ML145151YP [LANSDALE]
Parallel-Input PLL Frequency Synthesizer Interfaces with Single-Modulus Prescalers; 并行输入锁相环频率合成器的接口与单预分频系数型号: | ML145151YP |
厂家: | LANSDALE SEMICONDUCTOR INC. |
描述: | Parallel-Input PLL Frequency Synthesizer Interfaces with Single-Modulus Prescalers |
文件: | 总35页 (文件大小:2437K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ML145151 ML145156
ML145152 ML145157
ML145155 ML145158
PLL Frequency Synthesizer Family - CMOS
The devices described in this document are typically used as low–power, phase–locked loop frequency
synthesizers. When combined with an external low–pass filter and voltage–controlled oscillator, these
devices can provide all the remaining functions for a PLL frequency synthesizer operating up to the
device's frequency limit. For higher VCO frequency operation, a down mixer or a prescaler can be used
between the VCO and the synthesizer IC.
These frequency synthesizer chips can be found in the following and other applications:
CATV
TV Tuning
AM/FM Radios
Two–Way Radios
Scanning Receivers
Amateur Radio
÷
R
OSC
φ
CONTROL LOGIC
÷
A
N
÷
EXTERNAL
COMPONENTS
÷
P/P
+ 1
VCO
OUTPUT
FREQUENCY
CONTENTS
Page
DEVICE DETAIL SHEETS
ML145151 Parallel–Input, Single–Modulus ...........................................................................................2
ML145152 Parallel–Input, Dual–Modulus..............................................................................................5
ML145155 Serial–Input, Single–Modulus ..............................................................................................9
ML145156 Serial–Input, Dual–Modulus...............................................................................................13
ML145157 Serial–Input, Single–Modulus ............................................................................................17
ML145158 Serial–Input, Dual–Modulus...............................................................................................20
FAMILY CHARACTERISTICS
Maximum Ratings..................................................................................................................................23
DC Electrical Characteristics.................................................................................................................23
AC Electrical Characteristics.................................................................................................................25
Timing Requirements.............................................................................................................................26
Frequency Characteristics......................................................................................................................27
Phase Detector/Lock Detector Output Waveforms................................................................................27
DESIGN CONSIDERATIONS
Phase–Locked Loop – Low–Pass Filter Design ....................................................................................28
Crystal Oscillator Considerations..........................................................................................................29
Dual–Modulus Prescaling......................................................................................................................30
Page 1 of 35
www.lansdale.com
Issue A
ML145151
Parallel-Input PLL
Frequency Synthesizer
Interfaces with Single–Modulus Prescalers
Legacy Device: Motorola/Freescale MC145151
The ML145151 is programmed by 14 parallel–input data
lines for the N counter and three input lines for the R counter.
The device features consist of a reference oscillator, selec-
table–reference divider, digital–phase detector, and 14–bit
programmable divide–by–N counter.
P DIP 28 = YP
PLASTIC DIP
CASE 710
28
28
1
SO 28W = -6P
SOG PACKAGE
CASE 751F
• Operating Temperature Range: T
A =
– 40 to 85°C
• Low Power Consumption Through Use of CMOS
Technology
1
• 3.0 to 9.0 V Supply Range
CROSS REFERENCE/ORDERING INFORMATION
PACKAGE
MOTOROLA
LANSDALE
• On– or Off–Chip Reference Oscillator Operation
• Lock Detect Signal
• ÷ N Counter Output Available
P DIP 28
SO 28W
MC145151P2
MC145151DW2 ML145151-6P
ML145151YP
Note: Lansdale lead free (Pb) product, as it
becomes available, will be identified by a part
number prefix change from ML to MLE.
• Single Modulus/Parallel Programming
• 8 User–Selectable ÷ R Values: 8, 128, 256, 512, 1024,
2048, 2410, 8192
• ÷ N Range = 3 to 16383
• “Linearized” Digital Phase Detector Enhances Transfer
Function Linearity
PIN ASSIGNMENT
• Two Error Signal Options: Single–Ended (Three–State)
or Double–Ended
• Chip Complexity: 8000 FETs or 2000 Equivalent Gates
f
1
2
28
27
LD
in
V
OSC
SS
DD
out
in
V
3
26
25
24
23
22
21
20
19
18
17
OSC
N11
N10
N13
N12
T/R
N9
out
PD
4
RA0
RA1
RA2
5
6
7
φ
8
R
φ
9
V
f
10
N8
V
N0 11
N1 12
N7
N6
N2 13
N3 14
16
15
N5
N4
Page 2 of 35
www.lansdale.com
Issue A
LANSDALE Semiconductor, Inc.
ML145151
ML145151 BLOCK DIAGRAM
RA2
RA1
14 x 8 ROM REFERENCE DECODER
14
OSC
out
RA0
LOCK
LD
PD
DETECT
OSC
14–BIT
÷
R COUNTER
in
PHASE
DETECTOR
A
out
f
in
14–BIT
÷
N COUNTER
14
V
PHASE
DETECTOR
B
DD
φ
φ
V
R
TRANSMIT OFFSET ADDER
T/R
f
V
N13
N11
N9
N7 N6
N4
N2
N0
NOTE: N0 – N13 inputs and inputs RA0, RA1, and RA2 have pull–up resistors that are not shown.
PIN DESCRIPTIONS
nificant and N13 is the most significant. Pull–up resistors en-
sure that inputs left open remain at a logic 1 and require only
an SPST switch to alter data to the zero state.
INPUT PINS
f
in
Frequency Input (Pin 1)
T/R
Transmit/Receive Offset Adder Input (Pin 21)
Input to the ÷N portion of the synthesizer. f is typically
in
This input controls the offset added to the data provided at
the N inputs. This is normally used for offsetting the V
quency by an amount equal to the IF frequency of the trans-
ceiver. This offset is fixed at 856 when T/R is low and gives no
offset when T/R is high. A pull–up resistor ensures that no
connection will appear as a logic 1 causing no offset addition.
derived from loop V
CO
and is AC coupled into the device. For
fre-
CO
larger amplitude signals (standard CMOS logic levels) DC
coupling may be used.
RA0 – RA2
Reference Address Inputs (Pins 5, 6, 7)
These three inputs establish a code defining one of eight
possible divide values for the total reference divider, as defined
by the table below.
Pull–up resistors ensure that inputs left open remain at a
logic 1 and require only a SPST switch to alter data to the zero
state.
OSC , OSC
in
out
Reference Oscillator Input/Output (Pins 27, 26)
These pins form an on–chip reference oscillator when con-
nected to terminals of an external parallel resonant crystal.
Frequency setting capacitors of appropriate value must be con-
nected from OSC to ground and OSC
may also serve as the input for an externally generated refer-
ence signal. This signal is typically AC coupled to OSC , but
for larger amplitude signals (standard CMOS logic levels) DC
coupling may also be used. In the external reference mode, no
to ground. OSC
in
out
in
Total
Divide
Value
Reference Address Code
in
RA2
RA1
RA0
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
8
128
256
512
1024
2048
2410
8192
connection is required to OSC
OUTPUT PINS
PDout
.
out
Phase Detector A Output (Pin 4)
Three–state output of phase detector for use as loop–error
signal. Double–ended outputs are also available for this pur-
pose (see ΦV and ΦR).
N0 – N11
Frequency f > f or f Leading: Negative Pulses
Frequency f < f or f Lagging: Positive Pulses
Frequency f = f and Phase Coincidence: High–Imped-
V
V
V
R
R
V
V
N Counter Programming Inputs (Pins 11 – 20, 22 – 25)
These inputs provide the data that is preset into the ÷ N
counter when it reaches the count of zero. N0 is the least sig-
R
ance State
Page 3 of 35
www.lansdale.com
Issue A
LANSDALE Semiconductor, Inc.
ML145151
φR,φV
nally connected to the phase detector input. With this output
available, the ÷ N counter can be used independently.
Phase Detector B Outputs (Pins 8, 9)
These phase detector outputs can be combined externally for LD
a loop–error signal. A single–ended output is also available for Lock Detector Output (Pin 28)
this purpose (see PD ).
out
Essentially a high level when loop is locked (f , f of same
R V
If frequency f is greater than f or if the phase of f is
V
R
V
phase and frequency). Pulses low when loop is out of lock.
leading, then error information is provided by φV pulsing low.
φR remains essentially high.
POWER SUPPLY
If the frequency f is less than f or if the phase of f is
V
V
R
V
DD
lagging, then error information is provided by φR pulsing low.
φV remains essentially high.
Positive Power Supply (Pin 3)
The positive power supply potential. This pin may range
If the frequency of f = f and both are in phase, then both
V
R
from + 3 to + 9 V with respect to V
.
SS
φV and φR remain high except for a small minimum time peri-
V
od when both pulse low in phase.
SS
Negative Power Supply (Pin 2)
f
V
The most negative supply potential. This pin is usually-
ground.
N Counter Output (Pin 10)
This is the buffered output of the ÷ N counter that is inter-
TYPICAL APPLICATIONS
2.048 MHz
NC
NC
OSC
in
OSC
out
f
RA2 RA1
RA0
PD
in
VOLTAGE
CONTROLLED
OSCILLATOR
ML145151
out
N13 N12 N11 N10 N9 N8 N7 N6 N5 N4 N3 N2 N1 N0
5 – 5.5 MHz
0 1 1 1 0 0 0 1 0 0 0 = 5 MHz
1 0 1 0 1 1 1 1 1 0 0 = 5.5 MHz
Figure 1. 5 MHz to 5.5 MHz Local Oscillator Channel Spacing = 1 kHz
LOCK DETECT SIGNAL
TRANSMIT: 440.0 – 470.0 MHz
RECEIVE: 418.6 – 448.6 MHz
(25 kHz STEPS)
“1”
“1”
“0”
CHOICE OF
DETECTOR
ERROR
OSC
RA2
RA1
RA0
LD
f
V
out
SIGNALS
PD
out
OSC
in
LOOP
FILTER
φ
f
VCO
X6
+ V
R
V
V
V
DD
SS
ML145151
REF. OSC.
10.0417 MHz
(ON–CHIP OSC.
OPTIONAL)
f
in
T: 73.3333 – 78.3333 MHz
R: 69.7667 – 74.7667 MHz
T/R
T: 13.0833 – 18.0833 MHz
R: 9.5167 – 14.5167 MHz
DOWN
MIXER
“0” “0” “1”
CHANNEL PROGRAMMING
N = 2284 TO 3484
RECEIVE
÷
TRANSMIT
(ADDS 856 TO
N VALUE)
÷
X6
60.2500 MHz
NOTES:
1. f = 4.1667 kHz; ÷ R = 2410; 21.4 MHz low side injection during receive.
R
2. Frequency values shown are for the 440 – 470 MHz band. Similar implementation applies to the 406 – 440 MHz band.
For 470 – 512 MHz, consider reference oscillator frequency X9 for mixer injection signal (90.3750 MHz).
Figure 2. Synthesizer for Land Mobile Radio UHF Bands
ML145151 Data Sheet Continued on Page 23
Page 4 of 35
www.lansdale.com
Issue A
ML145152
Parallel-Input PLL
Frequency Synthesizer
Interfaces with Dual–Modulus Prescalers
Legacy Device: Motorola/Freescale MC145152
The ML145152 is programmed by sixteen parallel inputs
for the N and A counters and three input lines for the R
counter. The device features consist of a reference oscillator,
selectable–reference divider, two–output phase detector,
10–bit programmable divide–by–N counter, and 6–bit pro-
grammable ÷ A counter.
