LDT3220-271H [LEIDITECH]
SMD Disc Varisttors;
| 型号： | LDT3220-271H |
| 厂家： | 
Leiditech |
| 描述： | SMD Disc Varisttors |
| 文件： | 总7页 (文件大小：486K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LDT3220 Series
SMD Disc Varisttors
FEATURES
Improved component design in a compact case
High surge current capability
Superior performance at high temperature
SMD mountable disk varistors, suitable for lead-free
reflow / wave soldering
APPLICATIONS
Power supplies for telecommunication systems
Protection for LED circuits
Protection for consumer, industrial equipment
Protection for automotive electronics
APPLICABLE STANDARDS
UL1449
VDE (IEC61051-1, -2, -2-2, IEC60950-1Annex Q)
CQC (GB/T10193, GB/T10194, GB4943.1, GB8898)
TYPE CODE DESIGNATION
3220
-
471
H
LDT
High absorption
Varistor voltage V1mA: 47×101=470 V
Leiditech: logo
Tolerance of varistor voltage at 1 mA: ±10%(V1mA
)
3220: 32/100’’×20/100’’(8.0mm×6.3mm)
GENERALTECHNICALDATA
Parameter
Operating temperature
Storage temperature
Electric strength
Value
-55 to +125
-55 to +150
≥2.5
Unit
℃
℃
kVRMS
MΩ
Insulation resistance
≥100
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Rev 2.0 :12.01.2019
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LDT3220 Series
ELECTRICAL CHARACTERISTICS
(Ta=125℃)
Continious
Peak Current
Max
Energy
Max
Voltage
SMD Types
Rated Power
Max
(EIA Case 32×20
in inch)
VRMS
[V]
VDC
[V]
(8/20 μs, 1 time)
(2 ms, 1 time)
[A]
[J]
8.0
[mW]
200
LDT3220 - 271H
LDT3220 - 391H
175
250
225
320
1250
1250
12.0
200
LDT3220 - 431H
LDT3220 - 471H
LDT3220 - 511H
LDT3220 - 561H
LDT3220 - 681H
275
300
320
350
420
350
385
420
460
560
1250
1250
1250
1250
1250
13.5
15.0
16.0
16.5
18.0
200
200
200
200
200
(Ta=25℃)
Clamping
Capacitance
Max
Varistor Voltage at Voltage at Class
Class Current
SMD Types
(EIA Case 32×20
in inch)
1 mA
Current
(8/20 μs)
(8/20 μs)
(±10%)
(at 1 kHz)
[V]
[V]
455
650
710
775
845
930
1025
1120
[A]
10
10
10
10
10
10
10
10
[pF]
170
120
120
110
105
100
95
LDT3220 - 271H
LDT3220 - 391H
LDT3220 - 431H
LDT3220 - 471H
LDT3220 - 511H
LDT3220 - 561H
LDT3220 - 621H
LDT3220 - 681H
270
390
430
470
510
560
620
680
90
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Rev 2.0 :12.01.2019
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LDT3220 Series
SOLDERING GUIDELINES
The usage of mild, non-activated fluxes for soldering is recommended, as well as proper
cleaning of the PCB.
The components are suitable for reflow soldering per JEDEC J-STD-020C.
- Wave soldering
10s
300
℃
Normal curve
Limit curve
250
235
℃
~260
1st wave
approx. 200K/s
100 ~130
℃
2nd wave
5K/s
200
150
100
50
2K/s
℃
℃
Forced
cooling
2K/s
0
0
50
100
150
200
s
250
Time
Temperature characteristics at component terminal with dual-wave soldering
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Rev 2.0 :12.01.2019
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LDT3220 Series
- Reflow soldering
tp
T
P
L
Critical Zone
to T
Ramp-up
T
L
P
T
tL
T
S(max)
Ramp-down
T
S(min)
t
s
Preheat
25
time to peak temperatue
Time
(t 25℃ to peak)
Profile feature
Sn-Pb assembly
3℃/sec. Max
+100℃
Pb-Free assembly
3℃/sec. Max
+150℃
Average ramp-up rate (TSmax to Tp)
-Temperature min. (Ts(min)
-Temperature max.(Ts(max)
-Time (tSmin to tSmax
s(max) to TL - Ramp-up Rate
)
Preheat
)
+150℃
+200℃
)
60-120 secs.
