T502B685K035AG6210_技术文档

Tantalum Surface Mount Capacitors – High Temperature

T502 Series MnO₂230°C

Overview

The KEMET T502 Series is a high temperature product

that offers optimum performance characteristics in

applicationsꢀwithꢀoperatingꢀtemperaturesꢀupꢀtoꢀ230°C.ꢀ

Thisꢀseriesꢀisꢀclassiﬁedꢀasꢀmoistureꢀsensitivityꢀlevelꢀ(MSL)ꢀ

1ꢀunderꢀJꢀSTDꢀ020:ꢀunlimitedꢀﬂoorꢀlifeꢀtimeꢀatꢀ≤ꢀ30°C/85%ꢀ

RH.

Due to the potential use of high melting point solders, KEMET

has taken the initiative to package this series in moisture

barrier bags with desiccant and a humidity indicator card.

Beneﬁts

• F-Tech and 100% SBDS (KEMET's patented Simulated

Breakdown Voltage Screening)

• 3 Sigma Screening for iL, DF and ESR

•ꢀ Qualiﬁedꢀatꢀ1,000ꢀhoursꢀofꢀlifeꢀtestꢀatꢀ230°Cꢀatꢀ0.33ꢀVr

•ꢀ Voltageꢀderatingꢀofꢀ67%ꢀatꢀ230°C

• Unique high temperature material set

• Meets or exceeds EIA standard 535BAAC

• Standard gold-plated terminations

• RoHS compliant

•ꢀ Operatingꢀtemperatureꢀrangeꢀofꢀ−55ºCꢀtoꢀ+230ºC

• Voltage derating applies

• Taped and reeled per EIA 481

• Meets MSL 1 requirements for Pb-free assembly according

to JEDEC J–STD–020

Click image above for interactive 3D content

Open PDF in Adobe Reader for full functionality

• Packaged in moisture barrier bags with desiccant and a

humidity indicator card

• Surge current options available

Applications

Typicalꢀapplicationsꢀincludeꢀdecouplingꢀandꢀﬁlteringꢀforꢀveryꢀhighꢀtemperatureꢀenvironmentsꢀsuchꢀasꢀmeasurement-while-

drilling (MWD) in down-hole applications.

K-SIM

Forꢀaꢀdetailedꢀanalysisꢀofꢀspeciﬁcꢀpartꢀnumbers,ꢀpleaseꢀvisitꢀksim.kemet.comꢀtoꢀaccessꢀKEMET’sꢀK-SIMꢀsoftware.ꢀKEMETꢀ

K-SIM is designed to simulate behavior of components with respect to frequency, ambient temperature, and DC bias levels.

One world. One KEMET

1

T2075_T502 • 10/21/2016

Tantalum Surface Mount Capacitors – High Temperature

T502 Series MnO₂230°C

Ordering Information

T

502

Series

High

D

685

M

035

Rated

Voltage

(VDC)

A

G

61

10

Capacitor

Class

Case Capacitance Code Capacitance

Size

Termination

Finish

Failure Rate/

Design

Performance

ESR

(pF)

Tolerance

T =

B

D

First two digits K = ±10%

represent

signiﬁcantꢀ

016 = 16

025 = 25

035 = 35

A = N/A

G = Gold 61 = Surge None

plated

10 =

Standard

ESR

Tantalum Temperature

M = ±20%

62ꢀ=ꢀSurgeꢀatꢀ25°Cꢀ

63ꢀ=ꢀSurgeꢀ−55°Cꢀandꢀ+85°C

230°C

ﬁgures.ꢀThirdꢀ

digitꢀspeciﬁesꢀ

number of zeros.

Performance Characteristics

Item

Performance Characteristics

Operating Temperature

Rated Capacitance Range

Capacitance Tolerance

Rated Voltage Range

DF (120 Hz)

−55°Cꢀtoꢀ230°C

6.8ꢀ–ꢀ10ꢀµFꢀatꢀ120ꢀHz/25°C

K Tolerance (10%), M Tolerance (20%)

16 – 35 V

ReferꢀtoꢀPartꢀNumberꢀElectricalꢀSpeciﬁcationꢀTableꢀ

ꢀ≤ꢀ0.01ꢀCVꢀ(µA)ꢀatꢀratedꢀvoltageꢀafterꢀ5ꢀminutes

ESR (100 kHz)

