2.0SMB [LEIDITECH]

Surface Mount - 2000W;
2.0SMB
型号: 2.0SMB
厂家: Leiditech    Leiditech
描述:

Surface Mount - 2000W

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Surface Mount - 2000W >2.0SMB series  
Description  
The 2.0SMB series is designed specically  
to protect sensitive electronic equipment  
from voltage transients induced by lightning  
and other transient voltage events.  
Features  
2000W peak pulsepower capability at 10 x 1000μs waveform, repetition rate  
(duty cycle): 0.01%  
Glass Passivated chip junction  
For surface mounted applications to optimize board space  
Low profile package  
Built-in strain relief  
Low incremental surge resistance  
Excellent clamping capability  
Plastic package has UL flammability classification 94V-O  
Fast response time: typically less than 1.0ps from 0 Volts to BV min  
Typical IR less than 1uA above 12V  
High temperature soldering: 260°C/40 seconds at terminals  
IEC-61000-4-2 ESD 15KV(Air),8KV(Contact)  
ESD protection of data lines in accordance with IEC 61000-4-2(IEC801-2)  
EFT protection of data lines in accordance with IEC61000-4-4(IEC801-4)  
1/6  
Rev :01.06.2018  
www.leiditech.com  
Surface Mount - 2000W >2.0SMB series  
Applications  
TVS devices are ideal for the protection of I/O Interfaces, VCC bus and  
other vulnerable circuits used in Telecom, Computer, Industrial and  
Consumer electronic applications.  
Maximum Ratings and Electrical Characteristics  
(TA=25unless otherwise noted)  
Parameter  
Symbol  
Value  
Unit  
Peak Pulse Power Dissipation at  
TA=25  
by  
10x1000μs  
waveform  
PPPM  
2000  
W
(Fig.2)(Note 1) (Note 2)  
Power Dissipation on infinite heat sink at  
PD  
6.5  
W
TA=50℃  
Peak Forward Surge Current, 8.3ms Single  
Half Sine Wave Unidirectional only(Note 3)  
IFSM  
200  
A
V
Maximum Instantaneous Forward Voltage at  
100A for Unidirectional only  
VF  
3.5V/5.0  
Operating Junction and Storage Temperature  
Range  
TJ, TSTG  
-55 to 150  
Typical Thermal Resistance Junction to Lead  
RuJL  
15  
75  
/W  
/W  
Typical Thermal Resistance Junction to  
Ambient  
RuJA  
Notes:  
1. Non-repetitive current pulse, per Fig.3and derated above TA=25per Fig. 2.  
2. Mounted on copper pad area of 0.31x0.31(8.0 x 8.0mm) to each terminal.  
3. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional device  
only, duty cycle=4 per minute maximum.  
2/6  
Rev :01.06.2018  
www.leiditech.com  
Surface Mount - 2000W >2.0SMB series  
Electrical Characteristics  
PART NUMBER  
VRWM  
VBR  
MIN(V) MAX(V) (mA)  
60.2 69.5  
VBR  
IT  
IR  
Ipp  
(A)  
Vc  
BI- POLAR  
UNI-POLAR  
2.0SMB58A  
(V)  
(µA)  
(v)  
2.0SMB58CA  
58.0  
1
2
21.35  
93.6  
Notes:  
For bidirectional type having VRWM of 20 volts and less, the IR limit is double.  
For parts without A (VBR is ± 10% and VC is 5% higher than A parts  
I-V Curve Characteristics  
3/6  
Rev :01.06.2018  
www.leiditech.com  
Surface Mount - 2000W >2.0SMB series  
Ratings and Characteristic Curves (TA=25°C unless otherwise noted)  
Figure 1 - Peak Pulse Power Rating Curve  
Figure 2 - Pulse Derating Curve  
Figure 3 - Pulse Waveform  
Figure 4 - Typical Junction Capacitance  
Figure 5 - Steady State Power Dissipation  
Derating Curve  
Figure 6 - Maximum Non-Repetitive  
Forward Surge Current Uni-Directional Only  
4/6  
Rev :01.06.2018  
www.leiditech.com  
Surface Mount - 2000W >2.0SMB series  
Part Numbering System  
2.0SMB XXX C A  
(1)  
(2)  
(3)  
(4)  
(1) SERIES.  
(2) VR VOLTAGE.  
(3) BI-DIRECTIONAL AND UNI-DIRECTIONAL.  
(4) 5% VOLTAGE TOLERANCE.  
Product Dimensions  
Inches  
MIN MAX  
0.134 0.155  
0.205 0.22  
Millimeters  
MAX  
Dimension  
B
D
MIN  
A
B
C
D
E
F
G
H
J
3.40  
5.21  
1.90  
4.22  
0.91  
1.85  
0.05  
1.95  
1.09  
0.20  
3.94  
5.59  
2.11  
4.70  
1.42  
2.2  
C
A
0.075 0.083  
0.166 0.185  
0.036 0.056  
0.073 0.087  
0.002 0.008  
0.077 0.094  
0.043 0.053  
0.008 0.014  
H
F
L
E
J
G
K
.079  
0.20  
2.40  
1.35  
0.35  
(2.0)  
0.110  
(2.8)  
.079  
(2.0)  
K
L
0.039 0.049  
0.99  
1.24  
5/6  
Rev :01.06.2018  
www.leiditech.com  
Surface Mount - 2000W >2.0SMB series  
Solder Reflow Recommendations  
Recommended reflow methods: IR, vapor  
phase oven, hot air oven, wave solder.  
The device can be exposed to a maximum  
temperature of 265°C for 10 seconds.  
Devices can be cleaned using standard  
industry methods and solvents.  
Notes: If reflow temperatures exceed the  
recommended profile, devices may not  
meet the performance requirements.  
Summary of Packing Options  
Packing  
Industry  
Standard  
Package Type  
Description  
Quantity  
DO-214AA(SMB)  
Embossed Carrier Reel Pack  
3000PCS  
EIA-481-D  
Shanghai Leiditech Electronic Co.,Ltd  
Email: sale1@leiditech.com  
Tel : +86- 021 50828806  
Fax : +86- 021 50477059  
6/6  
Rev :01.06.2018  
www.leiditech.com  

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