P DIP 28 = YP
PLASTIC DIP
CASE 710
28
1
SO 28W = -6P
SOG PACKAGE
CASE 751F
28
• Operating Temperature Range: T = – 40 to 85°C
A
• Low Power Consumption Through Use of CMOS
Technology
1
CROSS REFERENCE/ORDERING INFORMATION
PACKAGE
MOTOROLA
LANSDALE
• 3.0 to 9.0 V Supply Range
• On– or Off–Chip Reference Oscillator Operation
• Lock Detect Signal
P DIP 28
SO 28W
MC145152P2
MC145152DW2 ML145152-6P
ML145152YP
Note: Lansdale lead free (Pb) product, as it
becomes available, will be identified by a part
number prefix change from ML to MLE.
• Dual Modulus/Parallel Programming
• 8 User–Selectable ÷ R Values: 8, 64, 128, 256, 512,
1024, 1160, 2048
• ÷ N Range = 3 to 1023, ÷ A Range = 0 to 63
• Chip Complexity: 8000 FETs or 2000 Equivalent Gates
• See Application Note AN980
PIN ASSIGNMENT
f
1
2
28
27
LD
in
V
OSC
SS
in
V
3
4
5
6
7
8
9
26
25
24
23
22
21
20
19
18
17
OSC
A4
A3
A0
A2
A1
N9
N8
N7
N6
DD
out
RA0
RA1
RA2
φ
R
φ
V
MC
A5 10
N0 11
N1 12
N2 13
N3 14
16
15
N5
N4
Page 5 of 35
www.lansdale.com
Issue A
LANSDALE Semiconductor, Inc.
ML145152
ML145152 BLOCK DIAGRAM
RA2
RA1
RA0
12 x 8 ROM REFERENCE DECODER
12
OSC
out
LOCK
DETECT
LD
OSC
in
12–BIT
÷
R COUNTER
MC
φ
φ
V
CONTROL
LOGIC
PHASE
DETECTOR
R
f
in
6–BIT
A5
÷
A COUNTER
10–BIT
N2
÷
N COUNTER
A3 A2
A0
N0
N4 N5
N7
N9
NOTE: N0 – N9, A0 – A5, and RA0 – RA2 have pull–up resistors that are not shown.
PIN DESCRIPTIONS
tors that ensure that inputs left open will remain at a logic 1.
INPUT PINS
OSC , OSC
in
out
Reference Oscillator Input/Output (Pins 27, 26)
f
in
Frequency Input (Pin 1)
These pins form an on–chip reference oscillator when con-
nected to terminals of an external parallel resonant crystal.
Frequency setting capacitors of appropriate value must be con-
Input to the positive edge triggered ÷ N and ÷ A counters.
f
is typically derived from a dual–modulus prescaler and is
in
nected from OSC to ground and OSC
to ground. OSC
in
out
in
AC coupled into the device. For larger amplitude signals (stan-
dard CMOS logic levels) DC coupling may be used.
may also serve as the input for an externally generated refer-
ence signal. This signal is typically AC coupled to OSC , but
in
RA0, RA1, RA2
Reference Address Inputs (Pins 4, 5, 6)
for larger amplitude signals (standard CMOS logic levels) DC
coupling may also be used. In the external reference mode, no
connection is required to OSC
OUTPUT PINS
φR,φV
.
These three inputs establish a code defining one of eight
possible divide values for the total reference divider. The total
reference divide values are as follows:
out
Phase Detector B Outputs (Pins 7, 8)
Total
Divide
Value
Reference Address Code
These phase detector outputs can be combined externally for
a loop–error signal.
If the frequency f is greater than f or if the phase of f is
leading, then error information is provided by φV pulsing low.
φR remains essentially high.
If the frequency f is less than f or if the phase of f is
RA2
RA1
RA0
V
R
V
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
8
64
128
256
512
1024
1160
2048
V
R
V
lagging, then error information is provided by φR pulsing low.
φV remains essentially high.
If the frequency of f = f and both are in phase, then both
V
R
φV and φR remain high except for a small minimum time peri-
od when both pulse low in phase.
N0 – N9
N Counter Programming Inputs (Pins 11 – 20)
MC
Dual–Modulus Prescale Control Output (Pin 9)
The N inputs provide the data that is preset into the ÷ N
counter when it reaches the count of 0. N0 is the least signifi-
cant digit and N9 is the most significant. Pull–up resistors en-
sure that inputs left open remain at a logic 1 and require only a
SPST switch to alter data to the zero state.
Signal generated by the on–chip control logic circuitry for
controlling an external dual–modulus prescaler. The MC level
will be low at the beginning of a count cycle and will remain
low until the ÷ A counter has counted down from its pro-
grammed value. At this time, MC goes high and remains high
until the ÷ N counter has counted the rest of the way down
from its programmed value (N – A additional counts since
both ÷ N and ÷ A are counting down during the first portion of
the cycle). MC is then set back low, the counters preset to
A0 – A5
A Counter Programming Inputs(Pins 23, 21, 22, 24, 25, 10)
The A inputs define the number of clock cycles of f that
in
require a logic 0 on the MC output (see Dual–Modulus Pres-
caling section). The A inputs all have internal pull–up resis-
Page 6 of 35
www.lansdale.com
Issue A
LANSDALE Semiconductor, Inc.
ML145152
POWER SUPPLY
their respective programmed values, and the above sequence
repeated. This provides for a total programmable divide value
(NT)=N•P+A where P and P + 1 represent the dual–modulus
prescaler divide values respectively for high and low MC lev-
els, N the number programmed into the ÷ N counter, and A the
number programmed into the ÷ A counter.
VDD
Positive Power Supply (Pin 3)
The positive power supply potential. This pin may range from
+ 3 to + 9 V with respect to V
.
SS
V
SS
Negative Power Supply (Pin 2)
LD
Lock Detector Output (Pin 28)
The most negative supply potential. This pin is usually-
ground.
Essentially a high level when loop is locked (f , f of same
R V
phase and frequency). Pulses low when loop is out of lock.
TYPICAL APPLICATIONS
NO CONNECTS
“1”
“1”
“1”
150 – 175 MHz
5 kHz STEPS
LOCK DETECT SIGNAL
R2
10.24 MHz
NOTE 1
C
OSC
out
RA2
RA1
RA0
LD
R1
R1
φ
–
+
R
OSC
in
VCO
φ
V
MC33171
NOTE 2
ML145152
R2
C
MC
V
V
+ V
DD
f
in
SS
N9
N0 A5
A0
ML12017
CHANNEL PROGRAMMING
÷
64/65 PRESCALER
NOTES:
1. Off–chip oscillator optional.
2. The φ and φ outputs are fed to an external combiner/loop filter. See the Phase–Locked Loop — Low–Pass Filter
R
V
Design page for additional information. The φ and φ outputs swing rail–to–rail. Therefore, the user should be careful
R
V
not to exceed the common mode input range of the op amp used in the combiner/loop filter.
Figure 1. Synthesizer for Land Mobile Radio VHF Bands
Page 7 of 35
www.lansdale.com
Issue A
LANSDALE Semiconductor, Inc.
ML145152
RECEIVER 2ND L.O.
30.720 MHz
REF. OSC.
15.360 MHz
NO CONNECTS
(ON–CHIP OSC.
OPTIONAL)
RECEIVER FIRST L.O.
825.030 844.980 MHz
X2
“1”
“1”
“1”
LOCK DETECT SIGNAL
R2
→
C
(30 kHz STEPS)
OSC
out
RA2
RA1
RA0
LD
R1
R1
φ
–
+
R
OSC
in
X4
NOTE 6
VCO
φ
V
ML145152
NOTE 5
NOTE 7
V
V
+ V
DD
R2
C
MC
SS
f
X4
TRANSMITTER
in
NOTE 6
MODULATION
N9
N0 A5
A0
ML12017
TRANSMITTER SIGNAL
825.030 844.980 MHz
(30 kHz STEPS)
÷
64/65 PRESCALER
CHANNEL PROGRAMMING
→
NOTE 6
NOTES:
1. Receiver 1st I.F. = 45 MHz, low side injection; Receiver 2nd I.F. = 11.7 MHz, low side injection.
2. Duplex operation with 45 MHz receiver/transmit separation.
3. f = 7.5 kHz; ÷ R = 2048.
R
total
4. N
= N 64 + A = 27501 to 28166; N = 429 to 440; A = 0 to 63.
5. ML145158 may be used where serial data entry is desired.
6. High frequency prescalers may be used for higher frequency VCO and f
implementations.
ref
7. The φ and φ outputs are fed to an external combiner/loop filter. See the Phase–Locked Loop — Low–Pass Filter Design page for
R
V
additional information. The φ and φ outputs swing rail–to–rail. Therefore, the user should be careful not to exceed the common mode
R
V
input range of the op amp used in the combiner/loop filter.
Figure 2. 666–Channel, Computer–Controlled, Mobile Radiotelephone Synthesizer
for 800 MHz Cellular Radio Systems
ML145152 Data Sheet Continued on Page 23
Page 8 of 35
www.lansdale.com
Issue A
ML145155
Serial–Input PLL
Frequency Synthesizer
Interfaces with Single–Modulus Prescalers
Legacy Device: Motorola/Freescale MC145155-2
The ML145155 is programmed by a clocked, serial input,
16–bit data stream. The device features consist of a reference
oscillator, selectable–reference divider, digital–phase detector,
14–bit programmable divide–by–N counter, and the necessary
shift register and latch circuitry for accepting serial input
data.
P DIP 18 = VP
PLASTIC DIP
CASE 707
18
1
• Operating Temperature Range: T = – 40 to 85°C
• Low Power Consumption Through Use of CMOS
Technology
A
SOG 20W = -6P
SOG PACKAGE
CASE 751D
20
1
• 3.0 to 9.0 V Supply Range
• On– or Off–Chip Reference Oscillator Operation with
Buffered Output
• Compatible with the Serial Peripheral Interface (SPI) on
CMOS MCUs
CROSS REFERENCE/ORDERING INFORMATION
PACKAGE
MOTOROLA
LANSDALE
P DIP 18
MC145155P2
ML145155VP
SOG 20W
MC145155DW2 ML145155-6P
• Lock Detect Signal
Note: Lansdale lead free (Pb) product, as it
becomes available, will be identified by a part
number prefix change from ML to MLE.
• Two Open–Drain Switch Outputs
• 8 User–Selectable ÷ R Values: 16, 512, 1024, 2048,
3668, 4096, 6144, 8192
• Single Modulus/Serial Programming
• ÷ N Range = 3 to 16383
• “Linearized” Digital Phase Detector Enhances Transfer
Function Linearity
• Two Error Signal Options: Single–Ended (Three–State)
or Double–Ended
• Chip Complexity: 6504 FETs or 1626 Equivalent Gates
PIN ASSIGNMENTS
PLASTIC DIP
SOG PACKAGE
RA1
RA2
1
2
3
4
5
6
18
17
16
15
14
13
RA0
OSC
OSC
REF
RA1
RA2
1
2
20
19
RA0
OSC
in
in
φ
φ
3
4
18
OSC
V
out
V
out
φ
17
REF
φ
R
out
R
out
V
5
6
16
15
NC
V
SW2
DD
out
DD
PD
SW2
SW1
ENB
DATA
CLK
PD
SW1
ENB
DATA
CLK
out
V
7
14
13
12
11
V
7
8
9
12
11
10
SS
NC
SS
LD
8
LD
9
f
in
f
10
in
NC = NO CONNECTION
Page 9 of 35
www.lansdale.com
Issue A
ML145155
LANSDALE Semiconductor, Inc.