Leakage Current

2

T2075_T502 • 10/21/2016

Tantalum Surface Mount Capacitors – High Temperature

T502 Series MnO₂230°C

Qualiﬁcation

Test

Condition

Characteristics

Within ±10% of initial value

Within 1.5 x initial limits

1 mAmp maximum

ΔꢀC/C

DF

Endurance

Storage Life

230°Cꢀatꢀ1/3ꢀratedꢀvoltage,ꢀ1,000ꢀhours

DCL

ESR

ΔꢀC/C

DF

Within 2.0 x initial limits

Within ±10% of initial value

Within 1.5 x initial limits

1 mAmp maximum

230°Cꢀatꢀ0ꢀvolts,ꢀ1,000ꢀhours

DCL

ESR

ΔꢀC/C

DF

Within 2.0 x initial limits

Within ±10% of initial value

Within initial limits

Humidity

85°C,ꢀ85%ꢀRH,ꢀ0ꢀV,ꢀ500ꢀhours

DCL

ESR

+25°C

IL*

Within initial limits

−55°C

±10%

IL

+85°C

±10%

+150°C

±20%

Extreme temperature exposure at a

successionꢀofꢀcontinuousꢀstepsꢀatꢀ+25°C,ꢀ

−55°C,ꢀ+25°C,ꢀ+85°C,ꢀ+150°C,ꢀ+25°C

ΔꢀC/C

DF

Temperature Stability

IL

1.5 x IL

10 x IL

1.5 x IL

12 x IL

DCL

IL

N/A

ΔꢀC/C

DF

Within ±10 of initial value

Within initial limits

MIL–STD–202, Method 213, Condition I, 100 G peak

MIL–STD–202, Method 204, 10 Hz to 2,000 Hz, 5G's for

20 minutes, 12 cycles each of 3 orientations

Mechanical Shock/

Vibration

DCL

Within initial limits

*IL = Initial limit

3

T2075_T502 • 10/21/2016

Tantalum Surface Mount Capacitors – High Temperature

T502 Series MnO₂230°C

Electrical Characteristics

Impedance & ESR vs. Frequency

ꢀꢁ000

502ꢃꢄꢅ5ꢆ035ꢇꢈMꢉ

502ꢃꢄꢅ5ꢆ035ꢇꢊSꢋ

502ꢌꢀ0ꢄꢆ0ꢀꢄꢇꢈMꢉ

502ꢌꢀ0ꢄꢆ0ꢀꢄꢇꢊSꢋ

ꢀ00

ꢀ0

ꢀ

0ꢂꢀ

ꢀ00

ꢀꢁ000

ꢀ0ꢁ000

ꢀ00ꢁ000

ꢀꢁ000ꢁ000

ꢀ0ꢁ000ꢁ000

Freꢊꢋeꢂꢃꢌ ꢆꢍꢎꢉ

The measurements were taken at room temperature (25°C)

Capacitance vs. Frequency

ꢀ00

ꢀ0

502ꢃꢄꢅ5ꢆ035ꢇCꢈꢉꢊꢋꢌꢍ

502ꢎꢀ0ꢄꢆ0ꢀꢄꢇCꢈꢉꢊꢋꢌꢍ

ꢀ

0ꢁꢀ

ꢀ00

ꢀꢂ000

ꢀ0ꢂ000

ꢀ00ꢂ000

ꢀꢂ000ꢂ000

ꢀ0ꢂ000ꢂ000

Freꢅꢆeꢂꢀꢇ ꢃꢈꢉꢄ

The measurements were taken at room temperature (25°C)

4

T2075_T502 • 10/21/2016

Tantalum Surface Mount Capacitors – High Temperature

T502 Series MnO₂230°C

Dimensions – Millimeters

CꢅTHOꢊꢄ ꢎꢑꢐ ꢄꢍꢊ ꢋꢉꢄꢌ

ꢌ

Sꢉꢊꢄ ꢋꢉꢄꢌ

ꢅꢍOꢊꢄ ꢎꢏꢐ ꢄꢍꢊ ꢋꢉꢄꢌ

ꢁOTTOM ꢋꢉꢄꢌ

ꢅ

ꢁ

H

ꢄ

ꢃ

ꢈ

Termination cutout

at ꢒꢄMꢄTꢓs optionꢔ

either enꢕ

ꢀ

T

S

ꢂ

S

ꢇ

ꢆ

Total

Weight

Case Size

Component

KEMET EIA

L

W

H

F

S

B (Ref)

X (Ref) P (Ref) R (Ref) T (Ref) A (Min) (mg)

