HL16-500 [LEIDITECH]
Positive Thermal Coefficent Diodes;
| 型号： | HL16-500 |
| 厂家： | 
Leiditech |
| 描述： | Positive Thermal Coefficent Diodes |
| 文件： | 总4页 (文件大小：1077K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HL16-010~1400 Series
Positive Thermal Coefficent Diodes
Features：
RoHS Compliant ＆ Halogen Free
Radial-leaded Devices
requirements
Cured，flame retardant epoxy polymer insulating material meets UL94V-0
Operation Current: 0.1A~14A ，Maximum Voltage: 16Vdc，
Operating Temperature：-40℃ TO 85℃
Agency recognition：TUV
Product Dimensions
Pig.1
Pig.2
Unit ：mm
HL16 Series
Dimensions（mm）
Lead material
Tinned metal(mm)
24 AWG/Φ0.5
24 AWG/Φ0.5
24 AWG/Φ0.5
24 AWG/Φ0.5
24 AWG/Φ0.5
24 AWG/Φ0.5
24 AWG/Φ0.5
24 AWG/Φ0.5
24 AWG/Φ0.5
24 AWG/Φ0.5
20 AWG/Φ0.8
20 AWG/Φ0.8
20 AWG/Φ0.8
Shape
Model
A(max)
5.5
B(max)
12.0
12.0
12.0
12.0
13.5
13.5
13.5
13.5
14.0
12.0
12.0
13.0
17.5
C(max)
D(typ)
5.1
5.1
5.1
5.1
5.1
5.1
5.1
5.1
5.1
5.1
5.1
5.1
5.1
Fig
1
HL16-010
HL16-025
HL16-030
HL16-050
HL16-075
HL16-090
HL16-110
HL16-135
HL16-160
HL16-200
HL16-300
HL16-400
HL16-500
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
5.5
1
5.5
1
5.5
1
7.4
1
7.4
1
7.4
1
7.4
1
7.4
1
9.0
2
9.0
2
10.0
11.8
2
2
1/4
Rev :01.06.2018
www.leiditech.com
HL16-010~1400 Series
HL16-600
HL16-700
HL16-800
HL16-900
HL16-1000
HL16-1100
HL16-1200
HL16-1300
HL16-1400
13.5
13.5
13.5
15.0
18.0
18.0
22.5
24.0
24.0
17.5
23.0
23.0
24.0
26.0
26.0
26.0
30.0
30.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
5.1
20 AWG/Φ0.8
20 AWG/Φ0.8
20 AWG/Φ0.8
20 AWG/Φ0.8
20 AWG/Φ0.8
20 AWG/Φ0.8
20 AWG/Φ0.8
20 AWG/Φ0.8
20 AWG/Φ0.8
2
2
2
2
2
2
2
2
2
5.1
5.1
5.1
5.1
5.1
10.2
10.2
10.2
Note: Dimensions in the A, B, C are the maximum sizes, all typical values of D is at the tolerance of ± 0.75mm.
