T513X687M006AC63107280

Tantalum Surface Mount Capacitors – High Reliability Commercial Off-the-Shelf (COTS)

T513 Multiple Anode Low ESR COTS MnO₂Series

Overview

The KEMET T513 Series is suitable for the Commercial Off-

the-Shelf (COTS) requirements of industrial, telecom, defense

and aerospace markets. This surface mount series offers very

low ESR and surge robustness designed for applications that

require high surge current and high ripple current capability.

These beneﬁts are achieved via a multiple anode construction

similar to KEMET's T510 Series. The T513 COTS Series also

offers various options including Weibull Grading, termination ﬁnish

and surge current.

Beneﬁts

Applications

• Meets or exceeds EIA Standard 535BAAC

• Taped and reeled per EIA 481–1

• High surge current capability

• Termination options B, C, H, K, T

• High ripple current capability

The T513 Series is suitable for the industrial, telecom, defense

and aerospace markets. Typical applications include decoupling

and ﬁltering in radar, sonar, power supply, guidance systems and

other high reliability applications.

• Surge testing options

• 100% steady-state accelerated aging

• Capacitance values of 68 μF to 1,000 μF

• Tolerances of ±10% and ±20%

• Voltage rating of 4 – 25 VDC

• Case sizes E and X

• ESR as low as 12 mΩ

• RoHS Compliant and lead-free terminations

• Operating temperature range of -55˚C to +125˚C

Environmental Compliance

RoHS Compliant (6/6) according to Directive 2002/95/EC when ordered with 100% Sn solder.

SPICE

For a detailed analysis of speciﬁc part numbers, please visit www.kemet.com for a free download of KEMET's SPICE software.

The KEMET SPICE program is freeware intended to aid design engineers in analyzing the performance of these capacitors over

frequency, temperature, ripple, and DC bias conditions.

One world. One KEMET

T2049_T513 • 12/14/2012

1

Tantalum Surface Mount Capacitors – High Reliability Commercial Off-the-Shelf (COTS)

T513 Multiple Anode Low ESR COTS MnO₂Series

Ordering Information

T

513

X

108

K

004

B

H

61

10

Capacitor

Class

Case

Size

Capacitance

Code (pF)

Capacitance

Tolerance

Failure Rate/

Design

Series

Voltage

Lead Material

Surge

ESR

T =

Tantalum

Multiple

Anode

COTS

E, X

First two digits

represent

signiﬁcant

ﬁgures. Third

digit speciﬁes

number of zeros.

K = ±10% 004 = 4 V

M = ±20% 006 = 6.3 V B = 0.1%/1,000 Dipped

A = N/A

C = Hot Solder

61 = None

62 = 10 cycles, 25°C ESR

after Weibull

63 = 10 cycles, -55°C 30 = Ultra Low

& 85°C after Weibull ESR

64 = 10 cycles,

10 = Standard

010 = 10 V

016 = 16 V

020 = 20 V

025 = 25 V

hours

H = Standard

Solder Coated

(SnPb 5% Pb

minimum)

20 = Low ESR

B = Gold Plated

-55°C & 85°C before

K = Solder Fused Weibull

T = 100% Tin

Performance Characteristics

Item

Performance Characteristics

Operating Temperature

Rated Capacitance Range

Capacitance Tolerance

Rated Voltage Range

DF (120 Hz)

-55°C to 125°C

68 – 1,000 μF @ 120 Hz/25°C

K Tolerance (10%), M Tolerance (20%)

4 – 25 VDC

Refer to Part Number Electrical Speciﬁcation Table

≤ 0.01 CV (μA) at rated voltage after 5 minutes

ESR (100 kHz)

Leakage Current

T2049_T513 • 12/14/2012

2

Tantalum Surface Mount Capacitors – High Reliability Commercial Off-the-Shelf (COTS)

