C1210V683KBRAC7800_技术文档

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield™ Technology, High Voltage, X7R Dielectric,

500 – 1,000 VDC (Commercial & Automotive Grade)

Overview

KEMET ArcShield high voltage surface mount capacitors

in X7R dielectric are designed for use in high voltage

applications susceptible to surface arcing (arc-over

discharge).

For added reliability, KEMET's Flexible Termination technology

is an available option that provides superior ﬂex performance

over standard termination systems. This technology was

developed to address ﬂex cracks, which are the primary failure

mode of MLCCs and typically the result of excessive tensile

and shear stresses produced during board ﬂexure and thermal

cycling. Flexible Termination technology inhibits the transfer of

board stress to the rigid body of the MLCC, therefore mitigating

ﬂex cracks which can result in low IR or short circuit failures.

The phenomenon of surface arcing is caused by a high

voltage gradient between the two termination surfaces or

between one of the termination surfaces and the counter

internal electrode structure within the ceramic body. It

occurs most frequently at application voltages that meet

or exceed 300 V, in high humidity environments, and in

chip sizes with minimal bandwidth separation (creepage

distance). This phenomenon can either damage surrounding

components or lead to a breakdown of the dielectric

material, ultimately resulting in a short-circuit condition

(catastrophic failure mode).

KEMET’s ArcShield high voltage surface mount MLCCs are

available in Automotive Grade, which undergo stricter testing

protocol and inspection criteria. Whether under-hood or

in-cabin, these devices are designed for mission and safety-

critical automotive circuits or applications requiring proven,

reliable performance in harsh environments. Automotive Grade

devices meet the demanding Automotive Electronics Council's

AEC-Q200 qualiﬁcation requirements.

Patented ArcShield technology features KEMET's highly

reliable base metal dielectric system combined with a

unique internal shield electrode structure that is designed

to suppress an arc-over event while increasing available

capacitance. Developed on the principle of a partial Faraday

cage, this internal system offers unrivaled performance

and reliability when compared to external surface coating

technologies.

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Ordering Information

C

0603

W

392

K

C

R

A

C

TU

Rated

Failure

Packaging/

Grade

Case Size Speciﬁcation/ Capacitance Capacitance

Ceramic

Voltage Dielectric Rate/

Termination Finish¹

(L" x W")

Series

Code (pF)

Tolerance

(VDC)

Design

(C-Spec)²

0603

0805

1206

1210

1808

1812

1825

2220

2225

V = ArcShield Two signiﬁcant J = ±5%

C = 500

B = 630

D = 1,000

R = X7R A = N/A C = 100% Matte Sn

See

"Packaging

C-Spec

Ordering

Options Table"

below

digits and

number of

zeros.

W = ArcShield

with Flexible

Termination

K = ±10%

M = ±20%

L = SnPb (5% PB minimum)

¹Additional termination ﬁnish options may be available. Contact KEMET for details.

^{1, 2}SnPb termination ﬁnish option is not available on Automotive Grade product.

²Additional reeling or packaging options may be available. Contact KEMET for details.

One world. One KEMET

C1034_X7R_HV_ARC_SMD • 11/29/2017

1

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Packaging C-Spec Ordering Options Table

Packaging/Grade

Packaging Type

Ordering Code (C-Spec)

Commercial Grade¹

Bulk Bag

Not Required (Blank)

TU

7" Reel/Unmarked

7411 (EIA 0603 and smaller case sizes)

7210 (EIA 0805 and larger case sizes)

13" Reel/Unmarked

7" Reel/Marked

TM

7040 (EIA 0603 and smaller case sizes)

7215 (EIA 0805 and larger case sizes)

13" Reel/Marked

7" Reel/Unmarked/2 mm pitchꢀ

7081

13" Reel/Unmarked/2 mm pitch²

7082

Automotive Grade³

7" Reel

AUTO

AUTO7411 (EIA 0603 and smaller case sizes)

AUTO7210 (EIA 0805 and larger case sizes)

13" Reel/Unmarked

7" Reel/Unmarked/2 mm pitch²

13" Reel/Unmarked/2 mm pitch²

3190

3191

¹Default packaging is "Bulk Bag". An ordering code C-Spec is not required for "Bulk Bag" packaging.

¹The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors

that have not been laser marked.

²The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case

size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".

³Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L" x W") and thickness dimension. See "Chip Thickness/Tape & Reel

Packaging Quantities" and "Tape & Reel Packaging Information".

³For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information".

³All Automotive packaging C-Specs listed exclude the option to laser mark components. Please contact KEMET if you require a laser marked option. For

more information see "Capacitor Marking".

Beneﬁts

• Patented technology

• Permanent internal arc protection

• Capacitance offerings ranging from 1,000 pF to 560 nF

• Available capacitance tolerances of ±5%, ±10% and ±20%

• Low ESR and ESL

• Non-polar device, minimizing installation concerns

• Commercial & Automotive (AEC-Q200) grades available

• 100% pure matte tin-plated termination ﬁnish allowing for

excellent solderability

• SnPb plated termination ﬁnish option available upon

request (5% Pb minimum)

• Flexible Termination option available upon request

• Protective surface coating not required

• Base metal electrode (BME) dielectric system

• Industry leading CV values

• −55°C to +125°C operating temperature range

• Exceptional performance at high frequencies

• Lead (Pb)-free, RoHS and REACH compliant

• EIA 0603, 0805, 1206, 1210, 1808, 1812, 1825,

2220, and 2225 case sizes

• DC voltage ratings of 500 V, 630 V and 1 KV

C1034_X7R_HV_ARC_SMD • 11/29/2017

2

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Automotive C-Spec Information

KEMET Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council.

Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualiﬁcation for Passive

Components. These products are supported by a Product Change Notiﬁcation (PCN) and Production Part Approval Process

warrant (PPAP).

Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.”

