SJMN65R38FM

更新时间:2024-09-18 21:39:47
品牌:KODENSHI
描述:N-Channel Super Junction MOSFET

SJMN65R38FM 概述

N-Channel Super Junction MOSFET

SJMN65R38FM 数据手册

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SJMN65R38FM  
Super Junction MOSFET  
N-Channel Super Junction MOSFET  
Features  
Drain-Source voltage: VDS=700V (@TJ=150°C)  
Low drain-source On resistance: RDS(on)=0.34Ω (Typ .)  
Ultra low gate charge: Qg=20nC(Typ.)  
RoHS compliant device  
100%avalanche tested  
Ordering Information  
G D S  
Part Number  
Marking  
Package  
TO-220FM-3L  
SJMN65R38FM  
SJ65R38M  
TO-220FM-3L  
Marking Information  
Column 1: Manufacturer  
Column 2: Production Information  
AUK  
e.g.) ◎△YMDD  
◎△YMDD□  
-. ◎△: Factory Management Code  
SJ65R38M  
-. YMDD: Date Code (Year, Month, Daily)  
-. : Package Option Code  
Column 3: Device Code  
Absolute maximum ratings (TC=25°C unless otherwise noted)  
Characteristic  
Symbol  
Rating  
Unit  
Drain-source voltage  
Gate-source voltage  
VDSS  
VGSS  
650  
±30  
11  
V
V
A
Tc=25°C  
Tc=100°C  
IDM  
(Note 1)  
Drain current (DC)  
ID  
7
A
(Note 1)  
Drain current (Pulsed)  
30  
A
(Note 2)  
Single pulsed avalanche energy  
Power dissipation  
EAS  
PD  
346  
32  
mJ  
W
°C  
°C  
Junction temperature  
TJ  
150  
-55~150  
Storage temperature range  
Tstg  
* Limited only maximum j unction temperature  
Rev. date: 07-AUG-17  
KSD-T0O263-000  
www.auk.co.kr  
1 of 8  
SJMN65R38FM  
Thermal Characteristics  
Characteristic  
Symbol  
Rating  
Max. 3.9  
Max. 62.5  
Unit  
Thermal resistance, junction to case  
Thermal resistance, j unction to ambient  
R
th(j -c)  
°C/ W  
R
th(j -a)  
Electrical Characteristics (TC=25°C unless otherwise noted)  
Characteristic  
Symbol  
Test Condition  
Min.  
Typ. Max.  
Unit  
Drain-source breakdown voltage  
Gate threshold voltage  
BVDSS  
VGS(th)  
ID=250uA, VGS=0  
650  
-
3.5  
-
-
V
V
ID=250uA, VDS=VGS  
VDS=650V, VGS=0V  
VDS=520V, TJ=125°C  
VDS=0V, VGS=±30V  
VGS=10V, ID=5.5A  
2.5  
4.5  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
1
uA  
uA  
nA  
Drain-source cut -off current  
IDSS  
-
10  
Gate leakage current  
Drain-source on-resistance  
Input capacitance  
IGSS  
-
±100  
RDS(ON)  
0.34  
1024  
796  
5
0.38  
C
iss  
-
-
-
-
-
-
-
-
-
-
VDS=25V, VGS=0V,  
f=1MHz  
Output capacitance  
Coss  
pF  
Reverse transfer capacitance  
C
rss  
(Not e 3)  
Tu r n -on delay time  
td(on)  
tr  
td(off)  
tf  
16  
14  
40  
5
(Not e 3)  
Rise time  
VDS=400V, ID=11A,  
RG=25  
ns  
(Not e 3)  
Tu r n -off delay time  
(Not e 3)  
Fall time  
(Note 4)  
Total gate charge  
Qg  
20  
6.5  
6.5  
VDS=480V, VGS=10V,  
ID=11A  
(Note 4)  
Gate-source charge  
Qgs  
Qgd  
nC  
(Note 4)  
Gate-drain charge  
Source-Drain Diode Ratings and Characteristics (TC=25°C unless otherwise noted)  
Characteristic  
Symbol  
Test Condition  
Min.  
Typ. Max.  
Unit  
Source current (DC)  
IS  
ISM  
VSD  
trr  
-
-
-
-
-
-
-
11  
30  
1.3  
-
A
A
Integral reverse diode  
in the MOSFET  
Source current (Pulsed)  
Forward voltage  
VGS=0V, IS=11A  
-
V
(Note 3,4)  
Reverse recovery time  
Reverse recovery charge  
360  
3.4  
ns  
uC  
IS=11A, VGS=0V,  
dIS/ dt=100A/ us  
(Note 3,4)  
Qrr  
-
Note:  
1. Calculated continuous current based on maximum allowable j unction temperature  
2. L=10mH, IAS=8A, VDD=50V, Starting TJ=25°C  
3. Guaranteed by design, not subj ect to production testing  
4. Pulse test: Pulse width300us, Duty cycle2%  
Rev. date: 07-AUG-17  
KSD-T0O263-000  
www.auk.co.kr  
2 of 8  
SJMN65R38FM  
Typical Electrical Characteristics Curves  
Fig. 1 Typical Output Characteristics  
Fig. 2 Typical Transf e r Characteristics  
Fig. 4 Body Diode Forward Voltage Variation  
with Source Current  
Fig.3 On-Resistance Variation with Drain Current  
and Gate Voltage  
Fig. 5 Typical Capacitance Characteristics  
Fig. 6 Typical Total Gate Charge Characteristics  
Rev. date: 07-AUG-17  
KSD-T0O263-000  
www.auk.co.kr  
3 of 8  
SJMN65R38FM  
Fig. 7 Breakdown Voltage Variation vs. Temperature  
Fig. 8 On-Resistance Variation vs. Temperature  
Fig. 10 Maximum Safe Operating Area  
Fig. 9 Maximum Drain Current vs. Case Temperature  
Fig. 11 Transient Thermal Impedance  
Rev. date: 07-AUG-17  
KSD-T0O263-000  
www.auk.co.kr  
4 of 8  
SJMN65R38FM  
Fig. 12 Gate Charge Test Circuit & Waveform  
Fig. 13 Resistive Switching Test Circuit & Waveform  
Fig. 14 EAS Test Circuit & Waveform  
Rev. date: 07-AUG-17  
KSD-T0O263-000  
www.auk.co.kr  
5 of 8  
SJMN65R38FM  
Fig. 15 Diode Reverse Recovery Time Test Circuit & Waveform  
Rev. date: 07-AUG-17  
KSD-T0O263-000  
www.auk.co.kr  
6 of 8  
SJMN65R38FM  
Package Outline Dimensions  
Rev. date: 07-AUG-17  
KSD-T0O263-000  
www.auk.co.kr  
7 of 8  
SJMN65R38FM  
The AUK Corp. products are intended for the use as components in general electronic  
equipment (Office and communication equipment, measuring equipment, home  
appliance, etc.).  
Please make sure that you consult with us before you use these AUK Corp. products in  
equipmentswhich require high quality and / or reliability, and in equipmentswhich could  
have major impact to the welfare of human life(atomic energy control, airplane,  
spaceship, transportation, combustion control, all types of safety device, etc.). AUK  
Corp. cannot accept liability to any damage which may occur in case these AUK Corp.  
products were used in the mentioned equipments without prior consultation with AUK  
Corp..  
Specifications mentioned in this publication are subject to change without notice.  
Rev. date: 07-AUG-17  
KSD-T0O263-000  
www.auk.co.kr  
8 of 8  

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