ORT8850L-1BM680I [LATTICE]
Field-Programmable System Chip (FPSC) Eight-Channel x 850 Mbits/s Backplane Transceiver; 现场可编程系统芯片( FPSC )八通道x 850 Mb / s的背板收发器型号: | ORT8850L-1BM680I |
厂家: | LATTICE SEMICONDUCTOR |
描述: | Field-Programmable System Chip (FPSC) Eight-Channel x 850 Mbits/s Backplane Transceiver |
文件: | 总105页 (文件大小:1285K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ORCA® ORT8850
Field-Programmable System Chip (FPSC)
Eight-Channel x 850 Mbits/s Backplane Transceiver
February 2008
Data Sheet
Introduction
Field Programmable System-on-a-Chip (FPSCs) bring a whole new dimension to programmable logic: Field Pro-
grammable Gate Array (FPGA) logic and an embedded system solution on a single device. Lattice has developed
a solution for designers who need the many advantages of FPGA-based design implementation, coupled with high-
speed serial backplane data transfer. Built on the Series 4 reconfigurable embedded System-on-a-Chip (SoC)
architecture, the ORT8850 family is made up of backplane transceivers (SERDES) containing eight channels, each
operating at up to 850 Mbits/s (6.8 Gbits/s when all eight channels are used). This is combined with a full-duplex
synchronous interface, with built-in Clock and Data Recovery (CDR) in standard-cell logic, along with over 600K
usable FPGA system gates (ORT8850H). With the addition of protocol and access logic such as protocol-indepen-
dent framers, Asynchronous Transfer Mode (ATM) framers, Packet-over-SONET (PoS) interfaces, and framers for
HDLC for Internet Protocol (IP), designers can build a configurable interface retaining proven backplane
driver/receiver technology. Designers can also use the device to drive high-speed data transfer across buses within
a system that are not SONET/SDH based. For example, designers can build a 6.8 Gbits/s PCI-to-PCI half bridge
using our PCI soft core.
The ORT8850 family offers a clockless High-Speed Interface for inter-device communication on a board or across
a backplane. The built-in clock recovery of the ORT8850 allows for higher system performance, easier-to-design
clock domains in a multiboard system, and fewer signals on the backplane. Network designers will benefit from the
backplane transceiver as a network termination device. The backplane transceiver offers SONET scram-
bling/descrambling of data and streamlined SONET framing, pointer moving, and transport overhead handling, plus
the programmable logic to terminate the network into proprietary systems. For non-SONET applications, all
SONET functionality is hidden from the user and no prior networking knowledge is required.
Table 1. ORCA ORT8850 Family – Available FPGA Logic (equivalent to OR4E02 and OR4E06 respectively)
FPGA
System
Gates (K)
PFU
FPGA Max
EBR
Blocks
EBR Bits
(K)
Device
PFU Rows Columns Total PFUs User I/Os
LUTs
4,992
ORT8850L
ORT8850H
26
46
24
44
624
278
297
8
74
201 - 397
471 - 899
2,024
16,192
16
148
Note: The embedded core, embedded system bus, FPGA interface and MPI are not included in the above gate counts. The System Gate
ranges are derived from the following: Minimum System Gates assumes 100% of the PFUs are used for logic only (No PFU RAM) with 40%
EBR usage and 2 PLL's. Maximum System Gates assumes 80% of the PFUs are for logic, 20% are used for PFU RAM, with 80% EBR usage
and 6 PLLs.
© 2008 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other
brand or product names are trademarks or registered trademarks of their respective holders.The specifications and information herein are subject to change without
notice.
www.latticesemi.com
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ort8850_11.1
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Package Thermal Characteristics Summary............100
qJA..............................................................100
YJC .............................................................100
qJC..............................................................100
qJB..............................................................100
FPSC Maximum Junction Temperature......101
Package Thermal Characteristics ...............101
Heat Sink Information..................................101
Package Coplanarity...................................101
Package Parasitics...................................................102
Package Outline Diagrams ......................................102
Terms and Definitions .................................102
Package Outline Drawings..........................103
Ordering Information ................................................104
Revision History .......................................................105
Table of Contents
Introduction ..................................................................1
Table of Contents.........................................................2
Features.......................................................................3
Embedded Core Features...............................3
FPGA Features ...............................................4
Programmable Logic System Features...........5
Description...................................................................6
What is an FPSC?...........................................6
FPSC Overview...............................................6
ispLEVER Development System.....................7
FPSC Design Kit .............................................7
FPGA Logic Overview.....................................8
System-Level Features ...................................9
Configuration.................................................10
Additional Information ...................................10
ORT8850 Overview ...................................................11
Embedded Core Overview............................11
SONET Logic Blocks - Overview ..................12
System Considerations for Reference Clock
Distribution..............................................15
SONET Bypass Mode...................................16
STM Macrocells - Overview ..........................17
HSI Macrocell - Overview..............................19
Supervisory and Test Support Features - Over-
view ........................................................19
Protection Switching - Overview ...................21
FPSC Configuration - Overview....................22
Backplane Transceiver Core Detailed Description ....25
SONET Logic Blocks, Detailed Description ..25
Receive Path Logic .......................................34
FPGA/Embedded Core Interface Signals ..................47
Clock and Data Timing at the FPGA/Embedded
Core Interface - SONET Block ...............49
Powerdown Mode .........................................56
Protection Switching......................................56
Memory Map..............................................................57
Registers Access and General Description...57
Electrical Characteristics............................................69
Absolute Maximum Ratings ..........................69
Recommended Operating Conditions........................69
Power Supply Decoupling LC Circuit ............70
HSI Electrical and Timing Characteristics.....71
Embedded Core LVDS I/O............................73
Pin Information...........................................................77
Package Pinouts........................................................82
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Lattice Semiconductor
ORCA ORT8850 Data Sheet
Features
Embedded Core Features
• Implemented in an ORCA Series 4 FPGA.
• Allows a wide range of high-speed backplane applications, including SONET transport and termination.
• No knowledge of SONET/SDH needed in generic applications. Simply supply data, 78 MHz—106 MHz clock,
and a frame pulse.
• High-Speed Interface (HSI) function for clock/data recovery serial backplane data transfer without external
clocks.
• Eight-channel HSI function provides 850 Mbits/s serial interface per channel for a total chip bandwidth of 6.8
Gbits/s (full duplex).
• HSI function uses Lattice’s 850 Mbits/s serial interface core. Rates from 126 Mbits/s to 850 Mbits/s are sup-
ported.
• LVDS I/Os compliant with EIA®-644 support hot insertion. All embedded LVDS I/Os include both input and output
on-board termination to allow long-haul driving of backplanes.
• Low-power 1.5 V HSI core.
• Low-power LVDS buffers.
• Programmable STS-3, and STS-12 framing.
• Independent STS-3, and STS-12 data streams per quad channels.
• 8:1 data multiplexing/demultiplexing for 106.25 MHz byte-wide data processing in FPGA logic.
• On-chip, Phase-Lock Loop (PLL) clock meets (type B) jitter tolerance specification of ITU-T recommendation
G.958.
• Powerdown option of HSI receiver on a per-channel basis.
• HSI automatically recovers from loss-of-clock once its reference clock returns to normal operating state.
• Frame alignment across multiple ORT8850 devices for work/protect switching at OC-192/STM-64 and above
rates.
• In-band management and configuration through transport overhead extraction/insertion.
• Supports transparent modes where either the only insertion is A1/A2 framing bytes, or no bytes are inserted.
• Streamlined pointer processor (pointer mover) for 8 kHz frame alignment to system clocks.
• Built-in boundry scan (IEEE ®1149.1 JTAG).
• FIFOs align incoming data across all eight channels (two groups of four channels or four groups of two channels)
for both SONET scrambling. Optional ability to bypass alignment FIFOs.
• 1 + 1 protection supports STS-12/STS-48 redundancy by either software or hardware control for protection
switching applications. STS-192 and above rates are supported through multiple devices.
• ORCA FPGA soft intellectual property core support for a variety of applications.
• Programmable Synchronous Transport Module (STM) pointer mover bypass mode.
• Programmable STM framer bypass mode.
• Programmable Clock and Data Recovery (CDR) bypass mode (clocked LVDS High-Speed Interface).
• Redundant outputs and multiplexed redundant inputs for CDR I/Os allow for implementation of eight channels
with redundancy on a single device.
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Lattice Semiconductor
FPGA Features
ORCA ORT8850 Data Sheet
• High-performance platform design:
– 0.16 µm 7-level metal technology.
– Internal performance of >250 MHz.
– Over 600K FPGA system gates (ORT8850H).
– Meets multiple I/O interface standards.
– 1.5 V operation (30% less power than 1.8 V operation) translates to greater performance.
• Traditional I/O selections:
– LVTTL (3.3V) and LVCMOS (2.5 V and 1.8 V) I/Os.
– Per pin-selectable I/O clamping diodes provide 3.3 V PCI compliance.
– Individually programmable drive capability: 24 mA sink/12 mA source, 12 mA sink/6 mA source, or 6 mA
sink/3 mA source.
– Two slew rates supported (fast and slew-limited).
– Fast-capture input latch and input flip-flop/latch for reduced input setup time and zero hold time.
– Fast open-drain drive capability.
– Capability to register 3-state enable signal.
– Off-chip clock drive capability.
– Two-input function generator in output path.
• New programmable high-speed I/O:
– Single-ended: GTL, GTL+, PECL, SSTL3/2 (class I & II), HSTL (Class I, III, IV), ZBT, and DDR.
– Double-ended: LVDS, bused-LVDS, LVPECL.
– LVDS include optional on-chip termination resistor per I/O and on-chip reference generation.
• New capability to (de)multiplex I/O signals:
– New Double-Data Rate (DDR) on both input and output at rates up to 350 MHz (700 Mbits/s effective rate).
– New 2x and 4x downlink and uplink capability per I/O (i.e., 50 MHz internal to 200 MHz I/O).
• Enhanced twin-quad Programmable Function Unit (PFU):
– Eight 16-bit Look-Up Tables (LUTs) per PFU.
– Nine user registers per PFU, one following each LUT, and organized to allow two nibbles to act indepen-
dently, plus one extra for arithmetic operations.
– New register control in each PFU has two independent programmable clocks, clock enables, local
SET/RESET, and data selects.
– New LUT structure allows flexible combinations of LUT4, LUT5, new LUT6, 4 → 1 MUX, new 8 → 1 MUX,
and ripple mode arithmetic functions in the same PFU.
– 32 x 4 RAM per PFU, configurable as single- or dual-port. Create large, fast RAM/ROM blocks (128 x 8 in
only eight PFUs) using the SLIC decoders as bank drivers.
– Soft-Wired LUTs (SWL) allow fast cascading of up to three levels of LUT logic in a single PFU through fast
internal routing, which reduces routing congestion and improves speed.
– Flexible fast access to PFU inputs from routing.
– Fast-carry logic and routing to all four adjacent PFUs for nibble-wide, byte-wide, or longer arithmetic func-
tions, with the option to register the PFU carry-out.
• Abundant high-speed buffered and nonbuffered routing resources provide 2x average speed improvements over
previous architectures.
• Hierarchical routing optimized for both local and global routing with dedicated routing resources. This results in
faster routing times with predictable and efficient performance.
• SLIC provides eight 3-State Buffers, up to 10-bit decoder, and PAL®-like AND-OR-INVERT (AOI) in each pro-
grammable logic cell.
• Improved built-in clock management with dual-output Programmable Phase-Locked Loops (PPLLs) provide opti-
mum clock modification and conditioning for phase, frequency, and duty cycle from 15 MHz up to 420 MHz. Mul-
tiplication of the input frequency up to 64x, and division of the input frequency down to 1/64x possible.
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Lattice Semiconductor
ORCA ORT8850 Data Sheet
• New 200 MHz embedded quad-port RAM blocks, two read ports, two write ports, and two sets of byte lane
enables. Each embedded RAM block can be configured as:
– One—512 x 18 (quad-port, two read/two write) with optional built-in arbitration.
– One—256 x 36 (dual-port, one read/one write).
– One—1K x 9 (dual-port, one read/one write).
– Two—512 x 9 (dual-port, one read/one write for each).
– Two RAM with arbitrary number of words whose sum is 512 or less by 18 (dual-port, one read/one write).
– Supports joining of RAM blocks.
– Two 16 x 8-bit Content Addressable Memory (CAM) support.
– FIFO 512 x 18, 256 x 36, 1K x 9, or dual 512 x 9.
– Constant multiply (8 x 16 or 16 x 8).
– Dual variable multiply (8 x 8).
• Embedded 32-bit internal system bus plus 4-bit parity interconnects FPGA logic, MicroProcessor Interface (MPI),
embedded RAM blocks, and embedded backplane transceiver blocks with 100 MHz bus performance. Included
are built-in system registers that act as the control and status center for the device.
• Built-in testability:
– Full boundary scan (IEEE 1149.1 and Draft 1149.2 JTAG).
– Programming and readback through boundary scan port compliant to IEEE Draft 1532:D1.7.
– TS_ALL testability function to 3-state all I/O pins.
– New temperature-sensing diode.
• Cycle stealing capability allows a typical 15% to 40% internal speed improvement after final place and route.This
feature also supports compliance with many setup/hold and clock to out I/O specifications and may provide
reduced ground bounce for output buses by allowing flexible delays of switching output buffers.
Programmable Logic System Features
• PCI local bus compliant for FPGA I/Os.
• Improved PowerPC/Power QUICC MPC860 and PowerPC II MPC8260 high-speed synchronous MicroProcessor
Interface can be used for configuration, readback, device control, and device status, as well as for a general-pur-
pose interface to the FPGA logic, RAMs, and embedded backplane transceiver blocks. Glueless interface to syn-
chronous PowerPC processors with user-configurable address space provided.
• New embedded AMBA™ specification 2.0 AHB system bus (ARM ® processor) facilitates communication among
the MicroProcessor Interface, configuration logic, embedded block RAM, FPGA logic, and backplane transceiver
logic.
• New network PLLs meet ITU-T G.811 specifications and provide clock conditioning for DS-1/E-1 and STS-
3/STM-1 applications.
• Variable size bused readback of configuration data capability with the built-in MicroProcessor Interface and sys-
tem bus.
• Internal, 3-state, and bidirectional buses with simple control provided by the SLIC.
• New clock routing structures for global and local clocking significantly increases speed and reduces skew (<200
ps for OR4E04).
• New local clock routing structures allow creation of localized clock trees.
• Two new edge clock routing structures allow up to six high-speed clocks on each edge of the device for improved
setup/hold and clock-to-out performance.
• New Double-Data Rate (DDR) and Zero-Bus Turn-around (ZBT) memory interfaces support the latest high-
speed memory interfaces.
• New 2x/4x uplink and downlink I/O capabilities interface high-speed external I/Os to reduced speed internal
logic.
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Lattice Semiconductor
ORCA ORT8850 Data Sheet
• Meets Universal Test and Operations PHY Interface for ATM (UTOPIA) Levels 1, 2, and 3. Also meets proposed
specifications for UTOPIA Level 4 POS-PHY, Level 3 (2.5 Gbits/s), and POS-PHY 4 (10 Gbits/s) interface stan-
dards for Packet-over-SONET as defined by the Saturn Group.
• ispLEVER development system software. Supported by industry-standard CAE tools for design entry, synthesis,
simulation, and timing analysis.
Description
What is an FPSC?
FPSCs, or Field Programmable System-on-a-Chip devices, are devices that combine field-programmable logic with
ASIC or mask-programmed logic on a single device. FPSCs provide the time to market and the flexibility of FPGAs,
the design effort savings of using soft Intellectual Property (IP) cores, and the speed, design density, and economy
of ASICs.
FPSC Overview
Lattice’s Series 4 FPSCs are created from Series 4 ORCA FPGAs. To create a Series 4 FPSC, several columns of
Programmable Logic Cells (see FPGA Logic Overview section for FPGA logic details) are added to an embedded
logic core. Other than replacing some FPGA gates with ASIC gates, at greater than 10:1 efficiency, none of the
FPGA functionality is changed—all of the Series 4 FPGA capability is retained: embedded block RAMs, MPI,
PCMs, boundary scan, etc. Columns of programmable logic are replaced on one side of the device, allowing pins
from the replaced columns to be used as I/O pins for the embedded core. The remainder of the device pins retain
their FPGA functionality.
FPSC Gate Counting
The total gate count for an FPSC is the sum of its embedded core (standard-cell/ASIC gates) and its FPGA gates.
Because FPGA gates are generally expressed as a usable range with a nominal value, the total FPSC gate count
is sometimes expressed in the same manner. Standard-cell ASIC gates are, however, 10 to 25 times more silicon-
area efficient than FPGA gates.Therefore, an FPSC with an embedded function is gate equivalent to an FPGA with
a much larger gate count.
FPGA/Embedded Core Interface
The interface between the FPGA logic and the embedded core has been enhanced to provide a greater number of
interface signals than on previous FPSC architectures. Compared to bringing embedded core signals off-chip, this
on-chip interface is much faster and requires less power.
Series 4 based FPSCs expand this interface by providing a link between the embedded block and the multi-master
32-bit system bus in the FPGA logic. This system bus allows the core easy access to many of the FPGA logic func-
tions including the embedded block RAMs and the MicroProcessor Interface.
Clock spines also can pass across the FPGA/embedded core boundary. This allows fast, low-skew clocking
between the FPGA and the embedded core. Many of the special signals from the FPGA, such as DONE and global
set/reset, are also available to the embedded core, making it possible to fully integrate the embedded core with the
FPGA as a system.
For even greater system flexibility, FPGA configuration RAMs are available for use by the embedded core. This
supports user-programmable options in the embedded core, in turn allowing greater flexibility. Multiple embedded
core configurations may be designed into a single device with user-programmable control over which configura-
tions are implemented, as well as the capability to change core functionality simply by reconfiguring the device.
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Lattice Semiconductor
ORCA ORT8850 Data Sheet
ispLEVER Development System
The ispLEVER development system is used to process a design from a netlist to a configured FPGA. This system
is used to map a design onto the ORCA architecture and then place and route it using ispLEVER's timing-driven
tools. The development system also includes interfaces to, and libraries for, other popular CAE tools for design
entry, synthesis, simulation, and timing analysis.
The ispLEVER development system interfaces to front-end design entry tools and provides the tools to produce a
configured FPGA. In the design flow, the user defines the functionality of the FPGA at two points in the design flow,
the design entry and the bit stream generation stage. Recent improvements in ispLEVER allow the user to provide
timing requirement information through logical preferences only; thus, the designer is not required to have physical
knowledge of the implementation.
Following design entry, the development system's map, place, and route tools translate the netlist into a routed
FPGA. A floor planner is available for layout feedback and control. A static timing analysis tool is provided to deter-
mine design speed, and a back-annotated netlist can be created to allow simulation and timing.
Timing and simulation output files from ispLEVER are also compatible with many third-party analysis tools. A bit
stream generator is then used to generate the configuration data which is loaded into the FPGAs internal configu-
ration RAM, embedded block RAM, and/or FPSC memory.
When using the bit stream generator, the user selects options that affect the functionality of the FPGA. Combined
with the front-end tools, ispLEVER produces configuration data that implements the various logic and routing
options discussed in this data sheet.
FPSC Design Kit
Development is facilitated by an FPSC design kit which, together with ispLEVER software and third-party synthesis
and simulation engines, provides all software and documentation required to design and verify an FPSC implemen-
tation. Included in the kit are the FPSC configuration manager, Synopsys Smart Model ®, and/or compiled Verilog ®
simulation model, HSPICE® and/or IBIS models for I/O buffers, and complete online documentation. The kit's soft-
ware couples with ispLEVER software, providing a seamless FPSC design environment. More information can be
obtained by visiting the Lattice website at www.latticesemi.com or contacting a local sales office.
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Lattice Semiconductor
FPGA Logic Overview
ORCA ORT8850 Data Sheet
The ORCA Series 4 architecture is a new generation of SRAM-based programmable devices from Lattice. It
includes enhancements and innovations geared toward today’s high-speed systems on a single chip. Designed
with networking applications in mind, the Series 4 family incorporates system-level features that can further reduce
logic requirements and increase system speed. ORCA Series 4 devices contain many new patented enhance-
ments and are offered in a variety of packages and speed grades.
The hierarchical architecture of the logic, clocks, routing, RAM, and system-level blocks create a seamless merge
of FPGA and ASIC designs. Modular hardware and software technologies enable System-on-a-Chip integration
with true plug-and-play design implementation.
The architecture consists of four basic elements: Programmable Logic Cells (PLCs), Programmable I/O cells
(PIOs), Embedded Block RAMs (EBRs) and system-level features. These elements are interconnected with a rich
routing fabric of both global and local wires. An array of PLCs are surrounded by common interface blocks which
provide an abundant interface to the adjacent PLCs or system blocks. Routing congestion around these critical
blocks is eliminated by the use of the same routing fabric implemented within the programmable logic core. Each
PLC contains a PFU, SLIC, local routing resources, and configuration RAM. Most of the FPGA logic is performed in
the PFU, but decoders, PAL-like functions, and 3-state buffering can be performed in the SLIC. The PIOs provide
device inputs and outputs and can be used to register signals and to perform input demultiplexing, output multiplex-
ing, uplink and downlink functions, and other functions on two output signals. Large blocks of 512 x 18 quad-port
RAM complement the existing distributed PFU memory. The RAM blocks can be used to implement RAM, ROM,
FIFO, multiplier, and CAM. Some of the other system-level functions include the MicroProcessor Interface (MPI),
Phase-Locked Loops (PLLs), and the Embedded System Bus (ESB).
PLC Logic
Each PFU within a PLC contains eight 4-input (16-bit) LUTs, eight latches/flip-flops, and one additional Flip-Flop
that may be used independently or with arithmetic functions.
The PFU is organized in a twin-quad fashion; two sets of four LUTs and flip-flops that can be controlled indepen-
dently. Each PFU has two independent programmable clocks, clock enables, local SET/RESET, and data selects.
LUTs may also be combined for use in arithmetic functions using fast-carry chain logic in either 4-bit or 8-bit
modes. The carry-out of either mode may be registered in the ninth flip-flop for pipelining. Each PFU may also be
configured as a synchronous 32 x 4 single- or dual-port RAM or ROM. The flip-flops (or latches) may obtain input
from LUT outputs or directly from invertible PFU inputs, or they can be tied high or tied low. The flip-flops also have
programmable clock polarity, clock enables, and local SET/RESET.
The SLIC is connected from PLC routing resources and from the outputs of the PFU. It contains eight 3-state, bidi-
rectional buffers, and logic to perform up to a 10-bit AND function for decoding, or an AND-OR with optional
INVERT to perform PAL-like functions. The 3-state drivers in the SLIC and their direct connections from the PFU
outputs make fast, true, 3-state buses possible within the FPGA, reducing required routing and allowing for real-
world system performance.
Programmable I/O
The Series 4 PIO addresses the demand for the flexibility to select I/Os that meet system interface requirements.
I/Os can be programmed in the same manner as in previous ORCA devices, with the additional new features which
allow the user the flexibility to select new I/O types that support High-Speed Interfaces.
Each PIO contains four Programmable I/O pads and is interfaced through a common interface block to the FPGA
array. The PIO is split into two pairs of I/O pads with each pair having independent clock enables, local
SET/RESET, and global SET/RESET. On the input side, each PIO contains a programmable latch/Flip-Flop which
enables very fast latching of data from any pad. The combination provides very low setup requirements and zero
hold times for signals coming on-chip. It may also be used to demultiplex an input signal, such as a multiplexed
address/data signal, and register the signals without explicitly building a demultiplexer with a PFU. On the output
side of each PIO, an output from the PLC array can be routed to each output flip-flop, and logic can be associated
8
Lattice Semiconductor
ORCA ORT8850 Data Sheet
with each I/O pad. The output logic associated with each pad allows for multiplexing of output signals and other
functions of two output signals.
The output flip-flop, in combination with output signal multiplexing, is particularly useful for registering address sig-
nals to be multiplexed with data, allowing a full clock cycle for the data to propagate to the output. The output buffer
signal can be inverted, and the 3-state control can be made active-high, active-low, or always enabled. In addition,
this 3-state signal can be registered or nonregistered.
The Series 4 I/O logic has been enhanced to include modes for speed uplink and downlink capabilities. These
modes are supported through shift register logic, which divides down incoming data rates or multiplies up outgoing
data rates. This new logic block also supports high-speed DDR mode requirements where data is clocked into and
out of the I/O buffers on both edges of the clock.
The new Programmable I/O cell allows designers to select I/Os which meet many new communication standards
permitting the device to hook up directly without any external interface translation. They support traditional FPGA
standards as well as high-speed, single-ended, and differential-pair signaling. Based on a programmable, bank-ori-
ented I/O ring architecture, designs can be implemented using 3.3V/ 2.5V/1.8V/1.5V referenced output levels.
Routing
The abundant routing resources of the Series 4 architecture are organized to route signals individually or as buses
with related control signals. Both local and global signals utilize high-speed buffered and nonbuffered routes. One
PLC segmented (x1), six PLC segmented (x6), and bused half-chip (xHL) routes are patterned together to provide
high connectivity with fast software routing times and high-speed system performance.
Eight fully distributed primary clocks are routed on a low-skew, high-speed distribution network and may be
sourced from dedicated I/O pads, PLLs, or the PLC logic. Secondary and edge-clock routing is available for fast
regional clock or control signal routing for both internal regions and on device edges. Secondary clock routing can
be sourced from any I/O pin, PLLs, or the PLC logic.
The improved routing resources offer great flexibility in moving signals to and from the logic core. This flexibility
translates into an improved capability to route designs at the required speeds when the I/O signals have been
locked to specific pins.
System-Level Features
The Series 4 also provides system-level functionality by means of its MicroProcessor Interface, embedded system
bus, quad-port embedded block RAMs, universal Programmable Phase-Locked Loops, and the addition of highly
tuned networking specific phase-locked loops. These functional blocks support easy glueless system interfacing
and the capability to adjust to varying conditions in today’s high-speed networking systems.
MicroProcessor Interface
The MPI provides a glueless interface between the FPGA and PowerPC microprocessors. Programmable in 8, 16,
and 32-bit interfaces with optional parity to the Motorola® PowerPC MPC860 and MPC8260 bus, it can be used for
configuration and readback, as well as for FPGA control and monitoring of FPGA status. All MPI transactions utilize
the Series 4 embedded system bus at 66 MHz performance.
The MPI provides a system-level MicroProcessor Interface to the FPGA user-defined logic, following configuration,
through the system bus, including access to the embedded block RAM and general user-logic. The MPI supports
burst data read and write transfers, allowing short, uneven transmission of data through the interface by including
data FIFOs.Transfer accesses can be single beat (1 x 4-bytes or less), 4-beat (4 x 4-bytes), 8-beat (8 x 2-bytes), or
16-beat (16 x 1-bytes).
System Bus
An on-chip, multimaster, 32-bit system bus with 1-bit parity facilitates communication among the MPI, configuration
logic, FPGA control, and status registers, embedded block RAMs, as well as user logic. Utilizing the AMBA specifi-
cation Rev 2.0 AHB protocol, the embedded system bus offers arbiter, decoder, master, and slave elements. Mas-
9
Lattice Semiconductor
ORCA ORT8850 Data Sheet
ter and slave elements are also available for the user-logic and embedded backplane transceiver portion of the
ORT8850.
The system bus control registers can provide control to the FPGA such as signaling for reprogramming, reset func-
tions, and PLL programming. Status registers monitor INIT, DONE, and system bus errors. An interrupt controller is
integrated to provide up to eight possible interrupt resources. Bus clock generation can be sourced from the Micro-
Processor Interface clock, configuration clock (for slave configuration modes), internal oscillator, user clock from
routing, or from the port clock (for JTAG configuration modes).
Phase-Locked Loops
Four user PLLs are provided for ORCA Series 4 FPSCs. Programmable PLLs can be used to manipulate the fre-
quency, phase, and duty cycle of a clock signal. Each PPLL is capable of manipulating and conditioning clocks
from 20 MHz to 420 MHz. Frequencies can be adjusted from 1/64x to 64x the input clock frequency. Each program-
mable PLL provides two outputs that have different multiplication factors but can have the same phase relation-
ships. Duty cycles and phase delays can be adjusted in 12.5% increments of the clock period. An automatic input
buffer delay compensation mode is available for phase delay. Each PPLL provides two outputs that can have pro-
grammable (12.5% steps) phase differences.
Embedded Block RAM
New 512 x 18 quad-port RAM blocks are embedded in the FPGA core to significantly increase the amount of mem-
ory and complement the distributed PFU memories. The EBRs include two write ports, two read ports, and two
byte lane enables which provide four-port operation. Optional arbitration between the two write ports is available,
as well as direct connection to the high-speed system bus.
Additional logic has been incorporated to allow significant flexibility for FIFO, constant multiply, and two-variable
multiply functions. The user can configure FIFO blocks with flexible depths of 512k, 256k, and 1k including asyn-
chronous and synchronous modes and programmable status and error flags. Multiplier capabilities allow a multiple
of an 8-bit number with a 16-bit fixed coefficient or vice versa (24-bit output), or a multiply of two 8-bit numbers (16-
bit output). On-the-fly coefficient modifications are available through the second read/write port. Two 16 x 8-bit
CAMs per embedded block can be implemented in single match, multiple match, and clear modes. The EBRs can
also be preloaded at device configuration time.
Configuration
The FPGAs functionality is determined by internal configuration RAM. The FPGAs internal initialization/configura-
tion circuitry loads the configuration data at power-up or under system control. The configuration data can reside
externally in an EEPROM or any other storage media. Serial EEPROMs provide a simple, low pin-count method for
configuring FPGAs.
The RAM is loaded by using one of several configuration modes. Supporting the traditional master/slave serial,
master/slave parallel, and asynchronous peripheral modes, the Series 4 also utilizes its MicroProcessor Interface
and embedded system bus to perform both programming and readback. Daisy chaining of multiple devices and
partial reconfiguration are also permitted.
Other configuration options include the initialization of the embedded-block RAM memories and FPSC memory as
well as system bus options and bit stream error checking. Programming and readback through the JTAG (IEEE
1149.2) port is also available meeting In-System Programming (ISP) standards (IEEE 1532 Draft).
Additional Information
Contact your local Lattice representative for additional information regarding the ORCA Series 4 FPSC and FPGA
devices, or visit our website at www.latticesemi.com.
10
Lattice Semiconductor
ORCA ORT8850 Data Sheet
ORT8850 Overview
The ORT8850 FPSCs provide high-speed backplane transceivers combined with FPGA logic. There are two
devices in the ORT8850 family. The ORT8850L device is based on 1.5 V OR4E02 ORCA FPGA and has a 26 x 24
array of Programmable Logic Cells (PLCs). The ORT8850H device is based on 1.5V OR4E06 ORCA FPGA and
has a 46 x 44 array. The embedded core which contains the backplane transceivers is attached to the right side of
the device and is integrated directly into the FPGA array. A top level diagram of the basic chip configuration is
shown in Figure 1.
Figure 1. ORT8850 Top Level Diagram
Embedded
ORCASeries 4E Based
ProgrammableLogic
Core
Containing
8 Serial I/O
Channels
Embedded Core Overview
The ORT8850 embedded core contains a pseudo-SONET block for backplane or intra-board, chip-to-chip commu-
nication. The SONET block includes a High-Speed Interface (HSI) macrocell and a Synchronous Transport Module
(STM) macrocell. It supports eight full-duplex channels and performs data transfer, scrambling/descrambling and
SONET framing at the maximum rate of 850 Mbits/s. Figure 2 shows a top level diagram of the ORT8850 and the
basic data flows through the device.
11
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Figure 2. ORT8850 Embedded Core,Top Level Functionality and Data Flow
FPGA Logic
Embedded Core
RXDxx_W_[P:N]
TXDxx_W_[P:N]
8
8
LVDS I/O
Buffers
Reserved
I/O
MUX
Note: xx=[AA, AB,…BD]
DOUTxx[7:0]
SONET
Logic
Block
I/O
DEMUX
(DEMUX is internal to HSI &
SONET logic block)
8
8
DINxx[7:0]
RXDxx_P_[P:N]
TXDxx_P_[P:N]
8
8
LVDS I/O
Buffers
I/O
MUX
Reserved
SONET Logic Blocks - Overview
The 850 Mbits/s SONET logic blocks allows the ORT8850 to communicate across a backplane or on a given board
at an aggregate speed of 6.8 Gbits/s, allowing high-speed asynchronous serial data transfer between system
devices. The external serial interfaces are implemented as eight channels of bidirectional 850 Mbits/s LVDS links
and use a pseudo-SONET framing protocol, which can be bypassed.
The SONET logic blocks are organized into two quads. Each quad supports four full duplex serial links (quad A
contains channels AA, AB, AC, and AD while quad B contains channels BA, BB, BC, and BD). A top level block dia-
gram of one channel of the SONET logic is shown in Figure 3.
12
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Figure 3. Top Level Block Diagram ORT8850 Embedded Core SONET Logic Block Common Signals and
Channel AA Data Flow
SONET Logic Blocks
FPGA_SYSCLK
SYS_FP
LINE_FP
System
Clock
Common Signals
SYS_CLK_[P:N]
*TOH_CLK
DOUTAA[7:0]
DOUTAA_PAR
DOUTAA_FP
Receive, Ch. AA
4:1 MUX
(x8)
RX Serial
Data
Multi-
Channel
Align
DOUTAA _SPE
DOUTAA_C1J1
DOUTAA_EN
FPGA
Logic
Pointer
Processing
RX HSI Block
Descrambler
RX STM Block
CDR_CLK_AA
*RX_TOH_CK_EN
*RX_TOH_FP
RXDxx_W_[P:N]
TXDxx_W_[P:N]
TOH Functions, Ch. AA
I/O MUX,
I/O DEMUX
and
LVDS
Buffers
Note: Signals
marked with
asterisk only
used in TOH
Insert Mode
*TOH_CK_LP_EN
*TOH_OUTAA
*TOH_AA_EN
*TX_TOH_CK_EN
*TOH_InAA
TOH Extraction
Block
TOH Insertion Block
TX STM Block
RXDxx_P_[P:N]
TXDxx_P_[P:N]
Transmit, Ch. AA
TX HSI Block
TX Serial
Data
DINAA[7:0]
DINAA_PAR
Signals
on
Package
Pins
Channel AB
.
.
.
