LM0605H-3R3MG-D [LEIDITECH]
Carbonyl powder inductor.;型号: | LM0605H-3R3MG-D |
厂家: | Leiditech |
描述: | Carbonyl powder inductor. |
文件: | 总9页 (文件大小:937K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LM0605H-Series(G)-D
1. Features
1. Carbonyl powder inductor.
2. Compact design.
3. High current,low DCR,high efficiency.
4. Very low acoustic noise and very low leakage flux noise.
5. High reliability.
Halogen
Pb
Pb-free
Halogen-free
6. 100% Lead(Pb) & Halogen-Free and RoHS compliant.
2. Applications
Note PC power system,incl. IMVP-6
DC/DC converter .
3. Dimensions
Recommend PC Board Pattern
C
A
D
L
ꢀ1R0
1322
G
L(mm)
G(mm)
H(mm)
Series
LM0605H
A(mm)
B(mm)
C(mm)
D(mm)
1.8±0.3
E(mm)
8.4
2.5
3.5
7.3±0.3
6.6±0.3
4.8±0.2
3.0±0.3
Note: 1. The above PCB layout reference only.
2. Recommend solder paste thickness at
0.15mm and above.
4. Part Numbering
LM
A
0605
B
H
C
-
1R0
D
MG
E
-
D
F
A: Series
B: Dimension
C: Type
D: Inductance
E: Inductance Tolerance
F: 印 D/C
BxC
Carbonyl Powder
1R0=1.00uH
M=±20%
印字:黑色 1R0 及 D/C 1322 (13 年,22 週期)(依實際生產日期而定).
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LM0605H-Series(G)-D
5. Specification
Inductance
L0 (uH)±20% @ 0 A
I rms (A)
Typ.
I sat (A)
Typ.
DCR
DCR
Part Number
(mΩ) Typ.@25℃ (mΩ) Max.@25℃
23
22
20
19
31
30
27
25
3.1
3.5
3.6
3.8
3.7
3.9
4.2
4.3
LM0605H-R40MG-D
LM0605H-R47MG-D
LM0605H-R56MG-D
LM0605H-R60MG-D
LM0605H-R68MG-D
LM0605H-R82MG-D
LM0605H-1R0MG-D
LM0605H-1R2MG-D
LM0605H-1R5MG-D
0.40
0.47
0.56
0.60
0.68
0.82
1.00
1.20
1.50
18
24
4.0
4.5
16.5
15
22
20
4.6
6.1
4.9
6.5
14
12
18
6.7
8.6
7.5
9.0
16.5
LM0605H-2R2MG-D
LM0605H-3R3MG-D
2.20
3.30
10
8
14
12
11.2
19
12.0
20.9
LM0605H-4R7MG-D
LM0605H-5R6MG-D
LM0605H-6R5MG-D
LM0605H-6R8MG-D
LM0605H-8R2MG-D
LM0605H-100MG-D
LM0605H-220MG-D
Note:
4.70
5.60
6.50
6.80
8.20
10.0
22.0
6.5
6.0
5.5
5.5
5.0
4.0
2.5
10
9.0
8.5
8.5
8.0
7.5
5.5
28
43.5
46
30.8
49
51.5
51.5
63
46
56
60
69
140
170
1. Test frequency : Ls : 100KHz /1.0V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.
4. Heat Rated Current (Irms) will cause the coil temperature rise approximately Δ T of 40℃
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
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LM0605H-Series(G)-D
6. Material List
NO
1
Items
Core
Wire
Clip
Materials
Carbonyl Powder.
2
Polyester Wire or equivalent.
100% Pb free solder(Ni+Sn---Plating)
Epoxy resin
3
4
paint
Ink
5
Halogen-free ketone
7. Reliability and Test Condition
Item
Performance
Test Condition
Operating temperature
-40~+125℃ (Including self - temperature rise)
1.-10~+40℃,50~60%RH (Product without taping)
2.-40~+125℃ (on board)
Storage temperature
Electrical Performance Test
Inductance
HP4284A,CH11025,CH3302,CH1320,CH1320S
LCR Meter.
