C1812F105K5RACTU [KEMET]
Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, X7R, 15% TC, 1uF, Surface Mount, 1812, CHIP, ROHS COMPLIANT;型号: | C1812F105K5RACTU |
厂家: | KEMET CORPORATION |
描述: | Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, X7R, 15% TC, 1uF, Surface Mount, 1812, CHIP, ROHS COMPLIANT 电容器 |
文件: | 总25页 (文件大小:1816K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric,
16 – 200 VDC (Commercial & Automotive Grade)
Overview
KEMET’s Ceramic Open Mode capacitor in X7R dielectric
is designed to significantly minimize the probability of a
low IR or short circuit condition when forced to failure in
a board stress flex situation, thus reducing the potential
for catastrophic failure. The Open Mode capacitor may
experience a drop in capacitance; however, a short is
unlikely because a crack will not typically propagate
across counter electrodes within the device’s “active area.”
Since there will not be any current leakage associated
with a typical Open Mode flex crack, there is no localized
heating and therefore little chance for a catastrophic and
potentially costly failure event.
circuit failures. Although flexible termination technology
does not eliminate the potential for mechanical damage that
may propagate during extreme environmental and handling
conditions, it does provide superior flex performance over
standard termination systems. When combined with flexible
termination technology these devices offer the ultimate level
of protection against a low IR or short circuit condition. Open
Mode devices compliment KEMET's Floating Electrode
(FE-CAP) and Floating Electrode with Flexible Termination
(FF-CAP) product lines by providing a fail-safe design
optimized for mid to high range capacitance values. These
devices exhibit a predictable change in capacitance with
respect to time and voltage and boast a minimal change
in capacitance with reference to ambient temperature.
Capacitance change is limited to ±15% from −55°C to +125°C.
Driven by the demand for a more robust and reliable
component, the Open Mode capacitor was designed for
critical applications where higher operating temperatures
and mechanical stress are a concern. These capacitors
are widely used in automotive circuits as well as power
supplies (input and output filters) and general electronic
applications.
Concerned with flex cracks resulting from excessive
tensile and shear stresses produced during board flexure
and thermal cycling? These devices are available with
KEMET's Flexible termination technology which inhibits the
transfer of board stress to the rigid ceramic body, therefore
mitigating flex cracks which can result in low IR or short
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Ordering Information
C
1210
J
685
K
3
R
A
C
TU
Rated
Voltage Dielectric
(VDC)
Failure
Rate/
Design
Case Size Specification/
Capacitance
Code (pF)
Capacitance
Tolerance
Packaging/Grade
Ceramic
Termination Finish1
(L" x W")
Series
(C-Spec)
0805
1206
1210
1812
F = Open Mode Two significant K = ±10%
J = Open Mode digits + number M = ±20%
4 = 16
R = X7R A = N/A C = 100% Matte Sn
L = SnPb
See "Packaging
C-Spec
Ordering
Options Table"
below
3 = 25
5 = 50
1 = 100
2 = 200
withꢀFlexible
of zeros
(5% Pb minimum)
Termination
1 Additional termination finish options may be available. Contact KEMET for details.
1 SnPb termination finish option is not available on automotive grade product.
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 11/29/2017
1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Packaging C-Spec Ordering Options Table
Packaging/Grade
Packaging Type
Ordering Code (C-Spec)
Commercial Grade1
Bulk Bag
Not Required (Blank)
TU
7" Reel/Unmarked
7411 (EIA 0603 and smaller case sizes)
7210 (EIA 0805 and larger case sizes)
13" Reel/Unmarked
7" Reel/Marked
TM
7040 (EIA 0603 and smaller case sizes)
7215 (EIA 0805 and larger case sizes)
13" Reel/Marked
7" Reel/Unmarked/2 mm pitch2
13" Reel/Unmarked/2 mm pitch2
7081
7082
Automotive Grade3
7" Reel
AUTO
AUTO7411 (EIA 0603 and smaller case sizes)
AUTO7210 (EIA 0805 and larger case sizes)
13" Reel/Unmarked
7" Reel/Unmarked/2 mm pitch2
13" Reel/Unmarked/2 mm pitch2
3190
3191
1 Default packaging is "Bulk Bag". An ordering code C-Spec is not required for "Bulk Bag" packaging.
1 The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors
that have not been laser marked.
2 The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".
3 Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L" x W") and thickness dimension. See "Chip Thickness/Tape & Reel
Packaging Quantities" and "Tape & Reel Packaging Information".
3 For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information".
3 All Automotive packaging C-Specs listed exclude the option to laser mark components. Please contact KEMET if you require a laser marked option. For
more information see "Capacitor Marking".
Benefits
• −55°C to +125°C operating temperature range
• Open Mode/fail open design
• Mid to high capacitance flex mitigation
• Non-polar device, minimizing installation concerns
• 100% pure matte tin-plated termination finish allowing for
excellent solderability
• Lead (Pb)-free, RoHS and REACH compliant
• EIA 0805, 1206, 1210, and 1812 case sizes
• DC voltage ratings of 16 V, 25 V, 50 V, 100 V, and 200 V
• Capacitance offerings ranging from 1,000 pF to 6.8 μF
• Available capacitance tolerances of ±5%, ±10%, and ±20%
• Commercial and Automotive (AEC–Q200) grades available
• SnPb termination finish option available upon request
(5% Pb minimum)
• Flexible termination option available upon request
Applications
Typical applications include input side filtering (power plane/bus), high current (battery line) and circuits that cannot
be fused to open when short circuits occur due to flex cracks. Markets include automotive applications that are directly
connected to the battery and/or involve conversion to a 42 V system and raw power input side filtering in power conversion.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 11/29/2017
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Automotive C-Spec Information
KEMET Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council.
Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive
Components. These products are supported by a Product Change Notification (PCN) and Production Part Approval Process
warrant (PPAP).
Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.”
This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade
component without the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review by a
KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET’s OEM Automotive customers and are
not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited
(see details below).
Product Change Notification (PCN)
The KEMET Product Change Notification system is used to communicate primarily the following types of changes:
• Product/process changes that affect product form, fit, function, and/or reliability
• Changes in manufacturing site
• Product obsolescence
Customer Notification due to:
KEMET Automotive
C-Spec
Days prior to
implementation
Process/Product change
Obsolescence*
KEMET assigned1
Yes (with approval and sign off)
Yes (without approval)
Yes
Yes
180 days minimum
90 days minimum
AUTO
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)
The purpose of the Production Part Approval Process is:
• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
• To provide the evidence that all customer engineering design record and specification requirements are properly
understood and fulfilled by the manufacturing organization.
• To demonstrate that the established manufacturing process has the potential to produce the part.
PPAP (Product Part Approval Process) Level
KEMET Automotive
C-Spec
1
●
○
2
3
●
○
4
5
KEMET assigned1
●
●
●
AUTO
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
● Part number specific PPAP available
○ Product family PPAP only
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 11/29/2017
3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Dimensions – Millimeters (Inches) – Standard Termination
L
W
T
B
S
S
EIA Size
Code
Metric Size
Code
L
W
Width
T
B
Mounting
Technique
Separation
Minimum
Length
Thickness
Bandwidth
2.00 (0.079)
±0.20 (0.008)
3.20 (0.126)
±0.20 (0.008)
3.20 (0.126)
±0.20 (0.008)
4.50 (0.177)
±0.30 (0.012)
1.25 (0.049)
±0.20 (0.008)
1.60 (0.063)
±0.20 (0.008)
2.50 (0.098)
±0.20 (0.008)
3.20 (0.126)
±0.30 (0.012)
0.50 (0.02)
±0.25 (0.010)
0.50 (0.02)
±0.25 (0.010)
0.50 (0.02)
±0.25 (0.010)
0.60 (0.024)
±0.35 (0.014)
0805
1206
1210
1812
2012
3216
3225
4532
0.75 (0.030)
N/A
Solder Wave or
Solder Reflow
See Table 2 for
Thickness
Solder Reflow
Only
Dimensions – Millimeters (Inches) – Flexible Termination
S
EIA Size
Code
Metric Size
Code
L
W
Width
T
B
Mounting
Technique
Separation
Minimum
Length
Thickness
Bandwidth
2.00 (0.079)
±0.30 (0.012)
3.30 (0.130)
±0.40 (0.016)
3.30 (0.130)
±0.40 (0.016)
4.50 (0.178)
±0.40 (0.016)
1.25 (0.049)
±0.30 (0.012)
1.60 (0.063)
±0.35 (0.013)
2.60 (0.102)
±0.30 (0.012)
3.20 (0.126)
±0.30 (0.012)
0.50 (0.02)
±0.25 (0.010)
0.60 (0.024)
±0.25 (0.010)
0.60 (0.024)
±0.25 (0.010)
0.70 (0.028)
±0.35 (0.014)
0805
1206
1210
1812
2012
3216
3225
4532
0.75 (0.030)
N/A
Solder Wave or
Solder Reflow
See Table 2 for
Thickness
Solder Reflow
Only
Qualification/Certification
Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are
referenced in Table 4, Performance and Reliability.
Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details
regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive
Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their
website at www.aecouncil.com.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 11/29/2017
4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Environmental Compliance
Lead (Pb)-free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option).
Electrical Parameters/Characteristics
Item
Parameters/Characteristics
Operating Temperature Range
−55°C to +125°C
±15%
Capacitance Change with Reference to
+25°C and 0 Vdc Applied (TCC)
1Aging Rate (Maximum % Capacitance Loss/Decade Hour)
2Dielectric Withstanding Voltage (DWV)
3.0%
250% of rated voltage
(5±1 seconds and charge/discharge not exceeding 50mA)
3Dissipation Factor (DF) Maximum Limit at 25°C
5%(6.3V & 10V), 3.5%(16V & 25V) and 2.5%(50V to 250V)
See Insulation Resistance Limit Table
(Rated voltage applied for 120±5 seconds at 25°C)
4Insulation Resistance (IR) Minimum Limit at 25°C
1 Regarding Aging Rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.
2 DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the
capacitor.
3 Capacitance and dissipation factor (DF) measured under the following conditions:
1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance ≤10µF
120Hz ± 10Hz and 0.5 ± 0.1 Vrms if capacitance >10µF
4 To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as
Automatic Level Control (ALC). The ALC feature should be switched to "ON".
