C2220C105MARACTM中文资料_数据手册_规格书

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Telecom “Tip and Ring” X7R Dielectric, 250 VDC

(Commercial Grade)

Overview

KEMET’s 250 V DC Tip and Ring MLCCs in X7R dielectric are

designed and rated for telecommunication ringer circuits where

the capacitor is used to block -48 V to -52 V DC of line voltage

material. Components of this classiﬁcation are ﬁxed, ceramic

dielectric capacitors suited for bypass and decoupling applications

or for frequency discriminating circuits where Q and stability

and pass a 16 – 25 Hz AC signal pulse of 70 VRMs to 90 VRMs. of capacitance characteristics are not critical. X7R dielectric

Serving as an excellent replacement for high voltage leaded

ﬁlm devices, these smaller surface mount technology footprints

save valuable board space which is critical when creating new

designs.

exhibits a predictable change in capacitance with respect to time

and voltage and boasts a minimal change in capacitance with

reference to ambient temperature. Capacitance change is limited

to ±15% from -55°C to +125°C.

KEMET Tip and Ring capacitors feature a 125°C maximum

operating temperature and are considered “temperature

stable.” The Electronics Components, Assemblies & Materials

Association (EIA) characterizes X7R dielectric as a Class II

These devices are able to withstand today’s higher lead-free reﬂow

processing temperatures and offer superior high frequency ﬁltering

characteristics and low ESR.

Beneﬁts

• -55°C to +125°C operating temperature range

• Pb-Free and RoHS Compliant

• SnPb termination ﬁnish option available upon request (5%

minimum)

• EIA 0805, 1206, 1210, 1812, 1825, 2220, and 2225 case sizes

• DC voltage rating of 250 V

• Flexible termination option available upon request

• Capacitance offerings ranging from 1,000 pF to 6.8 μF

• Available capacitance tolerances of ±10% and ±20%

• Non-polar device, minimizing installation concerns

• 100% pure matte tin-plated termination ﬁnish that allows for

excellent solderability

Ordering Information

C

1825

C

105

K

A

R

A

C

TU

Case Size Speciﬁcation/

Capacitance

Code (pF)

Capacitance

Tolerance

Failure Rate/

Design

Packaging/Grade

(C-Spec)²

Ceramic

Voltage

Dielectric

Termination Finish¹

(L" x W")

Series

0805

1206

1210

1812

1825

2220

2225

C = Standard 2 Signiﬁcant Digits + J = ±5%

A = 250 V R = X7R A = N/A

C = 100% Matte Sn Blank = Bulk

X = Flexible

Termination

Number of Zeros

K = ±10%

M = ±20%

L = SnPb (5%

minimum)

TU = 7" Reel

Unmarked

TM = 7" Reel

Marked

¹Additional termination ﬁnish options may be available. Contact KEMET for details.

²Additional reeling or packaging options may be available. Contact KEMET for details.

One world. One KEMET

C1011_X7R_TIP_RING_SMD • 1/14/2013

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

Dimensions – Millimeters (Inches) – Standard Termination

100% Tin or SnPb Plate

L

W

B

T

Nickel Plate

S

Conductive Metalization

Electrodes

EIA

Size

Code

Metric

Size

Code

S

L

W

Width

T

B

Mounting

Technique

Separation

Minimum

Length

Thickness

Bandwidth

0805

1206

1210

1812

1825

2220

2225

2012

3216

3225

4532

4564

5650

5664

2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008)

3.20 (.126) ± 0.20 (.008) 1.60 (.063) ± 0.20 (.008)

3.20 (.126) ± 0.20 (.008) 2.50 (.098) ± 0.20 (.008)

4.50 (.177) ± 0.30 (.012) 3.20 (.126) ± 0.30 (.012)

4.50 (.177) ± 0.30 (.012) 6.40 (.252) ± 0.40 (.016)

5.70 (.224) ± 0.40 (.016) 5.00 (.197) ± 0.40 (.016)

5.60 (.220) ± 0.40 (.016) 6.40 (.248) ± 0.40 (.016)

0.50 (0.02) ± 0.25 (.010)

0.60 (.024) ± 0.35 (.014)

0.75 (.030)

Solder Wave or

Solder Reﬂow

See Table 2 for

Thickness

N/A

Solder Reﬂow Only

Dimensions – Millimeters (Inches) – Flexible Termination

L

W

B

T

S

EIA

Size

Code

Metric

Size

Code

Mounting

Technique

T

L Length

Separation

Minimum

W Width

B Bandwidth

Thickness

0805

1206

1210

1812

1825

2220

2225

2012

3216

3225

4532

4564

5650

5664

2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008)

3.30 (.130) ± 0.40 (.016) 1.60 (.063) ± 0.20 (.008)

3.30 (.130) ± 0.40 (.016) 2.50 (.098) ± 0.20 (.008)