This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade

component without the requirement to submit a customer Source Controlled Drawing (SCD) or speciﬁcation for review by a

KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET’s OEM Automotive customers and are

not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited

(see details below).

Product Change Notiﬁcation (PCN)

The KEMET Product Change Notiﬁcation system is used to communicate primarily the following types of changes:

• Product/process changes that affect product form, ﬁt, function, and/or reliability

• Changes in manufacturing site

• Product obsolescence

Customer Notiﬁcation due to:

KEMET Automotive

C-Spec

Days prior to

implementation

Process/Product change

Obsolescence*

KEMET assigned¹

AUTO

Yes (with approval and sign off)

Yes (without approval)

Yes

180 days minimum

90 days minimum

¹KEMET assigned C-Specs require the submittal of a customer SCD or customer speciﬁcation for review. For additional information contact KEMET.

Production Part Approval Process (PPAP)

The purpose of the Production Part Approval Process is:

• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.

• To provide the evidence that all customer engineering design record and speciﬁcation requirements are properly

understood and fulﬁlled by the manufacturing organization.

• To demonstrate that the established manufacturing process has the potential to produce the part.

PPAP (Product Part Approval Process) Level

KEMET Automotive

C-Spec

1

●

○

2

3

●

○

4

5

KEMET assigned¹

AUTO

●

¹KEMET assigned C-Specs require the submittal of a customer SCD or customer speciﬁcation for review. For additional information contact KEMET.

● Part number speciﬁc PPAP available

○ Product family PPAP only

C1034_X7R_HV_ARC_SMD • 11/29/2017

3

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Applications

Typical applications include switch mode power supplies (input ﬁlters, resonators, tank circuits, snubber circuits, output

ﬁlters), high voltage coupling and DC blocking, lighting ballasts, voltage multiplier circuits, DC/DC converters and coupling

capacitors in Ćuk converters. Markets include power supply, LCD ﬂuorescent backlight ballasts, HID lighting, telecom

equipment, industrial and medical equipment/control, LAN/WAN interface, analog and digital modems, and automotive

(electric and hybrid vehicles, charging stations and lighting) applications.

Application Notes

X7R dielectric is not recommended for AC line ﬁltering or pulse applications.

Qualiﬁcation/Certiﬁcation

Commercial Grade products are subject to internal qualiﬁcation. Details regarding test methods and conditions are

referenced in Table 4, Performance & Reliability.

Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details

regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualiﬁcation for Passive

Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their

website at www.aecouncil.com.

Environmental Compliance

Lead (Pb)-free, RoHS, and REACH compliant without exemptions (excluding SnPb termination ﬁnish option).

C1034_X7R_HV_ARC_SMD • 11/29/2017

4

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Dimensions – Millimeters (Inches) – Standard Termination

L

W

T

B

S

EIA Size

Code

Metric Size

Code

L

W

Width

B

Mounting

Technique

T Thickness

Separation

Minimum

Length

Bandwidth

1.60 (0.063)

±0.15 (0.006)

2.00 (0.079)

±0.20 (0.008)

3.20 (0.126)

±0.20 (0.008)

0.80 (0.032)

±0.15 (0.006)

1.25 (0.049)

±0.20 (0.008)

1.60 (0.063)

±0.20 (0.008)

0.35 (0.014)

±0.15 (0.006)

0.50 (0.02)

0603

0805

1206

1210

1808

1812

1825

2220

2225

1608

2012

3216

3225

4520

4532

4564

5650

5664

0.70 (0.028)

Solder Wave or

0.75 (0.030)

±0.25 (0.010)

Solder Reﬂow

0.50 (0.02)

±0.25 (0.010)

0.50 (0.02)

±0.25 (0.010)

0.60 (0.024)

±0.35 (0.014)

0.60 (0.024)

±0.35 (0.014)

0.60 (0.024)

±0.35 (0.014)

0.60 (0.024)

±0.35 (0.014)

0.60 (0.024)

±0.35 (0.014)

3.20 (0.126)

±0.20 (0.008)

2.50 (0.098)

±0.20 (0.008)

See Table 2 for

Thickness

4.70 (0.185)

±0.50 (0.020)

4.50 (0.177)

±0.30 (0.012)

4.50 (0.177)

±0.30 (0.012)

5.70 (0.224)

±0.40 (0.016)

5.60 (0.220)

±0.40 (0.016)

2.00 (0.079)

±0.20 (0.008)

3.20 (0.126)

±0.30 (0.012)

6.40 (0.252)

±0.40 (0.016)

5.00 (0.197)

±0.40 (0.016)

6.40 (0.248)

±0.40 (0.016)

N/A

Solder Reﬂow

Only

Dimensions – Millimeters (Inches) – Flexible Termination

S

EIA Size

Code

Metric Size

Code

L

W

Width

B

Mounting

Technique

T Thickness

Separation

Minimum

Length

Bandwidth

1.60 (0.064)

±0.17 (0.007)

2.00 (0.079)

±0.30 (0.012)

3.30 (0.130)

±0.40 (0.016)

3.30 (0.130)

±0.40 (0.016)

4.70 (0.185)

±0.50 (0.020)

4.50 (0.178)

±0.40 (0.016)

4.60 (0.181)

±0.40 (0.016)

5.90 (0.232)

±0.75 (0.030)

0.80 (0.032)

±0.15 (0.006)

1.25 (0.049)

±0.30 (0.012)

1.60 (0.063)

±0.35 (0.013)

2.60 (0.102)

±0.30 (0.012)

2.00 (0.079)

±0.20 (0.008)

3.20 (0.126)

±0.30 (0.012)

6.40 (0.252)

±0.40 (0.016)

5.00 (0.197)

±0.40 (0.016)

0.45 (0.018)

±0.15 (0.006)

0.50 (0.02)

±0.25 (0.010)

0.60 (0.024)

±0.25 (0.010)

0.60 (0.024)

±0.25 (0.010)

0.70 (0.028)

±0.35 (0.014)

0.70 (0.028)

