C1812C106K4R2CTU [KEMET]
Surface Mount Multilayer Ceramic Chip Capacitors; 表面贴装多层陶瓷片式电容器型号: | C1812C106K4R2CTU |
厂家: | KEMET CORPORATION |
描述: | Surface Mount Multilayer Ceramic Chip Capacitors |
文件: | 总16页 (文件大小:2335K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Surface Mount Multilayer Ceramic Chip Capacitors
KPS Series – Commercial Grade (X7R Dielectric)
Overview
A two chip stack offers up to double the capacitance in the same
or smaller design footprint when compared to traditional surface
mount MLCC devices.
Providing up to 10mm of board flex capability, KPS Series
capacitors are environmentally friendly and in compliance with
RoHS legislation. Available in X7R dielectric, these devices are
capable of Pb-free reflow profiles and provide lower ESR, ESL
and higher ripple current capability when compared to other
dielectric solutions.
KEMET’s KPS Series (KEMET Power Solutions) utilizes
proprietary lead-frame technology to vertically stack one or two
multilayer ceramic chip capacitors (MLCCs) into a single compact
surface mount package. The attached lead-frame mechanically
isolates the capacitor/s from the printed circuit board, therefore
offering advanced mechanical and thermal stress performance.
Isolation also addresses concerns for audible, microphonic noise
that may occur when a bias voltage is applied.
Benefits
• Higher capacitance in the same footprint
• Potential board space savings.
Applications
• Industrial, Automotive, Military, Telecom
• Smoothing circuits
• Advanced protection against thermal and mechanical stress
• Provides up to 10mm of board flex capability
• Reduces audible, microphonic noise
• Extremely low ESR and ESL
• DC-to-DC converters
• Power supplies (input/output filters)
• Noise Reduction (piezoelectric / mechanical)
• Circuits with a direct battery or power source connection.
• Critical and safety relevant circuits without (integrated) current
limitation.
• Pb-Free and RoHS compliant
• Capable of Pb-Free reflow profiles
• Non-polar device, minimizing installation concerns
• Automotive grade (AEC-Q200) under development.
• Any application that is subject to high levels of board flexure or
temperature cycling
Ordering Information
C
2220
C
106
M
5
R
2
C
TU
Case Size Specification/ Capacitance Capacitance
End
Metallization2
Packaging/Grade
(C-Spec)3
Ceramic
Voltage Dielectric
Failure Rate/Design
(L" x W")
Series
Code (pF)
Tolerance1
1210
1812
2220
C = Standard
2 Sig. Digits
+ Number of
Zeros
K = ±10%
M = ±20% 4 = 16V
3 = 25V
8 = 10V
R = X7R 1 = KPS Single Chip Stack
2 = KPS Double Chip Stack
C = 100%
Matte Sn
TU = 7" Reel
Unmarked
7289 = 13" Reel
Unmarked
5 = 50V
1 = 100V
A = 250V
1 Double chip stacks ("2" in the 13th character position of the ordering code) are only available in M (±20%) capacitance tolerance. Single chip stacks ("1" in
the 13th character position of the ordering code) are available in K (±10%) or M (±20%) tolerances.