4.50 (.178) ± 0.40 (.016) 3.20 (.126) ± 0.30 (.012)

4.60 (.181) ± 0.40 (.016) 6.40 (.252) ± 0.40 (.016)

5.90 (.232) ± 0.75 (.030) 5.00 (.197) ± 0.40 (.016)

5.90 (.232) ± 0.75 (.030) 6.40 (.248) ± 0.40 (.016)

0.50 (0.02) ± 0.25 (.010)

0.60 (.024) ± 0.25 (.010)

0.70 (.028) ± 0.35 (.014)

0.75 (.030)

Solder Wave or

Solder Reﬂow

See Table 2 for

Thickness

N/A

Solder Reﬂow Only

C1011_X7R_TIP_RING_SMD • 1/14/2013

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

Applications

Typical applications include telecommunication ringing circuits, switch mode power supply snubber circuits, high voltage DC blocking

and high voltage coupling. Markets include telephone lines, analog and digital modems, facsimile machines, wireless base stations,

cable and digital video recording set-top boxes, satellite dishes, high voltage power supply, DC/DC converters, and Ethernet, POS and

ATM hardware.

Qualiﬁcation/Certiﬁcation

Commercial Grade products are subject to internal qualiﬁcation. Details regarding test methods and conditions are referenced in

Table 4, Performance & Reliability.

Environmental Compliance

Pb-Free and RoHS Compliant (excluding SnPb termination ﬁnish option).

Electrical Parameters/Characteristics

Item

Parameters/Characteristics

Operating Temperature Range

-55°C to +125°C

±15%

Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC)

Aging Rate (Maximum % Capacitance Loss/Decade Hour)

3.0%

250% of rated voltage

Dielectric Withstanding Voltage (DWV)

Dissipation Factor (DF) Maximum Limit @ 25ºC

Insulation Resistance (IR) Limit @ 25°C

(5 ±1 seconds and charge/discharge not exceeding 50 mA)

5% (6.3 and 10 V), 3.5% (16 and 25 V) and 2.5% (50 to 250 V)

See Insulation Resistance Limit Table

(Rated voltage applied for 120 ±5 seconds @ 25°C)

Regarding aging rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.

To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.

Capacitance and dissipation factor (DF) measured under the following conditions:

1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance ≤ 10 µF

120 Hz ±10 Hz and 0.5 ±0.1 Vrms if capacitance >10 µF

Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as

Automatic Level Control (ALC). The ALC feature should be switched to "ON."

C1011_X7R_TIP_RING_SMD • 1/14/2013

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

Post Environmental Limits

High Temperature Life, Biased Humidity, Moisture Resistance

Rated DC

Voltage

Capacitance

Dissipation Factor

(Maximum %)

Capacitance

Insulation

Resistance

Dielectric

X7R

Value

Shift

> 25

16/25

< 16

3.0

5.0

7.5

All

±20%

10% of Initial Limit

Insulation Resistance Limit Table

1,000 Megohm

Microfarads or 100 GΩ

500 Megohm

Microfarads or 10 GΩ

EIA Case Size

0201

0402

0603

0805

1206

1210

1808

1812

1825

2220

2225

N/A

< 0.012 µF

< 0.047 µF

< 0.22 µF

< 0.39 µF

ALL

≥ 0.012 µF

≥ 0.047 µF

≥ 0.22 µF

≥ 0.39 µF

N/A

< 2.2 µF

ALL

≥ 2.2 µF

N/A

< 10 µF

ALL

≥ 10 µF

N/A

C1011_X7R_TIP_RING_SMD • 1/14/2013

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

Table 1 – Capacitance Range/Selection Waterfall (0805 – 2225 Case Sizes)

Series

Voltage Code

Voltage DC

C0805

C1206

C1210

C1812

C1825

C2220

C2225

A

Capacitance

Code

Capacitance

250

Capacitance

Tolerance

Product Availability and Chip Thickness Codes

See Table 2 for Chip Thickness Dimensions

180 pF

220 pF

270 pF

330 pF

390 pF

470 pF

560 pF

680 pF

820 pF

181

221

271

331

391

471

561

681

821

102

122

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

823

104

124

154

184

224

274

334

394

474

564

684

824

105

125

J

K

M

DC

J

M

1000 pF

1200 pF

1500 pF

1800 pF

2200 pF

2700 pF

3300 pF

3900 pF

4700 pF

5600 pF

6800 pF

8200 pF

10000 pF

12000 pF

15000 pF

18000 pF

22000 pF

27000 pF

33000 pF

39000 pF

47000 pF

56000 pF

68000 pF

82000 pF

0.1 µF

0.12 µF

0.15 µF

0.18 µF

0.22 µF

0.27 µF

0.33 µF

0.39 µF

0.47 µF

0.56 µF

0.68 µF

0.82 µF

1 µF

EB

ED

EM

FB

FC

FF

FG

GB

GE

GG

GJ

HB

HD

HF

JC

JD

JF

KC

KD

KE

1.2 µF

250

C

1825

C

^Voltage1^D0^C5

K

²⁵⁰A

R

A²⁵⁰

C

TU

Capacitance

Code

Voltage Code

A

Capacitance

Case Size Speciﬁcation/

(L" x W")