Channel BD
Note: xx = AA, ..., BD
Each quad can frame independently in STS-3, STS-12 or STS-48 format. If using STS-48 format all channels in the
quad will be used and be treated as a single STS-48 channel using the quad STS-12 format in which each inde-
pendent channel carries entire STS-12 frames. The byte order for STS-48 must be created by the designer in the
FPGA design. Note that the recovered data will always continue to be in the same order as transmitted data.
Each channel contains transmit path and receive path logic, both of which are organized around High Speed Inter-
connect (HSI) and Synchronous Transport Mode (STM) macrocells. Additional logic allows insertion and extraction
of information in the Transport Overhead area of the SONET frame. (Support for loopback and for switching
between redundant serial links is also provided but is not shown in Figure 3). The following sections will give an
overview of the pseudo-SONET protocol supported by the ORT8850 and a top level overview of the Synchronous
Transport Module (STM) and High Speed Interconnect (HSI) macrocells, which provide the SONET functionality.
13
Lattice Semiconductor
ORCA ORT8850 Data Sheet
SONET Framing
Each 850 Mbits/s serial link uses a pseudo-SONET protocol. SONET A1/A2 framing is used on the link to detect
the 8 kHz frame location. The link is also scrambled using the standard SONET scrambler definition to ensure
proper transitions on the link for improved CDR performance. The ORT8850 can do SONET framing and scram-
bling in both STS-12 and STS-3 formats.
Elastic buffers (FIFOs) are used to align each incoming STS-12 link to the local 77.76 MHz clock and 8 kHz frame.
These FIFOs will absorb delay variations between the eight channels due to timing skews between cards and
along backplane traces. For greater variations, a streamlined pointer processor (pointer mover) within the STM
macro will align the 8 kHz frames regardless of their incoming frame position.
The data rates for SONET are covered in the following table.Values that fall in between those shown in the table for
each mode are supported (126.00 Mbits/s - 212.50 Mbits/s, 504.00 Mbits/s - 850.00 Mbits/s). 63.00 MHz is the
slowest reference clock while 106.25 MHz is the fastest reference clock frequency supported.
Table 2. Supported SONET Data Rates
Reference
Clock
STS-12 Mode
504.00 Mbits/s
622.08 Mbits/s
850.00 Mbits/s
STS-3 Mode
126.00 Mbits/s
155.52 Mbits/s
212.50 Mbits/s
63 MHz
77.76 MHz
106.25 MHz
An STS-N frame can be broadly divided into the Transport Overhead (TOH) and the Synchronous Payload Enve-
lope (SPE) areas. The TOH comprises of bytes that are used for framing, error detection and various other func-
tions. The start of the SPE can begin at any point in a SONET frame. The start of the SPE is determined using the
pointer bytes located in the TOH. The basic STS-1 frame is shown in Figure 4. Higher rate STS_N signals are cre-
ated by byte interleaving N STS-1 signals. Some TOH bytes have slightly different functions in STS-N frames than
in the basic STS-1 frame. The ORT8850 offers both a transparent option and a serial insertion option for process-
ing the TOH bytes.
Figure 4. STS-1 Frame Format
3 columns
Transport
Overhead
(TOH)
Synchronous Payload Envelope
9 rows
(SPE)
90 columns
14
Lattice Semiconductor
ORCA ORT8850 Data Sheet
LVDS Reference Clock
The reference clock for the ORT8850 SERDES is an LVDS input (SYS_CLK_[P:N]). This reference clock can run in
the range from 63.00 MHz to 106.25 MHz and is used to clock the entire Embedded Core. This clock is also avail-
able in the FPGA interface as the output signal FPGA_SYSCLK at the Embedded Core/FPGA Logic interface.
The supported range of reference clock frequencies will drive the internal and link serial rates from 504 MHz to 850
MHz. For standard SONET applications a reference clock rate of 77.76 MHz will allow the ORT8850 to communi-
cate with standard SONET devices. If the ORT8850 is communicating with another ORT8850, the reference clock
can run anywhere in the defined range. When using a non 77.76 MHz reference clock, the frame pulse will now
need to be derived from the non standard rate thus making the frame pulse rate not 8 kHz, but rather a single clock
pulse every 9720 clock cycles.
System Considerations for Reference Clock Distribution
There are two main system clocking architectures that can be used with the ORT8850 at the system level to pro-
vide the LVDS reference clocks. The recommended approach is to distribute a single reference clock to all boards.
However, independent clocks can be used on each board provided that they are matched with sufficient accuracy
and the alignment is not used. These two approaches are summarized in the following paragraphs
Distributed Clocking
A distributed clock architecture, shown in Figure 5, uses a single source for the system reference clock. This single
source drives all devices on both the line and switch sides of the backplane. Typically this is a lower speed clock
such as a 19.44 MHz signal. An external PLL on each board or and internal ORT8850 FPGA PLL is then used to
multiply the clock to the desired reference clock rate (i.e. by 4x to 77.76 MHz if the distributed clock is at 19.44
MHz). Using this type of clock architecture the ORT8850 data channels are fully synchronous and no domain trans-
fer is required from the transmitter to the receiver.
Figure 5. Distributed Clock Architecture
Port
Cards
19.44 Mhz.
ORT8850
(SERDES at
622 Mbps)
Oscillator
Fabric
Cards
FPGA
PPLL (x4)
FPGA
LVDS
PIO
PIO_OUT_P
PIO_OUT_N
SYS_CLK_N SYS_CLK_P
Buffer
77.76 Mhz
Clock (Differential)
19.44 Mhz
Clock Source
System Diagram
Independent Clocking
An independent clock architecture uses independent clock sources on each ORT8850 board. With this architec-
ture, for the SERDES to sample correctly the independent oscillators must be within reference clock tolerance
requirements for the Clock and Data Recovery (CDR) to correctly sample the incoming data and recover data and
clock. The local reference clock and the recovered clock will not be synchronous since they are created from a dif-
ferent source. The alignment FIFO uses the recovered clock for write and the local reference clock for read. Due to
15
Lattice Semiconductor
ORCA ORT8850 Data Sheet
this feature the alignment FIFO cannot be used with this clock architecture. The recovered clock is used for all
receive timing in the embedded core and supplied to the FPGA logic which must provide the clock domain transfer
functionality.
Figure 6. Independent Clock Architecture
Port
Cards
Fabric
ORT8850
Cards
(SERDES at
Osc.
622 Mbps)
Osc.
SYS_CLK_N SYS_CLK_P
Osc.
* Examples of
Typical Board
Components
Osc.
TI
LVDS
Buffer
77.76 Mhz
Differential
Output
SN65LVDS31D*
or
Conner
Winfield
HC54R8*
Oscillator
Board 77.76 Mhz
Details
Oscillator
System Diagram
Osc.
SONET Bypass Mode
It is possible to utilize only the serializer and deserializer (SERDES) blocks in the ORT8850 and to bypass all of the
SONET framing and scrambling/descrambling. In this mode the parallel data from the FPGA is serialized and sent
out the LVDS pins. The serial data in the receive direction will be run through the SERDES and then received as
parallel data with a recovered clock into the FPGA.
In the SONET Bypass mode there exists half and quarter rate selection options. Half rate allows the SERDES to
operate at 4x the reference clock. When using half rate mode only the bits 7:4 of the parallel FPGA bus are utilized.
Quarter rate allows the SERDES to operate at 2x the reference clock. When using quarter rate mode only bits 7:6
of the parallel FPGA bus are utilized. Half rate and quarter rate are selectable per channel and can be mixed per
channel so that some channels can run in full rate mode while others operate in half rate mode and still others
operate in quarter rate mode.
As shown in Table 3, 63.00 MHz is the slowest reference clock and 106.25 MHz is the fastest reference clock fre-
quency supported. For all three modes, all bandwidths within the reference clock limits are supported. Note that
there are gaps between the bandwidths supported in the three modes.
Table 3. SONET Bypass Mode Bandwidth Options
Half Mode
Bits [7:4] Used
Quarter Mode
Bits [7:6] Used
Reference Clock
Full Mode
63
504.00 Mbits/s
622.08Mbits/s
850.00 Mbits/s
252.00 Mbits/s
311.04Mbits/s
425.00 Mbits/s
126.00 Mbits/s
155.52Mbits/s
212.50 Mbits/s
77.76
106.25
In the SONET Bypass mode a 1's density function similar to SONET scrambling must be implemented in the FPGA
logic to assure reliable clock recovery at the receiver.
16
Lattice Semiconductor
ORCA ORT8850 Data Sheet
STM Macrocells - Overview
The Synchronous Transport Module (STM) portion of the embedded core consists of two quads, STM A and B.The
STM macrocells provide transmitter and receiver logic blocks on a per SERDES basis channel and are located in
the data path between the FPGA interface and the HSI macrocell. The STM macrocells' main functions are framing
and aligning data into standard STS-N frames as well as providing a 1's density through scrambling/descrambling.
Figure 7. STM Macrocell Partitioning
STM Macrocell
DOUTAA[7:0]
DINAA[7:0]
RX Serial DataAA
TX Serial DataAA
RX Serial DataAB
TX Serial DataAB
RX Serial DataAC
TX Serial DataAC
RX Serial DataAD
TX Serial DataAD
System Clock
Channel AA
Channel AB
Channel AC
Channel AD
SYS_CLK_[P:N]
DOUTAB[7:0]
DINAB[7:0]
DOUTAC[7:0]
DINAC[7:0]
DOUTAD[7:0]
DINAD[7:0]
RXDxx_W_[P:N]
TXDxx_W_[P:N]
Quad A
FPGA_SYSCLK
SYS_FP
FPGA
Logic
I/O DEMUX
and
LVDS
Buffers
Common Signals
Channel BA
RX Serial DataBA
TX Serial DataBA
RX Serial DataBB
TX Serial DataBB
RX Serial DataBC
TX Serial DataBC
RX Serial DataBD
TX Serial DataBD
DOUTBA[7:0]
DINBA[7:0]
RXDxx_P_[P:N]
TXDxx_P_[P:N]
DOUTBB[7:0]
DINBB[7:0]
Channel BB
Channel BC
Channel BD
DOUTBC[7:0]
DINBC[7:0]
Note: xx = AA, ...
DOUTBD[7:0]
DINBD[7:0]
Quad B
Transmit STM Macrocell Logic - Overview
In the transmit direction (FPGA interface to the backplane), each STM macrocell will receive frame aligned streams
of STS-12 data (maximum of four streams) from the FPGA logic. The transmitter receive data interface is in a par-
allel 8-bit format. A common frame pulse for all 8 channels is provided as an input from the FPGA logic to the trans-
mit SONET block.
On each frame pulse the A1/A2 frame alignment bytes are inserted into the data stream and will overwrite any data
in this location of the frame. TOH data can be optionally inserted into the transmitted SONET frame. The SONET
frame is then optionally scrambled and sent to the HSI macrocell.
TOH data can be inserted into the transmit data stream in two ways; transparently or by inserting serial TOH data
from a TOH serial interface signal in the FPGA logic. In the transparent mode, the SPE and TOH data received on
parallel input bus is transferred, unaltered, to the serial LVDS output. However, B1 byte of STS-1 is always replaced
with a new calculated value (the 11 bytes following B1 are replaced with all zeros). Likewise, in serial and transport
mode A1 and A2 bytes of all STS-1s are always regenerated. In the TOH serial insertion mode the SPE bytes are
transferred unaltered from the input parallel bus to the serial LVDS output. TOH bytes, however, are received from
the FPGA logic through the serial input port and are inserted in the STS- 12 frame before being sent to the LVDS
17
Lattice Semiconductor
ORCA ORT8850 Data Sheet
output. Although all TOH bytes from the 12 STS-1s are transferred into the device from each serial port, not all of
them get inserted in the frame. There are three hard coded exceptions to the TOH byte insertion:
• Framing bytes (A1/A2 of all STS-1s) are not inserted from the serial input bus. Instead, they can always be
regenerated.
• Parity byte (B1 of STS#1) is not inserted from the serial input bus. Instead, it is always recalculated (the 11 bytes
following B1 are replaced with all zeros).
• Pointer bytes (H1/H2/H3 of all STS-1s) are not inserted from the serial input bus. Instead, they always flow trans-
parently from parallel input to LVDS output.
The data stream is scrambled in the transmit direction and descrambled in the receive direction using a frame syn-
chronous scrambler of sequence length 127, operating at the line rate.The generating polynomial for the scrambler
is 1+x6+x7. The polynomial conforms to the standard SONET STS-12 data format. The scrambler is reset to
'1111111' on the first byte of the SPE (byte following the Z0 byte in the 12th STS-1). That byte and all subsequent
bytes to be scrambled are XOR'd, with the output from the bytewise scrambler. The scrambler runs continuously
from that byte, through the remainder of the frame. A1, A2, and J0/Z0 bytes are not scrambled. The B1 byte is cal-
culated (in both transmitter and receiver) on the non-scrambled data. There is a global scrambler/descrambler dis-
able feature, allowing the user to disable the scrambler of the transmitter and the descrambler of the receiver.
Following the scrambler block, byte wide data streams are sent to the HSI macrocell.
Receive STM Macrocell Logic - Overview
In the receive direction (backplane to the FPGA interface) each STM macrocell receives four byte wide data
streams at the reference clock rate (i.e., 8 X SYS_CLK_[P:N] in normal operation) and four associated clocks from
the HSI. The incoming streams are framed and (optionally) descrambled before they are written into a FIFO which
absorbs phase and delay variations and allows the shift to system clock and optionally allows frames to be aligned
both between quads and between streams on the same quad. Optionally, the pointer interpreter logic will then put
the STS SPEs into a small elastic store from which the pointer generator will produce four byte wide STS-12
streams of data that are aligned to the system timing pulse.
The alignment FIFO depth allows for 18 clocks of difference in the arriving A1/A2. If any of the channels in an align-
ment group are too far out of alignment for the FIFO to absorb the difference an alarm register will indicate the
error. Alarm indicators can be programmed to trigger an alarm at different levels of misalignment.
The multichannel alignment option allows separate SERDES data channels to be byte aligned based on the
SONET A1/A2 bytes. Data is written into the alignment FIFO using the per channel recovered clocks from the SER-
DES channel. Data is always read from the alignment FIFO using the local reference clock. (SYS_CLK pin,
FPGA_SYS CLK)
SERDES data channels can be placed into an alignment group by 2, by 4, or all 8. In by 2 mode, channels AA and
BA, AB and BB, AC and BC, and AD and BD are byte aligned. In by 4 mode channels AA, AB, AC, AD and BA, BB,
BC, BD are byte aligned. In the by 8 mode all of the channels are byte aligned.
After the alignment FIFO the receive data can optionally go through the pointer interpreter and pointer mover. The
pointer interpreter will identify the SONET payload envelope (SPE) and the C1(J0) bytes and the J1 bytes. For data
applications where the user is simply using SONET to carry user defined cells in the payload the SPE signal is very
useful as an enable to the cell processor. C1J1 for data applications can be ignored. If the pointer interpreter and
pointer mover are bypassed, then the SPE and C1J1 signals to the FPGA logic will be always '0'.In the ORT8850
each frame consists of 12 STS-1 format sub-frames. Thus, in the SPE region, there are 12 J1 pulses, one for each
STS-1. There is one C1(J0) (current SONET specifications use J0 instead of C1 as section trace to identify each
STS-1 in an STS-N) pulse in the TOH area for one frame. Thus, there are a total of 12 J1 pulses and one C1(J0)
pulse per frame. The C1(J0) pulse is coincident with the J0 of STS-1 #1 which is the first byte following the last A2
byte.
With the pointer interpreter option enabled, the SPE flag is active when the data stream is in SPE area. SPE
behavior is dependent on pointer movement and concatenation. Note: in the TOH area, H3 can also carry valid
18
Lattice Semiconductor
ORCA ORT8850 Data Sheet
data. When valid SPE data is carried in this H3 slot, SPE is high in this particular TOH time slot also. In the SPE
region, if there is no valid data during any SPE column, the SPE signal will be set to low.
After the pointer interpreter comes the pointer mover block. There is a separate pointer mover for each of the two
SONET quads, A and B, each of which handles up to one STS-48 (four channels) The K1/K2 bytes and H1-SS bits
are also passed through to the pointer generator so that the FPGA can receive them. The pointer mover handles
both concatenations inside the STS-12, and to other STS-12s inside the core. The pointer mover block can cor-
rectly process any length of concatenation of STS frames (multiple of three) as long as it begins on an STS-3
boundary (i.e., STS-1 number one, four, seven, ten, etc.) and is contained within the smaller of STS-3, 12, or 48.
The pointer generator block then maps the corresponding bytes into their appropriate location in the outgoing byte
stream. The generator also creates offset pointers based on the location of the J1 byte as indicated by the pointer
interpreter.
HSI Macrocell - Overview
The HSI macrocell consists of three functionally independent blocks: receiver, transmitter, and PLL synthesizer.
The HSI logic is used for Clock/Data Recovery (CDR) and to serialize and deserialize between the 106.25 MHz
byte-wide internal data buses and the 850 Mbits/s serial LVDS links. For a 622 Mbits/s SONET stream, the HSI will
perform Clock and Data Recovery (CDR) and MUX/DEMUX between 77.76 MHz byte-wide internal data buses
and 622 Mbits/s serial LVDS links.The transmitter block receives parallel data at its input. The MUX (serializer)
module performs a parallel-to-serial conversion using a clock provided by the PLL/synthesizer block. The resulting
serial data stream is then transmitted through the LVDS driver.
The receiver block receives a LVDS serial data without clock at its input. Based on data transitions, the receiver
selects an appropriate clock phase for each channel to retime the data. The retimed data and clock are then
passed to the DEMUX (deserializer) module. The DEMUX module performs serial-to-parallel conversion and pro-
vides parallel data and clock to the SONET framer block.
Supervisory and Test Support Features - Overview
The supervisory and test support functions provided by the ORT8850 include data integrity monitoring, error inser-
tion capabilities and loopback support. These functions are described in the following sections.
Integrity Monitoring
FPGA Parallel Bus Integrity: Parity error checking is implemented on each of the four parallel input buses on each
STM quad (A & B). "Even" or "Odd" parity can be selected by setting a control register bit. Upon detection of an
error, an alarm bit is set. This feature is on a per channel basis. Note that, on parallel output ports, parity is calcu-
lated over the 8-bit data bus and not on the SPE and C1J1 lines.
TOH Serial Port Integrity: There is “even” parity generation on each of the four TOH serial output ports. There is
“even” parity error checking on each of the four TOH serial input ports. There is one parity bit embedded in the TOH
frame. It occupies the Most Significant Bit location of A1 byte of STS#1. Upon detection of an error, an alarm bit is
set. This feature is on a per channel basis.LVDS Link Integrity: There is B1 parity generation on each of the four
LVDS output channels. There is also performance monitoring on each of the four LVDS input channels, imple-
mented as B1 parity error checking. Upon detection of an error, a counter is incremented (one count per errored
bit) and an alarm bit is set. The counter is 7-bits wide plus 1 overflow indicator bit. This feature is on a per channel
basis.
Framer Monitor: The framer in the receive direction will report Loss of Frame by setting an alarm bit, as well as a
LOF count and errored frame count. The LOF alarm bit is not clearable as long as the channel is in the LOF state.
In addition, the errored frame count represents errored frames, and will not increment more than once per frame
even if there are multiple errors.
Receiver Internal Path Integrity:There is "even" parity generation in the Receiver section (after descrambler).There
is also "even" parity error checking in the Receiver section (before output). Upon detection of an error, an alarm bit
is set. This feature is on a per channel basis.
19
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Pointer Mover Performance Monitoring: There is Pointer Mover performance monitoring in the Receiver section.
Alarm Indication Signals (AIS-P) and elastic store overflows are reported. AIS-P is implemented as a per STS-1
alarm bit. Elastic store overflow will cause an alarm bit to be set on a per STS-1 basis.
FIFO Aligner Monitoring:There is monitoring of the FIFO aligner operating point, and upon deviating from the nom-
inal operating point of the FIFO by more than user programmable threshold values (min and max threshold values),
an alarm bit is set. Threshold values are defined per device; alarm flags are per channel.
Frame Offset Monitoring: There is monitoring of the frame offset between all enabled channels (disabled channels
do not interfere with the monitoring). Monitoring is performed continuously. Upon exceeding the maximum allowed
frame offset (18 bytes) between all enabled channels, an alarm bit is set.
Error Insertion
A1/A2 Error Insert: There is a Frame Error inject feature in the transmitter section, allowing the user to replace
framing bytes A1/A2 (only last A1 byte and first A2 byte) with a selectable A1/A2 byte value for a selectable number
of consecutive frames. The number of consecutive frames to alter is specified by a 4-bit field, while A1/A2 value is
specified by two 8-bit fields. The error insert feature is on a per channel basis, A1/ A2 values and 4-bit frame count
value are on a per device basis.
B1 Error Insert: There is a B1 error insert feature in the transmitter section, allowing the user to insert errors on
user selectable bits in the B1 byte. Errors are created by simply inverting bit values. Bits to invert are specified
through an 8-bit control. To insert an error, software will first set the bits in the "transmitter B1 error insert mask".
Then, on a per channel basis software will write a one to the "B1 error insert command". The insertion circuitry per-
forms a rising edge detect on the bit, and will issue a corruption signal for the next frame, for one frame only. This
feature is on a per channel basis.
TOH Serial Output Port Parity Error Insert: There is a Parity error inject feature, in the receive section, allowing the
user to invert the parity bit of each serial output port. This feature inserts a single error. This feature is on a per
channel basis.
Parallel Output Bus Parity Error Insert:There is a Parity error inject feature, in the receive section, allowing the user
to invert parity lines (DOUTxx_PAR) associated with each output parallel busses (DOUTxx[7:0]). This feature
inserts a single error. This feature is on a per channel basis. This feature supports both 'even' and 'odd' parities.
Loopback
There are two types of loopback that can be utilized inside the embedded ASIC core of the ORT8850, near end
loopback and far end (line side) loopback. Both of these loopbacks are controlled by control registers inside the
ORT8850 core, which are accessible from the system bus and the MicroProcessor Interface (MPI). In both loop-
back modes, all channels are placed with a single control. The data paths in the two loopback modes are shown in
Figure 8.
20
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Figure 8. Data Paths for Near-End and Far-End Loopbacks (Single Channel)
ORT8850 Device Under Test (DUT)
FPGA Logic
Embedded Core
RXDxx_[W:P]_[P:N]
Data
Checking
m
2
LVDS
Buffer
Non-Functional
Test Equipment
or Logic on Local
System Card
Receive
32
TXDxx_[W:P]_[ P:N]
LVDS
Buffer
n
2
Data
Generation
Active
(to Eye Diagram
Measurement or
Remote System
Card)
Transmit
High Speed
Serial Loopback
Connection
(a) “Near End” Loopback
ORT8850 Device Under Test (DUT)
FPGA Logic Embedded Core
RXDxx_[W:P]_[P:N]
Active
(to Logic on
Local System
Card)
m
2
Data
Generation
RX SONET
SERDES
And
Receive
Test Equipment or
Remote System
Card
TXDxx_[W:P]_[ P:N]
LVDS
Non-Functional
n
Buffers
2
Data
Checking
TX SONET
Transmit
Parallel
Loopback
Connection
Note: xx = AA, ..., BD
(b) “Far End” Loopback
Near end loopback is a loopback of data from the FPGA transmit into the core and back out of the core to the
FPGA. This loopback mode is good for simulation since two ORT8850 devices do not have to be included in the
simulation test bench. It is also ideal for system debugging when only working with a single card. There are two
depths to the near end loopback, CDR and LVDS. The CDR near end loopback performs the loopback inside the
CDR itself. LVDS near end loopback does the loopback just before data is sent out of the LVDS transmit pins. In all
near end loopbacks the transmit data is still sent out of the LVDS pins.
Far end loopback is a loopback of the high speed data on the backplane side. Serial data is transmitted into the
device from the backplane and then looped back to the backplane side. This loopback is good for backplane con-
nectivity tests and backplane integrity type tests. The actual loopback of data is performed inside the Pointer Mover
Block. In this mode the SYS_FP signal from the FPGA logic to the Embedded Core must provide an 8KHz frame
pulse. It should also be noted that during the bypass of the Pointer Mover Block, the Far End Loopback cannot be
performed inside the Embedded ASIC Block. In that case it can be coded to be performed inside the FPGA.
Protection Switching - Overview
The ORT8850 supports 1:1 redundancy within both the transmit and receive data paths. Work/protect selection is
controlled by a control register bit which can be set using the system bus or the external MicroProcessor Interface.
Protection switching allows a pair of SERDES channels to act as main and protect data links. On the transmit side,
a simple broadcast mode is used and the same data is transmitted across both work and protect interfaces.
All data channels have receive work and protect switching capability. There are two types of receive protection
switching supported. The switching can be performed at the parallel interface to the FPGA or at the interface to the
LVDS buffers. Parallel protection switching (Figure 9) takes place just before the FPGA interface ports and after the
alignment FIFO. The alignment FIFO must be used for this type of protection switching. In this mode SERDES
channels AA and AB are used as main and protect. When selected for main channel AA is used to provide data on
FPGA interface ports AA. When selected for protect channel AB is used to provide data on FPGA interface ports
21
Lattice Semiconductor
ORCA ORT8850 Data Sheet
AA.This same scheme is used for channels groupings of AC/AD, BA/BB, and BC/BD. For quad protection when the
alignment FIFOs are to be used, the protection switching must be done in FPGA logic.
Figure 9. Parallel Protection Switching
SONET and
Transmit
Receive
HSI Blocks
SONET and
HSI Blocks
Work
Parallel RX Data
(To FPGA)
Parallel TX Data
(From FPGA)
Channel AA
Work
Channel AA
Protect
Channel AB
Etc.
Protect
Channel AB
Etc.
Work/Protect Select
LVDS protection switching (Figure 10) takes place at the LVDS buffer before the serial data is sent into the CDR.
The selection is between the main LVDS buffer and the protect LVDS buffer. The main LVDS buffer provide the
main receive data on RXDxx_W_[P:N] while the protect LVDS buffers provide protection receive data on
RXDxx_P_[P:N]. When operating using the main LVDS buffers (default) no status information is available on the
protect LVDS buffers since the serial stream must reach the SONET framer before status information is available
on the data stream. The same is also true for the main LVDS buffers when operating with the protect buffers.
Figure 10. LVDS Protection Switching
Transmit
Receive
To CDR
Work (from Work LVDS Buffer)
Work (to Work LVDS Buffer)
From TX SERDES
Protect (from Protect LVDS Buffer)
Protect (to Protect LVDS Buffer)
Work/Protect Select
See Table 17 and Table 18 and the accompanying text for details and register settings for the protection switching
options.
FPSC Configuration - Overview
Configuration of the ORT8850 occurs in two stages: FPGA bit stream configuration and embedded core setup.
FPGA Configuration - Overview
Prior to becoming operational, the FPGA goes through a sequence of states, including power-up, initialization, con-
figuration, start-up, and operation. The FPGA logic is configured by the standard FPGA bit stream configuration
means as discussed in the Series 4 FPGA data sheet. The options for the embedded core are set via registers that
are accessed through the FPGA system bus. The system bus can be driven by an external PPC compliant micro-
processor via the MPI block or via a user master interface in FPGA logic. A simple IP block, that drives the system
by using the user interface and uses very little FPGA logic, is available in the MPI/System Bus technical note
(TN1017). This IP block sets up the embedded core via a state machine and allows the ORT8850 to work in an
independent system without an external MicroProcessor Interface.
Embedded Core Setup
All options for the operation of the core are configured according to the memory map shown in Table 19.
During the power-up sequence, the ORT8850 device (FPGA programmable circuit and the core) is held in reset. All
the LVDS output buffers and other output buffers are held in 3-state. All Flip-Flops in the core area are in reset
state, with the exception of the boundry-scan shift registers, which can only be reset by boundary-scan reset. After
power-up reset, the FPGA can start configuration. During FPGA configuration, the ORT8850 core will be held in
22
Lattice Semiconductor
ORCA ORT8850 Data Sheet
reset and all the local bus interface signals forced high, but the following active-high signals, PROT_SWITCH_AA,
PROT_SWITCH_AC, PROT_SWITCH_BA, PROT_SWITCH_BC, TX_TOH_CK_EN, SYS_FP, LINE_FP, will be
forced low. The CORE_READY signal sent from the embedded core to FPGA is held low, indicating that the core is
not ready to interact with FPGA logic. At the end of the FPGA configuration sequence, the CORE_READY signal
will be held low for six SYS_CLK cycles after DONE, TRI_IO and RST_N (core global reset) are high.Then it will go
active-high, indicating the embedded core is ready to function and interact with FPGA programmable circuit. During
FPGA reconfiguration when DONE and TRI_IO are low, the CORE_READY signal sent from the core to FPGA will
be held low again to indicate the embedded core is not ready to interact with FPGA logic. During FPGA partial con-
figuration, CORE_READY stays active. The same FPGA configuration sequence described previously will repeat
again.
The initialization of the embedded core consists of two steps: register configuration and synchronization of the
alignment FIFO. The steps to configure the ORT8850 device for normal operation are listed in Table 4 and Table 5.
Generic Backplane Transceiver Application
Independent Channels, Transparent TOH: Table 4 lists the register values to setup the ORT8850 as eight inde-
pendent SONET channels (no alignment) using transparent TOH. The order is specific. The values are given from
the PowerPC point of view. If using the MPI to write data to the ORT8850, the value given in the table is the value
that should be used. If using the UMI of the system bus, the data value would need to be byte flipped.
Table 4. Independent Channels,Transparent TOH
Register
Address
Value
0x05
Description
Lock register. This value must be written to allow writing to any other ORT8850 core register
Lock register. This value must be written to allow writing to any other ORT8850 core register
Turn on Channel AA in functional mode
0x30004
0x30005
0x30020
0x30021
0x30022
0x30038
0x30030
0x3003A
0x30050
0x30051
0x30052
0x30068
0x30069
0x3006A
0x30080
0x30081
0x30082
0x30098
0x30099
0x3009A
0x300B0
0x300B1
0x300B2
0x300C8
0x300C9
0x300CA
0x80
0x07
0xFF
0xFF
0x07
0xFF
0xFF
0x07
0xFF
0xFF
0x07
0xFF
0xFF
0x07
0xFF
0xFF
0x07
0xFF
0xFF
0x07
0xFF
0xFF
0x07
0xFF
0xFF
Channel AA - Transparent TOH from parallel data
Channel AA - Transparent TOH from parallel data
Turn on Channel AB in functional mode
Channel AB - Transparent TOH from parallel data
Channel AB - Transparent TOH from parallel data
Turn on Channel AC function mode
Channel AC - Transparent TOH from parallel data
Channel AB - Transparent TOH from parallel data
Turn on Channel AD in functional mode
Channel AD - Transparent TOH from parallel data
Channel AD - Transparent TOH from parallel data
Turn on Channel BA functional mode
Channel BA- Transparent TOH from parallel data
Channel AD - Transparent TOH from parallel data
Turn on Channel BB in functional mode
Channel BB- Transparent TOH from parallel data
Channel BB- Transparent TOH from parallel data
Turn on Channel BC in functional mode
Channel BC- Transparent TOH from parallel data
Channel BC - Transparent TOH from parallel data
Turn on Channel BD in functional mode
Channel BD - Transparent TOH from parallel data
Channel BD - Transparent TOH from parallel data
23
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Channel Alignment,Transparent TOH: Table 5 lists the register values to setup the ORT8850 as 4 Channel align-
ment SONET channels using transparent TOH. The order is specific. The values are given from the PowerPC point
of view. If using the MPI to write data to the ORT8850, the value given in the table is the value that should be used.
If using the UMI of the system bus, the data value would need to be byte flipped.
Table 5. Channel Alignment,Transparent TOH
Register
Address
Value
Description
Initial Register Settings
0x30004
0x30005
0x30020
0x30021
0x30022
0x30037
0x30038
0x30039
0x3003A
0x3004F
0x30050
0x30051
0x30052
0x30067
0x30068
0x30069
0x3006A
0x3007F
0x30080
0x30081
0x30082
0x30097
0x30098
0x30099
0x3009A
0x300AF
0x300B0
0x300B1
0x300B2
0x300C7
0x300C8
0x300C9
0x300CA
0x300DF
0x05
0x80
0x47
0xFF
0xFF
0x08
0x47
0xFF
0xFF
0x08
0x47
0xFF
0xFF
0x08
0x47
0xFF
0xFF
0x08
0x47
0xFF
0xFF
0x08
0x47
0xFF
0xFF
0x08
0x47
0xFF
0xFF
0x08
0x47
0xFF
0xFF
0x08
Lock register. This value must be written to allow writing to any other ORT8850 core register
Lock register. This value must be written to allow writing to any other ORT8850 core register
Turn on Channel AA in functional mode with AIS-L
Channel AA - Transparent TOH from parallel data
Channel AA - Transparent TOH from parallel data
Channel AA- Aligned by 4 (Quad A)
Turn on Channel AB function mode with AIS-L
Channel AB - Transparent TOH from parallel data
Channel AB - Transparent TOH from parallel data
Channel AB - Aligned by 4 (Quad A)
Turn on Channel AC function mode with AIS-L
Channel AC - Transparent TOH from parallel data
Channel AD - Transparent TOH from parallel data
Channel AC- Aligned by 4 (Quad A)
Turn on Channel AD function mode with AIS-L
Channel AD- Transparent TOH from parallel data
Channel AD - Transparent TOH from parallel data
Channel AC- Aligned by 4 (Quad A)
Turn on Channel BA function mode with AIS-L
Channel BA- Transparent TOH from parallel data
Channel BA- Transparent TOH from parallel data
Channel BA- Aligned by 4 (Quad B)
Turn on Channel BB function mode with AIS-L
Channel BB- Transparent TOH from parallel data
Channel BB - Transparent TOH from parallel data
Channel BB - Aligned by 4 (Quad B)
Turn on Channel BC function mode with AIS-L
Channel BC - Transparent TOH from parallel data
Channel BC - Transparent TOH from parallel data
Channel BC - Aligned by 4 (Quad B)
Turn on Channel BD function mode with AIS-L
Channel BD - Transparent TOH from parallel data
Channel BD - Transparent TOH from parallel data
Channel BD - Aligned by 4 (Quad B)
Wait for 4 SONET Frames to establish an in-frame state (~500us)
0x30018
0x0C
Alignment command to resync Quad A and Quad B, then modify register settings as
follows. Write 0x00 to clear register for normal operation.