3.5 ±0.2

2.8±0.2

1.9±0.2

2.2±0.1

0.80+0.1/−0.3

0.4±0.15

0.10±0.10

0.5

1.0

0.13

1.9

3528-21

63

B

(0.138 ±0.008) (0.110±0.008) (0.075±0.008) (0.087±0.004) (0.032+0.004/−0.011) (0.016±0.006) (0.004±0.004) (0.020) (0.039) (0.005) (0.075)

7.3 ±0.3

4.3±0.3

2.8±0.3

2.4±0.1

1.3±0.3

(0.051 ±0.012)

0.5±0.15

0.10±0.10

0.9

1.0

0.13

3.8

7343-31

292

D

(0.287 ±0.012) (0.169±0.012) (0.110±0.012) (0.094±0.004)

(0.020±0.006) (0.004±0.004) (0.035) (0.039) (0.005) (0.150)

Notes: (Ref) – Dimensions provided for reference only.

These weights are provided as reference. If exact weights are needed, please contact your KEMET Sales Representative

Table 1 – Ratings & Part Number Reference

Maximum

Operating

Temp

Maximum

Allowable

Ripple Current

Rated

Voltage

Rated Case Code/

DC

Leakage

KEMET Part Number

DF

ESR

Cap

Case Size

µA at 25°C Max/5

Minutes

% at 25°C

120 Hz Max

Ω at 25°C

100 kHz Max

VDC at 85°C

µF

KEMET/EIA

(See below for part options)

mA at +45°C 100 kHz

°C

230

16

25

35

10

B/3528-21

D/7343-31

T502B106(1)016AG(2)10

T502D106(1)025AG(2)10

T502D685(1)035AG(2)10

1.6

2.5

2.4

6

2.8

1.8

174

289

230

6.8

(1) To complete KEMET part number, insert M for ±20% or K for ±10%. Designates capacitance tolerance.

(2) To complete KEMET part number, insert 61 = None, 62 = 10 cycles +25°C, 63 = 10 cycles −55°C +85°C Designates surge current option.

Refer to Ordering Information for additional detail.

5

T2075_T502 • 10/21/2016

Tantalum Surface Mount Capacitors – High Temperature

T502 Series MnO₂230°C

Recommended Voltage Derating Guidelines

ꢃ0ꢀ

50ꢀ

ꢂ0ꢀ

33ꢀ

30ꢀ

20ꢀ

ꢁ0ꢀ

0ꢀ

−55

25

ꢄ5

ꢁ25

ꢁꢅ5

200

2ꢁ5

230

Teꢆperaꢂꢇre ꢈꢉCꢊ

Working Voltage

Rated

Voltage

25°C

85°C

125°C

200°C

215°C

230°C

16

25

35

16

25

35

16

25

35

13.1

20.5

28.7

7.5

6.4

10

5.3

8.3

11.8

16.5

14

11.6

Note: Additional reliability can be obtained through the derating of voltage

Ripple Current/Ripple Voltage

Permissible AC ripple voltage and current are related to

equivalent series resistance (ESR) and the power dissipation

capabilities of the device. Permissible AC ripple voltage

which may be applied is limited by two criteria:

1. The positive peak AC voltage plus the DC bias voltage,

if any, must not exceed the DC voltage rating of the

capacitor.

2. The negative peak AC voltage in combination with

bias voltage, if any, must not exceed the allowable limits

speciﬁedꢀforꢀreverseꢀvoltage.ꢀSeeꢀtheꢀReverseꢀVoltageꢀ

section for allowable limits.

The maximum power dissipation by case size can be

determined using the table at right. The maximum power

dissipation rating stated in the table must be reduced with

increasing environmental operating temperatures. Refer to

the table below for temperature compensation requirements.

Maximum Power

Dissipation (P max)

mWatts at 25°C

w/+20°C Rise

85

KEMET

Case Code

EIA

Case Code

B

D

3528–21

7343–31

150

The maximum power dissipation rating must be reduced with increasing

environmental operating temperatures. Refer to the Temperature

Compensation Multiplier table for details.

Using the P max of the device, the maximum allowable rms

ripple current or voltage may be determined.