Refer to standard electrical characteristics list.
DCR
CH16502,Agilent33420A Micro-Ohm Meter.
Saturation DC Current (Isat) will cause L0
to drop △ L(%)
Saturation Current (Isat)
Approximately △ L30%.
Approximately △ T40℃
Heat Rated Current (Irms) will cause the coil temperature rise
△ T(℃) without core loss.
1.Applied the allowed DC current
Heat Rated Current (Irms)
2.Temperature measured by digital surface thermometer
Reliability Test
Preconditioning:
Run
through
IR
reflow
for
2
times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles)
Temperature: 125±2 ℃(Inductor)
Life Test
Applied current:rated current
Duration:1000±12hrs
Measured at room temperature after placing for 24±2 hrs
Preconditioning:
Run
through
IR
reflow
for
2
times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Load Humidity
Humidity:85±2﹪ R.H,
Temperature:85℃±2 ℃
Duration:1000hrs Min. with 100% rated current
Measured at room temperature after placing for 24±2 hrs
Preconditioning: Run through IR reflow for
2
times.( IPC/JEDEC J-STD-020DClassification Reflow
Profiles
1. Baked at50℃ for 25hrs, measured at room temperature
after placing for 4 hrs.
2. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and
Appearance:No damage.
keep 3 hours, cool down to 25℃ in 2.5hrs.
Moisture Resistance
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
3. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25℃ in
RDC:within ±15% of initial value and shall not
exceed the specification value
2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs
4. Keep at 25℃ 80-100%RH for 15min and vibrate at the
frequency of 10 to 55 Hz to 10 Hz, measure at
room temperature after placing for 1~2 hrs.
Preconditioning:
Run
through
IR
reflow
for
2
times.( IPC/JEDEC J-STD-020DClassification
Reflow Profiles
Condition for 1 cycle
Thermal
shock
Step1:-40±2℃ 30±5min
Step2:25±2℃ ≦ 0.5min
Step3:125±2℃ 30±5min
Number of cycles: 500
Measured at room temperature after placing for 24±2 hrs
Oscillation Frequency: 10~2K~10Hz for 20 minutes
Equipment: Vibration checker
Total Amplitude:1.52mm±10%
Vibration
Testing Time : 12 hours(20 minutes, 12 cycles each of 3
orientations)。
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LM0605H-Series(G)-D
Item
Performance
Test Condition
Peak
value
(g’s)
Normal
duration (D)
(ms)
Velocity
change
(Vi)ft/sec
Wave
form
Type
Shock
Appearance:No damage.
SMD
Lead
50
50
11
11
Half-sine
Half-sine
11.3
11.3
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
RDC:within ±15% of initial value and shall not
Shall be mounted on a FR4 substrate of the
following dimensions: >=0805:40x100x1.2mm
<0805:40x100x0.8mm
Bending depth: >=0805:1.2mm
<0805:0.8mm
exceed the specification value
Bending
duration of 10 sec.
Preheat: 150℃,60sec.。
Solder: Sn96.5% Ag3% Cu0.5%
More than 95% of the terminal electrode should
Temperature: 245±5℃。
be covered with solder。
Solderability
Flux for lead free: Rosin. 9.5%。
Dip time: 4±1sec。
Depth: completely cover the termination
Number of heat cycles: 1
Temperature
Temperature
Time(s)
10 ±1
ramp/immersion
Resistance
to Soldering
Heat
(°C)
and emersion rate
260 ±5(solder
temp)
25mm/s ±6 mm/s
Preconditioning:
Run
through
IR
reflow
for
2
times.( IPC/JEDEC J-STD-020DClassification
Reflow Profiles
With the component mounted on a PCB with the device to
be tested, apply a force
(>0805:1kg , <=0805:0.5kg)to the side of a device being
tested. This force shall be
Appearance:No damage.