0x30020
0x07
Channel AA in functional mode without AIS-L
24
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 5. Channel Alignment,Transparent TOH (Continued)
Register
Address
Value
Description
Initial Register Settings
0x30038
0x30050
0x30068
0x30080
0x30098
0x300B0
0x300C8
0x07
0x07
0x07
0x07
0x07
0x07
0x07
Channel AB in functional mode without AIS-L
Channel AC in functional mode without AIS-L
Channel AD in functional mode without AIS-L
Channel BA in functional mode without AIS-L
Channel BB in functional mode without AIS-L
Channel BC in functional mode without AIS-L
Channel BD in functional mode without AIS-L
Backplane Transceiver Core Detailed Description
SONET Logic Blocks, Detailed Description
The following sections describe the data processing performed in the SONET logic blocks. A 622 Mbits/s is
assumed in the descriptions however, as noted in the Overview sections, the ORT8850 can operate at variable
rates up to 850 Mbits/s. At a top level, the descriptions are separated into processing in the transmit path (FPGA to
serial link) and processing in the receive path (serial link to FPGA). A top level drawing of the two data paths and
associated clocks is shown in Figure 11. The various processing options are selected by setting bits in control reg-
isters and status information is written to status registers. Both types of registers can be written and/or read from
the System Bus or the MicroProcessor Interface (MPI). Memory maps and descriptions for the registers are given
in Table 19.
Figure 11. ORT8850 Top Level Data Flow
I/O MUX, I/O DEMUX
Embedded
Core
FPGA
Logic
And LVDS Buffers
RX Serial Data
8
-bit
bypass
SONET
1 - bit
PFU
SERDES
8-bit
8-bit
DOUTxx[7:0]
Pointer
Alignment
FIFO
Mover /
Interpreter
Receive (RX)
Path
register bit
register bits
-FPGA_SYSCLK or CDR_CLK_xx
-FPGA_SYSCLK if alignment FIFO is used
-Per channel CDR_CLK_xx if alignment FIFO is not used
PFU
bypass
bit
8 -
8-bit
DINxx[7:0]
TX Serial Data
8 -bit
SERDES
SONET
1 - bit
Transmit (TX)
Path
PLL
register bits
System
Clock
FPGA_SYSCLK
25
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Byte Ordering in SONET Frames
The ORT8850 expects byte ordering in the SONET frames to be in the standard byte interleaved format per the
GR-253 SONET standard. Byte ordering is the same in both the transmit and receive direction and treats the data
as multiple STS-1 frames. When using the ORT8850 in STS-3 format both the transmitter and receiver device must
be framed, based on STS-3 format. Likewise for the STS-12 format, both must operate in STS-12 format.
Table 6. Byte Ordering, STS-3 Format
STS-3 A -->
STS-3 B -->
STS-3 C -->
STS-3 D -->
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Table 7. Byte Ordering, STS-12 Format
STS-12 A -->
STS-12 B -->
STS-12 C -->
STS-12 D -->
12
12
12
12
9
9
9
9
6
6
6
6
3
3
3
3
11
11
11
11
8
8
8
8
5
5
5
5
2
2
2
2
10
10
10
10
7
7
7
7
4
4
4
4
1
1
1
1
26
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 8. Byte Ordering, Quad STS-12 (OC-48) Format
STS-12 A -->
STS-12 B -->
STS-12 C -->
STS-12 D -->
12
24
36
48
9
6
3
11
23
35
47
8
5
2
10
22
34
46
7
4
1
21
33
45
18
30
42
15
27
39
20
32
44
17
29
41
14
26
38
19
31
43
16
28
40
13
25
37
All internal framing is based on the system frame pulse (SYS_FP) which is a one-cycle pulse at an 8kHz rate.
There is one system frame pulse for all 8 channels or both quads. When the framer receives the system frame
pulse the individual overhead bytes are identified.
HSI Macrocell
The ORT8850 High-Speed Interface (HSI) provides a physical medium for high-speed asynchronous serial data
transfer between ASIC devices. The devices can be mounted on the same PC board or mounted on different
boards and connected through the shelf back-plane. The ORT8850 CDR macro is an eight-channel Clock-Phase
Select (CPS) and data retime function with serial-to-parallel demultiplexing for the incoming data stream and paral-
lel-to-serial multiplexing for outgoing data. The ORT8850 uses an eight-channel HSI macro cell. The HSI macro
consists of three functionally independent blocks: receiver, transmitter, and PLL synthesizer.
The PLL synthesizer block generates the necessary 850 MHz clock for operation from a 106.25 MHz, reference.
The PLL synthesizer block is a common asset shared by all eight receive and transmit channels. The PLL refer-
ence clock must match the interface frequency.
The HSI_RX block receives differential 850 Mbits/s serial data without clock at its LVDS receiver input. Based on
data transitions, the receiver selects an appropriate 850 MHz clock phase for each channel to retime the data. The
retimed data and clock are then passed to the deMUX (deserializer) module. DeMUX module performs serial-to-
parallel conversion and provides the 106 Mbits/s data and clock.
The HSI_TX block receives 106 Mbits/s parallel data at its input. MUX (serializer) module performs a parallel-to-
serial conversion using an 850 MHz clock provided by the PLL/synthesizer block. The resulting 850 Mbits/s serial
data stream is then transmitted through the LVDS driver.
The loopback feature built into the HSI macro provides looping of the transmitter data output into the receiver input
when desired.
All rate examples described here are the maximum rates possible. The actual HSI internal clock rate is determined
by the provided reference clock rate. For example, if a 77.76 MHz reference clock is provided, the HSI macro will
operate at 622 Mbits/s.
Transmit Path Logic
In the transmit direction each STM quad will receive frame aligned streams of STS-12 data (maximum of four
streams per quad) from the FPGA logic. The transmitter receives data interface in a parallel 8-bit format. A com-
mon frame pulse for all 8 channels is provided as an input from the FPGA logic to the transmit SONET block.
The system frame pulse is a single pulse at the reference clock rate every 9720 clock cycles. For a 77.76 MHz ref-
erence clock this creates an 8KHz pulse rate. The system frame pulse (SYS_FP) is used to generate the A1/A2 in
the transmit direction. It is also used by the Pointer Mover Block to perform the line side loopback, which otherwise
uses the LINE_FP frame pulse also provided by the user from the FPGA to the Embeddded ASIC Block.The Func-
tion of the LINE_FP is mentioned in the Pointer Mover bypass description.
The system frame pulse is common to all channels in the transmit direction. Once it is received from the FPGA
logic, the data to be transmitted goes through the following processing steps:
• A parity check is performed on the data
• The Transport Overhead (TOH) data is modified (optional)
27
Lattice Semiconductor
ORCA ORT8850 Data Sheet
• A1 and A2 framing bits are inserted (errored bits may optionally be inserted)
• The bit interleaved parity bit (B1) for the previously transmitted frame is inserted
• The data is scrambled using the standard STS-12 polynomial (optional)
• A parallel to serial conversion is performed on the data
• The serial data is broadcast to the work and protect LVDS buffers
These processing steps are described in more detail in the following sections. A block diagram of the transmit path
logic is shown in Figure 12. All processing except the parallel to serial conversion is optional. If all processing except
the SERDES is deselected, the device is said to be operating in the "bypass" mode.
Figure 12. Basic Logic Blocks,Transmit Path, Single Channel
FPGA
Logic
Embedded Core
SONET Logic
Prev.
Backplane
Serial
Links
I/O MUXs
And LVDS
Buffers
TX_TOH_CK_EN
TOH_Inxx
TOH
Serial
To
Parallel
Convert
B1
Calc.
B1
Hold
(from control
registers)
Insert
B1
Error
Insert
A1A2
Error
TXDxx_W_[P:N]
TXDxx_P_[P:N]
LVDS
Buffer
2
DINxx[7:0]
8
TOH
A1A2
B1
Parallel
To
Serial
Convert
Repeater
(for
STS 3)
Parity
Check
Scrambler
(optional)
Insert Insert Insert
(opt.) (opt.) (opt.)
DINxx_PAR
2
LVDS
Buffer
Note:
xx=[AA, AB,…BD]
Odd or Even
(from control
register)
622 MHz
PLL
77.78 MHz
Logic Common to Both Quads
TOH_CLK
To other
7 channels
SYS_CLK_[P:N]
2
To other
7 channels
LVDS
Buffer
SYS_FP
To other
7 channels
FPGA_SYSCLK
Parity Checking
Parity error checking is implemented on each of the four parallel input buses on each STM quad (A & B) on a per
channel basis. "Even" or "Odd" parity can be selected by setting a control register bit. Upon detection of an error,
an alarm bit in a status register is set.
There is also even parity error checking on each of the four TOH serial input ports on a per channel basis. Upon
detection of an error, an alarm bit in a status register is set.
TOH Byte Modification
The transport overhead bytes of the SONET frame can be used for in-band configuration, service, and manage-
ment since it is carried along the same channel as data. In the ORT8850 in-band signaling can be efficiently uti-
lized, since the total cost of overhead is only 3.3%. TOH data can be inserted into the transmit data stream in one
of two ways, the Transparent Insertion mode and the Serial TOH Insertion mode. The overhead bytes in an STS-1
header are shown in Figure 13. (The path overhead bytes are in the SPE.)
28
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Figure 13. SONET Overhead Bytes
0
1
2
J1
B3
C2
H4
G1
F2
Z4
Z5
Z6
A1
B1
A2
E1
D2
H2
K1
D5
D8
D11
Z3
C1/J0
F1
0
1
2
3
4
5
6
7
8
Section
Overhead
D1
D3
H1
H3
B2
K2
D4
D6
Line
Overhead
D7
D9
D10
S1/Z1
D12
E2
Transport
Overhead
Path
Overhead
When used in true SONET applications, most TOH bytes would be generated in the FPGA logic or by an external
device. The TOH bytes have the following functions. Table 9 and Table 10 show how the Embedded Core modifies
these bytes in the transmit direction and Table 12 shows how the bytes are modified in the receive direction.
Section Overhead Bytes:
• A1, A2 - These bytes are used for framing and to mark the beginning of a SONET frame. A1 has the value 0xF6
and A2 has the value 0x28.
• C1/J0 - Section Trace Message - This byte carries the section trace message. The message is interpreted to ver-
ify connectivity to a particular node in the network.
• B1 - Section Bit Interleaved Parity (BIP-8) byte - This byte carries the parity information which is used to check for
transmission errors in a section. The computed parity value is transmitted in the next frame in the B1 position. It
is defined only for the first STS-1 of a STS-N signal. The other bytes have a default value of 0x00 if using serial
TOH insertion. In transparent TOH mode the other bytes are passed through from DINxx bus.
• E1 - Section orderwire byte - This byte carries local orderwire information, which provides for a 64 Kbits/s voice
channel between two Section Termination Equipment (STE) devices.
• F1 - Section user channel byte - This byte provides a 64 Kbits/s user channel which can be used in a proprietary
fashion.
• D1, D2, D3 - Section Data Communications Channel (SDCC) bytes - These bytes provide a 192 Kbits/s channel
for transmission of information across STEs. This information could be for control and configuration, status mon-
itoring, alarms, network administration data etc.
Line Overhead Bytes:
• H1, H2 - STS Payload Pointers (H1 and H2) - These bytes are used to locate the start of the SPE in a SONET
frame. These two bytes contain the offset value, in bytes, between the pointer bytes and the start of the SPE.
These bytes are used for all the STS-1 signals contained in an STS-N signal to indicate the individual starting
positions of the SPEs. They bytes also contain justification indications, concatenation indications and path alarm
indication (AIS-P).
• H3 - Pointer Action Byte (H3) - This byte is used during frequency justifications. When a negative justification is
29
Lattice Semiconductor
ORCA ORT8850 Data Sheet
performed, one extra payload byte is inserted into the SONET frame. The H3 byte is used to hold this extra byte
and is hence called the pointer action byte. When justification is not being performed, this byte contains a default
value of 0x00.
• B2 - Line Bit-Interleaved Parity code (BIP-8) byte - This byte carries the parity information which is used to check
for transmission errors in a line. This is a even parity computed over all the bytes of the frame, except section
overhead bytes, before scrambling.The computed parity value is transmitted in the next frame in the B2 position.
This byte is defined for all the STS-1signals in an STS-N signal.
• K1, K2 - Automatic Protection Switching (APS channel) bytes - These bytes carry the APS information. They are
used for implementing automatic protection switching and for transmitting the line Alarm Indication Signal (AIS-L)
and the Remote Defect Indication (RDI-L) signal.
• D4 to D12 - Line Data Communications Channel (DCC) bytes - These bytes provide a 576 Kbits/s channel for
transmission of information.
• S1- Synchronization Status - This byte carries the synchronization status of the network element. It is located in
the first STS-1 of an STS-N. Bits 5 through 8 (as defined in GR-253) of this byte carry the synchronization status.
• Z1 - Growth - This byte is located in the second through Nth STS-1s of an STS-N and are allocated for future
growth. An STS-1 signal does not contain a Z1 byte.
• M0 - STS-1 REI-L - This byte is defined only for STS-1 signals and is used to convey the Line Remote Error Indi-
cation (REI-L). The REI-L is the count of the number of B2 parity errors detected by an LTE and is transmitted to
its peer LTE as feedback information. Bits 5 through 8 of this byte are used for this function.
• E2 - Orderwire byte - This byte carries for line orderwire information.
In the ORT8850 transmit path, the TOH processing is confined to the framing and byte interleaved parity bytes.The
remaining bytes are either passed through transparently or inserted from data sent from the serial TOH interface.
In the receive direction, the TOH bytes are stripped and optionally sent to the FPGA logic through the serial TOH
interface. Regenerated framing bytes are sent to the FPGA on the parallel data bus. The APS bytes K1 and K2 can
be optionally passed through the pointer mover under software control, or can be set to zero. The header bytes, J0
and C1 are also detected and used by the receive path, as will be discussed in a later section.
The serial TOH processing block is clocked by the TOH_CLK. If using the TOH bytes in the serial insertion mode to
support a communication channel, this TOH_CLK should be driven from the FPGA interface. The TOH processor
operates from 25 MHz to 106 MHz. A domain clock transfer takes place inside the TOH block and the TOH proces-
sor does not need to run as fast as the data.
Transparent Insert Mode
In the transmit direction the SPE and TOH data received on parallel input bus is transferred unaltered to the serial
LVDS output. However, B1 byte of STS-1 is always replaced with a new calculated value (the 11 bytes following B1
are replaced with all zeros). Also, A1 and A2 bytes of all STS-1s are always regenerated. The source for the TOH
bytes in the transparent mode is summarized in Table 9. (The order of transmission is row by row, left to right, and
then from top to bottom [most significant bit first]. SPE bytes are not shown.)
Table 9. Transmitter TOH on LVDS Output (Transparent Mode)
A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A2 A2 A2 A2 A2 A2 A2 A2 A2 A2 A2 A2
B1
0
0
0
0
0
0
0
0
0
0
0
Regenerated bytes.
Transparent bytes from parallel input port.
30
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Serial TOH Insertion Mode
In the transmit direction the SPE bytes are always transferred unaltered from the input parallel bus to the serial
LVDS output. On the other hand, TOH bytes are received from the serial input port and are inserted in the STS-12
frame before being sent to the LVDS output in the Serial TOH Insertion mode. The FPGA logic must provide fram-
ing information to the Core using the TX_TOH_CK_EN Input signal.TOH data is input on a row by row basis, with a
one clock cycle frame pulse delineating the start of a row, as shown in Figure 14. As shown in the figure, while the
SPE bytes are being transmitted for one row, the FPGA logic must simultaneously supply the Core with the TOH
data for the next row. Detailed timing for the TOH serial input is shown later in Figure 31.
Figure 14. TOH Serial Port Input Framing Signals (FPGA to Core)
FPGA_SYSCLK
SYS_FP
Row 1
DINxx[7:0]
36 bytes TOH
TOH_CLK
TX_TOH_CK_EN
TOH_INxx
MSbit(7)
of B1 byte STS1 #1
bit 6
of B1 byte STS1 #1
Incoming serial TOH data is synchronized initially to the free running clock, TOH_CLK. TOH_CLK can operate from
a minimum frequency of 25 Mhz. to a maximum frequency of 106 MHz. TOH bytes are transferred in the order
shown in Figure 15. Bytes are transferred over the serial links with the MSB first. Data should be transferred over
the serial link on a row-by-row basis. With three TOH bytes/per row for each STS-1 stream and a total of 12 STS-1
streams per STS-12 frame, a total of 288 TOH bits must be transferred for each row. The 288 TOH bits per row can
be sent back-to-back. In this case, TX_TO_CLK_EN will be high continuously for 288 TOH_CLK cycles.
It is the responsibility of the user to synchronize transfer of the TOH bytes to a pre-determined window of time rela-
tive to the STS-12 frame position on the parallel input bus, i.e., the 36 TOH bytes to be inserted in row number n
must be transferred to the Core during the time the SPE bytes of row n-1 are being transferred to the Core over the
parallel input bus. Within each SPE row, a guard band of four TOH_CLK cycles must be provided on each side of
the TOH transfer window. No data may be transferred in these guard bands.
31
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Figure 15. TOH Serial Port Input Framing Signals (FPGA to Core)
Transparent Insert TOH
Data on Parallel Input Bus
SPE Data on Parallel Input Bus
Window to Send TOH Bytes
B1, E1 and F1 for all 12 STS1's
on Serial Input Bus
For For
STS1STS1
#12 #1
For For
STS1STS1
For
STS1
#12
#1
#2
. . .
. . .
. . .
Row n-1
A1 A1
A1 A2
J0
Window to Send TOH Bytes
D1, D2 and D3 for all 12 STS1's
on Serial Input Bus
. . .
. . .
. . .
Row n
Etc.
B1 B1
B1 E1
F1
Guardband of
4 TOH_CLK Cycles
Guardband of
4 TOH_CLK Cycles
Although all TOH bytes from the 12 STS-1s are transferred into the device from each serial port, not all of them get
inserted in the frame. There are three hard coded exceptions to the TOH byte insertion:
• Framing bytes (A1/A2 of all STS-1s) are not inserted from the serial input bus. Instead, they can always be
regenerated.
• Parity byte (B1 of STS#1) is not inserted from the serial input bus. Instead, it is always recalculated (the 11 bytes
following B1 are replaced with all zeros).
• Pointer bytes (H1/H2/H3 of all STS-1s) are not inserted from the serial input bus. Instead, they always flow trans-
parently from parallel input to LVDS output.
Except for the above hardcode exceptions, the source of some TOH bytes can be controlled by bits in the control
registers. The 12 STS-1 bytes forming a single STS-12 TOH header block are controlled as a whole. When config-
ured to be in the transparent mode, the specific bytes must flow transparently from the parallel input. The 15 over-
head bytes that can be controlled on a per STS-1 basis are the following:
• K1 and K2 bytes of the 12 STS-1s (24 bytes)
• S1 and M0 bytes of the 12 STS-1s (24 bytes)
• E1, F1, E2 bytes of the STS-1s (36 bytes)
• D1 through D12 bytes of the STS-1s (144 bytes)
The C1(J0) and B2 bytes (unshaded in the following table) are also passed through transparently from the parallel
bus to the serial link.
Table 10 shows the order in which data is transferred to the serial LVDS output, starting with the most significant bit
of the first A1 byte. The first bit of the first byte is replaced by an even parity check bit over all TOH bytes from the
previous TOH frame. The source for the TOH bytes in the Serial TOH insert mode is summarized in the table.
32
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 10. Transmitter TOH on LVDS Output (TOH Insert Mode)
A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A2 A2 A2 A2 A2 A2 A2 A2 A2 A2 A2 A2 J0 J0 J0 J0 J0 J0 J0 J0 J0 J0 J0 J0
B1 E1 E1 E1 E1 E1 E1 E1 E1 E1 E1 E1 E1 F1 F1 F1 F1 F1 F1 F1 F1 F1 F1 F1 F1
0
0
0
0
0
0
0
0
0
0
0
D1 D1 D1 D1 D1 D1 D1 D1 D1 D1 D1 D1 D2 D2 D2 D2 D2 D2 D2 D2 D2 D2 D2 D2 D3 D3 D3 D3 D3 D3 D3 D3 D3 D3 D3 D3
H1 H1 H1 H1 H1 H1 H1 H1 H1 H1 H1 H1 H2 H2 H2 H2 H2 H2 H2 H2 H2 H2 H2 H2 H3 H3 H3 H3 H3 H3 H3 H3 H3 H3 H3 H3
B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 K1 K1 K1 K1 K1 K1 K1 K1 K1 K1 K1 K1 K2 K2 K2 K2 K2 K2 K2 K2 K2 K2 K2 K2
D4 D4 D4 D4 D4 D4 D4 D4 D4 D4 D4 D4 D5 D5 D5 D5 D5 D5 D5 D5 D5 D5 D5 D5 D6 D6 D6 D6 D6 D6 D6 D6 D6 D6 D6 D6
D7 D7 D7 D7 D7 D7 D7 D7 D7 D7 D7 D7 D8 D8 D8 D8 D8 D8 D8 D8 D8 D8 D8 D8 D9 D9 D9 D9 D9 D9 D9 D9 D9 D9 D9 D9
D10 D10 D10 D10 D10 D10 D10 D10 D10 D10 D10 D10 D11 D11 D11 D11 D11 D11 D11 D11 D11 D11 D11 D11 D12 D12 D12 D12 D12 D12 D12 D12 D12 D12 D12 D12
M0 M0 M0 M0 M0 M0 M0 M0 M0 M0 M0 M0
S1 S1 S1 S1 S1 S1 S1 S1 S1 S1 S1 S1
E2 E2 E2 E2 E2 E2 E2 E2 E2 E2 E2 E2
Regenerated bytes.
Bytes optionally inserted from TOH serial port data or transparently forwarded from parallel input port
Bytes transparently forwarded from parallel input port
Bytes transparently forwarded from parallel input port
Repeater
This block is essentially the inverse of the sampler block discussed in the receive path description section. It
receives byte-wide STS-12 rate data from the TOH insert block. In order to support the STS-3 mode of operation,
the HSI (622 Mbits/s) can be connected to a slower speed device (e.g., 155 Mbits/s).The purpose of this block is to
rearrange the data being fed to the HSI so that each bit is transmitted four times, thus simulating 155 Mbits/s serial
data. In STS-3 mode, the incoming STS-12 stream is composed of four identical STS-3s so only every fourth byte
is used. The bit expansion process takes a single byte and stretches it to take up 4 bytes each consisting of 4 cop-
ies of the 8 bits from the original byte.
A1/A2 Processing
The A1 and A2 bytes provide a special framing pattern that indicates where a STS-1 begins in a bit stream. All 12
A1 bytes of each STS-12 are set to 0xF6, and all 12 A2 bytes are set to 0x28 automatically by the SONET framer.
The latency from the transmit of the first bit of the A1 byte at the device output pins from the system frame pulse on
the FPGA interface is between five to seven clock cycles of the reference clock (FPGA_SYSCLK).
The A1 and A2 bytes can also be intentionally corrupted for testing by the A1/A2 error insert control register
(0x3000D, 0x3000E). Only the last A1 and first A2 are corrupted. When A1/A2 corruption detection is set for a par-
ticular channel, the A1/A2 values in the corrupted A1/A2 value registers are sent for the number of frames defined
in the corrupted A1/A2 frame count register (0x3000C). When the corrupted A1/A2 frame count register is set to
0x00, A1/A2 corruption will continue until the A1/A2 error insert register is cleared.
The ORT8850 device only has one control register to set the A1/A2 bytes as well as the number of frames of cor-
ruption. To insert the corrupted A1/A2 each channel has an enable A1/A2 insert register. When the per channel
error insert register bit is set, the A1/A2 values are corrupted for the number specified in the number of frames to
corrupt. To insert errors again, the per channel error insert register bit must be cleared, and set again.
It is also possible to not insert the A1/A2 framing bytes using the per channel register bit “disable A1/A2 insert.”
B1 Processing
In the transmit direction a bit interleaved parity (BIP-8) error check set for even parity over all the bits of an STS-1
frame B1 is defined for the first STS-1 in an STS-12 only, the B1 calculation block computes a BIP-8 code, using
even parity over all bits of the previous STS-12 frame after scrambling and is inserted in the B1 byte of the current
STS-12 frame before scrambling.
Per-bit B1 corruption is controlled by the force BIP-8 corruption register (0x3000F). For any bit set in this register,
the corresponding bit in the calculated BIP-8 is inverted before insertion into the B1 byte position. Each stream has
an independent fault insert register that enables the inversion of the B1 bytes. B1 bytes in all other STS- 1s in the
stream are filled with zeros.
It is also possible to not insert the B1 byte using the per channel register bit "disable B1 insert."
33
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Scrambling
To ensure a 1's density for the SERDES the data stream is scrambled using a frame-synchronous scrambler with a
sequence length of 127. The scrambling function can be disabled by setting a control register bit (0x3000C). The
generating polynomial for the scrambler is 1 + x6 + x7. This polynomial conforms to the standard SONET STS-12
data format. The scrambler is reset to 1111111 on the first byte of the SPE (byte following the Z0 byte in the twelfth
STS-1). The scrambler runs continuously from that byte on throughout the remainder of the frame. The A1, A2, J0,
and Z0 bytes are not scrambled.
After scrambling, the serial data is broadcast to both the work and protect LVDS buffers.
Receive Path Logic
Each of the two SONET logic blocks has four receiving channels which can be treated as one STS-48 stream or as
four independent STS-12 or STS-3 channels.The received data streams are processed and passed to the FPGA
logic.
When doing multichannel alignment of two or more data streams, the receiver can handle the data streams with
frame offsets of up to 18 bytes due to timing skews between cards and along backplane traces or other transmis-
sion medium. For multichannel alignment capability to operate properly, it should be noted that while the skew
between channels can be very large, they must operate at the exact same frequency (0 ppm frequency deviation),
thus requiring that the transmitters sourcing the data being received be driven by the same clock source.
Each STM block receives the serial streams of STS-12 data (maximum of four streams per quad) from the LVDS
inputs. There is no received clock input. There are two sets of receive LVDS pins, RXDxx_W_[P:N] and
RXDxx_P_[P:N]. If the LVDS protection switching is used, the RXDxx_W_[P:N] LVDS inputs are used to accept the
main data while the RXDxx_P_[P:N] LVDS inputs are used to accept the protect data.
Once the serial data is received from the LVDS inputs it goes through the following processing steps:
• The clock for the received data is recovered from the received serial data stream and a serial to parallel conver-
sion is performed on the data
• The frame format of the incoming data is reconstructed (optional). The data is descrambled using the standard
STS-12 polynomial (optional)
• A B1 parity error check is performed on the data from the previously transmitted frame
• The channel alignment FIFO perform channel alignments on groups of incoming data streams (optional) and/or
simply perform the domain transfer from the recovered clock to the local reference clock.
• The SONET pointer interpreter and pointer mover detect the location of the SPE and C1J1 bytes and additionally
inserts 0xFFs instead of received data into the data path, if an line Alarm Indication Signal (AIS-L) is detected.
The offset pointers are adjusted to point to the location of the J1 byte.
• The received parallel data, parity, recovered clock, SPE and C1J1 indicators and TOH parallel data is sent to the
FPGA logic.
These processing steps are described in more detail in the following sections. A block diagram of the receive path
logic is shown in Figure 16. All processing except the CDR functions (clock recovery and serial to parallel conver-
sion) is optional. If all processing except the SERDES is deselected, the device is said to be operating in the
"bypass" mode.
34
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Figure 16. Basic Logic Blocks, Receive Path, Single Channel
Backplane
Serial
FPGA
Logic
Embedded Core
Link
TOH_OUTxx
TOH_xx_EN
TOH Data
Parallel to
Serial
I/O
MUXs
And
LVDS
Buffers
SONET Logic
Notes: n=[7,…0]
xx=[AA, AB,…BD]
Convert
* ~ Signal from Control
Register
Bypass Align*
Bypass Mover*
2
B1 Check Prev.
FPF ~ Framer Frame Pulse
FPS ~ FIFO Sync Frame Pulse
LOF~ Loss of Frame
New B1
Calc.
(opt.)
B1
Insert Bus
Par. Err.*
K1/K2 Pass
/Regen*
DOUTxx[7:0]
MUX
Insert AIS-L*
Insert AIS-L
on LOF*
STS 12/48*
3
RXDxx_W_[P:N]
2
DOUTxx_PAR
Parity
Gen.
2
Align.
FIFO
(opt.)
DOUTxx_SPE
DOUTxx_C1J1
Sampler
(for
STS3)
Serial
To
Parallel
Old B1
Read Scrambler
(opt.) (opt.)
De-
Pointer
Mover
(opt.)
AIS
Insert
Framer
(opt.)
MUX
CDR
RXDxx_P_[P:N]
2
DOUTxx_EN
DOUTxx_FP
FIFO
W/R
Control
LOF
*
Recovered 77.76 MHz
MUX
FPF
2
Min/Max Th.*
CDR_CLK_xx
Bypass Align*
Control and
TOH Clock
FIFO
Control
RX_TOH_CK_EN
RX_TOH_FP
FPS
FIFO
Sync.
Logic Common
to Both Quads
TOH
Port
Control
TOH_CK_LP_EN
TOH_CLK
77.76 MHz
FIFO
Control
Control and
TOH Clock
SYS_CLK_[P:N]
2
To other
7 channels
LVDS
Buffer
MUX
SYS_FP
LINE_FP
Line Lbk.*
To other
7 channels
FPGA_SYSCLK
HSI Functions (Clock Recovery and Deserializer)
The HSI receive path functions include Clock and Data Recovery (CDR) and deserialization of the incoming data
from the selected work or protect input stream to the byte-wide internal data bus format. The serial data received
from the LVDS buffer does not have an accompanying clock. Based on data transitions, the receiver selects an
appropriate internal clock phase for each channel to retime the data. The retimed data and clock are then passed
to the DEMUX (deserializer) module. The DEMUX module performs serial-to-parallel conversion and provides par-
allel data and clock to the SONET framer block. For a 622 Mbits/s SONET stream, the HSI will perform Clock and
Data Recovery (CDR) and MUX/DEMUX between 77.76 MHz byte-wide internal data buses and 622 Mbits/s serial
LVDS links.
Sampler
This block operates on the byte-wide data directly from the HSI macro. The HSI external interface always runs at
622 Mbits/s (STS-12), or 850 Mbits/s, but it can be connected directly to a 155 Mbits/s STS-3 stream. If connected
to a 155 Mbits/s stream, each incoming bit is received four times. This block is used to return the byte stream to the
expected STS-12 format. The mode of operation is controlled by a register and can either be STS-12 (pass-
through) or STS-3. The output from this block is not bit aligned (i.e., an 8-bit sample does not necessarily contain
an entire SONET byte), but it is in standard SONET STS-12 format (i.e., four STS-3s) and is suitable for framing.
SONET Framer Block
The framer block takes byte-wide data from the HSI, and outputs a byte-aligned, byte-wide data stream and 8 kHz
sync pulse. The framer algorithm determines the out-of-frame/in-frame status of the incoming data and will set
alarm register bits on both an errored frame and an Out-Of-Frame (OOF) state.
The framer block takes byte wide data from the HSI, and outputs a byte aligned byte wide stream and 8 kHz sync
pulse asserted coincident the first A1 byte which will be used by following blocks. (Note however that if the pointer
35
Lattice Semiconductor
ORCA ORT8850 Data Sheet
mover is active, there is no fixed timing relationship between the data sent to the FPSC and DOUTxx_FP and the
DOUTxx_SPE and DOUTxx_C1. J1 signals should be used instead to determine data alignment within the frame.)
The framer algorithm determines the out-of-frame/in-frame status of the incoming data and will cause alarms on
both an errored frame and an OOF (out-of-frame) state. Functions performed by this block include:
• A1-A2 framing pattern detection. (Framing similar to SONET specification)
• Generation of timing and an 8kHz frame pulse.
• Detections of Out Of Frame (OOF) (generates an alarm).
• Errored frame detection (increments error counter).
Framer State Machine
Figure 17 shows the state machine for the framer. Because the ORT8850 is primarily intended for use between
itself and another ORT8850 or other devices via a backplane, there is only one errored frame state. Thus there is
no Severely Errored Frame (SEF) or Loss-Of-Frame (LOF) indication.
Figure 17. Framer State Machine
Expect A1/A2
AND Find A1/A2
Expect A1/A2
AND Find A1/A2
AND 4 Consecutive
Correct A1/A2
Transitions Detected
Expect A1/A2
AND do NOT
Find A1/A2
In
Frame
Expect A1/A2
AND Find A1/A2
Expect A1/A2
AND Find A1/A2
AND <4 Consecutive
Correct A1/A2
Frame
Confirm
Errored
Frame
Transitions Detected
Expect A1/A2
AND do NOT
Find A1/A2
Expect A1/A2
AND do NOT
Find A1/A2
- Find A1/A2 Transition
- Lock Barrel Shifter
- Set row and column counters
Out Of Frame
(OOF)
Reset
Notes:
1)
2)
Row and column counters are only set/reset by a state transition from the OOF state to to the Frame Confirm state.
“Expect A1/A2” means that the row and column counters have counted to the place for the last (12 th.) A1 byte and
that the next byte should be an A2 byte.
OOF State
This is the initial state for the state machine after a reset. In this state the A1 pattern is searched for on every clock
cycle. A second stage of comparison is implemented to locate the A1/A2 transition. When the A1/A2 transition is
found, the following occurs:
• The state machine moves from the OOF state to the Frame Confirm State.
• The A1offset for the byte start location is locked.
• Row and column counters are set
Frame Confirm State
In this state the A1/A2 transition is only compared for at the appropriate location, i.e. beginning at the 12th A1 loca-
tion. This location is determined from the row and column counters which were set at the transition from OOF to
Frame Confirm. If at this time the comparison fails, the state machine reverts to the OOF state. If the comparison
36
Lattice Semiconductor
ORCA ORT8850 Data Sheet
passes, the next state will either still be Frame Confirm or will be In Frame. For the framer to declare an In Frame
state the framer must detect 4 consecutive correct A1/A2 framing patterns.
This state is similar to the Frame Confirm state except that if the comparison at the A1/A2 time is incorrect, the next
state will be the Errored Frame state. If the comparison is correct, the next state will be In Frame. Data is only valid
in the Frame state
Errored Frame State
Once the Errored Frame state has been reached, if the next comparison is incorrect, the next state will be OOF i.e.,
after two transitions are missed, the state machine goes into the OOF state which will also generate an alarm. Oth-
erwise, if the comparison correct, the next state will be In Frame. Also, when the framer detects an errored frame it
increments an A1/A2 frame error counter register accessible from the system bus. The counter can be monitored
by a processor to compile performance status on the quality of the backplane.