ML145155 BLOCK DIAGRAM
RA2
14 x 8 ROM REFERENCE DECODER
RA1
RA0
LOCK
DETECT
14
OSC
REF
out
LD
OSC
14–BIT
14–BIT
÷
÷
R COUNTER
in
f
PHASE
DETECTOR
A
R
PD
out
f
V
out
f
in
R COUNTER
14
PHASE
DETECTOR
B
φ
φ
V
R
V
DD
SW2
SW1
ENB
LATCH
LATCH
14
14–BIT SHIFT REGISTER
DATA
CLK
2–BIT SHIFT
REGISTER
PIN DESCRIPTIONS
signals SW1 and SW2. The entry format is as follows:
INPUT PINS
in
f
÷
N COUNTER BITS
Frequency Input (PDIP – Pin 9, SOG – Pin 10)
Input to the ÷ N portion of the synthesizer. f is typically
in
derived from loop VCO and is AC coupled into the device. For
larger amplitude signals (standard CMOS logic levels) DC
coupling may be used.
LAST DATA BIT IN (BIT NO. 16)
FIRST DATA BIT IN (BIT NO. 1)
RA0, RA1, RA2
Reference Address Inputs (PDIP – Pins 18, 1, 2; SOG –
Pins 20, 1, 2)
These three inputs establish a code defining one of eight
possible divide values for the total reference divider, as defined
by the table below:
ENB
Latch Enable Input (PDIP – Pin 12, SOG – Pin 13)
When high (1), ENB transfers the contents of the shift reg-
ister into the latches, and to the programmable counter inputs,
and the switch outputs SW1 and SW2. When low (0), ENB
inhibits the above action and thus allows changes to be made
in the shift register data without affecting the counter program-
ming and switch outputs. An on–chip pull–up establishes a
continuously high level for ENB when no external signal is
applied. ENB is normally low and is pulsed high to transfer
data to the latches.
Total
Divide
Value
Reference Address Code
RA2
RA1
RA0
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
16
512
1024
2048
3668
4096
6144
8192
OSC , OSC
in
out
Reference Oscillator Input/Output (PDIP – Pins 17, 16;
SOG – Pins 19, 18)
These pins form an on–chip reference oscillator when con-
nected to terminals of an external parallel resonant crystal.
Frequency setting capacitors of appropriate value must be con-
CLK, DATA
Shift Register Clock, Serial Data Inputs
(PDIP – Pins 10, 11; SOG – Pins 11, 12)
Each low–to–high transition clocks one bit into the on–chip
16–bit shift register. The Data input provides programming
information for the 14–bit ÷ N counter and the two switch
nected from OSC to ground and OSC
to ground. OSC
in
out
in
may also serve as the input for an externally–generated refer-
ence signal. This signal is typically ac coupled to OSC , but
in
for larger amplitude signals (standard CMOS logic levels) DC
coupling may also be used. In the external reference mode, no
connection is required to OSC
.
out
Page 10 of 35
www.lansdale.com
Issue A
LANSDALE Semiconductor, Inc.
ML145155
ML145155
OUTPUT PINS
phase and frequency). LD pulses low when loop is out of lock.
PD
out
Phase Detector A Output (PDIP, SOG – Pin 6)
Three–state output of phase detector for use as loop error
signal. Double–ended outputs are also available for this pur-
pose (see φV and φR).
SW1, SW2
Band Switch Outputs (PDIP – Pins 13, 14; SOG – Pins 14, 15)
SW1 and SW2 provide latched open–drain outputs corre-
sponding to data bits numbers one and two. These outputs can
be tied through external resistors to voltages as high as 15 V,
Frequency f > f or f Leading: Negative Pulses
V
V
R
V
V
Frequency f < f or f Lagging: Positive Pulses
independent of the V
supply voltage. These are typically
R
DD
Frequency f = f and Phase Coincidence: High–Imped-
used for band switch functions. A logic 1 causes the output to
assume a high–impedance state, while a logic 0 causes the out-
put to be low.
V
R
ance State
φR, φV
Phase Detector B Outputs (PDIP, SOG – Pins 4, 3)
REF
out
These phase detector outputs can be combined externally for
a loop–error signal. A single–ended output is also available for
Buffered Reference Oscillator Output (PDIP, SOG – Pin 15)
Buffered output of on–chip reference oscillator or externally
provided reference–input signal.
this purpose (see PD ).
out
If frequency f is greater than f or if the phase of f is
V
R
V
leading, then error information is provided by f pulsing low.
POWER SUPPLY
V
f remains essentially high.
R
If the frequency f is less than f or if the phase of f is
VDD
V
R
V
lagging, then error information is provided by f pulsing low.
Positive Power Supply (PDIP, SOG – Pin 5)
The positive power supply potential. This pin may range
R
f
remains essentially high.
V
If the frequency of f = f and both are in phase, then both
from + 3 to + 9 V with respect to V
.
V
R
SS
f
and f remain high except for a small minimum time peri-
V
R
od when both pulse low in phase.
VSS
Negative Power Supply (PDIP, SOG – Pin 7)
The most negative supply potential. This pin is usually
ground.
LD
Lock Detector Output (PDIP – Pin 8, SOG – Pin 9)
Essentially a high level when loop is locked (f , f of same
R V
TYPICAL APPLICATIONS
4.0 MHz
UHF/VHF
TUNER OR
CATV
φ
FRONT END
–
+
R
f
in
MC120xx
PRESCALER
ML145155
φ
V
1/2 MC1458*
DATA
CLK
ENB
CMOS
MPU/MCU
3
MC14489
KEYBOARD
LED DISPLAY
* The φ and φ outputs are fed to an external combiner/loop filter. See the Phase–Locked Loop – Low–Pass Filter Design page
R
V
foradditionalinformation.TheφRandφVoutputsswingrail–to–rail.Therefore,theusershouldbecarefulnottoexceedthecommon
mode input range of the op amp used in the combiner/loop filter.
Figure 1. Microprocessor–Controlled TV/CATV Tuning System with Serial Interface
Page 11 of 35
www.lansdale.com
Issue A
ML145155
LANSDALE Semiconductor, Inc.
ML145155
2.56 MHz
φ
TO
AM/FM
OSCILLATORS
–
+
f
R
in
ML12019
÷20 PRESCALER
FM
OSC
ML145155
CLK
φ
V
1/2 MC1458*
AM
OSC
DATA
ENB
CMOS
MPU/MCU
KEYBOARD
TO DISPLAY
* The φ and φ outputs are fed to an external combiner/loop filter. See the Phase–Locked Loop – Low–Pass Filter Design page
R
V
foradditionalinformation.Theφ andφ outputsswingrail–to–rail. Therefore, theusershouldbecarefulnottoexceedthecommon
R
V
mode input range of the op amp used in the combiner/loop filter.
Figure 2. AM/FM Radio Synthesizer
Page 12 of 35
www.lansdale.com
Issue A
ML145156
Serial–Input PLL
Frequency Synthesizer
Interfaces with Dual–Modulus Prescalers
Legacy Device: Motorola/Freescale MC145156-2
The ML145156 is programmed by a clocked, serial input,
19–bit data stream. The device features consist of a reference
oscillator, selectable–reference divider, digital–phase detector,
10–bit programmable divide–by–N counter, 7–bit program-
mable divide–by–A counter, and the necessary shift register
and latch circuitry for accepting serial input data.
P DIP 20 = RP
PLASTIC DIP
CASE 738
20
1
SOG 20W = -6P
SOG PACKAGE
CASE 751D
• Operating Temperature Range: T = – 40 to 85°C
A
• Low Power Consumption Through Use of
CMOS Technology
20
1
• 3.0 to 9.0 V Supply Range
CROSS REFERENCE/ORDERING INFORMATION
PACKAGE
MOTOROLA
LANSDALE
• On– or Off–Chip Reference Oscillator Operation with
Buffered Output
• Compatible with the Serial Peripheral Interface (SPI) on
CMOS MCUs
P DIP 20
SOG 20W
MC145156P2
MC145156DW2 ML145156-6P
ML145156RP
Note: Lansdale lead free (Pb) product, as it
becomes available, will be identified by a part
number prefix change from ML to MLE.
• Lock Detect Signal
• Two Open–Drain Switch Outputs
• Dual Modulus/Serial Programming
• 8 User–Selectable ÷ R Values: 8, 64, 128, 256, 640,
1000, 1024, 2048
• ÷ N Range = 3 to 1023, ÷A Range = 0 to 127
• “Linearized” Digital Phase Detector Enhances Transfer
Function Linearity
• Two Error Signal Options: Single–Ended (Three–State)
or Double–Ended
• Chip Complexity: 6504 FETs or 1626 Equivalent Gates
PIN ASSIGNMENT
RA1
RA2
1
2
20
19
RA0
OSC
OSC
in
φ
3
4
18
V
out
out
φ
17
REF
R
V
5
6
16
15
TEST
SW2
DD
PD
V
out
SS
7
14
13
12
11
SW1
ENB
DATA
CLK
MC
LD
8
9
f
10
in
Page 13 of 35
www.lansdale.com
Issue A
ML145156
LANSDALE Semiconductor, Inc.
ML145156 BLOCK DIAGRAM
RA2
RA1
RA0
12 x 8 ROM REFERENCE DECODER
12
LOCK
DETECT
12–BIT
÷ R COUNTER
OSC
in
LD
OSC
REF
out
f
PHASE
DETECTOR
A
CONTROL LOGIC
R
out
PD
out
f
V
MC
PHASE
DETECTOR
B
7–BIT
÷
A COUNTER
10–BIT
÷
N COUNTER
10
f
φ
in
V
φ
R
7
V
SW2
SW1
DD
ENB
LATCH
÷
A COUNTER LATCH
7
÷
N COUNTER LATCH
10
DATA
CLK
2–BIT SHIFT
REGISTER
7–BIT SHIFT REGISTER
10–BIT SHIFT REGISTER
A COUNTER BITS
N COUNTER BITS
PIN DESCRIPTIONS
INPUT PINS
f
in
Frequency Input (Pin 10)
Input to the positive edge triggered ÷ N and ÷ A counters.
is typically derived from a dual–modulus prescaler and is
AC coupled into the device. For larger amplitude signals (stan-
dard CMOS logic levels), DC coupling may be used.
LAST DATA BIT IN (BIT NO. 19)
FIRST DATA BIT IN (BIT NO. 1)
f
in
ENB
Latch Enable Input (Pin 13)
When high (1), ENB transfers the contents of the shift reg-
ister into the latches, and to the programmable counter inputs,
and the switch outputs SW1 and SW2. When low (0), ENB
inhibits the above action and thus allows changes to be made
in the shift register data without affecting the counter program-
ming and switch outputs. An on–chip pull–up establishes a
continuously high level for ENB when no external signal is
applied. ENB is normally low and is pulsed high to transfer
data to the latches.
RA0, RA1, RA2
Reference Address Inputs (Pins 20, 1, 2)
These three inputs establish a code defining one of eight
possible divide values for the total reference divider, as defined
by the table below:
Total
Divide
Value
Reference Address Code
RA2
RA1
RA0
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
8
64
OSC , OSC
in
out
Reference Oscillator Input/Output (Pins 19, 18)
128
256
640
1000
1024
2048
These pins form an on–chip reference oscillator when con-
nected to terminals of an external parallel resonant crystal.