T513 Multiple Anode Low ESR COTS MnO₂Series

Qualiﬁcation

Test

Condition

Characteristics

Within ±10% of initial value

Within initial limits

Δ C/C

DF

85°C @ rated voltage, 2,000 hours

125°C @ 2/3 rated voltage, 2,000 hours

Endurance

DCL

ESR

Δ C/C

DF

Within 1.25 x initial limit

Within initial limits

Within ±10% of initial value

Within initial limits

Storage Life

125°C @ 0 volts, 2,000 hours

DCL

ESR

Δ C/C

DF

Within 1.25 x initial limit

Within initial limits

Within ±5% of initial value

Within initial limits

MIL–STD–202, Method 107, Condition B, mounted, -55°C to

125°C, 1,000 cycles

Thermal Shock

DCL

ESR

+25°C

IL*

Within 1.25 x initial limit

Within initial limits

-55°C

±10%

IL

+85°C

±10%

+125°C

±20%

Extreme temperature exposure at a

Δ C/C

Temperature Stability

succession of continuous steps at +25°C,

DF

IL

1.5 x IL

10 x IL

1.5 x IL

12 x IL

-55°C, +25°C, +85°C, +125°C, +25°C

DCL

IL

n/a

Δ C/C

DF

Within ±5% of initial value

Within initial limits

25°C and 85°C, 1.32 x rated voltage 1,000 cycles

(125°C, 1.2 x rated voltage)

Surge Voltage

DCL

ESR

Δ C/C

DF

Within initial limits

Within ±10 of initial value

Within initial limits

MIL–STD–202, Method 213, Condition I, 100 G peak

MIL–STD–202, Method 204, Condition D, 10 Hz to 2,000 Hz,

20 G peak

Mechanical Shock/Vibration

DCL

Within initial limits

Additional Qualiﬁcation Tests

per MIL–PRF–55365/8

Please contact KEMET for more information.

*IL = Initial limit

T2049_T513 • 12/14/2012

3

Tantalum Surface Mount Capacitors – High Reliability Commercial Off-the-Shelf (COTS)

T513 Multiple Anode Low ESR COTS MnO₂Series

Dimensions – Millimeters (Inches)

Metric will govern

Termination

cutout at

KEMET’s

option,

either end

Case Size

Component

F* ±0.1 S* ±0.3 B* ±0.15

±(.004) ±(.012) (Ref) ±.006

KEMET EIA

L*

W*

H*

X (Ref)

P (Ref) R (Ref) T (Ref) A (Min) G (Ref) E (Ref)

7.3 ±0.3

4.3 ±0.3

4.0 ±0.3

0.10 ± 0.10

7343–43

7360–38

2.4 (.094) 1.3 (.051)

4.1 (.161) 1.3 (.051)

0.5 (.020)

1.7 (.067)

0.9 (.035)

1.0 (.039) 0.13 (.005) 3.8 (.150) 3.5 (.138) 3.5 (.138)

X

(0.287 ±0.012) (0.169 ±0.012) (0.157 ±0.012)

(.004 ± .004)

7.3 ±0.3

6.0 ±0.3

3.6 ±0.2

0.10 ± 0.10

(.004 ± .004)

E

(0.287 ±0.012) (0.236 ± .012) (0.142 ±0.008)

Notes: (Ref) – Dimensions provided for reference only. No dimensions are provided for B, P or R because low proﬁle cases do not have a bevel or a notch.

* MIL–C–55365/8 speciﬁed dimensions

Table 1 – Ratings & Part Number Reference

Rated

Voltage

Rated Case Code/

KEMET Part

Number

DC

Leakage

Standard

ESR

Ultra-low

ESR

DF

Low ESR

Cap

Case Size

(See below for

part options)

μA @ +20ºC

Max/5 Min

% @ +20ºC

120 Hz Max

mΩ @ +20ºC

100 kHz Max

mΩ @ +20ºC

100 kHz Max

mΩ @ +20ºC

100 kHz Max

VDC

µF

KEMET/EIA

4

680

1000

470

680

330

150

220

100

68

X/7343-43

E/7360-38

X/7343-43

E/7360-38

X/7343-43

E/7360-38

T513X687(1)004(2)(3)(4)(5)

T513X108(1)004(2)(3)(4)(5)

T513E108(1)004(2)(3)(4)(5)

T513X477(1)006(2)(3)(4)(5)

T513X687(1)006(2)(3)(4)(5)

T513E687(1)006(2)(3)(4)(5)

T513X337(1)010(2)(3)(4)(5)

T513X157(1)016(2)(3)(4)(5)

T513X227(1)016(2)(3)(4)(5)

T513X107(1)020(2)(3)(4)(5)

T513X686(1)025(2)(3)(4)(5)

T513E107(1)025(2)(3)(4)(5)

