KT-2117ZG10Z4S [KINGBRIGHT]
SINGLE COLOR LED, GREEN, 1.75mm, 2.15 X 1.70 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, SMD, 2 PIN;
| 型号： | KT-2117ZG10Z4S |
| 厂家： | 
KINGBRIGHT CORPORATION |
| 描述： | SINGLE COLOR LED, GREEN, 1.75mm, 2.15 X 1.70 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, SMD, 2 PIN 光电 |
| 文件： | 总9页 (文件大小：379K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
2.15X1.7mm SMD LED WITH CERAMIC
SUBSTRATE
Part Number: KT-2117ZG10Z4S
Green
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHARGE
數位簽署者：yuanfang
DN：cn=yuanfang,o,ou,
email=rd15f09@ cn.kingbright.com,
yuanfangc=<無>
SENSITIVE
日期 2011.09.2915:01:07+08'00'
DEVICES
Features
z Dimension: 2.15mmX 1.7mm X 0.8mm.
z Low thermal resistance.
Application Note
z Ceramic package with silicone resin.
z Small package with high efficiency.
z Surface mount technology.
z ESD protection.
Static electricity and surge damage the LEDs.
It is recommended to use a wrist band or anti-electrostatic
glove when handling the LEDs.
All devices, equipment and machinery must be electrically
grounded.
z Package : 2000pcs / reel.
z Moisture sensitivity level : level 2a.
z Soldering methods: IR reflow soldering.
z RoHS compliant.
Typical Applications
Room lighting
Architectural lighting
Decorative/pathway lighting
Front panel backlight
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice.
4. The device has a single mounting surface. The device must be mounted according to the specifications.
SPEC NO: DSAM0816
APPROVED: WYNEC
REV NO: V.1B
DATE: SEP/29/2011
DRAWN: Y.H.Wu
PAGE: 1 OF 9
CHECKED: Allen Liu
ERP: 1212000095
Absolute Maximum Ratings at TA=25°C
Parameter
Symbol
Top
Tstg
TJ
Value
Unit
°C
Operating Temperature
-40 To +100
Storage Temperature
-40 To +120
°C
Junction temperature[1]
120
350
500
5
°C
DC Forward Current [1]
IF
mA
mA
V
Peak Forward Current [2]
Reverse Voltage
IFM
VR
Power dissipation
PD
1.3
8000
75
W
Electrostatic Discharge Threshold (HBM)
Thermal resistance [1] (Junction/ambient)
V
Rth j-a
Rth j-s
°C/W
°C/W
Thermal resistance [1] (Junction/solder point)
Notes:
28
1. Results from mounting on metal core PCB,mounted on pc board-metal core PCB is recommend.for lowest thermal resistance.
2. 1/10 Duty Cycle, 0.1ms Pulse Width.
Electrical / Optical Characteristics at TA=25°C
Parameter
Symbol
λ peak
λ dom [1]
Δλ
Value
520
Unit
nm
nm
nm
Wavelength at peak emission IF=350mA
[Typ.]
Dominant Wavelength IF=350mA [Typ.]
530
Spectral Line Half-width IF=350mA [Typ.]
Forward Voltage IF = 350mA [Min.]
Forward Voltage IF = 350mA [Typ.]
Forward Voltage IF = 350mA [Max.]
Allowable Reverse Current [Max.]
35
2.7
3.3
3.8
85
VF [2]
V
IR
mA
Optical efficiency
36.36
0.16
lm/W
η
opt
Temperature coefficient of λ peak
TC λ peak
TC λ dom
TCV
nm/° C
nm/° C
mV/° C
IF=350mA, -10 ° C≤ T≤100 ° C
[Typ.]
Temperature coefficient of λ dom
0.14
-3.1
IF=350mA, -10 ° C≤ T≤100 ° C
[Typ.]
Temperature coefficient of VF
IF=350mA, -10 ° C≤ T≤100 ° C [Typ.]
Notes:
1.Wavelength is measured with a current pulse of 20ms at a tolerance of ±1nm.
2.Forward voltage is measured with a current pulse of 10ms at a tolerance of ±0.1V.
3.Wavelength value is traceable to the CIE127-2007 compliant national standards.
SPEC NO: DSAM0816
APPROVED: WYNEC
REV NO: V.1B
DATE: SEP/29/2011
DRAWN: Y.H.Wu
PAGE: 2 OF 9
CHECKED: Allen Liu
ERP: 1212000095
Selection Guide
Part No.
Viewing
Angle [1]
Luminous Intensity [2]
Iv(cd)@ 350mA*
Φv (lm) [3]
@ 350mA
Dice
Lens Type
Min.