2 Additional termination options may be available. Contact KEMET for details.
3 Additional reeling or packaging options may be available. Contact KEMET for details.
One WORLD
One Brand
One Strategy
One Focus
One Team
One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1020-4 • 6/22/2010
1
Surface Mount Multilayer Ceramic Chip Capacitors –KPS Series – Commercial Grade (X7R Dielectric)
Top View
Single or Double
Profile View
Dimensions – Millimeters (Inches)
Double Chip Stack
Single Chip Stack
Chip Stack
EIA
Size
Code
1210
1812
Metric
Size
Code
3225
Chip
Stack
Mounting
Technique
L Length
W Width
T Thickness
LW Lead Width
3.50 (.138) ± 0.30 (.012) 2.60 (.102) ± 0.30 (.012) 3.35 (.132) ± 0.10 (.004) 0.80 (.032) ± 0.15 (.006)
5.00 (.197) ± 0.50 (.020) 3.50 (.138) ± 0.50 (.020) 2.65 (.104) ± 0.35 (.014) 1.10 (.043) ± 0.30 (.012)
6.00 (.236) ± 0.50 (.020) 5.00 (.197) ± 0.50 (.020) 3.50 (.138) ± 0.30 (.012) 1.60 (.063) ± 0.30 (.012)
3.50 (.138) ± 0.30 (.012) 2.60 (.102) ± 0.30 (.012) 6.15 (.242) ± 0.15 (.006) 0.80 (.031) ± 0.15 (.006)
5.00 (.197) ± 0.50 (.020) 3.50 (.138) ± 0.50 (.020) 5.00 (.197) ± 0.50 (.020) 1.10 (.043) ± 0.30 (.012)
6.00 (.236) ± 0.50 (.020) 5.00 (.197) ± 0.50 (.020) 5.00 (.197) ± 0.50 (.020) 1.60 (.063) ± 0.30 (.012)
Single
4532
2220
1210
1812
5650
Solder Reflow
3225
Double
4532
2220
5650
Outline Drawing
Ref
Name
Material
A
B
C
D
E
F
Leadframe
Phosphor Bronze - Alloy 510
Leadframe Attach
High Temp Solder
Cu
Ni
Sn
Ni
Termination
Electrode
Dielectric
G
BaTiO
3
Qualification/Certification
Commercial grade products meet or exceed the performance and reliability standards outlined in Table 4 - Performance and Reliability
of this specification.
Environmental Compliance
RoHS PRC ( Peoples Republic of China) compliant
Electrical Parameters/Characteristics
Operating Temperature Range:
Capacitance Change with Reference to +25°C and 0 Vdc Applied (TCC):
Aging Rate (Max % Cap Loss/Decade Hour):
-55°C to +125°C
±15%
3.5%
250% of rated voltage
(5 ± 1 seconds and charge/discharge not exceeding 50mA)
Dielectric Withstanding Voltage:
Dissipation Factor (DF) Maximum Limits @ 25ºC:
Insulation Resistance (IR) Limit @ 25°C:
5% (10V), 3.5% (16V & 25V) and 2.5% (50V to 200V)
See Insulation Resistance Limit Table page 3
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Capacitance and Dissipation Factor (DF) measured under the following conditions:
1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance ≤10µF
120Hz ± 10Hz and 0.5 ± 0.1 Vrms if capacitance >10µF
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1020-4 • 6/22/2010
2
Surface Mount Multilayer Ceramic Chip Capacitors –KPS Series – Commercial Grade (X7R Dielectric)
Insulation Resistance Limit Table
1000 megohm microfarads
500 megohm microfarads
EIA Case Size
or 100GΩ
< 0.39µF
< 2.2µF
or 10GΩ
≥ 0.39µF
≥ 2.2µF
≥ 10µF
1210
1812
2220
< 10µF
Electrical Characteristics
Z and ESR C1210C475M5R1C
Z and ESR C2220C225MAR2C
103
102
101
100
10-1
10-2
10-3
104
103
102
101
100
10-1
10-2
10-3
ESR
ESR
Z
Z
100
102
104
106
108
1010
100
102
104
106
108
1010
Frequency (Hz)
Frequency (Hz)
Z and ESR C2220C476M3R2C
104
ESR
Z
102
100
10-2
10-4
10-6
100
102
104
106
108
1010
Frequency (Hz)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1020-4 • 6/22/2010
3
Surface Mount Multilayer Ceramic Chip Capacitors –KPS Series – Commercial Grade (X7R Dielectric)
Electrical Characteristics con't
Impedance - 1812, .10µF, 50V X7R
ESR - 1812, .10µF, 50V X7R
ESR - 1210, .22µF, 50V X7R
Impedance - 1210, .22µF, 50V X7R
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1020-4 • 6/22/2010
4
Surface Mount Multilayer Ceramic Chip Capacitors –KPS Series – Commercial Grade (X7R Dielectric)
Electrical Characteristics con't
Microphonics - 2220, 22µF, 50V, X7R
Microphonics - 1210, 4.7µF, 50V, X7R
Microphonics - 2220, 47µF, 25V, X7R
Microphonics - 1210, 22µF, 25V, X7R
Competitive Comparision
Microphonics - 1210, 4.7µF, 50V, X7R
Ripple Current (Arms) 2220, 22µF, 50V
Note: Refer to Table 4 for test method.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1020-4 • 6/22/2010
5
Surface Mount Multilayer Ceramic Chip Capacitors –KPS Series – Commercial Grade (X7R Dielectric)
Electrical Characteristics con't
Board Flex vs. Termination Type
Board Flex vs. Termination Type
Weibull
Weibull
X7R 1210 10 uF – (22uF KPS Stacked)
X7R 2220 22uF 25V – (47uF KPS Stacked)
2
2
90
Standard Termination
KPS – 2 Chip Stack
Standard Termination
KPS – 2 Chip Stack
90
80
70
60
50
80
70
60
50
40
40
30
30
20
10
20
10
0
5
0
0
0
0
0
0
0
0
0
.
