1210J2000101KAT [KNOWLES]
CAP CER 100PF 200V C0G/NP0 1210;型号: | 1210J2000101KAT |
厂家: | KNOWLES ELECTRONICS |
描述: | CAP CER 100PF 200V C0G/NP0 1210 |
文件: | 总12页 (文件大小:3517K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
AEC-Q200
Automotive Grade
Capacitors
AEC-Q200
Automotive Grade Capacitors
At Knowles Precision Devices (KPD), we manufacture Single Layer, Multilayer, High Reliability and Precision
Variable Capacitors; EMI Filters and Thin Film Devices. One of our fields of expertise is the design and
manufacture of components important to engineers in the automotive industry. Today’s vehicles have
many electronic control units that enable absolute precision and control.
The Automotive Electronics Council (AEC) Component Technical Committee is the standardization body
for establishing standards for reliable, high-quality electronic components. Components meeting these
specifications are suitable for use in the harsh automotive environment without additional component-level
qualification testing.
The Component Technical Committee established AEC-Q200 “Stress Test Qualification for Passive
Components” to define the minimum stress test driven qualification requirements for electrical devices,
including ceramic capacitors. KPD’s Syfer brand has developed a range of MLC capacitors and surface mount
EMI filters qualified to AEC-Q200 rev D to meet the needs of high reliability and automotive manufacturers.
Knowles Suzhou (China), Norwich (England) and Penang (Malaysia) facilities are accredited to IATF
16949:2016 for the design, manufacture and supply of AEC-Q200 qualified MLCC components. Please
refer to the following pages for details of the product ranges offered.
2
Table of Contents
GENERAL AND TECHNICAL INTRODUCTION
Dielectric Characteristics ....................................................................................... 4-6
FlexiCap™ Overview ................................................................................................ 7
IECQ-CECC and AEC-Q200 Periodic Tests .......................................................... 8
Manufacturing Process ........................................................................................... 9
Testing ....................................................................................................................... 10
Regulations and Compliance ................................................................................. 11
Explanation of Aging of MLC ................................................................................. 12
Mounting, Soldering, Storage and Mechanical Precautions .............................. 13-14
Ceramic Chip Capacitors — Packaging Information ........................................... 15-16
Chip Dimensions ...................................................................................................... 17
MLC CAPACITORS
C0G/NP0 (1B) — AEC-Q200 and Standard Ranges ............................................. 18-20
X7R (2R1) — AEC-Q200 and Standard Ranges ..................................................... 21-23
Ordering Information — AEC-Q200 and Standard Ranges ................................. 24
StackiCap™ Capacitors ............................................................................................ 25
Safety Certified AC Capacitors ............................................................................... 26
Enhanced 250Vac and 305Vac Safety Certified AC Capacitors......................... 27-31
Legacy 250Vac Safety Certified AC Capacitors .................................................. 32-34
Open Mode Capacitors — C0G/NP0 (1B) and X7R (2R1) ..................................... 35
Tandem Capacitors — X7R (2R1) ............................................................................ 36
X8R High Temperature Capacitors — up to 150ºC .............................................. 37
Ultra-Low ESR HiQ MLCCs — X8G Range ............................................................ 38-39
SM EMI FILTERS
Surface Mount EMI Filters — E01 and E07 Ranges .............................................. 40-41
Surface Mount EMI Filters — E03 X2Y IPCs ......................................................... 42-44
Other Products Available That Are Not AEC-Q200 Qualified ............................ 45-46
Our Other Products ................................................................................................. 47
3
Dielectric Characteristics
CLASS I DIELECTRICS
Multilayer Ceramic Capacitors are generally divided into classes,
which are defined by the capacitance temperature characteristics
over specified temperature ranges. These are designated by alpha-
numeric codes. Code definitions are summarized below and are also
available in the relevant national and international specifications.
dielectric characteristics with negligible dependence of
capacitance and dissipation factor with time, voltage and
frequency. They exhibit the following characteristics:
a) Time does not significantly affect capacitance and dissipation
factor (Tan δ) – no aging.
Capacitors within this class have a dielectric constant range from 10
to 100. They are used in applications that require ultra stable
b) Capacitance and dissipation factor are not affected by voltage.
c) Linear temperature coefficient.