27.2

40.0

29.6

42.8

33.0

24.0

35.2

20.0

17.0

25.0

6.0

10.0

8.0

30

23

18

30

45

23

35

40

45

50

N/A

18

10

N/A

23

12

N/A

30

25

40

N/A

35

6.3

10

16

20

25

N/A

100

(See below for

part options)

μA @ +20ºC

Max/5 Min

% @ +20ºC

120 Hz Max

mΩ @ +20ºC

100 kHz Max

mΩ @ +20ºC

100 kHz Max

mΩ @ +20ºC

100 kHz Max

VDC

µF

KEMET/EIA

Rated

Cap

Case Code/

Case Size

X

DC

Leakage

Rated Voltage

KEMET Part Number

DF

Standard ESR

Low ESR

Ultra-low ESR

10

T

513

108

K

004

B

H

61

(1) To complete KEMET part number, insert M for ±20%, K for ±10%. Designates Capacitance tolerance.

(2) To complete KEMET part number, insert B (0.1%/1,000 hours), or A = N/A. Designates Reliability Level.

Class Size Code (pF) Tolerance Design

Capacitor Case Capacitance Capacitance Failure Rate/

Series

Voltage

Lead Material

Surge

ESR

(3) To complete KEMET part number, insert B = Gold Plated, C = Hot solder dipped, H = Solder Plated, K = Solder Fused or T = 100% Tin (Sn). Designates

T =

Tantalum

Multiple

Anode

COTS

E, X

First two digits

represent

signiﬁcant

ﬁgures. Third

digit speciﬁes

K = ±10% 004 = 4 V

M = ±20% 006 = 6.3 V B = 0.1%/1,000 Dipped

010 = 10 V hours H = Standard

A = N/A

C = Hot Solder

61 = None

62 = 10 cycles, 25°C ESR

after Weibull 20 = Low ESR

63 = 10 cycles, -55°C 30 = Ultra Low

& 85°C after Weibull ESR

10 = Standard

Termination Finish.

(4) To complete KEMET part number, insert 61 = None, 62 = 10 cycles +25°C, 63 = 10 cycles -55°C +85°C after Weibull or 64 = 10 cycles -55°C +85°C before

Weibull. Designates Surge current option.

(5) To complete KEMET part number, insert 10 = Standard ESR, 20 = Low ESR or 30 = Ultra Low ESR. Designates ESR option.

Refer to Ordering Information for additional detail.

016 = 16 V

020 = 20 V

Solder Coated

(SnPb 5% Pb

number of

zeros.

025 = 25 V

minimum)

64 = 10 cycles,

-55°C & 85°C before

B = Gold Plated

K = Solder Fused Weibull

T = 100% Tin

T2049_T513 • 12/14/2012

4

Roll Over for

Order Info.

Tantalum Surface Mount Capacitors – High Reliability Commercial Off-the-Shelf (COTS)

T513 Multiple Anode Low ESR COTS MnO₂Series

Recommended Voltage Derating Guidelines

120%

100%

80%

% Change in Working DC Voltage

with Temperature

67%

60%

Recommended Maximum

40%

Application Voltage (As %

of Rated Voltage)

33%

20%

0%

-55

25

85

125

Temperature (ºC)

Ripple Current/Ripple Voltage

Maximum Power

Dissipation (P max)

mWatts @ 25°C with

+20°C Rise

Temperature Compensation Multipliers

for Maximum Power Dissipation

Case Code

≤ 25°C

85°C

125°C

1.00

0.90

0.40

KEMET

EIA

T= Environmental Temperature

A

3216-18

3528-21

6032-28

7343-31

7343-43

7360-38

2012-12

3216-12

3528-12

6032-15

7343-20

7343-43

7260-38

75

85

B

Using the P max of the device, the maximum allowable rms

ripple current or voltage may be determined.

C

110

150

165

200

25

D

X

I(max) = √P max/R

E(max) = √P max R

E

*

R

I = rms ripple current (amperes)

E = rms ripple voltage (volts)

Pmax = maximum power dissipation (watts)

R = ESR at speciﬁed frequency (ohms)

S

T

60

70

U

90

V

125

270

285

T510X

T510E

T2049_T513 • 12/14/2012

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Tantalum Surface Mount Capacitors – High Reliability Commercial Off-the-Shelf (COTS)

T513 Multiple Anode Low ESR COTS MnO₂Series

Reverse Voltage

Solid tantalum capacitors are polar devices and may be permanently damaged or destroyed if connected with the wrong polarity. The

positive terminal is identiﬁed on the capacitor body by a stripe plus in some cases a beveled edge. A small degree of transient reverse

voltage is permissible for short periods per the table. The capacitors should not be operated continuously in reverse mode, even within

these limits.