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Rated DC
Voltage
Capacitance Dissipation Factor Capacitance
Insulation
Resistance
Dielectric
X7R
Value
(Maximum %)
Shift
> 25
16/25
< 16
3.0
5.0
7.5
10% of Initial
Limit
All
±20%
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 11/29/2017
5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Insulation Resistance Limit Table (X7R Dielectric)
1,000 Megohm
Microfarads or 100 GΩ
500 Megohm
Microfarads or 10 GΩ
EIA Case Size
0201
0402
0603
0805
1206
1210
1808
1812
1825
2220
2225
N/A
< 0.012 µF
< 0.047 µF
< 0.15 µF
< 0.47 µF
< 0.39 µF
ALL
ALL
≥ 0.012 µF
≥ 0.047 µF
≥ 0.15 µF
≥ 0.47 µF
≥ 0.39 µF
N/A
< 2.2 µF
ALL
≥ 2.2 µF
N/A
< 10 µF
ALL
≥ 10 µF
N/A
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 11/29/2017
6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Table 1A – Capacitance Range/Selection Waterfall - Standard Termination (0805 – 1812 Case Sizes)
Case Size/
Series
Voltage Code
C0805F/J
C1206F/J
C1210F/J
C1812F/J
Capacitance
Code
4
3
5
1
2
4
3
5
1
2
4
3
5
1
2
3
5
1
2
Capacitance
Rated Voltage (VDC) 16
25
50 100 200 16
25
50 100 200 16
25
50 100 200 25
50 100 200
Capacitance
Tolerance
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
1,000 pF
1,200 pF
1,500 pF
1,800 pF
2,200 pF
2,700 pF
3,300 pF
3,900 pF
4,700 pF
5,600 pF
6,800 pF
8,200 pF
10,000 pF
12,000 pF
15,000 pF
18,000 pF
22,000 pF
27,000 pF
33,000 pF
39,000 pF
47,000 pF
56,000 pF
68,000 pF
82,000 pF
0.10 µF
102
122
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
274
334
394
474
564
684
824
105
125
155
185
225
275
335
395
475
685
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DG
DG
DG
DG
DS
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DP
DG
DG
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
EU
EU
EU
EU
EU
EU
EU
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
EU
EU
EU
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
EU
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
EU
EU
ES
ER
ER
ER
ER
ER
EU
EU
EU
EU
EU
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GC
GD
GF
GK
GB
GB
GB
GB
GB
GB
GB
GB
GC
GF
GK
GL
DG DG
DG
FX
FX
FX
FX
FX
FX
FX
FX
FX
FX
FX
FX
FX
FX
FX
FZ
FU
FU
FJ
FX
FX
FX
FX
FX
FX
FX
FX
FX
FX
FX
FX
FZ
FZ
FU
FX
FX
FX
FX
FX
FX
FX
FX
FX
FZ
FZ
FZ
FU
FU
FJ
FX
FX
FX
FX
FX
FX
FZ
FZ
FU
FU
FJ
FX
FX
FZ
FZ
FU
FU
FS
DG DG DG
DG DG
DG DG
0.12 µF
0.15 µF
0.18 µF
DG DG
0.22 µF
0.27 µF
0.33 µF
0.39 µF
0.47 µF
0.56 µF
0.68 µF
0.82 µF
1.0 µF
1.2 µF
1.5 µF
1.8 µF
2.2 µF
DG
DP
DP
DP
DS
DP
DP
DG
DG
DG
DG
EU
ER
FR
FR
FR
FS
DG
GD GD
GD GD
GN GN GM
ER
EH
ER
EH
FM FM
2.7 µF
3.3 µF
3.9 µF
4.7 µF
FM
EH
FZ
FS
FM
FS
GK
50 100 200 25
GK
50 100 200
6.8 µF
Rated Voltage (VDC) 16
25
3
50 100 200 16
25
3
50 100 200 16
25
3
Voltage Code
4
5
1
2
4
5
1
2
4
5
1
2
3
5
1
2
Capacitance
Code
Capacitance
Case Size/ Series
C0805F/J
C1206F/J
C1210F/J
C1812F/J
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 11/29/2017
7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Table 1B – Capacitance Range/Selection Waterfall - Flexible Termination (0805 – 1812 Case Sizes)
Case Size/
Series
Voltage Code
C0805F/J
C1206F/J
C1210F/J
C1812F/J
Capacitance
Code
4
3
5
1
2
4
3
5
1
2
4
3
5
1
2
3
5
1
2
Capacitance
Rated Voltage (VDC) 16
25
50 100 200 16
25
50 100 200 16
25
50 100 200 25
50 100 200
Capacitance
Tolerance
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
1,000 pF
1,200 pF
1,500 pF
1,800 pF
2,200 pF
2,700 pF
3,300 pF
3,900 pF
4,700 pF
5,600 pF
6,800 pF
8,200 pF
10,000 pF
12,000 pF
15,000 pF
18,000 pF
22,000 pF
27,000 pF
33,000 pF
39,000 pF
47,000 pF
56,000 pF
68,000 pF
82,000 pF
0.10 µF
102
122
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
274
334
394
474
564
684
824
105
125
155
185
225
275
335
395
475
685
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DG
DG
DG
DG
DS
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DG
DG
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
EU
EU
EU
EU
EU
EU
EU
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
EU
EU
EU
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
EU
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
ER
EU
EU
ES
ER
ER