Typ.
Typ.
2 θ 1/2
120 °
KT-2117ZG10Z4S
Green (AlGaInN)
Water Clear
6
8
42
Brightness codes
luminous Intensity [2]
Iv(cd) @ 350mA
Φv (lm) [3]
@ 350mA
Code.
ZE
Min.
Max.
Typ.
32
6
7
8
9
7
8
ZF
38
ZG
9
42
ZH
11
55
Notes:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.
2.Luminous intensity is measured by a current pulse of 10ms at a tolerance of ±15%,*LEDs are binned according to their luminous intensity.
3.The typical data of Luminous Flux can only reflect statistical figures, actual parameters of individual product could differ from the typical data.
For the purpose of product enhancement, the typical data is subject to change without prior notice.
Shipment may contain more than one of the light intensity groups.
Orders for single light intensity group are generally not accepted.
4. Luminous Intensity/Luminous Flux value is traceable to the CIE127-2007 compliant national standards.
SPEC NO: DSAM0816
APPROVED: WYNEC
REV NO: V.1B
DATE: SEP/29/2011
DRAWN: Y.H.Wu
PAGE: 3 OF 9
CHECKED: Allen Liu
ERP: 1212000095
KT-2117ZG10Z4S
SPEC NO: DSAM0816
APPROVED: WYNEC
REV NO: V.1B
DATE: SEP/29/2011
DRAWN: Y.H.Wu
PAGE: 4 OF 9
CHECKED: Allen Liu
ERP: 1212000095
SPEC NO: DSAM0816
APPROVED: WYNEC
REV NO: V.1B
DATE: SEP/29/2011
DRAWN: Y.H.Wu
PAGE: 5 OF 9
CHECKED: Allen Liu
ERP: 1212000095
KT-2117ZG10Z4S
Reflow soldering is recommended and the soldering profile is shown below.
Other soldering methods are not recommended as they might cause damage to the product.
Heat Generation:
1.Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making
the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the
circuit board and density of LED placement on the board ,as well as other components. It is necessary to avoid intense heat gen-
eration and operate within the maximum ratings given in this specification.
2.Please determine the operating current with consideration of the ambient temperature local to the LED and refer to the plot
of Permissible Forward current vs. Ambient temperature on CHARACTERISTICS in this specification. Please also take meas-
ures to remove heat from the area near the LED to improve the operational characteristics on the LED.
3.The equation ① indicates correlation between Tj and Ta ,and the equation ② indicates correlation between Tj and Ts
Tj = Ta + Rthj-a *W ………
Tj = Ts + Rthj-s *W ………
①
②
Tj = dice junction temperature: °C
Ta = ambient temperature:°C
Ts = solder point temperature:°C
Rthj-a = heat resistance from dice junction temperature to ambient temperature : °C / W
Rthj-s = heat resistance from dice junction temperature to Ts measuring point : °C / W
W = inputting power (IFx VF) : W
SPEC NO: DSAM0816
APPROVED: WYNEC
REV NO: V.1B
DATE: SEP/29/2011
DRAWN: Y.H.Wu
PAGE: 6 OF 9
CHECKED: Allen Liu
ERP: 1212000095
Recommended Soldering Pattern
(Units : mm; Tolerance: ± 0.1)
Tape Specifications (Units : mm)
Reel Dimension
SPEC NO: DSAM0816
APPROVED: WYNEC
REV NO: V.1B
DATE: SEP/29/2011
DRAWN: Y.H.Wu
PAGE: 7 OF 9
CHECKED: Allen Liu
ERP: 1212000095
PACKING & LABEL SPECIFICATIONS
KT-2117ZG10Z4S
SPEC NO: DSAM0816
APPROVED: WYNEC
REV NO: V.1B
DATE: SEP/29/2011
DRAWN: Y.H.Wu
PAGE: 8 OF 9
CHECKED: Allen Liu
ERP: 1212000095
Handling Precautions
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic
significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.
As a result, special handling precautions need to be observed during assembly using silicone encapsulated
LED products. Failure to comply might lead to damage and premature failure of the LED.
1. Handle the component along the side surfaces by using forceps or appropriate tools.
2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.
3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or
damage the internal circuitry.
4.1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks.
4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup
and avoid damage during production.
5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of
leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances.
SPEC NO: DSAM0816
APPROVED: WYNEC
REV NO: V.1B
DATE: SEP/29/2011
DRAWN: Y.H.Wu
PAGE: 9 OF 9
CHECKED: Allen Liu
ERP: 1212000095
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