Temperature

25°C

Permissible Transient Reverse Voltage

15% of Rated Voltage

85°C

5% of Rated Voltage

125°C

1% of Rated Voltage

Table 2 – Land Dimensions/Courtyard

Metric

Size

Code

Density Level A:

Maximum (Most) Land

Protrusion (mm)

Density Level B:

Median (Nominal) Land

Protrusion (mm)

Density Level C:

Minimum (Least) Land

Protrusion (mm)

KEMET

Case

EIA

X

Y

C

V1

V2

X

Y

C

V1

V2

X

Y

C

V1

V2

E¹

7360–38

4.25

2.65

3.20

10.10

7.20

4.15

2.25

3.30

9.40

6.70

4.05

1.85

3.00

8.10

6.40

X¹

7343–43

2.55

3.75

2.70

10.20

5.50

2.45

3.35

2.60

9.10

5.00

2.35

2.95

2.50

8.20

4.70

Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reﬂow solder processes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reﬂow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualiﬁcation

testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).

¹ Height of these chips may create problems in wave soldering.

T2049_T513 • 12/14/2012

6

Tantalum Surface Mount Capacitors – High Reliability Commercial Off-the-Shelf (COTS)

T513 Multiple Anode Low ESR COTS MnO₂Series

Soldering Process

KEMET’s families of surface mount capacitors are compatible

with wave (single or dual), convection, IR or vapor phase reﬂow

techniques. Preheating of these components is recommended

to avoid extreme thermal stress. KEMET's recommended proﬁle

conditions for convection and IR reﬂow reﬂect the proﬁle conditions

of the IPC/J–STD–020D standard for moisture sensitivity testing.

The devices can safely withstand a maximum of three reﬂow

passes at these conditions.

Proﬁle Feature

SnPb Assembly Pb-Free Assembly

Preheat/Soak

Temperature Minimum (T_Smin

)

100°C

150°C

200°C

Temperature Maximum (T_Smax

)

Time (t_s) from T_sminto T_smax

)

60–120 seconds

3°C/seconds maximum

183°C

60–120 seconds

3°C/seconds maximum

217°C

Ramp-up Rate (T_Lto T_P)

Liquidous Temperature (T_L)

Time Above Liquidous (t_L)

Peak Temperature (T_P)

60–150 seconds

220°C*

235°C**

250°C*

260°C**

Time within 5°C of Maximum

Peak Temperature (t_P)

Note that although the X/7343–43 case size can withstand wave

soldering, the tall proﬁle (4.3 mm maximum) dictates care in wave

process development.

20 seconds maximum

30 seconds maximum

Ramp-down Rate (T_Pto T_L)

6°C/seconds maximum

6 minutes maximum

6°C/seconds maximum

8 minutes maximum

Time 25°C to Peak Temperature

Note: All temperatures refer to the center of the package, measured on the

package body surface that is facing up during assembly reﬂow.

*Case Size D, E, P, Y and X

Hand soldering should be performed with care due to the difﬁculty

in process control. If performed, care should be taken to avoid

contact of the soldering iron to the molded case. The iron should

be used to heat the solder pad, applying solder between the pad

and the termination, until reﬂow occurs. Once reﬂow occurs, the

iron should be removed immediately. “Wiping” the edges of a chip

and heating the top surface is not recommended.

**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W and Z

T_P

t_P

Maximum Ramp Up Rate = 3ºC/seconds

Maximum Ramp Down Rate = 6ºC/seconds

T_L

t_L

T

smax

During typical reﬂow operations, a slight darkening of the gold-

colored epoxy may be observed. This slight darkening is normal

and is not harmful to the product. Marking permanency is not

affected by this change.