ER
ER
ER
EU
EU
EU
EU
EU
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GC
GD
GF
GK
GB
GB
GB
GB
GB
GB
GB
GB
GC
GF
GK
GL
DG DG
DG
FX
FX
FX
FX
FX
FX
FX
FX
FX
FX
FX
FX
FX
FX
FX
FZ
FU
FU
FJ
FX
FX
FX
FX
FX
FX
FX
FX
FX
FX
FX
FX
FZ
FZ
FU
FX
FX
FX
FX
FX
FX
FX
FX
FX
FZ
FZ
FZ
FU
FU
FJ
FX
FX
FX
FX
FX
FX
FZ
FZ
FU
FU
FJ
FX
FX
FZ
FZ
FU
FU
FS
DG DG DG
DG DG
DG DG
0.12 µF
0.15 µF
0.18 µF
DG DG
0.22 µF
0.27 µF
0.33 µF
0.39 µF
0.47 µF
0.56 µF
0.68 µF
0.82 µF
1.0 µF
1.2 µF
1.5 µF
1.8 µF
2.2 µF
DG
DD
DD
DD
DS
DD
DD
DG
DG
DG
DG
EU
ER
FR
FR
FR
FS
DG
GD GD
GD GD
GN GN GM
ER
EH
ER
EH
FM FM
2.7 µF
3.3 µF
3.9 µF
4.7 µF
FM
EH
FZ
FS
FM
FS
GK
50 100 200 25
GK
50 100 200
6.8 µF
Rated Voltage (VDC) 16
25
3
50 100 200 16
25
3
50 100 200 16
25
3
Voltage Code
4
5
1
2
4
5
1
2
4
5
1
2
3
5
1
2
Capacitance
Code
Capacitance
Case Size/ Series
C0805F/J
C1206F/J
C1210F/J
C1812F/J
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 11/29/2017
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Table 2A – Chip Thickness/Tape & Reel Packaging Quantities - Standard Termination
Paper Quantity
Plastic Quantity
7" Reel 13" Reel
Thickness Case Thickness ±
Code
Size
Range (mm)
7" Reel
13" Reel
DP
DS
DG
ER
ES
EH
EU
FX
FZ
FU
FM
FJ
0805
0805
0805
1206
1206
1206
1206
1210
1210
1210
1210
1210
1210
1210
1812
1812
1812
1812
1812
1812
1812
1812
0.90 ± 0.10*
1.00 ± 0.20
1.25 ± 0.15
0.90 ± 0.20
1.00 ± 0.20
1.60 ± 0.20
1.60 ± 0.25
0.95 ± 0.20
1.25 ± 0.20
1.55 ± 0.20
1.70 ± 0.20
1.85 ± 0.20
2.25 ± 0.20
2.50 ± 0.30
1.00 ± 0.10
1.10 ± 0.10
1.25 ± 0.15
1.50 ± 0.10
1.60 ± 0.20
1.70 ± 0.20
1.90 ± 0.20
2.00 ± 0.20
4,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
15,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
2,500
2,500
4,000
2,500
2,000
2,000
4,000
2,500
2,000
2,000
2,000
2,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
500
10,000
10,000
10,000
10,000
8,000
8,000
10,000
10,000
8,000
8,000
8,000
8,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
2,000
2,000
FR
FS
GB
GC
GD
GF
GK
GN
GL
GM
0
0
0
0
0
500
7" Reel
13" Reel
7" Reel
13" Reel
Thickness
Code
Case
Size
Thickness ±
Range (mm)
Paper Quantity
Plastic Quantity
Package quantity based on finished chip thickness specifications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 11/29/2017
9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Table 2B – Chip Thickness/Tape & Reel Packaging Quantities - Flexible Termination
Paper Quantity
7" Reel 13" Reel
Plastic Quantity
7" Reel 13" Reel
Thickness Case Thickness ±
Code
Size
Range (mm)
DD
DS
DG
ER
ES
EH
EU
FX
FZ
FU
FM
FJ
0805
0805
0805
1206
1206
1206
1206
1210
1210
1210
1210
1210
1210
1210
1812
1812
1812
1812
1812
1812
1812
1812
0.90 ± 0.10
1.00 ± 0.20
1.25 ± 0.15
0.90 ± 0.20
1.00 ± 0.20
1.60 ± 0.20
1.60 ± 0.25
0.95 ± 0.20
1.25 ± 0.20
1.55 ± 0.20
1.70 ± 0.20
1.85 ± 0.20
2.25 ± 0.20
2.50 ± 0.30
1.00 ± 0.10
1.10 ± 0.10
1.25 ± 0.15
1.50 ± 0.10
1.60 ± 0.20
1.70 ± 0.20
1.90 ± 0.20
2.00 ± 0.20
0
0
4,000
10,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
2,500
2,500
4,000
2,500
2,000
2,000
4,000
2,500
2,000
2,000
2,000
2,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
500
10,000
10,000
10,000
10,000
8,000
8,000
10,000
10,000
8,000
8,000
8,000
8,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
2,000
2,000
FR
FS
GB
GC
GD
GF
GK
GN
GL
GM
500
7" Reel
13" Reel
7" Reel
13" Reel
Thickness
Code
Case
Size
Thickness ±
Range (mm)
Paper Quantity
Plastic Quantity
Package quantity based on finished chip thickness specifications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 11/29/2017 10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Table 2C – Bulk Packaging Quantities
Loose Packaging
Packaging Type
Bulk Bag (default)
Packaging C-Spec1
N/A2
Case Size
Packaging Quantities (pieces/unit packaging)
EIA (in)
Metric (mm)
Minimum
Maximum
0402
0603
0805
1206
1210
1808
1812
1825
2220
2225
1005
1608
2012
3216
3225
4520
4532
4564
5650
5664
50,000
1
20,000
1 The "Packaging C-Spec" is a 4 to 8 digit code which identifies the packaging type and/or product grade. When ordering, the proper code must be
included in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details.