CLASS I DIELECTRICS
C0G/NP0 (1B) (Porcelain)
P90 (Porcelain)
C0G/NP0 (1B)
X8G
Class I High Temperature
-
Ultra Stable
Ultra Stable
Ultra Stable
1B/CG
Ultra Stable
Ultra Stable
IECQ-CECC
EIA
-
-
-
-
-
-
-
-
-
Dielectric
classifications
C0G/NP0 (1B)
P90
C0G/NP0 (1B)
X8G
MIL
-
-
CG (BP)
-
DLI
Novacap
Syfer
CF
AH
-
-
-
N, RN
C
-
-
-
F
-
-
D, RD
G
-
-
-
-
Ordering code
Q, U
H
Voltronics
-
F
H
Q
-
-
-
-
Rated
temperature range
-55ºC to +125ºC
-55ºC to +125ºC
-55ºC to +125ºC
-55ºC to +125ºC
-55ºC to +150ºC
-55ºC to +160ºC
-55ºC to +200ºC
No DC
voltage applied
Maximum
capacitance
change over
0
15 ppm/ºC
+90 20 ppm/ºC
0
30 ppm/ºC
0
30 ppm/ºC
-
0
30 ppm/ºC
0
30 ppm/ºC
0
30 ppm/ºC
Rated DC
voltage applied
temperature range
>50pF ≤0.0015
≤50pF
0.0015 (15/Cr + 0.7)
Tangent of loss
angle (tan ð)
-
≤0.0005 @1MHz
≤0.0005 @1MHz
≤0.0005 @1MHz
≤0.001
@25ºC = 100GΩ or 1000ΩF
@160ºC & 200ºC = 1GΩ or
10ΩF (whichever is the least)
Insulation
resistance (Ri)
Time constant
(Ri x Cr)
@25ºC = 106 MΩ min
@125ºC = 105 MΩ min
100GΩ or 1000s
(whichever is the least)
Cr <4.7pF
Cr≥ 4.7 to <10pF
Cr ≥ 10pF
0.05pF, 0.10pF, 0.25pF, 0.5pF
0.10pF, 0.25pF, 0.5pF
1ꢀ, 2ꢀ, 5ꢀ, 10ꢀ
Capacitance
tolerance
≤200V
2.5 times
Dielectric strength.
Voltage applied
for 5 seconds.
Charging
>200V to <500V
500V to ≤ 1kV
2.5 times
Rated voltage +250V
1.5 times
2.5 times
current limited
to 50mA maximum.
>1kV to ≤ 1.2kV
>1.2kV
1.25 times
1.2 times
-
N/A
Chip
-
-
-
-
-
-
55/125/56
-
-
-
Climatic
category (IEC)
Dipped
-
-
55/125/21
55/125/56
-
-
Discoidal
Aging
characteristic
(Typical)
-
Zero
Approvals
Syfer Chip
-
-
-
QC-32100
-
-
4
Dielectric Characteristics
CLASS II DIELECTRICS
Capacitors of this type have a dielectric constant range of 1000-
4000 and also have a nonlinear temperature characteristic that
exhibits a dielectric constant variation of less than 15ꢀ (2R1)
from its room temperature value, over the specified temperature
range. Generally used for bypassing (decoupling), coupling,
filtering, frequency discrimination, DC blocking and voltage transient
suppression with greater volumetric efficiency than Class I units,
while maintaining stability within defined limits.
Capacitance and dissipation factors are affected by:
a) Time (Aging)
b) Voltage (AC or DC)
c) Frequency
CLASS II DIELECTRICS
X5R
X7R (2R1)
X8R
Class II High Temperature
Stable
Stable
Stable
Stable
-
Dielectric
classifications
-
2C1
-
2R1
2X1
-
-
-
-
-
-
IECQ-CECC
EIA
X5R
X7R (2R1)
X8R
-
-
BZ
-
BX
-
-
MIL
-
DLI
BW
P
-
R
-
B, RB
X
B
-
S
N
-
G
-
E, RE
Novacap
Syfer
Ordering code
X
X
X
-
-
-
Voltronics
Rated
temperature range
-55ºC to +85ºC
-55ºC to +125ºC
-55ºC to +150ºC
-55ºC to +160ºC
+15 -40ꢀ
-55ºC to +200ºC
+15 -65ꢀ
-
15ꢀ
-
15ꢀ
15ꢀ
-
15ꢀ
15ꢀ
-
No DC voltage applied
Maximum capacitance
change over
temperature range
Rated DC
voltage applied
+15 -45ꢀ
+15 -25ꢀ
-
>25V ≤0.025
≤25V ≤0.035
Tangent of loss
angle (tan ð)
≤ 0.025 Typical*
≤0.025
≤0.025
-
100GΩ or 1000s (whichever is the least)
5ꢀ, 10ꢀ, 20ꢀ
Time constant (Ri x Cr)
-
Insulation resistance (Ri)
Capacitance tolerance
2.5 times
≤200V
Dielectric strength.