±0.35 (0.014)

0.70 (0.028)

±0.35 (0.014)

0.70 (0.028)

±0.35 (0.014)

0603

0805

1206

1210

1808

1812

1825

2220

2225

1608

2012

3216

3225

4520

4532

4564

5650

5664

0.58 (0.023)

Solder Wave or

0.75 (0.030)

Solder Reﬂow

See Table 2 for

Thickness

N/A

Solder Reﬂow

Only

5.90 (0.232)

±0.75 (0.030)

6.40 (0.248)

±0.40 (0.016)

0.70 (0.028)

±0.35 (0.014)

C1034_X7R_HV_ARC_SMD • 11/29/2017

5

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Electrical Parameters/Characteristics

Item

Parameters/Characteristics

Operating Temperature Range

−55°C to +125°C

±15%

Capacitance Change with Reference to

+25°C and 0 Vdc Applied (TCC)

¹Aging Rate (Maximum % Capacitance Loss/Decade Hour)

3.0%

150% of rated voltage for voltage rating of < 1000V

120% of rated voltage for voltage rating of ≥ 1000V

(5±1 seconds and charge/discharge not exceeding 50mA)

²Dielectric Withstanding Voltage (DWV)

³Dissipation Factor (DF) Maximum Limit at 25°C

⁴Insulation Resistance (IR) Minimum Limit at 25°C

2.5%

100 megohm microfarads or 10GΩ

(500VDC applied for 120±5 seconds at 25°C)

¹Regarding Aging Rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.

²DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the

capacitor.

³Capacitance and dissipation factor (DF) measured under the following conditions:

1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance ≤10µF

120Hz ± 10Hz and 0.5 ± 0.1 Vrms if capacitance >10µF

⁴To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.

Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as

Automatic Level Control (ALC). The ALC feature should be switched to "ON".

Post Environmental Limits

High Temperature Life, Biased Humidity, Moisture Resistance

Rated DC

Voltage

Capacitance Dissipation Factor Capacitance

Insulation

Dielectric

X7R

Value

(Maximum %)

Shift

Resistance

> 25

16/25

< 16

3.0

10% of Initial

Limit

All

5.0

7.5

±20%

C1034_X7R_HV_ARC_SMD • 11/29/2017

6

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Table 1 – Capacitance Range/Selection Waterfall (0603 – 1812 Case Sizes)

Case Size/

Series

C0603W/V C0805W/V C1206W/V C1210W/V C1808W/V C1812W/V C1825W/V C2220W/V C2225W/V

Cap

Code

Voltage Code

C

B

D

C

B

D

C

B

D

C

B

D

C

B

D

C

B

D

C

B

C

B

C

B

Cap

Rated Voltage

(VDC)

500 630 1000 500 630 1000 500 630 1000 500 630 1000 500 630 1000 500 630 1000 500

630

500

630

500

630

Capacitance

Tolerance

Product Availability and Chip Thickness Codes

See Table 2 for Chip Thickness Dimensions

1,000 pF 102

1,200 pF 122

1,500 pF 152

1,800 pF 182

2,200 pF 222

2,700 pF 272

3,300 pF 332

3,900 pF 392

4,700 pF 472

5,600 pF 562

6,800 pF 682

8,200 pF 822

10,000 pF 103

12,000 pF 123

15,000 pF 153

18,000 pF 183

22,000 pF 223

27,000 pF 273

33,000 pF 333

39,000 pF 393

47,000 pF 473

56,000 pF 563

62,000 pF 623

68,000 pF 683

82,000 pF 823

J

K

M

CG CG CG

CG CG

CG

DG DG DG

DG DG

EJ EJ EJ

DG

LE LE LE

EJ EJ EJ FZ FZ FZ LE LE LE

EJ EJ

EJ

FZ FZ FZ LA LA LA GB GB GB

FZ FZ FU LA LA LA GB GB GB

FZ FU FK LA LA LB GB GB GC

FZ FU FK LA LA LB GB GB GE

FZ FK FS LA LA LC GB GB GE

FZ FK FS LA LA LC GE GE GE

EJ

FU FK

FK FS

FK

LA LC

LA

GB GE GK

GB GH GJ

GE GK

GE GN

GF

GJ

GL

GS

0.10 µF

0.12 µF

0.15 µF

0.18 µF

0.22 µF

0.27 µF

0.33 µF

0.39 µF

0.47 µF

0.56 µF

104

124

154

184

224

274

334

394

474

564

HE

HJ

HK

HE

HG

HJ

FK

LB

JE

JK

JL

JN

JE

JK

JL

JN

KF

KE

KF

KH

KJ

KE

KF

KH

KJ

Rated Voltage

(VDC)

500 630 1000 500 630 1000 500 630 1000 500 630 1000 500 630 1000 500 630 1000 500

630

B

500

C

630

B

500

C

630

B

Cap

Code

Voltage Code

C

B

D

C

B

D

C

B

D

C

B

D

C

B

D

C

B

D

C

Cap

Case Size/

Series

C0603W/V

C0805W/V

C1206W/V

C1210W/V

C1808W/V

C1812W/V

C1825W/V

C2220W/V

C2225W/V

These products are protected under US Patents 8,885,319 B2 and 9,490,072 B2, other patents pending, and any foreign counterparts.

KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage

capability within the same form factor (conﬁguration and dimensions).