Commercial Grade product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk
bag packaging option for Automotive Grade products.
2 A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and Automotive Grade products). The
15th through 22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our
standard "Bulk Bag" packaging.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 11/29/2017 11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Table 3A – Land Pattern Design Recommendations per IPC–7351 – Standard Termination
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
EIA
Size
Code
Metric
Size
Code
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
0805
1206
1210
12101
1812
2012
3216
3225
3225
4532
1.00
1.35
1.55
4.40
2.60
0.90
1.15
1.45
3.50
2.00
0.75
0.95
1.35
2.80
1.70
1.60
1.60
1.50
2.15
1.35
1.35
1.60
1.60
1.90
2.80
2.90
3.60
5.60
5.65
5.60
6.90
2.90
3.80
3.90
4.60
1.50
1.50
1.40
2.05
1.15
1.15
1.40
1.40
1.80
2.70
2.80
3.50
4.70
4.70
4.70
6.00
2.30
3.20
3.30
4.00
1.40
1.40
1.30
1.95
0.95
0.95
1.20
1.20
1.70
2.60
2.70
3.40
4.00
4.00
4.00
5.30
2.00
2.90
3.00
3.70
1 Only for capacitance values ≥ 22 µF
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
V1
Y
Y
V2
X
X
C
C
Grid Placement Courtyard
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 11/29/2017 12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Table 3B – Land Pattern Design Recommendations per IPC–7351 – Flexible Termination
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
EIA
Size
Code
Metric
Size
Code
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
0805
1206
1210
1812
2012
3216
3225
4532
0.99
1.44
1.66
4.47
2.71
0.89
1.24
1.56
3.57
2.11
0.79
1.04
1.46
2.42
1.81
1.59
1.59
2.10
1.62
1.62
1.80
2.06
3.01
3.60
5.85
5.90
7.00
3.06
4.01
4.60
1.49
1.49
2.00
1.42
1.42
1.60
1.96
2.91
3.50
4.95
4.95
6.10
2.46
3.41
4.00
1.39
1.39
1.90
1.22
1.22
1.40
1.86
2.81
3.40
4.25
4.25
5.40
2.16
3.11
3.70
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
V1
Y
Y
V2
X
X
C
C
Grid Placement Courtyard
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 11/29/2017 13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Reflow Soldering Profile:
KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),
convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal
stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/
J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes
at these conditions.
Termination Finish
ꢀP
ꢀL
tP
Profile Feature
Maꢂimum Ramp ꢃp Rate ꢄ ꢅꢆCꢇsecond
Maꢂimum Ramp Doꢈn Rate ꢄ 6ꢆCꢇsecond
SnPb
100% Matte Sn
tL
Preheat/Soak
Temperature Minimum (TSmin
)
100°C
150°C
150°C
200°C
ꢀsmaꢂ
ꢀsmin
Temperature Maximum (TSmax
)
Time (tS) from TSmin to TSmax
60 – 120 seconds
3°C/second
60 – 120 seconds
3°C/second
ts
Ramp-Up Rate (TL to TP)
maximum
maximum
2ꢁ
Liquidous Temperature (TL)
Time Above Liquidous (tL)
Peak Temperature (TP)
183°C
60 – 150 seconds
235°C
217°C
60 – 150 seconds
260°C
2ꢁꢆC to Peaꢉ
Time
Time Within 5°C of Maximum
Peak Temperature (tP)
20 seconds
maximum
30 seconds
maximum
6°C/second
maximum
6°C/second
maximum
Ramp-Down Rate (TP to TL)
Time 25°C to Peak
Temperature
6 minutes
maximum
8 minutes
maximum
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 11/29/2017 14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress
Reference
Test or Inspection Method
Terminal Strength
JIS–C–6429
Appendix 1, Note: Force of 1.8 kg for 60 seconds.
Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm
for C0G. Flexible termination system – 3.0 mm (minimum).
Board Flex
JIS–C–6429
Magnification 50 X. Conditions:
a) Method B, 4 hours at 155°C, dry heat at 235°C
b) Method B at 215°C category 3
Solderability
J–STD–002
c) Method D, category 3 at 260°C
1,000 Cycles (−55°C to +125°C). Measurement at 24 hours +/− 4 hours after test
conclusion.
Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor.
Measurement at 24 hours +/− 4 hours after test conclusion.
Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.
Measurement at 24 hours +/− 4 hours after test conclusion.
Temperature Cycling
Biased Humidity
JESD22 Method JA–104
MIL–STD–202 Method
103
MIL–STD–202 Method
t = 24 hours/cycle. Steps 7a and 7b not required.
Moisture Resistance
Thermal Shock
Measurement at 24 hours +/− 4 hours after test conclusion.
106
MIL–STD–202 Method
−55°C/+125°C. Note: Number of cycles required – 300, maximum transfer time – 20
seconds, dwell time – 15 minutes. Air – Air.
107
MIL–STD–202 Method
108
High Temperature Life
1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied.
/EIA–198
MIL–STD–202 Method
108
Storage Life
Vibration
150°C, 0 VDC for 1,000 hours.
