-3191

1206 – 1210

1805 – 1808

≥ 1812

8

4

C-7081

12

16

24

12

16

8

4

C-7082

* 2 mm pitch reel only available for 0603 EIA case size.

2 mm pitch reel for 0805 EIA case size under development.

8

2824

12

16

8

12

16

8

Beneﬁts of Changing from 4 mm to 2 mm Pitching Spacing

• Lower placement costs

• Double the parts on each reel results in fewer reel

changes and increased efﬁciency

• Fewer reels result in lower packaging, shipping and

storage costs, reducing waste

3040 – 4540

KPS 1210

KPS 1812 & 2220

Array 0508 & 0612

12

4

12

4

*Refer to Figures 1 & 2 for W and P₁carrier tape reference locations.

*Refer to Tables 6 & 7 for tolerance speciﬁcations.

C1069_C0G_HV_HT_200C • 3/24/2016 17

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)

Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

T

P2

[10 pitches cumulative

tolerance on tape ± 0.2 mm]

2

E

1

Po

ØDo

Ao

F

Ko

W

E

2

B

1

Bo

S

1

P

1

T

1

Embossment

For cavity size,

see Note 1 Table 4

Center Lines of Cavity

ØD

1

Cover Tape

is for tape feeder reference only,

including draft concentric about B

B

1

o

.

User Direction of Unreeling

Table 6 – Embossed (Plastic) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

R Reference S₁Minimum

T

T1

Maximum

Tape Size

8 mm

D₀

E₁

P₀

P₂

Note 2

Note 3

Maximum

25.0

(0.984)

1.5 +0.10/−0.0

1.75 ± 0.10

4.0 ± 0.10

2.0 ± 0.05

0.600

0.100

12 mm

16 mm

24 mm

(0.059 +0.004/−0.0)

(0.069 ± 0.004)

(0.157 ± 0.004)

(0.079 ± 0.002)

(0.024)

(0.004)

30

(1.181)

1.5 +0.10/−0.0

(0.059 +0.004/−0.0)

1.75 ± 0.10

(0.069 ± 0.004)

4.0 ± 0.10

(0.157 ± 0.004)

2.0 ± 0.10

(0.078 ± 0.003)

30

(1.181)

5

0.250

(0.009)

0.350

(0.013)

(0.196)

Variable Dimensions — Millimeters (Inches)

E₂

T₂

W

Tape Size

8 mm

Pitch

F

P₁

A₀,B₀& K₀

Minimum

Maximum

6.25

(0.246)

3.5 ± 0.05

(0.138 ± 0.002)

4.0 ± 0.10

(0.157 ± 0.004)

2.5

(0.098)

8.3

(0.327)

Single (4 mm)

Single (4 mm) &

Double (8 mm)

10.25

5.5 ± 0.05

8.0 ± 0.10

4.6

12.3

12 mm

16 mm

24 mm

(0.404)

(0.217 ± 0.002)

(0.315 ± 0.004)

(0.181)

(0.484)

Note 5

14.25

(0.561)

7.5 ± 0.05

(0.138 ± 0.002)

12.0 ± 0.10

(0.157 ± 0.004)

4.6

(0.181)

16.3

(0.642)

Triple (12 mm)

16 mm

22.25

(0.875)

11.5 ± 0.10

(0.452 ± 0.003) (0.629 ± 0.004)

16.0 ± 0.10

3

24.3

(0.956)

(0.118)

1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and

hole location shall be applied independent of each other.

2. The tape with or without components shall pass around R without damage (see Figure 6).

3. If S₁< 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).

4. B₁dimension is a reference dimension for tape feeder clearance only.

5. The cavity deﬁned by A₀, B₀and K₀shall surround the component with sufﬁcient clearance that:

(a) the component does not protrude above the top surface of the carrier tape.

(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).

(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4).

(e) for KPS Series product, A₀and B₀are measured on a plane 0.3 mm above the bottom of the pocket.

(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.

