C1632C103M4RAC [KEMET]
Four individual capacitors inside one 1206 monolithic structure; 内的一个1206的整体结构四个单项电容型号: | C1632C103M4RAC |
厂家: | KEMET CORPORATION |
描述: | Four individual capacitors inside one 1206 monolithic structure |
文件: | 总7页 (文件大小:933K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
CERAMIC CAPACITOR ARRAY
FEATURES
• Four individual capacitors inside
• Easier to handle and solder than 4 smaller chips
one 1206 monolithic structure
• Saves board and inventory space
• One placement instead of four - less costly
• Tape and reel per EIA 481-1
• RoHS Compliant
CAPACITOR OUTLINE DRAWING
T
L
CL
BW
P
BW1
P/2
Ref
W
TABLE 1
EIA DIMENSIONS – MILLIMETERS (INCHES)
Length
L
Width
W
Thickness
T (max.)
Bandwidth
BW
Bandwidth
BW1
Pitch
P
Size
Code
1632
3.2 (0.126)
1.6 (.063)
0.7 - 1.35
0.40 (0.016)
0.1 - 0.5
0.8 (0.031)
± 0.2 (0.008)
± 0.2 (.008)
(0.027 - 0.053) ± 0.2 (0.008) (0.004 - 0.020) ± 0.1 (0.004)
Notes:
1. Metric is controlling - English for reference only.
2. Pitch (P) tolerances are non-cumulative along the package.
3. Thickness (T) depends on capacitance.
CERAMIC ARRAY ORDERING INFORMATION
C
1632
C
103
K
5
R
A
C
CERAMIC
EIA SIZE CODE
Ceramic chip array
END METALLIZATION
C-Standard
(Tin-plated nickel barrier)
FAILURE RATE LEVEL
SPECIFICATION
C - Standard
A- Not Applicable
CAPACITANCE CODE
Expressed in Picofarads (pF)
TEMPERATURE CHARACTERISTIC
Designated by Capacitance
Change Over Temperature Range
G – C0G (NP0) (± 30 PPM/°C)
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 thru 9.9pF. (Example: 2.2pF = 229
R – X7R (± 15%)
VOLTAGE
5 = 50v; 3 = 25v; 4 = 16v; 8=10v
CAPACITANCE TOLERANCE
K – ± 10%: M – ± 20% Standard Tolerances
Contact factory for any special requirements.
85
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
CERAMIC CHIP ARRAY
1632 CERAMIC ARRAY
LAND PATTERN LAYOUT
TABLE 2A
C0G DIELECTRIC – CAPACITANCE RANGE
Capacitance
Values (pF)
Capacitance
Tolerance
10V
16V
KEMET Part Number
100V 200V
25V
50V
6 Places
P
X
8 Places
100 100
120 120
150 150
180 180
220 220
270 270
330 330
390 390
470 470
560 560
680 680
820 820
101
10
12
15
18
22
27
33
39
47
C1632C100(1)(2)GAC
C1632C120(1)(2)GAC
C1632C150(1)(2)GAC
C1632C180(1)(2)GAC
C1632C220(1)(2)GAC
C1632C270(1)(2)GAC
C1632C330(1)(2)GAC
C1632C390(1)(2)GAC
C1632C470(1)(2)GAC
C1632C560(1)(2)GAC
C1632C680(1)(2)GAC
C1632C820(1)(2)GAC
C1632C101(1)(2)GAC
C1632C121(1)(2)GAC
C1632C151(1)(2)GAC
C1632C181(1)(2)GAC
C1632C221(1)(2)GAC
C1632C271(1)(2)GAC
C1632C331(1)(2)GAC
C1632C391(1)(2)GAC
C1632C471(1)(2)GAC
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
100 100 100
120 120 120
150 150 150
180 180 180
220 220 220
270 270 270
330 330 330
390 390 390
470 470 470
560 560 560
680 680 680
820 820 820
101 101 101
121 121 121
151 151 151
181 181 181
221 221 221
271 271 271
331 331 331
391 391 391
471 471 471
C
G
Y
Z
56
68
82
Additional pad dimension information is available in
KEMET Technical Bulletin F-2100.
100
120
150
180
220
270
330
390
470
121
151
181
(1) To complete the KEMET part number, insert the alpha code for the tolerance desired.
K = ± 10% and M = ± 20% – standard tolerance. Contact factory for any special requirements.
(2) To complete the KEMET part number, insert appropriate number for voltage desired:
"5" = 50 volts, "3" = 25 volts, "4" = 16 volts, and "8" = 10 volts.
