DN4Q24TTE [KOA]
diode terminator network; 二极管终止网络
| 型号： | DN4Q24TTE |
| 厂家： | 
KOA SPEER ELECTRONICS, INC. |
| 描述： | diode terminator network |
| 文件： | 总2页 (文件大小：97K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DN(X)
diode terminator network
EU
features
• Fast reverse recovery time
• Low capacitance
• Fast turn on time
• SMD packages
• 16 kV IEC61000-4-2 capable
• Products with lead-free terminations meet EU RoHS
and China RoHS requirements
applications
• Signal termination
• Signal conditioning
• ESD suppression
• Transient suppression
dimensions and construction
Dimensions inches (mm)
S03
S04
Package Total
L
L
Pins
3
Pkg Ht
Code Power
L
0.2
W
0.2
p
0.ꢀ
d 0.05
P
0.2
p
Bonding
Bonding
Wire
Wire
.115
(2.92)
.091
(2.30)
.075
(1.91)
.037
(0.95)
.017
(0.43)
S03 225mw
Lead
Die
Pad
.115
(2.92)
.091
(2.30)
.075
(1.91)
.037
(0.95)
.017
(0.43)
S04 225mw
S06 225mw
N08 400mw
Q20 ꢀ000mw
Q24 ꢀ000mw
4
d
W
Lead
W
Si
Die
Wafer
.037
(0.95)
.037
(0.95)
.017
(0.43)
Pad
.115
(2.92)
.110
(2.80)
d
Si
6
Wafer
Molded
Resin
Molded
Resin
.190
(4.83)
.236
(5.99)
.050
(1.27)
.063
(1.60)
.016
(0.41)
8
N08, Q20,
Q24
S06
.341
(8.66)
.236
(5.99)
.025
(0.635)
.063
(1.60)
.010
(0.25)
L
p
L
20
24
Bonding
Wire
Bonding
Wire
.341
(8.66)
.236
(5.99)
.025
(0.635)
.063
(1.60)
.010
(0.25)
d
p
Lead
Lead
W
W
Die
Pad
Wafer
Die
d
Si
Pad
Si
Molded
Resin
Wafer
Molded
Resin
circuit schematic
1
1
1
1
DN3: 6 pins
DN4: 4 pins
DN2: 20 pins
DNA: 20 pins
1
1
1
DN6: 8 pins
DN5: 24 pins
DN7: 24 pins
For further information on packaging, please refer to Appendix A.
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
11/21/08
200
KOA Speer Electronics, Inc. • 199 Bolivar Drive • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com
DN(X)
diode terminator network
ordering information
New Part #
DNA
Q20
T
TEB
Package
Symbol
Termination
Material
Type
Packaging
DNA
DN2
DN3
DN4
DN5
DN6
DN7
Package type symbol + number of pins
S03: 3 pin SOT23
S04: 4 pin SOT23
S06: 6 pin SOT23
N08: 8 pin Narrow SOIC
Q20: 20 pin QSOP
T: Sn
TE: 7" embossed plastic
TEB: 13" embossed
plastic tape
(Other termination
styles available,
contact factory
for options)
Q24: 24 pin QSOP
application schematic
ESD Suppression
Signal Conditioning
Transient
Transient
Signal
Ringing
Ringing
Eliminate
+ Rail
Suppressed
+ Rail
Driver
Receiver
Driver
Receiver
– Rail or GND
– Rail or GND
applications and ratings
Reverse
ESD
Forward
Leakage
Current
@7V
Operating
Temperature
Range
Continuous
Forward
Current*
Part
Designation
Breakdown
Voltage
Capacitance
@ꢀMhz
Voltage
Voltage
Capability
IEC 6ꢀ000-4-2
ꢀF=50ma
ꢀ
R=ꢀma
-55°C
to +125°C
DN(X)
0.4 to 1.2V
7.2V
1uA
2pF
16kV
50mA
* One diode conducting
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
11/21/08
201
KOA Speer Electronics, Inc. • 199 Bolivar Drive • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com
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