Voltage applied
for 5 seconds.
Rated voltage +250V
>200V to <500V
1.5 times
1.2 times
500V to <1kV
≥1kV
Charging current limited
to 50mA
maximum.
55/85/56
55/125/56
55/150/56
-
-
-
Chip
-
-
55/125/21
55/125/56
-
-
Dipped
Discoidal
Climatic category (IEC)
Aging
characteristic (Typical)
5ꢀ Typical
-
<2ꢀ per time decade
-
QC-32100
-
-
QC-32100
-
Syfer chip
Approvals
* Refer to the MLC Capacitors catalog for details of Dissipation Factor.
5
Dielectric Characteristics
TYPICAL DIELECTRIC
TEMPERATURE CHARACTERISTICS
IMPEDANCE vs. FREQUENCY
Ultra Stable C0G/NP0 (1B) Dielectric
100,000,000
10,000,000
Porcelain C0G/NP0 & P90
10pF
100pF
1nF
1,000,000
100,000
10,000
1.25
1
10nF
C0G/NP0 (1B) Porcelain
1,000
100
P90 Porcelain
0.75
10
1
0.5
0.1
0.25
0
0.01
0.001
0.01
0.1
1
10
100
1,000
10,000
Frequency (MHz)
Stable X7R (2R1) Dielectric
-0.25
-0.5
1,000,000
100,000
10,000
1nF
10nF
100nF
1μF
-0.75
-1
1,000
100
-55 -40
-20
0
20
40
60
80
100
125
10
1
Temperature °C
0.1
0.01
C0G/NP0
0.001
0.01
0.1
1
10
100
1,000
10,000
Frequency (MHz)
50
25
0
Upper Limit
Stable X7R (2R1) Dielectric — 10nF
1,000,000
Typical Limit
100,000
1808
0805
1206
1210
10,000
1,000
100
10
1
0.1
-25
-50
0.01
0.001
0.01
0.1
1
10
100
1,000
10,000
Lower Limit
Frequency (MHz)
ESR vs. FREQUENCY — CHIPS
-55
-25
0
25
50
75
100
125
Temperature °C
Ultra Stable C0G/NP0 (1B) Dielectric
1,000
100pF
1nF
10nF
100
10
1
X7R (2R1)
20
15
Typical specification limit
0.1
Typical capacitance change curves will
lie within the band shown
10
0.01
5
0.001
0.001
0.01
0.1
1
10
100
1,000
10,000
Frequency (MHz)
0
Stable X7R (2R1) Dielectric
-5
10,000
1,000
100
1nF
-10
10nF
100nF
1μF
-15
10
1
Typical specification limit
-20
0.1
-55
-35
-15
5
25
45
65
85
105
125
0.01
Temperature °C
0.001
0.0001
0.001
0.01
0.1
1
10
100
1,000
10,000
Frequency (MHz)
6
FlexiCap™ Overview
FLEXICAP™ BENEFITS
FLEXICAP™ TERMINATION
With traditional termination materials and assembly, the
MLCCs are widely used in electronic circuit design for a multitude of
applications. Their small package size, technical performance and suitability
for automated assembly make them the component of choice for the
specifier. However, despite the technical benefits, ceramic components
are brittle and need careful handling on the production floor. In some
circumstances they may be prone to mechanical stress damage if not used in
an appropriate manner. Board flexing, depanelization, mounting through hole
components, poor storage and automatic testing may all result in cracking.
