KK74HC365AD [KODENSHI]
Bus Driver/Transceiver;
| 型号： | KK74HC365AD |
| 厂家： | 
KODENSHI KOREA CORP. |
| 描述： | Bus Driver/Transceiver |
| 文件： | 总6页 (文件大小：216K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TECHNICAL DATA
KK74HC365A
Hex 3-State Noninverting Buffer
with Common Enables
High-Performance Silicon-Gate CMOS
The KK74HC365A is identical in pinout to the LS/ALS365. The
device inputs are compatible with standard CMOS outputs; with pullup
resistors, they are compatible with LS/ALSTTL outputs.
This device is a high-speed hex buffer with 3-state outputs and two
common active-low Output Enables. When either of the enables is high,
the buffer outputs are placed into high-impedance states. The
KK74HC365A has noninverting outputs.
ORDERING INFORMATION
KK74HC365AN Plastic
KK74HC365AD SOIC
TA = -55° to 125° C for all packages
•
•
•
•
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 2.0 to 6.0 V
Low Input Current: 1.0 µA
High Noise Immunity Characteristic of CMOS Devices
PIN ASSIGNMENT
LOGIC DIAGRAM
FUNCTION TABLE
Inputs
Output
Y
Enable Enable
A
1
L
L
H
X
2
L
L
X
H
L
H
X
X
L
H
Z
Z
PIN 16 =VCC
PIN 8 = GND
Z = high impedance
X = don’t care
1
KK74HC365A
MAXIMUM RATINGS*
Symbol
Parameter
Value
-0.5 to +7.0
-1.5 to VCC +1.5
-0.5 to VCC +0.5
±20
Unit
V
VCC
VIN
VOUT
IIN
DC Supply Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
V
V
mA
mA
mA
mW
IOUT
ICC
DC Output Current, per Pin
±35
DC Supply Current, VCC and GND Pins
±75
PD
Power Dissipation in Still Air, Plastic DIP+
SOIC Package+
750
500
Tstg
TL
Storage Temperature
-65 to +150
260
°C
°C
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP or SOIC Package)
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
+Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C
SOIC Package: : - 7 mW/°C from 65° to 125°C
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Parameter
Min
2.0
0
Max
Unit
V
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
Operating Temperature, All Package Types
6.0
VCC
VIN, VOUT
TA
V
-55
+125
°C
ns
tr, tf
Input Rise and Fall Time (Figure 1)
VCC =2.0 V
VCC =4.5 V
VCC =6.0 V
0
0
0
1000
500
400
This device contains protection circuitry to guard against damage due to high static voltages or electric fields.
However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this
high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or
V
OUT)≤VCC.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused
outputs must be left open.
2
KK74HC365A
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
VCC
V
Guaranteed Limit
Symbol
VIH
Parameter
Test Conditions
Unit
V
25 °C
to
≤85 ≤125
°C
°C
-55°C
Minimum High-
Level Input Voltage
VOUT= VCC-0.1 V
⎢IOUT⎢≤ 20 µA
2.0
4.5
6.0
1.5
3.15
4.2
1.5
3.15
4.2
1.5
3.15
4.2
VIL
Maximum Low -
Level Input Voltage
VOUT=0.1 V
⎢IOUT⎢ ≤ 20 µA
2.0
4.5
6.0
0.3
0.9
1.2
0.3
0.9
1.2
0.3
0.9
1.2
V
VOH
Minimum High-
Level Output Voltage
VIN=VIH
⎢IOUT⎢ ≤ 20 µA
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
V
VIN=VIH
4.5
6.0
3.98
5.48
3.84
5.34
3.7
5.2
⎢IOUT⎢ ≤ 6.0 mA
⎢IOUT⎢ ≤ 7.8 mA
VOL
Maximum Low-
Level Output Voltage
VIN= VIL
⎢IOUT⎢ ≤ 20 µA
2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
VIN= VIL
4.5
6.0
0.26
0.26
0.33
0.33
0.4
0.4
⎢IOUT⎢ ≤ 6.0 mA
⎢IOUT⎢ ≤ 7.8 mA
IIN
Maximum Input
Leakage Current
VIN=VCC or GND
6.0
±0.1
±1.0 ±1.0
µA
µA
IOZ
Maximum Three-
State Leakage
Current
Output in High-Impedance
State
VIN= VIL or VIH
VOUT=VCC or GND
6.0
±0.5
±5.0
±10
ICC
Maximum Quiescent VIN=VCC or GND
6.0
8.0
80
160
µA
Supply Current
(per Package)
I
OUT=0µA
3
KK74HC365A
AC ELECTRICAL CHARACTERISTICS (CL=50pF,Input tr=tf=6.0 ns)
VCC
V
Guaranteed Limit
Symbol
Parameter
Unit
ns
25 °C
to
≤85°C ≤125°C
-55°C
tPLH, tPHL Maximum Propagation Delay, Input A to
Output Y (Figures 1 and 3)
2.0
4.5
6.0
120
24
150
30
180
36
20
26
31
tPLZ, tPHZ Maximum Propagation Delay ,Output Enable to
Output Y (Figures 2 and 4)
2.0
4.5
6.0
220
44
37
275
55
47
330
66
56
ns
tPZL, tPZH Maximum Propagation Delay ,Output Enable to
Output Y (Figures 2 and 4)
2.0
4.5
6.0
220
44
37
275
55
47
330
66
56
ns
tTLH, tTHL Maximum Output Transition Time, Any Output
(Figures 1 and 3)
2.0
4.5
6.0
60
12
10
75
15
13
90
18
15
ns
CIN
Maximum Input Capacitance
-
-
10
15
10
15
10
15
pF
pF
COUT
Maximum Three-State Output Capacitance
(Output in High-Impedance State)
Power Dissipation Capacitance (Per Buffer)
Typical @25°C,VCC=5.0 V
CPD
Used to determine the no-load dynamic power
consumption:
40
pF
PD=CPDVCC2f+ICCVCC
Figure 1. Switching Waveforms
Figure 2. Switching Waveforms
4
KK74HC365A
Figure 3. Test Circuit
Figure 4. Test Circuit
EXPANDED LOGIC DIAGRAM
(1/6 of the Device)
5
KK74HC365A
N SUFFIX PLASTIC DIP
(MS - 001BB)
A
Dimension, mm
9
8
16
1
Symbol
MIN
18.67
6.1
MAX
19.69
7.11
B
A
B
C
D
F
5.33
0.36
1.14
0.56
F
L
1.78
C
2.54
7.62
G
H
J
SEATING
PLANE
-T-
N
M
0
°
10
°
J
G
K
H
D
2.92
7.62
0.2
3.81
8.26
0.36
K
L
M
N
0.25 (0.010) M
T
NOTES:
1. Dimensions “A”, “B” do not include mold flash or protrusions.
Maximum mold flash or protrusions 0.25 mm (0.010) per side.
0.38
D SUFFIX SOIC
(MS - 012AC)
Dimension, mm
A
16
Symbol
MIN
9.8
MAX
10
9
A
B
C
D
F
H
B
P
3.8
4
1.35
0.33
0.4
1.75
0.51
1.27
1
8
G
R x 45
C
1.27
5.72
G
H
J
-T-
SEATING
PLANE
K
M
D
J
F
0.25 (0.010) M T C
M
0
°
8
°
0.1
0.19
5.8
0.25
0.25
6.2
K
M
P
NOTES:
1. Dimensions A and B do not include mold flash or protrusion.
2. Maximum mold flash or protrusion 0.15 mm (0.006) per side
0.25
0.5
R
for A; for B 0.25 mm (0.010) per side.
‑
6
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