0
.
.
.
.
.
.
.
.
.
.
1
1
2
3
4
5
6
7
8
9
1
Board Flexture (mm)
Board Flexture (mm)
Board Flexure to 10mm
Board Flexure to 10mm
Weibull
X7R 1812 47uF 16V
2
Weibull
X7R 1210 4.7 uF 50V
2
90
90
80
70
60
50
40
80
70
60
50
40
30
30
20
20
10
10
1
10
Board Flexture (mm)
Board Flexture (mm)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1020-4 • 6/22/2010
6
Surface Mount Multilayer Ceramic Chip Capacitors –KPS Series – Commercial Grade (X7R Dielectric)
Table 1 – (1210 - 2220 Case Sizes)
Series
Voltage Code
Voltage
C1210
C1812
5
C2220
Cap
Code
8
4
3
5
1
A
4
3
1
A
4
3
5
1
A
Cap pF
10
16
25
50
100
250
16
25
50
100
250
16
25
50
100
250
Cap Tolerance
Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions
Single Chip Stack
0.10 uF
0.22 uF
0.47 uF
1.0 uF
2.2 uF
3.3 uF
4.7 uF
10 uF
15 uF
22 uF
33 uF
47 uF
104
224
474
105
225
335
475
106
156
226
336
476
107
K
M
M
M
M
M
M
M
M
M
M
M
M
M
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
GP
GP
GP
GP
GP
GP
GP
GP
GP
GP
GP
GP
GP
GP
GP
GP
GP
GP
GP
GP
GP
GP
GP
GP
GP
GP
GP
GP
GP
GP
JS
JS
JS
JS
JS
JS
JS
JS
JS
JS
JS
JS
JS
JS
JS
JS
JS
JS
JS
JS
JS
JS
JS
JS
JS
JS
JS
JS
JS
JS
JS
JS
JS
JS
JS
JS
JS
JS
K
K
K
K
K
K
K
K
K
K
K
K
100 uF
Double Chip Stack
0.10 uF
0.22 uF
0.47 uF
1.0 uF
2.2 uF
3.3 uF
4.7 uF
10 uF
22 uF
33 uF
47 uF
100 uF
220 uF
104
224
474
105
225
335
475
106
226
336
476
107
227
M
M
M
M
M
M
M
M
M
M
M
M
M
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
GR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
FW
Voltage
10
8
16
4
25
3
50
5
100
1
250
A
16
4
25
3
50
5
100
1
250
A
16
4
25
3
50
5
100
1
250
A
Cap
Code
Voltage Code
Cap pF
Series
C1210
C1812
C2220
C
2220
C
M
5
R
2
C
TU
106
Case Size Specification/ Capacitance Capacitance
(L" x W")
End
Metallization2
Packaging/Grade
(C-Spec)3
Ceramic
Voltage Dielectric
Failure Rate/Design
Series
Code (pF)
Tolerance1
1210
1812
2220
C = Standard
2 Sig. Digits
+ Number of
K = ±10%
M = ±20% 4 = 16V
8 = 10V R = X7R 1 = KPS Single Chip Stack
C = 100%
Matte Sn
TU = 7” Reel
Unmarked
7289 = 13” Reel
Unmarked
2 = KPS Double Chip Stack
Zeros
3 = 25V
5 = 50V
1 = 100V
A = 250V
ackage Quniy Based on nshed hp Thickness pecificaions
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1020-4 • 6/22/2010
7
Surface Mount Multilayer Ceramic Chip Capacitors –KPS Series – Commercial Grade (X7R Dielectric)
Soldering Process
Recommended Soldering Technique:
• Mounting technique is limited to solder reflow only.