T

smin

t_S

25

25ºC to Peak

Time

Construction

T2049_T513 • 12/14/2012

7

Tantalum Surface Mount Capacitors – High Reliability Commercial Off-the-Shelf (COTS)

T513 Multiple Anode Low ESR COTS MnO₂Series

Capacitor Marking

Storage

Tantalum chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other

environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term

storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may

increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 60%

relative humidity. Temperature ﬂuctuations should be minimized to avoid condensation on the parts and atmospheres should be free of

chlorine and sulphur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within three years

of receipt.

T2049_T513 • 12/14/2012

8

Tantalum Surface Mount Capacitors – High Reliability Commercial Off-the-Shelf (COTS)

T513 Multiple Anode Low ESR COTS MnO₂Series

Tape & Reel Packaging Information

KEMET’s molded tantalum and aluminum chip capacitor families are packaged in 8 and 12 mm plastic tape on 7" and 13" reels in

accordance with EIA Standard 481–1: Embossed Carrier Taping of Surface Mount Components for Automatic Handling. This packaging

system is compatible with all tape-fed automatic pick-and-place systems.

8 mm (0.315")

or

12 mm (0.472")

180 mm (7.0")

Top Tape Thickness

or

0.10 mm (0.004")

330 mm (13.0")

Maximum Thickness

Table 3 – Packaging Quantity

Tape Width

Case Code

7" Reel*

13" Reel*

(mm)

KEMET

EIA

R

I

S

T

M

U

L

W

Z

V

A

B

C

D

Y

2012-12

3216-10

3216-12

3528-12

3528-15

6032-15

6032-19

7343-15

7343-17

7343-20

3216-18

3528-21

6032-28

7343-31

7343-40

7343-43

7360-38

7360-20

8

12

8

2,500

3,000

2,500

2,000

1,000

2,000

500

10,000

12,000

10,000

8,000

5,000

3,000

9,000

8,000

3,000

2,500

2,000

3,000

8

12

500

X

E/T428P

H

1,000

* No C-Spec required for 7" reel packaging. C-7280 required for 13" reel packaging.

T2049_T513 • 12/14/2012

9

Tantalum Surface Mount Capacitors – High Reliability Commercial Off-the-Shelf (COTS)

T513 Multiple Anode Low ESR COTS MnO₂Series

Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

T

P2

[10 pitches cumulative

tolerance on tape ± 0.2 mm]

2

E

1

Po

ØDo

Ao

F

Ko

W

E

2

B

1

Bo

S

1

P

1

T

1

Embossment

For cavity size,

see Note 1 Table 4

Center Lines of Cavity

ØD

1

Cover Tape

is for tape feeder reference only,

including draft concentric about B

B

1

o

.

User Direction of Unreeling

Table 4 – Embossed (Plastic) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

D₁Minimum

Note 1

1.0

R Reference S₁Minimum

Tape Size

8 mm

D₀

E₁

P₀

P₂

T Maximum T₁Maximum

Note 2

Note 3

25.0

(0.984)

(0.039)

1.5 +0.10/-0.0

(0.059 +0.004/-0.0)

1.75 ±0.10

4.0 ±0.10

2.0 ±0.05

0.600

(0.024)

0.600

(0.024)

0.100

(0.004)

12 mm

16 mm

(0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002)

1.5

(0.059)

30

(1.181)

Variable Dimensions — Millimeters (Inches)

B₁Maximum

Note 4

4.35

(0.171)

8.2

(0.323)

12.1

(0.476)

Tape Size

8 mm

Pitch

E₂Minimum

F

P₁

T₂Maximum W Maximum

A₀,B₀& K₀

6.25

(0.246)

10.25

(0.404)

14.25

3.5 ±0.05

4.0 ±0.10

2.5

(0.098)

4.6

8.3

(0.327)

12.3

Single (4 mm)

(0.138 ±0.002) (0.157 ±0.004)

5.5 ±0.05 8.0 ±0.10

(0.217 ±0.002) (0.315 ±0.004)

5.5 ±0.05 8.0 ±0.10

(0.217 ±0.002) (0.315 ±0.004)

Single (4 mm) &

Double (8 mm)

12 mm

16 mm

Note 5

(0.181)

4.6

(0.484)

16.3

Triple (12 mm)

(0.561)

(0.181)

(0.642)

1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and

hole location shall be applied independent of each other.