I(max) = √P max/R

E(max) = Z √P max/R

I = rms ripple current (amperes)

E = rms ripple voltage (volts)

P max = maximum power dissipation (watts)

R = ESR at speciﬁed frequency (ohms)

Z = Impedance at speciﬁed frequency (ohms)

Temperature Compensation Multipliers

for Maximum Ripple Current

Tꢀ≤ꢀ200°C

200ꢀ≥ꢀ220°C

220ꢀ≥ꢀ230°C

1.00

0.70

0.30

T = Environmental Temperature

6

T2075_T502 • 10/21/2016

Tantalum Surface Mount Capacitors – High Temperature

T502 Series MnO₂230°C

Reverse Voltage

Solid tantalum capacitors are polar devices and may be permanently damaged or destroyed if connected with the wrong

polarity.ꢀTheꢀpositiveꢀterminalꢀisꢀidentiﬁedꢀonꢀtheꢀcapacitorꢀbodyꢀbyꢀaꢀstripe,ꢀplusꢀinꢀsomeꢀcasesꢀaꢀbeveledꢀedge.ꢀAꢀsmallꢀ

degree of transient reverse voltage is permissible for short periods per the below table. The capacitors should not be

operated continuously in reverse mode, even within these limits.

Temperature

Permissible Transient Reverse Voltage

25°C

85°C

15% of Rated Voltage

5% of Rated Voltage

1% of Rated Voltage

125°C

Table 2 – Land Dimensions/Courtyard

Metric

Size

Code

Density Level A:

Maximum (Most) Land

Protrusion (mm)

Density Level B:

Median (Nominal) Land

Protrusion (mm)

Density Level C:

Minimum (Least) Land

Protrusion (mm)

KEMET

Case

EIA

W

L

S

V1

V2

W

L

S

V1

V2

W

L

S

V1

V2

B

3528–21 2.35

7343–31 2.55

2.21

0.92

6.32

4.00

2.23

1.80

1.12

5.22

3.50

2.13

1.42

1.28

4.36

3.24

D

2.77

3.67 10.22 5.60

2.43

2.37

3.87

9.12

5.10

2.33

1.99

4.03

8.26

4.84

Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reﬂow

solder processes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reﬂow solder processes.

Density Level C: For high component desity product applications. Before adapting the minimum land pattern variations the user should perform

qualiﬁcation testing based on the conditions outlined in IPC standard 7351 (IPC–7351).

¹Height of these chips may create problems in wave soldering.

²Land pattern geometry is too small for silkscreen outline.

ꢂꢃ

ꢀ

ꢂ2

ꢁ

S

ꢄriꢅ ꢆlacement Courtꢇarꢅ

7

T2075_T502 • 10/21/2016

Tantalum Surface Mount Capacitors – High Temperature

T502 Series MnO₂230°C

Soldering Process

KEMET’sꢀfamiliesꢀofꢀsurfaceꢀmountꢀcapacitorsꢀareꢀ

compatible with wave (single or dual), convection, IR,

orꢀvaporꢀphaseꢀreﬂowꢀtechniques.ꢀPreheatingꢀofꢀtheseꢀ

components is recommended to avoid extreme thermal

stress.ꢀKEMET'sꢀrecommendedꢀproﬁleꢀconditionsꢀforꢀ

convectionꢀandꢀIRꢀreﬂowꢀreﬂectꢀtheꢀproﬁleꢀconditionsꢀofꢀtheꢀ

IPC/J–STD–020D standard for moisture sensitivity testing.

The devices can safely withstand a maximum of three

reﬂowꢀpassesꢀatꢀtheseꢀconditions.

Proﬁle Feature

Preheat/Soak

SnPb Assembly Pb-Free Assembly

Temperature Minimum (T_Smin

)

100°C

150°C

200°C

Temperature Maximum (T_Smax

)

Time (t_s) from T_sminto T_smax

Ramp-up Rate (T_Lto T_P)

)

60 – 120 seconds

3°C/secondsꢀmaximum 3°C/secondsꢀmaximum

Liquidous Temperature (T_L)

Time Above Liquidous (t_L)

183°C

217°C

60 – 150 seconds

220°C*ꢀ

235°C**

250°C*

260°C**

Peak Temperature (T_P)

Timeꢀwithinꢀ5°CꢀofꢀMaximum

20 seconds maximum 30 seconds maximum

Note that although the X/7343–43 case size can withstand

waveꢀsoldering,ꢀtheꢀtallꢀproﬁleꢀ(4.3ꢀmmꢀmaximum)ꢀdictatesꢀ

care in wave process development.

Peak Temperature (t_P)

Ramp-down Rate (T_Pto T_L) 6°C/secondsꢀmaximum 6°C/secondsꢀmaximum

Timeꢀ25°CꢀtoꢀPeakꢀ

Temperature

6 minutes maximum

8 minutes maximum

Note: All temperatures refer to the center of the package, measured on

the package body surface that is facing up during assembly reﬂow.