C1034_X7R_HV_ARC_SMD • 11/29/2017

7

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Table 2A – Chip Thickness/Tape & Reel Packaging Quantities

Paper Quantity¹

7" Reel 13" Reel

Plastic Quantity

7" Reel 13" Reel

Thickness Case Thickness ±

Code

Size¹Range (mm)

CG

DG

EJ

FZ

FU

FK

FS

LE

LA

LB

LC

GB

GE

GC

GH

GF

GK

GJ

GN

GL

GS

HE

HG

HJ

HK

JE

0603

0805

1206

1210

1808

1812

1825

2220

2225

0.80 ± 0.10

1.25 ± 0.15

1.70 ± 0.20

1.25 ± 0.20

1.55 ± 0.20

2.10 ± 0.20

2.50 ± 0.30

1.00 ± 0.10

1.40 ± 0.15

1.60 ± 0.15

2.00 ± 0.15

1.00 ± 0.10

1.30 ± 0.10

1.10 ± 0.10

1.40 ± 0.15

1.50 ± 0.10

1.60 ± 0.20

1.70 ± 0.15

1.70 ± 0.20

1.90 ± 0.20

2.10 ± 0.20

1.40 ± 0.15

1.60 ± 0.20

2.00 ± 0.20

2.50 ± 0.20

1.40 ± 0.15

1.60 ± 0.20

2.00 ± 0.20

2.50 ± 0.20

1.40 ± 0.15

1.60 ± 0.20

2.00 ± 0.20

2.50 ± 0.20

4,000

0

15,000

0

2,500

2,000

2,500

2,000

1,000

2,500

1,000

500

10,000

8,000

10,000

8,000

4,000

10,000

4,000

2,000

4,000

2,000

4,000

2,000

4,000

2,000

500

1,000

500

1,000

500

JK

JL

JN

KE

KF

KH

KJ

500

1,000

500

7" Reel

13" Reel

7" Reel

13" Reel

Thickness

Code

Case

Size¹

Thickness ±

Range (mm)

Paper Quantity¹

Plastic Quantity

Package quantity based on ﬁnished chip thickness speciﬁcations.

¹If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA 0603

(1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".

C1034_X7R_HV_ARC_SMD • 11/29/2017

8

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Table 2B – Bulk Packaging Quantities

Loose Packaging

Packaging Type

Bulk Bag (default)

Packaging C-Spec¹

N/A²

Case Size

Packaging Quantities (pieces/unit packaging)

EIA (in)

Metric (mm)

Minimum

Maximum

0402

0603

0805

1206

1210

1808

1812

1825

2220

2225

1005

1608

2012

3216

3225

4520

4532

4564

5650

5664

50,000

1

20,000

¹The "Packaging C-Spec" is a 4 to 8 digit code which identiﬁes the packaging type and/or product grade. When ordering, the proper code must be included in

the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details. Commercial Grade

product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk bag packaging option for

Automotive Grade products.

²A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and Automotive Grade products). The 15th

through 22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our standard "Bulk

Bag" packaging.

C1034_X7R_HV_ARC_SMD • 11/29/2017

9

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Table 3A – Land Pattern Design Recommendations per IPC–7351 – Standard Termination

Density Level A:

Maximum (Most)

Land Protrusion (mm)

Density Level B:

Median (Nominal)

Land Protrusion (mm)

Density Level C:

Minimum (Least)

Land Protrusion (mm)

EIA

Size

Code

Metric

Size

Code

C

Y

X

V1

V2

C

Y

X

V1

V2

C

Y

X

V1

V2

0603

0805

1608

2012

3216

3225

4520

4532

4564

5650

5664

0.90

1.15

1.10

4.00

2.10

0.80

0.95

1.00

3.10

1.50

0.60

0.75

0.90

2.40

1.20

1.00

1.60

2.30

2.15

2.75

2.70

1.35

1.75

1.60

1.70

1.55

1.90

2.80

2.30

3.60

6.90

5.50

6.90

4.40

5.60

5.65

7.40

6.90

8.20

8.10

2.60

2.90

3.80

3.30

4.60

7.90

6.50

7.90

0.90

1.50

2.20

2.05

2.65

2.60

1.15

1.55

1.40

1.50

1.45

1.80

2.70

2.20

3.50

6.80

5.40

6.80

3.50

4.70

6.50

6.00

7.30

7.20

2.00

2.30

3.20

2.70

4.00

7.30

5.90

7.30

0.75

1.40

2.10

1.95

2.55

2.50

1.50

0.95

1.35

1.20

1.30

1.35

1.70

2.60

2.10

3.40

6.70

5.30

6.70

2.80

4.00

5.80

5.30

6.60

6.50

1.70

2.00

2.90

2.40

3.70

7.00

5.60

7.00

1206

1210

1808

1812

1825

2220

2225

Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reﬂow

solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reﬂow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform

qualiﬁcation testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).

Image below based on Density Level B for an EIA 1210 case size.

V1

Y

V2

X

C

Grid Placement Courtyard

C1034_X7R_HV_ARC_SMD • 11/29/2017 10

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Table 3B – Land Pattern Design Recommendations per IPC–7351 – Flexible Termination

Density Level A:

Maximum (Most)

Land Protrusion (mm)

Density Level B:

Median (Nominal)

Land Protrusion (mm)

Density Level C:

Minimum (Least)

Land Protrusion (mm)

EIA

Size

Code

Metric

Size

Code

C

Y

X

V1

V2

C

Y

X

V1

V2

C

Y

X

V1

V2

0603

0805

1206

1210

1808

1812

1825

2220

2225

1608

2012

3216

3225

4520

4532

4564

5650

5664

0.85

1.25

1.10

4.00

2.10

0.75

1.05

1.00

3.10

1.50

0.65

0.85

0.90

2.40

1.20

0.99

1.59

2.30

2.10

2.15

2.85

1.44

1.62

1.75

1.80

2.10

1.66

2.06

3.01

2.30

3.60

6.90

5.50

6.90

4.47

5.85

5.90

7.40

7.00

7.10

8.80

2.71

3.06

4.01

3.30

4.60

7.90

6.50

7.90

0.89

1.49

2.20

2.00

2.05

2.75

1.24

1.42

1.55

1.60

1.90

1.56

1.96

2.91

2.20

3.50

6.80

5.40

6.80

3.57

4.95

6.50

6.10

6.20

7.90

2.11

2.46

3.41

2.70

4.00

7.30

5.90

7.30

0.79

1.39

2.10

1.90

1.95

2.65

1.04

1.22

1.35

1.40

1.70

1.46

1.86

2.81

2.10

3.40

6.70

5.30

6.70

2.42

4.25

5.80

5.40

5.50

7.20

1.81

2.16

3.11

2.40

3.70

7.00

5.60

7.00

Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reﬂow

solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reﬂow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform

qualiﬁcation testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).