Capacitance

Series

Capacitance

Tolerance

Failure Rate/

Design

Packaging/Grade

C2220 C2225

1

C0805

C1206

Voltage

C1210

Dielectric

C1812

C1825

Termination Finish

Ceramic

Series

Code (pF)

(C-Spec)²

0805

1206

1210

1812

1825

2220

2225

C = Standard 2 Signiﬁcant Digits + J = ±5%

A = 250 V R = X7R A = N/A

C = 100% Matte Sn Blank = Bulk

X = Flexible

Termination

Number of Zeros

K = ±10%

M = ±20%

L = SnPb (5%

minimum)

TU = 7" Reel

Unmarked

TM = 7" Reel

Marked

C1011_X7R_TIP_RING_SMD • 1/14/2013

5

Roll Over for

Order Info.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

Table 2 – Chip Thickness/Packaging Quantities

Paper Quantity

Plastic Quantity

7" Reel 13" Reel

Thickness Case Thickness ±

Code

Size

Range (mm)

7" Reel

13" Reel

DC

EB

ED

EM

FB

FC

FF

FG

GB

GE

GG

GJ

HB

HD

HF

JC

0805

1206

1210

1812

1825

2220

2225

0.78 ± 0.10

1.00 ± 0.10

1.25 ± 0.15

0.78 ± 0.10

0.90 ± 0.10

1.10 ± 0.10

1.25 ± 0.15

1.00 ± 0.10

1.30 ± 0.10

1.55 ± 0.10

1.70 ± 0.15

1.10 ± 0.15

1.30 ± 0.15

1.50 ± 0.15

1.10 ± 0.15

1.30 ± 0.15

1.50 ± 0.15

1.10 ± 0.15

1.30 ± 0.15

1.40 ± 0.15

4,000

10,000

0

4,000

2,500

4,000

2,500

1,000

10,000

4,000

0

JD

JF

KC

KD

KE

7" Reel

13" Reel

7" Reel

13" Reel

Thickness

Code

Case

Size

Thickness ±

Range (mm)

Paper Quantity

Plastic Quantity

Package quantity based on ﬁnished chip thickness speciﬁcations.

Table 3A – Land Pattern Design Recommendations per IPC–7351 – Standard Termination

Density Level A:

Maximum (Most)

Land Protrusion (mm)

Density Level B:

Median (Nominal)

Land Protrusion (mm)

Density Level C:

Minimum (Least)

Land Protrusion (mm)

EIA

Size

Code

Metric

Size

Code

C

Y

X

V1

V2

C

Y

X

V1

V2

C

Y

X

V1

V2

0805

1206

1210

1210¹

1812

1825

2220

2225

2012

3216

3225

4532

4564

5650

5664

1.00

1.35

1.55

4.40

2.60

0.90

1.15

1.45

3.50

2.00

0.75

0.95

1.35

2.80

1.70

1.60

1.50

2.15

2.75

2.70

1.35

1.60

1.70

1.90

2.80

2.90

3.60

6.90

5.50

6.90

5.60

5.65

5.60

6.90

8.20

8.10

2.90

3.80

3.90

4.60

7.90

6.50

7.90

1.50

1.40

2.05

2.65

2.60

1.15

1.40

1.50

1.80

2.70

2.80

3.50

6.80

5.40

6.80

4.70

6.00

7.30

7.20

2.30

3.20

3.30

4.00

7.30

5.90

7.30

1.40

1.30

1.95

2.55

2.50

0.95

1.20

1.30

1.70

2.60

2.70

3.40

6.70

5.30

6.70

4.00

5.30

6.60

6.50

2.00

2.90

3.00

3.70

7.00

5.60

7.00

¹Only for capacitance values ≥ 22 µF

C1011_X7R_TIP_RING_SMD • 1/14/2013

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

Table 3B – Land Pattern Design Recommendations per IPC–7351 – Flexible Termination

Density Level A:

Maximum (Most)

Land Protrusion (mm)

Density Level B:

Median (Nominal)

Land Protrusion (mm)

Density Level C:

Minimum (Least)

Land Protrusion (mm)