*Case Size D, E, P, Y, and X

Hand soldering should be performed with care due to the

difﬁcultyꢀinꢀprocessꢀcontrol.ꢀIfꢀperformed,ꢀcareꢀshouldꢀbeꢀ

taken to avoid contact of the soldering iron to the molded

case. The iron should be used to heat the solder pad,

applying solder between the pad and the termination, until

reﬂowꢀoccurs.ꢀOnceꢀreﬂowꢀoccurs,ꢀtheꢀironꢀshouldꢀbeꢀ

removed immediately. “Wiping” the edges of a chip and

heating the top surface is not recommended.

**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W, and Z

T_ꢂ

t_ꢂ

Maꢀimum ꢃamp ꢄp ꢃate ꢅ 3ꢆCꢇsec

Maꢀimum ꢃamp ꢈoꢉn ꢃate ꢅ ꢊꢆCꢇsec

T_ꢁ

t_ꢁ

T_smaꢀ

T_smin

t_s

25

25ꢆC to ꢂeaꢋ

Tiꢀe

Storage

Tantalum chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in

other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,

and long term storage. In addition, packaging materials will be degraded by high temperature reels may soften or warp and

tapeꢀpeelꢀforceꢀmayꢀincrease.ꢀKEMETꢀrecommendsꢀthatꢀmaximumꢀstorageꢀtemperatureꢀnotꢀexceedꢀ40ºCꢀandꢀmaximumꢀ

storageꢀhumidityꢀnotꢀexceedꢀ60%ꢀrelativeꢀhumidity.ꢀTemperatureꢀﬂuctuationsꢀshouldꢀbeꢀminimizedꢀtoꢀavoidꢀcondensationꢀ

on the parts and atmospheres should be free of chlorine and sulphur bearing compounds. For optimized solderability chip

stock should be used promptly, preferably within three years of receipt.

8

T2075_T502 • 10/21/2016

Tantalum Surface Mount Capacitors – High Temperature

T502 Series MnO₂230°C

Construction

Molꢁeꢁ ꢇpoꢈꢉ

Case

ꢊolaritꢉ Stripe ꢂꢄꢃ

Deꢀaiꢁeꢂ Crꢃꢄꢄ Seꢅꢀiꢃꢆ

ꢑicꢒel ꢊlating

ꢂꢏourth ꢀaꢉerꢃ

ꢊolaritꢉ

ꢋeꢌel ꢂꢄꢃ

Tantalum ꢆire

ꢀeaꢁframe

ꢂ− Cathoꢁeꢃ

ꢆasher

Tantalum ꢆire

ꢆelꢁ

ꢂto attach ꢍireꢃ

Carꢐon

ꢂThirꢁ ꢀaꢉerꢃ

ꢆasher

TꢀꢊS

Ta₂O₅ꢎielectric

ꢂꢏirst ꢀaꢉerꢃ

MnO₂

ꢂSeconꢁ ꢀaꢉerꢃ

ꢀeaꢁframe

ꢂꢄ ꢅnoꢁeꢃ

Molꢁeꢁ ꢇpoꢈꢉ

Case

Tantalum

Capacitor Marking

Date Code *

1^stdigit = Last number of Year

5 = 2015

ꢀꢁMꢁT High

Temperature

MnO₂

ꢂolaritꢃ

6 = 2016

7 = 2017

8 = 2018

9 = 2019

ꢄnꢅicator ꢆꢇꢈ

ꢂicofaraꢅ

Coꢅe

2^ndand 3^rddigit = Week of the

Year

01 = 1^stweek of the Year to

52 = 52^ndweek of the Year

ꢀꢁMꢁT

ꢄꢋ

ꢉateꢅ

ꢊoltage

ꢋate

Coꢅeꢌ

ꢌ 5ꢍ0 ꢎ ꢍ0^thꢏeeꢐ of 20ꢑ5

9

T2075_T502 • 10/21/2016

Tantalum Surface Mount Capacitors – High Temperature

T502 Series MnO₂230°C

Tape & Reel Packaging Information

KEMET’sꢀmoldedꢀchipꢀcapacitorꢀfamiliesꢀareꢀpackagedꢀinꢀ8ꢀandꢀ12ꢀmmꢀplasticꢀtapeꢀonꢀ7"ꢀandꢀ13"ꢀreelsꢀinꢀaccordanceꢀwithꢀ

EIA Standard 481: Embossed Carrier Taping of Surface Mount Components for Automatic Handling. This packaging system

is compatible with all tape-fed automatic pick-and-place systems.