3℃/sec. Max
+183℃
60-180 secs.
3℃/sec. Max
+217℃
T
-Temperature min. (TL)
-Time (tL)
Time maintained
above
60-150 secs.
+220℃ to +240℃
60-150 secs.
+240℃ to +260℃
20 secs. to 40 secs.
6℃/sec. max.
8 min. max.
Peak classification temperature (Tp)
Time within 5℃of actual peak temperature (tp) 10 secs. to 30 secs.
Ramp-down rate
6℃/sec. max.
Time 25℃ to peak temperature
6 min. max.
Notes: All temperature refer to topside of the package, measured on the package body surface
Maximum number of reflow cycles: 3
STORAGE CONDITION
- As far as possible, the components should be employed within 24 months after delivery
from Kangtai Semiconductor.
- They should be left in their original packing to avoid soldering problems due to oxidized
contacts.
- Storage temperature: − 25 up to + 45°C.
- Relative humidity: < 75 % annual average, < 95 % on max. 30 days in a year.
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Rev 2.0 :12.01.2019
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LDT3220 Series
DIMENSIONAL DRAWINGS
l
Dimensions
Inches
Typ.
Ref.
Millimeters
Typ.
Min.
7.7
6.0
3.1
1.2
0
Max. Min.
8.3 0.303
6.6 0.236
4.0 0.122
1.8 0.047
Max.
0.327
0.260
0.150
0.071
0.012
0.130
l
d
w
h
d
e
f
w
f
0.3
0
2.7
3.3 0.106
RECOMMENDED SOLDER PAD LAYOUT
Dimensions
C
Inches
Typ.
Ref.
Millimeters
Typ.
3.5
2.8
4.5
Min.
Max. Min.
Max.
0.138
0.110
0.177
A
B
C
B
TEMPERATUREDERATINGCURVE
Max. current, energy, operating voltage and average power
dissipation depending on ambient temperature
110
100
90
80
70
60
50
40
30
20
10
0
-60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
Ambient temperature [℃]
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Rev 2.0 :12.01.2019
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LDT3220 Series
TAPING AND PACKAGING SPECIFICATION ACCORDING TO IEC 60286-3
P
0
T
P
D
2
0
T
A
1
0
T
1
P
1
T
2
Direction of unreeling
Tape end (trailer)
40 min.
empty cavities
Leader
25 min.
300 mm
empty cavities
cover tape
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Rev 2.0 :12.01.2019
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LDT3220 Series
- Dimensions of packing
Dimension
Definition
Symbol
Millimeters
inches
Typ.
Min.
6.8
8.5
1.5
4.1
Typ.
7.0
8.7
-
Max.
7.2
Min.
Max.
0.283
0.350
0.063
0.161
A
0
Compartment width
Compartment length
Sprocket hole diameter
Sprocket hole pitch
0.268
0.335
0.059
0.154
0.276
0.343
-
B
0
8.9
D
0
1.6
P
0
4.2
4.3
0.157
Distance center hole to center
compartment
P
2
1.95
11.9
2.00
12.0
2.05
12.1
0.077
0.469
0.079
0.472
0.081
0.476
Pitch of the component
compartments
P
1
Tape width
W
E
15.7
1.65
16.0
1.75
16.3
1.85
0.618
0.065
0.630
0.069
0.642
0.073
Distance edge to center of hole
Distance center hole to center
compartment
F
7.45
7.50
7.55
0.293
0.295
0.297
Distance compartment to edge
Overall thickness
G
0.75
-
-
-
-
-
-
-
0.030
-
-
-
-
T
2
-
-
5.5
-
0.217
0.012
12.99
0.705
0.882
Thickness tape
T
A
0.3
-
Reel diameter
328
16.4
-
330
17.9
22.4
12.91
0.646
-
W
1
Reel width (inside)
Reel width (outside)
-
-
W
2
1) Quantity of taping packing(pcs): 1000
Shanghai Leiditech Electronic Co.,Ltd
Email: sale1@leiditech.com
Tel : +86- 021 50828806
Fax : +86- 021 50477059
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Rev 2.0 :12.01.2019
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