Careful process control is important at all stages of circuit board assembly
and transportation — from component placement to test and packaging. Any
significant board flexing may result in stress fractures in ceramic devices that
may not always be evident during the board assembly process. Sometimes it
may be the end customer who finds out — when equipment fails!
chain of materials from bare PCB to soldered termination
provides no flexibility. In circumstances where excessive stress
is applied, the weakest link fails. This means the ceramic itself may
fail or short circuit. The benefit to the user is to facilitate a wider
process window — giving a greater safety margin and substantially
reducing the typical root causes of mechanical stress cracking. FlexiCap™
may be soldered using your traditional wave or reflow solder techniques,
including lead free, and needs no adjustment to equipment or current
processes. Knowles has delivered millions of FlexiCap™ components
and during that time has collected substantial test and reliability data,
working in partnership with customers worldwide to eliminate mechanical
cracking. An additional benefit of FlexiCap™ is that MLCCs can withstand
temperature cycling -55ºC to +125ºC in excess of 1,000 times without
cracking. FlexiCap™ termination has no adverse effect on any electrical
parameters, nor affects the operation of the MLCC in any way.
KNOWLES HAS THE SOLUTION — FLEXICAP™
FlexiCap™ has been developed as a result of listening to customers’
experiences of stress damage to MLCCs from many manufacturers, often
caused by variations in production processes. Our answer is a proprietary
flexible epoxy polymer termination material that is applied to the device under
the usual nickel barrier finish. FlexiCap™ will accommodate a greater degree of
board bending than conventional capacitors.
Picture taken at
1,000x magnification
using an SEM to
demonstrate the fibrous
nature of the FlexiCap
TM
termination that absorbs
increased levels of
mechanical stress.
KNOWLES FLEXICAP™ TERMINATION
Ranges are available with FlexiCap™ termination material offering increased
reliability and superior mechanical performance (board flex and temperature
cycling) when compared with standard termination materials. Refer to Knowles
application note reference AN0001. FlexiCap™ capacitors enable the board to
be bent almost twice as much before mechanical cracking occurs. Refer to
application note AN0002. FlexiCap™ is also suitable for space applications,
having passed thermal vacuum outgassing tests. Refer to Syfer application
note reference AN0026.
AVAILABLE ON THE FOLLOWING RANGES:
● All High Reliability Ranges
● Standard and High Voltage
Capacitors
● Non-Magnetic Capacitors
● 3-Terminal EMI Chips
● X2Y Integrated Passive
Components
● Open Mode and Tandem
Capacitors
● X8R High Temperature
● Safety Certified Capacitors
Capacitors
SUMMARY OF PCB BEND TEST RESULTS
The bend tests conducted on X7R (2R1) have proven that the FlexiCap™
termination withstands a greater level of mechanical stress before
mechanical cracking occurs. The AEC-Q200 test for X7R (2R1) requires a
bend level of 2mm minimum and a cap change of less than 10ꢀ. Knowles
test to a minimum bend of 5mm for X7R with FlexiCap termination, and
for COG with either FlexiCap or standard termination.
Product X7R (2R1)
Standard termination
FlexiCap™
Typical bend performance under AEC-Q200 test conditions
2mm to 3mm
Typically 8mm to 10mm
APPLICATION NOTES
FlexiCap™ may be handled, stored and transported in the same manner as standard terminated capacitors. The requirements
for mounting and soldering FlexiCap™ are the same as for standard SMD capacitors. For customers currently using standard
terminated capacitors there should be no requirement to change the assembly process when converting to FlexiCap™.
Based upon board bend tests in accordance with IEC 60384-1, the amount of board bending required to mechanically crack a FlexiCap™ terminated capacitor
is significantly increased compared with standard terminated capacitors. It must be stressed, however, that capacitor users must not assume that the use of
FlexiCap™ terminated capacitors will totally eliminate mechanical cracking. Good process controls are still required for this objective to be achieved.
7
IECQ-CECC and AEC-Q200 Tests
PERIODIC TESTS CONDUCTED FOR IECQꢁCECC AND AECꢁQ200
Sample acceptance
Test ref
Test
Termination type
Additional requirements
Reference
P
N
C
High temperature
exposure (storage)
Un-powered. 1,000 hours @ T=150ºC.
Measurement at 24 2 hours after test conclusion.
MIL-STD-202
Method 108
P1
All types
12
77
0
C0G/NP0 (1B):
All types X7R (2R1):
Y and H only
1,000 cycles -55ºC to +125ºC
Measurement at 24 2 hours after test conclusion.
JESD22
Method JA-104
P2
P3
Temperature cycling
Moisture resistance
12
12
77
77
0
0
T = 24 hours/cycle. Note: Steps 7a and 7b not required.
