X5R1210ATTDB225K [KOA]

Ceramic Chip Capacitors; 陶瓷芯片电容
X5R1210ATTDB225K
型号: X5R1210ATTDB225K
厂家: KOA SPEER ELECTRONICS, INC.    KOA SPEER ELECTRONICS, INC.
描述:

Ceramic Chip Capacitors
陶瓷芯片电容

文件: 总8页 (文件大小:205K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SS-241 R5  
AHA 1/24/07  
Ceramic Chip Capacitors  
CERTIFIED  
CERTIFIED  
Type X5R  
1. General  
General purpose dielectric for ceramic capacitors  
EIA class ll dielectric  
Temperature variation of capacitance is within ±15% from -55°C to +85°C  
Well suited for decoupling and filtering applications  
Available in high capacitance values (up to 100 µF)  
2. Dimensions  
Table 1  
Dimensions in inches (mm)  
L
Dimensions inches (mm)  
Case  
Size  
L
W
t (Max.)  
d
W
.039±.004  
.02±.004  
.021  
.01±.006  
(0.25±0.15)  
0402  
0603  
0805  
1206  
1210  
(1.0±0.1)  
(0.5±0.1)  
(0.55)  
t
.063±.006  
(1.6±0.15)  
.032±.006  
(0.81±0.15)  
.035  
(0.9)  
.014±.006  
(0.35±0.15)  
d
d
.079±.008  
(2.01±0.2)  
.049±.008  
(1.25±0.2)  
.051  
(1.3)  
.02±.01  
(0.50±0.25)  
Ceramic  
Body  
.126±.008  
(3.2±0.2)  
.063±.008  
(1.6±0.2)  
.059  
(1.5)  
.02±.01  
(0.5±0.25)  
.126±.008  
(3.2±0.2)  
.098±.008  
(2.5±0.2)  
.067  
(1.7)  
.02±.01  
(0.5±0.25)  
Solder  
Plating (Sn)  
Ni  
Plating  
Electrodes  
Silver  
Metallization  
3. Type Designation  
The type designation shall be the following form:  
X5R  
0805  
A
T
TD  
225  
K
Dielectric  
Size  
Voltage  
Termination  
Packaging  
Capacitance  
Code  
Capacitance  
Tolerance  
0402  
0603  
0805  
1206  
1210  
K
A
= 6.3V  
= 10V  
2 significant  
digits + no.  
of zeros.  
TP: 7" 2mm pitch  
(0402 only)  
TD: 7" Paper tape  
TE: 7" Embossed plastic  
TDB: 13" Paper tape  
TEB: 13" Embossed plastic  
T: Sn  
K: ±10%  
C = 16V  
PAGE 1 OF 8  
Bolivar Drive  
P.O. Box 547  
Bradford, PA 16701  
USA  
814-362-5536  
Fax 814-362-8883  
www.koaspeer.com  
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.  
SS-241 R5  
4. X5R Dielectric Capacitance Range  
Available sizes are shaded.  
Capacitance tolerance available: ±10%  
PAGE 2 OF 8  
www.koaspeer.com  
Bolivar Drive  
P.O. Box 547  
Bradford, PA 16701  
USA  
814-362-5536  
Fax 814-362-8883  
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.  
SS-241 R5  
5. Characteristics  
Item  
Requirement  
Test Methods  
Operating  
-55°C to +85°C  
Temperature cycle chamber  
Temperature Range  
Capacitance  
Within specified tolerance  
Frequency: 1.0 kHz ± 10%  
Voltage: 1.0 Vrms ± .2 V  
For Cap > 10 µF, 0.5 Vrms @ 120 Hz  
Dissipation Factor  
2.5% for 50V DC rating  
5.0% for 10V DC rating  
Insulation  
Resistance  
100,000 M or 500 M - µF,  
whichever is less  
Charge device with rated voltage for  
60 ± 5 secs @ room temp/humidity  
Dielectric  
Strength  
No breakdown or visual defects  
Charge device with 300% of rated voltage for  
1-5 seconds, w/charge and discharge current  
limited to 50 mA (max)  
Resistance to  
Flexure Stresses  
Appearance  
No defects  
Deflection: 1 mm  
Test Time: 30 seconds  
Capacitance Variation  
Dissipation Factor  
Insulation Resistance  
± 10%  
Meets initial values  
Initial Value x 0.3  
90 mm  
Solderability  
95% of each terminal should be covered  
with fresh solder  
Dip device in eutectic solder at 230 ± 5°C  
for 5.0 ± 0.5 seconds  
Resistance to  
Solder Heat  
Appearance  
No defects, < 25% leaching  
of either end terminal  
Dip device in eutectic solder at 260°C for  
60 seconds. Store at room temperature  
for 24 ± 2 hours before measuring  
electrical properties  
Capacitance Variation  
Dissipation Factor  
± 7.5%  
Meets initial values  
Insulation Resistance Meets initial values  
Dielectric Strength  
Meets initial values  
Thermal Shock  
Appearance  
No visual defects  
± 7.5%  
Step 1: -55°C ± 2°  
Step 2: Room temp  
30 ± 3 minutes  
3 minutes  
Capacitance Variation  
Dissipation Factor  
Meets initial values  
Step 3: +85°C ± 2° 30 ± 3 minutes  
Step 4: Room temp 3 minutes  
Insulation Resistance Meets initial values  
Dielectric Strength  
Meets initial values  
Repeat for 5 cycles and measure after  
24 ± 2 hours at room temperature  
PAGE 3 OF 8  
Bolivar Drive  
P.O. Box 547  
Bradford, PA 16701  
USA  
814-362-5536  
Fax 814-362-8883  
www.koaspeer.com  
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.  