B1 Parity Error Check
The B1 parity error check block receives byte-wide scrambled byte-wide parallel data and a frame sync from the
framer. The B1 error check calculation block computes a BIP-8 (bit interleaved parity 8 bits) code, using even parity
over all bits of the current STS-12 frame before descrambling.
The same calculation had previous been done for the previous STS-12 frame. The value obtained then is checked
against the B1 byte of the current frame after descrambling. A per-stream B1 error counter is incremented for each
bit that is in error. The error counter register is accessible from the system bus.
Descrambler
The received streams from the framer are descrambled using a frame synchronous descrambler with the same
polynomial (1 + x6 + x7) that was used in the transmit path. If the incoming data is not scrambled, the descrambling
function can be disabled by setting a control register bit (0x3000C).The A1/A2 framing bytes, the section trace byte
(C1/J0) and the growth bytes (Z0) are not descrambled.
AIS-L Insertion
The Alarm Indication Signal (AIS) is a continuous stream of unframed 1s sent to alert downstream equipment that
the near-end terminal has failed, lost its signal source, or has been temporarily taken out of service. AIS-L is
inserted into the received frame by writing all ones for all bytes of the descrambled stream under two conditions:
1. If a force AIS_L state is enabled by a bit in the AIS-L force register, AIS-L is inserted into the received frame
continuously. This will cause all bytes within a STS-12 frame to be FF
2. If an AIS-L Insertion on Out-Of-Frame enabled via a register, AIS-L is inserted into the received frame when
the framer indicates that an out-of-frame condition exists.
Since this occurs after the overhead processing block, all Transport Overhead can continue to byte read and B1
can still be used to monitor link integrity.
Alignment FIFO and Multi-Channel Alignment
The alignment FIFO in the ORT8850 performs two functions, clock domain transfer and multi-channel alignment.
The depth of the alignment FIFO is 10 bit words which allows it to absorb channel timing differences of up to 18
clock cycles. Multi-channel alignment is based on the incoming A1/A2 bytes.
The alignment FIFO is always written from the SONET framer using the per channel recovered clock. The FIFO is
always read using the local reference clock (FPGA_SYSCLK). For this reason when doing multi-channel alignment
there must be 0 ppm between the transmit ORT8850 reference clock and the receiving ORT8850 reference clock.
This can only be accomplished by using a single clock source for both the transmitting and receiving devices.
The alignment FIFO has several alarm and control indicators that are accessible via control and alarm registers
available via the system bus or the MPI. The default alignment threshold values for the alignment FIFO are set in
registers at 0x3000A and 0x3000B. Here the min and max threshold values can be programmed.The default min is
set to 2 clocks and the max default is set to 15. If the alignment FIFO determines that these thresholds have been
37
Lattice Semiconductor
ORCA ORT8850 Data Sheet
violated a per channel alarm bit will be set indicating that this channel has exceeded the threshold, as well as a
FIFO out-of-sync alarm bit to indicate the channel is not longer in sync with the reset of the alignment group.
The incoming data can be considered as 4 STS-12 channels (A, B, C, and D) per quad. Thus we have STS-12
channels AA to AD from quad A of the STM and STS-12 channels BA to BD of quad B. The 8 channels of parallel
SONET data can be grouped into an alignment group by 2, by 4 or all 8 channels. As the serial data is run through
the backplane and SERDES the parallel data can be slightly varied. The alignment FIFO can absorb this difference
in the channels and create a byte aligned grouping.
These streams can be frame aligned in the following patterns. Streams can be aligned on a twin STS-12 basis as
shown in Figure 18. In STS-48 mode, all four STS-12s of each STM quad are aligned with each other (i.e. AA, AB,
AC, AD) as shown in Figure 19. Optionally in STS-48 mode all eight STS-12s (STMs A and B) can be aligned which
allows hitless switching since all streams will be byte aligned (Figure 20). Multiple ORT8850 devices can be aligned
with each other using a common system frame pulse to enable STS-192 or higher modes.
Figure 18. Twin Channel Alignment
Channel AA
Channel AA
Channel BA
Channel AB
Channel BB
Channel AC
Channel BC
Channel AD
Channel BD
Channel BA
Channel AB
Channel BB
Channel AC
Channel BC
Channel AD
Channel BD
TWIN ALIGNMENT OF CHANNELS AA AND BA
TWIN ALIGNMENT OF CHANNELS AB AND BB
TWIN ALIGNMENT OF CHANNELS AC AND BC
TWIN ALIGNMENT OF CHANNELS AD AND BD
t3
t2
t1
t0
Figure 19. Alignment of SERDES Quads A and B
Channel AA
Channel AB
Channel AC
Channel AD
Channel AA
Channel AB
Channel AC
Channel AD
Channel BA
Channel BB
Channel BC
Channel BD
Channel BA
Channel BB
Channel BC
Channel BD
QUAD ALIGNMENT OF CHANNELS AA, AB, AC, AND AD
QUAD ALIGNMENT OF CHANNELS BA, BB, BC, AND BD
t0
t1
38
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Figure 20. Alignment of all Eight SERDES Channels.
Channel AA
Channel AB
Channel AC
Channel AD
Channel AA
Channel AB
Channel AC
Channel AD
Channel BA
Channel BB
Channel BC
Channel BD
Channel BA
Channel BB
Channel BC
Channel BD
t0
There is a provision to allow certain streams to be disabled (i.e. not producing alarms or affecting synchronization).
These streams can be enabled at a later time without disrupting other streams. If the newly enabled stream needs
to be a part of a bigger group the entire group must be resynchronized unless the affected stream was active when
the initial synchronization was performed. As long as all streams to be aligned were active when the most recent
synchronization was performed, individual streams may be enabled or disabled without affecting synchronization.
It is recommended that users select the smallest possible groups for channel alignment. If an application only
requires that two channels be aligned then it is best to use by-2 grouping. All of the channels in a group will affect
the group’s total alignment. If a channel in a group fails or is shut down it will not affect any of the other channels in
the group. This channel will simply be removed from the alignment algorithm. When the channel is re-enabled into
a working group it will be out of alignment with the rest of the group. It will be necessary to perform a FIFO realign-
ment procedure to realign the group. During a FIFO realignment data will not pass through any of the channels in
the alignment group.
Alignment FIFO Algorithm
The algorithm controlling writes to the alignment FIFO and reads from it operates as follows: Prior to detecting the
first frame pulse for a link being aligned, each link in the group continually writes to address 0 within its own FIFO
(each link has a FIFO). When the first link in the group receives a frame pulse from Framer block the write pointer
for the corresponding FIFO increments to next write address on each clock cycle. L inks that have not received a
frame pulse continue to write into their respective FIFOs. When any link receives a frame pulse, the write address
for that FIFO will be reset to ‘0’
The operation of the alignment algorithm requires a wait of several clocks from the first arriving frame pulse before
reading of FIFO data begins. In this case, when all frame pulses arrive together the alignment algorithm initiates
reads after 9 clocks cycles. If, however, the first to last arriving frame pulses are separated by multiple clock cycles,
there will be additional clock cycles between the first frame pulse and the first read. If all links in the group have not
reported a valid frame pulse signal after 18 clock cycles, an out of sync state is entered and an alarm is generated.
After all links have received frame pulses and are incrementing their write addresses while writing into their FIFOs,
data is then read out of each link's FIFO one byte at a time. All aligned links are now Frame/byte/bit synchronous.
FIFO Alignment Procedure
The FIFO alignment block has the ability to be realigned by changing the value of bits in the alignment control reg-
isters. This may be done in the FPGA logic or under the control of an external device through the system bus or
MPI. Alignment must take place after the stream has settled with valid data to guarantee proper channel alignment
and uncorrupted data transmission.
Channel realignment must occur when a channel goes from the Out-Of-Frame (OOF) state to the In-Frame state.
This happens when the channels are first powered up and given a valid frame pulse. This is the obvious known
39
Lattice Semiconductor
ORCA ORT8850 Data Sheet
condition. It is also possible during operation for the channel to go into OOF. This may occur due to the removal of
either the frame pulse or the cable. If this is the case, AND is is part of a multi-channel alignment group, the realign-
ment procedure must be re-executed once the channel goes back into frame.
When a channel goes from the OOF state to the In-Frame state the OOF alarm bit is set per channel. The OOF
alarm bit is a per channel bit contained in the channel alarm register. It takes the receiver at least 4 full SONET
frames for the state machine to declare the In-Frame state. When the OOF bit is high the channel is in OOF. When
the OOF bit changes to a ‘0’ then the channel is back in frame and the realignment procedure should be executed.
Table 11 lists the register values to set up the ORT8850 for alignment FIFO sync realignment. The order is specific.
The values are given from the PowerPC point of view. If using the MPI to write data to the ORT8850, the value
given in the table is the value that should be used. If using the UMI of the system bus, the data value would need to
be byte flipped. The following setup procedures should be followed after the enabled channels have a valid frame
pulse, and are in the Frame state:
Table 11. Alignment FIFO Synch Realignment
Register Address
0x30020, bit 6
0x30038, bit 6
0x30050, bit 6
0x30068, bit 6
0x30080, bit 6
0x30098, bit 6
0x300B0, bit 6
0x300C8, bit 6
Value (Binary)
Description
1
1
1
1
1
1
1
1
Force AIS-L in all channels of the group to be synchronized.
Wait for 4 SONET Frames (~500µs)
0x30017, specific bits
0x30018, specific bits
1
1
Issue FIFO realignment commands.
Wait for Another 4 SONET Frames (~500µs)
0x30017, specific bits
0x30018, specific bits
0x30020, bit 6
0
0
0
0
0
0
0
0
0
0
Clear FIFO alignment command register bits written in previous steps.
0x30038, bit 6
0x30050, bit 6
0x30068, bit 6
Release AIS-L in all channels of the group to allow normal data flow through the
reveiver.
0x30080, bit 6
0x30098, bit 6
0x300B0, bit 6
0x300C8, bit 6
RX Serial TOH Processing
Transport overhead is extracted from the receive data stream by the TOH extract block. The incoming data gets
loaded into a 36-byte shift register on the system clock domain. This, in turn, is clocked onto the TOH clock domain
at the start of the SPE time, where it can be clocked out.
The TOH processor is responsible for serializing all received TOH bytes of each channel through that channel's
corresponding serial TOH data port. The TOH serial ports are synchronized to the TOH clock (the same clock that
is being used by the serial ports on the transmitter side). This free-running TOH clock is provided to the core by
external circuitry and operates at a minimum frequency of 25 MHz and a maximum frequency of 77.76 MHz. Data
is transferred over serial links in a bursty fashion as controlled by the RX TOH clock enable signal, and is common
40
Lattice Semiconductor
ORCA ORT8850 Data Sheet
to all eight channels. All TOH bytes from the STS-12 streams are transferred over the appropriate serial link in the
same order in which they appear in a standard STS-12 frame.
During the SPE time, the receiver TOH frame pulse is generated (RX_TOH_FP) which indicates the start of the row
of 36 TOH bytes. This pulse, along with the receive TOH clock enable (RX_TOH_CK_EN), as well as the TOH data,
are all launched on the rising edge of the TOH clock (TOH_CLK).
On the TOH serial port, all TOH bytes are sent as received on the LVDS input (MSB first). The only exception is the
most significant bit of byte A1 of STS#1, which is replaced with an even parity bit. This parity bit is calculated over
the previous TOH frame. Also, on AIS-L (either resulting from OOF or forced through software), all TOH bits are
forced to all ones with proper parity (parity automatically ends up being set to 1 on AIS-L).
The Core logic must provide framing information to the FPGA using the RX_TOH_CK_EN and RX_TOH_FP output
signals. TOH data is output on a row by row basis, with the one clock cycle frame pulse (RX_TOH_FP) delineating
the start of a row, as shown in Figure 21. Detailed timing for the TOH serial output is shown in later in Figure 29.
Figure 21. TOH Serial Port Output Framing Signals (Core to FPGA)
Row 1
36 bytes TOH
1044 bytes SPE
DOUTxx[7:0]
TOH_CLK
RX_TOH_FP
RX_TOH_CK_EN
TOH_OUTxx
Data Valid
MSbit(7)
of A1 byte STS1 #1
bit 6
of A1 byte STS1 #1
Receiver TOH reconstruction on the output parallel bus is performed as shown in the following table (if the pointer
mover is not bypassed).
Table 12. Receiver TOH Byte Reconstruction (Output Parallel Bus)
A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A2 A2 A2 A2 A2 A2 A2 A2 A2 A2 A2 A2
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
H1 H1 H1 H1 H1 H1 H1 H1 H1 H1 H1 H1 H2 H2 H2 H2 H2 H2 H2 H2 H2 H2 H2 H2 H3 H3 H3 H3 H3 H3 H3 H3 H3 H3 H3 H3
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
K2
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
K2
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Regenerated bytes.
Regenerated bytes (under pointer control. SS bits must be transparent, AIS-P must be supported)
Bytes taken from elastic store buffer on negative stuff opportunity - else forced to all zeroes
Transparent or all zeros (K1/K12 are either taken from K1/K12 buffer or forced to all zero-soft control) In transport mode, AIS-L must be supported.
All zero bytes
Special TOH Byte Functions
The K1 and K2 bytes are used in Automatic Protection Switch (APS) applications. K1 and K2 bytes can be option-
ally passed through the pointer mover under software control, or can be set to zero with the other TOH bytes.
41
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Pointer Interpreter and Pointer Mover
After the alignment FIFO the receive data can optionally go through the pointer interpreter and pointer mover. The
pointer interpreter will identify the SONET payload envelope (SPE), the C1 bytes and the J1 bytes, and provide this
information to the FPGA logic. For data applications where the user is simply using SONET to carry user defined
cells in the payload the SPE signal is very useful as an enable to the cell processor. C1J1 for generic data applica-
tions can be ignored. If the pointer interpreter and pointer mover are bypassed, then the SPE and C1J1 signals will
be always '0'.
Since the start of an SPE can be located at any point in a SONET frame, the starting point is identified using
pointer bytes H1 and H2. The pointer bytes indicate the offset of the start of the SPE from the pointer byte position.
Two payload pointer bytes (H1 and H2) are allocated to a pointer that indicates the offset in bytes between the
pointer and the first byte of the STS SPE. The pointer bytes are used in all STS-1s within an STS-N to align the
STS-1 Transport Overhead in the STS-N, and to perform frequency justification. These bytes are also used to indi-
cate concatenation, and to detect Alarm Indication Signals (AIS).
The resulting 2 byte pointer is divided into three parts:
1. Four bits of New Data Flag (NDF)
2. Two bits of unassigned bits (These bits are set to 00.)
3. Ten bits for pointer value, which are alternately considered increment (I) bits or decrement (D) bits. The 10 bit
pointer is required to represent the maximum SPE offset of 782 (9 rows * 87 columns - 1). Specific combina-
tions of pointer byte values indicate that positive or negative frequency justification will occur and also whether
or not the current frame is a concatenated frame.
Normally the NDF bits are set to 0110, which indicates that the current pointer values are unchanged. The inverse
bit pattern, 1001, indicates that some data has changed. Any other bit configuration is interpreted using the 3 of 4
rule, i.e., 1110 is interpreted as 0110, etc. Patterns that cannot be resolved are undefined, however all one's in the
NDF and in the pointer bits indicates AIS detection.The ORT8850 can correctly process any length of concatena-
tion of STS frames (multiple of three) as long as it begins on an STS-3 boundary (i.e., STS-1 number one, four,
seven, ten, etc.) and is contained within the smaller of STS-3, 12, or 48.
Table 13. Valid Starting Positions for and STS MC
STS-18c to
STS-48c
SPEs
STS-1
Number
STS-3cSPE
Yes
STS-6cSPE
Yes
STS-9cSPE
Yes
Yes
No
STS-12cSPE
STS-15cSPE
Yes
1
Yes
No
No
No
Yes
No
No
No
Yes
No
No
No
Yes
No
No
Yes
—
4
Yes
Yes
Yes
7
Yes
Yes
Yes
—
10
13
16
19
22
25
28
31
34
37
40
43
Yes
No
No
Yes
—
Yes
Yes
Yes
Yes
No
Yes
—
Yes
Yes
Yes
—
Yes
Yes
Yes
—
Yes
No
No
Yes
—
Yes
Yes
Yes
Yes
No
Yes
—
Yes
Yes
Yes
—
Yes
Yes
Yes
—
Yes
No
No
Yes
No
No
No
No
Yes
Yes
Yes
Yes
No
No
Yes
Yes
No
Yes
Yes
No
42
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 13. Valid Starting Positions for and STS MC (Continued)
STS-18c to
STS-48c
STS-1
Number
STS-3cSPE
STS-6cSPE
STS-9cSPE
STS-12cSPE
STS-15cSPE
SPEs
46
Yes
No
No
No
No
No
Note:
Yes = STS-Mc SPE can start in that STS-1.
No = STS-Mc SPE cannot start in that STS-1.
-
= Yes or no, depending on the particular value of M.
A pointer action byte (H3) is allocated for SPE frequency justification purposes. Frequency justification is discussed
in a later section. The H3 byte is used in all STS-1s within an STS-N to carry the extra SPE byte in the event of a
negative pointer adjustment. The value contained in this byte when it's not used to carry the SPE byte is undefined.
Pointer Interpreter State Machine.
The pointer interpreter's highest priority is to maintain accurate data flow (i.e., valid SPE only) into the elastic store.
This will ensure that any errors in the pointer value will be corrected by a standard, fully SONET compliant, pointer
interpreter without any data hits. This means that error checking for increment, decrement, and new data flag
(NDF) (i.e., 8 of 10) is maintained in order to ensure accurate data flow. A single valid pointer (i.e., 0-782) that dif-
fers from the current pointer will be ignored. Two consecutive incoming valid pointers that differ from the current
pointer will cause a reset of the J1 location to the latest pointer value (the generator will then produce an NDF).
This block is designed to handle single bit errors without affecting data flow or changing state.
The pointer interpreter has only three states (NORM, AIS, and CONC). NORM state will begin whenever two con-
secutive NORM pointers are received. If two consecutive NORM pointers that both differ from the current offset are
received, then the current offset will be reset to the last received NORM pointer. When the pointer interpreter
changes its offset, it causes the pointer generator to receive a J1 value in a new position. When the pointer gener-
ator gets an unexpected J1, it resets its offset value to the new location and declares an NDF. The interpreter is
only looking for two consecutive pointers that are different from the current value. These two consecutive NORM
pointers do not have to have the same value. For example, if the current pointer is ten and a NORM pointer with off-
set of 15 and a second NORM pointer with offset of 25 are received, then the interpreter will change the current
pointer to 25.
If the data is concatenated, the receipt of two consecutive CONC pointers causes CONC state to be entered. Once
in this state, offset values from the head of the concatenation chain are used to determine the location of the STS
SPE for each STS in the chain. Finally, if two consecutive AIS pointers cause the AIS state to occur. Any two con-
secutive normal or concatenation pointers will end this AIS state. This state will cause the data leaving the pointer
generator to be overwritten with 0xFF.
Figure 22. Pointer Mover State Machine
Norm
2 x CONC
CONC
AIS
2 x AIS
43
Lattice Semiconductor
ORCA ORT8850 Data Sheet
SPE and C1J1 Identification
In the ORT8850 each frame can be considered as 12 STS-1s. In the SPE region, there are 12 J1 pulses for each
STS-1s.There is one C1(J0, new SONET specifications use J0 instead of C1 as section trace to identify each STS-
1 in an STS-N) pulse in the TOH area for one frame. Thus, for non concatenated data there are a total of 12 J1
pulses and one C1(J0) pulse per frame. The C1(J0) pulse is coincident with the J0 of STS-1 #1.
The pointer interpreter identifies the payload area of each frame. The SPE flag is active when the data stream is in
SPE area. SPE behavior is dependent on pointer movement and concatenation. Note that in the TOH area, H3 can
also carry valid data. When valid SPE data is carried in this H3 slot, SPE is high in this particular TOH time slot. In
the SPE region, if there is no valid data during any SPE column, the SPE signal will be set to low. SPE allows a
pointer processor to extract payload without interpreting the pointers.
Figure 23. SPE and C1J1 Functionality for STS -12
SPE
C1J1
Description
TOH information excluding C1(J0) of STS-1 #1.
0
0
Position of C1(J0) of STS-1 #1 (one per frame). Typically used to provide a unique link identification
(256 possible unique links) to help ensure cards are connected into the backplane correctly or cables
are connected correctly.
0
1
1
1
0
1
SPE information excluding the 12 J1 bytes.
Position of the 12 J1 bytes.
The following rules are observed for generating SPE and C1J1 signals:
• On occurrence of AIS-P on any of the STS-1, there is no corresponding J1 pulse.
• In case of concatenated payloads (up to STS48c), only the head STS-1 of the group has an associated J1 pulse.
• The C1J1 signal tracks any pointer movements.
This behavior is illustrated in the following figure. Note that the actual bit positions are dependent on the actual pay-
load configuration and offset.
Figure 24. SPE and C1J1 Signals
STS-12
TOH ROW # 1
SPE ROW # 1
first SPE BYTES OF THE
12 STS-1S
A2 A2 A2 A2 A2 A2 J0 Z0 Z0 Z0 Z0 Z0 Z0 Z0 Z0 Z0 Z0 Z0
1 2 3 4 5 6 7 8 9 10 11 12
A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A1 A2 A2 A2 A2 A2 A2
STS-12
SPE
J1 PULSE OF
3RD STS-1
C1 PULSE
C1J1
Pointer Mover
After the pointer interpreter comes the pointer mover block. There is a separate pointer mover for the two SONET
framer quads, A and B, each of which handles up to one STS-48 (four channels) The K1/K2 bytes and H1-SS bits
are also passed through to the pointer generator so that the FPGA can receive them. The pointer mover handles
both concatenations inside the STS-12, and to other STS-12s inside the core. Use of this block is optional, as dis-
cussed in a later section.
44
Lattice Semiconductor
ORCA ORT8850 Data Sheet
The pointer mover block can correctly process any length of concatenation of STS frames (multiple of three) as
long as it begins on an STS-3 boundary (i.e., STS-1 number one, four, seven, ten, etc.) and is contained within the
smaller of STS-3, 12, or 48. The pointer value can be adjusted to change the start of the SPE position and thereby
adjust for frequency changes. The variations in frequency are taken care of using justification.
When the incoming data rate exceeds the nominal rate, negative justification is used to compensate for the fre-
quency difference. Data are transmitted in the pointer action byte, H3, and thereby adjust for the additional incom-
ing data.The size of one SPE is still the same, but it is transmitted in less time than usual, and so a higher data rate
is achieved for some time. Negative justification causes the start of SPE to move left by one column or by decreas-
ing the pointer by one. The following frames contain the new pointer value.
Negative justification is indicated by inverting the D bits (bits 8, 10, 12, 14, 16) of the pointer word. The receiver
determines the occurrence of negative justification by examining these bits of the pointer word and applying a 5-bit
majority logic on them.
When the incoming data rate lags the nominal rate, positive justification is used to compensate for the frequency
difference. Data are not transmitted in the byte following the pointer action byte, H3, and thereby adjust for the lack
of incoming data. The size of one SPE is still the same, but it is transmitted in more time than usual, and hence a
slower data rate is achieved for some time. Positive justification causes the start of SPE to move right by one col-
umn or by increasing the pointer by one. The following frames contain the new pointer value.
Positive justification is indicated by inverting the I bits (bits 7, 9, 11, 13, 15) of the pointer word. The receiver deter-
mines the occurrence of positive justification by examining these bits of the pointer word and applying a 5-bit major-
ity logic on them.
The SPE signal to the FPGA logic must be high during negative stuff opportunity byte time slots (H3) for which valid
data is carried (negative stuffing). SPE signal must be low during positive stuff opportunity byte time slots for which
there is no valid data (positive stuffing). This behavior is shown in the following figure.
Figure 25. SPE Signal During Justification
STS-12
TOH ROW # 4
SPE ROW # 4
NEGATIVE STUFF
OPPORTUNITY BYTES
POSITIVE STUFF
OPPORTUNITY BYTES
H2H2 H2H2 H2H2 H3H3H3 H3H3 H3H3 H3H3H3 H3H3
1 2 3 4 5 6 7 8 9 10 11 12
H1 H1H1 H1H1H1 H1H1 H1H1 H1H1H2 H2H2 H2H2 H2
STS-12
SPE
SPE SIGNAL SHOWS NEGATIVE STUFFING FOR 2ND STS-1,
AND POSITIVE STUFFING FOR 6TH STS-1
In either justification, the pointer must remain unchanged for at least three consecutive frames before it can be jus-
tified again. The pointer can jump randomly to a new position at any point of time. This can happen in conditions
when the transmitting end has just recovered from an error condition. A sudden jump in the pointer value is indi-
cated through NDF, New Data Flag. This information is carried in the four MS bits of the pointer word. A 3-bit major-
ity logic is applied on the NDF bits to determine the status of the pointer jump.
Pointer Generator
The pointer generator maps the corresponding bytes into their appropriate location in the outgoing byte stream.
The generator also creates offset pointers based on the location of the J1 byte as indicated by the pointer inter-
preter. The generator will signal NDFs when the interpreter signals that it is coming out of AIS state. The pointer
generator resets the pointer value and generates NDF every time a byte marked J1 is read from the elastic store
that doesn't match the previous offset. Increment and decrement signals from the pointer interpreter are latched
once per frame on either the F1 or E2 byte times (depending on collisions); this ensures constant values during the
H1 through H3 times. The choice of which byte time to do the latching on is made once when the relative frame
45
Lattice Semiconductor
ORCA ORT8850 Data Sheet
phases (i.e., received and system) are determined. This latch point is then stable unless the relative framing
changes and the received H byte times collide with the system F1 or E2 times, in which case the latch point would
be switched to the collision-free byte time.
There is no restriction on how many or how often increments and decrements are processed. Any received incre-
ment or decrement is immediately passed to the generator for implementation regardless of when the last pointer
adjustment was made. The responsibility for meeting the SONET criteria for maximum frequency of pointer adjust-
ments is left to an upstream pointer processor.
Receive Bypass Options
Not all of the blocks in the receive direction are required to be used. The following bypass options are valid in the
receive (backplane → FPGA) direction:
• STM Pointer Mover bypass:
– In this mode, data from the alignment FIFOs is transferred to the FPGA logic. All channels are synchronous
to the FPGA_SYSCLK signals driven to the FPGA logic, as is also the case when the pointer mover is not
bypassed. During bypass SPE, C1J1, and data parity signals are not valid. When the pointer mover is
bypassed, eight frame pulses (DOUTxx_FP) from aligned channels are provided by the embedded core to
the FPGA.
– When the pointer mover is used, the FPGA logic provides the frame pulse on the LINE_FP (recall: there is
only one LINE_FP just like there is only one SYS_FP) signal essential for the Pointer Mover to move the
data. The FPGA gets eight channels of SONET data with the A1 byte position of each channel of the TOH
arbitrarily offset from the LINE_FP. The DOUTxx_FP signals are not valid when the pointer mover is used.
• STM Pointer Mover and Alignment FIFO bypass:
– In this mode, data from the framer block is transferred to the FPGA logic. All channels supply data and frame
pulses synchronous with their individual recovered clock (CDR_CLK_xx) per channel. During bypass, SPE,
C1J1, and data parity signals are not valid. Additionally, no serial TOH_OUT_xx data and frame pulse sig-
nals will be available. The DOUTxx_FP signals are aligned with the A1 byte position of each channel, as
shown in Figure 26.
Figure 26. Pointer Mover and Alignment FIFO Bypass Timing
CDR_CLK_xx
DOUTxx
First A1 Byte
DOUTxx_FP
Table 14 shows the register settings to enable the bypass modes.
Table 14. Register Settings for Bypass Mode
Register Address
0x3000C
Value
Description
Turn off the SONET scrambler/descrambler
Channel AA in functional mode
Channel AB in functional mode
Channel AC in functional mode
Channel AD in functional mode
Channel BA in functional mode
Channel BB in functional mode
Channel BC in functional mode
Channel BD in functional mode
0x04
0x07
0x07
0x07
0x07
0x07
0x07
0x07
0x07
0x30020
0x30038
0x30050
0x30068
0x30080
0x30098
0x300B0
0x300C8
46
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 14. Register Settings for Bypass Mode (Continued)
Register Address
0x30021
Value
Description
0x01
0x01
0x01
0x01
0x01
0x01
0x01
0x01
0x30
0x30
0x30
0x30
0x30
0x30
0x30
0x30
0x44
Channel AA in transparent mode
Channel AB in transparent mode
Channel AC in transparent mode
Channel AD in transparent mode
Channel BA in transparent mode
Channel BB in transparent mode
Channel BC in transparent mode
Channel BD in transparent mode
0x30039
0x30051
0x30069
0x30081
0x30099
0x300B1
0x300C8
0x30023
0x3003B
0x30053
0x3006B
0x30083
0x3009B
0x300B3
0x300CB
0x30037
Channel AA - Do not insert A1/A2 or B1
Channel AB - Do not insert A1/A2 or B1
Channel AC - Do not insert A1/A2 or B1
Channel AD - Do not insert A1/A2 or B1
Channel BA - Do not insert A1/A2 or B1
Channel BB - Do not insert A1/A2 or B1
Channel BC - Do not insert A1/A2 or B1
Channel BD - Do not insert A1/A2 or B1
Channel AA - Bypass Alignment FIFO and Pointer interpreter/mover, disable
SONET framer
0x3004F
0x30067
0x3007F
0x30097
0x300AF
0x300C7
0x300DF
0x44
0x44
0x44
0x44
0x44
0x44
0x44
Channel AB - Bypass Alignment FIFO and Pointer interpreter/mover, disable
SONET framer
Channel AC - Bypass Alignment FIFO and Pointer interpreter/mover, disable
SONET framer
Channel AD - Bypass Alignment FIFO and Pointer interpreter/mover, disable
SONET framer
Channel BA - Bypass Alignment FIFO and Pointer interpreter/mover, disable
SONET framer
Channel BB - Bypass Alignment FIFO and Pointer interpreter/mover, disable
SONET framer
Channel BC - Bypass Alignment FIFO and Pointer interpreter/mover, disable
SONET framer
Channel BD - Bypass Alignment FIFO and Pointer interpreter/mover, disable
SONET framer
Note: To select between full, half and quad rate modes, registers 0x300E1 and 0x300E2 are used. See the memory map for details on these
registers.
FPGA/Embedded Core Interface Signals
Table 15. FPGA/Embedded Core Interface Signals
ORT8850 FPGA/Embedded Core Interface Signals - SONET Blocks
FPGA/Embedded Core
Interface Signal Name
xx=[AA,…,BD]
Input (I) to or Output (O)
from Core
Signal Description
Common Interface Signals
FPGA_SYSCLK
Local reference clock from the core to the FPGA. All of the transmit
data is captured on this clock edge inside the ORT8850 core. If
using the alignment FIFO all of the parallel data from the ort8850
core will also be clocked from this clock. This signal uses an ORCA
Series4 primary clock route.
O
47
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 15. FPGA/Embedded Core Interface Signals (Continued)
ORT8850 FPGA/Embedded Core Interface Signals - SONET Blocks
FPGA/Embedded Core
Interface Signal Name
xx=[AA,…,BD]
Input (I) to or Output (O)
from Core
Signal Description
SYS_FP
System frame pulse generated inside the FPGA logic. This is a sin-
gle clock pulse of FPGA_SYSCLK every 9720 clock cycles. For a
77.76 MHz reference clock the system frame pulse is at the SONET
standard of 8 KHz. All the eight Transmit channels' first A1 byte
should be aligned to the SYS_FP. Internally SYS_FP is used when
Far end loopback (line side loopback) needs to be performed. This
loopback can only be performed when Pointer Mover is not
bypassed.
I
LINE_FP
User-provided frame pulse used by only the Pointer Mover block in
the receive direction. The Pointer Mover moves the data to align it
with the LINE_FP. If the Pointer Mover is bypassed, LINE_FP is not
used.
I
I
TOH_CLK
Clock driven from the FPGA to clock the TOH processor. This clock
can be in the range from 25MHz to 77.76MHz. If not using the TOH
communication channel this signal can be connected to GND.
Signals to TX Logic Blocks
DINxx[7:0]
Byte wide data for channel xx. This data is ultimately preset on the
serial LVDS pin TXDxx_W_[P:N] (work) and TXDxx_P_[P:N] (pro-
tect).
I
I
DINxx_PAR
Parity input for byte wide data DINxx. Odd or even parity selection
is controlled by a bit in the control register at 0x3000C.
Signals from RX Logic Blocks
DOUTxx[7:0]
O
O
Byte wide data for channel AA
DOUTxx_PAR
Parity output for byte wide data DOUTxx[7:0]. Odd/Even is con-
trolled by control register at 0x3000C.
DOUTxx_FP
Frame pulse output from the SONET framer. A single clock pulse to
indicate the start of the SONET frame. If bypassing the pointer
mover/interpreter this pulse will line up directly with the first A1 on
DOUTxx[7:0]. If using the pointer interpreter/mover DOUTxx_FP
will fall several clock cycles before the A1 on DOUTxx[7:0] due to
the latency from the pointer mover.
O
O
DOUTxx_SPE
DOUTxx_C1J1
When '1' indicates SPE bytes are on the DOUTxx[7:0] lines. Only
available when using the pointer interpreter/mover
When '1' indicates the C1J1 bytes are on the DOUTxx[7:0] lines.
Only available when using the pointer interpreter/mover.
O
O
DOUTxx_EN
CDR_CLK_xx
Indicates the state of register setting for DOUTxx_EN.
Recovered clock from the Channel xx SERDES. If not using the
alignment FIFO all of the parallel data from Channel xx will be
clocked from this clock.
O
Signals to TOH Logic Blocks (Note:These signals are active only in the serial TOH insertion mode)
TX_TOH_CK_EN
Active-hi TOH_CLK enable. If using serial TOH insertion this enable
must be active.
I
I
TOH_INxx
Serial TOH insertion port for channel xx.
Signals from TOH Logic Blocks (Note:These signals are active only in the serial TOH insertion mode)
RX_TOH_CK_EN
When '1' indicates a control register bit has been set to enable the
TOH clock and frame pulse.
O
RX_TOH_FP
O
O
O
Single clock frame pulse to indicate the serial link frame pulse.
When '1' indicates the TOH serial link clock is enabled.