Image below based on Density Level B for an EIA 1210 case size.

V1

Y

V2

X

C

Grid Placement Courtyard

C1034_X7R_HV_ARC_SMD • 11/29/2017 11

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Soldering Process

Recommended Soldering Technique:

• Solder wave or solder reﬂow for EIA case sizes 0603, 0805 and 1206

• All other EIA case sizes are limited to solder reﬂow only

Recommended Reﬂow Soldering Proﬁle:

KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),

convection, IR or vapor phase reﬂow techniques. Preheating of these components is recommended to avoid extreme thermal

stress. KEMET’s recommended proﬁle conditions for convection and IR reﬂow reﬂect the proﬁle conditions of the IPC/J-

STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reﬂow passes at

these conditions.

Termination Finish

T_ꢂ

T_L

t_ꢂ

Proﬁle Feature

Maꢁimum Ramp ꢃp Rate ꢄ ꢅꢆCꢇsecond

Maꢁimum Ramp Doꢈn Rate ꢄ ꢉꢆCꢇsecond

SnPb

100% Matte Sn

t_L

Preheat/Soak

Temperature Minimum (T_Smin

)

100°C

150°C

200°C

T_smaꢁ

T_smin

Temperature Maximum (T_Smax

Time (t_S) from T_Sminto T_Smax

)

60 – 120 seconds

t_s

3°C/second

maximum

3°C/second

maximum

Ramp-Up Rate (T_Lto T_P)

ꢀ5

ꢀ5ꢆC to ꢂeaꢊ

Liquidous Temperature (T_L)

Time Above Liquidous (t_L)

Peak Temperature (T_P)

183°C

60 – 150 seconds

235°C

217°C

60 – 150 seconds

260°C

Time

Time Within 5°C of Maximum

20 seconds

maximum

30 seconds

maximum

Peak Temperature (t_P)

6°C/second

maximum

6°C/second

maximum

Ramp-Down Rate (T^Pto T_L)

Time 25°C to Peak

6 minutes

maximum

8 minutes

maximum

Temperature

Note 1: All temperatures refer to the center of the package, measured on the

capacitor body surface that is facing up during assembly reﬂow.

C1034_X7R_HV_ARC_SMD • 11/29/2017 12

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Table 4 – Performance & Reliability: Test Methods and Conditions

Stress

Reference

Test or Inspection Method

Terminal Strength

JIS–C–6429

Appendix 1, Note: Force of 1.8 kg for 60 seconds.

Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm

for C0G. Flexible termination system – 3.0 mm (minimum).

Board Flex

JIS–C–6429

Magniﬁcation 50 X. Conditions:

a) Method B, 4 hours at 155°C, dry heat at 235°C

b) Method B at 215°C category 3

Solderability

J–STD–002

c) Method D, category 3 at 260°C

Temperature Cycling

Biased Humidity

JESD22 Method JA–104 1,000 cycles (−55°C to +125°C). Measurement at 24 hours +/−4 hours after test conclusion.

Load Humidity: 1,000 hours 85°C/85% RH and 200 VDC maximum. Add 100 K ohm resistor.

Measurement at 24 hours +/−4 hours after test conclusion.

MIL–STD–202 Method

103

Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.

Measurement at 24 hours +/−4 hours after test conclusion.

MIL–STD–202 Method

106

t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered. Measurement at 24 hours

Moisture Resistance

Thermal Shock

+/−4 hours after test conclusion.

MIL–STD–202 Method

107

®55°C/+125°C. Note: Number of cycles required – 300. Maximum transfer time – 20

seconds. Dwell time – 15 minutes. Air – Air.

MIL–STD–202 Method

High Temperature Life

Storage Life

1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 1.2 X rated voltage applied.

108

MIL–STD–202 Method

108

150°C, 0 VDC for 1,000 hours.

5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7

secure points on one long side and 2 secure points at corners of opposite sides. Parts

mounted within 2" from any secure point. Test from 10 – 2,000 Hz

MIL–STD–202 Method

204

Vibration

MIL–STD–202 Method

213

Mechanical Shock

Figure 1 of Method 213, Condition F.

MIL–STD–202 Method

Resistance to Solvents

Add aqueous wash chemical, OKEM Clean or equivalent.

215

Storage & Handling

Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in

other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,

and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp

and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum

storage humidity not exceed 70% relative humidity. Temperature ﬂuctuations should be minimized to avoid condensation on

the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock

should be used promptly, preferably within 1.5 years of receipt.

C1034_X7R_HV_ARC_SMD • 11/29/2017 13

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Construction – Standard Termination

Detailed Cross Section

Shield Electrodes Dielectric Material

(Ni)

(BaTiO₃)

Barrier Layer

(Ni)

Dielectric

Material (BaTiO₃)

Termination Finish

End Termination/

(100% Matte Sn/

SnPb - 5% Pb min)

External Electrode

(Cu)

Inner Electrodes

(Ni)

Shield Electrodes End Termination/

(Ni)

External Electrode

(Cu)

Barrier Layer

(Ni)

Termination Finish

(100% Matte Sn/

SnPb - 5% Pb min)

Inner Electrodes Shield Electrode

(Ni)

Construction – Flexible Termination

Detailed Cross Section

Shield Electrodes Dielectric Material

(Ni)

(BaTiO₃)

Barrier Layer

(Ni)

End Termination/

External Electrode

(Cu)

Termination Finish

(100% Matte Sn/

SnPb - 5% Pb min)

Epoxy Layer

(Ag)

Dielectric

Material (BaTiO₃)

Inner Electrodes

(Ni)

Shield Electrodes

(Ni)

End Termination/

External Electrode

(Cu)

Epoxy Layer

(Ag)

Barrier Layer

(Ni)

Termination Finish

(100% Matte Sn/

SnPb - 5% Pb min)

Inner Electrodes

(Ni)

Shield Electrode

(Ni)

C1034_X7R_HV_ARC_SMD • 11/29/2017 14

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Capacitor Marking (Optional):

These surface mount multilayer ceramic capacitors are

normally supplied unmarked. If required, they can be

marked as an extra cost option. Marking is available

on most KEMET devices but must be requested using

the correct ordering code identiﬁer(s). If this option is

requested, two sides of the ceramic body will be laser

marked with a “K” to identify KEMET, followed by two

characters (per EIA–198 - see table below) to identify the

capacitance value. EIA 0603 case size devices are limited

to the “K” character only.