Frequency setting capacitors of appropriate value must be con-
nected from OSC to ground and OSC
to ground. OSC
in
out
in
may also serve as the input for an externally–generated refer-
ence signal. This signal is typically AC coupled to OSC , but
in
for larger amplitude signals (standard CMOS logic levels) DC
coupling may also be used. In the external reference mode, no
CLK, DATA
Shift Register Clock, Serial Data Inputs (Pins 11, 12)
Each low–to–high transition clocks one bit into the on–chip
19–bit shift register. The data input provides programming in-
formation for the 10–bit ÷ N counter, the 7–bit ÷ A counter,
and the two switch signals SW1 and SW2. The entry format is
as follows:
connection is required to OSC
.
out
TEST
Factory Test Input (Pin 16)
Used in manufacturing. Must be left open or tied to V
.
SS
Page 14 of 35
www.lansdale.com
Issue A
LANSDALE Semiconductor, Inc.
ML145156
ML145156
OUTPUT PINS
respective programmed values, and the above sequence repeat-
ed. This provides for a total programmable divide value (N ) =
T
PDout
N • P + A where P and P + 1 represent the dual–modulus
prescaler divide values respectively for high and low MC lev-
els, N the number programmed into the ÷ N counter, and A the
number programmed into the ÷ A counter.
Phase Detector A Output (Pin 6)
Three–state output of phase detector for use as loop–error
signal. Double–ended outputs are also available for this pur-
pose (see φ and φ ).
V
R
LD
Frequency f > f or f Leading: Negative Pulses
V
R
V
V
Lock Detector Output (Pin 9)
Frequency f < f or f Lagging: Positive Pulses
V
V
R
R
Frequency f = f and Phase Coincidence: High–Imped-
Essentially a high level when loop is locked (f , f of same
R V
ance State
phase and frequency). LD pulses low when loop is out of lock.
φR, φV
SW1, SW2
Band Switch Outputs (Pins 14, 15)
Phase Detector B Outputs (Pins 4, 3)
These phase detector outputs can be combined externally for
a loop–error signal. A single–ended output is also available for
SW1 and SW2 provide latched open–drain outputs corre-
sponding to data bits numbers one and two. These outputs can
be tied through external resistors to voltages as high as 15 V,
this purpose (see PD ).
out
If frequency f is greater than f or if the phase of f is
independent of the V
supply voltage. These are typically
V
R
V
DD
leading, then error information is provided by φ pulsing low.
used for band switch functions. A logic 1 causes the output to
assume a high–impedance state, while a logic 0 causes the out-
put to be low.
V
φ remains essentially high.
R
If the frequency f is less than f or if the phase of f is
V
R
V
lagging, then error information is provided by φ pulsing low.
R
φ
remains essentially high.
REF
out
V
If the frequency of f = f and both are in phase, then both
Buffered Reference Oscillator Output (Pin 17)
V
R
φ
and φ remain high except for a small minimum time
V
R
Buffered output of on–chip reference oscillator or externally
provided reference–input signal.
period when both pulse low in phase.
MC
POWER SUPPLY
Dual–Modulus Prescale Control Output (Pin 8)
Signal generated by the on–chip control logic circuitry for-
controlling an external dual–modulus prescaler. The MC level-
will be low at the beginning of a count cycle and will remain-
low until the ÷ A counter has counted down from its pro-
grammed value. At this time, MC goes high and remains high-
until the ÷ N counter has counted the rest of the way down-
from its programmed value (N – A additional counts since
both ÷ N and ÷ A are counting down during the first portion of
the cycle). MC is then set back low, the counters preset to their
V
DD
Positive Power Supply (Pin 5)
The positive power supply potential. This pin may range
from + 3 to + 9 V with respect to V
.
SS
V
SS
Negative Power Supply (Pin 7)
The most negative supply potential. This pin is usually-
ground.
Page 15 of 35
www.lansdale.com
Issue A
ML145156
LANSDALE Semiconductor, Inc.
ML145156
TYPICAL APPLICATIONS
+ 12 V
LOCK DETECT SIGNAL
3.2 MHz
NOTES 1
AND 2
FM B +
+ 12 V
AM B +
+ V
OSC
OSC
RA2 RA1 RA0 LD SW1 SW2
in
out
OPTIONAL
LOOP
ERROR SIGNAL
PD
out
V
V
DD
–
+
φ
ML145156
R
SS
VCO
REF
φ
V
out
1/2 MC1458
NOTE 3
f
CLK
DATA
ENB
in
MC
KEY–
BOARD
CMOS MPU/MCU
ML12019
20/21 DUAL MODULUS PRESCALER
÷
TO DISPLAY DRIVER (e.g., MC14489)
NOTES:
1. For AM: channel spacing = 5 kHz,
2. For FM: channel spacing = 25 kHz,
÷
R =
÷
640 (code 100).
÷ 128 (code 010).
÷
R =
3. Theφ andφ outputsarefedtoanexternalcombiner/loopfilter.SeethePhase–LockedLoop–Low–PassFilterDesignpage
R
V
for additional information. The φ and φ outputs swing rail–to–rail. Therefore, the user should be careful not to exceed the
R
V
common mode input range of the op amp used in the combiner/loop filter.
Figure 1. AM/FM Radio Broadcast Synthesizer
3.2 MHz (NOTE 3)
VCO RANGE
NAV = 01
COM = 10
NAV: 97.300 – 107.250 MHz
COM–T: 118.000 – 135.975 MHz
COM–R: 139.400 – 157.375 MHz
LOCK DETECT SIGNAL
+ V
OSC
OSC
out
RA2 RA1 RA0 LD SW1 SW2
in
PD
out
V
V
DD
–
+
ML145156
φ
R
SS
VCO
REF
φ
V
out
MC33171
NOTE 5
f
CLK
DATA
ENB
in
MC
CMOS MPU/MCU
R/T
ML12016 (NOTES 2 AND 4)
40/41 DUAL MODULUS PRESCALER
÷
CHANNEL
TO DISPLAY DRIVER
SELECTION
(e.g., MC14489)
NOTES:
1. For NAV: f = 50 kHz,
÷
R = 64 using 10.7 MHz lowside injection, N
= 1946 – 2145.
total
R
For COM–T: f = 25 kHz,
÷
÷
R = 128, N
= 4720 – 5439.
R
total
R = 128, using 21.4 MHz highside injection, N
For COM–R: f = 25 kHz,
= 5576 – 6295.
R
total
32/33 dual modulus approach is provided by substituting an ML12015 for the ML12016.The devices are pin equivalent.
3. A 6.4 MHz oscillator crystal can be used by selecting R = 128 (code 010) for NAV and R = 256 (code 011) for COM.
4. ML12013 + MC10131 combination may also be used to form the 40/41 prescale.r
5. The φ and φ outputs are fed to an external combiner/loop filter. See the Phase–Locked Loop – Low–Pass Filter Design
2. A
÷
÷
÷
÷
R
V
page for additional information.The φ and φ outputs swing rail–to–rail.Therefore, the user should be careful not to exceed
R
V
the common mode input range of the op amp used in the combiner/loop filter.
Figure 2. Avionics Navigation or Communication Synthesizer
ML145156 Data Sheet Continued on Page 23
Page 16 of 35
www.lansdale.com
Issue A
ML145157
Serial–Input PLL
Frequency Synthesizer
Interfaces with Single–Modulus Prescalers
Legacy Device: Motorola/Freescale MC145157-2
The ML145157 has a fully programmable 14–bit reference
counter, as well as a fully programmable ÷ N counter. The
counters are programmed serially through a common data
input and latched into the appropriate counter latch, accord-
ing to the last data bit (control bit) entered.
P DIP 16 = EP
PLASTIC DIP
CASE 648
16
1
• Operating Temperature Range: T = – 40 to 85°C
A
• Low Power Consumption Through Use of CMOS
Technology
SOG 16 = -5P
SOG PACKAGE
CASE 751G
16
1
• 3.0 to 9.0 V Supply Range
• Fully Programmable Reference and ÷ N Counters
• ÷ R Range = 3 to 16383
• ÷ N Range = 3 to 16383
CROSS REFERENCE/ORDERING INFORMATION
PACKAGE
MOTOROLA
LANSDALE
P DIP 16
MC145157P2
ML145157EP
SOG 20W
MC145157DW2 ML145157-5P
• f and f Outputs
V
R
• Lock Detect Signal
Note: Lansdale lead free (Pb) product, as it
becomes available, will be identified by a part
number prefix change from ML to MLE.
• Compatible with the Serial Peripheral Interface
(SPI) on CMOS MCUs
• “Linearized” Digital Phase Detector
• Single–Ended (Three–State) or Double–Ended Phase
Detector Outputs
PIN ASSIGNMENT
• Chip Complexity: 6504 FETs or 1626 Equivalent Gates
OSC
in
1
2
16
15
φ
φ
R
OSC
out
V
f
3
4
14
13
REF
V
out
V
f
R
DD
out
PD
5
6
12
11
S/R
out
V
ENB
DATA
CLK
SS
LD
7
10
9
f
8
in
Page 17 of 35
www.lansdale.com
Issue A
ML145157
LANSDALE Semiconductor, Inc.
ML145157 BLOCK DIAGRAM
14–BIT SHIFT REGISTER
14
f
R
ENB
REFERENCE COUNTER LATCH
14
LOCK
DETECT
LD
PD
OSC
14–BIT
÷
R COUNTER
in
out
out
PHASE
DETECTOR
A
OSC
REF
out
PHASE
DETECTOR
B
φ
φ
V
14–BIT
÷
N COUNTER
14
f
in
R
÷
N COUNTER LATCH
14
f
V
1–BIT
CONTROL
S/R
DATA
CLK
S/R
out
14–BIT SHIFT REGISTER
PIN DESCRIPTIONS
the control bit is at a logic low. A logic low on this pin allows
the user to change the data in the shift registers without affect-
ing the counters. ENB is normally low and is pulsed high to
transfer data to the latches.
INPUT PINS
fin
Frequency Input (Pin 8)
OSCin, OSCout
Reference Oscillator Input/Output (Pins 1, 2)
Input frequency from VCO output. A rising edge signal on
this input decrements the ÷ N counter. This input has an invert-
er biased in the linear region to allow use with AC coupled sig-
nals as low as 500 mV p–p. For larger amplitude signals (stan-
dard CMOS logic levels), DC coupling may be used.
These pins form an on–chip reference oscillator when con-
nected to terminals of an external parallel resonant crystal.
Frequency setting capacitors of appropriate value must be con-
nected from OSC to ground and OSC
to ground. OSC
in
out
in
may also serve as the input for an externally–generated refer-
CLK, DATA
Shift Clock, Serial Data Inputs (Pins 9, 10)
ence signal. This signal is typically AC coupled to OSC , but
in
for larger amplitude signals (standard CMOS logic levels) DC
coupling may also be used. In the external reference mode, no
Each low–to–high transition of the clock shifts one bit of
data into the on–chip shift registers. The last data bit entered
determines which counter storage latch is activated; a logic
1selects the reference counter latch and a logic 0 selects the
÷ N counter latch. The entry format is as follows:
connection is required to OSC
.
out
OUTPUT PINS
PD
out
Single–Ended Phase Detector A Output (Pin 5)
This single–ended (three–state) phase detector output pro-
duces a loop–error signal that is used with a loop filter to con-
trol a VCO.
Frequency fV > fR or fV Leading: Negative Pulses
Frequency fV < fR or fV Lagging: Positive Pulses
Frequency fV = fR and Phase Coincidence:
High–Impedance State
FIRST DATA BIT INTO SHIFT REGISTER
ENB
Latch Enable Input (Pin 11)
φR, φV
Double–Ended Phase Detector B Outputs (Pins 16, 15)
These outputs can be combined externally for a loop–error
signal. A single–ended output is also available for this purpose
A logic high on this pin latches the data from the shift regis-
ter into the reference divider or ÷ N latches depending on the
control bit. The reference divider latches are activated if the
control bit is at a logic high and the ÷ N latches are activated if
(see PD ).
out
Page 18 of 35
www.lansdale.com
Issue A
LANSDALE Semiconductor, Inc.