TOH serial link output from Channel xx
TOH_CK_FP_EN
TOH_OUTxx
48
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 15. FPGA/Embedded Core Interface Signals (Continued)
ORT8850 FPGA/Embedded Core Interface Signals - SONET Blocks
FPGA/Embedded Core
Interface Signal Name
xx=[AA,…,BD]
Input (I) to or Output (O)
from Core
Signal Description
TOH_xx_EN
O
Indicates state of register settings for TOHxx_EN
Protection Switching Signals (Note: See also Table 17 and Table 18)
PROT_SWITCH_AA
PROT_SWITCH_AC
PROT_SWITCH_BA
PROT_SWITCH_BC
LVDS_PROT_AA
LVSD_PROT_AB
LVDS_PROT_AC
LVDS_PROT_AD
LVDS_PROT_BA
LVDS_PROT_BB
LVDS_PROT_BC
LVDS_PROT_BD
I
I
I
I
I
I
I
I
I
I
I
I
Parallel protection switch select, Channels AA and AB
Parallel protection switch select, Channels AC and AD
Parallel protection switch select, Channels BA and BB
Parallel protection switch select, Channels BC and BD
LVDS protection switch select, Channel AA
LVDS protection switch select, Channel AB
LVDS protection switch select, Channel AC
LVDS protection switch select, Channel AD
LVDS protection switch select, Channel BA
LVDS protection switch select, Channel BB
LVDS protection switch select, Channel BC
LVDS protection switch select, Channel BD
Clock and Data Timing at the FPGA/Embedded Core Interface - SONET Block
(Note: This section assumes a basic understanding of the Lattice Semiconductor ispLEVER design tool set)
This section provides examples of the clock and data timing relationships at the FPGA/Embedded Core interface
for both the parallel SONET data and the serial TOH data. The initiation of a change of data is referred to as the
"launch" time and the actual time of capture of the data is referred to as the "capture" time. Two relationships are
discussed, the relationship between data and clock at the interface itself and the relative timing constraints on the
signals in the FPGA logic between the interface and the launch/capture latch in the FPGA portion of the FPSC.
The ispLEVER place and route tool will automatically attempt to meet the timing constraints by placing a frequency
constraint on the corresponding clock and will report a non-routed condition if it is unable to do so. Trace reports
should also be generated using ispLEVER to evaluate both the setup and the hold margins.
The typical timing numbers used in the discussions are for illustration purposes and can vary due to both process
and environmental variations and to differences in the routing through the FPGA logic, especially for the data path.
Exact timing numbers should always be obtained from ispLEVER.
In all of the discussions in this section, the maximum reference clock frequency of 106 MHz is assumed. The pri-
mary clock path delay was assumed to be 3 ns - this delay is well controlled in the FPGA logic. A secondary clock
path delay can vary from 1 to 3.5 ns - a delay of 2.5 ns was used in the payload data discussions and 2 ns for the
TOH discussions.
The five cases considered in the discussion are shown in Table 16. The clock routing and timing configurations
shown in this section are recommended for the general user since they give the best timing margins. In the discus-
sion, if both the core and FPGA launch and latch data on the same edge, it is referred to as a "full cycle" mode. If
they launch and latch on different edges, it is referred to as a "half cycle" mode.
49
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 16. Operating Modes and Data Paths - SONET Logic Block
Embedded Core
Clock
Launch/Latch
Data (Note: xx
=[AA, …BD])
FPGA Clock
Launch/Latch
Case
Data Path
Clock/Route
CDR_CLK_xx/Secondary
FPGA_SYSCLK/Primary
FPGA_SYSCLK/Primary
From FPGA/Secondary
From FPGA/Secondary
1
2
3
4
5
DOUTxx[7:0]
DOUTxx[7:0]
DINxx[7:0]
Core to FPGA
Core to FPGA
FPGA to Core
Core to FPGA
FPGA to Core
Falling Edge
Falling Edge
Rising Edge
Rising Edge
Falling Edge
Falling Edge
Rising Edge
Rising Edge
Rising Edge
Rising Edge
TOH_OUTxx
TOH_INxx
All timing is referenced to the clock signal at the FPGA/Core interface. Data is also timed for signals at the
FPGA/Core interface. There will be additional time delays until the interface signals reach the capturing latch. The
primary or secondary path delay is controlled, as noted earlier, and the clock timing at the capture latch can be pre-
dicted. The data delay, however, may be unique to each interconnect routing.
The timing diagrams provide a quantitative picture of the relative importance of setup and hold margins for the
cases discussed. In the diagrams, the launch and capture times and the time difference between the launching and
capturing clock edges are identified. As the time between launch and capture increases (up to a full clock period),
the possibility of a setup time problem decreases. Also, the possibility of a setup time problem decreases for
smaller maximum propagation delay values.
If capture occurs before the next data is launched, a hold time problem cannot occur. In nearly all cases, the differ-
ence between the launch and capture clock edges will be nearly a full clock cycle and the data will be captured
before the next data is launched. This is not guaranteed, however, and ispLEVER timing analysis should be done
for each application.
The general rules used for the FPGA/Core interface are as follows:
1. If possible, transfers across the FPGA/Core interface should be direct register to register transfers with minimal
or preferably no intervening logic.
2. Use positive (rising) edge flip-flops in the FPGA for both input and output unless a timing diagram (case 1)
explicitly indicates otherwise, or a special case (long routing path, etc.) is being considered.
3. Attempt to ‘locate’ the FPGA side flip-flops reasonably close to the interface unless other timing constraints
prevent this. This ‘locate’ is typically achieved by placing a frequency constraint on the FPGA_CLK signal. In
most cases, up the 3 ns of data path delay through the FPGA logic in the ORT8850 is acceptable.
4. Pay attention to the clock routing resource recommended (these are fixed on the ORT8850), and to the delay
and skew limits and the clock source points.
5. Run Trace setup and hold checks in ispLEVER on the routed design taking the environmental constraints into
account. (See ispLEVER Application Note for details).
For the cases where parallel data is output from the core, the reference clock is also output from the core and the
effects of propagation delay variation are included in the discussion. Propagation delay is defined relative to the
interface signals and thus is the time from the enabling (falling) edge of the clock from the core to the time that data
is guaranteed to be valid at the interface. As an example, for the first case discussed, the minimum (tprop_min) and
maximum (tprop_max) propagation delays are 0.8 ns. and 4.7 ns. respectively. Therefore the data outputs are sta-
ble for 6.1 ns. (10 ns. - 3.9 ns.) of each clock cycle. The data must be captured during this stable period, i.e., the
data signals must arrive at the capturing latch with adequate setup and hold margins versus the clock signal at the
latch.
In the first case, Figure 27, the alignment FIFO is assumed to be bypassed and all timing is with respect to the
recovered clock. The FPGA is latched on the falling edge of the clock, an exception to the general recommenda-
50
Lattice Semiconductor
ORCA ORT8850 Data Sheet
tions. (The clock edge on which data is latched in the core is hard wired to be the falling edge.) Since the falling
edge of the clock (FPGA_CLK) at the FPGA latch occurs after the next data byte is launched, the delay from the
interface to the FPGA latch must be large enough that an acceptable hold time margin is obtained. However the
maximum propagation delay is fairly large, so a half cycle approach might lead to setup time problems.
Figure 27. Full Cycle, Alignment FIFO Bypass Mode Output Configuration and Timing (-1 Speed Grade)
a. Configuration
Note: xx = [AA, AB, ..., BD]
DOUTxx[7:0]
FPGA
Logic
Embedded
Core
D
Q
Δt
Δt
RETIME_CLK
1.3 ns
FPGA_CLK
-
-
CDR_CLK_xx
HSI_CLK
0.5 ns
3.0 ns
Secondary Clock
b. Timing (ns)
0.0
4.7
9.4
18.8
14.1
CDR_CLK_xx
10.2
14.9
19.6
0.8
5.5
Launch
RETIME_CLK
FPGA_CLK
Hold
16.6
11.9
2.5
7.2
Capture
tprop_max = 4.7
tprop_min = 0.8
DOUTxx[7:0]
Data Valid
51
Lattice Semiconductor
ORCA ORT8850 Data Sheet
In the case shown in Figure 28 the alignment FIFO is used and all timing is with respect to the single reference
clock, which is routed through the FPGA as a primary clock. The capturing clock edge occurs after the launch of
the next data byte, so hold time margin is of concern and an acceptably margin should be verified. Launched data
has nearly a full clock period to become stable at the capture latch, so setup margin should not be a problem. Mov-
ing the capture to the rising clock edge might give a setup time margin problem.
Figure 28. Half Cycle, Alignment Mode Output Configuration and Timing (-1 Speed Grade)
Note: xx = [AA, AB, ... BD]
FPGA
Logic
Embedded
Core
DOUTxx[7:0]
D
Q
Δ
Δ
t
t
ASB_CLK
FPGA_CLK
+
-
FPGA_SYSCLK
1.4 ns
3.0 ns
Primary Clock
a.) Configuration
14.1
4.7
9.4
0.0
18.8
FPGA_SYSCLK
8.0
12.7
17.4
-1.4
3.3
Launch
Hold
ASB_CLK
17.1
12.4
3.0
7.7
Capture
FPGA_CLK
tprop_max = 2.4
tprop_min = - 0.8
DOUTxx[7:0]
Data Valid
b.) Timing (times in ns.)
52
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Figure 29 shows the timing for sending data from the FPGA logic to the Core. In the input case, the constraints on
the data are specified in terms of setup and hold times on the data at the interface relative to the clock at the inter-
face. For correct operation these constraints must be met. In the case shown, launch and capture occur on the
same (rising) clock edge. Data is captured before the next data is launched, so there will be no hold margin prob-
lem. Launched data also has nearly a full clock period to become stable at the capture latch, so setup margin
should not be a problem.
Figure 29. Full Cycle, Align and Bypass Mode Input Configuration and Timing (-1 Speed Grade)
a.) Configuration
Note: xx = [AA, AB, ..., BD]
DINxx[7:0]
Embedded
FPGA
Core
Logic
Q
D
Δ
Δ
t
t
RETIME_CLK
FPGA_CLK
.
2.4 ns
+
+
FPGA_SYSCLK
1.4 ns
3.0 ns
Primary Clock
a.) Timing (ns)
0.0
4.7
9.4
14.1
FPGA_SYSCLK
FPGA_CLK
17.1
- 1.7
12.4
3.0
7.7
Launch
Hold
15.1
10.4
1.0
5.7
Capture
RETIME_CLK
hold time = 2.3
setup time - 1.3
Requirements on
DINxx[7:0]
Data Valid
53
Lattice Semiconductor
ORCA ORT8850 Data Sheet
The next two examples show timing for serial TOH data input and output. For these cases, the clock is generated in
the FPGA logic and the discussion accounts for the skew between the clock signal at the FPGA latch and at the
FPGA/Core interface. The clock is routed over a secondary clock path and the skew can vary by 3 ns. A value of
+ 2 ns was assumed in the discussions.
Figure 30 shows the timing for sending serial TOH data from the Core to the FPGA logic with data being launched
and latched on the same (rising) clock edge. As in the previous examples, setup and hold time constraints for the
data versus the reference clock at the capturing latch must be met. Data is not captured before the next data is
launched, so there might be a hold time margin problem. Launched data has nearly a full clock period to become
stable at the capture latch and the maximum propagation delay is only 0.2 ns so setup margin should not be a
problem for the timing relationships assumed. Actual timing analysis should be performed for each application
because of the wide range of possible skew values.
Figure 30. Full Cycle,TOH Output Configuration and Timing (-1 Speed Grade)
a. Configuration
Note: xx - [AA, AB, ..., BD]
FPGA
Logic
Embedded
Core
TOH_OUTxx
D
Q
Δt
Δt
ASB_TOH_CLK
FPGA_CLK
+
+
TOH_CLK
3.0 ns skew
+2.0 ns assumed
0.4 ns
Secondary Clock
b. Timing (ns)
0.0
18.8
4.7
9.4
14.1
TOH_CLK
8.8
14.5
19.2
0.4
5.1
Launch
Hold
11.4
ASB_TOH_CLK
16.1
2.0
6.7
Capture
FPGA_CLK
tprop_min = - 0.5
TOH_OUTxx
tprop_max = 2.0
Data Valid
54
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Figure 31 shows the timing for sending TOH data from the FPGA logic to the Core. As in the earlier input example,
the constraints on the data are specified in terms of setup and hold times on the data at the interface relative to the
clock at the interface. In the case shown, launch and capture occur on different clock edges (rising edge in the
FPGA). Data is captured before the next data is launched, so there will be no hold margin problem. Launched data
also has nearly a full clock period to become stable at the capture latch, so setup margin should not be a problem
for the timing relationships assumed in the example. Actual timing analysis should be performed for each applica-
tion because of the wide range of possible skew values.
Figure 31. Half Cycle,TOH Input Configuration and Timing (-1 Speed Grade)
a. Configuration
Note: xx = [AA, AB, ..., BD]
FPGA
Logic
Embedded
Core
TOH_INxx
Q
D
Δt
Δt
ASB_IN_TOH_CLK
FPGA_CLK
+
-
TOH_CLK
3.0 ns skew
+2.0 ns assumed
1.8 ns
Secondary Clock
b. Timing (ns)
14.1
9.4
0.0
4.7
TOH_CLK
16.1
11.4
2.0
6.7
Launch
FPGA_CLK
Hold
15.9
11.2
6.5
1.8
Capture
ASB_IN_TOH_CLK
hold time = 1.8
setup time = 0.0
Requirements on
TOH_INxx
Data
Valid
55
Lattice Semiconductor
Powerdown Mode
ORCA ORT8850 Data Sheet
Powerdown mode will be entered when the corresponding channel is disabled. Channels can be independently
enabled or disabled under software control.
Parallel data bus output enable and TOH serial data output enable signals are made available to the FPGA logic.
The HSI macrocell’s corresponding channel is also powered down. The device will power up with all eight channels
in powerdown mode.
Protection Switching
There is built-in protection switching between the SERDES channels, in the receive direction of the ORT8850. Pro-
tection switching allows pairs of SERDES channels to act as main and protect data links, and to switch between the
main and protect links via a control register or FPGA interface port.There are two types of protection switches: par-
allel and LVDS.
Parallel protection switching takes place just before the FPGA interface ports, and after the alignment FIFO. The
alignment FIFO must be used for this type of protection switching. It is possible to bypass the pointer inter-
preter/mover and still use the parallel protection switching. In this mode, SERDES channels AA and AB are used
as main and protect. When selected for main, channel AA is used to provide data on interface ports AA. When
selected for protect, channel AB is used to provide data on FPGA interface ports AA. The same scheme is used for
channel groupings AC/AD, BA/BB, and BC/BD
There are two ways to control the parallel protection switching, interface signal and software control. On the FPGA
interface, there are 4 input signals to the ORT8850 core that will select between a main and a protect channel.
When using the interface signal to control protection switching, only the parallel data is switched; the serial TOH
data outputs are not switched.
Software control will switch both the parallel data and the serial TOH data outputs to the FPGA. The software con-
trol register is found at 0x30009 in the memory map (Table 19).
Table 17. Register Settings, Parallel Protection Switching
FPGA Interface Signal
PROT_SWITCH_AA
PROT_SWITCH_AC
PROT_SWITCH_BA
PROT_SWITCH_BC
When ‘0’
When ‘1’
Channel AB data on DOUTAA
Channel AD data on DOUTAC
Channel BB data on DOUTBA
Channel BD data on DOUTBC
Channel AA data on DOUTAA
Channel AC data on DOUTAC
Channel BA data on DOUTBA
Channel BC data on DOUTBC
LVDS protection switching takes place at the LVDS buffer before the serial data is sent into the Data Recovery
(CDR). The selection is between the main LVDS buffer and the protect LVDS buffer. The work LVDS buffers are
TXDxx_W_[P:N], while the protect LVDS buffers are TXDxx_P_[P:N]. When operating using the LVDS buffers
(default), no status information is available on the protect LVDS buffers since the serial stream must reach the
SONET framer before status information is available on the data stream. The same is also true for the work LVDS
buffers when operating with the protect buffers.
There are two ways to control the LVDS protection switching, interface and software control. On the FPGA inter-
face, there are eight input signals to the ORT8850 core that will select between the work and protect LVDS buffers.
Table 18. LVDS Protection Switching
FPGA Interface Signal
LVDS_PROT_AA
LVDS_PROT_AB
LVDS_PROT_AC
LVDS_PROT_AD
When ‘0’
When ‘1’
Channel AA gets TXD_AA_W_[P:N]
Channel AB gets TXD_AB_W_[P:N]
Channel AC gets TXD_AC_W_[P:N]
Channel AD gets TXD_AD_W_[P:N]
Channel AA gets TXD_AA_P_[P:N]
Channel AB gets TXD_AB_P_[P:N]
Channel AC gets TXD_AC_P_[P:N]
Channel AD gets TXD_AD_P_[P:N]
56
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 18. LVDS Protection Switching (Continued)
FPGA Interface Signal
When ‘0’
When ‘1’
LVDS_PROT_BA
LVDS_PROT_BB
LVDS_PROT_BC
LVDS_PROT_BD
Channel BA gets TXD_BA_W_[P:N]
Channel BB gets TXD_BB_W_[P:N]
Channel BC gets TXD_BC_W_[P:N]
Channel BD gets TXD_BD_W_[P:N]
Channel BA gets TXD_BA_P_[P:N]
Channel BB gets TXD_BB_P_[P:N]
Channel BC gets TXD_BC_P_[P:N]
Channel BD gets TXD_BD_P_[P:N]
For software control of the LVDS protection switching there is an enable bit to enable software control, and a bit per
channel which selects main or protect. The enable register is at 0x30008 in the memory map (Table 19).
Memory Map
The memory map for the ORT8850 core is only part of the full memory map of the ORT8850 device. The ORT8850
is an ORCA Series4 based device and thus uses the system bus as a communication bridge. The ORT8850 core
register map contained in this data sheet only covers the embedded ASIC core of the device, not the entire device.
The system bus itself, and the generic FPGA memory map, are fully documented in the MPI/System Bus Applica-
tion Note. As part of the system bus, the embedded ASIC core of an FPSC is located at address offset 0x30000.
The ORT8850 embedded core is an eight-bit slave interface on the Series 4 system bus.
Each ORCA device contains a device ID.This device ID is unique to each ORCA device and can be used for device
identification and assist in system debugging. The device ID is located at absolute address 0x00000 - 0x00003.
The ORT8850H’s device ID is 0xDC0123C0 and the ORT8850L’s device ID is 0xDC0121C0. More information on
the device ID and other Series 4 generic registers can be found in the MPI/System Bus Application Note.
The ORT8850 core registers are clocked by the reference clock SYS_CLK_P/N. If a clock is not provided to the ref-
erence clock, the registers will fail to operate.
The ORT8850 core registers do not check for parity on a write operation. On a read operation, no parity is gener-
ated, and a “0” is passed back to the initiating bus master interface on the parity signal line.
Registers Access and General Description
The memory map comprises three address blocks:
• Generic register block: ID, revision, scratch pad, lock and reset register.
• Device register block: control and status bits, common to the eight channels in each of the two quad interfaces.
• Channel register blocks: each of the four channels in both quads have an address block.The four address blocks
in both quads have the same structure, with a constant address offset between channel register blocks.
All registers are write-protected by the lock register, except for the scratch pad register. The lock register is a 16-bit
read/write register. Write access is given to registers only when the key value 0x0580 is present in the lock register.
An error flag will be set upon detecting a write access when write permission is denied. The default value is
0x0000.
After power-up reset or soft reset, unused register bits will be read as zeros. Unused address locations are also
read as zeros. Bit in write-only registers will always be read as zeros.
This table is constructed to show the correct values when read and written via the system bus MPI interface.When
using this table while interfacing with the system bus user logic master interface, the data values will need
to be byte flipped.This is due to the opposite orientation of the MPI and master interface bus ordering. More infor-
mation on this can be found in the MPI/System Bus Application Note (TN1017).
57
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 19. Memory Map Descriptions
(0x)
Absolute
Address
Reset
Value
(0x)
Bit
Type
R
Name
Description
30000
[0:7]
[0:7]
[0:7]
-
-
-
05
80
80
Internal device revision
Internal device revision
Internal device revision
30001
R
30002
R
The scratch pad has no function and is not used anywhere in
the core. However, this register can be written to and read from
for debugging purposes.
30003
[0:7]
[0:7]
R/W
scratch pad
lockreg MSB
00
00
In order to write to registers in memory locations 0x30006 to
0x300FF, lockreg MSB and lockreg LSB must be respectively
set to the values of 05 and 80. If the MSB and LSB lockreg val-
ues are not set to {05, 80}, then any values written to the regis-
ters in memory locations 0x30006 to 0x300FF will be ignored.
After reset (both hard and soft), the core is in a write locked
mode. The core needs to be unlocked before it can be written
to.
30004
R/W
Also note that the scratch pad register (0 x 30003) can always
be written to as it is unaffected by write lock mode.
30005
30006
30007
[0:7]
[0]
R/W
R/W
lockreg LSB
global reset
00
0
The global reset is a soft (software initiated) reset which will
have the exact reset effect as a hard (RST_N pin) reset.This is
a pulse register and does not have to be cleared.
[1-7]
[0:7]
-
-
Not Used
Not Used
0
00
Device Register Blocks
0 = No Loopback
LVDS loopback
control
1 = LVDS loopback, transmit to receive.TX serial data is looped
back to the RX serial input. TX data is still available at the TX
pins
[0]
[1]
R/W
0
-
-
Not Used
Not Used
0
0
[2]
30008
0 = Protection switching performed via bit settings in registers
0x30037 etc.
1 = Protection switching performed via hardware pins
LVDS_PROT_SWITCH_xx
LVDS Protection
Switch enable
[3]
R/W
0
TOH RX serial
enable
TOH_CK_FP_EN signal
[4]
R/W
-
0
0
[5-7]
Not Used
58
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 19. Memory Map Descriptions (Continued)
(0x)
Absolute
Address
Reset
Value
(0x)
Bit
Type
Name
Description
TOH serial port
R/W output MUX select
for AA/AB
0 = AB TOH is output on AA
1 = AA TOH is output on AA
[0]
1
1
1
1
1
1
1
1
TOH serial port
R/W output MUX select
AC/AD
0 = AD TOH is output on AC
1 = AC TOH is output on AC
[1]
[2]
[3]
[4]
[5]
[6]
[7]
DOUT parallel port
R/W output MUX select
for AA/AB
0 = AB data is output on AA
1 = AA data is output on AA
DOUT parallel port
R/W output MUX select
for AC/AD
0 = AD data is output on AC
1 = AC data is output on AC
30009
TOH serial port
R/W output MUX select
for BA/BB
0 = BB TOH is output on BA
1 = BA TOH is output on BA
TOH serial port
R/W output MUX select
for BC/BD
0 = BD TOH is output on BC
1 = BC TOH is output on BC
DOUT parallel port
R/W output MUX select
for BA/BB
0 = BB data is output on BA
1 = BA data is output on BA
DOUT parallel port
R/W output MUX select
BC/BD
0 = BD data is output on BC
1 = BC data is output on BC
FIFO aligner
threshold value
(min)
Minimum threshold value for the per channel receive direction
alignment FIFOs. If and when the minimum threshold value is
violated by a particular channel, then the “FIFO aligner thresh-
old error” alarm bit will be generated for that channel and if
enabled, latched as a “FIFO aligner threshold error flag” in the
respective channel alarm register.
The allowable range for minimum threshold values is 1 to 23.
Note that the minimum FIFO aligner threshold value applies to
all eight channels.
40
decimal
2
[0:4]
R/W
3000A
3000B
MSB bit is 4.
[5-7]
[0:4]
[5-7]
-
-
-
Not Used
N/A
A8
FIFO aligner
threshold value
(max)
The allowable range for maximum threshold values is 0 to 22.
decimal MSB bit is 4
15
Not Used
N/A
59
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 19. Memory Map Descriptions (Continued)
(0x)
Absolute
Address
Reset
Value
(0x)
Bit
Type
Name
Description
number of consec-
utive A1 A2 errors
to generate [0:3]
If a particular channel’s “A1 A2 error insert command” control
bit is set to the value 1 then the “A1 and A2 error insert values”
will be inserted into that channels respective A1 and A2 bytes.
The number of consecutive frames to be corrupted is deter-
mined by the “number of consecutive A1 A2 errors to generate
[0:3]” control bits.
[0:3]
R/W
00
MSB is bit 3
backplane side
loopback control
0 = No loopback.
1 = RX to TX loopback on backplane side. Serial input is run
through SERDES and SONET block, then looped back in paral-
lel to SERDES and out serial.
[4]
[5]
[6]
R/W
0
1
1
3000C
DINxx/DOUTxx
R/W parallel bus parity
control
0 = Odd parity
1 = Even parity
scram-
bler/descrambler
0 = no RX direction, descramble / TX direction scramble
1 = In RX direction, descramble channel after the SONET frame
recovery. In TX direction, scramble data just before parallel-to-
serial conversion
R/W
[7]
-
Not Used
0
A1 error insert
value [0:7]
Value of the A1 byte for error insert
Value of the A2 byte for error insert
3000D
3000E
3000F
[0:7]
R/W
00
A2 error insert
value [0:7]
[0:7]
[0:7]
R/W
R/W
00
00
transmit B1 error
insert mask [0:7]
0 = No error insertion.
1 = Invert corresponding bit in B1 byte.
AA alarm
AB alarm
AC alarm
AD alarm
Consolidation alarm for channel AA
1 = alarm
0 = no alarm.
[0]
[1]
[2]
R
R
R
0
0
0
Consolidation alarm for channel AB
1 = alarm
0 = no alarm.
30010
Consolidation alarm for channel AC
1 = alarm
0 = no alarm.
Consolidation alarm for channel AD
1 = alarm
0 = no alarm.
[3]
[4-7]
[0]
R
-
0
0
0
Not Used
AA/BA alarm
R/W enable/mask regis-
ter
AA and BA enable
1 = enabled
0 = not enabled
AB/BB alarm
R/W enable/mask regis-
ter
AB and BB enable
1 = enabled
0 = not enabled
[1]
[2]
0
0
30011
AC/BC alarm
R/W enable/mask regis-
ter
AC and BC enable
1 = enabled
0 = not enabled
AD/BD alarm
R/W enable/mask regis-
ter
AD and BD enable
1 = enabled
0 = not enabled
[3]
0
0
[4-7]
-
Not Used
60
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 19. Memory Map Descriptions (Continued)
(0x)
Absolute
Address
Reset
Value
(0x)
Bit
Type
Name
Description
frame offset error
flag
If in the receive direction the phase offset between any two
channels exceeds 17 bytes, then a frame offset error event will
be issued. This condition is continuously monitored.
Write a “1” to clear this bit
[0]
R
0
30012
write to locked reg-
ister error flag
If the core memory map has not been unlocked (by writing to
the lock registers), and any address other than the lockreg reg-
isters or scratch pad register is written to, then a “write to locked
register” event will be generated.
[1]
R
-
0
Write a “1” to clear this bit
[2-7]
[0]
Not Used
N/A
0
frame offset error
R/W enable
Frame offset error flag enable.
0 = not enable
1 = enable
30013
30014
write to locked reg-
R/W ister for error
enable
Write to locked register error flag enable
0 = not enable
1 = enable
[1]
[2-7]
[0]
0
0
0
-
Not Used
BA alarm
Consolidation alarm for channel BA
0 = no alarm
1 = alarm
R
BB alarm
BC alarm
BD alarm
Consolidation alarm for channel BB
0 = no alarm
1 = alarm
[1]
[2]
[3]
R
R
R
0
0
0
Consolidation alarm for channel BC
0 = no alarm
1 = alarm
Consolidation alarm for channel BD
0 = no alarm
1 = alarm
[4-7]
[0:7]
R
-
Not Used
Not Used
0
30015
30016
00
STM A mode con-
trol
00 - Quad STS-12 or STS-48.
10 - Quad STS-3.
[0:1]
R/W
0
STM B mode con-
trol
00 - Quad STS-12 or STS-48.
10 - Quad STS-3.
[2:3]
[4-7]
R/W
-
0
0
Not Used
61
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 19. Memory Map Descriptions (Continued)
(0x)
Absolute
Address
Reset
Value
(0x)
Bit
Type
Name
Description
30017
[0]
R/W
BD resync
0
0
0
0
0
0
0
0
Channel BD alignment FIFO resync. Write “1” to resync
this channel. When no alignment is used, this resets the
read pointer to the middle of the FIFO. Write “0” for normal
operation
[1]
[2]
[3]
[4]
[5]
[6]
[7]
R/W
R/W
R/W
R/W
R/W
R/W
R/W
BC resync
BB resync
BA resync
AD resync
AC resync
AB resync
AA resync
Channel BC alignment FIFO resync. Write “1” to resync
this channel. When no alignment is used, this resets the
read pointer to the middle of the FIFO. Write “0” for normal
operation
Channel BB alignment FIFO resync. Write “1” to resync
this channel. When no alignment is used, this resets the
read pointer to the middle of the FIFO. Write “0” for normal
operation
Channel BA alignment FIFO resync. Write “1” to resync
this channel. When no alignment is used, this resets the
read pointer to the middle of the FIFO. Write “0” for normal
operation
Channel AD alignment FIFO resync. Write “1” to resync
this channel. When no alignment is used, this resets the
read pointer to the middle of the FIFO.Write “0” for normal
operation
Channel AC alignment FIFO resync. Write “1” to resync
this channel. When no alignment is used, this resets the
read pointer to the middle of the FIFO.Write “0” for normal
operation
Channel AB alignment FIFO resync. Write “1” to resync
this channel. When no alignment is used, this resets the
read pointer to the middle of the FIFO.Write “0” for normal
operation
Channel AA alignment FIFO resync. Write “1” to resync
this channel. When no alignment is used, this resets the
read pointer to the middle of the FIFO.Write “0” for normal
operation
30018
[0]
[1]
[2]
[3]
R/W
R/W
R/W
R/W
AD/BD resync
AC/BC resync
AB/BB resync
AA/BA resync
0
0
0
0
2-link AD/BD alignment FIFO resync.
Write “1” to resync this link. Write “0” for normal operation.
2-link AC/BC alignment FIFO resync.
Write “1” to resync this link. Write “0” for normal operation.
2-link AB/BB alignment FIFO resync.
Write “1” to resync this link. Write “0” for normal operation.
2-link AA/BA alignment FIFO resync.
Write “1” to resync this link. Write “0” for normal operation.
[4]
[5]
R/W
R/W
STM B resync
STM A resync
0
0
Quad B alignment resync. Write “0” for normal operation.
Quad A alignment FIFO resync
Write “0” for normal operation.
[6]
[7]
R/W
-
All 8 resync
Not Used
0
All 8 channel alignment FIFO resync.
Write “0” for normal operation.
N/A
62
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 19. Memory Map Descriptions (Continued)
(0x)
Absolute
Address
Reset
Value
(0x)
Bit
Type
Name
Description
30019
[0:7]
-
Not Used
00
Channel Register Blocks
30020*
30038
30050
30068
30080
30098
300B0
300C8
[0]
R/W
AIS-L insert in
OOF
0
0 = When RX direction OOF occurs,
do not insert AIS-L.
1 = When RX direction OOF occurs, insert AIS-L.
0
0
[1]
[2]
R/W
AIS-L control
0 = Do not force AIS-L insert
1 = Always force AIS-L insert
R/W TOH output par-
ity error insert
0 = Do not insert a parity error
1 = Insert parity error in parity bit of receive TOH serial out-
put for as long as this bit is set
[3]
[4]
R/W RX K1/K2 source
select
0
0
0 = Set receive direction K1 K2 bytes to 0.
1 = Pass receive direction K1 K2 through pointer mover.
R/W DOUTxx bus par-
ity error insert
0 = Do not insert parity error.
1 = Insert parity error in DOUTxx_PAR for as long as this
bit is set.
0
[5]
R/W
channel
enable/disable
control
0 = Power down CDR channels
1 = Functional mode.
0
0
[6]
[7]
[0]
R/W
R/W
DOUTxx_EN
TOH_EN
DOUTxx_EN signal
TOHxx_EN signal
30021*
30039
30051
30069
30081
30099
300B1
300C9
R/W D9 source select
0
0
0
0
0
0
0 = Insert D9 from TOH_INxx
1 = Pass through D9 from DINxx
[1]
[2]
[3]
[4]
[5]
[6]
[7]
R/W
R/W
R/W
R/W
R/W
D10 source
select
0 = Insert D10 from TOH_INxx
1 = Pass through D10 from DINxx
D11 source
select
0 = Insert D11 from TOH_INxx
1 = Pass through D11 from DINxx
D12 source
select
0 = Insert D12 from TOH_INxx
1 = Pass through D12 from DINxx
K1 K2 source
select
0 = Insert K1, K2 from TOH_INxx
1 = Pass through K1, K2 from DINxx
S1 M0 source
select
0 = Insert S1, M0, from TOH_INxx
1 = Pass through S1 M0 of DINxx
R/W E1 F1 E2 source
select
0 = Insert E1, F1, E2 from TOH_INxx on FPGA interface
1 = Pass through E1, F1, E2 TOH bytes of DINxx
0
R/W
TOH source
select
0 = Insert TOH from TOH_INxx on FPGA interface for
transmit
1 = Pass through all TOH DINxx for transmit
00
30022*
3003A
30052
3006A
30082
3009A
300B2
300CA
[0:7]
R/W
D1~D8 source
select
0 = Insert TOH for transmit from TOH_INxx from the FPGA
interface.
1 = Pass through D1~D8 TOH bytes from DINxx.
63
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 19. Memory Map Descriptions (Continued)
(0x)
Absolute
Address
Reset
Value
(0x)
Bit
Type
Name
Description
0
30023*
3003B
30053
3006B
30083
3009B
300B3
300CB
[0]
R/W
A1 A2 error
insert command
0 = Do not insert error.
1 = Insert error for number of frames in register 0x3000C.
The error insertion is based on a rising edge detector. As
such, the control must be set to value 0 before trying to
indicate a second A1, A2 corruption
0.
[1]
R/W
B1 error insert
command
0 = Do not insert error
1 = Insert error marked in register 0x3000F.
The error insertion is based on a rising edge detector. As
such, the control must be set to value 0 before trying to ini-
tiate a second B1 corruption.
0
0
[2]
[3]
R/W disable B1 insert
0 = B1 is inserted in the transmit direction by the SONET
block
1 = B1 is not inserted in the transmit direction
R/W
disable A1/A2
insert
0 = A1/A2 is inserted in the transmit direction by the
SONET block
1 = A1/A2 is not inserted in the transmit direction
[4-7]
[0:3]
-
Not Used
0
0
30024*
3003C
30054
3006C
30084
3009C
300B4
300CC
R
concat indication
3, 6, 9, 12
The value 1 in any bit location indicates that STS# is in
CONCAT mode.