Marking appears in legible contrast. Illustrated below

is an example of an MLCC with laser marking of “KA8”,

which designates a KEMET device with rated capacitance

of 100 µF. Orientation of marking is vendor optional.

2-Digit

KEMET

Capacitance

ID

Code

Laser marking option is not available on:

• C0G, Ultra Stable X8R and Y5V dielectric devices.

• EIA 0402 case size devices.

• EIA 0603 case size devices with Flexible Termination

option.

• KPS Commercial and Automotive Grade stacked

devices.

• X7R dielectric products in capacitance values outlined

below.

EIA Case Size

Metric Size Code

Capacitance

0603

0805

1206

1210

1808

1812

1825

2220

2225

1608

2012

3216

3225

4520

4532

4564

5650

5664

≤ 170 pF

≤ 150 pF

≤ 910 pF

≤ 2,000 pF

≤ 3,900 pF

≤ 6,700 pF

≤ 0.018 µF

≤ 0.027 µF

≤ 0.033 µF

C1034_X7R_HV_ARC_SMD • 11/29/2017 15

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Capacitor Marking (Optional) cont’d

Capacitance (pF) For Various Alpha/Numeral Identiﬁers

Numeral

Alpha

Character

9

0

1

2

3

4

5

6

7

8

Capacitance (pF)

A

B

C

D

E

F

0.10

0.11

0.12

0.13

0.15

0.16

0.18

0.20

0.22

0.24

0.27

0.30

0.33

0.36

0.39

0.43

0.47

0.51

0.56

0.62

0.68

0.75

0.82

0.91

0.25

0.35

0.40

0.45

0.50

0.60

0.70

0.80

0.90

1.0

1.1

1.2

1.3

1.5

1.6

1.8

2.0

2.2

2.4

2.7

3.0

3.3

3.6

3.9

4.3

4.7

5.1

5.6

6.2

6.8

7.5

8.2

9.1

2.5

3.5

4.0

4.5

5.0

6.0

7.0

8.0

9.0

10

11

12

13

15

16

18

20

22

24

27

30

33

36

39

43

47

51

56

62

68

75

82

91

25

35

40

45

50

60

70

80

90

100

110

120

130

150

160

180

200

220

240

270

300

330

360

390

430

470

510

560

620

680

750

820

910

250

350

400

450

500

600

700

800

900

1,000

1,100

1,200

1,300

1,500

1,600

1,800

2,000

2,200

2,400

2,700

3,000

3,300

3,600

3,900

4,300

4,700

5,100

5,600

6,200

6,800

7,500

8,200

9,100

2,500

3,500

4,000

4,500

5,000

6,000

7,000

8,000

9,000

10,000 100,000 1,000,000 10,000,000

11,000 110,000 1,100,000 11,000,000

100,000,000

110,000,000

120,000,000

130,000,000

150,000,000

160,000,000

180,000,000

200,000,000

220,000,000

240,000,000

270,000,000

300,000,000

330,000,000

360,000,000

390,000,000

430,000,000

470,000,000

510,000,000

560,000,000

620,000,000

680,000,000

750,000,000

820,000,000

910,000,000

250,000,000

350,000,000

400,000,000

450,000,000

500,000,000

600,000,000

700,000,000

800,000,000

900,000,000

12,000 120,000 1,200,000 12,000,000

13,000 130,000 1,300,000 13,000,000

15,000 150,000 1,500,000 15,000,000

16,000 160,000 1,600,000 16,000,000

18,000 180,000 1,800,000 18,000,000

20,000 200,000 2,000,000 20,000,000

22,000 220,000 2,200,000 22,000,000

24,000 240,000 2,400,000 24,000,000

27,000 270,000 2,700,000 27,000,000

30,000 300,000 3,000,000 30,000,000

33,000 330,000 3,300,000 33,000,000

36,000 360,000 3,600,000 36,000,000

39,000 390,000 3,900,000 39,000,000

43,000 430,000 4,300,000 43,000,000

47,000 470,000 4,700,000 47,000,000

51,000 510,000 5,100,000 51,000,000

56,000 560,000 5,600,000 56,000,000

62,000 620,000 6,200,000 62,000,000

68,000 680,000 6,800,000 68,000,000

75,000 750,000 7,500,000 75,000,000

82,000 820,000 8,200,000 82,000,000

91,000 910,000 9,100,000 91,000,000

25,000 250,000 2,500,000 25,000,000

35,000 350,000 3,500,000 35,000,000

40,000 400,000 4,000,000 40,000,000

45,000 450,000 4,500,000 45,000,000

50,000 500,000 5,000,000 50,000,000

60,000 600,000 6,000,000 60,000,000

70,000 700,000 7,000,000 70,000,000

80,000 800,000 8,000,000 80,000,000

90,000 900,000 9,000,000 90,000,000

G

H

J

K

L

M

N

P

Q

R

S

T

U

V

W

X

Y

Z

a

b

d

e

f

m

n

t

y

C1034_X7R_HV_ARC_SMD • 11/29/2017 16

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Tape & Reel Packaging Information

KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with

EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for

details on reeling quantities for commercial chips.