ML145157
ML145157
REF
If frequency f is greater than f or if the phase of f is
out
V
R
V
Buffered Reference Oscillator Output (Pin 14)
leading, then error information is provided by φ pulsing low.
V
This output can be used as a second local oscillator, refer-
ence oscillator to another frequency synthesizer, or as the sys-
tem clock to a microprocessor controller.
φ remains essentially high.
R
If the frequency f is less than f or if the phase of fV is
V
R
lagging, then error information is provided by φ pulsing low.
R
φ
remains essentially high.
V
S/R
out
If the frequency of f = f and both are in phase, then both
and φ remain high except for a small minimum time peri-
V
R
Shift Register Output (Pin 12)
φ
V
R
od when both pulse low in phase.
This output can be connected to an external shift register to
provide band switching, control information, and counter pro-
gramming code checking.
f , f
R V
RCounter Output, N Counter Output (Pins 13, 3)
Buffered, divided reference and f frequency outputs. The
in
POWER SUPPLY
f and f outputs are connected internally to the ÷ R and ÷ N
R
V
counter outputs respectively, allowing the counters to be used
independently, as well as monitoring the phase detector inputs.
V
DD
Positive Power Supply (Pin 4)
The positive power supply potential. This pin may range
LD
from +3 to +9 V with respect to V
.
SS
Lock Detector Output (Pin 7)
This output is essentially at a high level when the loop is
V
SS
Negative Power Supply (Pin 6)
locked (f , f of same phase and frequency), and pulses low
R V
when loop is out of lock.
The most negative supply potential. This pin is usually
ground.
Page 19 of 35
www.lansdale.com
Issue A
ML145158
Serial–Input PLL
Frequency Synthesizer
Interfaces with Dual–Modulus Prescalers
Legacy Device: Motorola/Freescale MC145158-2
The ML145158 has a fully programmable 14–bit reference
counter, as well as fully programmable ÷ N and ÷ A counters.
The counters are programmed serially through a common
data input and latched into the appropriate counter latch,
according to the last data bit (control bit) entered.
P DIP 16 = EP
PLASTIC DIP
CASE 648
16
1
• Operating Temperature Range: T
A =
• Low Power Consumption Through Use of CMOS
Technology
– 40 to 85°C
SOG 16 = -5P
SOG PACKAGE
CASE 751G
16
1
• 3.0 to 9.0 V Supply Range
• Fully Programmable Reference and ÷ N Counters
• ÷ R Range = 3 to 16383
• ÷ N Range = 3 to 1023
CROSS REFERENCE/ORDERING INFORMATION
PACKAGE
MOTOROLA
LANSDALE
P DIP 16
SOG 16
MC145158P2
MC145158DW2 ML145158-5P
ML145158EP
• Dual Modulus Capability; ÷ A Range = 0 to 127
• f and f Outputs
Note: Lansdale lead free (Pb) product, as it
becomes available, will be identified by a part
number prefix change from ML to MLE.
V
R
• Lock Detect Signal
• Compatible with the Serial Peripheral Interface (SPI) on
CMOS MCUs
• “Linearized” Digital Phase Detector
• Single–Ended (Three–State) or Double–Ended Phase
Detector Outputs
• Chip Complexity: 6504 FETs or 1626
Equivalent Gates
PIN ASSIGNMENT
OSC
in
1
2
16
15
φ
φ
R
OSC
out
V
f
3
4
14
13
REF
out
V
V
f
R
DD
out
PD
5
6
12
11
MC
V
ENB
SS
LD
7
10
9
DATA
CLK
f
8
in
Page 20 of 35
www.lansdale.com
Issue A
LANSDALE Semiconductor, Inc.
ML145158
ML145158 BLOCK DIAGRAM
14–BIT SHIFT REGISTER
14
f
R
ENB
REFERENCE COUNTER LATCH
14
LOCK
DETECT
LD
PD
OSC
in
14–BIT
÷ RCOUNTER
PHASE
DETECTOR
A
OSC
out
out
out
CONTROL LOGIC
REF
7–BIT
COUNTER
÷
A
10–BIT ÷ N
PHASE
DETECTOR
B
φ
φ
V
f
in
COUNTER
R
7
10
÷
A COUNTER
LATCH
÷
N COUNTER
LATCH
f
V
7
10
1–BIT
CONTROL
S/R
DATA
CLK
MC
7–BIT S/R
10–BIT S/R
÷
A
÷
N
PIN DESCRIPTIONS
INPUT PINS
Frequency Input (Pin 8)
f
in
Input frequency from VCO output. A rising edge signal on
this input decrements the ÷ A and ÷ N counters. This input has
an inverter biased in the linear region to allow use with AC
coupled signals as low as 500 mV p–p. For larger amplitude
signals (standard CMOS logic levels), DC coupling may be
used.
FIRST DATA BIT INTO SHIFT REGISTER
ENB
Latch Enable Input (Pin 11)
A logic high on this pin latches the data from the shift regis-
ter into the reference divider or ÷ N, ÷ A latches depending on
the control bit. The reference divider latches are activated if the
control bit is at a logic high and the ÷ N, ÷ A latches are acti-
vated if the control bit is at a logic low. A logic low on this pin
allows the user to change the data in the shift registers without
affecting the counters. ENB is normally low and is pulsed high
to transfer data to the latches.
CLK, DATA
Shift Clock, Serial Data Inputs (Pins 9, 10)
Each low–to–high transition of the CLK shifts one bit of
data into the on–chip shift registers. The last data bit entered
determines which counter storage latch is activated; a logic 1
selects the reference counter latch and a logic 0 selects the
÷ A, ÷ N counter latch. The data entry format is as follows:
OSC , OSC
in
out
Reference Oscillator Input/Output (Pins 1, 2)
These pins form an on–chip reference oscillator when con-
nected to terminals of an external parallel resonant crystal.
Frequency setting capacitors of appropriate value must be con-
÷
R
nected from OSC to ground and OSC
to ground. OSC
in
out
in
may also serve as the input for an externally–generated refer-
ence signal. This signal is typically AC coupled to OSC , but
in
for larger amplitude signals (standard CMOS logic levels) DC
coupling may also be used. In the external reference mode, no
FIRST DATA BIT INTO SHIFT REGISTER
connection is required to OSC
.
out
Page 21 of 35
www.lansdale.com
Issue A
ML145158
LANSDALE Semiconductor, Inc.
ML145158
OUTPUT PINS
lus prescaler divide values respectively for high and low modu-
lus control levels, N the number programmed into the ÷ N
counter, and A the number programmed into the ÷ A counter.
Note that when a prescaler is needed, the dual–modulus ver-
sion offers a distinct advantage. The dual–modulus prescaler
allows a higher reference frequency at the phase detector input,
increasing system performance capability, and simplifying the
loop filter design.
PD
out
Phase Detector A Output (Pin 5)
This single–ended (three–state) phase detector output pro-
duces a loop–error signal that is used with a loop filter to con-
trol a VCO.
Frequency f > f or f Leading: Negative Pulses
V
R
V
V
Frequency f < f or f Lagging: Positive Pulses
V
R
f , f
R V
Frequency f = f and Phase Coincidence:
V
R
R Counter Output, N Counter Output (Pins 13, 3)
High–Impedance State
Buffered, divided reference and fin frequency outputs. The
φR, φV
f and f outputs are connected internally to the ÷ R and ÷ N
R
V
Phase Detector B Outputs (Pins 16, 15)
counter outputs respectively, allowing the counters to be used
independently, as well as monitoring the phase detector inputs.
Double–ended phase detector outputs. These outputs can be
combined externally for a loop–error signal. A single–ended
LD
output is also available for this purpose (see PD ).
out
Lock Detector Output (Pin 7)
If frequency f is greater than f or if the phase of f is
V
R
V
leading, then error information is provided by φ pulsing low.
This output is essentially at a high level when the loop is
V
φ remains essentially high.
locked (f , f of same phase and frequency), and pulses low
R
R V
If the frequency f is less than f or if the phase of f is
when loop is out of lock.
V
R
V
lagging, then error information is provided by φ pulsing low.
R
φ
remains essentially high.
REF
out
V
If the frequency of f = f and both are in phase, then both
Buffered Reference Oscillator Output (Pin 14)
V
R
φ
and φ remain high except for a small minimum time peri-
V
R
This output can be used as a second local oscillator, refer-
ence oscillator to another frequency synthesizer, or as the sys-
tem clock to a microprocessor controller.
od when both pulse low in phase.
MC
Dual–Modulus Prescaler Control Output (Pin 12)
POWER SUPPLY
This output generates a signal by the on–chip control logic
circuitry for controlling an external dual–modulus prescaler.
The MC level is low at the beginning of a count cycle and
remains low until the ÷ A counter has counted down from its
programmed value. At this time, MC goes high and remains
high until the ÷ N counter has counted the rest of the way
down from its programmed value (N – A additional counts
since both ÷ N and ÷ A are counting down during the first por-
tion of the cycle). MC is then set back low, the counters preset
to their respective programmed values, and the above sequence
repeated. This provides for a total programmable divide value
V
DD
Positive Power Supply (Pin 4)
The positive power supply potential. This pin may range
from + 3 to + 9 V with respect to VSS.
V
SS
Negative Power Supply (Pin 6)
The most negative supply potential. This pin is usually-
ground.
(N ) = N • P + A where P and P + 1 represent the dual–modu-
T
Page 22 of 35
www.lansdale.com
#
LANSDALE Semiconductor, Inc.
ML1451xx
ML14515X FAMILY CHARACTERISTICS AND DESCRIPTIONS - CONTINUED
MAXIMUM RATINGS* (Voltages Referenced to V
)
SS
These devices contain protection circuitry to
Symbol
Parameter
DC Supply Voltage
Value
Unit
V
protect against damage due to high static
voltages or electric fields. However, precau-
tionsmust betakentoavoidapplicationsofany
voltage higher than maximum rated voltages
to these high–impedance circuits. For proper
V
DD
– 0.5 to + 10.0
V , V
in out
Input or Output Voltage (DC or Transient)
except SW1, SW2
– 0.5 to V
+ 0.5
DD
V
operation, V and V
to the range V
SS
except for SW1 and SW2.
SW1 and SW2 can be tied through external
resistors to voltages as high as 15 V, indepen-
dent of the supply voltage.
Unused inputs must always be tied to an
appropriatelogicvoltagelevel(e.g.,eitherV
should be constrained
V
Output Voltage (DC or Transient),
– 0.5 to + 15
10
V
in
out
out
(V or V
in out
)
V
DD
SW1, SW2 (R
= 4.7 kΩ)
pull–up
I
, I
in out
Input or Output Current (DC or Transient),
per Pin
mA
I
, I
Supply Current, V
or V
Pins
SS
30
500
mA
mW
C
DD SS
DD
P
Power Dissipation, per Package†
Storage Temperature
D
SS
orV ),exceptforinputswithpull–updevices.
DD
Unused outputs must be left open.
T
stg
– 65 to + 150
260
T
Lead Temperature, 1 mm from Case for
10 seconds
C
L
* Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the limits in the Electrical Characteristics
tables or Pin Descriptions section.