5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7
secure points on one long side and 2 secure points at corners of opposite sides. Parts
mounted within 2" from any secure point. Test from 10 – 2,000 Hz
MIL–STD–202 Method
204
MIL–STD–202 Method
Mechanical Shock
Figure 1 of Method 213, Condition F.
213
MIL–STD–202 Method
215
Resistance to Solvents
Add aqueous wash chemical, OKEM Clean or equivalent.
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum
storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on
the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock
should be used promptly, preferably within 1.5 years of receipt.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 11/29/2017 15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Construction – Standard Termination
Detailed Cross Section
Dielectric Material
(BaTiO3)
Dielectric
Material (BaTiO3)
Barrier Layer
(Ni)
End Termination/
External Electrode
(Cu)
Termination Finish
(100% Matte Sn /
SnPb - 5% Pb min)
Inner Electrodes
(Ni)
End Termination/
External Electrode
(Cu)
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn /
SnPb - 5% Pb min)
Inner Electrodes
(Ni)
Construction – Flexible Termination
Detailed Cross Section
Dielectric Material
(BaTiO3)
Barrier Layer
(Ni)
End Termination/
External Electrode
(Cu)
Termination Finish
(100% Matte Sn /
SnPb - 5% Pb min)
Epoxy Layer
(Ag)
Dielectric
Material (BaTiO3)
Inner Electrodes
(Ni)
End Termination/
External Electrode
(Cu)
Epoxy Layer
(Ag)
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn /
SnPb - 5% Pb min)
Inner Electrodes
(Ni)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 11/29/2017 16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Capacitor Marking (Optional):
These surface mount multilayer ceramic capacitors are
normally supplied unmarked. If required, they can be
marked as an extra cost option. Marking is available
on most KEMET devices but must be requested using
the correct ordering code identifier(s). If this option is
requested, two sides of the ceramic body will be laser
marked with a “K” to identify KEMET, followed by two
characters (per EIA–198 - see table below) to identify the
capacitance value. EIA 0603 case size devices are limited
to the “K” character only.
Marking appears in legible contrast. Illustrated below
is an example of an MLCC with laser marking of “KA8”,
which designates a KEMET device with rated capacitance
of 100 µF. Orientation of marking is vendor optional.
2-Digit
KEMET
Capacitance
ID
Code
Laser marking option is not available on:
• C0G, Ultra Stable X8R and Y5V dielectric devices.
• EIA 0402 case size devices.
• EIA 0603 case size devices with Flexible Termination
option.
• KPS Commercial and Automotive Grade stacked
devices.
• X7R dielectric products in capacitance values outlined
below.
EIA Case Size
Metric Size Code
Capacitance
0603
0805
1206
1210
1808
1812
1825
2220
2225
1608
2012
3216
3225
4520
4532
4564
5650
5664
≤ 170 pF
≤ 150 pF
≤ 910 pF
≤ 2,000 pF
≤ 3,900 pF
≤ 6,700 pF
≤ 0.018 µF
≤ 0.027 µF
≤ 0.033 µF
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 11/29/2017 17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Capacitor Marking (Optional) cont’d
Capacitance (pF) For Various Alpha/Numeral Identifiers
Numeral
Alpha
Character
9
0
1
2
3
4
5
6
7
8
Capacitance (pF)
A
B
C
D
E
F
0.10
0.11
0.12
0.13
0.15
0.16
0.18
0.20
0.22
0.24
0.27
0.30
0.33
0.36
0.39
0.43
0.47
0.51
0.56
0.62
0.68
0.75
0.82
0.91
0.25
0.35
0.40
0.45
0.50
0.60
0.70
0.80
0.90
1.0
1.1
1.2
1.3
1.5
1.6
1.8
2.0
2.2
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
2.5
3.5
4.0
4.5
5.0
6.0
7.0
8.0
9.0
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
51
56
62
68
75
82
91
25
35
40
45
50
60
70
80
90
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
250
350
400
450
500
600
700
800
900
1,000
1,100
1,200
1,300
1,500
1,600
1,800
2,000
2,200
2,400
2,700
3,000
3,300
3,600
3,900
4,300
4,700
5,100
5,600
6,200
6,800
7,500
8,200
9,100
2,500
3,500
4,000
4,500
5,000
6,000
7,000
8,000
9,000
10,000 100,000 1,000,000 10,000,000
11,000 110,000 1,100,000 11,000,000
100,000,000
110,000,000
120,000,000
130,000,000
150,000,000
160,000,000
180,000,000
200,000,000
220,000,000
240,000,000
270,000,000
300,000,000
330,000,000
360,000,000
390,000,000
430,000,000
470,000,000
510,000,000
560,000,000
620,000,000
680,000,000
750,000,000
820,000,000
910,000,000
250,000,000
350,000,000
400,000,000
450,000,000
500,000,000
600,000,000
700,000,000
800,000,000
900,000,000
12,000 120,000 1,200,000 12,000,000
13,000 130,000 1,300,000 13,000,000
15,000 150,000 1,500,000 15,000,000
16,000 160,000 1,600,000 16,000,000
18,000 180,000 1,800,000 18,000,000
20,000 200,000 2,000,000 20,000,000
22,000 220,000 2,200,000 22,000,000
24,000 240,000 2,400,000 24,000,000
27,000 270,000 2,700,000 27,000,000
30,000 300,000 3,000,000 30,000,000
33,000 330,000 3,300,000 33,000,000
36,000 360,000 3,600,000 36,000,000
39,000 390,000 3,900,000 39,000,000
43,000 430,000 4,300,000 43,000,000
47,000 470,000 4,700,000 47,000,000
51,000 510,000 5,100,000 51,000,000
56,000 560,000 5,600,000 56,000,000
62,000 620,000 6,200,000 62,000,000
68,000 680,000 6,800,000 68,000,000
75,000 750,000 7,500,000 75,000,000
82,000 820,000 8,200,000 82,000,000
91,000 910,000 9,100,000 91,000,000
25,000 250,000 2,500,000 25,000,000
35,000 350,000 3,500,000 35,000,000
40,000 400,000 4,000,000 40,000,000
45,000 450,000 4,500,000 45,000,000
50,000 500,000 5,000,000 50,000,000
60,000 600,000 6,000,000 60,000,000
70,000 700,000 7,000,000 70,000,000
80,000 800,000 8,000,000 80,000,000
90,000 900,000 9,000,000 90,000,000
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
W
X
Y
Z
a
b
d
e
f
m
n
t
y
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 11/29/2017 18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with
EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for
details on reeling quantities for commercial chips.