0 = Not in concatenation mode or is the head of concate-
nated group
1 = indicates the channel is concatenated
[4-7]
[0:7]
-
Not Used
0
0
30025*
3003D
30055
3006D
30085
3009D
300B5
300CD
R
concat indication
1, 4, 7, 10,
The value 1 in any bit location indicates that STS# is in
CONCAT mode.
0 = Not in concatenation mode or is the head of concate-
nated group
2, 5, 8, 11
1 = indicates the channel is concatenated
30026*
3003E
30056
3006E
30086
3009E
300B6
300CE
[0]
R
Channel alarm
bit
0
Set when any of the alarms in the channel alarm register
(0x30028) are set and the alarm is enabled. This alarm is
enabled in 0x30027 bit 0 for channel AA etc.
[1]
[2]
R
R
AIS-P flag
0
0
Set when any alarm for AIS-P is set and the corresponding
enable is set.
Pointer mover
elastic store
overflow flag
Set when the elastic store in the pointer mover write and
read address is within 1 byte. Alarm enable is 0x30027 bit
2.
[3-7]
-
Not Used
0
64
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 19. Memory Map Descriptions (Continued)
(0x)
Absolute
Address
Reset
Value
(0x)
Bit
Type
Name
Description
30027*
0303F
30057
3006F
30087
3009F
300B7
300CF
[0]
R/W
enable channel
alarm
0
0
0
Channel alarm bit (30026, ...) enable. Set to 1 to enable
alarm bit to propagate to alarm 0x30010
[1]
[2]
R/W enable AIS-P flag
AIS -P flag alarm enable. Set to 1 to enable alarm bit to
propagate to alarm 0x30010
enable pointer
mover elastic
store overflow
flag
Pointer mover elastic store overflow flag enable. Set to 1 to
enable alarm bit to propagate to 0x30010
[3-7]
[0]
-
Not Used
0
30028*
30040
30058
30070
30088
300A0
300B8
300D0
R
FIFO aligner
threshold error
flag
00
Alarm is set to 1 if either the min or max FIFO threshold
levels are violated, the min and max threshold levels can
be set in address 0x3000A and 0x300B. Alarm enable is
0x30029 bit 0. Write 1 to clear this alarm bit This alarm is
only valid when FIFO OOS flag is also set.
[1]
[2]
[3]
[4]
RX internal path
parity error flag
Alarm indicator on receive path internal parity error. Alarm
is enabled in 0x30029 bit 1. Write 1 to clear
OOF flag
Alarm indicator channel is OOF. Alarm enable is 0x30029
bit 2. Write 1 to clear.
LVDS link B1 par-
ity error flag
Alarm indicator that channel has found a B1 parity error.
Alarm enable is 0x30029 bit 3. Write 1 to clear.
DINxx parallel
bus parity error
flag
0
0
0
Alarm indicator channel has found a parity error on the
DINxx input from the FPGA.Alarm enable is 0x30029 bit 4.
Write 1 to clear.
[5]
[6]
TOH serial input
port parity error
flag
Alarm indicator channel has found a parity error on the
TOH_INxx input from the FPGA. Write 1 to clear this
alarm. Alarm enable is 0x30028 bit 5.
FIFO OOS error
flag
Alarm indicates channel group is out of sync. Write 1 to
clear. Alarm enable is 0x30028.
[7]
-
Not Used
0
30029*
30041
30059
30071
30089
300A1
300B9
300D1
[0:6]
R/W
channel alarm
enable
00
Enable bits for channel alarm register 0x30028. Set to 1 to
enable and to propagate the alarm to register 0x30026 bit
0.
[7]
-
Not Used
0
3002A*
30042
3005A
30072
3008A
300A2
300BA
300D2
[0:3]
[4-7]
R
-
AIS alarm flags 3,
6, 9, 12
0
0
These are the AIS-P alarm flags. 1 if the LVDS input STS #
contains AIS.
Not Used
65
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 19. Memory Map Descriptions (Continued)
(0x)
Absolute
Address
Reset
Value
(0x)
Bit
Type
Name
Description
3002B*
30043
3005B
30073
3008B
300A3
300BB
300D3
[0:7]
R
AIS alarm flags 1,
4, 7, 10, 2, 5, 8,
11
00
These are the AIS-P alarm flags. 1 if the LVDS input STS #
contains AIS.
3002C*
30044
3005C
30074
3008C
300A4
300BC
300D4
[0:3]
[4-7]
R/W enable AIS alarm
3, 6, 9, 12
0
0
Enable bits for AIS alarms. Set to 1 to enable and propa-
gate the alarm to register 0x30026.
-
Not Used
3002D*
30045
3005D
30075
3008D
300A5
300BD
300D5
[0:7]
R/W AIS alarm enable
1, 4, 7, 10, 2, 5,
8, 11
00
Enable bits for AIS alarms. Set to 1 to enable and propa-
gate the alarm to register 0x30026.
3002E*
30046
3005E
30076
3008E
300A6
300BE
300D6
[0:3]
R
Pointer mover
elastic store over-
flow flags 12, 9,
6, 3
0
Per STS-1 pointer mover elastic store overflow alarm flags.
This alarm will propagate to 0x30026 bit 2 when enabled
[4-7]
[0:7]
-
Not Used
0
3002F*
30047
3005F
30077
3008F
300A7
300BF
300D7
R
Pointer mover
elastic store over-
flow flags 4, 7,
10, 2, 5, 8, 11
00
Per STS-1 pointer mover elastic store overflow alarm flags.
This alarm will propagate to 0x30026 bit 2 when enabled
30030*
30048
30060
30078
30090
300A8
300C0
300D8
[0:3]
[4-7]
R/W
-
enable elastic
store overflow
flag 12, 9, 6, 3
0
0
Enable Bit for elastic store alarms. Set 1 to enable alarm
and propagate alarm to register 0x30026
Not Used
66
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 19. Memory Map Descriptions (Continued)
(0x)
Absolute
Address
Reset
Value
(0x)
Bit
Type
Name
Description
30031*
30049
30061
30079
30091
300A9
300C1
300D9
[0:7]
enable elastic
store overflow
flag 1, 4, 7, 10, 2,
5, 8, 11
00
Enable Bit for elastic store alarms. Set 1 to enable alarm
and propagate alarm to register 0x30026.
30032*
3004A
30062
3007A
30092
300AA
300C2
300DA
[0:6]
[7]
R
R
B1 parity error
counter
00
0
7 bit counter for the number of B1 parity errors in the
receive direction of the channel. Clear on read. Bit 6 is
MSB
B1 parity error
counter overflow
Overflow bit for B1 parity error counter
30033*
3004B
30063
3007B
30093
300AB
300C3
300DB
[0:6]
[7]
R
R
OOF counter
00
0
7 bit counter for the number of in-frame to OOF transitions.
Clear on read. Bit 6 is MSB
OOF counter
overflow
Overflow bit for OOF counter
30034*
3004C
30064
3007C
30094
300AC
300C4
300DC
[0:6]
[7]
R
R
A1 A2 frame
error counter
00
0
This counter increments when an errored frame pattern is
detected by the framer. Note that this is different from
OOF. In OOF state, you can detect the correct framing pat-
tern and still be out-of-frame.
A1, A2 error
counter overflow
Overflow bit for A1/A2 error counter
30035*
3004D
30065
3007D
30095
300AD
300C5
300DD
[0:4]
[5-7]
R
-
FIFO depth regis-
ter
30
0
Current value of the channel’s read address of the align-
ment FIFO. Bit 4 is the MSB
Not Used
30036*
3004E
30066
3007E
30096
300AE
300C6
300DE
[0:7]
R
Sampler phase
error counter
00
This is coming from the sampler block. The sampler looks
for bit transitions 0->1->0 to determine if the transitions
occur after 4 repeated bits. For e.g.: if you have
000011110000 then the 0->1->0 transition occurs in the
5th and 9th positions. It uses this to select one of the 4
repeated bits and form a repeated byte. When the transi-
tions happen at different bit positions, then the phase error
merely indicates that this has happened
67
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 19. Memory Map Descriptions (Continued)
(0x)
Absolute
Address
Reset
Value
(0x)
Bit
Type
Name
Description
30037*
3004F
30067
3007F
30097
300AF
300C7
300DF
[0]
R/W
Bypass pointer
mover
0
0 = use pointer mover
1 = Bypass pointer mover.
[1]
[2]
R/W
Bypass pointer
mover and align-
ment FIFO
0
0 = uses alignment FIFO and pointer mover
1 = Bypass alignment FIFO and pointer mover.
0
Enable work/pro-
tect channels
Bit to control the LVDS receivers to CDR.
0 = Use LVDS receivers from HSI work channels.
1 = Use LVDS receivers from HSI protect channels.
[3:4]
R
R
Multichannel
alignment control
00
00 = No alignment.
10 = Align with twin (i.e., STM B stream A).
01 = Align with all 4 (i.e., STM A all streams).
11 = Align with all 8 (i.e., STM A and B all streams).
[5]
RX path SONET
framer
0
0 = Enable framer.
1 = Disable SONET framing data is passed through
[6-7]
[0]
-
Not Used
Reserved
0
0
0
300E0
R/W
R/W
Reserved, must be set to 0.
Always set to zero
[1]
CDR control
register
[2]
[3]
-
Not Used
0
0
R/W
CDR control
register
When set to 1, controls bypass of 16 PLL generated
phases with 16 low-speed phases.
[4]
[5]
R/W
R/W
CDR control
register
0
0
Enables CDR loopback.
0 = No loopback.
1 = Loopback TX to RX.
CDR control
register
Enables bypassing of the internal 622 MHz clock with
TSTCLK. Must be used for simulation
0 = Use PLL.
1 = Bypass PLL (uses TSTCLK as reference clock).
[6]
R/W
CDR control
register
0
0
Enables CDR test mode. Initiates CDR’s built-in self-test:
0 = Regular mode.
1 = Test mode.
[7]
-
Not Used
Half Rate
300E1
300E2
[0:7]
R/W
Per Channel select for half rate mode can only be used in
pure bypass mode. Bit 7 is for channel BD, bit 6 is for BC
etc.
0 = full rate
1 = half rate
[0:7]
R/W
Quad Rate
Per Channel select for quad rate mode can only be used in
pure bypass mode. Bit 7 is for channel BD, bit 6 is for BC
etc.
0 = full rate
1 = quad rate
* For Channels AA, AB, AC, AD, BA, BB, BC, BD respectively
Note: Registers at addresses ≥ 300E3 must remain at their default (reset) settings and must not be changed by the user.
68
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Electrical Characteristics
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-
lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess
of those given in the operations sections of this data sheet. Exposure to absolute maximum ratings for extended
periods can adversely affect device reliability.
The ORCA Series 4 FPSCs include circuitry designed to protect the chips from damaging substrate injection cur-
rents and to prevent accumulations of static charge. Nevertheless, conventional precautions should be observed
during storage, handling, and use to avoid exposure to excessive electrical stress.
Table 20. Absolute Maximum Ratings
Parameter
Storage Temperature
Symbol
Tstg
Min.
-65
Max.
150
Units
°C
V
Power Supply Voltage with Respect to Ground
VDD332
VDDIO
VDD15
VDDA_STM1
—
-0.3
-0.3
-0.3
-0.3
-0.3
-0.3
—
4.2
4.2
V
2.0
V
2.0
V
Input Signal with Respect to Ground
VDDIO + 0.3
VDDIO + 0.3
220
V
Signal Applied to High-impedance Output
Maximum Package Body (Soldering) Temperature
—
V
—
°C
Recommended Operating Conditions
Table 21. Recommended Operating Conditions
Parameter
Symbol
Min.
Max.
3.6
Units
V
Power Supply Voltage with Respect to Ground*
VDD332
VDD15
VDDA_STM1
VIN
2.7
1.425
1.425
-0.3
1.575
V
1.575
V
Input Voltages
VDDIO + 0.3
125
V
Junction Temperature
TJ
-40
°C
For FPGA Recommended Operating Conditions and Electrical Characteristics, see the Recommended Operating
Conditions and Electrical Characteristics tables in the ORCA Series 4 FPGA data sheet (ORT8850L: OR4E02,
ORT8850H: OR4E06) and the ORCA Series 4 I/O Buffer Technical Note. FPSC Standby Currents (IDDSB15 and
IDDSB33) are tested with the Embedded Core in the powered down state.
Notes:
1. VDDA_STM is an analog power supply input which needs to be isolated from other power supplies on the board.
2. VDD33 is an analog power supply for the FPGA PLLs and needs to be isolated from other power supplies on the board.
69
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Power Supply Decoupling LC Circuit
The 850 MHz HSI macro contains both analog and digital circuitry. The data recovery function, for example, is
implemented as primarily a digital function, but it relies on a conventional analog phase-locked loop to provide its
850 MHz reference frequency. The internal analog phase-locked loop contains a voltage-controlled oscillator. This
circuit will be sensitive to digital noise generated from the rapid switching transients associated with internal logic
gates and parasitic inductive elements. Generated noise that contains frequency components beyond the band-
width of the internal phase-locked loop (about 3 MHz) will not be attenuated by the phase-locked loop and will
impact bit error rate directly. Thus, separate power supply pins are provided for these critical analog circuit ele-
ments.
Additional power supply filtering in the form of a LC filter section will be used between the power supply source and
these device pins as shown in Figure 32. The corner frequency of the LC filter is chosen based on the power supply
switching frequency, which is between 100 kHz and 300 kHz in most applications.
Capacitors C1 and C2 are large electrolytic capacitors to provide the basic cut-off frequency of the LC filter. For
example, the cutoff frequency of the combination of these elements might fall between 5 kHz and 50 kHz. Capaci-
tor C3 is a smaller ceramic capacitor designed to provide a low-impedance path for a wide range of high-frequency
signals at the analog power supply pins of the device. The physical location of capacitor C3 must be as close to the
device lead as possible. Multiple instances of capacitors C3 can be used if necessary. The recommended filter for
the HSI macro is shown below: L = 4.7µH, RL = 1Ω, C1 = 0.01µF, C2 = 0.01µF, C3 = 4.7µF.
Figure 32. Sample Power Supply Filter Network for Analog HSI Power Supply Pins
FROM POWER
SUPPLY SOURCE
L
TO DEVICE
VDDA_STM
+
C1
+
C2
+
C3
PLL_VSSA
5-9344(F)
If the programmable PLLs on the FPGA portion of the device are to be used, then the VDD33 supply must isolated
in the same way. More information on this and other requirements for the FPGA PLLs can be found in technical
note TN1011, ORCA Series 4 I/O Tuning via PLL available on the Lattice web site at www.latticesemi.com.
70
Lattice Semiconductor
ORCA ORT8850 Data Sheet
HSI Electrical and Timing Characteristics
Table 22. Maximum Power Dissipation
Parameter
Power Dissipation
Conditions
Min.
Typ.
Max.
Units
SERDES, scrambler/descrambler, framer,
FIFO alignment, pointer mover, and I/O
(per channel), 622 Mbtis/s
—
—
125
mW
1. With all channels operating, 1.575 V and 3.6 V supplies, 85ºC.
Table 23. Recommended Operating Conditions
Parameter
VDD15 Supply Voltage
Conditions
Min.
1.425
–40
Typ.
—
Max.
1.575
125
Units
V
—
TJ
Junction Temperature
—
°C
Table 24. Receiver Specifications
Parameter
Input Data
Conditions
Min.
Typ.
Max.
Units
Stream of Nontransitions 1
Phase Change, Input Signal
Eye Opening3
—
Over a 200 ns time interval 2
—
—
—
—
—
—
—
—
72
100
—
bits
ps
0.4
—
UIp-p
UIp-p
UIp-p
Jitter Tolerance @ 622 Mbits/s, Worst Case
Jitter Tolerance @ 155 Mbits/s, Worst Case
300 MV diff eye4
250 MV diff eye5
0.6
0.85
—
1. This sequence should not occur more than once per minute.
2. Translates to a frequency change of 500 ppm.
3. A unit interval for 622.08 Mbits/s data is 1.6075 ns.
4. With STS-12 data pattern, all channels operating, FPGA logic active, REFCLK jitter of 30 ps., TA=0°C to 85°C, 1.425 V to 1.575 V supply. Jit-
ter measured with a Wavecrest SIA-3000.
5. With STS-3 data pattern, all channels operating, FPGA logic active, REFCLK jitter of 30 ps., TA=0°C to 85°C, 1.425 V to 1.575 V supply. Jit-
ter measured with a Wavecrest SIA-3000.
71
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 25. Channel Output Jitter (622 Mbits/s)
Parameter
Deterministic
Random
Conditions
Min.
—
Typ.1
0.09
0.11
0.20
Max.1
0.10
0.14
0.24
Units
UIp-p
UIp-p
UIp-p
—
Total2,3
—
1. With PRBS 2^7 data pattern, all channels operating, FPGA logic active, REFCLK jitter of 30 ps., 0°C to 85°C, 1.425 V to 1.575 V supply.
2. Wavecrest SIA-3000 instrument used to measure one-sigma (rms) random jitter component value. This value is multiplied by 14 to provide
the peak-to-peak value that corresponds to a BER of 10-12
.
3. Total jitter measurement performed with Wavecrest SIA-3000 at a BER of 10-12. See instrument documentation and other Wavecrest publi-
cations for a detailed discussion of jitter types included in this measurement.
Table 26. Channel Output Jitter (155 Mbits/s)
Parameter
Conditions
Min.
—
Typ.1
0.027
0.053
0.08
Max.1
0.035
0.065
0.10
Units
UIp-p
UIp-p
UIp-p
Deterministic
Random
Total2,3
—
—
1. With PRBS 2^7 data pattern, all channels operating, FPGA logic active, REFCLK jitter of 30 ps., 0°C to 85°C, 1.425 V to 1.575 V supply.
2. Wavecrest SIA-3000 instrument used to measure one-sigma (rms) random jitter component value. This value is multiplied by 14 to provide
the peak-to-peak value that corresponds to a BER of 10-12
.
3. Total jitter measurement performed with Wavecrest SIA-3000 at a BER of 10-12. See instrument documentation and other Wavecrest publi-
cations for a detailed discussion of jitter types included in this measurement.
Table 27. Synthesizer Specifications
Parameter
Conditions
Min
Typical
Max
Unit
PLL1
Loop Bandwidth
—
—
—
—
—
—
10
—
—
—
—
—
6
2
MHz
dB
Jitter Peaking
power-up Reset Time
Lock Acquisition Time
Input Reference Clock
Frequency
—
1
μs
ms
—
62.5
-350
—
—
—
—
106.25
350
MHz
ppm
ps
Frequency Deviation2
—
Phase Change
Over a 200 ns time interval3
100
1. External 10 kΩ resistor to analog ground required.
2. The frequency deviation allowed between the transmitter reference clock and receiver reference clock on a given link.
3. Translates to a frequency change of 500 ppm.
72
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Embedded Core LVDS I/O
Table 28. Driver DC Data
Parameter
Symbol
VOH
Test Conditions
RLOAD = 100 Ω 1%
RLOAD = 100 Ω 1%
RLOAD = 100 Ω 1%
RLOAD = 100 Ω 1%
VCM = 1.0 V and 1.4 V
VCM = 1.0 V and 1.4 V
RLOAD = 100 Ω 1%
Min.
—
Typ.
—
Max.
1.475
—
Units
V
Output Voltage High, VOA or VOB
Output Voltage Low, VOA or VOB
Output Differential Voltage
Output Offset Voltage
VOL
0.925
0.25
1.125
80
—
V
⏐VOD⏐
VOS
—
0.45
1.275
120
V
—
V
Output Impedance, Differential
RO Mismatch Between A and B
Ro
100
—
W
%
Δ RO
—
10
Change in Differential Voltage Between
Complementary States
⏐Δ VOD⏐
Δ VOS
—
—
—
—
25
25
mV
mV
Change in Output Offset Voltage
Between Complementary States
RLOAD = 100 Ω 1%
Output Current
ISA, ISB
ISAB
Driver shorted to GND
Drivers shorted together
—
—
—
—
24
12
mA
mA
Output Current
Power-off Output Leakage
VDD = 0 V
VPAD, VPADN = 0 V—2.5 V
|Ixa|, |Ixb|
—
—
10
mA
1. VDD33 = 3.1 V—3.5 V, VDD15 = 1.4 V—1.6 V, –40 ˚C.
2. External reference, REF10 = 1.0 V 3%, REF14 = 1.4 V 3%.
Table 29. Driver AC Data1
Parameter
Symbol
Test Conditions
ZL = 100 Ω 1%
CPAD = 3.0 pF, CPAD = 3.0 pF
Min.
Typ.
Max.
Units
VOD Fall Time, 80% to 20%
tF
100
—
210
ps
VOD Rise Time, 20% to 80%
ZL = 100 Ω 1%
CPAD = 3.0 pF, CPAD = 3.0 pF
tR
100
—
—
—
210
50
ps
ps
Differential Skew
|tPHLA – tPLHB| or |tPHLB – tPLHA|
Any differential pair on pack-
age at 50% point of the tran-
sition
tSKEW1
1. VDD33 = 3.1V - 3.5 V, VDD15 = 1.4V - 1.6 V, -40˚C.
73
Lattice Semiconductor
ORCA ORT8850 Data Sheet
LVDS Receiver Buffer Requirements
Table 30. Receiver DC Data1
Parameter
Symbol
Test Conditions
Min.
Typ.
Max.
Units
Input Voltage Range, VIA or VIB
⏐VGPD⏐ < 925 mV
DC – 1 MHz
VI
0.0
1.2
2.4
V
Input Differential Threshold
⏐VGPD⏐ < 925 mV
450 MHz
VIDTH
VHYST
RIN
–100
25
—
—
100
—
mV
mV
Ω
Input Differential Hysteresis
(+VIDTHH) – (–VIDTHL)
Receiver Differential Input Impedance
With build-in termination,
center-tapped
80
100
120
1. VDD = 3.1V - 3.5V, 0 °C -125 °C.
Table 31. LVDS Operating Parameters
Parameter
Transmit Termination Resistor
Receiver Termination Resistor
Temperature Range
Test Conditions
Min.
Normal
100
100
—
Max.
Units
—
—
—
—
—
—
80
80
120
120
125
3.6
Ω
Ω
˚C
V
–40
3.0
Power Supply VDD33
—
Power Supply VDD15
1.425
—
—
1.575
—
V
Power Supply VSS
0
V
Note: Under worst-case operating conditions, the LVDS driver will withstand a disabled or unpowered receiver for an unlimited period of time
without being damaged. Similarly, when outputs are short-circuited to each other or to ground, the LVDS will not suffer permanent damage.
The LVDS driver supports hot insertion. Under a well-controlled environment, the LVDS I/O can drive backplane as well as cable.
74
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Input/Output Buffer Measurement Conditions (on-LVDS Buffer)
Figure 33. AC Test Loads
VCC
GND
1 k
TO THE OUTPUT UNDER TEST
50 pF
TO THE OUTPUT UNDER TEST
50 pF
A. Load Used to Measure Propagation Delay
B. Load Used to Measure Rising/Falling Edges
Note: Switch to VDD for TPLZ/TPZL; switch to GND for TPHZ/TPZH.
Figure 34. Output Buffer Delays
ts[i]
PAD
out[i]
AC TEST LOADS (SHOWN ABOVE)
OUT
VDD
VDD/2
VSS
out[i]
PAD
OUT
1.5 V
0.0 V
TPLL
TPHH
Figure 35. Input Buffer Delays
PAD
IN
in[i]
3.0 V
PAD IN 1.5 V
0.0 V
VDD
in[i] VDD/2
VSS
TPLL
TPHH
75
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Termination Resistor
The LVDS drivers and receivers operate on a 100 Ω differential impedance, as shown below. External resistors are
not required. The differential driver and receiver buffers include termination resistors inside the device package, as
shown in Figure 36 below.
Figure 36. LVDS Driver and Receiver and Associated Internal Components
LVDS DRIVER
LVDS RECEIVER
50
50
100
CENTER TAP
EXTERNAL
DEVICE PINS
LVDS Driver Buffer Capabilities
Under worst-case operating condition, the LVDS driver must withstand a disabled or unpowered receiver for an
unlimited period of time without being damaged. Similarly, when its outputs are short-circuited to each other or to
ground, the LVDS driver will not suffer permanent damage Figure 37 illustrates the terms associated with LVDS
driver and receiver pairs.
Figure 37. LVDS Driver and Receiver
DRIVER
INTERCONNECT
RECEIVER
VOA
A
B
AA
BB
VIA
VIB
VOB
VGPD
Figure 38. LVDS Driver
CA
VOA
VOB
A
RLOAD
V
VOD = (VOA – VOB)
B
CB
76
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Pin Information
This section describes the pins and signals that perform FPGA-related functions. During configuration, the user-
programmable I/Os are 3-stated and pulled up with an internal resistor. If any FPGA function pin is not used (or not
bonded to package pin), it is also 3-stated and pulled up after configuration.
Table 32. FPGA Common-Function Pin Descriptions
Symbol
I/O
Description
Dedicated Pins
VDD33
3.3 V positive power supply. This power supply is used for 3.3 V configuration RAMs and internal
PLLs. When using PLLs, this power supply should be well isolated from all other power supplies on
the board for proper operation.
—
VDD15
VDDIO
VSS
—
—
—
I
1.5 V positive power supply for internal logic.
Positive power supply used by I/O banks.
Ground.
PTEMP
RESET
Temperature sensing diode pin. Dedicated input.
During configuration, RESET forces the restart of configuration and a pull-up is enabled. After con-
figuration, RESET can be used as a general FPGA input or as a direct input, which causes all PLC
latches/FFs to be asynchronously SET/RESET.
I
O
I
CCLK
DONE
In the master and asynchronous peripheral modes, CCLK is an output which strobes configuration
data in.
In the slave or readback after configuration, CCLK is input synchronous with the data on DIN or
D[7:0]. CCLK is an output for daisy-chain operation when the lead device is in master, peripheral, or
system bus modes.
I
As an input, a low level on DONE delays FPGA start-up after configuration.*
As an active-high, open-drain output, a high level on this signal indicates that configuration is com-
plete. DONE has an optional pull-up resistor.
O
PRGM
PRGM is an active-low input that forces the restart of configuration and resets the boundary-scan
circuitry. This pin always has an active pull-up.
I
I
RD_CFG
This pin must be held high during device initialization until the INIT pin goes high. This pin always
has an active pull-up.
During configuration, RD_CFG is an active-low input that activates the TS_ALL function and 3-
states all of the I/O.
After configuration, RD_CFG can be selected (via a bit stream option) to activate the TS_ALL func-
tion as described above, or, if readback is enabled via a bit stream option, a high-to-low transition on
RD_CFG will initiate readback of the configuration data, including PFU output states, starting with
frame address 0.
RD_DATA/TDO
RD_DATA/TDO is a dual-function pin. If used for readback, RD_DATA provides configuration data
out. If used in boundary-scan, TDO is test data out.
O
O
CFG_IRQ/MPI_IRQ
During JTAG, slave, master, and asynchronous peripheral configuration assertion on this CFG_IRQ
(active-low) indicates an error or errors for block RAM or FPSC initialization. MPI active-low inter-
rupt request output, when the MPI is used.
1. The FPGA States of Operation section contains more information on how to control these signals during start-up. The timing of DONE
release is controlled by one set of bit stream options, and the timing of the simultaneous release of all other configuration pins (and the activa-
tion of all user I/Os) is controlled by a second set of options.
77
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 32. FPGA Common-Function Pin Descriptions (Continued)
Symbol
I/O
Description
Special-Purpose Pins
M[3:0]
During power-up and initialization, M0—M3 are used to select the configuration mode with their val-
ues latched on the rising edge of INIT. During configuration, a pull-up is enabled.
I
I/O After configuration, these pins are user-programmable I/O.*
Semi-dedicated PLL clock pins. During configuration they are 3-stated with a pull up.
I/O These pins are user-programmable I/O pins if not used by PLLs after configuration.
Pins dedicated for the primary clock. Input pins on the middle of each side with differential pairing.
PLL_CK[0:7][TC]
I
P[TBLR]CLK[1:0][T
C]
I
I/O After configuration these pins are user-programmable I/O, if not used for clock inputs.
TDI, TCK, TMS
If boundary-scan is used, these pins are test data in, test clock, and test mode select inputs. If
boundary-scan is not selected, all boundary-scan functions are inhibited once configuration is com-
plete. Even if boundary-scan is not used, either TCK or TMS must be held at logic 1 during configu-
I
ration. Each pin has a pull-up enabled during configuration.
I/O After configuration, these pins are user-programmable I/O in boundary scan is not used.*
RDY/BUSY/RCLK
During configuration in asynchronous peripheral mode, RDY/RCLK indicates another byte can be
written to the FPGA. If a read operation is done when the device is selected, the same status is also
O
available on D7 in asynchronous peripheral mode.
During the master parallel configuration mode, RCLK is a read output signal to an external memory.
This output is not normally used.
I/O After configuration this pin is a user-programmable I/O pin.*
HDC
LDC
INIT
High during configuration is output high until configuration is complete. It is used as a control output,
indicating that configuration is not complete.
O
I/O After configuration, this pin is a user-programmable I/O pin.*
Low during configuration is output low until configuration is complete. It is used as a control output,
indicating that configuration is not complete.
O
I/O After configuration, this pin is a user-programmable I/O pin.*
INIT is a bidirectional signal before and during configuration. During configuration, a pull-up is
enabled, but an external pull-up resistor is recommended. As an active-low open-drain output, INIT
I/O is held low during power stabilization and internal clearing of memory. As an active-low input, INIT
holds the FPGA in the wait-state before the start of configuration.
After configuration, this pin is a user-programmable I/O pin.*
CS0, CS1
CS0 and CS1 are used in the asynchronous peripheral, slave parallel, and microprocessor configu-
ration modes. The FPGA is selected when CS0 is low and CS1 is high. During configuration, a pull-
up is enabled.
I
I/O After configuration, if MPI is not used, these pins are user-programmable I/O pins.*
RD/MPI_STRB
WR/MPI_RW
RD is used in the asynchronous peripheral configuration mode. A low on RD changes D[7:3] into a
status output. WR and RD should not be used simultaneously. If they are, the write strobe overrides.
This pin is also used as the MPI data transfer strobe. As a status indication, a high indicates ready,
and a low indicates busy.
I
WR is used in asynchronous peripheral mode. A low on WR transfers data on D[7:0] to the FPGA.
In MPI mode, a high on MPI_RW allows a read from the data bus, while a low causes a write trans-
fer to the FPGA.
I
I/O After configuration, if the MPI is not used, WR/MPI_RW is a user-programmable I/O pin.*
PPC_A[14:31]
MPI_BURST
During MPI mode the PPC_A[14:31] are used as the address bus driven by the PowerPC bus mas-
ter utilizing the least-significant bits of the PowerPC 32-bit address.
I
MPI_BURST is driven low to indicate a burst transfer is in progress in MPI mode. Driven high indi-
cates that the current transfer is not a burst.
I
1. The FPGA States of Operation section contains more information on how to control these signals during start-up. The timing of DONE
release is controlled by one set of bit stream options, and the timing of the simultaneous release of all other configuration pins (and the activa-
tion of all user I/Os) is controlled by a second set of options.
78
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 32. FPGA Common-Function Pin Descriptions (Continued)
Symbol
I/O
Description
MPI_BDIP
MPI_BDIP is driven by the PowerPC processor in MPI mode. Assertion of this pin indicates that the
second beat in front of the current one is requested by the master. Negated before the burst transfer
ends to abort the burst data phase.
I
MPI_TSZ[0:1]
A[21:0]
MPI_TSZ[0:1] signals are driven by the bus master in MPI mode to indicate the data transfer size for
the transaction. Set 01 for byte, 10 for half-word, and 00 for word.
I
O
During master parallel mode A[21:0] address the configuration EPROMs up to 4M bytes.
I/O If not used for MPI these pins are user-programmable I/O pins after configuration.*
MPI_ACK
MPI_CLK
MPI_TEA
In MPI mode this is driven low indicating the MPI received the data on the write cycle or returned
O
data on a read cycle.
I/O If not used for MPI these pins are user-programmable I/O pins after configuration.*
This is the PowerPC synchronous, positive-edge bus clock used for the MPI interface. It can be a
source of the clock for the embedded system bus. If MPI is used this will be the AMBA bus clock.
I
I/O If not used for MPI these pins are user-programmable I/O pins after configuration.*
A low on the MPI transfer error acknowledge indicates that the MPI detects a bus error on the inter-
nal system bus for the current transaction.
O
I/O If not used for MPI these pins are user-programmable I/O pins after configuration.*
MPI_RTRY
D[0:31]
O
This pin requests the MPC860 to relinquish the bus and retry the cycle.
I/O If not used for MPI these pins are user-programmable I/O pins after configuration.*
Selectable data bus width from 8, 16, 32-bit in MPI mode. Driven by the bus master in a write trans-
action and driven by MPI in a read transaction.
I/O
D[7:0] receive configuration data during master parallel, peripheral, and slave parallel configuration
modes when WR is low and each pin has a pull-up enabled. During serial configuration modes, D0
is the DIN input.
I
O
D[7:3] output internal status for asynchronous peripheral mode when RD is low.
I/O After configuration, if MPI is not used, the pins are user-programmable I/O pins.*
DP[0:3]
DIN
Selectable parity bus width in MPI mode from 1, 2, 4-bit, DP[0] for D[0:7], DP[1] for D[8:15], DP[2]
I/O for D[16:23], and DP[3] for D[24:31].
After configuration, if MPI is not used, the pins are user-programmable I/O pin.*
During slave serial or master serial configuration modes, DIN accepts serial configuration data syn-
chronous with CCLK. During parallel configuration modes, DIN is the D0 input. During configuration,
a pull-up is enabled.
I
I/O After configuration, this pin is a user-programmable I/O pin.*
DOUT
During configuration, DOUT is the serial data output that can drive the DIN of daisy-chained slave
devices. Data out on DOUT changes on the rising edge of CCLK.
O
After configuration, DOUT is a user-programmable I/O pin.*
I/O
I
TESTCFG
During configuration this pin should be held high, to allow configuration to occur. A pull up is
enabled during configuration.
I/O After configuration, TESTCFG is a user programmable I/O pin.*
Reference resistor connection for controlled impedance termination of Series 4 FPGA LVDS inputs.