SS-241 R5  
5. Characteristics (continued)  
Item  
Requirement  
Test Methods  
Load Life  
Appearance  
No visual defects  
± 12.5%  
Charge device with twice rated voltage  
in test chamber set at 85°C ± 2°C for  
1000 hours (+48, -0)  
Capacitance Variation  
Dissipation Factor  
Insulation Resistance  
Dielectric Strength  
Initial value x 2.0  
Initial value x 0.3  
Meets initial values  
Remove from test chamber and stabilize at  
room temp. and humidity for 24 ±2 hours  
before measuring  
Load Humidity  
Appearance  
No visual defects  
± 12.5%  
Store in a test chamber set at 85°C ± 2°C/  
85% ±5% relative humidity for 1000 hours  
(+48, -0) with rated voltage applied  
Capacitance Variation  
Dissipation Factor  
Insulation Resistance  
Dielectric Strength  
Initial value x 2.0  
Initial value x 0.3  
Meets initial values  
Remove from chamber and stabilize at  
room temp. and humidity for 24 ±2 hours  
before measuring  
6. Typical Impedance Characteristics  
X5R -Temperature Coefficient  
Insulation Resistance vs Temp.  
+20  
10000  
1000  
100  
+15  
+10  
+5  
0
-5  
-10  
-15  
-20  
-60  
-40 -20  
0
+20 +40 +60 +80  
+20  
+25  
+40  
+60  
+80 +100  
Temperature (°C)  
Temperature (°C)  
PAGE 4 OF 8  
Bolivar Drive  
P.O. Box 547  
Bradford, PA 16701  
USA  
814-362-5536  
Fax 814-362-8883  
www.koaspeer.com  
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.  
SS-241 R5  
7. Tape and Reel Quantities  
All tape and reel specifications are in compliance with RS481.  
Size  
Dielectric  
Voltage  
Cap. Range  
TP  
TD  
TE  
TDB  
TEB  
0402  
0603  
0805  
1206  
1210  
All  
All  
All  
All  
All  
10  
All  
All  
10000  
–––  
–––  
4000  
–––  
–––  
–––  
–––  
15000  
–––  
–––  
–––  
–––  
–––  
–––  
All  
X5R  
X5R  
X5R  
All  
–––  
3000  
2000  
2000  
All  
–––  
–––  
–––  
106 ~ 226  
–––  
–––  
–––  
* TP is a 7" reel with a 2mm pitch,  
TD & TE are 7" reels,  
TDB & TEB are 13" reels  
8. Reel Dimensions  
W3 (Includes flange  
distortion at  
outer edge).  
1.575 (40) min.  
Access hole at  
slot location.  
W2 (Measured at hub).  
B*  
(Arbor hole dia.)  
C
D*  
A
N (Hub dia.)  
Full radius*  
W1 (Measured at hub).  
Tape slot in core  
for tape start.  
0.98 (2.5) min. width,  
.394 (10) min. depth.  
* Drive spokes optional. If used,  
asterisked dimensions apply.  
Dimensions in inches (mm)  
Tape  
A
Max.  
B*  
Min.  
D*  
Min.  
N
Min.  
W2  
Max.  
C
W1  
W3  
Size(1)  
.311  
.331-± .060  
(7.9 Min.)  
.567  
14.4  
0.0  
8mm  
(8.4 ±- 1.0  
)
.429  
0.0  
12.992  
(330)  
0.059  
(1.5)  
0.512 ± 0.008  
(13.0 ± 0.20)  
.795  
(20.2)  
1.969  
(50)  
(10.9 Max.)  
.469  
± .076  
(11.9 Min.)  
12mm  
.488  
.724  
(18.4)  
-
0.0  
(12.4±- 2.0  
)
.607  
0.0  
(15.4 Max.)  