LANDPATTERN DIMENSIONS - CERAMIC CHIP
CAPACITOR ARRAYS - MM
Reflow Solder
P(ref)
0.80
Dimension
Z
G
X
Y(ref) C(ref)
TABLE 2B
3216
2.80 0.40 0.52 1.20 1.60
X7R DIELECTRIC – CAPACITANCE RANGE
Calculation Formula
Z = Lmin + 2Jt + Tt
G = Smax - 2Jh -Th
X = Wmin + 2Js + Ts
Tt, Th, Ts = Combined
tolerances
Capacitance
Values (pF)
Capacitance
Tolerance
10V
16V
KEMET Part Number
200V
100V
25V
50V
331
391
471
561
331
391
471
561
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
C1632C331(1)(2)RAC
C1632C391(1)(2)RAC
C1632C471(1)(2)RAC
C1632C561(1)(2)RAC
C1632C681(1)(2)RAC
C1632C821(1)(2)RAC
C1632C102(1)(2)RAC
C1632C122(1)(2)RAC
C1632C152(1)(2)RAC
C1632C182(1)(2)RAC
C1632C222(1)(2)RAC
C1632C272(1)(2)RAC
C1632C332(1)(2)RAC
C1632C392(1)(2)RAC
C1632C472(1)(2)RAC
C1632C562(1)(2)RAC
C1632C682(1)(2)RAC
C1632C822(1)(2)RAC
C1632C103(1)(2)RAC
C1632C123(1)(2)RAC
C1632C153(1)(2)RAC
C1632C183(1)(2)RAC
C1632C223(1)(2)RAC
C1632C273(1)(2)RAC
C1632C333(1)(2)RAC
C1632C393(1)(2)RAC
C1632C473(1)(2)RAC
C1632C563(1)(2)RAC
C1632C683(1)(2)RAC
C1632C823(1)(2)RAC
C1632C104(1)(2)RAC
331 331 331
391 391 391
471 471 471
561 561 561
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
K,M
681 681 681 681
821 821 821 821
102 102 102 102
122 122 122 122
152 152 152 152
182 182 182 182
222 222 222 222
272 272 272 272
332 332 332 332
392 392 392 392
472 472 472 472
562 562 562
682 682 682
822 822 822
103 103 103
123 123 123
153 153 153
183 183 183
223 223 223
273
8200
10,000
12,000
15,000
18,000
22,000
27,000
33,000
39,000
47,000
56,000
68,000
82,000
100,000
333
393
473
563
683
823
104
(1) To complete the KEMET part number, insert the alpha code for the tolerance desired:
K = ± 10% and M = ± 20% – standard tolerances. Contact factory for any special requirements.
(2) To complete the KEMET part number, insert appropriate number for voltage desired:
"5" = 50 volts, "3" = 25 volts, "4" = 16 volts, and "8" = 10 volts.
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
86
CERAMIC CHIP CAPACITORS
Packaging Information
Tape & Reel Packaging
KEMET offers Multilayer Ceramic Chip Capacitors
packaged in 8mm and 12mm plastic tape on 7" and
13" reels in accordance with EIA standard 481-1:
Taping of surface mount components for automatic
handling. This packaging system is compatible with all
tape fed automatic pick and place systems. See page 78
for details on reeling quantities for commercial chips
and page 87 for MIL-PRF-55681 chips.
Anti-Static Reel
®
Embossed Carrier*
Chip Orientation
0402 and 0603 case sizes
in Pocket
KEMET
available on punched paper only.
(except 1825 Commercial, and 1825 & 2225 Military)
Embossment
8mm ± .30
(.315 ± .012")
Anti-Static Cover Tape
178mm (7.00")
or
330mm (13.00")
or
(.10mm (.004") Max Thickness)
12mm ± .30
(.472 ± .012")
* Punched paper carrier used for 0402 and 0603 case size.
SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM
Reflow Solder
Wave Solder
Y(ref) Smin
Grid
Placement
Dimension
0402
Z
G
X
Y(ref) C(ref)
Z
G
X
Not Recommended
2.14 0.28 0.74 0.93 1.21
2.78 0.68 1.08 1.05 1.73
3.30 0.70 1.60 1.30 2.00
4.50 1.50 2.00 1.50 3.00
4.50 1.50 2.90 1.50 3.00
5.90 2.30 3.70 1.80 4.10
5.90 2.30 6.90 1.80 4.10
7.00 3.30 5.50 1.85 5.15
7.00 3.30 6.80 1.85 5.15
Courtyard
0603
3.18 0.68 0.80 1.25 1.93
3.70 0.70 1.10 1.50 2.20
4.90 1.50 1.40 1.70 3.20
4.90 1.50 2.00 1.70 3.20
C
0805
1206
1210
1812
1825
X
Not Recommended
2220
2225
Calculation Formula
Z = Lmin + 2Jt + Tt
G = Smax - 2Jh -Th
G
Y
Z
X = Wmin + 2Js + Ts
Tt, Th, Ts = Combined tolerances
93
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
TANTALUM, CERAMIC AND
ALUMINUM CHIP CAPACITORS
Packaging Information
Performance Notes
1. Cover Tape Break Force: 1.0 Kg Minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
8 mm
Peel Strength
0.1 Newton to 1.0 Newton (10g to 100g)
12 mm
0.1 Newton to 1.3 Newton (10g to 130g)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier
tape shall be 165ꢀ to 180ꢀ from the plane of the carrier tape. During peeling, the carrier and/or cover tape
shall be pulled at a velocity of 300 10 mm/minute.
3. Reel Sizes: Molded tantalum capacitors are available on either 180 mm (7") reels (standard) or 330 mm (13")
reels (with C-7280). Note that 13” reels are preferred.
4. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes.
Refer to EIA-556.
Embossed Carrier Tape Configuration: Figure 1
Table 1 — EMBOSSED TAPE DIMENSIONS (Metric will govern)
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
E
P0
P2
T Max
T1 Max
8 mm
and
12 mm
1.5
+0.10 -0.0
(0.059
1.75 0.10
4.0 0.10
2.0 0.05
0.600
0.100
(0.069 0.004) (0.157 0.004) (0.079 0.002) (0.024)
(0.004)
+0.004, -0.0)
Variable Dimensions — Millimeters (Inches)
Tape Size
Pitch
B1 Max.
Note 1
D1 Min.
Note 2
F
P1
R Min. T2 Max
Note 3
W
A0B0K0
Note 4
8 mm
Single
4.4
1.0
3.5 0.05
4.0 0.10
25.0
2.5
8.0 0.30
(4 mm)
(0.173)
(0.039) (0.138 0.002) (0.157 0.004) (0.984) (0.098) (.315 0.012)
12 mm
Double
(8 mm)
8.2
(0.323)
1.5 5.5 0.05 8.0 0.10 30.0 4.6 12.0 0.30
(0.059) (0.217 0.002) (0.315 0.004) (1.181) (0.181) (0.472 0.012)
NOTES
1. B1 dimension is a reference dimension for tape feeder clearance only.
2. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of
embossment location and hole location shall be applied independent of each other.
3. Tape with components shall pass around radius “R” without damage (see sketch A). The minimum trailer length (Fig. 2) may require
additional length to provide R min. for 12 mm embossed tape for reels with hub diameters approaching N min. (Table 2)
4. The cavity defined by A0, B0, and K0 shall be configured to surround the part with sufficient clearance such that the chip does not pro-
trude beyond the sealing plane of the cover tape, the chip can be removed from the cavity in a vertical direction without mechanical
restriction, rotation of the chip is limited to 20 degrees maximum in all 3 planes, and lateral movement of the chip is restricted to 0.5 mm
maximum in the pocket (not applicable to vertical clearance.)
94
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
TANTALUM, CERAMIC AND
ALUMINUM CHIP CAPACITORS
Packaging Information
Embossed Carrier Tape Configuration (cont.)
20°
Sketch D: Tape Camber (Top View)
1mm (0.039) Max.
1mm (0.039) Max.
250mm (9.843)
Allowable camber to be 1 mm/250 mm.
400mm (15.75) Min.
Figure 2:
Tape Leader
& Trailer
Dimensions
(Metric
Dimensions
Will Govern)
Figure 3: Reel Dimensions (Metric Dimensions will govern)
Table 2 – REEL DIMENSIONS (Metric will govern)
Tape Size
A Max
B* Min
C
D* Min
N Min
W1
W2 Max
W3
8 mm
330.0
(12.992)
1.5
13.0 0.20
20.2
(0.795)
50.0
(1.969)
See
8.4
+1.5, -0.0
(0.331
14.4
(0.567)
7.9 Min
(0.311)
10.9 Max
(0.429)
(0.059) (0.512 0.008)
Note 3
+0.059, -0.0)
12 mm
330.0
(12.992)
1.5
13.0 0.20
20.2
(0.795)
Table 1
12.4
+2.0, -0.0
(0.488
18.4
(0.724)
11.9 Min
(0.469)
15.4 Max
(0.606)
(0.059) (0.512 0.008)
+0.078, -0.0)
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
95
CERAMIC CHIP CAPACITORS
Packaging Information
Punched Carrier (Paper Tape) Configuration (Ceramic Chips Only):
10 pitches cumulative
P0
tolerance on tape
± 0.2 (± 0.008)
T
D0
P2
E
Top
Tape
Cover
A0
Bottom
Tape
Cover
F
W
B0
G2
T1
P1
Center lines
of cavity
Max. Cavity Size
See Note 1
Table 1
User Direction of Feed
Table 1: 8 & 12mm PunchedTape
(Metric Dimensions Will Govern)
Constant Dimensions - Millimeters (Inches)
Tape
Size
D
P
P
T
G
G
2
E
R Min.
