HL130-110 [LEIDITECH]
Positive Thermal Coefficent Diodes;
| 型号： | HL130-110 |
| 厂家： | 
Leiditech |
| 描述： | Positive Thermal Coefficent Diodes |
| 文件： | 总4页 (文件大小：1008K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HL130-010~250 Series
Positive Thermal Coefficent Diodes
Features：
Radial leaded Devices
Cured,flame retardant epoxy polymer insulating material meets UL94V-0
RoHS compliant and lead-free
Product Dimensions
Fig.1
Fig.2
Unit :mm
Model
Dimensions（mm）
C(max)
Lead material
Tinned metal(mm)
22AWG/Φ0.6
22AWG/Φ0.6
22AWG/Φ0.6
22AWG/Φ0.6
22AWG/Φ0.6
22AWG/Φ0.6
22AWG/Φ0.6
22AWG/Φ0.6
22AWG/Φ0.6
22AWG/Φ0.6
20AWG/Φ0.8
20AWG/Φ0.8
20AWG/Φ0.8
20AWG/Φ0.8
20AWG/Φ0.8
20AWG/Φ0.8
20 AWG/Φ0.8
Shape
A(max)
7.4
B(max)
12.7
13.0
13.5
13.5
13.5
14.0
15.0
15.2
18.0
18.0
19.6
21.3
22.0
25
D(typ)
5.1
Fig
1
1
1
1
1
1
1
1
1
1
2
2
2
2
2
2
2
HL130-010
HL130-015
HL130-017
HL130-020
HL130-025
HL130-030
HL130-040
HL130-050
HL130-065
HL130-075
HL130-090
HL130-110
HL130-135
HL130-160
HL130-185
HL130-200
HL130-250
3.8
3.8
3.8
3.8
3.8
3.8
3.8
3.8
3.8
3.8
3.8
3.8
3.8
3.8
3.8
3.8
3.8
7.4
5.1
7.4
5.1
7.6
5.1
7.6
5.1
8.0
5.1
9.4
5.1
10.2
12.8
12.8
14.5
16.3
17.0
20
5.1
5.1
5.1
5.1
5.1
5.1
5.1
22
23
5.1
25
27
10.2
10.2
27
32
Note: Dimensions in the A, B, C are the maximum sizes, all typical values of D is at the tolerance of ± 0.75mm.
1/4
Rev :01.06.2018
www.leiditech.com
HL130-010~250 Series
Thermal Derating Chart-IH（A）
Maximum ambient operating temperatures（℃）
Model
-40
-20
0
25
40
0.085
0.13
0.14
0.17
0.21
0.26
0.34
0.43
0.55
0.64
0.77
0.94
1.15
1.36
1.57
1.70
2.13
50
0.076
0.11
0.13
0.15
0.19
0.23
0.30
0.38
0.49
0.57
0.68
0.84
1.03
1.22
1.41
1.52
1.90
60
0.067
0.10
0.11
0.13
0.17
0.20
0.27
0.34
0.44
0.50
0.60
0.74
0.90
1.07
1.24
1.34
1.68
70
0.060
0.09
0.10
0.12
0.15
0.18
0.24
0.30
0.39
0.45
0.54
0.66
0.81
0.96
1.11
1.20
1.50
85
0.047
0.07
0.08
0.09
0.12
0.14
0.19
0.24
0.31
0.35
0.42
0.52
0.63
0.75
0.87
0.94
1.18
HL130-010
HL130-015
HL130-017
HL130-020
HL130-025
HL130-030
HL130-040
HL130-050
HL130-065
HL130-075
HL130-090
HL130-110
HL130-135
HL130-160
HL130-185
HL130-200
HL130-250
0.15
0.22
0.25
0.29
0.37
0.44
0.59
0.74
0.96
1.10
1.32
1.62
1.98
2.35
2.72
2.94
3.68
0.13
0.20
0.22
0.26
0.33
0.40
0.53
0.66
0.86
0.99
1.19
1.45
1.78
2.11
2.44
2.64
3.30
0.12
0.18
0.20
0.24
0.30
0.35
0.47
0.59
0.77
0.89
1.06
1.30
1.59
1.89
2.18
2.36
2.95
0.10
0.15
0.17
0.20
0.25
0.30
0.40
0.50
0.65
0.75
0.90
1.10
1.35
1.60
1.85
2.00
2.50
Electrical Characteristics
Resistance(Ω)
Maximum Time-to-trip
IH（A）
Vmax（V）
Imax（A） Pd （W）
Model
IT(A)
Time（S） Rmin- Rmax
Current （A）
HL130-010
HL130-015
HL130-017
HL130-020
HL130-025
HL130-030
HL130-040
HL130-050
HL130-065
0.10
0.15
0.17
0.20
0.25
0.30
0.40
0.50
0.65
0.20
0.30
0.34
0.40
0.50
0.60
0.80
1.0
130
130
130
130
130
130
130
130
130
3
3
0.8
0.8
0.8
0.8
1.0
1.0
1.0
1.0