2. The tape, with or without components, shall pass around R without damage (see Figure 5).

3. If S₁< 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481–D, paragraph 4.3, section b).

4. B₁dimension is a reference dimension for tape feeder clearance only.

5. The cavity deﬁned by A₀, B₀and K₀shall surround the component with sufﬁcient clearance that:

(a) the component does not protrude above the top surface of the carrier tape.

(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 2).

(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 mm and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 3).

(e) see Addendum in EIA Standard 481–D for standards relating to more precise taping requirements.

T2049_T513 • 12/14/2012 10

Tantalum Surface Mount Capacitors – High Reliability Commercial Off-the-Shelf (COTS)

T513 Multiple Anode Low ESR COTS MnO₂Series

Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 Kg minimum.

2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

Tape Width

8 mm

Peel Strength

0.1 to 1.0 Newton (10 to 100 gf)

0.1 to 1.3 Newton (10 to 130 gf)

12 and 16 mm

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180°

from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.

3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA

Standards 556 and 624.

Figure 2 – Maximum Component Rotation

°

T

Maximum Component Rotation

Top View

Maximum Component Rotation

Side View

Typical Pocket Centerline

Tape

Maximum

°

T

s

Width (mm) Rotation (

)

8,12

16 – 200

20

10

Bo

Tape

Maximum

°

S

Width (mm) Rotation (

)

8,12

16 – 56

72 – 200

20

10

5

Typical Component Centerline

Ao

Figure 4 – Bending Radius

Figure 3 – Maximum Lateral Movement

Embossed

Carrier

Punched

Carrier

8 mm & 12 mm Tape

16 mm Tape

0.5 mm maximum

1.0 mm maximum

R

Bending

Radius

R

T2049_T513 • 12/14/2012 11

Tantalum Surface Mount Capacitors – High Reliability Commercial Off-the-Shelf (COTS)

T513 Multiple Anode Low ESR COTS MnO₂Series

Figure 5 – Reel Dimensions

Full Radius,

W3 (Includes

flange distortion

at outer edge)

Access Hole at

Slot Location

(Ø 40 mm minimum)

See Note

W

2 (Measured at hub)

D

(See Note)

A

N

C

(Arbor hole

W

1 (Measured at hub)

diameter)

If present,

tape slot in core

for tape start:

2.5 mm minimum width x

10.0 mm minimum depth

B

(see Note)

Note: Drive spokes optional; if used, dimensions B and D shall apply.

Table 5 – Reel Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size

8 mm

A

B Minimum

C

D Minimum

178 ±0.20

(7.008 ±0.008)

or

330 ±0.20

(13.000 ±0.008)

1.5

(0.059)

13.0 +0.5/-0.2

(0.521 +0.02/-0.008)

20.2

(0.795)

12 mm

16 mm

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

N Minimum

W₁

W₂Maximum

W₃

8.4 +1.5/-0.0

(0.331 +0.059/-0.0)

12.4 +2.0/-0.0

(0.488 +0.078/-0.0)

16.4 +2.0/-0.0

14.4

(0.567)

18.4

(0.724)

22.4

50

(1.969)

Shall accommodate tape width

without interference

12 mm

16 mm

(0.646 +0.078/-0.0)

(0.882)

T2049_T513 • 12/14/2012 12

Tantalum Surface Mount Capacitors – High Reliability Commercial Off-the-Shelf (COTS)

T513 Multiple Anode Low ESR COTS MnO₂Series

Figure 6 – Tape Leader & Trailer Dimensions

Embossed Carrier

Carrier Tape

Round Sprocket Holes

Punched Carrier

8 mm & 12 mm only

START

END

Top Cover Tape

Elongated Sprocket Holes

(32 mm tape and wider)

100 mm

Minimum Leader

400 mm Minimum

Trailer

160 mm Minimum

Components

Top Cover Tape

Figure 7 – Maximum Camber

Elongated sprocket holes

(32 mm & wider tapes)

Carrier Tape

Round Sprocket Holes

1 mm Maximum, either direction

Straight Edge

250 mm

T2049_T513 • 12/14/2012 13

Tantalum Surface Mount Capacitors – High Reliability Commercial Off-the-Shelf (COTS)