EIA

Size

Code

Metric

Size

Code

C

Y

X

V1

V2

C

Y

X

V1

V2

C

Y

X

V1

V2

0805

1206

1210

1812

1825

2220

2225

2012

3216

3225

4532

4564

5650

5664

1.00

1.35

1.55

4.40

2.60

0.90

1.15

1.45

3.50

2.00

0.80

0.95

1.35

2.80

1.70

1.60

2.10

2.15

2.85

1.65

1.80

2.10

1.90

2.80

3.60

6.90

5.50

6.90

5.90

7.00

7.10

2.90

3.80

4.60

7.90

6.50

7.90

1.50

2.00

2.05

2.75

1.45

1.60

1.90

1.80

2.70

3.50

6.80

5.40

6.80

5.00

6.10

6.20

7.90

2.30

3.20

4.00

7.30

5.90

7.30

1.40

1.90

1.95

2.65

1.25

1.40

1.70

2.60

3.40

6.70

5.30

6.70

4.30

5.40

5.50

7.20

2.00

2.90

3.70

7.00

5.60

7.00

8.80

Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reﬂow solder

processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reﬂow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualiﬁcation

testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).

Soldering Process

Recommended Soldering Technique:

• Solder wave or solder reﬂow for EIA case sizes 0603, 0805 and 1206

• All other EIA case sizes are limited to solder reﬂow only

Recommended Soldering Proﬁle:

• KEMET recommends following the guidelines outlined in IPC/JEDEC J–STD–020

C1011_X7R_TIP_RING_SMD • 1/14/2013

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

Table 4 – Performance & Reliability: Test Methods and Conditions

Stress

Reference

Test or Inspection Method

Terminal Strength

JIS–C–6429

Appendix 1, Note: Force of 1.8 kg for 60 seconds.

Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G.

Flexible termination system – 3.0 mm (minimum).

Board Flex

JIS–C–6429

Magniﬁcation 50 X. Conditions:

a) Method B, 4 hours @ 155°C, dry heat @ 235°C

b) Method B @ 215°C category 3

Solderability

J–STD–002

c) Method D, category 3 @ 260°C

Temperature Cycling

Biased Humidity

JESD22 Method JA–104

MIL–STD–202 Method 103

1,000 Cycles (-55°C to +125°C). Measurement at 24 hours +/- 2 hours after test conclusion.

Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor. Measurement

at 24 hours +/- 2 hours after test conclusion.

Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.

Measurement at 24 hours +/- 2 hours after test conclusion.

t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered.

Measurement at 24 hours +/- 2 hours after test conclusion.

-55°C/+125°C. Note: Number of cycles required – 300, maximum transfer time – 20 seconds, dwell

time – 15 minutes. Air – Air.

Moisture Resistance

Thermal Shock

MIL–STD–202 Method 106

MIL–STD–202 Method 107

MIL–STD–202 Method 108

/EIA–198

High Temperature Life

Storage Life

1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied.

MIL–STD–202 Method 108 150°C, 0 VDC for 1,000 hours.

5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 secure

MIL–STD–202 Method 204 points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2"

from any secure point. Test from 10 – 2,000 Hz

Vibration

Mechanical Shock

MIL–STD–202 Method 213 Figure 1 of Method 213, Condition F.

Resistance to Solvents MIL–STD–202 Method 215 Add aqueous wash chemical, OKEM Clean or equivalent.

Storage and Handling

Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other

environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term

storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may

increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70%

relative humidity. Temperature ﬂuctuations should be minimized to avoid condensation on the parts and atmospheres should be free of

chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of

receipt.

C1011_X7R_TIP_RING_SMD • 1/14/2013

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

Construction – Standard Termination

Reference

Item

Material

A

B

C

D

E

Finish

100% Matte Sn SnPb (5% min)

Termination

System

Barrier Layer

Base Metal

Ni

Cu

Inner Electrode

Dielectric Material

Ni

BaTiO₃

Note: Image is exaggerated in order to clearly identify all components of construction.

Construction – Flexible Termination

Reference

Item

Material

A

B

C

D

E

F

Finish

100% Matte Sn SnPb (5% min)

Barrier Layer

Epoxy Layer

Base Metal

Ni

Ag

Termination

System

Cu

Inner Electrode

Dielectric Material

Ni

BaTiO₃

Note: Image is exaggerated in order to clearly identify all components of construction.

C1011_X7R_TIP_RING_SMD • 1/14/2013

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

Capacitor Marking (Optional):

These surface mount multilayer ceramic capacitors are

normally supplied unmarked. If required, they can be marked

as an extra cost option. Marking is available on most KEMET

devices but must be requested using the correct ordering

code identiﬁer(s). If this option is requested, two sides of the

ceramic body will be laser marked with a “K” to identify KEMET,

followed by two characters (per EIA–198 - see table below) to

identify the capacitance value. EIA 0603 case size devices are

limited to the “K” character only.

Marking appears in legible contrast. Illustrated below is an

example of an MLCC with laser marking of “KA8”, which

designates a KEMET device with rated capacitance of 100 µF.

