HL30-250 [LEIDITECH]
Positive Thermal Coefficent Diodes;型号: | HL30-250 |
厂家: | Leiditech |
描述: | Positive Thermal Coefficent Diodes |
文件: | 总4页 (文件大小:1009K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
HL30-050~900 Series
Positive Thermal Coefficent Diodes
Features:
RoHS Compliant & Halogen Free
Radial-leaded Devices
Cured,flame retardant epoxy polymer insulating material meets UL94V-0 requirements
Operation Current: 0.5A~9A ,Maximum Voltage:30Vdc,Operating Temperature:-40℃ TO 85℃
Agency recognition:UL、TUV
Product Dimensions
Pig.1
Pig.2
Pig.3
Unit :mm
HL30 Series
Dimensions(mm)
Lead material
Shape
Model
A(max)
7.4
B(max)
12.7
13.0
18.5
18.5
18.5
17.6
20.2
20.2
20.2
22.4
20.4
23.7
23.7
C(max)
3.0
D(typ)
5.1
Tinned metal(mm)
24AWG/Φ0.5
24AWG/Φ0.5
24AWG/Φ0.5
24AWG/Φ0.5
24AWG/Φ0.5
24AWG/Φ0.5
24AWG/Φ0.5
24AWG/Φ0.5
24AWG/Φ0.5
24AWG/Φ0.5
20 AWG/Φ0.8
20 AWG/Φ0.8
20 AWG/Φ0.8
Fig
1
HL30-050
HL30-075
HL30-090
HL30-110
HL30-120
HL30-135
HL30-160
HL30-185
HL30-200
HL30-250
HL30-300
HL30-400
HL30-500
7.4
3.0
5.1
1
7.4
3.0
5.1
2
7.4
3.0
5.1
2
7.4
3.0
5.1
2
9.2
3.0
5.1
2
9.2
3.0
5.1
2
9.2
3.0
5.1
2
15.2
13.2
13.2
14.0
14.0
3.0
5.1
2
3.0
5.1
2
3.0
5.1
3
3.0
5.1
3
3.0
10.2
3
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Rev :01.06.2018
www.leiditech.com
HL30-050~900 Series
HL30-600
HL30-700
HL30-800
HL30-900
17.2
17.2
23.5
23.5
27.0
27.0
29.2
29.2
3.0
3.0
3.0
3.0
10.2
10.2
10.2
10.2
20 AWG/Φ0.8
20 AWG/Φ0.8
20 AWG/Φ0.8
20 AWG/Φ0.8
3
3
3
3
Note: Dimensions in the A, B, C are the maximum sizes, all typical values of D is at the tolerance of ± 0.75mm.
Thermal Derating Chart-IH(A)
Maximum ambient operating temperature(℃)
Model
-40℃
-20℃
0℃
25℃
30℃
40℃
50℃
60℃
70℃
85
52%
HL30 series
137%
130%
115%
100%
91%
83%
77%
68%
61%
Electrical Characteristics
Vmax
V(
Imax
Pd
W
Maximum Time-to-Trip
Resistance(mΩ)
Model
IH(A)
IT (A)
A
Current (A) Time(S) Rmin
Rmax
600
370
220
200
180
160
140
120
100
80
)
DC
HL30-050
HL30-075
HL30-090
HL30-110
HL30-120
HL30-135
HL30-160
HL30-185
HL30-200
HL30-250
HL30-300
HL30-400
HL30-500
HL30-600
HL30-700
HL30-800
HL30-900
0.5
1.0
1.5
1.8
2.2
2.4
2.7
3.2
3.7
4.0
5.0
6.0
8.0
10
30
40
40
40
40
40
40
40
40
40
40
40
40
40
40
40
40
40
0.5
0.6
0.7
0.7
0.8
0.8
0.9
1.0
1.2
1.2
2.0
2.5
3.0
3.5
3.8
4.0
4.2
2.5
3.75
4.5
5.0
5.0
8.0
8.0
8.0
8.0
8.0
8.0
11
250
200
100
70
80
70
60
50
40
30
30
10
10
5
0.75
0.90
1.10
1.20
1.35
1.60
1.85
2.00
2.50
3.00
4.00
5.00
6.00
7.00
8.00
9.00
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
5.5
6.0
6.75
8.0
9.25
10.0
12.5
15.0
20.0
25.0
30.0
35.0
40.0
40.0
11
11
70
12.7
14.5
16
60
50
12
40
14
17.5
18.8
20
5
30
16
5
25
18
5
20
IH=Hold current:Maximum current at which the device will not interruptin 25℃ still air.
IT=Trip current:Minimum current at which the device from low resistance to high resistance in 25℃ still air.
Vmax=Maximum continuousvoltage device can withstand without damage at rated current.
Imax=Maximum fault current device can withstand without damage at rated voltage.
Maximum Time-to-trip:Maximum time to trip at assigned current.
Pd=Typical power dissipation:Typical amount of power dissipated from the device when in 25℃ still air environment.
Rmin=Minimum resistance of device at 25℃ prior to tripping.
Rmax=Maximum resistance of device at 25℃ prior to tripping.
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Rev :01.06.2018
www.leiditech.com
HL30-050~900 Series
Marking System
HL
Leiditech series product
Environmental Specifications
Test
Conditions
Resistance change
±8% typical
±8% typical
±12% typical
No change
Passive aging
+85℃,1000hours
Humidity aging
Thermal shock
SolventResistance
Vibration
+85℃,85%R.H.1000hours
+125℃ to -55℃,10 Times
MIL-STD-202,Method 215F
MIL-STD-202,Method 201
No change
Solderingmethod
Wave Soldering
Soldering Temperature:245℃~260℃
Soldering Time:≤5sec
Soldering Position: Resettable fuse lead and the distance fromthe bottom ≥ 6mm
Manual soldering
Soldering Temperature:250℃~280℃
Soldering Time: ≤3sec
Soldering Position: Resettable fuse lead and the distance fromthe bottom ≥ 6mm
3/4
Rev :01.06.2018
www.leiditech.com
HL30-050~900 Series
The maximum ambient temperature shall not exceed 40℃.Storage temperature higher than 40℃ could result in the
deformation of packaging materials.The maximum relative humidity recommended for storage is 70%.High humidity with
high temperature can accelerate the oxidation of the solder plating on the leads and reduce the solderability of the
components.Sealed plastic bags with desiccant shall be used to reduce the oxidation of the leads and shall only be opened
prior to use.The products shall not be stored in areas where harmful gases containing acid or alkali or other harmful
substancesare present.
Warning:
• Please read this specification before usingthe product.
• Use PPTC beyond the maximum ratings or improper use may result in device damage,electrical arcing and flame.
• PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be used when
repeated fault conditions or prolonged trip events are anticipated.
• Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic,
thermal, and mechanical procedures for electronic components.
• Use PPTC with a large inductance in circuit will generate a circuit voltage above the rated voltage of the PPTC.
• Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space.
•
Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the performance
of the devices.PPTC can be cleaned by standard methods.
Shanghai Leiditech Electronic Co.,Ltd
Email: sale1@leiditech.com
Tel : +86- 021 50828806
Fax : +86- 021 50477059
4/4
Rev :01.06.2018
www.leiditech.com
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