Recommended Soldering Profile
• KEMET recommends following the guidelines outlined in IPC/JEDEC J-STD-020D.1
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC-7351
EIA Size
Code
Metric Size
Code
Median (Nominal) Land
Protrusion (mm)
X
Y
C
1210
1812
2220
3225
4532
5650
1.75
2.87
4.78
1.14
1.35
2.08
3.00
4.39
5.38
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress
Reference
Test or Inspection Method
Heat Generation
∆T : 20ºC max.
Reflow solder the capacitor onto a PC board and apply voltage with 10kHz~1Mhz sine curve.
(Ripple voltage must be < rated voltage)
Ripple Current
Terminal Strength
Board Flex
JIS-C-6429
Appendix 1, Note:Force of 1.8kg for 60 seconds.
Appendix 2, Note:2mm (min) for all except 3mm for C0G.
Magnification 50X. Conditions:
JIS-C-6429
a) Method B, 4 hrs @ 155°C, dry heat @ 235°C
b) Method B @ 215°C category 3
Solderability
J-STD-002
c) Method D, category 3 @ 260°C
Temperature Cycling
Biased Humidity
JESD22 Method JA-104
MIL-STD-202 Method 103
1000 Cycles (-55°C to +125°C), Measurement at 24 hrs. +/- 2 hrs after test conclusion.
Load Humidity: 1000 hours 85°C/85%RH and Rated Voltage.Add 100K ohm resistor. Measurement
at 24 hrs. +/- 2 hrs after test conclusion.
Low Volt Humidity:1000 hours 85C°/85%RH and 1.5V.Add 100K ohm resistor.
Measurement at 24 hrs. +/- 2 hrs after test conclusion.
t = 24 hours/cycle.Steps 7a & 7b not required.Unpowered.
Measurement at 24 hrs. +/- 2 hrs after test conclusion.
-55°C/+125°C.Note: Number of cycles required-300, Maximum transfer time-20 seconds, Dwell
Moisture Resistance
Thermal Shock
MIL-STD-202 Method 106
MIL-STD-202 Method 107
time-15 minutes.Air-Air.
High Temperature Life
Storage Life
MIL-STD-202 Method 108
MIL-STD-202 Method 108
MIL-STD-202 Method 213
MIL-STD-202 Method 215
1000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 1.5X rated voltage applied.
150°C, 0VDC, for 1000 Hours.
Mechanical Shock
Resistance to Solvents
Figure 1 of Method 213, Condition F.
Add Aqueous wash chemical - OKEM Clean or equivalent.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1020-4 • 6/22/2010
8
Surface Mount Multilayer Ceramic Chip Capacitors –KPS Series – Commercial Grade (X7R Dielectric)
Tape & Reel Packaging Information
KEMET offers Multilayer Ceramic Chip Capacitors packaged in
8mm, 12mm and 16mm tape on 7" and 13" reels in accordance
with EIA standard 481. This packaging system is compatible with
all tape fed automatic pick and place systems. See Table 2 for
details on reeling quantities for commercial chips.
Bar Code Label
Anti-Static Reel
®
Embossed Plastic* or
Punched Paper Carrier.
Chip and KPS Orientation in Pocket
(except 1825 Commercial, and 1825 & 2225 Military)
KEMET
Sprocket Holes
Embossment or Punched Cavity
8mm, 12mm
or 16mm Carrier Tape
Anti-Static Cover Tape
(.10mm (.004") Max Thickness)
178mm (7.00")
or
330mm (13.00")
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
Table 5 - Carrier Tape Configuration (mm)
EIA Case Size
Tape size (W)*
Pitch (P1)*
01005 - 0402
0603 - 1210
8
8
2
4
1805 - 1808
12
12
12
16
8
4
≥ 1812
8
KPS 1210
8
KPS 1812 & 2220
Array 0508 & 0612
12
4
*Refer to Figure 1 for W and P1 carrier tape reference locations.
*Refer to Table 4 for tolerance specifications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1020-4 • 6/22/2010
9
Surface Mount Multilayer Ceramic Chip Capacitors –KPS Series – Commercial Grade (X7R Dielectric)
Figure 1: Embossed (Plastic) Carrier Tape Dimensions
T
T
P2
[10 pitches cumulative
tolerance on tape ±0.2 mm]
2
E
1
Po
ØDo
Ao
F
Ko
W
E
2
B
1
Bo
S
1
P
1
T
1
Embossment
For cavity size,
see Note 1 Table 6
Center Lines of Cavity
ØD
1
Cover Tape
is for tape feeder reference only,
including draft concentric about B
B
1
o
.