ꢎar code laꢅel
Anti-static reel
®
ꢄmꢅossed plasticꢆ or
punched paper carrierꢁ
Chip and ꢊPS orientation in pocꢉet
(eꢈcept 1ꢀ2ꢋ commercial, and 1ꢀ2ꢋ and 222ꢋ Military)
KEMET
Sprocꢉet holes
ꢄmꢅossment or punched cavity
ꢀ mm, 12 mm
or 16 mm carrier tape
Anti-static cover tape
(0ꢁ10 mm (0ꢁ00ꢇꢂ) maꢈimum thicꢉness)
17ꢀ mm (7ꢁ00ꢂ)
or
ꢃꢃ0 mm (1ꢃꢁ00ꢂ)
ꢆꢄꢌA 0100ꢋ, 0201, 0ꢇ02 and 060ꢃ case siꢍes availaꢅle on punched paper carrier onlyꢁ
Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm)
New 2 mm Pitch Reel Options*
Embossed Plastic Punched Paper
Tape
Packaging
Ordering Code
(C-Spec)
C-3190
7" Reel 13" Reel 7" Reel 13" Reel
EIA Case Size Size
(W)*
Packaging Type/Options
Pitch (P1)* Pitch (P1)*
01005 – 0402
0603
8
8
2
2
2/4
4
Automotive grade 7" reel unmarked
Automotive grade 13" reel unmarked
Commercial grade 7" reel unmarked
Commercial grade 13" reel unmarked
C-3191
2/4
4
C-7081
0805
8
4
4
4
C-7082
1206 – 1210
1805 – 1808
≥ 1812
8
4
4
4
4
* 2 mm pitch reel only available for 0603 EIA case size.
2 mm pitch reel for 0805 EIA case size under development.
12
12
12
16
8
4
8
8
Benefits of Changing from 4 mm to 2 mm Pitching Spacing
• Lower placement costs.
• Double the parts on each reel results in fewer reel
changes and increased efficiency.
• Fewer reels result in lower packaging, shipping and
storage costs, reducing waste.
KPS 1210
8
8
KPS 1812
and 2220
12
4
12
4
Array 0612
*Refer to Figures 1 and 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 and 7 for tolerance specifications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 11/29/2017 19
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
ꢀ
ꢀ
P 2
ꢋ10 pitches cumulative
tolerance on tape ꢌ0ꢅ2 mmꢍ
2
ꢇ
1
Po
ꢆDo
Ao
F
ꢃo
ꢁ
ꢇ
2
ꢂ
1
ꢂo
S
1
P
1
ꢀ
1
ꢇmꢄossment
For cavity siꢈe,
see ꢉote 1 ꢀaꢄle ꢊ
Center Lines of Cavity
ꢆD
1
Cover ꢀape
is for tape feeder reference only,
including draft concentric aꢄout ꢂoꢅ
ꢂ
1
User Direction of Unreeling
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
D1 Minimum
Note 1
1.0
(0.039)
R Reference S1 Minimum
T
T1
Tape Size
8 mm
D0
E1
P0
P2
Note 2
Note 3
Maximum Maximum
25.0
(0.984)
1.5 +0.10/−0.0
(0.059 +0.004/−0.0)
1.75 ±0.10
4.0 ±0.10
2.0 ±0.05
0.600
(0.024)
0.600
(0.024)
0.100
(0.004)
12 mm
16 mm
(0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002)
1.5
(0.059)
30
(1.181)
Variable Dimensions — Millimeters (Inches)
B1 Maximum
E2
T2
W
Tape Size
8 mm
Pitch
F
P1
A0,B0 & K0
Note 4
4.35
(0.171)
Minimum
6.25
(0.246)
Maximum Maximum
2.5
(0.098)
3.5 ±0.05
(0.138 ±0.002) (0.157 ±0.004)
4.0 ±0.10
8.3
(0.327)
Single (4 mm)
Single (4 mm)
8.2
10.25
5.5 ±0.05
8.0 ±0.10
4.6
12.3
12 mm
16 mm
Note 5
and Double (8 mm)
(0.323)
(0.404)
(0.217 ±0.002) (0.315 ±0.004)
(0.181)
(0.484)
12.1
(0.476)
14.25
(0.561)
7.5 ±0.05 12.0 ±0.10
(0.138 ±0.002) (0.157 ±0.004)
4.6
(0.181)
16.3
(0.642)
Triple (12 mm)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment
location and hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see
Figure 4).