Thermal Derating Chart-IH（A）
Maximum ambient operating temperature（℃）
Model
-40℃
-20℃
0℃
25℃
30℃
40℃
50℃
60℃
70℃
85℃
47%
HL16 series
147%
132%
120%
100%
90%
88%
80%
71%
61%
Electrical Characteristics
Vmax
V（
Imax
Pd
W
Maximum Time-to-Trip
Resistance（mΩ）
IH
IT
(A)
0.3
0.5
0.6
1.0
1.5
1.8
2.2
2.7
3.2
4
Model
(A)
A
Current（A） Time（S）
Rmin
1500
500
300
200
100
90
60
40
40
35
20
20
14
10
8
Rmax
7500
1950
700
500
320
180
150
130
110
75
）
DC
HL16-010
HL16-025
HL16-030
HL16-050
HL16-075
HL16-090
HL16-110
HL16-135
HL16-160
HL16-200
HL16-300
HL16-400
HL16-500
HL16-600
HL16-700
HL16-800
HL16-900
HL16-1000
HL16-1100
HL16-1200
0.1
0.25
0.3
0.5
0.75
0.9
1.1
1.35
1.6
2
16
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
0.38
0.45
0.49
0.56
0.72
0.83
0.94
1.2
0.5
1.25
1.5
2.5
3.75
4.5
5.5
6.75
8
5
5
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
5
5
5
5
5
5
1.4
5
2.2
6
15
15
15
15
15
15
15
25
30
30
30
3
6
2.3
9
60
4
8
2.4
12
40
5
10
12
14
16
18
20
22
24
2.6
15
25
6
2.8
18
21
7
3.0
21
15
8
3.0
24
6
13
9
3.3
27
4
12
10
11
12
3.7
30
4
11
3.7
33
3
9
4.2
36
3
8
2/4
Rev :01.06.2018
www.leiditech.com
HL16-010~1400 Series
HL16-1300
HL16-1400
13
14
26
28
16
16
100
100
4.2
4.2
39
40
50
50
3
3
8
7
IH=Hold current:Maximum current at which the device will not interruptin 25℃ still air.
IT=Trip current:Minimum current at which the device from low resistance to high resistance in 25℃ still air.
Vmax=Maximum continuousvoltage device can withstand without damage at rated current.
Imax=Maximum fault current device can withstand without damage at rated voltage.
Maximum Time-to-trip:Maximum time to trip at assigned current.
Pd=Typical power dissipation:Typical amount of power dissipated from the device when in 25℃ still air environment.
Rmin=Minimum resistance of device at 25℃ prior to tripping.
Rmax=Maximum resistance of device at 25℃ prior to tripping.
Marking System
HL
Leiditech series product
Environmental Specifications
Test
Conditions
Resistance change
±8% typical
±8% typical
±12% typical
No change
Passive Aging
+85℃，1000hours
Humidity Aging
Thermal Shock
SolventResistance
Vibration
+85℃，85%R.H.1000hours
+125℃ to -55℃，10 Times
MIL-STD-202，Method 215F
MIL-STD-202，Method 201
No change
Solderingmethod
Wave Soldering
Soldering Temperature:245℃~260℃
Soldering Time:≤5sec
Soldering Position: Resettable fuse lead and the distance fromthe bottom ≥ 6mm
Manual soldering
Soldering Temperature:250℃~280℃
Soldering Time: ≤3sec
Soldering Position: Resettable fuse lead and the distance fromthe bottom ≥ 6mm
3/4
Rev :01.06.2018
www.leiditech.com
HL16-010~1400 Series
Packaging and Storage
Storage
The maximum ambient temperature shall not exceed 40℃.Storage temperature higher than 40℃ could result in the
deformation of packaging materials.The maximum relative humidity recommended for storage is 70%.High humidity with
high temperature can accelerate the oxidation of the solder plating on the leads and reduce the solderability of the
components.Sealed plastic bags with desiccant shall be used to reduce the oxidation of the leads and shall only be opened
prior to use.The products shall not be stored in areas where harmful gases containing acid or alkali or other harmful
substancesare present.
Warning:
• Please read this specification before usingthe product.
• Use PPTC beyond the maximum ratings or improper use may result in device damage,electrical arcing and flame.
• PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be used when
repeated fault conditions or prolonged trip events are anticipated.
• Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic,
thermal, and mechanical procedures for electronic components.
• Use PPTC with a large inductance in circuit will generate a circuit voltage above the rated voltage of the PPTC.
• Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space.
•
Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the performance
of the devices.PPTC can be cleaned by standard methods.
Shanghai Leiditech Electronic Co.,Ltd
Email: sale1@leiditech.com
Tel : +86- 021 50828806
Fax : +86- 021 50477059
4/4
Rev :01.06.2018
www.leiditech.com
相关型号：
©2020 ICPDF网 联系我们和版权申明