8 mm (0.315")

or

12 mm (0.472")

180 mm (7.0")

Top Tape Thickness

or

0.10 mm (0.004")

330 mm (13.0")

Maximum Thickness

Table 3 – Packaging Quantity

Tape Width

Case Code

7" Reel* 13" Reel*

(mm)

KEMET

EIA

S

T

M

U

L

W

Z

V

A

B

C

D

Q

Y

3216-12

3528-12

3528-15

6032-15

6032-19

7343-15

7343-17

7343-20

3216-18

3528-21

6032-28

7343-31

7343-12

7343-40

7343-43

7360-38

7360-20

8

12

8

2,500

2,000

1,000

2,000

500

1,000

500

10,000

8,000

5,000

3,000

9,000

8,000

3,000

2,500

3,000

2,000

2,500

8

12

X

E/T428P

H

1,000

* No C-Spec required for 7" reel packaging. C-7280 required for 13" reel packaging.

10

T2075_T502 • 10/21/2016

Tantalum Surface Mount Capacitors – High Temperature

T502 Series MnO₂230°C

Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

T

ꢀ 2

ꢓꢉ0 pitches cumulatiꢄe

tolerance on tape ꢔ 0ꢕ2 mmꢖ

2

ꢏ

ꢉ

ꢀo

ꢍꢎo

ꢆo

ꢁ

ꢈo

ꢂ

ꢏ

2

ꢇ

ꢉ

ꢇo

S

ꢉ

ꢀ

ꢉ

T

ꢉ

ꢏmꢌossment

ꢁor caꢄitꢅ siꢐeꢋ

see ꢑote ꢉ Taꢌle ꢒ

Center ꢃines of Caꢄitꢅ

ꢍꢎ

ꢉ

Coꢄer Tape

is for tape feeꢊer reference onlꢅꢋ

incluꢊing ꢊraft concentric aꢌout ꢇ

ꢇ

ꢉ

o

.

ꢀꢁer Direꢂꢃiꢄꢅ ꢄꢆ ꢀꢅreeꢇiꢅg

Table 4 – Embossed (Plastic) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

D₁Minimum

Note 1

1.0

R Reference S₁Minimum

T₁

Tape Size

D₀

E₁

P₀

P₂

T Maximum

Note 2

25.0

Note 3

Maximum

8 mm

12 mm

16 mm

2.0±0.05

(0.079±0.002)

(0.039)

(0.984)

1.5+0.10/−0.0ꢀ

(0.059+0.004/−0.0)

1.75±0.10

(0.069±0.004) (0.157±0.004)

4.0±0.10

0.600

(0.024)

0.100

(0.004)

1.5

(0.059)

30

(0.024)

2.0±0.1

(0.079±0.059)

(1.181)

Variable Dimensions — Millimeters (Inches)

B₁Maximum

Note 4

Tape Size

8 mm

Pitch

E₂Minimum

F

P₁

T₂Maximum W Maximum A₀, B₀& K₀

4.35

(0.171)

6.25

(0.246)

3.5±0.05

2.0±0.05 or 4.0±0.10

2.5

8.3

(0.327)

Single (4 mm)

(0.138±0.002) (0.079±0.002 or 0.157±0.004)

(0.098)

Single (4 mm)

& Double (8

mm)

2.0±0.05 (0.079±0.002) or

8.2

(0.323)

10.25

(0.404)

5.5±0.05

4.6

(0.181)

12.3

(0.484)

12 mm

16 mm

4.0±0.10 (0.157±0.004) or

(0.217±0.002)

Note 5

8.0±0.10 (0.315 ±0.004)

12.1

(0.476)

14.25

(0.561)

7.5±0.10

4.0±0.10 (0.157±0.004)

(0.295±0.004) to 12.0±0.10 (0.472±0.004)

16.3

(0.642)

Triple (12 mm)

8.0 (0.315)

1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment

location and hole location shall be applied independent of each other.

2. The tape, with or without components, shall pass around R without damage (see Figure 4).

3. If S₁< 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481–D, paragraph 4.3, section b).

4. B₁dimension is a reference dimension for tape feeder clearance only.

5. The cavity deﬁned by A₀, B₀and K₀shall surround the component with sufﬁcient clearance that:

(a) the component does not protrude above the top surface of the carrier tape.