Metric dimensions will govern.  
English measurements rounded and for reference only.  
(1) For tape sizes 16mm and 24mm (used with chip size 3640) consult EIA RS-481 latest revision.  
PAGE 5 OF 8  
Bolivar Drive  
P.O. Box 547  
Bradford, PA 16701  
USA  
814-362-5536  
Fax 814-362-8883  
www.koaspeer.com  
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.  
SS-241 R5  
9. Carrier Tape Specifications  
P0  
tolerance on tape  
±0.008 (±0.2)  
T2  
Embossment  
Embossed plastic  
P2  
D0  
T
8 & 12mm  
Deformation  
between  
embossments  
E
F
G1  
See note 3  
A0  
Top  
cover  
tape  
W
B1  
B0  
P1  
K0  
G2  
See note 4  
T1  
Center lines  
of cavity  
For tape feeder reference  
only including draft  
concentric around B0  
D1 for components  
.079 x .047 (2.0 x 1.2)  
and larger  
Maximum cavity  
size, see note 1  
User direction of feed  
Dimensions in inches (mm)  
Tape Size  
Constant  
D0  
E
P0  
P2  
T Max.  
T1  
G1  
G2  
.059 ±- .004 .069 ± .004 .157 ± .004 .079 ± .002  
.024  
(0.600)  
.004  
(0.10)  
Max.  
.030  
(0.75)  
Min.  
.030  
(0.75)  
Min.  
0.0  
± 0.10  
8mm  
and  
12mm  
(1.5  
) (1.75 ±0.10) (4.0 ± 0.10) (2.0 ± 0.05)  
-
0.0  
See note 3 See note 4  
Tape Size  
Variable  
B1  
Max.  
D1  
R
Min.  
Min.  
See note 6 See note 5  
F
P1  
See note 2  
T2  
W
A0B0K0  
.179  
(4.55)  
.039  
(1.0)  
.138 ± .002 .157 ± .004  
(3.5 ± 0.05) (4.0 ± 0.10)  
.984  
(25)  
.098  
(2.5 Max.)  
.315 -± .012  
.004  
8mm  
See note 1  
± 0.3  
-
(8.0  
)
0.1  
.323  
(8.2)  
.059  
(1.5)  
.217 ± .002 .157 ± .004  
(5.5 ± 0.05) (4.0 ± 0.10)  
1.181  
(30)  
.256  
.472 ± .012  
12mm  
See note 1  
See note 1  
See note 1  
(6.5 Max.) (12.0 ± .30)  
12mm  
1/2 Pitch  
.179  
(4.55)  
.039  
(1.0)  
.138 ± .002 .079 ± .004  
(3.5 ± 0.05) (2.0 ± 0.10)  
.984  
(25)  
.098  
(2.5 Max.)  
.315 -± .012  
.004  
± 0.3  
(8.0  
)
-
0.1  
12mm  
Double Pitch  
.323  
(8.2)  
.059  
(1.5)  
.217 ± .002 .315 ± .004  
(5.5 ± 0.05) (8.0 ± 0.10)  
1.181  
(30)  
.256  
.472 ± .012  
(6.5 Max.) (12.0 ± .30)  
Notes:  
1. A0, B0 and K0 are determined by the max. dimensions to the ends of the terminals extending from the components body and/or the body of the  
component. The clearance between the end of the terminals of the body of the components to the sides and depth of the cavity (A0, B0 and K0)  
must be within .002" (0.05)mm min. and .020" (0.50)mm max. The clearance allowed must also prevent rotation of the component within the  
cavity of not more than 20 degrees (see examples A & B).  
2. Tape with components shall pass around radius "R" without damage. The minimum trailer length (Note 2 Fig. 3) may require additional length to  
provide R min. for .472" (12)mm embossed tape for reels with hub diameters approaching N min. (Table 4).  
3. G1 dimension is the flat area from the edge of the sprocket hole to either the outward deformation of the carrier tape between the embossed  
cavities or to the edge of the cavity whichever is less.  
4. G2 dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier tape  
between the embossed cavity or to the edge of the cavity whichever is less.  
PAGE 6 OF 8  
Bolivar Drive  
P.O. Box 547  
Bradford, PA 16701  
USA  
814-362-5536  
Fax 814-362-8883  
www.koaspeer.com  
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.  
SS-241 R5  
9. Carrier Tape Specifications (continued)  
Embossed plastic  
8 & 12mm  
Notes:  
5. The embossed hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment  
location and hole location shall be applied independent of each other.  
