KK74HCT245A [KODENSHI]

Octal 3-State Noninverting Bus Transceiver High-Performance Silicon-Gate CMOS; 八路三态同相总线收发器的高性能硅栅CMOS
KK74HCT245A
型号: KK74HCT245A
厂家: KODENSHI KOREA CORP.    KODENSHI KOREA CORP.
描述:

Octal 3-State Noninverting Bus Transceiver High-Performance Silicon-Gate CMOS
八路三态同相总线收发器的高性能硅栅CMOS

总线收发器 栅
文件: 总6页 (文件大小:294K)
中文:  中文翻译
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TECHNICAL DATA  
KK74HCT245A  
Octal 3-State Noninverting  
Bus Transceiver  
High-Performance Silicon-Gate CMOS  
The KK74HCT245A is identical in pinout to the LS/ALS245.This  
device may be used as a level converter for interfacing TTL or NMOS  
outputs to High Speed CMOS inputs.  
The KK74HCT245A is a 3-state noninverting transceiver that is used  
for 2-way asynchronous communication between data buses. The device  
has an active-low Output Enable pin, which is used to place the I/O ports  
into high-impedance states. The Direction control determines whether  
data flows from A to B or from B to A.  
ORDERING INFORMATION  
KK74HCT245AN Plastic  
KK74HCT245ADW SOIC  
TA = -55° to 125° C for all packages  
TTL/NMOS Compatible Input Levels  
Outputs Directly Interface to CMOS, NMOS, and TTL  
Operating Voltage Range: 4.5 to 5.5 V  
Low Input Current: 1.0 µA  
PIN ASSIGNMENT  
LOGIC DIAGRAM  
FUNCTION TABLE  
Control Inputs  
PIN 20=VCC  
Output  
Enable  
Direction  
Operation  
PIN 10 = GND  
L
L
H
L
Data Transmitted  
from Bus B to  
Bus A  
H
X
Data Transmitted  
from Bus A to  
Bus B  
Buses Isolated  
(High Impedance  
State)  
X = don’t care  
1
KK74HCT245A  
MAXIMUM RATINGS*  
Symbol  
Parameter  
Value  
-0.5 to +7.0  
-1.5 to VCC +1.5  
-0.5 to VCC +0.5  
±20  
Unit  
V
VCC  
VIN  
VOUT  
IIN  
DC Supply Voltage (Referenced to GND)  
DC Input Voltage (Referenced to GND)  
DC Output Voltage (Referenced to GND)  
DC Input Current, per Pin  
V
V
mA  
mA  
mA  
mW  
IOUT  
ICC  
DC Output Current, per Pin  
±35  
DC Supply Current, VCC and GND Pins  
±75  
PD  
Power Dissipation in Still Air, Plastic DIP+  
SOIC Package+  
750  
500  
Tstg  
TL  
Storage Temperature  
-65 to +150  
260  
°C  
°C  
Lead Temperature, 1 mm from Case for 10 Seconds  
(Plastic DIP or SOIC Package)  
*Maximum Ratings are those values beyond which damage to the device may occur.  
Functional operation should be restricted to the Recommended Operating Conditions.  
+Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C  
SOIC Package: : - 7 mW/°C from 65° to 125°C  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
VCC  
Parameter  
Min  
4.5  
0
Max  
5.5  
Unit  
V
DC Supply Voltage (Referenced to GND)  
DC Input Voltage, Output Voltage (Referenced to GND)  
Operating Temperature, All Package Types  
Input Rise and Fall Time (Figure 1)  
VIN, VOUT  
TA  
VCC  
+125  
500  
V
-55  
0
°C  
ns  
tr, tf  
This device contains protection circuitry to guard against damage due to high static voltages or electric fields.  
However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this  
high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND(VIN or  
V
OUT)VCC.  
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused  
outputs must be left open.  
2
KK74HCT245A  
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)  
VCC  
V
Guaranteed Limit  
Symbol  
Parameter  
Test Conditions  
Unit  
25 °C  
to  
85 125  
°C  