(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 2).

(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 mm and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see

Figure 3).

(e) see Addendum in EIA Standard 481–D for standards relating to more precise taping requirements.

11

T2075_T502 • 10/21/2016

Tantalum Surface Mount Capacitors – High Temperature

T502 Series MnO₂230°C

Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 Kg minimum.

2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

Tape Width

8 mm

Peel Strength

0.1 to 1.0 Newton (10 to 100 gf)

0.1 to 1.3 Newton (10 to 130 gf)

12 and 16 mm

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be

165°ꢀtoꢀ180°ꢀfromꢀtheꢀplaneꢀofꢀtheꢀcarrierꢀtape.ꢀDuringꢀpeeling,ꢀtheꢀcarrierꢀand/orꢀcoverꢀtapeꢀshallꢀbeꢀpulledꢀatꢀaꢀvelocityꢀofꢀ

300 ±10 mm/minute.

3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA

Standards 556 and 624.

Figure 2 – Maximum Component Rotation

°

T

ꢀaꢁiꢂꢃꢂ Cꢄꢂpꢄꢅeꢅꢆ ꢇꢄꢆaꢆiꢄꢅ

Tꢄp View

ꢀaꢁiꢂꢃꢂ Cꢄꢂpꢄꢅeꢅꢆ ꢇꢄꢆaꢆiꢄꢅ

Siꢈe View

Tꢇpical ꢈocꢉet Centerline

Tape

ꢀaꢁiꢂꢃꢂ

°

T

s

Wiꢈꢆꢉ ꢊꢂꢂꢋ ꢇꢄꢆaꢆiꢄꢅ ꢊ

)

ꢂꢃꢄ2

ꢄꢅ – 200

20

ꢄ0

ꢁo

Tape

ꢀaꢁiꢂꢃꢂ

°

S

Wiꢈꢆꢉ ꢊꢂꢂꢋ ꢇꢄꢆaꢆiꢄꢅ ꢊ

)

ꢂꢃꢄ2

ꢄꢅ – 5ꢅ

ꢆ2 – 200

20

ꢄ0

5

Tꢇpical Component Centerline

ꢀo

Figure 4 – Bending Radius

Figure 3 – Maximum Lateral Movement

ꢃmꢄosseꢂ

Carrier

ꢅuncheꢂ

Carrier

ꢂ mm ꢃ ꢄ2 mm Tape

ꢄꢅ mm Tape

0ꢀ5 mm maꢁimum

ꢄꢀ0 mm maꢁimum

ꢀ

ꢁenꢂing

ꢀaꢂius

ꢀ

12

T2075_T502 • 10/21/2016

Tantalum Surface Mount Capacitors – High Temperature

T502 Series MnO₂230°C

Figure 5 – Reel Dimensions

ꢅull ꢆaꢇiusꢈ

See ꢃote

ꢓ3 ꢂꢍncluꢇes

flange ꢇistortion

at outer eꢇgeꢄ

ꢀccess Hole at

Slot ꢊocation

ꢂꢋ ꢌ0 mm minimumꢄ

ꢓ2 ꢂMeasureꢇ at huꢔꢄ

ꢁ

ꢂSee ꢃoteꢄ

ꢀ

ꢃ

C

ꢂꢀrꢔor hole

ꢓꢒ ꢂMeasureꢇ at huꢔꢄ

ꢇiameterꢄ

ꢍf presentꢈ

tape slot in core

for tape startꢎ

2ꢏ5 mm minimum ꢐiꢇth ꢑ

ꢒ0ꢏ0 mm minimum ꢇepth

ꢉ

ꢂsee ꢃoteꢄ

ꢃoteꢎ ꢁriꢕe spoꢖes optionalꢗ if useꢇꢈ ꢇimensions ꢉ anꢇ ꢁ shall applꢘꢏ

Table 5 – Reel Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size

8 mm

A

B Minimum

C

D Minimum

178±0.20

(7.008±0.008)

or

330±0.20

(13.000±0.008)

1.5

(0.059)

13.0+0.5/−0.2ꢀ

(0.521+0.02/−0.008)

20.2

(0.795)

12 mm

16 mm

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

N Minimum

W₁

W₂Maximum

W₃

8.4+1.5/−0.0

(0.331+0.059/−0.0)

12.4+2.0/−0.0

(0.488+0.078/−0.0)ꢀꢀ

16.4+2.0/−0.0

14.4

(0.567)