Orientation of marking is vendor optional.

_

KA8

Laser marking option is not available on:

• C0G, Ultra Stable X8R and Y5V dielectric devices

• EIA 0402 case size devices

• EIA 0603 case size devices with Flexible Termination option.

• KPS Commercial and Automotive Grade stacked devices.

Capacitance (pF) For Various Alpha/Numeral Identiﬁers

Numeral

Alpha

Character

9

0

1

2

3

4

5

6

7

8

Capacitance (pF)

A

B

C

D

E

F

G

H

J

0.1

0.11

0.12

0.13

0.15

0.16

0.18

0.2

1 0

1.1

1 2

1 3

1 5

1 6

1 8

2 0

2 2

2.4

2.7

3 0

3 3

3 6

3 9

4 3

4.7

5.1

5 6

6 2

6 8

7 5

8 2

9.1

2 5

3 5

4 0

4 5

5 0

6 0

7 0

8 0

9 0

10

11

12

13

15

16

18

20

22

24

27

30

33

36

39

43

47

51

56

62

68

75

82

91

25

35

40

45

50

60

70

80

90

100

110

120

130

150

160

180

200

220

240

270

300

330

360

390

430

470

510

560

620

680

750

820

910

250

350

400

450

500

600

700

800

900

1,000

1,100

1,200

1,300

1,500

1,600

1,800

2,000

2,200

2,400

2,700

3,000

3,300

3,600

3,900

4,300

4,700

5,100

5,600

6,200

6,800

7,500

8,200

9,100

2,500

3,500

4,000

4,500

5,000

6,000

7,000

8,000

9,000

10,000

11,000

12,000

13,000

15,000

16,000

18,000

20,000

22,000

24,000

27,000

30,000

33,000

36,000

39,000

43,000

47,000

51,000

56,000

62,000

68,000

75,000

82,000

91,000

25,000

35,000

40,000

45,000

50,000

60,000

70,000

80,000

90,000

100,000 1,000,000

110,000 1,100,000

120,000 1,200,000

130,000 1,300,000

150,000 1,500,000

160,000 1,600,000

180,000 1,800,000

200,000 2,000,000

220,000 2,200,000

240,000 2,400,000

270,000 2,700,000

300,000 3,000,000

330,000 3,300,000

360,000 3,600,000

390,000 3,900,000

430,000 4,300,000

470,000 4,700,000

510,000 5,100,000

560,000 5,600,000

620,000 6,200,000

680,000 6,800,000

750,000 7,500,000

820,000 8,200,000

910,000 9,100,000

250,000 2,500,000

350,000 3,500,000

400,000 4,000,000

450,000 4,500,000

500,000 5,000,000

600,000 6,000,000

700,000 7,000,000

800,000 8,000,000

900,000 9,000,000

10,000,000

11,000,000

12,000,000

13,000,000

15,000,000

16,000,000

18,000,000

20,000,000

22,000,000

24,000,000

27,000,000

30,000,000

33,000,000

36,000,000

39,000,000

43,000,000

47,000,000

51,000,000

56,000,000

62,000,000

68,000,000

75,000,000

82,000,000

91,000,000

25,000,000

35,000,000

40,000,000

45,000,000

50,000,000

60,000,000

70,000,000

80,000,000

90,000,000

100,000,000

110,000,000

120,000,000

130,000,000

150,000,000

160,000,000

180,000,000

200,000,000

220,000,000

240,000,000

270,000,000

300,000,000

330,000,000

360,000,000

390,000,000

430,000,000

470,000,000

510,000,000

560,000,000

620,000,000

680,000,000

750,000,000

820,000,000

910,000,000

250,000,000

350,000,000

400,000,000

450,000,000

500,000,000

600,000,000

700,000,000

800,000,000

900,000,000

0.22

0.24

0.27

0.3

K

L

M

N

P

Q

R

S

T

U

V

W

X

Y

Z

a

0.33

0.36

0.39

0.43

0.47

0.51

0.56

0.62

0.68

0.75

0.82

0.91

0.25

0.35

0.4

b

d

e

0.45

0.5

f

m

n

0.6

0.7

t

0.8

y

0.9

C1011_X7R_TIP_RING_SMD • 1/14/2013 10

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

Tape & Reel Packaging Information

KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA

Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on

reeling quantities for commercial chips.

Bar Code Label

Anti-Static Reel

®

Embossed Plastic* or

Punched Paper Carrier.

Chip and KPS Orientation in Pocket

(except 1825 Commercial, and 1825 and 2225 Military)

KEMET

Sprocket Holes

Embossment or Punched Cavity

8 mm, 12 mm

or 16 mm Carrier Tape

Anti-Static Cover Tape

(.10 mm (.004") Maximum Thickness)

178 mm (7.00")

or

330 mm (13.00")

*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.