T513 Multiple Anode Low ESR COTS MnO₂Series

KEMET Corporation

World Headquarters

Europe

Asia

Southern Europe

Paris, France

Tel: 33-1-4646-1006

Northeast Asia

Hong Kong

Tel: 852-2305-1168

2835 KEMET Way

Simpsonville, SC 29681

Sasso Marconi, Italy

Tel: 39-051-939111

Shenzhen, China

Tel: 86-755-2518-1306

Mailing Address:

P.O. Box 5928

Greenville, SC 29606

Beijing, China

Central Europe

Landsberg, Germany

Tel: 49-8191-3350800

Tel: 86-10-5829-1711

www.kemet.com

Tel: 864-963-6300

Fax: 864-963-6521

Shanghai, China

Tel: 86-21-6447-0707

Kamen, Germany

Tel: 49-2307-438110

Corporate Ofﬁces

Fort Lauderdale, FL

Tel: 954-766-2800

Taipei, Taiwan

Tel: 886-2-27528585

Northern Europe

Bishop’s Stortford, United Kingdom

Tel: 44-1279-460122

North America

Southeast Asia

Singapore

Southeast

Tel: 65-6586-1900

Lake Mary, FL

Tel: 407-855-8886

Espoo, Finland

Tel: 358-9-5406-5000

Penang, Malaysia

Tel: 60-4-6430200

Northeast

Wilmington, MA

Tel: 978-658-1663

Bangalore, India

Tel: 91-806-53-76817

Central

Novi, MI

Tel: 248-994-1030

West

Milpitas, CA

Tel: 408-433-9950

Mexico

Guadalajara, Jalisco

Tel: 52-33-3123-2141

Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not

assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of

KEMET Electronics Corporation.

T2049_T513 • 12/14/2012 14

Tantalum Surface Mount Capacitors – High Reliability Commercial Off-the-Shelf (COTS)

T513 Multiple Anode Low ESR COTS MnO₂Series

Other KEMET Resources

Tools

Resource

Location

Conﬁgure A Part: CapEdge

SPICE & FIT Software

http://capacitoredge.kemet.com

http://www.kemet.com/spice

http://www.kemet.com/keask

http://www.kemet.com:8080/elc

Search Our FAQs: KnowledgeEdge

Electrolytic LifeCalculator

Product Information

Resource

Location

Products

Technical Resources (Including Soldering Techniques)

RoHS Statement

http://www.kemet.com/products

http://www.kemet.com/technicalpapers

http://www.kemet.com/rohs

Quality Documents

http://www.kemet.com/qualitydocuments

Product Request

Resource

Location

http://www.kemet.com/sample

http://www.kemet.com/kits

Sample Request

Engineering Kit Request

Contact

Resource

Location

Website

Contact Us

Investor Relations

Call Us

www.kemet.com

http://www.kemet.com/contact

http://www.kemet.com/ir

1-877-MyKEMET

Twitter

http://twitter.com/kemetcapacitors

Disclaimer

All product speciﬁcations, statements, information and data (collectively, the “Information”) are subject to change without notice.

All Information given herein is believed to be accurate and reliable, but is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.

Statements of suitability for certain applications are based on our knowledge of typical operating conditions for such applications, but are not intended to constitute – and we

speciﬁcally disclaim – any warranty concerning suitability for a speciﬁc customer application or use. This Information is intended for use only by customers who have the requisite

experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by us with reference to the

use of our products is given gratis, and we assume no obligation or liability for the advice given or results obtained.

Although we design and manufacture our products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur.

Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or

redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.

Although all product-related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other measures may not

be required.

T2049_T513 • 12/14/2012 15

Tantalum Surface Mount Capacitors – High Reliability Commercial Off-the-Shelf (COTS)

T513 Multiple Anode Low ESR COTS MnO₂Series

Digitally signed by Jeannette Calvo

DN: c=US, st=FL, l=Fort Lauderdale, o=KEMET Corp., ou=Marketing

Communications, cn=Jeannette Calvo, email=jeannettecalvo@kemet.com

Date: 2012.12.18 11:35:54 -05'00'

T2049_T513 • 12/14/2012 16


型号：	T513X687M006AC63107280
厂家：	KEMET CORPORATION
描述：	Tantalum Capacitor, Polarized, Tantalum (dry/solid), 6.3V, 20% +Tol, 20% -Tol, 680uF, Surface Mount, 2917, CHIP 电容器
文件：	总16页 (文件大小：1773K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

T513X687M006AC63107280 [KEMET]

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