18.4

(0.724)

22.4

50

(1.969)

Shall accommodate tape

width without interference

12 mm

16 mm

(0.646+0.078/−0.0)

(0.882)

13

T2075_T502 • 10/21/2016

Tantalum Surface Mount Capacitors – High Temperature

T502 Series MnO₂230°C

Figure 6 – Tape Leader & Trailer Dimensions

ꢅmꢎosseꢃ Carrier

Carrier Tape

ꢊuncheꢃ Carrier

ꢋ mm ꢌ ꢀ2 mm onlꢍ

ꢂounꢃ Sprocꢄet Holes

STAꢁT

EꢀD

Top Coꢉer Tape

ꢅlongateꢃ Sprocꢄet Holes

ꢆ32 mm tape anꢃ ꢇiꢃerꢈ

ꢀ00 mm

Minimum ꢏeaꢃer

ꢐ00 mm Minimum

Trailer

Components

ꢀꢁ0 mm Minimum

Top Coꢉer Tape

Figure 7 – Maximum Camber

ꢆlongateꢁ sprocꢂet holes

ꢇ32 mm ꢈ ꢉiꢁer tapesꢊ

Carrier Tape

ꢀounꢁ Sprocꢂet Holes

ꢃ mm Maꢄimumꢅ either ꢁirection

Straight ꢆꢁge

250 mm

14

T2075_T502 • 10/21/2016

Tantalum Surface Mount Capacitors – High Temperature

T502 Series MnO₂230°C

KEMET Electronic Corporation Sales Ofﬁces

Forꢀaꢀcompleteꢀlistꢀofꢀourꢀglobalꢀsalesꢀof ꢀces,ꢀpleaseꢀvisitꢀwww.kemet.com/sales.

Disclaimer

Allꢀproductꢀspeci ꢀcations,ꢀstatements,ꢀinformationꢀandꢀdataꢀ(collectively,ꢀtheꢀ“Information”)ꢀinꢀthisꢀdatasheetꢀareꢀsubjectꢀtoꢀchange.ꢀTheꢀcustomerꢀisꢀresponsibleꢀforꢀ

checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.

All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.

StatementsꢀofꢀsuitabilityꢀforꢀcertainꢀapplicationsꢀareꢀbasedꢀonꢀKEMETꢀElectronicsꢀCorporation’sꢀ(“KEMET”)ꢀknowledgeꢀofꢀtypicalꢀoperatingꢀconditionsꢀforꢀsuchꢀ

applications,ꢀbutꢀareꢀnotꢀintendedꢀtoꢀconstituteꢀ–ꢀandꢀKEMETꢀspeci ꢀcallyꢀdisclaimsꢀ–ꢀanyꢀwarrantyꢀconcerningꢀsuitabilityꢀforꢀaꢀspeci ꢀcꢀcustomerꢀapplicationꢀorꢀuse.ꢀ

The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any

technicalꢀadviceꢀinferredꢀfromꢀthisꢀInformationꢀorꢀotherwiseꢀprovidedꢀbyꢀKEMETꢀwithꢀreferenceꢀtoꢀtheꢀuseꢀofꢀKEMET’sꢀproductsꢀisꢀgivenꢀgratis,ꢀandꢀKEMETꢀassumesꢀnoꢀ

obligation or liability for the advice given or results obtained.

Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component

failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards

(suchꢀasꢀinstallationꢀofꢀprotectiveꢀcircuitryꢀorꢀredundancies)ꢀinꢀorderꢀtoꢀensureꢀthatꢀtheꢀfailureꢀofꢀanꢀelectricalꢀcomponentꢀdoesꢀnotꢀresultꢀinꢀaꢀriskꢀofꢀpersonalꢀinjuryꢀorꢀ

property damage.

Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other

measures may not be required.

KEMET is a registered trademark of KEMET Electronics Corporation.

15

T2075_T502 • 10/21/2016


型号：	T502B685K035AG6210
厂家：	KEMET CORPORATION
描述：	Tantalum Surface Mount Capacitors â High Temperature
文件：	总15页 (文件大小：1260K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

T502B685K035AG6210 [KEMET]

相关型号：

T502B685K035AG6310

T502B685M016AG6110

T502B685M016AG6210

T502B685M016AG6310

T502B685M025AG6110

T502B685M025AG6210

T502B685M025AG6310

T502B685M035AG6110

T502B685M035AG6210

T502B685M035AG6310

T502D685K016AG6110

T502D685K016AG6210