User Direction of Unreeling
Table 6 - Embossed (Plastic) Carrier Tape Dimensions
(Metric will govern)
Constant Dimensions — Millimeters (Inches)
D1 Min.
Note 1
1.0
R Ref.
Note 2
25.0
S1 Min.
Note 3
Tape Size
8mm
D0
E1
P0
P2
T Max. T1 Max.
(0.039)
(0.984)
1.5 +0.10/-0.0
(0.059 +0.004/-0.0)
1.75 ± 0.10
4.0 ± 0.10
2.0 ± 0.05
0.600
(0.024)
0.600
(0.024) (0.004)
0.100
12mm
(0.069 ± 0.004) (0.157 ± 0.004) (0.079 ± 0.002)
1.5
30
(0.059)
(1.181)
16mm
Variable Dimensions — Millimeters (Inches)
B1 Max.
Note 4
4.35
(0.171)
8.2
(0.323)
12.1
(0.476)
Tape Size
8mm
Pitch
E2 Min.
F
P1
T2 Max
W Max
A0,B0 & K0
Note 5
6.25
(0.246)
10.25
(0.404)
14.25
3.5 ± 0.05
4.0 ± 0.10
2.5
(0.098)
4.6
(0.181)
4.6
8.3
(0.327)
12.3
(0.484)
16.3
Single (4mm)
(0.138 ± 0.002) (0.157 ± 0.004)
5.5 ± 0.05 8.0 ± 0.10
(0.217 ± 0.002) (0.315 ± 0.004)
5.5 ± 0.05 8.0 ± 0.10
(0.217 ± 0.002) (0.315 ± 0.004)
Single (4mm) &
Double (8mm)
12mm
16mm
Triple (12mm)
(0.561)
(0.181)
(0.642)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and
hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 5).
3. If S1<1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Document 481 paragraph 4.3 (b)).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12mm tapes and 10° maximum for 16mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8mm and 12mm wide tape and to 1.0mm maximum for 16mm tape (see Figure 4)
(e) For KPS Series product A0 and B0 are measured on a plane 0.3mm above the bottom of the pocket.
(f) see Addendum in EIA Document 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1020-4 • 6/22/2010
10
Surface Mount Multilayer Ceramic Chip Capacitors –KPS Series – Commercial Grade (X7R Dielectric)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
T
P2
[10 pitches cumulative
tolerance on tape ±0.2 mm]
E
1
Po
ØDo
0
A
F
W
2
E
0
B
Bottom Cover Tape
P
1
G
Cavity Size,
See
1
T
1
T
Top Cover Tape
Center Lines of Cavity
Note 1, Table 7
Bottom Cover Tape
User Direction of Unreeling
Table 7 - Punched (Paper) Carrier Tape Dimensions
(Metric will govern)
Constant Dimensions — Millimeters (Inches)
R Ref.
Note 2
25
Tape Size
8mm
D0
E1
P0
P2
T1Max
G Min
1.5 +0.10-0.0
(0.059 +0.004, -0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
0.10
(.004) Max.
0.75
(.030)
(.984)
Variable Dimensions — Millimeters (Inches)
Tape Size
8mm
Pitch
E2 Min
F
P1
T Max
W Max
A0 B0
2.0 ± 0.05
(0.079 ± 0.002)
4.0 ± 0.10
8.3
(0.327)
8.3
Half (2mm)
6.25
(0.246)
3.5 ± 0.05
(0.138 ± 0.002)
1.1
(0.098)
Note 5
8mm
Single (4mm)
(0.157 ± 0.004)
(0.327)
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).
e) see Addendum in EIA Document 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 5).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1020-4 • 6/22/2010
11
Surface Mount Multilayer Ceramic Chip Capacitors –KPS Series – Commercial Grade (X7R Dielectric)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg Minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
Peel Strength
8mm
0.1 Newton to 1.0 Newton (10g to 100g)
0.1 Newton to 1.3 Newton (10g to 130g)
12mm & 16mm
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the
carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA-556 and EIA-624.