Table 5 – Carrier Tape Conﬁguration – Embossed Plastic & Punched Paper (mm)

EIA Case Size

01005 – 0402

0603 – 1210

Tape Size (W)*

Pitch (P₁)*

8

2

4

1805 – 1808

12

16

8

4

≥ 1812

8

KPS 1210

8

KPS 1812 & 2220

Array 0508 & 0612

12

4

*Refer to Figures 1 & 2 for W and P₁carrier tape reference locations.

*Refer to Tables 6 & 7 for tolerance speciﬁcations.

C1011_X7R_TIP_RING_SMD • 1/14/2013 11

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

T

P2

[10 pitches cumulative

tolerance on tape ± 0.2 mm]

2

E

1

Po

ØDo

Ao

F

Ko

W

E

2

B

1

Bo

S

1

P

1

T

1

Embossment

For cavity size,

see Note 1 Table 4

Center Lines of Cavity

ØD

1

Cover Tape

is for tape feeder reference only,

including draft concentric about B

B

1

o

.

User Direction of Unreeling

Table 6 – Embossed (Plastic) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

D₁Minimum

Note 1

1.0

(0.039)

R Reference S₁Minimum

T

T₁

Tape Size

8 mm

D₀

E₁

P₀

P₂

Note 2

Note 3

Maximum

25.0

(0.984)

1.5 +0.10/-0.0

(0.059 +0.004/-0.0)

1.75 ±0.10

4.0 ±0.10

2.0 ±0.05

0.600

(0.024)

0.600

(0.024)

0.100

(0.004)

12 mm

16 mm

(0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002)

1.5

(0.059)

30

(1.181)

Variable Dimensions — Millimeters (Inches)

B₁Maximum

Note 4

4.35

(0.171)

E₂

T₂

W

Tape Size

8 mm

Pitch

F

P₁

A₀,B₀& K₀

Minimum

6.25

(0.246)

Maximum

2.5

(0.098)

Maximum

8.3

(0.327)

3.5 ±0.05

(0.138 ±0.002) (0.157 ±0.004)

4.0 ±0.10

Single (4 mm)

Single (4 mm) &

Double (8 mm)

8.2

10.25

5.5 ±0.05

8.0 ±0.10

4.6

12.3

12 mm

16 mm

Note 5

(0.323)

(0.404)

(0.217 ±0.002) (0.315 ±0.004)

(0.181)

(0.484)

12.1

(0.476)

14.25

(0.561)

7.5 ±0.05 12.0 ±0.10

(0.138 ±0.002) (0.157 ±0.004)

4.6

(0.181)

16.3

(0.642)

Triple (12 mm)

1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and

hole location shall be applied independent of each other.

2. The tape with or without components shall pass around R without damage (see Figure 6).

3. If S₁< 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).

4. B₁dimension is a reference dimension for tape feeder clearance only.

5. The cavity deﬁned by A₀, B₀and K₀shall surround the component with sufﬁcient clearance that:

(a) the component does not protrude above the top surface of the carrier tape.

(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).

(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4).

(e) for KPS Series product, A₀and B₀are measured on a plane 0.3 mm above the bottom of the pocket.

(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.

C1011_X7R_TIP_RING_SMD • 1/14/2013 12

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

Figure 2 – Punched (Paper) Carrier Tape Dimensions

T

P2

[10 pitches cumulative

tolerance on tape ± 0.2 mm]

E

1

Po

ØDo

0

A

F

W

2

E

0

B

Bottom Cover Tape

P

1

G

Cavity Size,

See

1

T

1

T

Top Cover Tape

Center Lines of Cavity

Note 1, Table 7

Bottom Cover Tape

User Direction of Unreeling

Table 7 – Punched (Paper) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

R Reference

Note 2

Tape Size

8 mm

D₀

E₁

P₀

P₂

T₁Maximum

G Minimum

1.5 +0.10 -0.0

(0.059 +0.004 -0.0)

1.75 ±0.10

(0.069 ±0.004)

4.0 ±0.10

(0.157 ±0.004)

2.0 ±0.05

(0.079 ±0.002) (0.004) Maximum

0.10

0.75

(0.030)

25

(0.984)

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

Pitch

E2 Minimum

F

P₁

T Maximum

W Maximum

A₀B₀

2.0 ±0.05

(0.079 ±0.002)

4.0 ±0.10

8.3

(0.327)

8.3

Half (2 mm)

Single (4 mm)

6.25

(0.246)

3.5 ±0.05

(0.138 ±0.002)

1.1

(0.098)

Note 1

8 mm

(0.157 ±0.004)

(0.327)

1. The cavity deﬁned by A₀, B₀and T shall surround the component with sufﬁcient clearance that:

a) the component does not protrude beyond either surface of the carrier tape.

b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

c) rotation of the component is limited to 20° maximum (see Figure 3).

d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).

e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.