0
0
2
1
1
8mm
and
12mm
1.5
1.75 ± 0.10
4.0 ± 0.10
2.0 ± 0.05
0.10 0.75 0.75 25 (.984)
(.004) (.030) (.030) See Note 2
+0.10, -0.0
(.059
(.069 ± 0.004) (.157 ± 0.004) (.079 ± 0.002) Max. Min. Min.
Table 1
+0.004, -0.0)
Table 1: 8 & 12mm PunchedTape
(Metric Dimensions Will Govern)
Variable Dimensions - Millimeters (Inches)
Tape
Size
P
W
A B
0 0
T
F
1
8mm
1/2
2.0 ± 0.10
1.1mm (.043)
Max. for Paper
Base Tape and
1.6mm (.063)
Max. for Non-
Paper Base
(.079 ± .004)
3.5 ± 0.05
8.0 ± ±0.3
See Note 1
Table 1
Pitch See Require-
ments
(.138 ± .002)
(.315 ± ±0.012)
Section 3.3 (d)
8mm
4.0 ± 0.10
(0.157 ± .004)
Compositions.
See Note 3.
12mm
12mm
4.0 ± 0.10
5.5 ± 0.05
12.0 ± 0.3
(0.157 ± .004)
8.0 ± 0.10
(.217 ± .002)
(.472 ± .012)
Double (0.315 ± .004)
Pitch
Note:
1. A , B and T determined by the maximum dimensions to the ends of the terminals extending from the
0
0
body and/or the body dimensions of the component. The clearance between the ends of the terminals or
body of the component to the sides and depth of the cavity (A , B and T) must be within 0.05mm (.002)
0
0
minimum and 0.50mm (.020) maximum. The clearance allowed must also prevent rotation of the component
within the cavity of not more than 20 degrees (see sketches A and B).
2. Tape with components shall pass around radius "R" without damage.
3. KEMET nominal thicknesses are: 0402 = 0.6mm and all others 0.95mm minimum.
Sketch C:
Component Rotation - Top View
Maximum
Sketch B:
R
(Min.)
Max. Component
Rotation - Front
component rotation.
Sketch A:
Bending Radius
See Note 2
Table 1
20°
Cross Sectional View
Typical
component
center line
20°
96
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
CERAMIC CHIP CAPACITORS
Packaging Information
Table 2 – Capacitance Values Available
In Bulk Cassette Packaging
Bulk Cassette Packaging (Ceramic Chips only)
(Meets Dimensional Requirements IEC-286-6 and EIAJ 7201)
Min. Max.
Cap Cap
Size Dielectric Voltage Value Value
Case
53.3*
Unit: mm
* Reference
0402
0603
0805
All
All
All
All
All
All
All
All
0.1
10*
1.5 ±
2.0 ±
3.0 ±
0
0
0.1
0.2
0
C0G
200
100
50
109 181
109 331
109 102
X7R
Y5V
200
100
50
221 392
221 103
221 273
221 104
221 104
25
16
25
16
104 224
104 224
5.0*
110 ± 0.7
Table 1 – Capacitor Dimensions for Bulk
Cassette Packaging – Millimeters
Metric EIA
Size Size
Code Code
Minimum
Length
L
Width
W
Thickness Bandwidth Separation
Number of
Pcs/Cassette
T
B
S
1005 0402 1.0 ± 0.05 0.5 ± 0.05
1608 0603 1.6 ± 0.07 0.8 ± 0.07
0.5 ± .05
0.8 ± .07
0.2 to 0.4
0.2 to 0.5
0.5 to 0.75
0.3
50,000
15,000
10,000
0.7
2012 0805 2.0 ± 0.10 1.25 ± 0.10 0.6 ± .10
0.75
Terminations: KEMET nickel barrier layer with a tin overplate.
