DN5524B [KOA]
Diode Termination Array, 18-Line;
| 型号： | DN5524B |
| 厂家： | 
KOA SPEER ELECTRONICS, INC. |
| 描述： | Diode Termination Array, 18-Line 接口集成电路 |
| 文件： | 总2页 (文件大小：102K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Electrical Characteristics
Supply Voltage
(VDD) . . . . . . . . . . . . . -.3V to +7V
Channel Clamp
Current. . . . . . . . . . . . . ±50mA
Package Power
Rating @ 70°C . . . . . . . 1W
Operating
Temperature . . . . . . . . . . 0°C to +70°C
Storage Temperature. . . . -65°C to +150°C
Forward Voltage
(to VDD @ 50ma). . . . . 0.55V to 0.90V
Forward Voltage
(to GND @ 50ma). . . . . 0.55V to 0.85V
Reverse Recovery
Time (@ 50ma) . . . . . . . <400ps
Channel Leakage
(0<Vin<VDD) . . . . . . . 0.1µA to 5µA
Input Capacitance
(If = 1MHz,
Vin = 2.5v) . . . . . . . . . . 5pF
DN5 SERIES
Low parasitics, fast reverse recovery time, and a
low forward voltage characteristic make KOA’s DN5
Schottky diode network an excellent bus terminator
for very high speed I/O. This network offers the
designer a single package solution to address
overshoot and undershoot problems, ringing, and
bus reflections that are common to high speed I/O.
Today these networks are commonly used to
optimize bus performance in high end computers,
external data storage peripherals, LAN networks,
and many other applications where high transfer
rates are necessary.
ESD Protection . . . . . . . 4KV min.
Circuit Schematic
VDD
24
VDD
GND
13
Features
■
Negligible reverse recovery time
G
■
Low capacitance
Low forward voltage drop
■
1
12
VDD
■
GND
GND
18-channel terminator in a single package
■
Resolved bus impedance mismatch
Available Pin Configurations
= Number of Pins (24)
See physical configurations on page G-3
for available pin/package configurations.
Applications
n
■
Termination of data/control signals @ ≥ 66 MHz
■
Dynamic RAM bus termination
■
RISC architecture
■
■
■
Bolivar Drive, P.O. Box 547, Bradford, PA 16701 USA
814-362-5536
Fax: 814-362-8883
www.koaspeer.com
G-2
Physical Configurations
Mechanical Characteristics
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . Resistance
Body Style . . . . . . . . . . . . . . . . . . . . . Pin Count
Item. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Material
Substrate . . . . . . . . . . . . . . . . . . . . . . . Silicon
Resistor material. . . . . . . . . . . . . . . . . . . . TaN
Passivation . . . . . . . . . . . . . . . . . . . . . . Glass
QSOP . . . . . . . . . . . . . . . . . . . . . 24
TSSOP . . . . . . . . . . . . . . . . . . . . 24
Die Pack * . . . . . . . . . . . . . . . . . . 24
Part Marking
Manufacturer's
Trademark
Date Code
9909
Model
DN5 Q24
Body Style/
Pin Count
Pin 1 Indicator
(Molded Indent)
* See page J-6 for preliminary Die Pack specifications.
Ordering Information
DN5
Q
24
B
Circuit
Type
Body
Style
Number
of Pins
Packaging
Q = QSOP
24
B = 13"
G
See
above
table
Embossed
Plastic Tape
& Reel, see
Packaging
Section for
details
T = TSSOP
6 = 0.6 mm
Die Pack
5 = 0.5 mm
Die Pack
4 = 0.4 mm
Die Pack
■
■
■
Bolivar Drive, P.O. Box 547, Bradford, PA 16701 USA
814-362-5536
Fax: 814-362-8883
www.koaspeer.com
G-3
相关型号：
©2020 ICPDF网 联系我们和版权申明