C1069_C0G_HV_HT_200C • 3/24/2016 18

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)

Figure 2 – Punched (Paper) Carrier Tape Dimensions

T

P2

[10 pitches cumulative

tolerance on tape ± 0.2 mm]

E

1

Po

ØDo

0

A

F

W

2

E

0

B

Bottom Cover Tape

P

1

G

Cavity Size,

See

1

T

1

T

Top Cover Tape

Center Lines of Cavity

Note 1, Table 7

Bottom Cover Tape

User Direction of Unreeling

Table 7 – Punched (Paper) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

R Reference

Note 2

Tape Size

8 mm

D₀

E₁

P₀

P₂

T₁Maximum

G Minimum

0.10

1.5 +0.10/−0.0

(0.059 +0.004/−0.0)

1.75 ±0.10

(0.069 ±0.004)

4.0 ±0.10

(0.157 ±0.004)

2.0 ±0.05

(0.079 ±0.002)

0.75

(0.030)

25

(0.984)

(0.004)

Maximum

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

Pitch

E2 Minimum

F

P₁

T Maximum

W Maximum

A₀B₀

2.0 ±0.05

(0.079 ±0.002)

4.0 ±0.10

8.3

(0.327)

8.3

Half (2 mm)

Single (4 mm)

6.25

(0.246)

3.5 ±0.05

(0.138 ±0.002)

1.1

(0.098)

Note 1

8 mm

(0.157 ±0.004)

(0.327)

1. The cavity deﬁned by A₀, B₀and T shall surround the component with sufﬁcient clearance that:

a) the component does not protrude beyond either surface of the carrier tape.

b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

c) rotation of the component is limited to 20° maximum (see Figure 3).

d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).

e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.

2. The tape with or without components shall pass around R without damage (see Figure 6).

C1069_C0G_HV_HT_200C • 3/24/2016 19

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)

Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 Kg minimum.

2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

Tape Width

8 mm

Peel Strength

0.1 to 1.0 Newton (10 to 100 gf)

0.1 to 1.3 Newton (10 to 130 gf)

0.1 to 1.6 Newton (10 to 160 gf)

12 and 16 mm

24 mm

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180°

from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.

3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA

Standards 556 and 624.

Figure 3 – Maximum Component Rotation

°

T

Maximum Component Rotation

Top View

Maximum Component Rotation

Side View

Typical Pocket Centerline

Tape

Maximum

°

T

s

Width (mm) Rotation (

)

8,12

16 – 200

20

10

Bo

Tape

Maximum

°

S

Width (mm) Rotation (

)

8,12

16 – 56

72 – 200

20

10

5

Typical Component Centerline

Ao

Figure 5 – Bending Radius

Figure 4 – Maximum Lateral Movement

Embossed

Carrier

Punched

Carrier

8 mm & 12 mm Tape

16 mm Tape

0.5 mm maximum

1.0 mm maximum

R

Bending

Radius

R

C1069_C0G_HV_HT_200C • 3/24/2016 20

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)

Figure 6 – Reel Dimensions

Full Radius,

W3 (Includes

flange distortion

at outer edge)

Access Hole at

Slot Location

(Ø 40 mm minimum)

See Note

W

2 (Measured at hub)

D

(See Note)

A

N

C

(Arbor hole

W

1 (Measured at hub)

diameter)

If present,

tape slot in core

for tape start:

2.5 mm minimum width x

10.0 mm minimum depth

B

(see Note)

Note: Drive spokes optional; if used, dimensions B and D shall apply.

Table 8 – Reel Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size

8 mm

A

B Minimum

C

D Minimum

178 ±0.20

(7.008 ±0.008)

or

330 ±0.20

(13.000 ±0.008)

1.5

(0.059)

13.0 +0.5/−0.2

(0.521 +0.02/−0.008)

20.2

(0.795)

12 mm

16 mm

24 mm

1.2

(0.047)

13.0 + −0.2

(0.521 + −0.008)

21

(0.826)

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

N Minimum

W₁

W₂Maximum

W₃

8.4 +1.5/−0.0

(0.331 +0.059/−0.0)

14.4

(0.567)

12.4 +2.0/−0.0

18.4

12 mm

16 mm

24 mm

(0.488 +0.078/−0.0)

(0.724)

50

(1.969)

Shall accommodate tape width

without interference

16.4 +2.0/−0.0

(0.646 +0.078/−0.0)

25 +1.0/−0.0

(0.984 +0.039/−0.0)