LVDS_R
—
1. The FPGA States of Operation section contains more information on how to control these signals during start-up. The timing of DONE
release is controlled by one set of bit stream options, and the timing of the simultaneous release of all other configuration pins (and the activa-
tion of all user I/Os) is controlled by a second set of options.
79
Lattice Semiconductor
ORCA ORT8850 Data Sheet
This section describes device I/O signals to/from the embedded core.
Table 33. FPSC Embedded Core Function Pin Description (xx = AA, ..., BD)
Symbol
HSI LVDS Receive Pins
RXDXX_W_P
RXDXX_W_N
RXDXX_P_P
I/O
Description
I
I
I
I
I
I
I
Positive LVDS work link—Channel XX
Negative LVDS work link—Channel XX
Positive LVDS protect link—Channel XX
Negative LVDS protect link—Channel XX
RXDXX_P_N
DAUTREC
Disable auto recovery for the PLL. Internal pull-down.
Analog VDD 1.5 V power supply for the HSI block.
Analog VSS for the HSI block.
VDDA_STM
VSSA_STM*
HSI LVDS Transmit Pins
TXDXX_W_P
I
I
I
I
Positive LVDS work link—channel XX
Negative LVDS work link—channel XX
Positive LVDS protect link—channel XX
Negative LVDS protect link—channel XX
TXDXX_W_N
TXDXX_P_P
TXDXX_P_N
HSI Test Signals
TSTCLK
I
Test clock for emulation of 622 MHz clock during PLL bypass. Internal pull-
down.
MRESET
TESTRST
I
I
Test mode reset. Internal pull-down.
Resets receiver clock division counter. Internal pull-up.
Resets transmitter clock division counter. Internal pull-up.
Test mode output port.
RESETTX
I
TSTMUX[9:0]S
SCAN_TSTMD
SCAN_EN
O
I
Test mode enable. Must be tie-low for normal operation.
Scan test enable. Internal pull-up.
Internal pull-down.
I
TSTSUFTLD
E_TOGGLE
ELSEL
I
I
Internal pull-down.
I
Internal pull-down.
EXDNUP
I
Internal pull-down.
LVDS Interface Special Pins
LVCTAP_W[4:0]
LVCTAP_P[4:0]
REF10
—
—
—
—
—
—
LVDS work input center tap (use 0.01 µF to GND).
LVDS protect input center tap (use 0.01 µF to GND).
LVDS reference voltage: 1.0 V 3%.
REF14
LVDS reference voltage: 1.4 V 3%.
RESHI
LVDS resistor high pin ( 100 Ω in series with reslo).
LVDS resistor low pin ( 100 Ω in series with reshi).
RESLO
MISC System Signals
RST_N
I
Reset the core only. The FPGA logic is not reset by rst_n.
Internal pull down allows chip to stay in reset state when external driver loses
power.
SYS_CLK_P
SYS_CLK_N
I
I
Positive LVDS system clock, 50% duty cycle, also the reference clock of PLL.
Negative LVDS system clock, 50% duty cycle, also the reference clock of
PLL.
LVCTAP_SK
O
LVDS center-tap for SYS_CLK (use 0.01 µf to GND).
80
Lattice Semiconductor
Package Information
ORCA ORT8850 Data Sheet
Table 34 summarizes the programmable I/O clock and power pins available to the ORT8850 devices.
Table 34. ORT8850 IO and Power Pin Summary
I/O or Power Type
User I/O Single Ended
ORT8850L
ORT8850H
278
129
7
297
129
7
User I/O Differential Pairs (LVDS, LVPECL)
Configuration
Dedicated Function
3
3
VDD15
48
28
38
89
48
28
38
89
VDD33
VDDIO
Vss
Single-Ended/Differential I/O per Bank
Bank 0
Bank 1
Bank 2
Bank 3
Bank 4
Bank 5
Bank 6
Bank 7
64/32
47/20
68/32
47/20
ASIC I/O
ASIC I/O
ASIC I/O
44/18
ASIC I/O
ASIC I/O
ASIC I/O
44/18
76/32
76/32
55/27
62/27
There are some incompatibilities between the ORT8850H and ORT8850L due to the fact that the ORT8850L is a
much smaller array and hence does not provide as many programmable IOs (PIOs). In order to allow pin-for-pin
compatible board layouts that can accommodate either device, key compatibility issues include the following:
• Unused Pins Table 35 shows a list of bonded ORT8850H PIOs that are unused in the ORT8850L. As shown in
the table, there are 19 balls that are not available in the ORT8850L, but are available in the ORT8850H. These
user I/Os should not be used if an ORT8850L will be used.
• Shared Control Signals on I/O Registers. The ORCA Series 4 architecture shares clock and control signals
between two adjacent I/O pads. If I/O registers are used, incompatibilities may arise between ORT8850L and
ORT8850H when different clock or control signals are needed on adjacent package pins. This is because one
device may allow independent clock or control signals on these adjacent pins, while the other may force them to
be the same. There are two ways to avoid this issue.
– Always keep an open bonded pin (non-bonded pins for the ORT8850L do not count) between pins that
require different clock or control signals. Note that this open pin can be used to connect signals that do not
require the use of I/O registers to meet timing.
– Place and route the design in both the ORT8850H and ORT8850L to verify both produce valid designs. Note
that this method guarantees the current design, but does not necessarily guard against issues that can
occur when design changes are made that affect I/O registers.
– 2X/4X I/O Shift Registers. If 2X I/O shift registers or 4X I/O shift registers are used in the design, this may
cause incompatibilities between the ORT880L and ORT8850H because only the A and C I/Os in a PIC sup-
port 2X I/O shift registers and only A I/Os supports 4X I/O shift register mode. A and C I/Os are shown in the
following pinout tables under the I/O pad columns as those ending in A or C.
• Edge Clock Input Pins. The input buffers for fast edge clocks are only available at the C I/O pad.The C I/Os are
shown in the following pinout tables under the I/O pad columns as those ending in C.
81
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 35. ORT8850H Pins That Are Unused in ORT8850L
BGA Ball Bonds
K4
ORT8850H PIOs
PL11A
PL13A
PL20A
PL21A
PL27A
PL28A
PL29A
PL35A
PL37A
PL38A
PB3A
M5
R5
T5
W4
AA2
Y4
AC4
AD5
AG1
AP4
AK10
AK11
AM9
AN9
AM14
AN14
D11
PB9A
PB10A
PB11A
PB12A
PB19A
PB20A
PT12A
PT11A
E13
Users should avoid using these pins if they plan to migrate their ORT8850H design to an ORT8850L.
Package Pinouts
Table 36 provides the package pin and pin function for the ORT8850 FPSC and packages. The bond pad name is
identified in the PIO nomenclature used in the ispLEVER design editor. The Bank column provides information as
to which output voltage level bank the given pin is in. The Group column provides information as to the group of
pins the given pin is in. This is used to show which VREF pin is used to provide the reference voltage for single-
ended limited-swing I/Os. If none of these buffer types (such as SSTL, GTL, HSTL) are used in a given group, then
the VREF pin is available as an I/O pin.
When the number of FPGA bond pads exceeds the number of package pins, bond pads are unused. When the
number of package pins exceeds the number of bond pads, package pins are left unconnected (no connects).
When a package pin is to be left as a no connect for a specific die, it is indicated as a note in the device column for
the FPGA. The tables provide no information on unused pads.
82
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 36. ORT8850L and ORT8850H 680-Pin PBGAM Pinout (note: pins labeled “Reserved” should be left
unconnected)
VREF
BM680
A1
E4
F5
VDDIO Bank
—
Group
—
—
—
—
—
—
—
7
I/O
VSS
VDD33
O
ORT8850L
VSS
ORT8850H Additional Function
Pair
—
VSS
—
—
VDD33
VDD33
—
—
—
PRD_DATA
PRESET_N
PRD_DATA
PRESET_N
RD_DATA/TDO
—
D2
E3
G5
C4
F4
—
I
RESET_N
—
—
I
PRD_CFG_N PRD_CFG_N
PPRGRM_N PPRGRM_N
RD_CFG_N
—
—
I
PRGRM_N
—
0 (TL)
0 (TL)
0 (TL)
—
VDDIO0
IO
VDDIO0
PL2D
PL2C
VSS
VDDIO0
PL2D
—
—
PLL_CK0C/HPPLL
L21C_D2
L21T_D2
—
D1
A2
E2
F3
7
IO
PL2C
PLL_CK0T/HPPLL
—
7
VSS
IO
VSS
—
0 (TL)
0 (TL)
0 (TL)
0 (TL)
0 (TL)
0 (TL)
0 (TL)
0 (TL)
0 (TL)
—
PL2B
PL2A
PL3D
PL3C
VDDIO0
PL3B
PL3A
PL4D
PL4C
VSS
PL3D
—
L22C_D0
L22T_D0
L23C_D0
L23T_D0
—
7
IO
PL3C
VREF_0_07
G4
H5
D3
E1
F2
7
IO
PL4D
D5
7
IO
PL4C
D6
—
8
VDDIO0
IO
VDDIO0
PL5D
—
—
L24C_D0
L24T_D0
L25C_D1
L25T_D1
—
8
IO
PL5C
VREF_0_08
J5
8
IO
PL6D
HDC
G3
A18
H4
F1
8
IO
PL6C
LDC_N
—
8
VSS
IO
VSS
—
0 (TL)
0 (TL)
0 (TL)
0 (TL)
0 (TL)
0 (TL)
0 (TL)
0 (TL)
0 (TL)
—
PL4B
PL4A
PL5D
PL5C
VDDIO0
PL5B
PL5A
PL6D
PL6C
VSS
PL7D
—
L26C_D2
L26T_D2
L27C_D0
L27T_D0
—
8
IO
PL7C
—
G2
H3
E5
K5
J4
9
IO
PL8D
TESTCFG
9
IO
PL8C
D7
—
9
VDDIO0
IO
VDDIO0
PL9D
—
VREF_0_09
A17/PPC_A31
CS0_N
CS1
L28C_D0
L28T_D0
L29C_D3
L29T_D3
—
9
IO
PL9C
G1
L5
9
IO
PL10D
PL10C
VSS
9
IO
A33
H2
J3
—
10
10
10
10
10
10
1
VSS
IO
—
0 (TL)
0 (TL)
0 (TL)
0 (TL)
0 (TL)
0 (TL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
PL6B
PL6A
PL7D
PL7C
PL7B
PL7A
PL8D
PL8C
VDDIO7
PL8B
PL8A
PL9D
PL11D
PL11C
PL12D
PL12C
PL13D
PL13C
PL14D
PL14C
VDDIO7
PL15D
PL15C
PL16D
—
L30C_D0
L30T_D0
L31C_D0
L31T_D0
L32C_D0
L32T_D0
L1C_D0
L1T_D0
—
IO
—
H1
J2
IO
INIT_N
IO
DOUT
K3
L4
IO
VREF_0_10
A16/PPC_A30
A15/PPC_A29
A14/PPC_A28
—
IO
J1
IO
K2
L1
1
IO
—
1
VDDIO7
IO
M4
L3
—
L2C_D0
L2T_D0
L3C_D3
1
IO
—
K1
1
IO
VREF_7_01
83
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 36. ORT8850L and ORT8850H 680-Pin PBGAM Pinout (note: pins labeled “Reserved” should be left
unconnected) (Continued)
VREF
Group
BM680
N5
VDDIO Bank
7 (CL)
—
I/O
IO
ORT8850L
PL9C
ORT8850H Additional Function
Pair
1
PL16C
VSS
D4
L3T_D3
—
AM22
L2
—
2
VSS
IO
VSS
—
7 (CL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
—
PL9B
PL17D
PL17C
PL18D
PL18C
VDDIO7
PL19D
PL19C
PL20D
PL20C
VSS
—
L4C_D1
L4T_D1
L5C_D2
L5T_D2
—
N4
2
IO
PL9A
—
P5
2
IO
PL10D
PL10C
VDDIO7
PL10B
PL10A
PL11D
PL11C
VSS
RDY/BUSY_N/RCLK
M2
M3
M1
P4
2
IO
VREF_7_02
—
2
VDDIO7
IO
—
A13/PPC_A27
L6C_D2
L6T_D2
L7C_D0
L7T_D0
—
2
IO
A12/PPC_A26
N2
3
IO
—
P3
3
IO
—
AM32
R4
—
3
VSS
IO
—
7 (CL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
—
PL11B
PL11A
PL12D
PL12C
PL12B
PL12A
PL13D
PL13C
VSS
PL21D
PL21C
PL22D
PL22C
PL22B
PL22A
PL23D
PL23C
VSS
A11/PPC_A25
L8C_D2
L8T_D2
L9C_A0
L9T_A0
L10C_D1
L10T_D1
L11C_D3
L11T_D3
—
N1
3
IO
VREF_7_03
P2
3
IO
—
P1
3
IO
—
T4
3
IO
—
R2
3
IO
—
U5
4
IO
RD_N/MPI_STRB_N
R1
4
IO
VREF_7_04
AN1
V5
—
4
VSS
IO
—
7 (CL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
—
PL13B
PL13A
PL14D
PL14C
VDDIO7
PL14B
PL14A
VSS
PL23B
PL23A
PL24D
PL24C
VDDIO7
PL24B
PL24A
VSS
—
L12C_D1
L12T_D1
L13C_A0
L13T_A0
—
T3
4
IO
—
T2
4
IO
PLCK0C
T1
4
IO
PLCK0T
R3
—
4
VDDIO7
IO
—
U4
—
L14C_A0
L14T_A0
—
U3
4
IO
—
AN2
U2
—
5
VSS
IO
—
A10/PPC_A24
A9/PPC_A23
—
7 (CL)
7 (CL)
—
PL15D
PL15C
VSS
PL25D
PL25C
VSS
L15C_A0
L15T_A0
—
V2
5
IO
AN33
V3
—
5
VSS
IO
7 (CL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
—
PL15B
PL15A
PL16D
PL16C
PL16B
PL16A
PL17D
PL17C
VSS
PL25B
PL25A
PL26D
PL26C
PL27D
PL27C
PL28D
PL28C
VSS
—
L16C_A0
L16T_A0
L17C_A2
L17T_A2
L18C_D1
L18T_D1
L19C_D0
L19T_D0
—
V4
5
IO
—
W5
W2
W3
Y1
5
IO
A8/PPC_A22
VREF_7_05
—
5
IO
5
IO
5
IO
—
Y2
6
IO
PLCK1C
PLCK1T
—
AA1
AN34
Y5
6
IO
—
6
VSS
IO
7 (CL)
PL17B
PL29D
VREF_7_06
L20C_D3
84
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 36. ORT8850L and ORT8850H 680-Pin PBGAM Pinout (note: pins labeled “Reserved” should be left
unconnected) (Continued)
VREF
Group
BM680
AB1
AA5
AA3
U1
VDDIO Bank
7 (CL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
6 (BL)
6 (BL)
—
I/O
IO
ORT8850L
PL17A
PL18D
PL18C
VDDIO7
PL18B
PL19D
PL19C
PL19B
PL19A
PL20D
PL20C
VDDIO7
PL20B
PL20A
PL21D
PL21C
PL21B
PL21A
PL22D
PL22C
VSS
ORT8850H Additional Function
Pair
L20T_D3
L21C_A1
L21T_A1
—
6
PL29C
PL30D
PL30C
VDDIO7
PL31D
PL32D
PL32C
PL33D
PL33C
PL34D
PL34C
VDDIO7
PL35D
PL35C
PL36D
PL36C
PL37D
PL37C
PL38D
PL38C
VSS
A7/PPC_A21
6
IO
A6/PPC_A20
6
IO
A5/PPC_A19
—
7
VDDIO7
IO
—
AB2
AA4
AC1
AB5
AC2
AB4
AC5
W1
—
—
7
IO
WR_N/MPI_RW
L22C_D2
L22T_D2
L23C_D2
L23T_D2
L23C_D0
L23T_D0
—
7
IO
VREF_7_07
7
IO
—
7
IO
—
8
IO
A4/PPC_A18
8
IO
VREF_7_08
—
8
VDDIO7
IO
—
AD2
AE1
AD3
AE2
AF1
AD4
AE3
AF2
AB13
AE4
AF3
AE5
AG2
AK5
AH1
AF5
AF4
AG3
AB14
AH2
AJ1
A3/PPC_A17
L23C_D0
L23T_D0
L24C_D0
L24T_D0
L25C_D2
L25T_D2
L1C_D0
L1T_D0
—
8
IO
A2/PPC_A16
8
IO
A1/PPC_A15
8
IO
A0/PPC_A14
8
IO
DP0
8
IO
DP1
1
IO
D8
1
IO
VREF_6_01
—
1
VSS
IO
—
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
—
PL22B
PL22A
PL23D
PL23C
VDDIO6
PL23B
PL23A
PL24D
PL24C
VSS
PL39D
PL39C
PL40D
PL40C
VDDIO6
PL41D
PL41C
PL42D
PL42C
VSS
D9
L2C_D0
L2T_D0
L3C_D1
L3T_D1
—
1
IO
D10
2
IO
—
2
IO
VREF_6_02
—
2
VDDIO6
IO
—
—
L4C_D3
L4T_D3
L5C_D0
L5T_D0
—
2
IO
—
3
IO
D11
3
IO
D12
—
3
VSS
IO
—
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
—
PL24B
PL24A
PL25D
PL25C
VDDIO6
PL25B
PL25A
PL26D
PL26C
VSS
PL43D
PL43C
PL44D
PL44C
VDDIO6
PL44B
PL45A
PL45D
PL45C
VSS
—
L6C_D0
L6T_D0
L7C_A0
L7T_A0
—
3
IO
—
AG4
AG5
AL3
AH3
AK1
AJ2
3
IO
VREF_6_03
3
IO
D13
—
4
VDDIO6
IO
—
—
—
4
IO
—
—
4
IO
—
L8C_D2
L8T_D2
—
AH5
AB15
AH4
4
IO
VREF_6_04
—
4
VSS
IO
—
—
6 (BL)
PL26B
PL46D
—
85
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 36. ORT8850L and ORT8850H 680-Pin PBGAM Pinout (note: pins labeled “Reserved” should be left
unconnected) (Continued)
VREF
Group
BM680
AJ3
VDDIO Bank
6 (BL)
6 (BL)
6 (BL)
—
I/O
IO
ORT8850L
PL26A
PL27D
PL27C
VSS
ORT8850H Additional Function
Pair
—
4
PL46A
PL47D
PL47C
VSS
—
AK2
AL1
4
IO
PLL_CK7C/HPPLL
L9C_D0
L9T_D0
—
4
IO
PLL_CK7T/HPPLL
AB20
AJ5
—
4
VSS
IO
—
6 (BL)
6 (BL)
—
PL27B
PL27A
VSS
PL47B
PL47A
VSS
—
L10C_A0
L10T_A0
—
AJ4
4
IO
—
AB21
AK3
AM1
AL2
—
—
—
—
—
—
—
5
VSS
I
—
—
PTEMP
VDDIO6
LVDS_R
VDD33
VSS
PTEMP
VDDIO6
LVDS_R
VDD33
VSS
PTEMP
—
6 (BL)
—
VDDIO6
IO
—
—
LVDS_R
—
AK4
AB22
AK6
AL5
—
VDD33
VSS
VDD33
IO
—
—
—
—
—
—
VDD33
PB2A
PB2B
VDDIO6
PB2C
PB2D
PB3A
PB3B
VDDIO6
PB3C
PB3D
PB4A
PB4B
VSS
VDD33
PB2A
—
—
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
—
DP2
L11T_D1
L11C_D1
—
AN4
AM2
AM5
AK7
AL6
5
IO
PB2B
—
—
5
VDDIO6
IO
VDDIO6
PB2C
PB2D
PB3C
PB3D
VDDIO6
PB4C
PB4D
PB5C
PB5D
VSS
—
PLL_CK6T/PPLL
L12T_D1
L12C_D1
L13T_D1
L13C_D1
—
5
IO
PLL_CK6C/PPLL
5
IO
—
AN5
AM4
AM6
AL7
5
IO
—
—
5
VDDIO6
IO
—
VREF_6_05
L14T_D0
L14C_D0
L15T_D3
L15C_D3
—
5
IO
DP3
AK8
AP5
AB32
AK9
AN6
AM7
AP6
AN3
AL8
6
IO
—
6
IO
—
—
6
VSS
IO
—
VREF_6_06
D14
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
—
PB4C
PB4D
PB5A
PB5B
VDDIO6
PB5C
PB5D
PB6A
PB6B
VSS
PB6C
PB6D
PB7C
PB7D
VDDIO6
PB8C
PB8D
PB9C
PB9D
VSS
L16T_D2
L16C_D2
L17T_D1
L17C_D1
—
6
IO
6
IO
—
6
IO
—
—
7
VDDIO6
IO
—
D15
L18T_D1
L18C_D1
L19T_D0
L19C_D0
—
AN7
AM8
AL9
7
IO
D16
7
IO
D17
7
IO
D18
AL4
—
7
VSS
IO
—
AP7
AN8
AL10
AP8
AL11
AM10
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
PB6C
PB6D
PB7A
PB7B
PB7C
PB7D
PB10C
PB10D
PB11C
PB11D
PB12C
PB12D
VREF_6_07
D19
L20T_D0
L20C_D0
L21T_D2
L21C_D2
L22T_D0
L22C_D0
7
IO
8
IO
D20
8
IO
D21
8
IO
VREF_6_08
D22
8
IO
86
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 36. ORT8850L and ORT8850H 680-Pin PBGAM Pinout (note: pins labeled “Reserved” should be left
unconnected) (Continued)
VREF
Group
BM680
AK12
AP9
VDDIO Bank
6 (BL)
6 (BL)
—
I/O
IO
ORT8850L
PB8A
ORT8850H Additional Function
Pair
L23T_D3
L23C_D3
—
9
PB13A
PB13B
VSS
—
9
IO
PB8B
—
AL31
AN10
AL12
AM11
AP10
AP3
—
9
VSS
IO
VSS
—
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
—
PB8C
PB13C
PB13D
PB14A
PB14B
VDDIO6
PB14C
PB14D
PB15C
PB15D
VSS
D23
L24T_D1
L24C_D1
L25T_D1
L25C_D1
—
9
IO
PB8D
D24
9
IO
PB9A
—
9
IO
PB9B
—
—
9
VDDIO6
IO
VDDIO6
PB9C
—
AK13
AN11
AL13
AK14
AM3
VREF_6_09
L26T_D2
L26C_D2
L27T_D0
L27C_D0
—
9
IO
PB9D
D25
9
IO
PB10A
PB10B
VSS
—
9
IO
—
—
10
10
10
10
10
10
11
11
—
11
11
1
VSS
IO
—
AN12
AL14
AP12
AN13
AP13
AK15
AL15
AK16
AM13
AP14
AL16
AN15
AP15
AK17
Y15
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
—
PB10C
PB10D
PB11A
PB11B
PB11C
PB11D
PB12A
PB12B
VSS
PB16C
PB16D
PB17C
PB17D
PB18C
PB18D
PB19C
PB19D
VSS
D26
L28T_D1
L28C_D1
L29T_D0
L29C_D0
L30T_D3
L30C_D3
L31T_D0
L31C_D0
—
IO
D27
IO
—
IO
—
IO
VREF_6_10
IO
D28
IO
D29
IO
D30
VSS
IO
—
6 (BL)
6 (BL)
5 (BC)
5 (BC)
5 (BC)
—
PB12C
PB12D
PB13C
PB14A
PB14B
VSS
PB20C
PB20D
PB21A
PB21C
PB21D
VSS
VREF_6_11
L32T_D2
L32C_D2
—
IO
D31
IO
—
1
IO
—
L1T_D3
L1C_D3
—
1
IO
—
—
1
VSS
IO
—
AM16
AN16
AL17
AM12
AP16
AM17
AN17
AL18
AN18
AM18
AN19
AK18
Y20
5 (BC)
5 (BC)
5 (BC)
5 (BC)
5 (BC)
5 (BC)
5 (BC)
5 (BC)
5 (BC)
5 (BC)
5 (BC)
5 (BC)
—
PB14C
PB15A
PB15B
VDDIO5
PB15C
PB15D
PB16A
PB16B
PB16C
PB16D
PB17A
PB17B
VSS
PB22A
PB22C
PB22D
VDDIO5
PB23A
PB23B
PB23C
PB23D
PB24A
PB24B
PB24C
PB24D
VSS
—
—
1
IO
VREF_5_01
L2T_D1
L2C_D1
—
1
IO
—
—
2
VDDIO5
IO
—
—
L3T_D1
L3C_D1
L4T_D1
L4C_D1
L5T_A0
L5C_A0
L6T_D2
L6C_D2
—
2
IO
—
2
IO
PBCK0T
2
IO
PBCK0C
2
IO
—
2
IO
—
2
IO
VREF_5_02
2
IO
—
—
—
—
2
VSS
IO
AM19
5 (BC)
PB17C
PB25C
L7T_A0
87
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 36. ORT8850L and ORT8850H 680-Pin PBGAM Pinout (note: pins labeled “Reserved” should be left
unconnected) (Continued)
VREF
Group
BM680
AL19
AP20
AK19
AM15
AN20
Y21
VDDIO Bank
5 (BC)
5 (BC)
5 (BC)
5 (BC)
5 (BC)
—
I/O
IO
ORT8850L
PB17D
PB18A
PB18B
VDDIO5
PB18C
VSS
ORT8850H Additional Function
Pair
L7C_A0
L8T_D3
L8C_D3
—
2
PB25D
PB26C
PB26D
VDDIO5
PB27A
VSS
—
3
IO
—
3
IO
VREF_5_03
—
3
VDDIO5
IO
—
—
—
—
3
VSS
IO
—
—
AP21
AL20
Y22
5 (BC)
5 (BC)
—
PB19A
PB19B
VSS
PB27C
PB27D
VSS
—
L9T_D2
L9C_D2
—
3
IO
—
—
3
VSS
IO
—
AK20
AN21
AM21
AM20
AK21
AP22
AL21
AA15
AN22
AP23
AN23
AA13
AK22
AL22
AN24
AK23
AA14
AL23
AM24
AP25
AN25
AP26
AK25
AN26
AP27
AM25
AK26
N32
5 (BC)
5 (BC)
5 (BC)
5 (BC)
5 (BC)
5 (BC)
5 (BC)
—
PB19C
PB20A
PB20B
VDDIO5
PB20C
PB21A
PB21B
VSS
PB28A
PB28C
PB28D
VDDIO5
PB29A
PB29C
PB29D
VSS
—
—
3
IO
PBCK1T
L10T_A0
L10C_A0
—
3
IO
PBCK1C
—
3
VDDIO5
IO
—
—
—
4
IO
—
L11T_D2
L11C_D2
—
4
IO
—
—
4
VSS
IO
—
5 (BC)
5 (BC)
5 (BC)
—
PB21C
PB22A
PB22B
VSS
PB30A
PB30C
PB30D
VSS
—
—
4
IO
—
L12T_A0
L12C_A0
—
4
IO
VREF_5_04
—
4
VSS
IO
—
5 (BC)
5 (BC)
5 (BC)
5 (BC)
—
PB22C
PB22D
PB23C
PB23D
VSS
PB31C
PB31D
PB32C
PB32D
VSS
—
L13T_A0
L13C_A0
L14T_D2
L14C_D2
—
4
IO
—
5
IO
—
5
IO
VREF_5_05
—
5
VSS
IO
—
5 (BC)
5 (BC)
5 (BC)
5 (BC)
5 (BC)
5 (BC)
5 (BC)
5 (BC)
5 (BC)
5 (BC)
—
PB24C
PB24D
PB25A
PB25B
PB25C
PB26A
PB26B
PB26C
PB27A
PB27B
VSS
PB33C
PB33D
PB34C
PB34D
PB35A
PB35C
PB35D
PB36A
PB36C
PB36D
VSS
—
L15T_D0
L15C_D0
L16T_A0
L16T_A0
—
5
IO
—
5
IO
—
5
IO
—
6
IO
—
6
IO
—
L17T_A0
L17C_A0
—
6
IO
VREF_5_06
6
IO
—
—
—
—
—
—
—
—
—
6
IO
L18T_D3
L18C_D3
—
6
IO
—
—
—
—
—
—
VSS
O
AL24
AK24
A32
—
TXDAA_P_N TXDAA_P_N
TXDAA_P_P TXDAA_P_P
L1N_A0
L1P_A0
—
—
O
—
VDD33
O
VDD33
VDD33
AN27
AP28
—
TXDAB_P_N TXDAB_P_N
TXDAB_P_P TXDAB_P_P
L2N_D0
L2P_D0
—
O
88
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 36. ORT8850L and ORT8850H 680-Pin PBGAM Pinout (note: pins labeled “Reserved” should be left
unconnected) (Continued)
VREF
BM680
P13
VDDIO Bank
—
Group
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
I/O
ORT8850L
ORT8850H Additional Function
VSS
Pair
—
VSS
VSS
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
AL25
AL26
B32
—
O
TXDAC_P_N TXDAC_P_N
TXDAC_P_P TXDAC_P_P
L3N_A0
L3P_A0
—
—
O
—
VDD33
VDD33
VDD33
AM26
AM27
P14
—
O
TXDAD_P_N TXDAD_P_N
TXDAD_P_P TXDAD_P_P
L4N_A0
L4P_A0
—
—
O
—
VSS
VSS
VSS
AN28
AP29
C31
—
O
Reserved
Reserved
VDD33
Reserved
Reserved
VDD33
L5N_D0
L5P_D0
—
—
O
—
VDD33
AL27
AK27
P15
—
O
TXCLK_P_N TXCLK_P_N
TXCLK_P_P TXCLK_P_P
L6N_A0
L6P_A0
—
—
O
—
VSS
VSS
VSS
AL28
AK28
C33
—
O
TXDBA_P_N TXDBA_P_N
TXDBA_P_P TXDBA_P_P
L7N_A0
L7P_A0
—
—
O
—
VDD33
VDD33
VDD33
AM28
AN29
P20
—
O
TXDBB_P_N TXDBB_P_N
TXDBB_P_P TXDBB_P_P
L8N_D0
L8P_D0
—
—
O
—
VSS
VSS
VSS
AL29
AK29
C34
—
O
TXDBC_P_N TXDBC_P_N
TXDBC_P_P TXDBC_P_P
L9N_A0
L9P_A0
—
—
O
—
VDD33
VDD33
VDD33
AP30
AN30
P21
—
O
TXDBD_P_N TXDBD_P7_N
TXDBD_P_P TXDBD_P_P
L10N_D0
L10P_D0
—
—
O
—
VSS
VSS
VSS
AM29
AP31
D32
—
I
DAUTREC
TSTCLK
VDD33
DAUTREC
TSTCLK
VDD33
—
—
I
—
—
VDD33
—
AM30
AN31
P22
—
I
TESTRST
TESTRST
—
—
I
TSTSHFTLD TSTSHFTLD
—
—
VSS
VSS
VSS
VSS
VSS
—
R13
—
VSS
—
R14
—
VSS
VSS
VSS
—
E30
—
VDD33
VDD33
RESETTX
VDD33
ETOGGLE
ELSEL
VSS
VDD33
RESETTX
VDD33
ETOGGLE
ELSEL
VSS
—
AL30
E31
—
I
—
—
VDD33
—
AH30
AJ30
R15
—
I
—
—
I
—
—
VSS
—
AL33
AH31
L34
—
I
EXDNUP
MRESET
VDD33
EXDNUP
MRESET
VDD33
—
—
I
—
—
VDD33
—
89
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 36. ORT8850L and ORT8850H 680-Pin PBGAM Pinout (note: pins labeled “Reserved” should be left
unconnected) (Continued)
VREF
BM680
AK32
AJ31
R20
VDDIO Bank
—
Group
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
I/O
ORT8850L
ORT8850H Additional Function
Pair
L11N_D0
L11P_D0
—
I
RXDAA_P_N RXDAA_P_N
RXDAA_P_P RXDAA_P_P
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
I
—
VSS
VSS
VSS
AL34
AK33
AJ32
M32
—
I
RXDAB_P_N RXDAB_P_N
RXDAB_P_P RXDAB_P_P
LVCTAP_P_0 LVCTAP_P_0
L12N_D0
L12P_D0
—
—
I
—
I
—
VDD33
VDD33
VDD33
—
AF30
AG30
R21
—
I
RXDAC_P_N RXDAC_P_N
RXDAC_P_P RXDAC_P_P
L13N_A0
L13P_A0
—
—
I
—
VSS
VSS
VSS
AG31
AF31
AK34
R32
—
I
RXDAD_P_P RXDAD_P_N
RXDAD_P_P RXDAD_P_P
LVCTAP_P_1 LVCTAP_P_1
L14N_A0
L14P_A0
—
—
I
—
I
—
VDD33
VDD33
Reserved
Reserved
VSS
VDD33
Reserved
Reserved
VSS
—
AJ33
AH32
R22
—
I
L15N_A0
L15P_A0
—
—
I
—
VSS
AJ34
AH33
AD30
U34
—
I
Reserved
Reserved
Reserved
Reserved
L16N_D0
L16P_D0
—
—
I
—
I
LVCTAP_P_2 LVCTAP_P_2
VDD33 VDD33
—
VDD33
—
AG32
AG33
T16
—
I
RXDBA_P_N RXDBA_P_N
RXDBA_P_P RXDBA_P_P
L17N_A0
L17P_A0
—
—
I
—
VSS
VSS
VSS
AH34
AE30
AE31
W34
—
I
LVCTAP_P_3 LVCTAP_P_3
RXDBB_P_N RXDBB_P_N
RXDBB_P_P RXDBB_P_P
—
—
I
L18N_A0
L18P_A0
—
—
I
—
VDD33
VDD33
VDD33
AF32
AF33
T17
—
I
RXDBC_P_N RXDBC_P_N
RXDBC_P_P RXDBC_P_P
L19N_A0
L19P_A0
—
—
I
—
VSS
VSS
VSS
AC30
AG34
AF34
Y32
—
I
LVCTAP_P_4 LVCTAP_P_4
RXDBD_P_N RXDBD_P_N
RXDBD_P_P RXDBD_P_P
—
—
I
L20N_A0
L20P_A0
—
—
I
—
VDD33
VDD33
VDDA_STM
VSSA_STM
VSS
VDD33
VDDA_STM
VSSA_STM
VSS
AB30
AD31
T18
—
VDDA_STM
—
—
VSSA_STM
—
—
VSS
—
AE32
AE33
AC32
AE34
—
I
SYS_CLK_N SYS_CLK_N
SYS_CLK_P SYS_CLK_P
L21N_D0
L21P_D0
—
—
I
VDD33
O
—
VDD33
VDD33
—
LVCTAP_SK LVCTAP_SK
—
90
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 36. ORT8850L and ORT8850H 680-Pin PBGAM Pinout (note: pins labeled “Reserved” should be left
unconnected) (Continued)
VREF
BM680
T19
VDDIO Bank
—
Group
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
I/O
ORT8850L
ORT8850H Additional Function
VSS
Pair
—
VSS
VSS
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
AC31
AB31
T34
—
I
RXDAA_W_N RXDAA_W_N
RXDAA_W_P RXDAA_W_P
L22N_A0
L22P_A0
—
—
I
—
VSS
VSS
VSS
AD32
AD33
AA30
AD34
AC33
AC34
U16
—
I
RXDAB_W_N RXDAB_W_N
RXDAB_W_P RXDAB_W_P
LVCTAP_W_0 LVCTAP_W_0
L23N_A0
L23P_A0
—
—
I
—
I
—
VDD33
VDD33
VDD33
—
—
I
RXDAC_W_N RXDAC_W_N
RXDAC_W_P RXDAC_W_P
L24N_A0
L24P_A0
—
—
I
—
VSS
VSS
VSS
AB33
AB34
Y30
—
I
RXDAD_W_N RXDAD_W_N
RXDAD_W_P RXDAD_W_P
LVCTAP_W_1 LVCTAP_W_1
L25N_A0
L25P_A0
—
—
I
—
I
AK30
AA31
AA32
U17
—
VDD33
VDD33
Reserved
Reserved
VSS
VDD33
Reserved
Reserved
VSS
—
—
I
L26N_A0
L26P_A0
—
—
I
—
VSS
W30
Y31
—
I
Reserved
Reserved
Reserved
Reserved
L27N_D0
L27P_D0
—
—
I
AA33
AK31
AA34
Y34
—
I
LVCTAP_W_2 LVCTAP_W_2
VDD33 VDD33
—
VDD33
—
—
I
RXDBA_W_N RXDBA_W_N
RXDBA_W_P RXDBA_W_P
L28N_A0
L28P_A0
—
—
I
U18
—
VSS
VSS
VSS
Y33
—
I
LVCTAP_W_3 LVCTAP_W_3
RXDBB_W_N RXDBB_W_N
RXDBB_W_P RXDBB_W_P
—
W31
W32
AL32
V30
—
I
L29N_A0
L29P_A0
—
—
I
—
VDD33
VDD33
VDD33
—
I
RXDBC_W_N RXDBC_W_N
RXDBC_W_P RXDBC_W_P
L30N_A0
L30P_A0
—
V31
—
I
U19
—
VSS
VSS
VSS
W33
V32
—
I
LVCTAP_W_4 LVCTAP_W_4
RXDBD_W_N RXDBD_W_N
RXDBD_W_P RXDBD_W_P
—
—
I
L31N_A0
L31P_A0
