L-7113SURDK [KINGBRIGHT]
Single Color LED, Hyper Red, Diffused Red, T-1 3/4, 5mm, ROHS COMPLIANT PACKAGE-2;
| 型号： | L-7113SURDK |
| 厂家： | 
KINGBRIGHT CORPORATION |
| 描述： | Single Color LED, Hyper Red, Diffused Red, T-1 3/4, 5mm, ROHS COMPLIANT PACKAGE-2 光电 |
| 文件： | 总5页 (文件大小：492K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
L-7113SURDK
T-1 3/4 (5mm) Solid State Lamp
DESCRIPTIONS
PACKAGE DIMENSIONS
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The Hyper Red source color devices are made with
AlGaInP on GaAs substrate Light Emitting Diode
Electrostatic discharge and power surge could
damage the LEDs
It is recommended to use a wrist band or anti-
electrostatic glove when handling the LEDs
All devices, equipments and machineries must be
electrically grounded
FEATURES
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z
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Low power consumption
Popular T-1 3/4 diameter package
General purpose leads
Reliable and rugged
Long life - solid state reliability
Available on tape and reel
RoHS compliant
APPLICATIONS
z
z
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Status indicator
Illuminator
Signage applications
Decorative and entertainmenigting
Commercial and residential artectal lighting
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
3. Lead spacing is measured where the leads emerge from the package.
4. The specifications, characteristics and technical data described in the datasheet are subject to change
without prior notice.
ATTENTION
Observe precautions for handling
electrostatic discharge sensitive devices
SELECTION GUIDE
Iv (mcd) @ 20mA [2]
Viewing Angle [1]
Emitting Color
(Material)
Part Number
Lens Type
Min.
Typ.
2θ1/2
700
1300
■
Hyper Red
(AlGaInP)
L-7113SURDK
Red Diffused
30°
*300
*650
Notes:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.
2. Luminous intensity / luminous flux: +/-15%.
* Luminous intensity value is traceable to CIE127-2007 standards.
Page 1 / 5
© 2018 Kingbright. All Rights Reserved. Spec No: DSAD3993 / 1101005324 Rev No: V.20A Date: 08/22/2018
L-7113SURDK
ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C
Value
Parameter
Symbol
Emitting Color
Unit
Typ.
Max.
Wavelength at Peak Emission IF = 20mA
Dominant Wavelength IF = 20mA
λpeak
Hyper Red
Hyper Red
Hyper Red
Hyper Red
Hyper Red
Hyper Red
Hyper Red
Hyper Re
Hyd
645
-
nm
nm
[1]
λdom
630
28
-
-
Spectral Bandwidth at 50% Φ REL MAX
IF = 20mA
Δλ
nm
Capacitance
C
35
-
pF
[2]
Forward Voltage IF = 20mA
Reverse Current (VR = 5V)
VF
1.95
-
2.5
10
-
V
IR
uA
Temperature Coefficient of λpeak
IF = 20mA, -10°C ≤ T ≤ 85°C
TCλpeak
TCλdom
TCV
0.13
0.05
-1.9
nm/°C
nm/°C
mV/°C
Temperature Coefficient of λdom
IF = 20mA, -10°C ≤ T ≤ 85°C
-
Temperature Coefficient of VF
IF = 20mA, -10°C ≤ T ≤ 85°C
-
Notes:
1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd : ±1nm. )
2. Forward voltage: ±0.1V.
3. Wavelength value is traceable to CIE127-2007 standards.
4. Excess driving current and / or operating temperature higher than recommended conditions my relighdegradation or premature failure.
ABSOLUTE MAXIMUM RATINGS at TA=5°C
Parameter
Symbol
Value
Unit
Power Dissipation
Reverse Voltage
PD
VR
Tj
75
5
mW
V
Junction Temperature
115
°C
Operating Temperature
Top
Tstg
IF
-40 to +85
-40 to +85
30
°C
Storage Temperature
°C
DC Forward Current
mA
mA
V
[1]
Peak Forward Current
IFM
185
Electrostatic Discharge Threshold (HBM)
Thermal Resistance (Junction / Ambient)
Thermal Resistance (Junction / Solder point)
Lead Solder Temperature [3]
Lead Solder Temperature [4]
3000
550
-
[2]
Rth JA
°C/W
°C/W
[2]
Rth JS
310
260°C For 3 Seconds
260°C For 5 Seconds
Notes:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
2. Rth JA ,Rth Results from mounting on PC board FR4 (pad size ≥ 16 mm2 per pad).
JS
3. 2mm below package base.
4. 5mm below package base.
5. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.