2. The tape with or without components shall pass around R without damage (see Figure 6).

C1011_X7R_TIP_RING_SMD • 1/14/2013 13

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 Kg minimum.

2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

Tape Width

8 mm

Peel Strength

0.1 to 1.0 Newton (10 to 100 gf)

0.1 to 1.3 Newton (10 to 130 gf)

12 and 16 mm

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180°

from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.

3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA

Standards 556 and 624.

Figure 3 – Maximum Component Rotation

°

T

Maximum Component Rotation

Top View

Maximum Component Rotation

Side View

Typical Pocket Centerline

Tape

Maximum

°

T

s

Width (mm) Rotation (

)

8,12

16 – 200

20

10

Bo

Tape

Maximum

°

S

Width (mm) Rotation (

)

8,12

16 – 56

72 – 200

20

10

5

Typical Component Centerline

Ao

Figure 4 – Maximum Lateral Movement

Figure 5 – Bending Radius

Embossed

Carrier

Punched

Carrier

8 mm & 12 mm Tape

16 mm Tape

0.5 mm maximum

1.0 mm maximum

R

Bending

Radius

R

C1011_X7R_TIP_RING_SMD • 1/14/2013 14

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

Figure 6 – Reel Dimensions

Full Radius,

See Note

W3 (Includes

flange distortion

at outer edge)

Access Hole at

Slot Location

(Ø 40 mm minimum)

W

2 (Measured at hub)

D

(See Note)

A

N

C

(Arbor hole

W

1 (Measured at hub)

diameter)

If present,

tape slot in core

for tape start:

2.5 mm minimum width x

10.0 mm minimum depth

B

(see Note)

Note: Drive spokes optional; if used, dimensions B and D shall apply.

Table 8 – Reel Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size

8 mm

A

B Minimum

C

D Minimum

178 ±0.20

(7.008 ±0.008)

or

330 ±0.20

(13.000 ±0.008)

1.5

(0.059)

13.0 +0.5/-0.2

(0.521 +0.02/-0.008)

20.2

(0.795)

12 mm

16 mm

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

N Minimum

W₁

W₂Maximum

W₃

8.4 +1.5/-0.0

(0.331 +0.059/-0.0)

14.4

(0.567)

50

(1.969)

12.4 +2.0/-0.0

18.4

Shall accommodate tape width

without interference

12 mm

16 mm

(0.488 +0.078/-0.0)

(0.724)

16.4 +2.0/-0.0

(0.646 +0.078/-0.0)

22.4

(0.882)

C1011_X7R_TIP_RING_SMD • 1/14/2013 15

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

Figure 7 – Tape Leader & Trailer Dimensions

Embossed Carrier

Carrier Tape

Round Sprocket Holes

Punched Carrier

8 mm & 12 mm only

START

END

Top Cover Tape

Elongated Sprocket Holes

(32 mm tape and wider)

100 mm

Minimum Leader

400 mm Minimum

Trailer

160 mm Minimum

Components

Top Cover Tape

Figure 8 – Maximum Camber

Elongated sprocket holes

(32 mm & wider tapes)

Carrier Tape

Round Sprocket Holes

1 mm Maximum, either direction

Straight Edge

250 mm

C1011_X7R_TIP_RING_SMD • 1/14/2013 16

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

KEMET Corporation

World Headquarters

Europe

Asia

Southern Europe

Paris, France

Tel: 33-1-4646-1006

Northeast Asia

Hong Kong

Tel: 852-2305-1168

2835 KEMET Way

Simpsonville, SC 29681

Sasso Marconi, Italy

Tel: 39-051-939111

Shenzhen, China

Tel: 86-755-2518-1306

Mailing Address:

P.O. Box 5928

Greenville, SC 29606

Beijing, China

Central Europe

Landsberg, Germany

Tel: 49-8191-3350800

Tel: 86-10-5829-1711

www.kemet.com

Tel: 864-963-6300

Fax: 864-963-6521

Shanghai, China

Tel: 86-21-6447-0707

Kamen, Germany

Tel: 49-2307-438110

Corporate Ofﬁces

Fort Lauderdale, FL

Tel: 954-766-2800

Taipei, Taiwan

Tel: 886-2-27528585

Northern Europe

Bishop’s Stortford, United Kingdom

Tel: 44-1279-460122

North America

Southeast Asia

Singapore

Southeast

Tel: 65-6586-1900

Lake Mary, FL

Tel: 407-855-8886

Espoo, Finland

Tel: 358-9-5406-5000

Penang, Malaysia

Tel: 60-4-6430200

Northeast

Wilmington, MA

Tel: 978-658-1663

Bangalore, India

Tel: 91-806-53-76817

Central

Novi, MI

Tel: 248-994-1030

West

Milpitas, CA

Tel: 408-433-9950

Mexico

Guadalajara, Jalisco

Tel: 52-33-3123-2141

Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not

assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of

KEMET Electronics Corporation.