°C  
-55°C  
VIH  
VIL  
Minimum High-  
Level Input Voltage  
VOUT=0.1 V or VCC-0.1 V  
IOUT⎢≤ 20 µA  
4.5  
5.5  
2.0  
2.0  
2.0  
2.0  
2.0  
2.0  
V
V
V
Maximum Low -  
Level Input Voltage  
VOUT=0.1 V or VCC-0.1 V  
IOUT⎢ ≤ 20 µA  
4.5  
5.5  
0.8  
0.8  
0.8  
0.8  
0.8  
0.8  
VOH  
Minimum High-  
Level Output Voltage  
VIN=VIH or VIL  
IOUT⎢ ≤ 20 µA  
4.5  
5.5  
4.4  
5.4  
4.4  
5.4  
4.4  
5.4  
VIN=VIH or VIL  
4.5  
3.98  
3.84  
3.7  
IOUT⎢ ≤ 6.0 mA  
VOL  
Maximum Low-  
Level Output Voltage  
VIN= VIL or VIH  
IOUT⎢ ≤ 20 µA  
4.5  
5.5  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
V
VIN= VIL or VIH  
4.5  
5.5  
0.26  
0.33  
0.4  
IOUT⎢ ≤ 6.0 mA  
IIN  
Maximum Input  
Leakage Current  
VIN=VCC or GND,  
Pin 1 or 19  
±0.1  
±1.0 ±1.0  
µA  
µA  
IOZ  
Maximum Three-  
State Leakage  
Current  
Output in High-Impedance  
State  
VIN= VIL or VIH  
VOUT=VCC or GND,  
I/O Pins  
5.5  
±0.5  
±5.0  
±10  
ICC  
Maximum Quiescent VIN=VCC or GND  
5.5  
4.0  
40  
160  
µA  
Supply Current  
(per Package)  
I
OUT=0µA  
Additional Quiescent VIN=2.4 V, Any One Input  
mA  
ICC  
-55°C  
2.9  
25°C to  
125°C  
Supply Current  
VIN=VCC or GND, Other  
Inputs  
5.5  
2.4  
IOUT=0µA  
3
KK74HCT245A  
AC ELECTRICAL CHARACTERISTICS (VCC =5.0 V ± 10%, CL=50pF,Input tr=tf=6.0 ns)  
Guaranteed Limit  
85°C 125°C  
Symbol  
Parameter  
Unit  
25 °C  
to  
-55°C  
tPLH, tPHL Maximum Propagation Delay, A to B or B to A  
(Figures 1 and 3)  
22  
32  
30  
12  
28  
40  
38  
15  
33  
48  
45  
18  
ns  
ns  
ns  
ns  
tPLZ, tPHZ Maximum Propagation Delay , Direction or  
Output Enable to A or B (Figures 2 and 4)  
tPZL, tPZH Maximum Propagation Delay , Direction or  
Output Enable to A or B (Figures 2 and 4)  
tTLH, tTHL Maximum Output Transition Time, Any Output  
(Figures 1 and 3)  
CIN  
Maximum Input Capacitance (Pin 1 or Pin 19)  
10  
15  
10  
15  
10  
15  
pF  
pF  
COUT  
Maximum Three-State I/O Capacitance  
(I/O in High-Impedance State)  
Power Dissipation Capacitance (Per Enable  
Output)  
Typical @25°C,VCC=5.0 V  
CPD  
Used to determine the no-load dynamic power  
consumption:  
97  
pF  
PD=CPDVCC2f+ICCVCC  
Figure 1. Switching Waveforms  
Figure 2. Switching Waveforms  
4
KK74HCT245A  
Figure 3. Test Circuit  
Figure 4. Test Circuit  
EXPANDED LOGIC DIAGRAM  
5
KK74HCT245A  
N SUFFIX PLASTIC DIP  
(MS - 001AD)  
A
Dimension, mm  
11  
10  
20  
1
Symbol MIN  
MAX  
26.92  
7.11  
B
24.89  
6.1  
A
B
C
D
F
5.33  
0.36  
1.14  
0.56  
F
L
1.78  
2.54  
7.62  
G
H
J
C
SEATING  
PLANE  
-T-  
K
N
0
10  
°
°
M
J
G
H
D
2.92  
7.62  
0.2  
3.81  
8.26  
0.36  
K
L
M
N
0.25 (0.010) M  
T
NOTES:  
1. Dimensions “A”, “B” do not include mold flash or protrusions.  
Maximum mold flash or protrusions 0.25 mm (0.010) per side.  
0.38  
D SUFFIX SOIC  
(MS - 013AC)  
A
20  
11  
Dimension, mm  
Symbol MIN  
MAX  
13  
H
B
P
12.6  
7.4  
A
B
C
D
F
7.6  
2.35  
0.33  
0.4  
2.65  
0.51  
1.27  
1
10  
G
R x 45  
C
-T-  
SEATING  
PLANE  
1.27  
9.53  
G
H
J
K
M
D
J
F
M
0.25 (0.010) M T C  
0
°
8
°
NOTES:  
0.1  
0.23  
10  
0.3  
0.32  
10.65  
0.75  
K
M
P
1. Dimensions A and B do not include mold flash or protrusion.  
2. Maximum mold flash or protrusion 0.15 mm (0.006) per side  
for A; for B 0.25 mm (0.010) per side.  
0.25  
R
6

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