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
RDC:within ±15% of initial value and shall not
applied for 60 +1 seconds. Also the force shall be applied
gradually as not to apply a
exceed the specification value
shock to the component being tested.
Terminal
Strength
Note : When there are questions concerning measurement result : measurement shall be made after 48 ± 2 hours
of recovery under the standard condition.
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Rev 2.0 :12.01.2019
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LM0605H-Series(G)-D
8. Soldering and Mounting
(1) Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. terminations are suitable for re-flow
soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering
tools.
(2) Solder re-flow:
Recommended temperature profiles for re-flow soldering in Figure 1.
(3) Soldering Iron:
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
‧
Preheat circuit and products to 150℃
‧
Never contact the ceramic with the iron tip
‧
Use a 20 watt soldering iron with tip diameter of 1.0mm
‧
355℃ tip temperature (max)
‧
1.0mm tip diameter (max)
‧
Limit soldering time to 4~5sec.
Reflow Soldering
Iron Soldering
PRE-HEATING
SOLDERING
NATURAL
COOLING
PRE-HEATING
SOLDERING
NATURAL
COOLING
within 4~5s
TP(260℃ / 10s max.)
350
150
217
60~150s
200
150
60~180s
480s max.
Gradual cooling
Over 60s
25
TIME(sec.)
TIME( sec.)
Iron Soldering times: 1 times max.
Fig.2
Reflow times: 3 times max.
Fig.1
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LM0605H-Series(G)-D
9. Packaging Information
(1) Reel Dimension
COVER TAPE
2.0∮0.5
Type
A(mm) B(mm) C(mm) D(mm)
13”x16mm
16.4+2/-0
13+0.5/-0.2
330
100±2
A
EMBOSSED CARRIER
(2) Tape Dimension
Series Size Bo(mm) Ao(mm) Ko(mm) P(mm) W(mm) F(mm) t(mm) D(mm)
LM
0605
7.7±0.1
7.0±0.1
5.3±0.1
12.0±0.1
16±0.3
7.5±0.1
0.35±0.05
1.5±0.1
(3) Packaging Quantity
LM
0605
Chip / Reel
Inner box
Carton
800
1600
6400
(4) Tearing Off Force
The force for tearing off cover tape is 10 to 130 grams in the arrow
direction under the following conditions(referenced
ANSI/EIA-481-C-2003 of 4.11 stadnard).
F
Top cover tape
Room Temp.
Room Humidity
(%)
Room atm
(hPa)
Tearing Speed
mm/min
(℃)
Base tape
5~35
45~85
860~1060
300
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LM0605H-Series(G)-D
10. Typical Performance Curves
LM0605H-R40
LM0605H-R47
LM0605H-R56
0.7
0.56
0.42
0.28
0.14
0
100
80
60
40
20
0
0.8
0.6
0.4
0.2
0
80
70
60
50
40
30
20
10
0
1
0.8
0.6
0.4
0.2
0
80
70
60
50
40
30
20
10
0
0
6.2
12.4
18.6
24.8
31
0
6
12
18
24
30
0
6.75
13.5
20.25
16.5
13.5
27
DC CURRENT(A)