ꢑar code laꢈel

Antiꢆstatic reel

®

ꢇmꢈossed plasticꢉ or

punched paper carrierꢃ

Chip and ꢍꢎS orientation in pocꢌet

(eꢋcept 1ꢀꢁ5 commercial, and 1ꢀꢁ5 and ꢁꢁꢁ5 Military)

KEMET

Sprocꢌet holes

ꢇmꢈossment or punched cavity

ꢀ mm, 1ꢁ mm

or 1ꢂ mm carrier tape

Antiꢆstatic cover tape

(0ꢃ10 mm (0ꢃ00ꢊꢄ) maꢋimum thicꢌness)

17ꢀ mm (7ꢃ00ꢄ)

or

ꢅꢅ0 mm (1ꢅꢃ00ꢄ)

ꢉꢇꢏA 01005, 0ꢁ01, 0ꢊ0ꢁ and 0ꢂ0ꢅ case siꢐes availaꢈle on punched paper carrier onlyꢃ

Table 5 – Carrier Tape Conﬁguration, Embossed Plastic & Punched Paper (mm)

New 2 mm Pitch Reel Options*

Embossed Plastic Punched Paper

Tape

Packaging

Ordering Code

(C-Spec)

C-3190

7" Reel 13" Reel 7" Reel 13" Reel

EIA Case Size Size

(W)*

Packaging Type/Options

Pitch (P₁)* Pitch (P₁)*

01005 – 0402

0603

8

2

2/4

4

Automotive grade 7" reel unmarked

Automotive grade 13" reel unmarked

Commercial grade 7" reel unmarked

Commercial grade 13" reel unmarked

C-3191

2/4

4

C-7081

0805

8

4

C-7082

1206 – 1210

1805 – 1808

≥ 1812

8

4

* 2 mm pitch reel only available for 0603 EIA case size.

2 mm pitch reel for 0805 EIA case size under development.

12

16

8

4

8

Beneﬁts of Changing from 4 mm to 2 mm Pitching Spacing

• Lower placement costs.

• Double the parts on each reel results in fewer reel

changes and increased eﬃciency.

• Fewer reels result in lower packaging, shipping and

storage costs, reducing waste.

KPS 1210

8

KPS 1812

and 2220

12

4

12

4

Array 0612

*Refer to Figures 1 and 2 for W and P₁carrier tape reference locations.

*Refer to Tables 6 and 7 for tolerance speciﬁcations.

C1034_X7R_HV_ARC_SMD • 11/29/2017 17

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

T

ꢀ ꢇ

ꢍ10 pitches cumulative

tolerance on tape ꢎ0ꢆꢇ mmꢏ

ꢇ

ꢉ

1

ꢀo

ꢈDo

Ao

ꢁ

ꢄo

ꢂ

ꢉ

ꢇ

ꢃ

1

ꢃo

S

1

ꢀ

1

T

1

ꢉmꢅossment

ꢁor cavity siꢊe,

see ꢋote 1 Taꢅle ꢌ

Center Lines of Cavity

ꢈD

1

Cover Tape

is for tape feeder reference only,

including draft concentric aꢅout ꢃoꢆ

ꢃ

1

User Direction of Unreeling

Table 6 – Embossed (Plastic) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

D₁Minimum

Note 1

1.0

(0.039)

R Reference S₁Minimum

T

T₁

Tape Size

8 mm

D₀

E₁

P₀

P₂

Note 2

Note 3

Maximum Maximum

25.0

(0.984)

1.5 +0.10/−0.0

(0.059 +0.004/−0.0)

1.75 ±0.10

4.0 ±0.10

2.0 ±0.05

0.600

(0.024)

0.600

(0.024)

0.100

(0.004)

12 mm

16 mm

(0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002)

1.5

(0.059)

30

(1.181)

Variable Dimensions — Millimeters (Inches)

B₁Maximum

Note 4

E₂

T₂

W

Tape Size

8 mm

Pitch

F

P₁

A₀,B₀& K₀

Minimum

6.25

(0.246)

Maximum Maximum

2.5

(0.098)

4.35

(0.171)

3.5 ±0.05

(0.138 ±0.002) (0.157 ±0.004)

4.0 ±0.10

8.3

(0.327)

Single (4 mm)

8.2

10.25

5.5 ±0.05

8.0 ±0.10

4.6

12.3

12 mm

16 mm

Note 5

and Double (8 mm)

(0.323)

(0.404)

(0.217 ±0.002) (0.315 ±0.004)

(0.181)

(0.484)

12.1

(0.476)

14.25

(0.561)

7.5 ±0.05 12.0 ±0.10

(0.138 ±0.002) (0.157 ±0.004)

4.6

(0.181)

16.3

(0.642)

Triple (12 mm)

1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment

location and hole location shall be applied independent of each other.

2. The tape with or without components shall pass around R without damage (see Figure 6).

3. If S₁< 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).

4. B₁dimension is a reference dimension for tape feeder clearance only.

5. The cavity deﬁned by A₀, B₀and K₀shall surround the component with suﬃcient clearance that:

(a) the component does not protrude above the top surface of the carrier tape.

(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).

(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see

Figure 4).

(e) for KPS product, A₀and B₀are measured on a plane 0.3 mm above the bottom of the pocket.

(f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.