—
V33
—
I
V1
—
VSS
VSS
VSS
U33
—
I
RESLO
RESHI
REF14
REF10
VDD33
VSS
RESLO
RESHI
REF14
REF10
VDD33
VSS
—
U32
—
I
—
U31
—
I
I
—
T33
—
—
AM31
V16
—
VDD33
VSS
—
—
—
91
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 36. ORT8850L and ORT8850H 680-Pin PBGAM Pinout (note: pins labeled “Reserved” should be left
unconnected) (Continued)
VREF
BM680
T32
VDDIO Bank
—
Group
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
I/O
ORT8850L
ORT8850H Additional Function
Pair
L32N_D1
L32P_D1
—
O
TXDAA_W_N TXDAA_W_N
TXDAA_W_P TXDAA_W_P
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
R34
AM33
U30
T31
—
O
—
VDD33
VDD33
VDD33
—
O
TXDAB_W_N TXDAB_W_N
TXDAB_W_P TXDAB_W_P
L33N_D0
L33P_D0
—
—
O
V17
R33
P34
AM34
P33
N34
V18
T30
—
VSS
VSS
VSS
—
O
TXDAC_W_N TXDAC_W_N
TXDAC_W_P TXDAC_W_P
L34N_D0
L34P_D0
—
—
O
—
VDD33
VDD33
VDD33
—
O
TXDAD_W_N TXDAD_W_N
TXDAD_W_P TXDAD_W_P
L35N_D0
L35P_D0
—
—
O
—
VSS
VSS
VSS
—
O
Reserved
Reserved
VDD33
Reserved
Reserved
VDD33
L36N_D0
L36P_D0
—
R31
AN32
P32
R30
V19
N33
M34
AP32
P31
M33
V34
N31
P30
L33
—
O
—
VDD33
—
O
Reserved
Reserved
VSS
Reserved
Reserved
VSS
L37N_D1
L37P_D1
—
—
O
—
VSS
—
O
TXDBA_W_N TXDBA_W_N
TXDBA_W_P TXDBA_W_P
L38N_D0
L38P_D0
—
—
O
—
VDD33
VDD33
VDD33
—
O
TXDBB_W_N TXDBB_W_N
TXDBB_W_P TXDBB_W_P
L39N_D1
L39P_D1
—
—
O
—
VSS
VSS
VSS
—
O
TXDBC_W_N TXDBC_W_N
TXDBC_W_P TXDBC_W_P
TXDBD_W_N TXDBD_W_N
TXDBD_W_P TXDBD_W_P
L40N_D0
L40P_D0
L41N_D0
L41P_D0
—
—
O
—
O
K34
W16
M31
L32
—
O
—
VSS
VSS
VSS
—
I
Reserved
Reserved
Reserved
VSS
Reserved
Reserved
Reserved
VSS
L42N_D0
L42P_D0
—
—
I
K33
W17
N30
L30
—
I
—
VSS
—
—
VDDA_PDI
Reserved
Reserved
VSS
Reserved
Reserved
VSS
—
—
VSSA_PDI
—
W18
M30
L31
—
VSS
—
—
I
Reserved
Reserved
VSS
Reserved
Reserved
VSS
L43N_D0
L43P_D0
—
—
I
W19
J34
—
VSS
—
I
I
I
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
L44N_D1
L44P_D1
—
K32
J33
—
—
92
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 36. ORT8850L and ORT8850H 680-Pin PBGAM Pinout (note: pins labeled “Reserved” should be left
unconnected) (Continued)
VREF
BM680
H34
J32
VDDIO Bank
Group
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
I/O
ORT8850L
Reserved
Reserved
VSS
ORT8850H Additional Function
Pair
L45N_D1
L45P_D1
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
I
Reserved
Reserved
VSS
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
I
Y13
K31
K30
H33
J31
VSS
I
Reserved
Reserved
Reserved
Reserved
Reserved
VSS
Reserved
Reserved
Reserved
Reserved
Reserved
VSS
L46N_A0
L46P_A0
—
I
I
I
L47N_A0
L47P_A0
—
J30
I
Y14
G34
H32
H31
G33
F34
H30
G32
F33
G30
G31
E34
F32
E33
F31
E32
D34
D33
F30
D30
E29
C30
B31
D29
B30
VSS
I
I
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
TSTMUX0S
TSTMUX1S
TSTMUX2S
TSTMUX3S
TSTMUX4S
TSTMUX5S
TSTMUX6S
TSTMUX7S
TSTMUX8S
TSTMUX9S
SCANEN
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
TSTMUX0S
TSTMUX1S
TSTMUX2S
TSTMUX3S
TSTMUX4S
TSTMUX5S
TSTMUX6S
TSTMUX7S
TSTMUX8S
TSTMUX9S
SCANEN
L48N_D1
L48P_D1
—
I
I
L49N_D0
L49P_D0
—
I
I
I
L50N_D0
L50P_D0
L51N_A0
L51P_A0
—
I
I
I
I
I
L52N_A0
L52P_A0
—
I
O
O
O
O
O
O
O
O
O
O
I
—
—
—
—
—
—
—
—
—
—
SCAN_TSTM SCAN_TSTM
A31
—
—
I
—
—
D
D
B29
E28
C29
D28
E27
A30
C28
B28
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
I
RST_N
RST_N
—
—
—
—
—
—
—
—
—
O
O
O
O
O
O
O
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
L53N_D1
L53P_D1
L54N_D0
L54P_D0
L55N_D1
L55P_D1
L56N_D0
93
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 36. ORT8850L and ORT8850H 680-Pin PBGAM Pinout (note: pins labeled “Reserved” should be left
unconnected) (Continued)
VREF
BM680
A29
D27
E26
C27
D26
A28
B27
C26
D25
A27
B26
D24
C25
C22
A26
E25
A25
B25
C24
D23
C32
B24
E24
D22
B23
E23
A23
D21
B22
D4
VDDIO Bank
—
Group
—
—
—
—
—
—
—
—
—
—
—
—
—
—
1
I/O
O
ORT8850L
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
VSS
ORT8850H Additional Function
Pair
L56P_D0
L57N_D0
L57P_D0
L58N_D0
L58P_D0
L59N_D0
L59P_D0
L60N_D0
L60P_D0
L61N_D0
L61P_D0
L62N_D0
L62P_D0
—
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
VSS
—
—
O
—
—
O
—
—
O
—
—
O
—
—
O
—
—
O
—
—
O
—
—
O
—
—
O
—
—
O
—
—
O
—
—
O
—
—
VSS
IO
IO
IO
IO
IO
IO
VSS
IO
IO
IO
IO
IO
IO
IO
IO
VSS
IO
IO
IO
IO
IO
VSS
IO
IO
IO
VDDIO1
IO
IO
—
1 (TC)
1 (TC)
1 (TC)
1 (TC)
1 (TC)
1 (TC)
—
PT26D
PT26C
PT26B
PT35D
PT35C
PT35B
PT35A
PT34D
PT34C
VSS
—
L1C_D3
L1T_D3
L2C_A0
L2T_A0
L3C_D0
L3T_D0
—
1
—
1
—
1
PT26A
—
1
PT25D
PT25C
VSS
VREF_1_01
1
—
—
1
—
1 (TC)
1 (TC)
1 (TC)
1 (TC)
1 (TC)
1 (TC)
1 (TC)
1 (TC)
—
PT25B
PT33D
PT33C
PT32D
PT32C
PT31D
PT31C
PT30D
PT30C
VSS
—
L4C_A2
L4T_A2
L5C_D1
L5T_D1
L6C_A3
L6T_A3
L7C_D1
L7T_D1
—
1
PT25A
—
2
PT24D
PT24C
PT24B
—
2
VREF_1_02
2
—
2
PT24A
—
2
PT23D
PT23C
VSS
—
2
—
—
3
—
A22
C21
E22
D20
B21
D31
E21
A21
B20
A11
A20
E20
1 (TC)
1 (TC)
1 (TC)
1 (TC)
1 (TC)
—
PT22D
PT22C
PT22A
PT29D
PT29C
PT29A
PT28D
PT28C
VSS
—
L8C_D1
L8T_D1
—
3
VREF_1_03
3
—
—
—
—
—
—
—
—
—
—
3
PT21D
PT21C
VSS
L9C_D1
L9T_D1
—
3
—
3
1 (TC)
1 (TC)
1 (TC)
1 (TC)
1 (TC)
1 (TC)
PT21A
PT28A
PT27D
PT27C
VDDIO1
PT27A
PT26D
—
3
PT20D
PT20C
VDDIO1
PT20A
L10C_D0
L10T_D0
—
3
—
3
—
4
PT19D
L11C_D0
94
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 36. ORT8850L and ORT8850H 680-Pin PBGAM Pinout (note: pins labeled “Reserved” should be left
unconnected) (Continued)
VREF
Group
BM680
D19
C19
B19
N3
VDDIO Bank
1 (TC)
1 (TC)
1 (TC)
—
I/O
IO
ORT8850L
PT19C
PT19B
PT19A
VSS
ORT8850H Additional Function
Pair
L11T_D0
L12C_A0
L12T_A0
—
4
PT26C
PT25D
PT25C
VSS
—
4
IO
—
4
IO
—
—
4
VSS
IO
—
E19
D18
A17
B18
C18
B17
C17
N13
A16
D17
B16
C16
D16
E18
A15
A19
B15
D15
A14
N14
B14
E17
C14
D14
N15
E16
A13
B13
A12
B12
D13
A34
E15
B11
A10
E14
A3
1 (TC)
1 (TC)
1 (TC)
1 (TC)
1 (TC)
1 (TC)
1 (TC)
—
PT18D
PT18C
VDDIO1
PT18B
PT18A
PT17D
PT17C
VSS
PT24D
PT24C
VDDIO1
PT24B
PT24A
PT23D
PT23C
VSS
—
L13C_D0
L13T_D0
—
4
IO
VREF_1_04
—
4
VDDIO1
IO
—
—
L14C_A0
L14T_A0
L15C_A0
L15T_A0
—
4
IO
—
5
IO
PTCK1C
5
IO
PTCK1T
—
5
VSS
IO
—
1 (TC)
1 (TC)
1 (TC)
1 (TC)
1 (TC)
1 (TC)
1 (TC)
1 (TC)
1 (TC)
1 (TC)
1 (TC)
—
PT17B
PT17A
PT16D
PT16C
PT16A
PT15D
PT15C
VDDIO1
PT15A
PT14D
PT14C
VSS
PT23B
PT23A
PT22D
PT22C
PT22A
PT21D
PT21C
VDDIO1
PT21A
PT20D
PT20C
VSS
—
L16C_D2
L16T_D2
L17C_A0
L17T_A0
—
5
IO
—
5
IO
PTCK0C
5
IO
PTCK0T
5
IO
—
5
IO
VREF_1_05
L18C_D3
L18T_D3
—
5
IO
—
—
5
VDDIO1
IO
—
—
—
6
IO
—
L19C_D2
L19T_D2
—
6
IO
—
—
6
VSS
IO
—
1 (TC)
1 (TC)
1 (TC)
1 (TC)
—
PT14A
PT13D
PT13C
PT13A
VSS
PT20A
PT19D
PT19C
PT19A
VSS
—
—
6
IO
—
L20C_D2
L20T_D2
—
6
IO
VREF_1_06
6
IO
—
—
1
VSS
IO
—
—
0 (TL)
0 (TL)
0 (TL)
0 (TL)
0 (TL)
0 (TL)
—
PT11D
PT11C
PT11B
PT11A
PT10D
PT10C
VSS
PT18D
PT18C
PT17D
PT17C
PT16D
PT16C
VSS
MPI_RTRY_N
L1C_D3
L1T_D3
L2C_D0
L2T_D0
L3C_D1
L3T_D1
—
1
IO
MPI_ACK_N
1
IO
—
1
IO
VREF_0_01
1
IO
M0
1
IO
M1
—
2
VSS
IO
—
0 (TL)
0 (TL)
0 (TL)
0 (TL)
0 (TL)
0 (TL)
PT10B
PT10A
PT9D
PT15D
PT15C
PT14D
PT14C
VDDIO0
PT13D
MPI_CLK
L4C_D3
L4T_D3
L5C_D3
L5T_D3
—
2
IO
A21/MPI_BURST_N
2
IO
M2
M3
2
IO
PT9C
—
2
VDDIO0
IO
VDDIO0
PT9B
—
D12
VREF_0_02
L6C_D0
95
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 36. ORT8850L and ORT8850H 680-Pin PBGAM Pinout (note: pins labeled “Reserved” should be left
unconnected) (Continued)
VREF
Group
BM680
C11
B10
A9
VDDIO Bank
0 (TL)
0 (TL)
0 (TL)
0 (TL)
0 (TL)
0 (TL)
0 (TL)
—
I/O
IO
ORT8850L
PT9A
PT8D
PT8C
PT8B
PT8A
PT7D
PT7C
VSS
ORT8850H Additional Function
Pair
2
PT13C
PT12D
PT12C
PT11D
PT11C
PT10D
PT10C
VSS
MPI_TEA_N
L6T_D0
L7C_D0
L7T_D0
L8C_D0
L8T_D0
L9C_D2
L9T_D2
—
3
IO
—
3
IO
—
C10
B9
3
IO
VREF_0_03
3
IO
—
A8
3
IO
D0
D10
B1
3
IO
TMS
—
4
VSS
IO
—
C9
0 (TL)
0 (TL)
0 (TL)
0 (TL)
0 (TL)
0 (TL)
0 (TL)
0 (TL)
0 (TL)
—
PT7B
PT7A
PT6D
PT6C
VDDIO0
PT6B
PT6A
PT5D
PT5C
VSS
PT9D
PT9C
PT8D
PT8C
VDDIO0
PT7D
PT7C
PT6D
PT6C
VSS
A20/MPI_BDIP_N
L10C_D0
L10T_D0
L11C_D4
L11T_D4
—
B8
4
IO
A19/MPI_TSZ1
A7
4
IO
A18/MPI_TSZ0
E12
B3
4
IO
D3
—
4
VDDIO0
IO
—
D9
VREF_0_04
L12C_D0
L12T_D0
L13C_D3
L13T_D3
—
C8
4
IO
—
E11
B7
5
IO
D1
5
IO
D2
B2
—
5
VSS
IO
—
A6
0 (TL)
0 (TL)
0 (TL)
0 (TL)
0 (TL)
0 (TL)
0 (TL)
0 (TL)
0 (TL)
—
PT5B
PT5A
PT4D
PT4C
VDDIO0
PT4B
PT4A
PT3D
PT3C
VSS
PT5D
PT5C
PT4D
PT4C
VDDIO0
PT4B
PT4A
PT3D
PT3C
VSS
—
L14C_D2
L14T_D2
L15C_D1
L15T_D1
—
D8
5
IO
VREF_0_05
C7
5
IO
TDI
A5
5
IO
TCK
C1
—
5
VDDIO0
IO
—
E10
D7
—
L16C_D2
L16T_D2
L17C_D4
L17T_D4
—
5
IO
—
A4
6
IO
—
E9
6
IO
VREF_0_06
B33
B6
—
6
VSS
IO
—
0 (TL)
0 (TL)
0 (TL)
0 (TL)
0 (TL)
0 (TL)
0 (TL)
PT3B
PT3A
PT2D
PT2C
VDDIO0
PT2B
PT2A
PT3B
PT3A
PT2D
PT2C
VDDIO0
PT2B
PT2A
—
L18C_A0
L18T_A0
L19C_D1
L19T_D1
—
C6
6
IO
—
B5
6
IO
PLL_CK1C/PPLL
D6
6
IO
PLL_CK1T/PPLL
C2
—
6
VDDIO0
IO
—
—
—
C5
L20C_D0
L20T_D0
B4
6
IO
PCFG_MPI_IR PCFG_MPI_IR CFG_IRQ_N/MPI_IR
Q_N
E8
—
—
O
—
Q
Q
96
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 36. ORT8850L and ORT8850H 680-Pin PBGAM Pinout (note: pins labeled “Reserved” should be left
unconnected) (Continued)
VREF
BM680
E7
VDDIO Bank
—
Group
—
—
—
—
—
—
—
10
10
3
I/O
IO
ORT8850L
PCCLK
ORT8850H Additional Function
Pair
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
PCCLK
PDONE
VDD33
VSS
CCLK
DONE
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
D5
—
IO
PDONE
VDD33
E6
—
VDD33
VSS
B34
A24
AM23
AP1
K4
—
VSS
1 (TC)
5 (BC)
—
VDDIO1
VDDIO5
VSS
VDDIO1
VDDIO5
VSS
VDDIO1
VDDIO5
VSS
0 (TL)
0 (TL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
7 (CL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
6 (BL)
0 (TL)
0 (TL)
6 (BL)
7 (CL)
7 (CL)
7 (CL)
5 (BC)
5 (BC)
5 (BC)
5 (BC)
1 (TC)
1 (TC)
1 (TC)
1 (TC)
—
IO
UNUSED
UNUSED
UNUSED
UNUSED
UNUSED
UNUSED
UNUSED
UNUSED
UNUSED
UNUSED
UNUSED
UNUSED
UNUSED
UNUSED
UNUSED
UNUSED
UNUSED
UNUSED
UNUSED
VDDIO7
VDDIO7
VDDIO7
VDDIO5
VDDIO5
VDDIO5
VDDIO5
VDDIO1
VDDIO1
VDDIO1
VDDIO1
VDD15
PL11A
PL13A
PL20A
PL21A
PL27A
PL28A
PL29A
PL35A
PL37A
PL38A
PB9A
M5
IO
R5
IO
T5
3
IO
W4
5
IO
AA2
Y4
6
IO
6
IO
AC4
AD5
AG1
AK10
AK11
AM9
AN9
AM14
AN14
D11
E13
AP4
Y3
8
IO
8
IO
1
IO
7
IO
7
IO
PB10A
PB11A
PB12A
PB19A
PB20A
PT12A
PT11A
PB3A
8
IO
8
IO
11
11
3
IO
IO
IO
3
IO
5
IO
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
VDDIO7
VDDIO7
VDDIO7
VDDIO5
VDDIO5
VDDIO5
VDDIO5
VDDIO1
VDDIO1
VDDIO1
VDDIO1
VDD15
VDD15
VDD15
VDD15
VDD15
VDDIO7
VDDIO7
VDDIO7
VDDIO5
VDDIO5
VDDIO5
VDDIO5
VDDIO1
VDDIO1
VDDIO1
VDDIO1
VDD15
VDD15
VDD15
VDD15
VDD15
AC3
AD1
AP11
AP17
AP19
AP24
C12
C15
C20
C23
W22
Y16
V22
U22
T22
—
VDD15
—
VDD15
—
VDD15
—
VDD15
97
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 36. ORT8850L and ORT8850H 680-Pin PBGAM Pinout (note: pins labeled “Reserved” should be left
unconnected) (Continued)
VREF
BM680
P17
VDDIO Bank
—
Group
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
I/O
ORT8850L
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
ORT8850H Additional Function
Pair
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
VDD15
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
P18
—
N16
N17
N18
N19
P16
—
—
—
—
—
P19
—
R16
R17
R18
R19
T13
—
—
—
—
—
T14
—
T15
—
T20
—
T21
—
U13
U14
U15
U20
U21
V13
—
—
—
—
—
—
V14
—
V15
—
V20
—
V21
—
W13
W14
W15
W20
W21
Y17
—
—
—
—
—
—
Y18
—
Y19
—
AA16
AA17
AA18
AA19
AB16
AB17
AB18
—
—
—
—
—
—
—
98
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 36. ORT8850L and ORT8850H 680-Pin PBGAM Pinout (note: pins labeled “Reserved” should be left
unconnected) (Continued)
VREF
Group
BM680
C3
VDDIO Bank
I/O
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VDD15
VSS
ORT8850L
VSS
ORT8850H Additional Function
Pair
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VDD15
VSS
—
—
—
—
—
—
—
—
—
—
—
—
—
—
C13
—
VSS
AP2
—
VSS
AP18
AP33
AP34
AA20
AA21
AA22
N21
—
VSS
—
VSS
—
VSS
—
VSS
—
VSS
—
VSS
—
VSS
N22
—
VSS
AB3
—
VSS
AB19
N20
—
VDD15
VSS
—
Note: Pins labeled “reserved” should be left unconnected.
99
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Package Thermal Characteristics Summary
There are three thermal parameters that are in common use: θJA, ψJC, and θJC. It should be noted that all the param-
eters are affected, to varying degrees, by package design (including paddle size) and choice of materials, the
amount of copper in the test board or system board, and system airflow.
θJA
This is the thermal resistance from junction to ambient (theta-JA, R-theta, etc.).
T - T
J
A
(1)
=
θ
JA
Q
where TJ is the junction temperature, TA, is the ambient air temperature, and Q is the chip power.
Experimentally, θJA is determined when a special thermal test die is assembled into the package of interest, and
the part is mounted on the thermal test board. The diodes on the test chip are separately calibrated in an oven. The
package/board is placed either in a JEDEC natural convection box or in the wind tunnel, the latter for forced con-
vection measurements. A controlled amount of power (Q) is dissipated in the test chip’s heater resistor, the chip’s
temperature (TJ) is determined by the forward drop on the diodes, and the ambient temperature (TA) is noted. Note
that θJA is expressed in units of °C/watt.
ΨJC
This JEDEC designated parameter correlates the junction temperature to the case temperature. It is generally
used to infer the junction temperature while the device is operating in the system. It is not considered a true thermal
resistance, and it is defined by:
T - T
J
C
(2)
=
Ψ
JC
Q
where TC is the case temperature at top dead center, TJ is the junction temperature, and Q is the chip power. Dur-
ing the θJA measurements described above, besides the other parameters measured, an additional temperature
ψ
reading, TC, is made with a thermocouple attached at top-dead-center of the case. JC is also expressed in units of
°C/W.
θJC
This is the thermal resistance from junction to case. It is most often used when attaching a heat sink to the top of
the package. It is defined by:
T - T
J
C
(3)
=
θ
JC
Q
The parameters in this equation have been defined above. However, the measurements are performed with the
case of the part pressed against a water-cooled heat sink to draw most of the heat generated by the chip out the
ψ
top of the package. It is this difference in the measurement process that differentiates θJC from JC. θJC is a true
thermal resistance and is expressed in units of °C/W.
θJB
This is the thermal resistance from junction to board (ΘJL). It is defined by:
T - T
J
B
(4)
=
θ
JB
Q
where TB is the temperature of the board adjacent to a lead measured with a thermocouple. The other parameters
on the right-hand side have been defined above. This is considered a true thermal resistance, and the measure-
ment is made with a water-cooled heat sink pressed against the board to draw most of the heat out of the leads.
Note that θJB is expressed in units of °C/W and that this parameter and the way it is measured are still being dis-
cussed by the JEDEC committee.
100
Lattice Semiconductor
ORCA ORT8850 Data Sheet
FPSC Maximum Junction Temperature
Once the power dissipated by the FPSC has been determined, the maximum junction temperature of the FPSC
can be found. This is needed to determine if speed derating of the device from the 85 °C junction temperature used
in all of the delay tables is needed. Using the maximum ambient temperature, TAmax, and the power dissipated by
the device, Q (expressed in °C), the maximum junction temperature is approximated by:
TJmax = TAmax + (Q • θJA)
Table 37 lists the thermal characteristics for the package used with the ORCA ORT8850 Series of FPSCs.
Package Thermal Characteristics
Table 37. ORCA ORT8850 Plastic Package Thermal Guidelines
Θ
JA (°C/W)
Maximum Power (W)
T = 70 °C Max,TJ = 125 °C Max, 0 fpm
4.10
Package
680-Pin PBGAM*
0 fpm
200 fpm
500 fpm
13.4
11.5
10.5
*
The 680-Pin PBGAM package includes 2 oz. copper plates.
Heat Sink Information
The estimated worst-case power requirements for the ORT8850 are in the 4 W to 5 W range. Consequently, for
most applications an external heat sink will be required. The following table lists, in alphabetical order, heat sink
vendors who advertise heat sinks aimed at the BGA market.
Table 38. Heat Sink Vendors
Vendor
Location
Concord, NH
Phone
(603) 224-9988
Aavid Thermalloy
Chip Coolers (Tyco Electronics)
IERC (CTS Corp.)
R-Theta
Harrisburg, PA
Burbank, CA
Buffalo, NY
(800) 468-2023
(818) 842-7277
(800) 388-5428
(310) 783-5400
(603) 635-2800
Sanyo Denki
Torrance, CA
Pelham, NH
Wakefield Thermal Solutions
Package Coplanarity
The coplanarity limits of the Lattice packages are as follows:
• PBGAM: 8.0 mils
101
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Package Parasitics
The electrical performance of an IC package, such as signal quality and noise sensitivity, is directly affected by the
package parasitics. Table 39 lists eight parasitics associated with the ORCA packages. These parasitics represent
the contributions of all components of a package, which include the bond wires, all internal package routing, and
the external leads.
Four inductances in nH are listed: LSW and LSL, the self-inductance of the lead; and LMW and LML, the mutual
inductance to the nearest neighbor lead. These parameters are important in determining ground bounce noise and
inductive crosstalk noise. Three capacitances in pF are listed: CM, the mutual capacitance of the lead to the near-
est neighbor lead; and C1 and C2, the total capacitance of the lead to all other leads (all other leads are assumed
to be grounded). These parameters are important in determining capacitive crosstalk and the capacitive loading
effect of the lead. Resistance values are in mΩ.
The parasitic values in Table 39 are for the circuit model of bond wire and package lead parasitics. If the mutual
capacitance value is not used in the designer’s model, then the value listed as mutual capacitance should be
added to each of the C1 and C2 capacitors.
Table 39. ORCA ORT8850 Package Parasitics
Package Type
LSW
LMW
RW
C1
C2
CM
LSL
LML
680-Pin PBGAM
3.8
1.3
250
1.0
1.0
0.3
2.8 - 5.0
0.5 - 1.0
Figure 39. Package Parasitics
LSW
RW
LSL
PAD N
Pad N
Circuit
Board Pads
C1
C2
Package
Pads
LMW
LSW
LML
LSL
CM
PAD N + 1
Pad N+1
RW
C1
C2
Package Outline Diagrams
Terms and Definitions
Basic Size (BSC): The basic size of a dimension is the size from which the limits for that dimension are derived by
the application of the allowance and the tolerance.
Design Size: The design size of a dimension is the actual size of the design, including an allowance for fit and tol-
erance.
Typical (TYP): When specified after a dimension, this indicates the repeated design size if a tolerance is specified
or repeated basic size if a tolerance is not specified.
Reference (REF): The reference dimension is an untoleranced dimension used for informational purposes only. It
is a repeated dimension or one that can be derived from other values in the drawing.
Minimum (MIN) or Maximum (MAX): Indicates the minimum or maximum allowable size of a dimension.
102
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Package Outline Drawings
Figure 40. 680-Pin PBGAM Outline Drawings
Dimensions are in millimeters.
35.00
+ 0.70
– 0.00
30.00
A1 BALL
IDENTIFIER ZONE
35.00
+ 0.70
30.00
– 0.00
1.170
0.61 0.08
SEATING PLANE
0.20
SOLDER BALL
33 SPACES @ 1.00 = 33.00
2.51 MAX
0.50 0.10
AP
AM
AK
AH
AF
AD
AB
Y
AN
AL
AJ
AG
AE
AC
AA
W
U
0.64 0.15
33 SPACES
@ 1.00 = 33.00
V
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
1
3
5
7
9
11 123 125 137 19 21
3
25
7
29
1 33
A1 BALL
CORNER
2
4
6
8
10 12 14 16 18 20 22 24 26 28 30 32 34
103
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Ordering Information
Figure 41. Part Number Description
ORT8850X - X XXX XXX X
Grade
Device Family
ORT8850L
ORT8850H
C = Commercial
I = Industrial
Speed Grade
Ball Count
Package Type
BM = Fine-Pitch Plastic Ball Grid Array (PBGAM)
BMN = Lead-Free Fine-Pitch Plastic Ball Grid Array (PBGAM)
Table 40. Device Type Options
Device
Voltage
1.5 V internal
3.3 V/2.5 V/1.8 V/1.5 V I/O
ORT8850L
1.5 V internal
3.3 V/2.5 V/1.8 V/1.5 V I/O
ORT8850H
Table 41.Temperature Range
Symbol
Description
Commercial
Industrial
Ambient Temperature
0 ˚C to +70 ˚C
Junction Temperature
0 ˚C to +85 ˚C
C
I
–40 ˚C to +85 ˚C
–40 ˚C to +100 ˚C
Table 42. Conventional Packaging – Commercial Ordering Information1
Speed
Grade
Ball
Count
Device Family
Part Number
ORT8850L-3BM680C
ORT8850L-2BM680C
ORT8850L-1BM680C
ORT8850H-2BM680C
ORT8850H-1BM680C
Package Type
PBGAM (fpBGA)
PBGAM (fpBGA)
PBGAM (fpBGA)
PBGAM (fpBGA)
PBGAM (fpBGA)
Grade
ORT8850L
3
2
1
2
1
680
C
C
C
C
C
680
680
ORT8850H
680
680
Table 43. Conventional Packaging – Industrial Ordering Information1
Speed
Grade
Ball
Count
Device Family
Part Number
ORT8850L-2BM680I
ORT8850L-1BM680I
ORT8850H-1BM680I
Package Type
PBGAM (fpBGA)
PBGAM (fpBGA)
PBGAM (fpBGA)
Grade
ORT8850L
2
1
1
680
680
680
I
I
I
ORT8850H
1.For all but the slowest commercial speed grade, the speed grades on these devices are dual marked. For example, the commercial speed
grade -2XXXXXC is also marked with the industrial grade -1XXXXXI. The commercial grade is always one speed grade faster than the associ-
ated dual mark industrial grade. The slowest commercial speed grade is marked as commercial grade only.
104
Lattice Semiconductor
ORCA ORT8850 Data Sheet
Table 44. Lead-Free Packaging – Commercial Ordering Information1
Speed
Grade
Ball
Count
Device Family
Part Number
ORT8850L-3BMN680C
ORT8850L-2BMN680C
ORT8850L-1BMN680C
ORT8850H-2BMN680C
ORT8850H-1BMN680C
Package Type
Grade
ORT8850L
3
2
1
2
1
Lead-Free PBGAM (fpBGA)
Lead-Free PBGAM (fpBGA)
Lead-Free PBGAM (fpBGA)
Lead-Free PBGAM (fpBGA)
Lead-Free PBGAM (fpBGA)
680
C
C
C
C
C
680
680
ORT8850H
680
680
Table 45. Lead-Free Packaging – Industrial Ordering Information1
Speed
Grade
Ball
Count
Device Family
Part Number
ORT8850L-2BMN680I
ORT8850L-1BMN680I
ORT8850H-1BMN680I
Package Type
Grade
ORT8850L
2
1
1
Lead-Free PBGAM (fpBGA)
Lead-Free PBGAM (fpBGA)
Lead-Free PBGAM (fpBGA)
680
680
680
I
I
I
ORT8850H
1.For all but the slowest commercial speed grade, the speed grades on these devices are dual marked. For example, the commercial speed
grade -2XXXXXC is also marked with the industrial grade -1XXXXXI. The commercial grade is always one speed grade faster than the associ-
ated dual mark industrial grade. The slowest commercial speed grade is marked as commercial grade only.
Revision History
Date
–
Version
Change Summary
8
8.1
9
Previous Lattice releases.
January 2004
August 2004
October 2005
Added lead-free package designator.
Added lead-free package ordering part numbers (OPNs).
10
Added clarification to the STM Pointer Mover bypass. Added clarification to the signal
description for LINE_FP.
April 2006
11
Added clarification to the B1, section bit interleavered parity (BIP-8) byte. Added clarifica-
tion to B1 processing.
February 2008
11.1
Corrected name of Register 30009, Bits 5 & 6 in Memory Map Description table.
105
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