Page 2 / 5
© 2018 Kingbright. All Rights Reserved. Spec No: DSAD3993 / 1101005324 Rev No: V.20A Date: 08/22/2018
L-7113SURDK
TECHNICAL DATA
SPATIAL DISTRIBUTION
RELATIVE INTENSITY vs. WAVELENGTH
Red
100%
0°
-15°
15°
Ta = 25 °C
Ta = 25 °C
-30°
30°
80%
60%
40%
20%
0%
-45°
45°
60°
-60°
75°
-75°
350
400
450
500
550
600
650
700
750
800
90°
1.0
-90°
1.0
Wavelength (nm)
0.5
0.0
0.5
HYPER RED
Forward Current Derating Curve
Forward Current vs.
Forward Voltage
Luminous Intensity vs.
Forward Current
Luminous Intensity vs.
Ambient Temperature
50
40
30
20
10
0
2.5
50
40
30
0
10
0
2.5
2.0
1.5
1.0
0.5
0.0
Ta = 25 °C
Ta = 25 °C
2.0
1.5
1.0
0.5
0.0
1.5
1.7
1.9
2.1
2.3
2.5
0
10
20
30
40
-40 -20
0
20 40 60 80 100
-40 -20
0
20 40 60 80 100
Forward voltage (V)
Forward curre
Ambient temperature (°C)
Ambient temperature (°C)
RECOMMENDED WAVE SOLDERING PROLE
Notes:
1. Recommend pre-heat temperature of 105°C or less (as measured with a thermocouple
attached to the LED pins) prior to immersion in the solder wave with a maximum solder bath
temperature of 260°C
2. Peak wave soldering temperature between 245°C ~ 255°C for 3 sec (5 sec max).
3. Do not apply stress to the epoxy resin while the temperature is above 85°C.
4. Fixtures should not incur stress on the component when mounting and during soldering process.
5. SAC 305 solder alloy is recommended.
6. No more than one wave soldering pass.
PACKING & LABEL SPECIFICATIONS
Page 3 / 5
© 2018 Kingbright. All Rights Reserved. Spec No: DSAD3993 / 1101005324 Rev No: V.20A Date: 08/22/2018
L-7113SURDK
PRECAUTIONS
Storage conditions
1. Avoid continued exposure to the condensing moisture environment and keep the product away from rapid transitions in ambient
temperature.
2. LEDs should be stored with temperature ≤ 30°C and relative humidity < 60%.
3. Product in the original sealed package is recommended to be assembled within 72 hours of pening.
Product in opened package for more than a week should be baked for 30 (+10/-0) ours t 85 100°C.
LED Mounting Method
1. The lead pitch of the LED must match the
pitch of the mounting holes on the PCB
during component placement.
Lead-forming may be required to nsure
the lead pitch matches the he ch.
Refer to the figure below for prer ld
forming procedures.
Note 1-3: Do not route PCB trace in the contact area between the
leadframe and the PCB to prevent short-circuits.
" ○" Correct mounting method " x " Incorrect mounting method
2. When soldering wires to the LED, each wire joint should be separately insulated with heat-shrink tube to prevent short-circuit contact.
Do not bundle both wires in one heat shrink tube to avoid pinching the LED leads. Pinching stress on the LED leads may damage the
internal structures and cause failure.
3. Use stand-offs (Fig.1) or spacers (Fig.2) to securely position the LED above the PCB.
4. Maintain a minimum of 3mm clearance between the base of the LED lens and the first lead
bend (Fig. 3 ,Fig. 4).
5. During lead forming, use tools or jigs to hold the leads securely so that the bending force
will not be transmitted to the LED lens and its internal structures. Do not perform lead
forming once the component has been mounted onto the PCB. (Fig. 5 )
Page 4 / 5
© 2018 Kingbright. All Rights Reserved. Spec No: DSAD3993 / 1101005324 Rev No: V.20A Date: 08/22/2018
L-7113SURDK
Lead Forming Procedures
1. Do not bend the leads more than twice. (Fig. 6 )
2. During soldering, component covers and holders should leave
clearance to avoid placing damaging stress on the LED during
soldering. (Fig. 7)
3. The tip of the soldering iron should never touch the lens epoxy.
4. Through-hole LEDs are incompatible with reflow soldering.
5. If the LED will undergo multiple soldering passes or face other
processes where the part may be subjected to intense heat,
please check with Kingbright for compatibility.
PRECAUTIONARY NOTES
1. The information included in this document reflects representative usage scenarios and is intended for technical reference only.
2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to
the latest datasheet for the updated specifications.
3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If
customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues.
4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening
liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance.
5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright.
6. All design applications should refer to Kingbright application notes available at http://www.Kingbright.com/application_notes
Page 5 / 5
© 2018 Kingbright. All Rights Reserved. Spec No: DSAD3993 / 1101005324 Rev No: V.20A Date: 08/22/2018
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