†Power Dissipation Temperature Derating:
Plastic DIP: – 12 mW/ C from 65 to 85 C
SOG Package: – 7 mW/ C from 65 to 85 C
ELECTRICAL CHARACTERISTICS (Voltages Referenced to V
)
SS
– 40 C
25 C
Max
85 C
Max
V
DD
V
Symbol
Parameter
Test Condition
Unit
Min
Max
Min
Min
V
DD
Power Supply Voltage
Range
–
3
9
3
9
3
9
V
I
ss
Dynamic Supply Current
f
= OSC = 10 MHz,
3
5
9
–
–
–
3.5
10
30
–
–
–
3
7.5
24
–
–
–
3
7.5
24
mA
in
in
1 V p–p AC coupled sine
wave
R = 128, A = 32, N = 128
I
Quiescent Supply Current
(not including pull–up
current component)
V
= V
DD
= 0 µA
or V
SS
3
5
9
–
–
–
800
1200
1600
–
–
–
800
1200
1600
–
–
–
1600
2400
3200
µA
SS
in
I
out
V
Input Voltage – f , OSC
in
Input AC coupled sine wave
–
500
–
500
–
500
–
mV p–p
V
in
in
V
IL
LowLevel Input V oltage
– f , OSC
V
2.1 V
3.5 V
6.3 V square wave
Input DC
coupled
3
5
9
–
–
–
0
0
0
–
–
–
0
0
0
–
–
–
0
0
0
out
V
out
in
in
V
out
V
High–Level Input Voltage
– f , OSC
V
0.9 V
1.5 V
2.7 V square wave
Input DC
coupled
3
5
9
3.0
5.0
9.0
–
–
–
3.0
5.0
9.0
–
–
–
3.0
5.0
9.0
–
–
–
V
V
V
IH
out
V
out
in
in
V
out
V
Low–Level Input Voltage
– except f , OSC
3
5
9
–
–
–
0.9
1.5
2.7
–
–
–
0.9
1.5
2.7
–
–
–
0.9
1.5
2.7
IL
in
in
V
IH
High–Level Input Voltage
– except f , OSC
3
5
9
2.1
3.5
6.3
–
–
–
2.1
3.5
6.3
–
–
–
2.1
3.5
6.3
–
–
–
in
in
I
Input Current (f , OSC
in
)
in
V
V
= V
= V
or V
SS
9
9
2
–
50
2
–
25
2
–
22
µA
µA
in
in
DD
SS
I
IL
Input Leakage Current
(Data, CLK, ENB –
without pull–ups)
– 0.3
– 0.1
– 1.0
in
I
IH
Input Leakage Current (all
inputs except f , OSC
V
in
= V
9
–
0.3
–
0.1
–
1.0
µA
DD
)
in
in
(continued)
Page 23 of 35
www.lansdale.com
Issue A
ML1451xx
LANSDALE Semiconductor, Inc.
DC ELECTRICAL CHARACTERISTICS (continued)
– 40 C
25 C
85 C
V
DD
V
Symbol
Parameter
Test Condition
Unit
Min
Max
Min
Max
Min
Max
I
IL
Pull–up Current (all inputs
with pull–ups)
V
in
= V
9
– 20
– 400
– 20
– 200
– 20
– 170
µA
SS
C
Input Capacitance
Low–Level Output
–
–
10
–
10
–
10
pF
V
in
V
OL
I
V
0 µA
3
5
9
–
–
–
0.9
1.5
2.7
–
–
–
0.9
1.5
2.7
–
–
–
0.9
1.5
2.7
out
in
Voltage – OSC
= V
out
DD
V
OH
High–Level Output
Voltage – OSC
I
V
0 µA
3
5
9
2.1
3.5
6.3
–
–
–
2.1
3.5
6.3
–
–
–
2.1
3.5
6.3
–
–
–
V
out
in
= V
out
SS
V
OL
Low–Level Output
Voltage – Other Outputs
I
0 µA
3
5
9
–
–
–
0.05
0.05
0.05
–
–
–
0.05
0.05
0.05
–
–
–
0.05
0.05
0.05
V
out
V
OH
High–Level Output
Voltage – Other Outputs
I
0 µA
3
5
9
2.95
4.95
8.95
–
–
–
2.95
4.95
8.95
–
–
–
2.95
4.95
8.95
–
–
–
V
out
V
Drain–to–Source
Breakdown Voltage –
SW1, SW2
R
= 4.7 kΩ
pull–up
–
15
–
15
–
15
–
V
(BR)DSS
I
Low–Level Sinking
Current – MC
V
= 0.3 V
= 0.4 V
= 0.5 V
3
5
9
1.30
1.90
3.80
–
–
–
1.10
1.70
3.30
–
–
–
0.66
1.08
2.10
–
–
–
mA
mA
mA
mA
mA
mA
mA
OL
out
V
out
V
out
I
High–Level Sourcing
Current – MC
V
= 2.7 V
= 4.6 V
= 8.5 V
3
5
9
– 0.60
– 0.90
– 1.50
–
–
–
– 0.50
– 0.75
– 1.25
–
–
–
– 0.30
– 0.50
– 0.80
–
–
–
OH
out
V
V
out
out
I
Low–Level Sinking
Current – LD
V
= 0.3 V
= 0.4 V
= 0.5 V
3
5
9
0.25
0.64
1.30
–
–
–
0.20
0.51
1.00
–
–
–
0.15
0.36
0.70
–
–
–
OL
out
V
V
out
out
I
High–Level Sourcing
Current – LD
V
= 2.7 V
= 4.6 V
= 8.5 V
3
5
9
– 0.25
– 0.64
– 1.30
–
–
–
– 0.20
– 0.51
– 1.00
–
–
–
– 0.15
– 0.36
– 0.70
–
–
–
OH
out
V
V
out
out
I
Low–Level Sinking
Current – SW1, SW2
V
= 0.3 V
= 0.4 V
= 0.5 V
3
5
9
0.80
1.50
3.50
–
–
–
0.48
0.90
2.10
–
–
–
0.24
0.45
1.05
–
–
–
OL
OL
OH
out
V
out
V
out
I
Low–Level Sinking
Current – Other Outputs
V
= 0.3 V
= 0.4 V
= 0.5 V
3
5
9
0.44
0.64
1.30
–
–
–
0.35
0.51
1.00
–
–
–
0.22
0.36
0.70
–
–
–
out
V
out
V
out
I
High–Level Sourcing
Current – Other Outputs
V
= 2.7 V
= 4.6 V
= 8.5 V
3
5
9
– 0.44
– 0.64
– 1.30
–
–
–
– 0.35
– 0.51
– 1.00
–
–
–
– 0.22
– 0.36
– 0.70
–
–
–
out
V
out
V
out
I
I
Output Leakage Current –
V
= V
or V
SS
9
–
–
–
0.3
0.3
10
–
–
–
0.1
0.1
10
–
–
–
1.0
3.0
10
µA
µA
pF
OZ
out
DD
PD
Output in Off State
out
Output Leakage Current –
SW1, SW2
V
out
= V or V
SS
9
OZ
DD
Output in Off State
C
Output Capacitance –
PD – Three–State
–
out
out
PD
out
Page 24 of 35
www.lansdale.com
Issue A
LANSDALE Semiconductor, Inc.
ML1451xx
AC ELECTRICAL CHARACTERISTICS (C = 50 pF, Input t = t = 10 ns)
L
r
f
V
DD
V
Guaranteed Limit
Guaranteed Limit
255C
– 40 to 85°C
Symbol
, t
Parameter
Unit
t
Maximum Propagation Delay, f to MC
in
3
5
9
110
60
35
120
70
40
ns
ns
ns
ns
ns
ns
ns
PLH PHL
(Figures 1 and 4)
t
Maximum Propagation Delay, ENB to SW1, SW2
(Figures 1 and 5)
3
5
9
160
80
50
180
95
60
PHL
t
w
Output Pulse Width, φ , φ , and LD with f in Phase with f
V
3
5
9
25 to 200
20 to 100
10 to 70
25 to 260
20 to 125
10 to 80
R
V
R
(Figures 2 and 4)
t
t
Maximum Output Transition Time, MC
(Figures 3 and 4)
3
5
9
115
60
40
115
75
60
TLH
Maximum Output Transition Time, MC
(Figures 3 and 4)
3
5
9
60
34
30
70
45
38
THL
t
, t
TLH THL
Maximum Output Transition Time, LD
(Figures 3 and 4)
3
5
9
180
90
70
200
120
90
t
, t
TLH THL
Maximum Output Transition Time, Other Outputs
(Figures 3 and 4)
3
5
9
160
80
60
175
100
65
SWITCHING WAVEFORMS
V
DD
SS
INPUT
50%
– V
t
w
t
t
PHL
PLH
50%
φ
, φ , LD*
R V
OUTPUT
50%
* f in phase with f .
R
V
Figure 1.
Figure 2.
t
t
THL
TLH
ANY
OUTPUT
90%
10%
Figure 3.
V
DD
TEST POINT
15 k
TEST POINT
OUTPUT
Ω
OUTPUT
DEVICE
UNDER
TEST
DEVICE
UNDER
TEST
C *
C *
L
L
* Includes all probe and fixture capacitance.
Figure 4. Test Circuit
* Includes all probe and fixture capacitance.
Figure 5. Test Circuit
Page 25 of 35
www.lansdale.com
Issue A
ML1451xx
LANSDALE Semiconductor, Inc.
TIMING REQUIREMENTS (Input t = t = 10 ns unless otherwise indicated)
r
f
V
DD
V
Guaranteed Limit
25 C
Guaranteed Limit
– 40 to 85 C
Symbol
Parameter
Unit
f
Serial Data Clock Frequency, Assuming 25% Duty Cycle
3
5
9
DC to 5.0
DC to 7.1
DC to 10
DC to 3.5
DC to 7.1
DC to 10
MHz
clk
NOTE: Refer to CLK t
(Figure 6)
below
w(H)
t
Minimum Setup Time, Data to CLK
(Figure 7)
3
5
9
30
20
18
30
20
18
ns
ns
ns
ns
ns
µs
su
t
Minimum Hold Time, CLK to Data
(Figure 7)
3
5
9
40
20
15
40
20
15
h
t
su
Minimum Setup Time, CLK to ENB
(Figure 7)
3
5
9
70
32
25
70
32
25
t
Minimum Recovery Time, ENB to CLK
(Figure 7)
3
5
9
5
10
20
5
10
20
rec
t
Minimum Pulse Width, CLK and ENB
(Figure 6)
3
5
9
50
35
25
70
35
25
w(H)
t , t
r
Maximum Input Rise and Fall Times – Any Input
(Figure 8)
3
5
9
5
4
2
5
4
2
f
SWITCHING WAVEFORMS
– V
DD
t
DATA
w(H)
50%
– V
DD
V
SS
CLK,
ENB
t
su
50%
t
h
V
*
SS
1
– V
DD
4 f
clk
LAST
CLK
FIRST
CLK
CLK
ENB
50%
V
SS
*Assumes 25% Duty Cycle.
t
t
su
rec
– V
DD
Figure 6.
50%
V
SS
PREVIOUS
DATA
LATCHED
t
t
f
r
ANY
OUTPUT
– V
DD
90%
10%
Figure 7.
V
SS
Figure 8.
Page 26 of 35
www.lansdale.com
Issue A
LANSDALE Semiconductor, Inc.