22.4

(0.882)

27.4 +1.0/−1.0

(1.078+0.039/−0.039)

C1069_C0G_HV_HT_200C • 3/24/2016 21

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)

Figure 7 – Tape Leader & Trailer Dimensions

Embossed Carrier

Carrier Tape

Round Sprocket Holes

Punched Carrier

8 mm & 12 mm only

START

END

Top Cover Tape

Elongated Sprocket Holes

(32 mm tape and wider)

100 mm

Minimum Leader

400 mm Minimum

Trailer

160 mm Minimum

Components

Top Cover Tape

Figure 8 – Maximum Camber

Elongated sprocket holes

(32 mm & wider tapes)

Carrier Tape

Round Sprocket Holes

1 mm Maximum, either direction

Straight Edge

250 mm

C1069_C0G_HV_HT_200C • 3/24/2016 22

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)

Wafﬂe Tray Packaging Information – 2" x 2" w/ Static Protection

Figure 9 – Wafﬂe Tray Dimensions – Inches (Millimeters)

M

M3

0.10 (2.54) X 45°

M1

M2

Y

X

A

Z

0.098

(2.489)

0.156 +0.002/-0.003

(3.962 +0.051/-0.076)

0.086

(2.184)

0.004

90°

(0.102)

2.000 ±0.004 SQ

(50.800 ±0.102 SQ)

1.800 ±0.004 SQ

(45.720 ±0.102 SQ)

1.812 ±0.004 SQ

(46.025 ±0.102 SQ)

STANDARD RIB MATRIX

C1069_C0G_HV_HT_200C • 3/24/2016 23

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)

Table 9A – Wafﬂe Tray Dimensions – Inches

2" x 2" Wafﬂe Tray Dimensions – Inches

Case Size

Packaging Quantity

(pcs/unit packaging)

M

M1

M2

M3

X

Y

Z

A°

MATRIX

EIA (in) Metric (mm) ±0.003

±0.003

0.153

0.226

0.153

0.186

0.240

0.228

0.250

0.244

0.285

0.362

±0.002

0.077

0.172

0.077

0.181

0.190

0.193

0.375

0.215

0.286

0.424

±0.002

0.110

0.170

0.110

0.171

0.140

0.124

0.167

0.174

0.243

0.34

±0.002

0.073

0.080

0.073

0.062

0.060

0.067

0.100

0.110

0.150

0.24

±0.002

0.042

0.090

0.042

0.092

0.110

0.130

0.200

0.145

0.200

0.32

±0.003

0.041

0.055

0.041

0.036

0.075

0.065

0.070

0.080

0.075

0.032

± 1/2°

7

5

7

10

5

(X x Y)

16 X 23

10 X 10

16 X 23

10 X 10

12 X 9

14 X 9

10 X 5

10 X 8

7 X 6

0402

0504

0603

0805

1005

1206^1,2

1206^1,3

1210

1808

1812

1825

2220

2225

1005

1210

1608

2012

2512

3216

3225

4520

4532

4564

5650

5664

0.175

0.235

0.175

0.232

0.230

0.194

0.250

0.217

0.271

0.318

368

100

368

100

108

126

50

80

42

20

5

7 X 6

5 X 4

0.34

0.24

0.32

20

¹Packaging of 1206 (3216 metric) case size capacitors is dependent upon the nominal chip thickness of the device. See "Capacitance Range/Selection Waterfall"

and "Chip Thickness/Tape & Reel Packaging Quantities" to identify the nominal chip thickness of the capacitor.

²Assigned to 1206 (3216 metric) case size capacitors with nominal thickness of ≤ 1.25mm (0.049 inches).

³Assigned to 1206 (3216 metric) case size capacitors with nominal thickness of > 1.25mm (0.049 inches).