1.0
0.5
0.75
0.85
1.0
6
2.5-9.0
2.5-7.5
5.5
5.2
5.0
4.8
4.5
4.5
5.0
5.2
3
1.5-7.0
3
1.9-4.0
3
1.25
1.5
1.45-3.50
1.0-3.0
3
3
2.0
0.75-2.0
0.50-1.60
0.45-1.0
3
2.5
1.3
10
3.25
2/4
Rev :01.06.2018
www.leiditech.com
HL130-010~250 Series
HL130-075
HL130-090
HL130-110
HL130-135
HL130-160
HL130-185
HL130-200
HL130-250
0.75
0.90
1.10
1.35
1.60
1.85
2.00
2.50
1.5
1.8
2.2
2.7
3.2
3.7
4.0
5.0
130
130
130
130
130
130
130
130
10
10
10
10
10
10
10
10
1.0
1.5
1.8
1.8
2.0
2.0
2.2
2.5
3.75
4.5
5.5
5.8
6.3
7.5
8
0.40-0.90
0.30-0.70
0.20-0.65
0.15-0.60
0.10-0.50
0.10-0.40
0.10-0.30
0.05-0.25
5.5
6.75
8.0
9.25
10.0
12.5
9
10
12
IH=Hold current:Maximum current at which the device will not interruptin 25℃ still air.
IT=Trip current:Minimum current at which the device from low resistance to high resistance in 25℃ still air.
Vmax=Maximum continuousvoltage device can withstand without damage at rated current.
Imax=Maximum fault current device can withstand without damage at rated voltage.
Maximum Time-to-trip:Maximum time to trip at assigned current.
Pd=Typical power dissipation:Typical amount of power dissipated from the device when in 25℃ still air environment.
Rmin=Minimum resistance of device at 25℃ prior to tripping.
Rmax=Maximum resistance of device at 25℃ prior to tripping.
Marking System
HL
Leiditech series product
Environmental Specifications
Test
Conditions
Resistance change
±8% typical
±8% typical
±12% typical
No change
Passive Aging
Humidity Aging
Thermal Shock
SolventResistance
Vibration
+85℃，1000hours
+85℃，85%R.H.1000hours
+125℃ to -55℃，10 Times
MIL-STD-202，Method 215F
MIL-STD-202，Method 201
No change
3/4
Rev :01.06.2018
www.leiditech.com
HL130-010~250 Series
Solderingmethod
Wave Soldering
Soldering Temperature:260℃~270℃
Soldering Time:≤3sec
Soldering Position: Resettable fuse lead and the distance fromthe bottom ≥ 6mm
Manual soldering
Soldering Temperature:250℃~280℃
Soldering Time: ≤3sec
Soldering Position: Resettable fuse lead and the distance fromthe bottom ≥ 6mm
Storage
The maximum ambient temperature shall not exceed 40℃.Storage temperature higher than 40℃ could result in the
deformation of packaging materials.The maximum relative humidity recommended for storage is 70%.High humidity with
high temperature can accelerate the oxidation of the solder plating on the leads and reduce the solderability of the
components.Sealed plastic bags with desiccant shall be used to reduce the oxidation of the leads and shall only be opened
prior to use.The products shall not be stored in areas where harmful gases containing acid or alkali or other harmful
substancesare present.
Shanghai Leiditech Electronic Co.,Ltd
Email: sale1@leiditech.com
Tel : +86- 021 50828806
Fax : +86- 021 50477059
4/4
Rev :01.06.2018
www.leiditech.com
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