Unpowered.
MIL-STD-202
Method 106
All types
All types
Measurement at 24 2 hours after test conclusion.
1,000 hours 85ºC/85ꢀRH. Rated voltage or 50V
whichever is the least and 1.5V.
Measurement at 24 2 hours after test conclusion.
MIL-STD-202
Method 103
P4
Biased humidity
12
77
0
Condition D steady state TA=125ºC at full rated.
Measurement at 24 2 hours after test conclusion.
MIL-STD-202
Method 108
P5
P6
Operational life
All types
All types
12
12
77
5
0
0
Note: Add aqueous wash chemical.
Do not use banned solvents.
MIL-STD-202
Method 215
Resistance to solvents
C0G/NP0 (1B):
All types X7R (2R1):
Y and H only
MIL-STD-202
Method 213
P7
P8
Mechanical shock
Vibration
Figure 1 of Method 213. Condition F
12
12
30
30
0
0
5g’s for 20 minutes, 12 cycles each of 3 orientations.
C0G/NP0 (1B):
All types X7R (2R1):
Y and H only
Note: Use 8" x 5" PCB 0.031" thick 7 secure points on one
long side and 2 secure points at corners of opposite sides.
Parts mounted within 2" from any secure point. Test from
10-2,000Hz.
MIL-STD-202
Method 204
Condition B, no pre-heat of samples:
Single wave solder - Procedure 2
MIL-STD-202
Method 210
P9
Resistance to soldering heat
Thermal shock
All types
3
12
0
0
C0G/NP0 (1B):
All types X7R (2R1):
Y and H only
-55ºC/+125ºC. Number of cycles 300.
Maximum transfer time - 20 seconds,
dwell time - 15 minutes. Air-Air.
MIL-STD-202
Method 107
P10
12
30
BS EN132100
Clause 4.8, 4.12
and 4.13
Adhesion, rapid temp change and
climatic sequence
X7R (2R1):
A, F and J only
5N force applied for 10s, -55ºC/+125ºC for 5 cycles,
damp heat cycles
P11
12
12
27
30
0
0
C0G/NP0 (1B):
All types X7R (2R1):
Y and H only
3mm deflection Class I
2mm deflection Class II
P12
Board flex
AEC-Q200-005
BS EN132100
Clause 4.9
P13
P14
P15
P16
Board flex
Terminal strength
Beam load test
X7R (2R1): A, F and J only
All types
1mm deflection
12
12
12
12
12
30
30
45
0
0
0
0
Force of 1.8kg for 60 seconds
AEC-Q200-006
AEC-Q200-003
All types
-
56 days, 40ºC/93ꢀ RH 15x no volts, 15x 5Vdc,
15x rated voltage or 50V whichever is the least
BS EN132100
Clause 4.14
Damp heat steady state
All types
Test results are available on request.
P = Period in months. N = Sample size. C = Acceptance criteria.
8
Manufacturing Process
KNOWLES RELIABILITY GRADES
PRODUCTION PROCESS FLOWCHART
High reliability (space quality)
Electrode ink material
Ceramic powder
preparation
Space
Grade
ESCC 3009(1)
MIL Grade
Multilayer build
Fire
IECQ-CECC(2)
AEC-Q200(3)
Standard components
Standard reliability
Notes:
Rumble
1) Space grade tested in accordance with ESCC3009 (refer to Knowles Spec S02A
0100) or MIL Grade (in accordance with MIL-PRF-123, MILPRF-55681).
2) IECQ-CECC. The International Electrotechnical Commission (IEC) Quality Assessment
System for Electronic Components. This is an internationally recognized product
quality certification that provides customers with assurance that the product
supplied meets high-quality standards. View Knowles IECQ-CECC approvals at
iecq.org or at knowlescapacitors.com
DPA inspection
Termination
3) AEC-Q200. Automotive Electronics Council Stress Test Qualification For Passive
Components. Refer to Knowles application note AN0009.
Plating (if specified)
Printing (if specified)
KNOWLES RELIABILITY SURFACE MOUNT
PRODUCT GROUPS
High reliability
Electrical test
Tandem
FlexiCapTM
capacitors(1)
Test verification
Open Mode
FlexiCapTM capacitors(2)
Additional sample Rel
tests (if specified)
Standard FlexiCapTM capacitors(3)
Standard components
Standard reliability
QC inspection
Notes:
1) “Tandem” construction capacitors, i.e., internally having the equivalent of two series
capacitors. If one of these should fail or short circuit, there is still capacitance end to
end and the chip will still function as a capacitor, although capacitance may be
affected. Refer to application note AN0021. Also available qualified to AEC-Q200.