Figure 3 – Maximum component rotation
°
T
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Typical Pocket Centerline
Tape
Maximum
°
°
T
s
Width (mm) Rotation (
)
8,12
16-200
20
10
Bo
Tape
Maximum
°
S
Width (mm) Rotation (
)
8,12
16-56
72-200
20
10
5
Typical Component Centerline
Ao
Figure 4 – Maximum lateral movement
8mm & 12mm Tape
16mm Tape
0.5 mm maximum
1.0 mm maximum
1.0 mm maximum
0.5 mm maximum
Figure 5 – Bending radius
Embossed
Carrier
Punched
Carrier
R
Bending
Radius
R
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1020-4 • 6/22/2010
12
Surface Mount Multilayer Ceramic Chip Capacitors –KPS Series – Commercial Grade (X7R Dielectric)
Figure 6 – Reel Dimensions
Full Radius,
W3 (Includes
flange distortion
at outer edge)
Access Hole at
Slot Location
(Ø 40 mm min.)
See Note
W
2 (Measured at hub)
D
(See Note)
A
N
C
(Arbor hole
W
1 (Measured at hub)
diameter)
If present,
tape slot in core
for tape start:
2.5 mm min. width x
10.0 mm min. depth
B
(see Note)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
Table 8 – Reel Dimensions
(Metric Dimensions Will Govern)
Constant Dimensions — Millimeters (Inches)
Tape Size
8mm
A
B Min
C
D Min
178 ± 0.20
(7.008 ± 0.008)
or
330 ± 0.20
(13.000 ± 0.008)
1.5
(0.059)
13.0 +0.5/-0.2
(0.521 +0.02/-0.008)
20.2
(0.795)
12mm
16mm
Variable Dimensions — Millimeters (Inches)
Tape Size
8mm
N Min
W1
W2 Max
W3
8.4 +1.5/-0.0
(0.331 +0.059/-0.0)
12.4 +2.0/-0.0
(0.488 +0.078/-0.0)
16.4 +2.0/-0.0
14.4
(0.567)
18.4
(0.724)
22.4
50
(1.969)
Shall Accommodate Tape
Width Without Interference
12mm
16mm
(0.646 +0.078/-0.0)
(0.882)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1020-4 • 6/22/2010
13
Surface Mount Multilayer Ceramic Chip Capacitors –KPS Series – Commercial Grade (X7R Dielectric)
Figure 7 – Tape leader & trailer dimensions
Embossed Carrier
Carrier Tape
Punched Carrier
8 mm & 12 mm only
Round Sprocket Holes
START
END
Top Cover Tape
Elongated Sprocket Holes
(32 mm tape and wider)
100 mm Min.
Leader
Trailer
160 mm minimum,
Components
400 mm Minimum,
Top Cover Tape
Figure 8 – Maximum camber
Elongated sprocket holes
(32 mm & wider tapes)
Carrier Tape
Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1020-4 • 6/22/2010
14
Surface Mount Multilayer Ceramic Chip Capacitors –KPS Series – Commercial Grade (X7R Dielectric)
Other KEMET Resources
Tools
Resource
Location
Configure A Part: CapEdge
SPICE & FIT Software
http://capacitoredge.kemet.com
http://www.kemet.com/spice
http://www.kemet.com/keask
Search Our FAQs: KnowledgeEdge
Product Information
Resource
Products
Location
http://www.kemet.com/products
Technical Resources (Including Soldering
Techniques)
http://www.kemet.com/technicalpapers
RoHS Statement
http://www.kemet.com/rohs
Quality Documents
http://www.kemet.com/qualitydocuments
Product Request
Resource
Location
Sample Request
Engineering Kit Request
http://www.kemet.com/sample
http://www.kemet.com/kits
Contact
Resource
Website
Location
www.kemet.com
Contact Us
Investor Relations
Call Us
http://www.kemet.com/contact
http://www.kemet.com/ir
1-877-MyKEMET
Twitter
http://twitter.com/kemetcapacitors
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1020-4 • 6/22/2010