DC CURRENT(A)
DC CURRENT(A)
LM0605H-R82
LM0605H-R60
LM0605H-R68
1.6
1.2
0.8
0.4
0
80
1
0.8
0.6
0.4
0.2
0
50
40
30
20
10
0
1.2
0.9
0.6
0.3
0
80
70
60
50
40
30
20
10
0
70
60
50
40
30
20
10
0
0
5
10
15
20
25
0
5.5
11
16.5
22
0
5.5
11
22
DC CURRENT(A)
DC CURRENT(A)
DC CURRENT(A)
LM0605H-1R0
LM0605H-1R2
LM0605H-1R5
2
1.5
1
80
70
60
50
40
30
20
10
0
2
1.5
1
80
3
2.4
1.8
1.2
0.6
0
80
70
60
50
40
30
20
10
0
70
60
50
40
30
20
10
0
0.5
0
0.5
0
0
0
0
0
5
10
15
20
0
5
10
15
20
0
4.5
9
18
DC CURRENT(A)
DC CURRENT(A)
DC CURRENT(A)
LM0605H-2R2
LM0605H-3R3
LM0605H-4R7
4
3
2
1
0
80
70
60
50
40
30
20
10
0
6
4.5
3
80
70
60
50
40
30
20
10
0
8
6
4
2
0
80
70
60
50
40
30
20
10
0
1.5
0
3.5
7
10.5
6.75
6
14
0
3
6
9
12
0
2
4
6
8
10
DC CURRENT(A)
DC CURRENT(A)
DC CURRENT(A)
LM0605H-5R6
LM0605H-6R8
LM0605H-8R2
10
8
100
90
80
70
60
50
40
30
20
10
0
12
9
100
90
80
70
60
50
40
30
20
10
0
16
12
8
80
70
60
50
40
30
20
10
0
6
6
4
3
4
2
0
0
0
2.25
4.5
9
0
2.25
4.5
6.75
9
0
2
4
6
8
DC CURRENT(A)
DC CURRENT(A)
DC CURRENT(A)
LM0605H-100
LM0605H-220
20
16
12
8
100
90
80
70
60
50
40
30
20
10
0
40
30
20
10
0
200
160
120
80
4
40
0
0
2
4
8
0
1.1
2.2
3.3
4.4
5.5
DC CURRENT(A)
DC CURRENT(A)
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LM0605H-Series(G)-D
11. Inductance vs. Frequency Curves
LM0605H-R47
LM0605H-R56
0.9
LM0605H-R40
0.9
0.72
0.54
0.36
0.18
0
0.8
0.6
0.4
0.2
0
0.72
0.54
0.36
0.18
0
1
10
100
1000
1
10
100
1000
1
10
100
1000
FREQUENCY(KHz)
FREQUENCY(KHz)
FREQUENCY(KHz)
LM0605H-R68
LM0605H-R82
LM0605H-R60
1.2
1.6
1.28
0.96
0.64
0.32
0
1
0.8
0.6
0.4
0.2
0
0.96
0.72
0.48
0.24
0
1
10
100
1000
1
10
100
1000
1
10
100
1000
FREQUENCY(KHz)
FREQUENCY(KHz)
LM0605H-1R5
LM0605H-1R0
LM0605H-1R2
2.6
2
1.5
1
2
2.08
1.56
1.04
0.52
0
1.6
1.2
0.8
0.4
0
0.5
0
1
10
100
1000
1
10
100
1000
1
10
100
1000
FREQUENCY(KHz)
LM0605H-2R2
LM0605H-3R3
LM0605H-4R7
5
5
4
3
2
1
8
4
3
2
1
0
6.4
4.8
3.2
1.6
0
0
1
1
10
100
1000
10
100
1000
1
10
100
1000
FREQUENCY(KHz)
FREQUENCY(KHz)
FREQUENCY(KHz)
LM0605H-5R6
LM0605H-6R8
LM0605H-8R2
11.6
9.28
6.96
4.64
2.32
0
11.6
9.28
6.96
4.64
2.32
0
16
12.8
9.6
6.4
3.2
0
1
10
100
1000
1
10
100
1000
1
10
100
1000
FREQUENCY(KHz)
FREQUENCY(KHz)
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Rev 2.0 :12.01.2019
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LM0605H-Series(G)-D
LM0605H-220
LM0605H-100
.2
45
19.2
15.36
11.52
7.68
3.84
0
36.16
27.12
18.08
9.04
0
1
10
100
1000
1
10
100
1000
FREQUENCY(KHz)
Shanghai Leiditech Electronic Co.,Ltd
Email: sale1@leiditech.com
Tel : +86- 021 50828806
Fax : +86- 021 50477059
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