ML1451xx
FREQUENCY CHARACTERISTICS (Voltages References to V , C = 50 pF, Input t = t =10 ns unless otherwise indicated)
SS
L
r
f
– 40 C
25 C
Max
85 C
Max
V
DD
V
Symbol
Parameter
Input Frequency
Test Condition
Min
Max
Min
Min
Unit
f
i
R ≥ 8, A ≥ 0, N ≥ 8
= 500 mV p–p
AC coupled sine wave
3
5
9
–
–
–
6
15
15
–
–
–
6
15
15
–
–
–
6
15
15
MHz
MHz
MHz
(f , OSC
)
in
V
in
in
R ≥ 8, A ≥ 0, N ≥ 8
= 1 V p–p AC coupled
sine wave
3
5
9
–
–
–
12
22
25
–
–
–
12
20
22
–
–
–
7
20
22
V
in
R ≥ 8, A ≥ 0, N ≥ 8
3
5
9
–
–
–
13
25
25
–
–
–
12
22
25
–
–
–
8
22
25
V
in
= V
to V
DD
SS
DC coupled square wave
NOTE: Usually, the PLL's propagation delay from f to MC plus the setup time of the prescaler determines the upper frequency limit of the system.
in
The upper frequency limit is found with the following formula:f = P /(t + t ) where f is the upper frequency in Hz, P is the lower of the dual
P
set
modulus prescaler ratios, t is the f to MC propagation delay in seconds, and t
is the prescaler setup time in seconds.
P
in
set
For example, with a 5 V supply, the f to MC delay is 70 ns. If the MC12028A prescaler is used, the setup time is 16 ns. Thus, if the 64/65
ratio is utilized, the upper frequency limit is f = P/(t + t ) = 64/(70 + 16) = 744 MHz.
set
in
P
f
V
R
H
REFERENCE
OSC
÷
R
V
V
L
f
H
V
FEEDBACK
(f N)
÷
V
V
in
L
H
*
HIGH IMPEDANCE
PD
out
V
V
L
H
φ
R
V
V
L
H
φ
V
V
V
L
H
LD
V
L
V
H
V
L
= High Voltage Level.
= Low Voltage Level.
* At this point, when both f and f are in phase, the output is forced to near mid–supply.
R
V
NOTE: The PD
generates error pulses during out–of–lock conditions.When locked in phase and frequency the output is high
out
and the voltage at this pin is determined by the low–pass filter capacitor.
Figure 9. Phase Detector/Lock Detector Output Waveforms
Page 27 of 35
www.lansdale.com
Issue A
ML1451xx
LANSDALE Semiconductor, Inc.
DESIGN CONSIDERATIONS
PHASE–LOCKED LOOP – LOW–PASS FILTER DESIGN
K
K
φ
VCO
A)
PD
out
VCO
ω
=
=
n
NR C
R
1
1
φ
–
–
R
V
C
Nω
n
ζ
φ
2K
K
VCO
φ
1
F(s) =
R sC + 1
1
PD
B)
VCO
out
K
K
φ
VCO
R
ω
=
1
n
NC(R + R )
1
2
φ
–
–
R
R
2
N
)
(
R C +
2
φ
ζ
=
0.5
ω
C
V
n
K
K
VCO
φ
R sC + 1
2
F(s) =
(R + R )sC + 1
1
2
R
2
K
K
VCO
PD
–
C)
φ
out
ω
=
n
NCR
C
1
R
R
1
_
+
φ
R
ω
R C
2
A
VCO
n
φ
V
ζ
=
2
1
ASSUMING GAIN A IS VERY LARGE, THEN:
R sC + 1
R
2
2
C
F(s) =
R sC
1
NOTE: Sometimes R is split into two series resistors, each R ÷2. A capacitor C is then placed from the midpoint to ground to further
1
R
1
C
filter φ and φ . The value of C should be such that the corner frequency of this network does not significantly affect ω .
V
C
n
The φ and φ outputs swing rail–to–rail.Therefore, the user should be careful not to exceed the common mode input range of the
R
V
op amp used in the combiner/loop filter.
DEFINITIONS:
N = Total Division Ratio in feedback loop
K
φ
K
φ
(Phase Detector Gain) = V /4π for PD
DD
out
(Phase Detector Gain) = V /2π for φ and φ
DD
V
R
2π∆f
VCO
K
VCO
(VCO Gain) =
∆V
VCO
2πfr
10
for a typical design w (Natural Frequency)
(at phase detector input).
n
Damping Factor: ζ ≅ 1
RECOMMENDED READING:
Gardner, Floyd M., Phaselock Techniques (second edition). New York, Wiley–Interscience, 1979.
Manassewitsch, Vadim, Frequency Synthesizers: Theory and Design (second edition). New York, Wiley–Interscience, 1980.
Blanchard, Alain, Phase–Locked Loops: Application to Coherent Receiver Design. New York, Wiley–Interscience, 1976.
Egan, William F., Frequency Synthesis by Phase Lock. New York, Wiley–Interscience, 1981.
Rohde, Ulrich L., Digital PLL Frequency Synthesizers Theory and Design. Englewood Cliffs, NJ, Prentice–Hall, 1983.
Berlin, Howard M., Design of Phase–Locked Loop Circuits, with Experiments. Indianapolis, Howard W. Sams and Co., 1978.
Kinley, Harold, The PLL Synthesizer Cookbook. Blue Ridge Summit, PA, Tab Books, 1980.
AN535, Phase–Locked Loop Design Fundamentals, Motorola Semiconductor Products, Inc., 1970.
AR254, Phase–Locked Loop Design Articles, Motorola Semiconductor Products, Inc., Reprinted with permission from Electronic Design,
1987.
Page 28 of 35
www.lansdale.com
Issue A
LANSDALE Semiconductor, Inc.
ML1451xx
CRYSTAL OSCILLATOR CONSIDERATIONS
The following options may be considered to provide a refer-
ence frequency to Motorola's or Lansdale’s CMOS frequency
synthesizers.
C C
in out
C1 • C2
C1 + C2
C =
L
+ C + C +
a o
C
+ C
out
in
where
C
= 5 pF (see Figure 11)
= 6 pF (see Figure 11)
Use of a Hybrid Crystal Oscillator
in
C
out
Commercially available temperature–compensated crystal
oscillators (TCXOs) or crystal–controlled data clock oscilla-
tors provide very stable reference frequencies. An oscillator
capable of sinking and sourcing 50 µA at CMOS logic levels
C = 1 pF (see Figure 11)
a
C
= the crystal's holder capacitance
(see Figure 12)
O
C1 and C2 = external capacitors (see Figure 10)
may be direct or DC coupled to OSC . In general, the highest
in
frequency capability is obtained utilizing a direct–coupled
C
a
square wave having a rail–to–rail (V
to V ) voltage
DD
SS
swing. If the oscillator does not have CMOS logic levels on the
outputs, capacitive or AC coupling to OSC may be used.
C
C
out
in
in
OSC , an unbuffered output, should be left floating.
out
For additional information about TCXOs and data clock
oscillators, please consult the latest version of the eem Elec-
tronic Engineers Master Catalog, the Gold Book, or similar
publications.
Figure 11. Parasitic Capacitances of the Amplifier
R
L
C
S
S
S
Design an Off–Chip Reference
1
2
1
2
The user may design an off–chip crystal oscillator using ICs
specifically developed for crystal oscillator applications, such
as the ML12061 MECL device. The reference signal from the
C
O
MECL device is AC coupled to OSC . For large amplitude
in
R
X
e
signals (standard CMOS logic levels), DC coupling is used.
e
2
1
OSC , an unbuffered output, should be left floating. In gen-
out
eral, the highest frequency capability is obtained with a di-
rect–coupled square wave having rail–to–rail voltage swing.
NOTE: Values are supplied by crystal manufacturer
(parallel resonant crystal).
Use of the On–Chip Oscillator Circuitry
Figure 12. Equivalent Crystal Networks
The on–chip amplifier (a digital inverter) along with an ap-
propriate crystal may be used to provide a reference source fre-
quency. A fundamental mode crystal, parallel resonant at the
desired operating frequency, should be connected as shown in
Figure 10.
The oscillator can be “trimmed” on–frequency by making a
portion or all of C1 variable. The crystal and associated com-
ponents must be located as close as possible to the OSC and
in
OSC
pins to minimize distortion, stray capacitance, stray
out
inductance, and startup stabilization time. In some cases, stray
capacitance should be added to the value for C and C
FREQUENCY
SYNTHESIZER
.
R
in out
f
Power is dissipated in the effective series resistance of the
crystal, Re, in Figure 12. The drive level specified by the crys-
tal manufacturer is the maximum stress that a crystal can with-
stand without damage or excessive shift in frequency. R1 in
Figure 10 limits the drive level. The use of R1 may not be nec-
essary in some cases (i.e., R1 = 0 Ω).
OSC
C1
OSC
out
in
R1*
To verify that the maximum DC supply voltage does not
overdrive the crystal, monitor the output frequency as a func-
C2
tion of voltage at OSC . (Care should be taken to minimize
out
loading.) The frequency should increase very slightly as the
DC supply voltage is increased. An overdriven crystal will
decrease in frequency or become unstable with an increase in
supply voltage. The operating supply voltage must be reduced
or R1 must be increased in value if the overdriven condition
exists. The user should note that the oscillator start–up time is
proportional to the value of R1.
Through the process of supplying crystals for use with
CMOS inverters, many crystal manufacturers have developed
expertise in CMOS oscillator design with crystals. Discussions
with such manufacturers can prove very helpful (see Table 1).
* May be deleted in certain cases. See text.
Figure 10. Pierce Crystal Oscillator Circuit
For V
DD
= 5.0 V, the crystal should be specified for a loading
capacitance, C , which does not exceed 32 pF for frequencies to
L
approximately 8.0 MHz, 20 pF for frequencies in the area of 8.0 to
15 MHz, and 10 pF for higher frequencies. These are guidelines
that provide a reasonable compromise between IC capacitance,
drive capability, swamping variations in stray and IC input/output
capacitance, and realistic C values. The shunt load capacitance,
L
C , presented across the crystal can be estimated to be:
L
Page 29 of 35
www.lansdale.com
Issue A
ML1451xx
LANSDALE Semiconductor, Inc.
Table 1. Partial List of Crystal Manufacturers
United States Crystal Corp.
Crystek Crystal
Statek Corp.
Fox Electronics
NOTE: Lansdale and Motorola do not recommend one supplier over another and in no
way suggests that this is a complete listing of crystal manufacturers.
RECOMMENDED READING
DESIGN GUIDELINES
Technical Note TN–24, Statek Corp.
Technical Note TN–7, Statek Corp.
E. Hafner, “The Piezoelectric Crystal Unit – Definitions and
Method of Measurement”, Proc. IEEE, Vol. 57, No. 2
Feb.,1969.
D. Kemper, L. Rosine, “Quartz Crystals for
FrequencyControl”, Electro–Technology, June, 1969.
P. J. Ottowitz, “A Guide to Crystal Selection”, Electronic
Design, May, 1966.
The system total divide value, N total (N ) will be dictated
T
by the application:
N is the number programmed into the ÷ N counter, A is the
frequency into the prescaler
N
=
= N • P + A
T
frequency into the phase detector
number programmed into the ÷ A counter, P and P + 1 are the
two selectable divide ratios available in the dual–modulus
prescalers. To have a range of N values in sequence, the
T
DUAL–MODULUS PRESCALING
OVERVIEW
÷ A counter is programmed from zero through P – 1 for a par-
ticular value N in the ÷ N counter. N is then incremented to N
+ 1 and the ÷ A is sequenced from 0 through P – 1 again.
There are minimum and maximum values that can be
The technique of dual–modulus prescaling is well estab-
lished as a method of achieving high performance frequency
synthesizer operation at high frequencies. Basically, the
approach allows relatively low–frequency programmable coun-
ters to be used as high–frequency programmable counters with
speed capability of several hundred MHz. This is possible with
out the sacrifice in system resolution and performance that
results if a fixed (single–modulus) divider is used for the
prescaler.