(e) for KPS product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 11/29/2017 20
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
ꢀ
ꢈ10 pitches cumulative
tolerance on tape ꢉ0ꢊ2 mmꢋ
ꢂ1
Po
ꢁDo
A0
F
ꢃ
ꢂ2
ꢄ0
P1
ꢄottom Cover ꢀape
G
Cavity Siꢅe,
See
ꢀ1
ꢀ1
Center Lines of Cavity
ꢀop Cover ꢀape
ꢆote 1, ꢀaꢇle 7
ꢄottom Cover ꢀape
User Direction of Unreeling
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
R Reference
Tape Size
D0
E1
P0
P2
T1 Maximum
G Minimum
Note 2
0.10
1.5 +0.10 -0.0
(0.059 +0.004 -0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
0.75
(0.030)
25
(0.984)
8 mm
(0.004)
Maximum
Variable Dimensions — Millimeters (Inches)
Tape Size
8 mm
Pitch
E2 Minimum
F
P1
T Maximum
W Maximum
A0 B0
2.0 ±0.05
(0.079 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
8.3
(0.327)
8.3
(0.327)
Half (2 mm)
Single (4 mm)
6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
1.1
(0.098)
Note 1
8 mm
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
c) rotation of the component is limited to 20° maximum (see Figure 3).
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).
e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 11/29/2017 21
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
8 mm
Peel Strength
0.1 to 1.0 Newton (10 to 100 gf)
0.1 to 1.3 Newton (10 to 130 gf)
12 and 16 mm
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be
165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of
300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
°
T
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Typical Pocket Centerline
Tape
Maximum
°
°
T
s
Width (mm) Rotation (
)
8,12
16 – 200
20
10
Bo
Tape
Maximum
°
S
Width (mm) Rotation (
)
8,12
16 – 56
72 – 200
20
10
5
Typical Component Centerline
Ao
Figure 4 – Maximum Lateral Movement
Figure 5 – Bending Radius
Embossed
Carrier
Punched
Carrier
8 mm & 12 mm Tape
16 mm Tape
0.5 mm maximum
0.5 mm maximum
1.0 mm maximum
1.0 mm maximum
R
Bending
Radius
R
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 11/29/2017 22
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Figure 6 – Reel Dimensions
Full Radius,
ꢋꢌ (ꢅncludes
flange distortion
at outer edge)
Access ꢂole at
Slot Location
(ꢃ ꢄ0 mm minimum)
See ꢀote
ꢋ2 (Measured at huꢍ)
D
(See ꢀote)
A
ꢀ
C
(Arꢍor hole
ꢋ1 (Measured at huꢍ)
diameter)
ꢅf present,
tape slot in core
for tape startꢆ
2ꢇꢈ mm minimum ꢉidth ꢊ
10ꢇ0 mm minimum depth
ꢁ
(see ꢀote)
ꢀoteꢆ Drive spoꢎes optionalꢏ if used, dimensions ꢁ and D shall applyꢇ
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
8 mm
A
B Minimum
C
D Minimum
178 ±0.20
(7.008 ±0.008)
or
1.5
(0.059)
13.0 +0.5/−0.2
(0.521 +0.02/−0.008)
20.2
(0.795)
12 mm
16 mm
330 ±0.20
(13.000 ±0.008)
Variable Dimensions — Millimeters (Inches)
Tape Size
N Minimum
W1
W2 Maximum
W3
8.4 +1.5/−0.0
(0.331 +0.059/−0.0)
14.4
(0.567)
8 mm
50
(1.969)
12.4 +2.0/−0.0
18.4
Shall accommodate tape
width without interference
12 mm
16 mm
(0.488 +0.078/−0.0)
(0.724)
16.4 +2.0/−0.0
(0.646 +0.078/−0.0)
22.4
(0.882)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 11/29/2017 23
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
Figure 7 – Tape Leader & Trailer Dimensions
ꢃmꢇossed Carrier
Carrier ꢀape
Punched Carrier
ꢆ mm & 12 mm only
Round Sprocꢁet ꢂoles
START
END
ꢀop Cover ꢀape
ꢃlongated Sprocꢁet ꢂoles
(ꢄ2 mm tape and ꢅider)
100 mm
minimum Leader
ꢈ00 mm minimum
ꢀrailer
Components
160 mm minimum
ꢀop Cover ꢀape
Figure 8 – Maximum Camber
ꢄlongated Sprocꢁet ꢂoles
(ꢆ2 mm & ꢇider tapes)
Carrier ꢀape
Round Sprocꢁet ꢂoles
1 mm maꢃimum, either direction
Straight ꢄdge
2ꢅ0 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 11/29/2017 24
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)
KEMET Electronics Corporation Sales Offices
For a complete list of our global sales offices, please visit www.kemet.com/sales.
Disclaimer
All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for
checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.
All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such
applications, but are not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use.
The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any
technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no
obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component
failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards
(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or
property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other
measures may not be required.
KEMET is a registered trademark of KEMET Electronics Corporation.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1012_X7R_OPENMODE_SMD • 11/29/2017 25
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