20° Maximum Component Rotation  
6. B1 dimension is a reference dimension for tape feeder clearance only.  
Typical component  
cavity center line  
20°  
BO  
Maximum Component Rotation  
Typical component  
center line  
Side or Front Sectional View  
Example "A"  
AO  
Top View Example "B"  
10 pitches cumulative  
tolerance on tape  
±0.008 (±0.2)  
10. Carrier Tape Specifications  
P0  
Punched paper tape  
8 & 12mm  
P2  
D0  
T
E
F
Top  
W
cover  
B0  
tape  
Bottom  
cover  
tape  
G1  
A0  
T1  
T1  
P1  
Cavity size,  
see note 1  
G2  
Center lines  
of cavity  
User direction of feed  
Dimensions in inches (mm)  
Tape Size  
Constant  
D0  
E
P0  
P2  
T1  
G1  
G2  
R MIN  
8mm  
and  
12mm  
.059 -± .004  
.069 ± .004  
(1.75 ±0.10)  
.157 ± .004  
(4.0 ± 0.10)  
.079 ± .002  
(2.0 ± 0.05)  
.004  
(0.10)  
Max.  
.030  
(0.75)  
Min.  
.030  
(0.75)  
Min.  
.984  
(25)  
See note 2  
.000  
(1.5 ±- 0.1  
)
0.0  
Tape Size  
Variable  
P1  
F
W
A0B0  
T
± .012  
.157 ± .004  
(4.0 ± 0.10)  
.138 ± .002  
(3.5 ± 0.05)  
.315  
-
.004  
8mm  
± 0.3  
(8.0  
)
0.1  
-
.157 ± .004  
(4.0 ± .010)  
.217 ± .002  
(5.5 ± 0.05)  
.472 ± .012  
(12.0 ± 0.3)  
12mm  
See note 1  
See note 3  
± .012  
8mm  
1/2 Pitch  
.079 ± .004  
(2.0 ± 0.10)  
.138 ± .002  
(3.5 ± 0.05)  
.315  
(8.0  
-
.004  
± 0.3  
)
-
0.1  
12mm  
Double Pitch  
.315 ± .004  
(8.0 ± .010)  
.217 ± .002  
(5.5 ± 0.05)  
.472 ± .012  
(12.0 ± 0.3)  
PAGE 7 OF 8  
www.koaspeer.com  
Bolivar Drive  
P.O. Box 547  
Bradford, PA 16701  
USA  
814-362-5536  
Fax 814-362-8883  
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.  
SS-241 R5  
10. Carrier Tape Specifications (continued)  
Punched paper tape  
8 & 12mm  
Notes:  
1. A0, B0 and T are determined by the max. dimensions to the ends of the terminals extending from the component body and/or the body dimensions  
of the component. The clearance between the ends of the terminals or body of the components to the sides and depth of the cavity (A0, B0  
and T) must be within .002" (0.05) mm min. and .020" (0.50) mm max. The clearance allowed must also prevent rotation of the component  
within the cavity of not more than 20 degrees (see examples C & D).  
2. Tape with components shall pass  
20° Maximum Component Rotation  
around radius "R" without damage.  
3. .043" (1.1) mm base tape and  
.063" (1.6) mm max. for  
T
Typical component  
cavity center line  
20°  
BO  
non-paper base compositions.  
Maximum Component Rotation  
Side or Front Sectional View  
Example "C"  
Typical component  
center line  
AO  
Top View Example "D"  
11. Recommended Land Pattern Dimensions  
Component pads should be designed to achieve good solder filets and minimize component movement during reflow soldering.  
Pad dimensions are given below for multilayer ceramic capacitors for both reflow and wave soldering. The basis for these designs is:  
Pad width equal to component width. It is permissible to decrease this to as low as 85% of component width but it is not advisable to go below this.  
Pad overlap 0.5mm beneath component  
Pad extension 0.5mm beyond components for reflow and 1.0mm for wave soldering  
C
D
B
C
Case Size  
0402  
A
B
C
D
A
0.02  
(0.50)  
0.07  
(1.70)  
0.02  
(0.60)  
0.02  
(0.50)  
0.03  
(0.75)  
0.09  
(2.30)  
0.03  
(0.80)  
0.03  
(0.70)  
0603  
0.05  
(1.25)  
0.12  
(3.00)  
0.04  
(1.00)  
0.04  
(1.00)  
0805  
0.06  
(1.60)  
0.16  
(4.00)  
0.04  
(1.00)  
0.09  
(2.00)  
1206  
0.10  
(2.50)  
0.16  
(4.00)  
0.04  
(1.00)  
0.09  
(2.00)  
1210  
PAGE 8 OF 8  
Bolivar Drive  
P.O. Box 547  
Bradford, PA 16701  
USA  
814-362-5536  
Fax 814-362-8883  
www.koaspeer.com  
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.  

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