Table 9B – Wafﬂe Tray Dimensions – Millimeters

2" x 2" Wafﬂe Tray Dimensions – Millimeters

Case Size

Packaging Quantity

(pcs/unit packaging)

M

M1

M2

M3

X

Y

Z

A°

MATRIX

EIA (in) Metric (mm) ±0.08

±0.08

±0.05

±0.08

± 1/2°

(X x Y)

0402

0504

0603

0805

1005

1206^1,2

1206^1,3

1210

1808

1812

1825

2220

2225

1005

1210

1608

2012

2512

3216

3225

4520

4532

4564

5650

5664

4.45

5.97

4.45

5.89

5.84

4.93

6.35

5.51

6.88

8.08

3.89

5.74

3.89

4.72

6.10

5.79

6.35

6.20

7.24

9.19

1.96

4.37

1.96

4.60

4.83

4.90

9.53

5.46

7.26

2.79

4.32

2.79

4.34

3.56

3.15

4.24

4.42

6.17

8.64

1.85

2.03

1.85

1.57

1.52

1.70

2.54

2.79

3.81

6.10

1.07

2.29

1.07

2.34

2.79

3.30

5.08

3.68

5.08

8.13

1.04

1.40

1.04

0.91

1.91

1.65

1.78

2.03

1.91

0.81

7

5

7

10

5

16 X 23

10 X 10

16 X 23

10 X 10

12 X 9

14 X 9

10 X 5

10 X 8

7 X 6

5 X 4

368

100

368

100

108

126

50

80

42

20

7.26

10.77

5

20

¹Packaging of 1206 (3216 metric) case size capacitors is dependent upon the nominal chip thickness of the device. See "Capacitance Range/Selection Waterfall"

and "Chip Thickness/Tape & Reel Packaging Quantities" to identify the nominal chip thickness of the capacitor.

²Assigned to 1206 (3216 metric) case size capacitors with nominal thickness of ≤ 1.25mm (0.049 inches).

³Assigned to 1206 (3216 metric) case size capacitors with nominal thickness of > 1.25mm (0.049 inches).

C1069_C0G_HV_HT_200C • 3/24/2016 24

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)

KEMET Corporation

World Headquarters

Europe

Asia

Southern Europe

Sasso Marconi, Italy

Tel: 39-051-939111

Northeast Asia

Hong Kong

Tel: 852-2305-1168

2835 KEMET Way

Simpsonville, SC 29681

Skopje, Macedonia

Tel: 389-2-55-14-623

Shenzhen, China

Tel: 86-755-2518-1306

Mailing Address:

P.O. Box 5928

Greenville, SC 29606

Beijing, China

Central Europe

Landsberg, Germany

Tel: 49-8191-3350800

Tel: 86-10-5877-1075

www.kemet.com

Tel: 864-963-6300

Fax: 864-963-6521

Shanghai, China

Tel: 86-21-6447-0707

Kamen, Germany

Tel: 49-2307-438110

Corporate Ofﬁces

Fort Lauderdale, FL

Tel: 954-766-2800

Seoul, South Korea

Tel: 82-2-6294-0550

Northern Europe

Wyboston, United Kingdom

Tel: 44-1480-273082

Taipei, Taiwan

Tel: 886-2-27528585

North America

Northeast

Wilmington, MA

Tel: 978-658-1663

Espoo, Finland

Tel: 358-9-5406-5000

Southeast Asia

Singapore

Tel: 65-6701-8033

Southeast

Lake Mary, FL

Tel: 407-855-8886

Penang, Malaysia

Tel: 60-4-6430200

Central

Novi, MI

Tel: 248-994-1030

Bangalore, India

Tel: 91-806-53-76817

Irving, TX

Tel: 972-915-6041

West

Milpitas, CA

Tel: 408-433-9950

Mexico

Guadalajara, Jalisco

Tel: 52-33-3123-2141

Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not

assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of

KEMET Electronics Corporation.

C1069_C0G_HV_HT_200C • 3/24/2016 25

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)

Disclaimer

All product speciﬁcations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and

verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.

All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.

Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are

not intended to constitute – and KEMET speciﬁcally disclaims – any warranty concerning suitability for a speciﬁc customer application or use. The Information is intended for use only

by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise

provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained.

Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still

occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective

circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.

Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not

be required.

C1069_C0G_HV_HT_200C • 3/24/2016 26


型号：	C1210H393BCGAGTU
厂家：	KEMET CORPORATION
描述：	Surface Mount Multilayer Ceramic Chip Capacitors
文件：	总26页 (文件大小：1515K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

C1210H393BCGAGTU [KEMET]

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