C1011_X7R_TIP_RING_SMD • 1/14/2013 17

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

Other KEMET Resources

Tools

Resource

Location

Conﬁgure A Part: CapEdge

SPICE & FIT Software

http://capacitoredge.kemet.com

http://www.kemet.com/spice

http://www.kemet.com/keask

http://www.kemet.com:8080/elc

Search Our FAQs: KnowledgeEdge

Electrolytic LifeCalculator

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Resource

Location

Products

Technical Resources (Including Soldering Techniques)

RoHS Statement

http://www.kemet.com/products

http://www.kemet.com/technicalpapers

http://www.kemet.com/rohs

Quality Documents

http://www.kemet.com/qualitydocuments

Product Request

Resource

Location

http://www.kemet.com/sample

http://www.kemet.com/kits

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Engineering Kit Request

Contact

Resource

Location

Website

Contact Us

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Call Us

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Disclaimer

All product speciﬁcations, statements, information and data (collectively, the “Information”) are subject to change without notice.

All Information given herein is believed to be accurate and reliable, but is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.

Statements of suitability for certain applications are based on our knowledge of typical operating conditions for such applications, but are not intended to constitute – and we

speciﬁcally disclaim – any warranty concerning suitability for a speciﬁc customer application or use. This Information is intended for use only by customers who have the requisite

experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by us with reference to the

use of our products is given gratis, and we assume no obligation or liability for the advice given or results obtained.

Although we design and manufacture our products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur.

Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or

redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.

Although all product-related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other measures may not

be required.

C1011_X7R_TIP_RING_SMD • 1/14/2013 18

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

Digitally signed by Jeannette Calvo

DN: c=US, st=FL, l=Fort Lauderdale, o=KEMET Corp., ou=Marketing Communications,

cn=Jeannette Calvo, email=jeannettecalvo@kemet.com

Date: 2013.01.15 11:04:22 -05'00'

C1011_X7R_TIP_RING_SMD • 1/14/2013 19

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	包装说明：	, 2220
Reach Compliance Code：	compliant	ECCN代码：	EAR99
HTS代码：	8532.24.00.20	风险等级：	5.25
Is Samacsys：	N	电容：	1 µF
电容器类型：	CERAMIC CAPACITOR	介电材料：	CERAMIC
高度：	1.5 mm	JESD-609代码：	e3
长度：	5.7 mm	安装特点：	SURFACE MOUNT
多层：	Yes	负容差：	20%
端子数量：	2	最高工作温度：	125 °C
最低工作温度：	-55 °C	封装形状：	RECTANGULAR PACKAGE
封装形式：	SMT	包装方法：	TR, Embossed Plastic, 7 Inch
正容差：	20%	额定（直流）电压（URdc）：	250 V
尺寸代码：	2220	表面贴装：	YES
温度特性代码：	X7R	温度系数：	15% ppm/°C
端子面层：	Matte Tin (Sn) - with Nickel (Ni) barrier	端子形状：	WRAPAROUND
宽度：	5 mm	Base Number Matches：	1

型号	制造商	描述	价格	文档
C2220C105MCR2C7186	KEMET	KPS SMD Comm X7R HV, Ceramic, 1 uF, 20%, 500 VDC, X7R, 2220-2	获取价格
C2220C105MCR2L7186	KEMET	KPS SMD Comm X7R HV SnPb, Ceramic, 1 uF, 20%, 500 VDC, X7R, 2220-2	获取价格
C2220C105MCR2L7289	KEMET	KPS SMD Comm X7R HV SnPb, Ceramic, 1 uF, 20%, 500 VDC, X7R, 2220-2	获取价格
C2220C106J1RACTU	KEMET	X7R Dielectric, 6.3 - 250 VDC (Commercial Grade)	获取价格
C2220C106J2RACTU	KEMET	X7R Dielectric, 6.3 - 250 VDC (Commercial Grade)	获取价格
C2220C106J3RACTU	KEMET	X7R Dielectric, 6.3 â 250 VDC (Commercial Grade)	获取价格
C2220C106J4RACTU	KEMET	X7R Dielectric, 6.3 â 250 VDC (Commercial Grade)	获取价格
C2220C106J5RACTU	KEMET	X7R Dielectric, 6.3 - 250 VDC (Commercial Grade)	获取价格
C2220C106J6RACTU	KEMET	X7R Dielectric, 6.3 - 250 VDC (Commercial Grade)	获取价格
C2220C106J8RACTU	KEMET	X7R Dielectric, 6.3 â 250 VDC (Commercial Grade)	获取价格

C2220C105MARACTM

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