In dual–modulus prescaling, the lower speed counters must
be uniquely configured. Special control logic is necessary to
select the divide value P or P + 1 in the prescaler for the
required amount of time (see modulus control definition).
Lansdale's dual–modulus frequency synthesizers contain this
feature and can be used with a variety of dual–modulus-
prescalers to allow speed, complexity and cost to be tailored to
the system requirements. Prescalers having P, P + 1 divide val-
ues in the range of ÷ 3/÷4 to ÷128/÷ 129 can be controlled by
most Lansdale frequency synthesizers.
achieved for N . These values are a function of P and the size
T
of the ÷ N and ÷ A counters.
The constraint N ≥ A always applies. If A
= P – 1, then
≥ P – 1. Then N min = (P – 1) P + A or (P – 1) P since
max
N
min
T
A is free to assume the value of 0.
NT = N
• P + A
max max
max
To maximize system frequency capability, the dual–modulus
prescaler output must go from low to high after each group of
P or P + 1 input cycles. The prescaler should divide by P when
its modulus control line is high and by P + 1 when its MC is
low.
For the maximum frequency into the prescaler (f
value used for P must be large enough such that:
), the
VCOmax
1.f
max divided by P may not exceed the frequency
VCO
capability of f (input to the ÷ N and ÷ A counters).
in
2.The period of f
sum of the times:
divided by P must be greater than the
VCO
Several dual–modulus prescaler approaches suitable for use
with the MC145152 (Motorola), ML145156, or ML145158 are:
a. Propagation delay through the dual–modulus prescaler.
b. Prescaler setup or release time relative to its MC signal.
c. Propagation time from f to the MC output for the
frequency synthesizer device.
A sometimes useful simplification in the programming code
can be achieved by choosing the values for P of 8, 16, 32, or
in
ML12009
ML12011
ML12013
ML12015
ML12016
ML12017
ML12018
MC12028A
MC12034
MC12038
ML12052
ML12054A
÷5/÷6
÷8/÷9
440 MHz
500 MHz
500 MHz
225 MHz
225 MHz
225 MHz
520 MHz
1.1 GHz
2.0 GHz
1.1 GHz
1.1 GHz
2.0 GHz
÷10/÷11
÷32/÷33
64. For these cases, the desired value of N results when N
T
T
÷40/÷41
in binary is used as the program code to the ÷ N and ÷ A coun-
ters treated in the following manner:
÷64/÷65
÷128/÷129
÷32/33 or ÷64/65
÷32/33 or ÷64/65
÷127/128 or ÷255/256
÷64/65 or ÷128/129
÷64/65 or ÷128/129
a
1.Assume the ÷A counter contains “a” bits where 2 ≥P.
2.Always program all higher order ÷A counter bits above
“a” to 0.
Page 30 of 35
www.lansdale.com
Issue A
LANSDALE Semiconductor, Inc.
ML1451xx
3. Assume the ÷N counter and the ÷A counter (with all the
higher order bits above “a” ignored) combined into a single
binary counter of n + a bits in length (n = number of divider
stages in the ÷N counter). The MSB of this “hypothetical”
counter is to correspond to the MSB of ÷ N and the LSB is to
correspond to the LSB of ÷ A. The system divide value, N ,
T
now results when the value of N in binary is used to program
T
the “new” n + a bit counter.
By using the two devices, several dual–modulus values are
achievable (shown in Figure 13).
MC
DEVICE A
DEVICE B
DEVICE
B
DEVICE A
MC10131
MC10138
ML12009
ML12011
ML12013
÷
÷
20/
÷
÷
21
51
÷
÷
32/
÷
33
÷
40/
÷
÷
41
50/
80/÷
81
÷
100/
101
NOTE: ML12009, ML12011, and ML12013 are pin equivalent.
ML12015, ML12016, and ML12017 are pin equivalent.
Figure 13. Dual–Modulus Values
Page 31 of 35
www.lansdale.com
Issue A
ML1451xx
LANSDALE Semiconductor, Inc.
OUTLINE DIMENSIONS
P DIP 16 = EP
PLASTIC DIP
CASE 648–08
(ML145157EP, ML145158EP)
NOTES:
–A–
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
16
9
B
INCHES
MILLIMETERS
DIM
A
B
C
D
F
G
H
J
K
L
M
S
MIN
MAX
0.770
0.270
0.175
0.021
0.70
MIN
18.80
6.35
3.69
0.39
1.02
2.54 BSC
1.27 BSC
0.21
MAX
19.55
6.85
4.44
0.53
1.77
F
0.740
0.250
0.145
0.015
0.040
0.100 BSC
0.050 BSC
0.008
C
L
S
SEATING
–T–
PLANE
K
M
0.015
0.130
0.305
10°
0.38
3.30
7.74
10°
H
J
0.110
0.295
0°
2.80
7.50
0°
G
D 16 PL
0.020
0.040
0.51
1.01
M
M
0.25 (0.010)
T A
P DIP 18 = VP
PLASTIC DIP
CASE 707–02
(ML145155VP)
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM
MATERIAL CONDITION, IN RELATION TO
SEATING PLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
18
10
B
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
MILLIMETERS
INCHES
DIM
A
B
C
D
F
MIN
22.22
6.10
3.56
0.36
1.27
MAX
23.24
6.60
4.57
0.56
1.78
MIN
MAX
A
0.875
0.240
0.140
0.014
0.050
0.915
0.260
0.180
0.022
0.070
L
C
G
H
J
K
L
M
N
2.54 BSC
0.100 BSC
1.02
0.20
2.92
1.52
0.30
3.43
0.040
0.008
0.115
0.060
0.012
0.135
K
N
J
F
D
M
SEATING
PLANE
7.62 BSC
0.300 BSC
H
G
0°
15°
0°
15°
0.51
1.02
0.020
0.040
Page 32 of 35
www.lansdale.com
Issue A
LANSDALE Semiconductor, Inc.
ML1451xx
OUTLINE DIMENSIONS
P DIP 20 = RP
PLASTIC DIP
CASE 738–03
(ML145156RP)
-A-
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
20
1
11
10
B
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
C
L
INCHES
MILLIMETERS
DIM
A
B
C
D
E
F
G
J
K
L
M
N
MIN
MAX
1.070
0.260
0.180
0.022
MIN
25.66
6.10
3.81
0.39
1.27 BSC
1.27
2.54 BSC
0.21
2.80
7.62 BSC
0°
0.51
MAX
27.17
6.60
4.57
0.55
1.010
0.240
0.150
0.015
-T-
K
SEATING
M
0.050 BSC
0.050
0.100 BSC
0.008
0.110
0.300 BSC
0°
0.020
PLANE
0.070
1.77
E
N
0.015
0.140
0.38
3.55
G
F
J 20 PL
D 20 PL
M
M
0.25 (0.010)
T
B
15°
0.040
15°
1.01
M
M
0.25 (0.010)
T
A
SOG 20 = -6P
SOG PACKAGE
CASE 751D–04
(MC145155-6P, MC145156-6P)
NOTES:
–A–
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
20
11
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOW ABLE
DAMBAR PROTRUSION SHALL BE 0.13
10X P
–B–
M
M
0.010 (0.25)
B
1
10
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
MILLIMETERS
INCHES
20X D
DIM
A
B
C
D
MIN
12.65
7.40
2.35
0.35
0.50
MAX
12.95
7.60
2.65
0.49
0.90
MIN
MAX
0.510
0.299
0.104
0.019
0.035
J
0.499
0.292
0.093
0.014
0.020
M
S
S
0.010 (0.25)
T
A
B
F
F
G
J
K
M
P
R
1.27 BSC
0.050 BSC
0.25
0.10
0°
0.32
0.25
7°
0.010
0.004
0°
0.012
0.009
7°
R X 45°
10.05
0.25
10.55
0.75
0.395
0.010
0.415
0.029
C
SEATING
–T–
PLANE
M
18X G
K
Page 33 of 35
www.lansdale.com
Issue A
LANSDALE Semiconductor, Inc.
ML1451xx
OUTLINE DIMENSIONS
P DIP 28 = YP
PLASTIC DIP
CASE 710–02
(ML145151YP, ML145152YP)
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25mm (0.010) AT
MAXIMUM MATERIAL CONDITION, IN
RELATION TO SEATING PLANE AND
EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
28
1
15
14
B
MILLIMETERS
INCHES
DIM
A
B
C
D
F
MIN
36.45
13.72
3.94
0.36
1.02
MAX
37.21
14.22
5.08
0.56
1.52
MIN
MAX
1.435
0.540
0.155
0.014
0.040
1.465
0.560
0.200
0.022
0.060
L
A
C
N
G
H
J
K
L
M
N
2.54 BSC
0.100 BSC
1.65
0.20
2.92
2.16
0.38
3.43
0.065
0.008
0.115
0.085
0.015
0.135
J
H
G
M
K
SEATING
PLANE
15.24 BSC
15
1.02
0.600 BSC
15
0.020 0.040
F
D
0
0.51
°
°
0°
°
SO 28W = -6P
SOG PACKAGE
CASE 751F–04
(ML145151-6P, ML145152–6P)
-A-
NOTES:
28
1
15
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15
(0.006) PER SIDE.
14X P
M
M
-B-
0.010 (0.25)
B
14
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
28X D
M
M
S
S
0.010 (0.25)
T
A
B
R X 45°
MILLIMETERS
INCHES
C
DIM
A
B
C
D
F
G
J
K
M
P
R
MIN
17.80
7.40
2.35
0.35
0.41
1.27 BSC
0.23
0.13
MAX
MIN
MAX
-T-
18.05
0.701
0.292
0.093
0.014
0.016
0.711
-T-
7.60
2.65
0.49
0.90
0.299
0.104
0.019
0.035
26X G
SEATING
PLANE
K
F
0.050 BSC
0.009
0.005
0.32
0.29
0.013
0.011
8°
0.415
0.029
J
0°
8°
0°
10.05
0.25
10.55
0.75
0.395
0.010
Page 34 of 35
www.lansdale.com
Issue A
ML1451xx
LANSDALE Semiconductor, Inc.
OUTLINE DIMENSIONS
SOG 20 = -5P
SOG PACKAGE
CASE 751G–02
(ML145157-5P, ML145158-5P)
–A–
16
9
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
–B–
8X P
0.010 (0.25)
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
M
M
B
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
1
8
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
J
16X D
M
S
S
0.010 (0.25)
T
A
B
F
MILLIMETERS
INCHES
DIM
A
B
C
D
MIN
10.15
7.40
2.35
0.35
0.50
MAX
10.45
7.60
2.65
0.49
0.90
MIN
MAX
0.411
0.299
0.104
0.019
0.035
0.400
0.292
0.093
0.014
0.020
R X 45°
C
F
G
J
K
M
P
R
1.27 BSC
0.050 BSC
–T–
0.25
0.10
0°
0.32
0.25
7°
0.010
0.004
0°
0.012
0.009
7°
M
SEATING
14X G
K
PLANE
10.05
0.25
10.55
0.75
0.395
0.010
0.415
0.029
Lansdale Semiconductor reserves the right to make changes without further notice to any products herein to improve reliabili-
ty, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit
described herein; neither does it convey any license under its patent rights nor the rights of others. ÒTypical ” parameters which
may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the customer’s
technical experts. Lansdale Semiconductor is a registered trademark of Lansdale Semiconductor, Inc.
Page 35 of 35
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Issue A
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