C1034_X7R_HV_ARC_SMD • 11/29/2017 18

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Figure 2 – Punched (Paper) Carrier Tape Dimensions

T

ꢊ10 pitches cumulative

tolerance on tape ꢋ0ꢌꢄ mmꢍ

ꢂ₁

ꢀo

ꢁDo

A₀

ꢃ

ꢅ

ꢂ_ꢄ

ꢆ₀

ꢀ¹

ꢆottom Cover Tape

G

Cavity Siꢇe,

See

T¹

Center Lines of Cavity

Top Cover Tape

ꢈote 1, Taꢉle 7

ꢆottom Cover Tape

User Direction of Unreeling

Table 7 – Punched (Paper) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

R Reference

Note 2

Tape Size

8 mm

D₀

E₁

P₀

P₂

T₁Maximum

G Minimum

0.10

1.5 +0.10 -0.0

(0.059 +0.004 -0.0)

1.75 ±0.10

(0.069 ±0.004)

4.0 ±0.10

(0.157 ±0.004)

2.0 ±0.05

(0.079 ±0.002)

0.75

(0.030)

25

(0.984)

(0.004)

Maximum

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

Pitch

E2 Minimum

F

P₁

T Maximum

W Maximum

A₀B₀

2.0 ±0.05

(0.079 ±0.002)

4.0 ±0.10

(0.157 ±0.004)

8.3

(0.327)

8.3

(0.327)

Half (2 mm)

Single (4 mm)

6.25

(0.246)

3.5 ±0.05

(0.138 ±0.002)

1.1

(0.098)

Note 1

8 mm

1. The cavity deﬁned by A₀, B₀and T shall surround the component with suﬃcient clearance that:

a) the component does not protrude beyond either surface of the carrier tape.

b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

c) rotation of the component is limited to 20° maximum (see Figure 3).

d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).

e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.

2. The tape with or without components shall pass around R without damage (see Figure 6).

C1034_X7R_HV_ARC_SMD • 11/29/2017 19

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 kg minimum.

2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

Tape Width

8 mm

Peel Strength

0.1 to 1.0 Newton (10 to 100 gf)

0.1 to 1.3 Newton (10 to 130 gf)

12 and 16 mm

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be

165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of

300 ±10 mm/minute.

3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA

Standards 556 and 624.

Figure 3 – Maximum Component Rotation

°

T

Maximum Component Rotation

Top View

Maximum Component Rotation

Side View

Typical Pocket Centerline

Tape

Maximum

°

T

s

Width (mm) Rotation (

)

8,12

16 – 200

20

10

Bo

Tape

Maximum

°

S

Width (mm) Rotation (

)

8,12

16 – 56

72 – 200

20

10

5

Typical Component Centerline

Ao

Figure 4 – Maximum Lateral Movement

Figure 5 – Bending Radius

Embossed

Carrier

Punched

Carrier

8 mm & 12 mm Tape

16 mm Tape

0.5 mm maximum

1.0 mm maximum

R

Bending

Radius

R

C1034_X7R_HV_ARC_SMD • 11/29/2017 20

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Figure 6 – Reel Dimensions

ꢁull Radius,

ꢋꢌ (ꢅncludes

flange distortion

at outer edge)

Access Hole at

Slot Location

(ꢃ ꢄ0 mm minimum)

See ꢀote

ꢋꢇ (Measured at huꢍ)

D

(See ꢀote)

A

ꢀ

C

(Arꢍor hole

ꢋ1 (Measured at huꢍ)

diameter)

ꢅf present,

tape slot in core

for tape startꢆ

ꢇꢈ5 mm minimum ꢉidth ꢊ

10ꢈ0 mm minimum depth

ꢂ

(see ꢀote)

ꢀoteꢆ Drive spoꢎes optionalꢏ if used, dimensions ꢂ and D shall applyꢈ

Table 8 – Reel Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size

8 mm

A

B Minimum

C

D Minimum

178 ±0.20

(7.008 ±0.008)

or

1.5

(0.059)

13.0 +0.5/−0.2

(0.521 +0.02/−0.008)

20.2

(0.795)

12 mm

16 mm

330 ±0.20

(13.000 ±0.008)

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

N Minimum

W₁

W₂Maximum

W₃

8.4 +1.5/−0.0

(0.331 +0.059/−0.0)

14.4

(0.567)

50

(1.969)

12.4 +2.0/−0.0

18.4

Shall accommodate tape

width without interference

12 mm

16 mm

(0.488 +0.078/−0.0)

(0.724)

16.4 +2.0/−0.0

(0.646 +0.078/−0.0)

22.4

(0.882)

C1034_X7R_HV_ARC_SMD • 11/29/2017 21

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

Figure 7 – Tape Leader & Trailer Dimensions

ꢂmꢈossed Carrier

Carrier Tape

ꢆunched Carrier

ꢇ mm & 1ꢄ mm only

Round Sprocꢁet Holes

START

END

Top Cover Tape

ꢂlongated Sprocꢁet Holes

(ꢃꢄ mm tape and ꢅider)

100 mm

minimum Leader

ꢉ00 mm minimum

Trailer

Components

1ꢀ0 mm minimum

Top Cover Tape

Figure 8 – Maximum Camber

ꢂlongated Sprocꢀet Holes

(ꢄꢃ mm & ꢅider tapes)

Carrier Tape

Round Sprocꢀet Holes

1 mm maꢁimum, either direction

Straight ꢂdge

ꢃ50 mm

C1034_X7R_HV_ARC_SMD • 11/29/2017 22

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)

KEMET Electronics Corporation Sales Oﬃces

For a complete list of our global sales oﬃces, please visit www.kemet.com/sales.

Disclaimer

All product speciﬁcations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for

checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.

All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.

Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such

applications, but are not intended to constitute – and KEMET speciﬁcally disclaims – any warranty concerning suitability for a speciﬁc customer application or use.

The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any

technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no

obligation or liability for the advice given or results obtained.

Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component

failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards

(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or

property damage.

Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other

measures may not be required.

KEMET is a registered trademark of KEMET Electronics Corporation.

C1034_X7R_HV_ARC_SMD • 11/29/2017 23


型号：	C1210V683KBRAC7800
厂家：	KEMET CORPORATION
描述：	Ceramic Capacitor, Multilayer, Ceramic, 630V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.068uF, Surface Mount, 1210, CHIP, ROHS COMPLIANT
文件：	总23页 (文件大小：1537K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

C1210V683KBRAC7800 [KEMET]

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