Additional Hi Rel activities
(S02A 100ꢀ burn-in, QC insp)
2) “Open Mode” capacitors with FlexiCapTM termination also reduce the possibility of a
short circuit by utilizing inset electrode margins. Refer to application note AN0022.
Also available qualified to AEC-Q200.
Packaging
TM
3) Multilayer capacitors with Knowles FlexiCapTM termination. By using FlexiCap
termination, there is a reduced possibility of the mechanical cracking occurring.
Finished goods store
TM
4) “Standard” capacitors include MLCCs with tin finish over nickel but no FlexiCap .
9
Other Products Available That Are Not
AEC-Q200 Qualified
HIGH TEMPERATURE HiT RANGE
200°C - C0G/NP0 (1B) & X7R (2R1)
The HiT range of multilayer ceramic capacitors is suitable for a
Insulation Resistance (IR):
25ºC >100GΩ or 1000secs (whichever is the least)
variety of high temperature applications, including: oil exploration,
geothermal, military, automotive under-hood and avionics. This range
is manufactured to exacting standards using our unique screen
printing process. This provides a high-quality component suitable for
demanding applications.
200ºC >1GΩ or 10secs (whichever is the least)
Temperature Coefficient of Capacitance (TCC):
C0G/NP0 (1B) 30ppm/ºC to +125°C
• 200ºC operating temperature
X7R (2R1) 15ꢀ to +125°C
• 0603 to 2220 chip sizes
• C0G/NP0 (1B) and X7R dielectric options
• Capacitance range C0G/NP0 (1B) from 3.9pF up to 47nF
• Capacitance range X7R (2R1) from 100pF up to 4.7µF
• Voltage ratings from 10V to 630V
• RoHS compliant/Pb free
Aging Rate:
C0G/NP0 (1B) Zero.
X7R (2R1) typically less than 2ꢀ per time decade
• Sn over Ni termination
• Sample kits available
HIGH TEMP. HiT250 RANGE
250°C — C0G/NP0 (1B) & X7R (2R1)
The HiT250 range of multilayer ceramic capacitors is suitable for a
variety of high temperature applications, including: oil exploration,
geothermal, military, automotive under-hood and avionics.
Insulation Resistance (IR):
25ºC >100GΩ or 1000secs (whichever is the least)
250ºC >100MΩ or 1secs (whichever is the least)
This range is manufactured to exacting standards using our unique
screen printing process. This provides a high-quality component
suitable for demanding applications.
Temperature Coefficient of Capacitance (TCC):
C0G/NP0 (1B) 30ppm/ºC to +125°C
• 250ºC operating temperature
• 0603 to 2220 chip sizes
X7R (2R1) 15ꢀ to +125°C
• C0G/NP0 (1B) and X7R dielectric options
• Capacitance range C0G/NP0 (1B) from 3.9pF up to 39nF
• Capacitance range X7R (2R1) from 1nF up to 2.2µF
• Voltage ratings from 10V to 630V
• RoHS compliant/Pb free
Aging Rate:
C0G/NP0 (1B) Zero
X7R (2R1) typically less than 2ꢀ per time decade
• Au over Ni termination
• Sample kits available
46
Our Other Products
Broadband Blocking Capacitors
EMI Filters
Feedthrough EMI Filters
Gain Equalizers
Hi-Rel Products
High Capacitance Value Chips
High Temperature Capacitors
HiT Capacitors
Opti-Cap Capacitors
Planar Arrays
Powder Dividers
Pulse Capacitors
Pulse Power Capacitors
Radial Leaded Capacitors
Safety Certified Capacitors
Single Layer Capacitors
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Asian Sales Office
O: +86 512 62588258
F: +86 512 62589258
KPD-Asia-sales@knowles.com
European Sales Office
O: +44 1603 723300
F: +44 1603 723301
KPD-Europe-sales@knowles.com
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O: +1 661 295 5920
F: +1 661 295 5928
O: +1 315 655 8710
F: +1 315 655 0445
KPD-NA-sales@knowles.com
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