LMKAK1066CA [LEIDITECH]

Ideal for automated placement;
LMKAK1066CA
型号: LMKAK1066CA
厂家: Leiditech    Leiditech
描述:

Ideal for automated placement

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LMKAK10 SERIES  
Features  
● Ideal for automated placement  
● High surge current capability  
● Meets MSL level 1, per J-STD-020, LF maximum  
peak of 260 °C  
● Bi-directional TVS  
● Glass passivated junction  
● Low clamping voltage under surge  
Typical Applications  
● High power DC bus protection  
SMTO-218  
Mechanical Data  
ackage: SMT -218  
P
Molding compound meets UL 94 V-0 flammability  
rating, RoHS-compliant  
Terminals: Tin plated leads, solderable per  
J-STD-002 and JESD22-B102  
Symbol  
Maximum Ratings & Thermal Characteristics :  
(TA = 25 °C unless otherwise noted)  
Items  
Symbol  
IPPM  
Value  
10000  
Unit  
Peak pulse current (tp= 8/20µs)  
A
Storage temperature  
Tstg  
-55 ~+150  
°C  
°C  
Junction temperature  
Tj  
-55 ~+125  
1/4  
Rev :01.06.2019  
www.leiditech.com  
LMKAK10 SERIES  
ELECTRICAL CHARACTERISTICS(TA=25)  
IPP  
VC@VPP  
Part Number  
VR  
IR@VR  
VBR@IT  
IT  
Bi-Polar  
V
66  
66  
76  
86  
μA  
5
min(V)  
64  
max(V)  
mA max(V)  
A
110  
10  
70  
LMKAK1058CA  
LMKAK1066CA  
LMKAK1076CA  
LMKAK1086CA  
10000  
10000  
10000  
10000  
120  
10  
80  
5
72  
135  
10  
95  
5
85  
157  
10  
107  
5
96  
Surge waveform: 1.2/50μs &8/20μs  
VR: Stand-off voltage -- Maximum voltage that can be applied  
VBR: Breakdown voltage  
VC: Clamping voltage -- Peak voltage measured across the suppressor at a specified VPP  
IR: Reverse leakage current  
RATINGS AND VI CHARACTERISTICS CURVES (TA=25, unless otherwise noted)  
FIG.2 Pulse Derating Curve  
FIG.1 V-I curve characteristics  
I
IPP  
IT  
V
VC VBR VR  
IR  
IR  
IT  
VR VBR VC  
IPP  
Fig.3 Current 8/20us Waveform per IEC 6100-4-5  
FIG.4: Typical VBR vs. junction temperature  
2/4  
Rev :01.06.2019  
www.leiditech.com  
LMKAK10 SERIES  
SOLDERING PARAMETERS  
Pb-Free assembly  
(see FIG.3)  
Reflow Condition  
-Temperature Min (Ts(min)  
)
+150℃  
FIG.3: Reflow condition  
Pre  
tp  
-Temperature Max(Ts(max)  
-Time (Min to Max) (ts)  
)
+200℃  
TP  
Heat  
Critical Zone  
TL to TP  
Ramp-up  
60-180 secs.  
TL  
tL  
Average ramp up rate (Liquidus Temp  
(TL)to peak)  
TS(max)  
3/sec. Max  
Ramp-down  
Preheat  
ts  
T
s(max) to TL - Ramp-up Rate  
3/sec. Max  
+217℃  
TS(min)  
25  
-Temperature(TL)(Liquidus)  
-Temperature(tL)  
time to peak temperatue  
Reflow  
Time  
(t 25to peak)  
60-150 secs.  
+260(+0/-5)℃  
Peak Temp (Tp)  
Time within 5of actual Peak Temp (tp) 20-40secs  
Ramp-down Rate  
6/sec. Max  
8 min. Max  
+260℃  
Time 25to Peak Temp (TP)  
Do not exceed  
3/4  
Rev :01.06.2019  
www.leiditech.com  
LMKAK10 SERIES  
PACKAGE MECHANICAL DATA  
Outline Dimensions  
SMTO-218  
SME  
Suggested pad layout  
Dim  
A
Min  
13.16  
10.55  
2.50  
5.15  
1.20  
1.20  
13.45  
15.50  
6.94  
18.1  
1.9  
Max  
13.76  
11.05  
2.90  
5.65  
1.40  
1.40  
14.60  
16.05  
7.24  
18.5  
2.1  
Dim  
A
Millimeters  
18.31  
10.80  
13.72  
2.54  
B
C
D
F1  
F
B
C
D
E
2.70  
G
H
J
F
5.33  
G
2.15  
K
L
M
N
T
0.4  
0.6  
1.4  
1.6  
0.33  
0.35  
0.43  
0.45  
S
Shanghai Leiditech Electronic Co.,Ltd  
Email: sale1@leiditech.com  
Tel : +86- 021 50828806  
Fax : +86- 021 50477059  
4/4  
Rev :01.06.2019  
www.leiditech.com  

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