15
Surface Mount Multilayer Ceramic Chip Capacitors –KPS Series – Commercial Grade (X7R Dielectric)
Zac Paris Rive Gauche
118-122 avenue de France
75013 Paris, France
Tel: 33-1-4646-1009
Fax: 33-1-4646-1599
KEMET Corporation World
Asia
Northeast Asia
Headquarters
30 Canton Road, Room 1512
Silvercord Tower II
Tsimshatshui, Kowloon, Hong Kong
Tel: 852-2305-1168
P.O. Box 5928
Greenville, SC 29606
www.kemet.com
Tel: 864-963-6300
Fax: 864-963-6521
Via San Lorenzo 19
Sasso Marconi, BO
40037 Italy
Tel: 39-051-939111
Fax: 39-051-840684
Fax: 852-2759-0345
Room 1411, 14/F New China Insurance Edifice
Mintian Road, CBD Futian District
Shenzhen 518001, China
Tel: 1-867-55-25181306
Fax: 1-867-55-25181307
North America
Corporate Offices
101 NE Third Avenue
Tower 101, Suite 1700
Fort Lauderdale, FL 33301
Tel: 954-766-2800
Via Milanofiori Palazzo
A/2 Scala 2
Milano 20090 Italy
Tel: 39-02-57518176
Fax: 39-02-57512093
Floor 17, Tower B, Ping An IFC
No.1-3 Xin Yuan South Road
Chao Yang District
Fax: 954-766-2805
Beijing 100027, China
Tel: 86-10-5829-1711
Fax: 86-10-5829-1963
Southeast
Central Europe
Hermann-Koehl-Str. 2
Landsberg am Lech
86899 Germany
Tel: 49-8191-3350800
Fax: 49-8191-3350990
801 International Parkway, Suite 500
Lake Mary, FL 32746
Tel: 407-855-8886
Room 2602, Grand Gateway Tower 1
No.1 Hong Qiao Road
Shanghai 200030, China
Tel: 86-21-6447-0707
Northeast
340-X Fordham Road
Wilmington, MA 01887
Phone: 978-658-1663
Fax: 978-658-1790
Ruhrallee 9
Dortmund
44139 Germany
Tel: 49-2307-3619672
Fax: 49-2307-961527
Fax: 86-21-6447-0070
Room 305, Floor 3, #142
Sec. 4, Chung Hsiao East Road
Taipei 106, Taiwan ROC
Tel: 886-2-27528585
Central
1900 North Roselle Road, Suite 405
Schaumburg, IL 60195
Tel: 847-882-3590
Northern Europe
Unit 1, Ducketts Wharf
South Street
Bishops Stortford
Hertfordshire CM23 3AL
United Kingdom
Fax: 886-2-27213129
Fax: 847-882-3046
Southeast Asia
73 Bukit Timah Road
#05-01 Rex House
229832 Singapore
Tel: 65-6586-1900
Fax: 65-6586-1901
West
1551 McCarthy Boulevard, Suite 117
Milpitas, CA 95035
Tel: 408-433-9946
Fax: 408-433-9946
Phone: 44-1279-757201
Fax: 44-1279-465237
20 Cumberland Drive
Granby Industrial Estate
Weymouth, Dorset DT4 9TE
United Kingdom
Tel: 44-1305-830747
Fax: 44-1305-760670
1-5-20 Krystal Point 2
Lebuh Bukit Kecil 6
11900 Bayan Baru
Penang, Malaysia
Tel: 6- 04-6430200
Fax: 6 -04-6444220
Mexico
Tezozomoc No. 47
Col. Ciudad del Sol
Zapopan, Jalisco C.P. 45050
Mexico
Tel: 52-33-3123-2141
Fax: 52-33-3123-2144
Thörnblads Väg 6
Färjestaden 386 90
Sweden
Tel: 46-485-563934
Fax: 46-485-563938
Office No. 605, 6th Floor
Barton Centre M.G. Road
Bangalore 560 001 India
Tel: 91-80-653-76817
Europe
Southern Europe
15bis chemin des Mines
1202 Geneva
Switzerland
Tel: 41-22-715-0100
Fax: 41-22-715-0170
Fax: 91-80-2532-0160
Stella Business Park
Lars Sonckin kaari 16
Espoo 02600, Finland
Tel: 358-9-5406-5000
Fax: 358-9-5406-5010
Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not
assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of
KEMET Electronics Corporation.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1020-4 • 6/22/2010
16
相关型号:
©2020 ICPDF网 联系我们和版权申明