CAPACITOR MARKING TABLE
(Marking Optional - Not Available
for 0402 Size or Y5V Dielectric)
Capacitance (pF) For Various Numeral Identifiers
Numeral
Laser marking is available as an extra-cost option for
most KEMET ceramic chips. Such marking is two
sided, and includes a K to identify KEMET, followed by
two characters (per EIA-198 - see table below) to
identify the capacitance value. Note that marking is
not available for size 0402 nor for any Y5V chip. In
addition, the 0603 marking option is limited to the K
only.
Alpha
9
0
1
2
3
4
5
6
7
Character
A
B
C
D
E
F
G
H
J
0.10 1.0 10 100 1000 10,000 100,000 1,000,000 10,000,000
0.11 1.1 11 110 1100 11,000 110,000 1,100,000 11,000,000
0.12 1.2 12 120 1200 12,000 120,000 1,200,000 12,000,000
0.13 1.3 13 130 1300 13,000 130,000 1,300,000 13,000,000
0.15 1.5 15 150 1500 15,000 150,000 1,500,000 15,000,000
0.16 1.6 16 160 1600 16,000 160,000 1,600,000 16,000,000
0.18 1.8 18 180 1800 18,000 180,000 1,800,000 18,000,000
0.20 2.0 20 200 2000 20,000 200,000 2,000,000 20,000,000
0.22 2.2 22 220 2200 22,000 220,000 2,200,000 22,000,000
0.24 2.4 24 240 2400 24,000 240,000 2,400,000 24,000,000
0.27 2.7 27 270 2700 27,000 270,000 2,700,000 27,000,000
0.30 3.0 30 300 3000 30,000 300,000 3,000,000 30,000,000
0.33 3.3 33 330 3300 33,000 330,000 3,300,000 33,000,000
0.36 3.6 36 360 3600 36,000 360,000 3,600,000 36,000,000
0.39 3.9 39 390 3900 39,000 390,000 3,900,000 39,000,000
0.43 4.3 43 430 4300 43,000 430,000 4,300,000 43,000,000
0.47 4.7 47 470 4700 47,000 470,000 4,700,000 47,000,000
0.51 5.1 51 510 5100 51,000 510,000 5,100,000 51,000,000
0.56 5.6 56 560 5600 56,000 560,000 5,600,000 56,000,000
0.62 6.2 62 620 6200 62,000 620,000 6,200,000 62,000,000
0.68 6.8 68 680 6800 68,000 680,000 6,800,000 68,000,000
0.75 7.5 75 750 7500 75,000 750,000 7,500,000 75,000,000
0.82 8.2 82 820 8200 82,000 820,000 8,200,000 82,000,000
0.91 9.1 91 910 9100 91,000 910,000 9,100,000 91,000,000
0.25 2.5 25 250 2500 25,000 250,000 2,500,000 25,000,000
0.35 3.5 35 350 3500 35,000 350,000 3,500,000 35,000,000
0.40 4.0 40 400 4000 40,000 400,000 4,000,000 40,000,000
0.45 4.5 45 450 4500 45,000 450,000 4,500,000 45,000,000
0.50 5.0 50 500 5000 50,000 500,000 5,000,000 50,000,000
0.60 6.0 60 600 6000 60,000 600,000 6,000,000 60,000,000
0.70 7.0 70 700 7000 70,000 700,000 7,000,000 70,000,000
0.80 8.0 80 800 8000 80,000 800,000 8,000,000 80,000,000
0.90 9.0 90 900 9000 90,000 900,000 9,000,000 90,000,000
K
L
M
N
P
Q
R
S
T
U
V
W
X
Y
Z
a
b
d
e
f
m
n
t
Example shown is 1,000 pF capacitor.
KA3
y
97
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
相关型号:
C1632C103M4RAC7800
Array/Network Capacitor, 16V, X7R, 0.01uF, Surface Mount, CHIP-8, CHIP, ROHS COMPLIANT
KEMET
C1632C103M4RACTU
Array/Network Capacitor, 16V, X7R, 0.01uF, Surface Mount, CHIP-8, CHIP, ROHS COMPLIANT
KEMET
C1632C104K4RAC
Array/Network Capacitor, 16V, X7R, 0.1uF, Surface Mount, CHIP-8, CHIP, ROHS COMPLIANT
KEMET
C1632C104K4RAC7210
Array/Network Capacitor, 16V, X7R, 0.1uF, Surface Mount, CHIP-8, CHIP, ROHS COMPLIANT
KEMET
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